DE19604614A1 - Encapsulated electronic control device e.g. for motor vehicles - Google Patents

Encapsulated electronic control device e.g. for motor vehicles

Info

Publication number
DE19604614A1
DE19604614A1 DE19604614A DE19604614A DE19604614A1 DE 19604614 A1 DE19604614 A1 DE 19604614A1 DE 19604614 A DE19604614 A DE 19604614A DE 19604614 A DE19604614 A DE 19604614A DE 19604614 A1 DE19604614 A1 DE 19604614A1
Authority
DE
Germany
Prior art keywords
control device
housing
electronic control
sheet metal
metal part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19604614A
Other languages
German (de)
Inventor
Reinhold Maier
Ernst Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayerische Motoren Werke AG
Original Assignee
Bayerische Motoren Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayerische Motoren Werke AG filed Critical Bayerische Motoren Werke AG
Priority to DE19604614A priority Critical patent/DE19604614A1/en
Priority to DE19624478A priority patent/DE19624478A1/en
Priority to EP96120636A priority patent/EP0789507B1/en
Priority to DE59609654T priority patent/DE59609654D1/en
Priority to US08/798,502 priority patent/US5887342A/en
Publication of DE19604614A1 publication Critical patent/DE19604614A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The control device includes a casing and a punched metal part comprising a conductor path structure with electric components arranged on it. Contact parts are shaped on the punched metal part and project from it. The casing (13) is manufactured in plastic pressure moulding, and surrounds the electric components (10, 11) and the punched metal part (6) with exception of the outer ends of the contact sections (3, 4, 5), completely. Further conductor path structures (5) can be arranged to project from the casing, and may serve for the mounting of external components.

Description

Die Erfindung bezieht sich auf ein elektronisches Steuergerät mit den Merkmalen, die im Oberbegriff des Patentanspruchs 1 angegeben sind, sowie auf ein Verfah­ ren zur Herstellung eines derartigen Steuergeräts.The invention relates to an electronic control unit with the features which are specified in the preamble of claim 1, and to a procedure ren for the production of such a control device.

Ein derartiges Steuergerät und ein Verfahren zu seiner Herstellung ist aus der DE 44 04 986 A1 bekannt. Die Leiterbahnstruktur wird dabei auf einem Träger be­ festigt. Anschließend werden die elektronischen Bauelemente mit der Leiterbahn­ struktur kontaktiert. Am Einsatzort, hier einem mit dem Steuergerät gesteuerten Elektromotor wird der Träger mit einer Abdeckung versehen, so daß die Leiter­ bahnstruktur und die Bauelemente von einem Gehäuse ummant sind.Such a control device and a method for its production is from the DE 44 04 986 A1 known. The conductor track structure is on a carrier consolidates. Then the electronic components with the conductor track structure contacted. On site, here one controlled by the control unit Electric motor, the carrier is provided with a cover so that the conductor track structure and the components are encased in a housing.

Die Herstellung des bekannten Steuergeräts ist aufwendig. Zudem besitzt das Steuergerät eine geringe mechanische Stabilität, da beispielsweise das Gehäuse lediglich Schutz vor Feuchtigkeit oder Verschmutzung bietet, nicht jedoch die me­ chanische Stabilität des Steuergeräts erhöht. Diese wird im wesentlichen lediglich durch die Festigkeit des Trägers bestimmt.The production of the known control unit is complex. It also has Control unit has low mechanical stability because, for example, the housing only provides protection against moisture or pollution, but not me mechanical stability of the control unit increased. This is essentially just determined by the strength of the wearer.

Der Erfindung liegt die Aufgabe zugrunde, ein elektronisches Steuergerät der ein­ gangs genannten Art zu schaffen, das eine hohe mechanische Stabilität besitzt und das darüber hinaus auf besonders einfache Weise herzustellen ist.The invention has for its object an electronic control unit gangs mentioned to create that has a high mechanical stability and it is also easy to manufacture.

Die Erfindung löst diese Aufgabe für das Steuergerät hinsichtlich der mechani­ schen Stabilität durch die kennzeichnenden Merkmale des Patentanspruchs 1 und hinsichtlich des Herstellungsverfahrens durch die kennzeichnenden Merkmale des Patentanspruchs 3.The invention solves this problem for the control unit in terms of mechani stability by the characterizing features of claim 1 and  with regard to the manufacturing process through the characteristic features of the Claim 3.

Das Steuergerät besitzt nunmehr ein in Kunststoff-Spritztechnik hergestelltes Ge­ häuse, das zu einem kompakten und gegen mechanische sowie thermische und atmosphärische Einflüsse weitgehend unempfindlichen Aufbau führt. Die Herstel­ lung erfolgt mit Hilfe der von integrierten Schaltkreisen bekannten Spritztechnik, die einfach zu handhaben ist und die einen hohen Reifegrad besitzt. Abhängig vom verwendeten Kunststoff und/oder dem angewandten Herstellungsverfahren lassen sich die mechanischen und thermischen Eigenschaften des Steuergeräts den je­ weiligen Anforderungen optimal anpassen.The control unit now has a Ge manufactured in plastic injection molding technology housing that is compact and against mechanical as well as thermal and largely insensitive to atmospheric influences. The manufacturer tion takes place with the help of the spray technology known from integrated circuits, which is easy to use and has a high level of maturity. Depending on the used plastic and / or the manufacturing process used the mechanical and thermal properties of the control unit ever optimally adapt to certain requirements.

Vorteilhafte Ausgestaltungen des Steuergeräts sind Gegenstand des Patentan­ spruchs 2 und ermöglichen, die Einsatzmöglichkeiten des Steuergeräts zu vergrö­ ßern. Durch die Verwendung zusätzlicher Leiterbahn-Strukturabschnitte lassen sich empfindliche Bauelemente, die während der Herstellung des Gehäuses Scha­ den nehmen würden, auslagern und erst nachträglich am Steuergerät befestigen. Dadurch ergibt sich die Möglichkeit, die Kunststofftechnik noch mehr den geforder­ ten mechanischen Eigenschaften des Gehäuses anzupassen, da auf die Belast­ barkeit der ansonsten innerhalb des Gehäuses angeordneten elektrischen Bauteile dann keine Rücksicht mehr genommen zu werden braucht.Advantageous embodiments of the control device are the subject of the patent Proposition 2 and allow to increase the possible uses of the control unit eat. By using additional conductor track structural sections sensitive components that Scha would take it, outsource it and attach it to the control unit only afterwards. This results in the possibility that plastics technology meets the requirements even more adapt the mechanical properties of the housing to the load Availability of the electrical components otherwise arranged within the housing then no more consideration needs to be taken.

Im Rahmen des Herstellungsverfahrens lassen sich die Kontaktteile nachträglich den jeweiligen Anforderungen anpassen. Sie können als Steck-, als Löt- oder an­ dere Anschlüsse ausgebildet werden. Neben der Möglichkeit, diese Kontakte nachträglich auszubilden, besteht auch die Möglichkeit, diese Kontakte vor dem Umspritzen der Bauteile, beispielsweise bei der Herstellung des Stanzteils selbst bereits auszubilden.The contact parts can be retrofitted as part of the manufacturing process adapt to the respective requirements. You can use it as a plug-in, as a solder or on whose connections are formed. In addition to the possibility of these contacts training afterwards, there is also the possibility of these contacts before Injection molding of the components, for example in the manufacture of the stamped part itself already training.

Die Erfindung ist anhand eines in der Zeichnung dargestellten Ausführungsbei­ spiels weiter erläutert. Es zeigtThe invention is based on an exemplary embodiment shown in the drawing game explained further. It shows

Fig. 1 ein elektronisches Steuergerät gemäß der Erfindung in perspektivischer Darstellung nach Fertigstellung, Fig. 1 shows an electronic control unit according to the invention in a perspective view after completion,

Fig. 2 bis 5 einzelne Stufen des Fertigungsverfahrens für das Steuergerät von Fig. 1 Fig. 2 to 5 individual stages of the manufacturing process for the control device of Fig. 1

Fig. 6 eine Ausführungsvariante des Steuergeräts von Fig. 1 in Draufsicht, Fig. 6 is a variant of the control device of Fig. 1 in top view,

Fig. 7 das Steuergerät von Fig. 6 im verbauten Zustand und Fig. 7, the control device of Fig. 6 in the installed state and

Fig. 8 eine weitere Ausführungsvariante des Steuergeräts in Seitenansicht. Fig. 8 shows a further embodiment of the control unit in side view.

Das in Fig. 1 dargestellte elektronische Steuergerät besteht im wesentlichen aus einem Gehäuse 2, aus dem Steckkontakte 3, Anschlußkontakte 4 und 4′ (Fig. 2) sowie weitere Anschlußkontakte 5 hervorstehen. Es dient beispielsweise dazu, einen Schrittmotor zu steuern (Fig. 7).The electronic control unit shown in Fig. 1 consists essentially of a housing 2 , from the plug contacts 3 , connection contacts 4 and 4 '( Fig. 2) and further connection contacts 5 protrude. It is used, for example, to control a stepper motor ( Fig. 7).

Das Steuergerät 1 wird hergestellt aus einem Blechstanzteil 6, das aufgebaut ist aus einem Hilfsrahmen 7 und mit diesem verbundenen Kontaktteilen 3, 4 und 5 sowie den Kontakten 4 entsprechenden korrespondierenden Kontaktteilen 4′, Lei­ terbahnabschnitten 8 sowie einem zentralen Träger 9. Nach Herstellung des Blechstanzteils 6 werden elektronische Bauteile wie ein Chipkondensator 10 und ein Mikroprozessor 11 an den eingezeichneten Stellen fixiert und über Bonddrähte mit den zugehörigen Anschlüssen 3, 4, 4′ und 5 verbunden (Fig. 3).The control unit 1 is made of a stamped sheet metal part 6 , which is constructed from an auxiliary frame 7 and connected to this contact parts 3 , 4 and 5 and the contacts 4 corresponding corresponding contact parts 4 ', Lei terbahnabschnitte 8 and a central support. 9 After the stamped sheet metal part 6 has been produced , electronic components such as a chip capacitor 10 and a microprocessor 11 are fixed at the points shown and connected to the associated connections 3 , 4 , 4 'and 5 via bond wires ( FIG. 3).

Anschließend wird das Stanzteil mit Kunststoff umgeben und das Gehäuse 13 gebildet (Fig. 4). Dabei wird eine an sich bekannte Kunststoff-Spritztechnik ange­ wandt.The stamped part is then surrounded with plastic and the housing 13 is formed ( FIG. 4). A known plastic injection molding technique is used.

Anschließend wird der Hilfsrahmen 7 wie dargestellt entfernt. Die Anschlüsse 3, 4, 4′ und 5 bleiben stehen und können beispielsweise nachbehandelt werden. Sie können beispielsweise verlötet oder wie bei den Anschlüssen 4 und 4′ angedeutet an der eingezeichneten Stelle ausgestanzt und so mit Öffnungen versehen wer­ den. Subsequently, the subframe 7 is removed as shown. The connections 3 , 4 , 4 'and 5 remain and can be treated, for example. You can, for example, soldered or punched out as indicated in the connections 4 and 4 'at the location shown and thus provided with openings to who.

Das so gebildete Steuergerät ist mechanisch stabil. Die Bauteile sowie die zu den Anschlüssen führenden Bonddrähte sind gegen äußere Einflüsse thermischer, me­ chanischer und chemischer Art völlig geschützt.The control device thus formed is mechanically stable. The components as well as the Connections leading bond wires are thermal against external influences, me chanical and chemical type completely protected.

Beim Ausführungsbeispiel von Fig. 6 ist gezeigt, wie die beiden Anschlüsse 5 dazu verwendet werden, ein ausgelagertes Bauteil, beispielsweise einen Resonator 14 zu tragen. Dieser wird nach der Herstellung des Gehäuses 13 angeordnet. Hierbei können die Anschlüsse 5 nach oben gebogen werden (Fig. 1).The embodiment of FIG. 6 shows how the two connections 5 are used to support an outsourced component, for example a resonator 14 . This is arranged after the manufacture of the housing 13 . Here, the connections 5 can be bent upwards ( FIG. 1).

Das so gebildete Steuergerät kann beispielsweise verwendet werden, um einen Schrittmotor 15 zu steuern. Es ist in an sich bekannter Weise auf der Oberseite des Motors angeordnet und über die Anschlüsse 4 und 4′ mit dem Motor 15 ver­ bunden (Fig. 7).The control device formed in this way can be used, for example, to control a stepper motor 15 . It is arranged in a manner known per se on the top of the motor and connected via the connections 4 and 4 'to the motor 15 ( FIG. 7).

Ergänzend kann für beispielsweise die Steckkontakte 3 ein Gehäuse 16 vorgese­ hen sein, das nachträglich mit dem Körper 13 verbunden werden kann. Hierzu besitzt der Körper 13 beispielsweise dann eine Einschnürung 17, in die das Stec­ ker-Gehäuse 16 eingeklippst wird. Die Anschlüsse 3 sind dann zusätzlich ge­ schützt und ermöglichen einen problemlosen Anschluß eines nicht gezeigten Stec­ kers am elektronischen Steuergerät 1. Auf diese Weise ergibt sich ein elektroni­ sches Steuergerät, das einfach im Aufbau und in der Herstellung ist und das den­ noch eine hohe mechanische und thermische Stabilität besitzt.In addition, for example the plug contacts 3, a housing 16 can be hen, which can subsequently be connected to the body 13 . For this purpose, the body 13 then has, for example, a constriction 17 , into which the connector housing 16 is clipped. The connections 3 are then additionally protected and enable problem-free connection of a connector (not shown) to the electronic control unit 1 . In this way, there is an electronic control unit which is simple in construction and manufacture and which still has high mechanical and thermal stability.

Claims (4)

1. Elektronisches Steuergerät mit einem Gehäuse, mit einem Blechstanzteil für eine Leiterbahnstruktur und darauf angeordneten elektrischen Bauteilen, und mit aus dem Blechstanzteil ausgeformten und aus dem Gehäuse her­ vortretenden Kontaktteilen, dadurch gekennzeichnet, daß das Gehäuse (13) in Kunststoff-Spritztechnik hergestellt ist und die elektrischen Bauteile (10, 11) und das Blechstanzteil (6) mit Ausnahme der äußeren Enden der Kontaktteile (3, 4, 4′, 5) vollständig umgibt.1. Electronic control device with a housing, with a sheet metal stamped part for a conductor track structure and electrical components arranged thereon, and with molded from the sheet metal stamped part and emerging from the housing forth contact parts, characterized in that the housing ( 13 ) is made in plastic injection molding and the electrical components ( 10 , 11 ) and the stamped sheet metal part ( 6 ) with the exception of the outer ends of the contact parts ( 3 , 4 , 4 ', 5 ) completely surrounds. 2. Steuergerät nach Anspruch 1, dadurch gekennzeichnet, daß weitere Leiter­ bahnstrukturen (5) aus dem Gehäuse (13) hervortreten und zur Befestigung von ausgelagerten Bauteilen (14) dienen.2. Control device according to claim 1, characterized in that further conductor track structures ( 5 ) emerge from the housing ( 13 ) and serve to fasten outsourced components ( 14 ). 3. Verfahren zum Herstellen eines elektronischen Steuergeräts nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß ein im Blechstanzteil (6) ausgebilde­ ter Hilfsrahmen (7) beim Herstellen des Gehäuses (13) nicht umspritzt und anschließend weitgehend entfernt wird.3. A method for producing an electronic control device according to claim 1 or 2, characterized in that a formed in the stamped sheet metal part ( 6 ) ter subframe ( 7 ) during the manufacture of the housing ( 13 ) is not extrusion coated and then largely removed. 4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Kontaktfeile (3, 4, 4′, 5) nachträglich im Rahmen eines Umformprozesses fertiggestellt werden.4. The method according to claim 3, characterized in that the contact file ( 3 , 4 , 4 ', 5 ) are finished afterwards in the course of a forming process.
DE19604614A 1996-02-08 1996-02-08 Encapsulated electronic control device e.g. for motor vehicles Withdrawn DE19604614A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19604614A DE19604614A1 (en) 1996-02-08 1996-02-08 Encapsulated electronic control device e.g. for motor vehicles
DE19624478A DE19624478A1 (en) 1996-02-08 1996-06-19 Method of manufacturing an electronic control device
EP96120636A EP0789507B1 (en) 1996-02-08 1996-12-20 Encapsulated electronic controlling device and method of fabricating the same
DE59609654T DE59609654D1 (en) 1996-02-08 1996-12-20 Encapsulated electronic control device and process for its manufacture
US08/798,502 US5887342A (en) 1996-02-08 1997-02-10 Method for making an electronic control unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19604614A DE19604614A1 (en) 1996-02-08 1996-02-08 Encapsulated electronic control device e.g. for motor vehicles

Publications (1)

Publication Number Publication Date
DE19604614A1 true DE19604614A1 (en) 1997-08-14

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DE19604614A Withdrawn DE19604614A1 (en) 1996-02-08 1996-02-08 Encapsulated electronic control device e.g. for motor vehicles

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29918914U1 (en) 1999-10-27 2000-03-09 TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell Control device for occupant restraint systems in vehicles
DE102004043054A1 (en) * 2004-09-06 2006-03-30 Bayerische Motoren Werke Ag Electrical components such as ceramic capacitors are located in plastic moulded protective housing
EP2966934A1 (en) * 2014-07-08 2016-01-13 Eberspächer catem GmbH & Co. KG Control device for an electric heating device and method for its production

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Publication number Priority date Publication date Assignee Title
DE29918914U1 (en) 1999-10-27 2000-03-09 TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell Control device for occupant restraint systems in vehicles
US6362971B1 (en) 1999-10-27 2002-03-26 Trw Automotive Electronics & Components Gmbh & Co.Kg Control device for a vehicular occupant restraint system
DE102004043054A1 (en) * 2004-09-06 2006-03-30 Bayerische Motoren Werke Ag Electrical components such as ceramic capacitors are located in plastic moulded protective housing
DE102004043054B4 (en) * 2004-09-06 2016-01-28 Bayerische Motoren Werke Aktiengesellschaft Arrangement with a conductor track structure with electrical or electronic components in a protective housing, protective housing therefor and method for forming an assembly
EP2966934A1 (en) * 2014-07-08 2016-01-13 Eberspächer catem GmbH & Co. KG Control device for an electric heating device and method for its production
WO2016005205A1 (en) * 2014-07-08 2016-01-14 Eberspächer Catem Gmbh & Co. Kg Controller for an electric heating device, and method for producing same
CN106537058A (en) * 2014-07-08 2017-03-22 埃贝赫卡腾有限两合公司 Controller for an electric heating device, and method for producing same
US20170151858A1 (en) * 2014-07-08 2017-06-01 Eberspächer Catem Gmbh & Co. Kg Controller for an Electric Heating Device and Method for Producing Same
US10723200B2 (en) 2014-07-08 2020-07-28 Eberspächer Catem Gmbh & Co. Kg Controller for an electric heating device and method for producing same
CN106537058B (en) * 2014-07-08 2020-12-08 埃贝赫卡腾有限两合公司 Control device for an electric heating apparatus and method for producing such a control device

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