DE4104853A1 - Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board - Google Patents

Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board

Info

Publication number
DE4104853A1
DE4104853A1 DE4104853A DE4104853A DE4104853A1 DE 4104853 A1 DE4104853 A1 DE 4104853A1 DE 4104853 A DE4104853 A DE 4104853A DE 4104853 A DE4104853 A DE 4104853A DE 4104853 A1 DE4104853 A1 DE 4104853A1
Authority
DE
Germany
Prior art keywords
board
wiring
circuit board
contact members
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4104853A
Other languages
German (de)
Inventor
Knut Ing Grad Albrecht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE4104853A priority Critical patent/DE4104853A1/en
Priority to AU10719/92A priority patent/AU1071992A/en
Publication of DE4104853A1 publication Critical patent/DE4104853A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/728—Coupling devices without an insulating housing provided on the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A plug connector, with contact members (6), makes a releasable electrical connection between moulded circuit boards (4) and wiring (2). The circuit boards are inserted into frames and the wiring (2) is on the back wall. The contact members (6) are integrally moulded in one piece with the circuit board (4). Guide pins (7) and resilient hooks (8) are also moulded onto the board (4). The board (4) is fixed by the integral guide pins (7) and is fastened to the wiring (2) by the integral hooks (8). ADVANTAGE - Provides an improved electrical connection between circuit boards and wiring.

Description

Die Anmeldung betrifft eine Vorrichtung zur Herstellung von lösbaren elektrischen Verbindungen zwischen in Gestellen einsteckbaren, spritzgegossenen Leiterplatten und den in den Gestellen angeordneten Rückwandverdrahtungen über aus Kontaktstücken bestehende Steckverbinder.The application relates to a device for manufacturing of detachable electrical connections between in Rack insertable, injection molded circuit boards and those arranged in the racks Backplane wiring over from contact pieces existing connectors.

Spritzgegossene Leiterplatten sind bekannt (Aufsatz: "Thermoplast zum Herstellen dreidimensionaler Leiterplatten" in ELEKTRONIK PRODUKTION & PRÜFTECHNIK, Dezember 1986, Seiten 16 und 17). Um derartige Leiterplatten für die Kontaktgabe zu Rückwandverdrahtungen in Gestellen geeignet zu machen, werden diskrete Steckverbinder-Leisten verwendet, welche an einer Kante der Leiterplatte befestigt und mit Leiterbahnen auf der Leiterplatte elektrisch leitend verbunden werden. Injection molded circuit boards are known (article: "Thermoplastic for making three-dimensional PCB "in ELECTRONICS PRODUCTION & TEST TECHNOLOGY, December 1986, pages 16 and 17). To such Printed circuit boards for making contact Make backplane wiring suitable in racks, discrete connector strips are used, which is attached to an edge of the circuit board and with conductor tracks on the circuit board electrically be conductively connected.  

Diese bekannte Vorrichtung ist beispielsweise in der Herstellung und der Montage aufwendig. Außerdem ist für die Kontaktoberflächen wegen ihrer Belastung beim Ziehen und Stecken der Leiterplatten ein großer Aufwand erforderlich.This known device is for example in the Manufacturing and assembly complex. Also is for the contact surfaces because of their stress when Pulling and inserting the circuit boards is a big effort required.

Das der Erfindung zugrunde liegende technische Problem besteht deshalb darin, die lösbare elektrische Verbindung zwischen Leiterplatte und Rückwandverdrahtung zu verbessern.The technical problem underlying the invention is therefore the releasable electrical Connection between circuit board and Improve backplane wiring.

Dieses technische Problem ist erfindungsgemäß dadurch gelöst, daß die Kontaktstücke einstückig in die spritzgegossene Leiterplatte mit eingespritzt sind.This technical problem is according to the invention solved that the contact pieces in one piece in the injection molded printed circuit board are also injected.

Bei der erfindungsgemäßen Vorrichtung entfallen die diskreten Steckverbinder, wodurch der Aufwand beim Material und bei der Montage verringert wird. Es lassen sich mechanisch geringer belastete Kontaktflächen verwirklichen. Außerdem lassen sich für die Befestigung und die Positionierung benötigte Teile ebenfalls einstückig mit anspritzen und es wird sogar noch Einbauvolumen eingespart.In the device according to the invention, the discrete connector, reducing the effort in Material and assembly is reduced. Leave it contact surfaces exposed to less mechanical stress realize. They can also be used for attachment and the positioning needed parts too in one piece with inject and it will even Installation volume saved.

Die Erfindung ist nachstehend anhand der Fig. 1 bis 5 näher erläutert. Es zeigen:The invention is explained in more detail below with reference to FIGS. 1 to 5. Show it:

Fig. 1 einen Ausschnitt der Seitenansicht einer in ein Gestell eingeschobenen Leiterplatte, Fig. 1 shows a detail of the side view of a frame inserted in a printed circuit board,

Fig. 2 den Ausschnitt aus Gestell und Leiterplatte in einer Draufsicht entsprechend dem Pfeil A in Fig. 1, Fig. 2 shows the detail of the frame and circuit board in a top view according to the arrow A in Fig. 1,

Fig. 3 einen einstückig an die Leiterplatte angespritzten Federhaken, Fig. 3 is an integrally molded to the circuit board spring hook,

Fig. 4 eine einstückig an die Leiterplatte angespritzte Kontaktfeder, und Fig. 4 is an integrally molded on the circuit board contact spring, and

Fig. 5 die Draufsicht auf mehrere nebeneinander angeordnete Kontaktfedern. Fig. 5 is a plan view of a plurality of contact springs arranged side by side.

Aus Fig. 1 ist ein Teil eines Gestells zu erkennen, welches aus der Horizontalschiene 1 und der an dieser befestigten Rückwandverdrahtung 2 besteht, bei der es sich ebenfalls um eine Leiterplatte handeln kann. Wie aus Fig. 2 besser zu erkennen, ist an der Horizontalschiene 1 eine U-förmige Führung 3 für die Leiterplatte 4 befestigt. Die Führung 3 ist mittels des an ihr angespritzten Fixierzapfens 5 in der Rückwandverdrahtung 2 fixiert. Die Leiterplatte 4 ist an ihrer der Rückwandverdrahtung zugewandten Kante mit einer Mehrzahl von Kontaktfedern 6 versehen, welche einstückig an der Leiterplatte 4 angespritzt sind. Die Leiterplatte 4 ist mittels des ebenfalls einstückig an ihr angespritzten Führungsstiftes 7 fixiert und durch die ebenfalls einstückig an der Leiterplatte 4 angespritzte Federhaken 8 in der Rückwandverdrahtung 2 befestigt.From Fig. 1 a part of a frame can be seen, which consists of the horizontal rail 1 and the attached to this rear wall wiring 2 , which can also be a circuit board. As can be seen better from FIG. 2, a U-shaped guide 3 for the printed circuit board 4 is fastened to the horizontal rail 1 . The guide 3 is fixed in the rear wall wiring 2 by means of the fixing pin 5 molded onto it. The circuit board 4 is provided on its edge facing the rear wall wiring with a plurality of contact springs 6 , which are integrally molded onto the circuit board 4 . The printed circuit board 4 is fixed by means of the guide pin 7, which is also integrally molded onto it, and is fastened in the rear wall wiring 2 by the spring hooks 8 also molded integrally on the printed circuit board 4 .

Fig. 3 verdeutlicht die Ausbildung des Federhakens 8, welcher die Rückwandverdrahtung 2 durchstößt und mittels einer Nase auf ihrer Rückseite einrastet. Fig. 3 illustrates the design of the spring hook 8 , which pierces the rear wall wiring 2 and snaps into place on the back by means of a nose.

Fig. 4 zeigt ein Ausführungsbeispiel der an der Leiterplatte 4 einstückig angespritzten Kontaktfeder 6. Das Ende der Kontaktfeder 6 ist mit einer Verdickung versehen, welche federnd auf einer Kontaktfläche auf der Rückwandverdrahtung 2 aufliegt. Fig. 4 shows an embodiment of the integrally molded to the circuit board 4 Contact spring 6. The end of the contact spring 6 is provided with a thickening which rests resiliently on a contact surface on the rear wall wiring 2 .

Fig. 5 verdeutlicht eine zweireihige Anordnung der Kontaktflächen 9 auf der Rückwandverdrahtung 2. Es läßt sich dadurch eine dichtgedrängte Anordnung der Kontakte verwirklichen, wenn längere und kürzere Kontaktfedern 6 einander abwechseln. Fig. 5 illustrates a two-row arrangement of the contact surfaces 9 on the backplane wiring 2. This allows a tightly packed arrangement of the contacts to be achieved if longer and shorter contact springs 6 alternate with one another.

Claims (2)

1. Vorrichtung zur Herstellung von lösbaren elektrischen Verbindungen zwischen in Gestellen einsteckbaren, spritzgegossenen Leiterplatten und den in den Gestellen angeordneten Rückwandverdrahtungen über aus Kontaktstücken bestehende Steckverbinder, dadurch gekennzeichnet, daß die Kontaktstücke (6) einstückig in die spritzgegossenen Leiterplatten (4) mit eingespritzt sind.1. Device for producing detachable electrical connections between insertable in frames, injection-molded printed circuit boards and the rear wall wiring arranged in the frames via connectors consisting of contact pieces, characterized in that the contact pieces ( 6 ) are integrally injected into the injection-molded printed circuit boards ( 4 ). 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß Führungsstifte (7) und Federhaken (8) einstückig an der Leiterplatte (4) angespritzt sind.2. Device according to claim 1, characterized in that guide pins ( 7 ) and spring hooks ( 8 ) are integrally molded on the circuit board ( 4 ).
DE4104853A 1991-02-16 1991-02-16 Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board Withdrawn DE4104853A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE4104853A DE4104853A1 (en) 1991-02-16 1991-02-16 Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board
AU10719/92A AU1071992A (en) 1991-02-16 1992-02-04 Plug-in printed circuit board connection arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4104853A DE4104853A1 (en) 1991-02-16 1991-02-16 Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board

Publications (1)

Publication Number Publication Date
DE4104853A1 true DE4104853A1 (en) 1992-08-20

Family

ID=6425217

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4104853A Withdrawn DE4104853A1 (en) 1991-02-16 1991-02-16 Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board

Country Status (2)

Country Link
AU (1) AU1071992A (en)
DE (1) DE4104853A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0689162A3 (en) * 1994-06-23 1996-02-07 Molex Inc Latching means for the assembly for an IC card
FR2832287A1 (en) * 2001-11-09 2003-05-16 Nexans PRINTED CIRCUIT CARRIER WITH INTEGRATED CONNECTIONS AND METHOD FOR MANUFACTURING SUCH A CARRIER
DE102006046259A1 (en) * 2006-09-28 2008-04-03 Diehl Ako Stiftung & Co. Kg component arrangement

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1867468U (en) * 1961-07-18 1963-02-21 Krone Kg WITH A PRINTED OR ETCHED CIRCUIT AS WELL AS AN INSULATING MATERIAL SUPPORT PLATE.
DE1262354B (en) * 1965-12-30 1968-03-07 Siemens Ag Wiring support for telecommunication systems, especially telephone switching systems
US3997229A (en) * 1975-09-15 1976-12-14 Thomas & Betts Corporation Flexible connecting means
DE2727641C2 (en) * 1976-06-21 1984-07-26 Advanced Circuit Technology, Inc., Nashua, N.H. Conductor track pattern, in particular connection cable, and method for its production
US4521065A (en) * 1983-09-27 1985-06-04 General Motors Corporation Socket connector for parallel circuit boards
DE3518975A1 (en) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen PLASTIC PART
US4719541A (en) * 1985-02-13 1988-01-12 Fujitsu Limited Electronic apparatus mounting structure
US4893215A (en) * 1987-09-30 1990-01-09 Hitachi, Ltd. Electronic circuit apparatus of automobile
DE3924176C2 (en) * 1988-07-26 1990-12-13 Atlanta-Kabel-Steinmueller Kg, 5880 Luedenscheid, De

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1867468U (en) * 1961-07-18 1963-02-21 Krone Kg WITH A PRINTED OR ETCHED CIRCUIT AS WELL AS AN INSULATING MATERIAL SUPPORT PLATE.
DE1262354B (en) * 1965-12-30 1968-03-07 Siemens Ag Wiring support for telecommunication systems, especially telephone switching systems
US3997229A (en) * 1975-09-15 1976-12-14 Thomas & Betts Corporation Flexible connecting means
DE2727641C2 (en) * 1976-06-21 1984-07-26 Advanced Circuit Technology, Inc., Nashua, N.H. Conductor track pattern, in particular connection cable, and method for its production
US4521065A (en) * 1983-09-27 1985-06-04 General Motors Corporation Socket connector for parallel circuit boards
US4719541A (en) * 1985-02-13 1988-01-12 Fujitsu Limited Electronic apparatus mounting structure
DE3518975A1 (en) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen PLASTIC PART
US4893215A (en) * 1987-09-30 1990-01-09 Hitachi, Ltd. Electronic circuit apparatus of automobile
DE3924176C2 (en) * 1988-07-26 1990-12-13 Atlanta-Kabel-Steinmueller Kg, 5880 Luedenscheid, De

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SCHAAF, H. *
u.a.: Dreidimensionale Leiterplatten. In: Feinwerktechnik & Messtechnik 97, 1989, 5, S.191-194 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0689162A3 (en) * 1994-06-23 1996-02-07 Molex Inc Latching means for the assembly for an IC card
FR2832287A1 (en) * 2001-11-09 2003-05-16 Nexans PRINTED CIRCUIT CARRIER WITH INTEGRATED CONNECTIONS AND METHOD FOR MANUFACTURING SUCH A CARRIER
DE102006046259A1 (en) * 2006-09-28 2008-04-03 Diehl Ako Stiftung & Co. Kg component arrangement
DE102006046259B4 (en) * 2006-09-28 2011-04-07 Diehl Ako Stiftung & Co. Kg component arrangement

Also Published As

Publication number Publication date
AU1071992A (en) 1992-08-20

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: ALCATEL SEL AKTIENGESELLSCHAFT, 7000 STUTTGART, DE

8139 Disposal/non-payment of the annual fee