DE112014001400A5 - Anzeigevorrichtung - Google Patents

Anzeigevorrichtung Download PDF

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Publication number
DE112014001400A5
DE112014001400A5 DE112014001400.1T DE112014001400T DE112014001400A5 DE 112014001400 A5 DE112014001400 A5 DE 112014001400A5 DE 112014001400 T DE112014001400 T DE 112014001400T DE 112014001400 A5 DE112014001400 A5 DE 112014001400A5
Authority
DE
Germany
Prior art keywords
display device
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112014001400.1T
Other languages
English (en)
Inventor
Norwin Von Malm
Alexander Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112014001400A5 publication Critical patent/DE112014001400A5/de
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386Geometry or layout of the interconnection structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78672Polycrystalline or microcrystalline silicon transistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • H01L33/405Reflective materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
DE112014001400.1T 2013-03-15 2014-03-05 Anzeigevorrichtung Granted DE112014001400A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013102667.2A DE102013102667A1 (de) 2013-03-15 2013-03-15 Anzeigevorrichtung
DE102013102667.2 2013-03-15
PCT/EP2014/054275 WO2014139849A1 (de) 2013-03-15 2014-03-05 Anzeigevorrichtung

Publications (1)

Publication Number Publication Date
DE112014001400A5 true DE112014001400A5 (de) 2015-12-03

Family

ID=50231173

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013102667.2A Withdrawn DE102013102667A1 (de) 2013-03-15 2013-03-15 Anzeigevorrichtung
DE112014001400.1T Granted DE112014001400A5 (de) 2013-03-15 2014-03-05 Anzeigevorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013102667.2A Withdrawn DE102013102667A1 (de) 2013-03-15 2013-03-15 Anzeigevorrichtung

Country Status (6)

Country Link
US (1) US9917077B2 (de)
JP (1) JP6444901B2 (de)
KR (1) KR102175404B1 (de)
CN (1) CN105051901B (de)
DE (2) DE102013102667A1 (de)
WO (1) WO2014139849A1 (de)

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* Cited by examiner, † Cited by third party
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DE102012112302A1 (de) * 2012-12-14 2014-06-18 Osram Opto Semiconductors Gmbh Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung
DE102014115319A1 (de) * 2014-10-21 2016-04-21 Osram Opto Semiconductors Gmbh Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
DE102015108545A1 (de) 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102015108532A1 (de) 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Anzeigevorrichtung mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte
DE102015111574A1 (de) 2015-07-16 2017-01-19 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung sowie Verfahren zur Herstellung einer optoelektronischen Anordnung
US10412369B2 (en) 2015-07-31 2019-09-10 Dell Products, Lp Method and apparatus for compensating for camera error in a multi-camera stereo camera system
US10304811B2 (en) * 2015-09-04 2019-05-28 Hong Kong Beida Jade Bird Display Limited Light-emitting diode display panel with micro lens array
US10032757B2 (en) * 2015-09-04 2018-07-24 Hong Kong Beida Jade Bird Display Limited Projection display system
DE102015115812A1 (de) 2015-09-18 2017-03-23 Osram Opto Semiconductors Gmbh Bauelement sowie Verfahren zur Herstellung eines Bauelements
DE102015119353B4 (de) * 2015-11-10 2024-01-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
CN105470359B (zh) * 2015-12-31 2018-05-08 天津三安光电有限公司 具有内嵌式电极结构的高功率led结构及其制备方法
DE102016100351B4 (de) * 2016-01-11 2023-07-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Leuchtvorrichtung und Autoscheinwerfer
JP6428730B2 (ja) * 2016-08-24 2018-11-28 日亜化学工業株式会社 発光装置
FR3055948B1 (fr) * 2016-09-15 2018-09-07 Valeo Vision Procede de montage d'un composant electroluminescent matriciel sur un support
US11094208B2 (en) * 2016-09-30 2021-08-17 The Boeing Company Stereo camera system for collision avoidance during aircraft surface operations
DE102016220915A1 (de) * 2016-10-25 2018-04-26 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
US10629577B2 (en) * 2017-03-16 2020-04-21 Invensas Corporation Direct-bonded LED arrays and applications
CN107105141B (zh) * 2017-04-28 2019-06-28 Oppo广东移动通信有限公司 图像传感器、图像处理方法、成像装置和移动终端
DE102018118079B4 (de) 2017-10-09 2024-07-18 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Spektrometer
DE102017124307A1 (de) * 2017-10-18 2019-04-18 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
KR102588293B1 (ko) * 2017-12-14 2023-10-11 엘지디스플레이 주식회사 발광 소자, 마이크로 디스플레이 장치
US11749790B2 (en) * 2017-12-20 2023-09-05 Lumileds Llc Segmented LED with embedded transistors
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
DE102018107628B4 (de) * 2018-03-29 2022-09-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierende vorrichtung
DE102018118355A1 (de) * 2018-07-30 2020-01-30 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und optoelektronisches Halbleiterbauteil
JP7449280B2 (ja) 2019-04-23 2024-03-13 京セラ株式会社 マイクロled素子基板および表示装置
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
KR102581156B1 (ko) * 2020-05-15 2023-09-21 루미레즈 엘엘씨 방출 강도의 구성가능한 공간 분포를 갖는 발광 디바이스
DE102021201131A1 (de) * 2021-02-08 2022-08-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement mit einer goldschicht im randbereich

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US5893721A (en) 1997-03-24 1999-04-13 Motorola, Inc. Method of manufacture of active matrix LED array
JP2002141492A (ja) * 2000-10-31 2002-05-17 Canon Inc 発光ダイオードディスプレイパネル及びその製造方法
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JP2009175198A (ja) 2008-01-21 2009-08-06 Sony Corp El表示パネル及び電子機器
EP2245667B1 (de) * 2008-02-29 2018-05-09 OSRAM Opto Semiconductors GmbH Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen
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US8008683B2 (en) * 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device
DE102008062933B4 (de) 2008-12-23 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Projektionsvorrichtung
US9196653B2 (en) 2009-07-30 2015-11-24 3M Innovative Properties Company Pixelated LED
DE102009047788A1 (de) 2009-09-30 2011-03-31 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung für eine Kamera sowie Verfahren zum Betrieb derselben
KR101106151B1 (ko) 2009-12-31 2012-01-20 서울옵토디바이스주식회사 발광 소자 및 그것을 제조하는 방법
KR101142965B1 (ko) * 2010-09-24 2012-05-08 서울반도체 주식회사 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
KR101039610B1 (ko) 2010-10-12 2011-06-09 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
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DE102012112302A1 (de) 2012-12-14 2014-06-18 Osram Opto Semiconductors Gmbh Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung

Also Published As

Publication number Publication date
JP2016513876A (ja) 2016-05-16
JP6444901B2 (ja) 2018-12-26
CN105051901A (zh) 2015-11-11
CN105051901B (zh) 2018-08-31
KR102175404B1 (ko) 2020-11-06
KR20150130293A (ko) 2015-11-23
WO2014139849A1 (de) 2014-09-18
US20160027765A1 (en) 2016-01-28
DE102013102667A1 (de) 2014-10-02
US9917077B2 (en) 2018-03-13

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Legal Events

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R012 Request for examination validly filed
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division