DE102016107982A1 - Smart card module, smart card and method for forming a smart card module - Google Patents

Abstract

In various embodiments, a smart card module for a smart card is provided. The smart card module may include a carrier having a first side and an opposite second side, a chip disposed over the first side of the carrier, an antenna disposed over the carrier, the antenna being electrically conductively coupled and configured to the chip may inductively couple to a second antenna formed on a smart card body of the smart card and a capacitor electrically conductively coupled to the chip, the capacitor having a first electrode disposed over the first side of the carrier , and a second electrode disposed over the second side of the carrier.

Description

Technical area

Various embodiments generally relate to a smart card module and to a method of forming a smart card module.

background

Smart cards (also referred to as smart cards) may include an integrated smart card module (also referred to as chip module or smart card module) having at least one chip. The chip card module can be arranged in a chip card body.

A chip card may be a so-called chip card "with two interfaces" (DIF chip card), i. H. the chip card can be both a chip contact structure, for. B. chip pads, which is arranged on the smart card module, for example, for electrically connecting the smart card with a device, such as a card reader, as well as a device for wireless communication, the induction can use for data exchange and power supply of the smart card, for example by using radio waves , contain. The device for wireless communication of the chip may also be referred to as a wireless data transmission interface, a wireless interface or a CL interface.

The wireless interface may include, for example, an antenna disposed in the smart card body. This antenna may also be referred to as a chip card body antenna or booster antenna. The booster antenna may be constructed in such a manner that contactless communication between the booster antenna and an external device may take place. In other words, the booster antenna may be constructed in such a way that it can receive and transmit electromagnetic information and energy to and from outside the smart card. In addition, the wireless interface may include an antenna in the smart card module. The booster antenna may be inductively coupled to the antenna of the smart card module or may couple inductively. In other words, the antenna of the smart card module may be constructed in such a way that it can perform information and energy exchange by induction with the booster antenna. The antenna of the chip card module can additionally be connected to the chip in an electrically conductive manner.

Therefore, contactless communication between the external device and the chip (from the external device to the chip and / or from the chip to the external device) through the booster antenna, the antenna in the smart card module, and the electrically conductive connection to the chip may be possible be.

The technology of the antenna, which is arranged on the chip card module, for inductive coupling to the booster antenna is also referred to as coil-on-module (CoM).

In CoM modules, the antenna can be designed to match an input capacitance of the chip.

For example, the CoM can be used in combination with the booster antenna to realize a reliable chip card with two interfaces (DIF chip card).

In the case of an application requiring only contactless communication, a module may be equipped with coil windings on both sides. So far, only coil structures can be used.

Summary

In various embodiments, a smart card module for a smart card is provided. The smart card module may include a carrier having a first side and an opposite second side, a chip disposed over the first side of the carrier, an antenna disposed over the carrier, the antenna being electrically conductively coupled and configured with the chip may be inductively coupled to a second antenna formed on a smart card body of the smart card, and a capacitor electrically conductively coupled to the chip, the capacitor having a first electrode disposed over the first side of the carrier and a second electrode disposed over the second side of the carrier.

Brief description of the drawings

In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, instead, in general, the presentation of the principles of the invention is emphasized. In the following description, various embodiments of the invention will be described with reference to the following drawings, in which:

1A shows a DIF chip card module, and 1B shows a contactless (CL-only) smart card module only;

2A and 2 B each cross-sectional views of a CoM smart card module according to different embodiments compared to a conventional CoM chip card module show;

3A and 3B each show a simulation of a magnetic field of a CoM module in accordance with various embodiments;

4 shows two types of layer structures of smart card modules according to various embodiments;

5 a schematic view of a DIF chip card module shows.

6 a smart card in accordance with various embodiments; and

7 10 shows a process flow of a method of forming a smart card module in accordance with various embodiments.

description

The following detailed description refers to the accompanying drawings, which show by way of illustration specific details and embodiments in which the invention may be practiced.

The word "exemplary" is used herein to mean "serving as an example, instance, or representation." Any embodiment or construction described herein as "exemplary" is not necessarily to be interpreted as preferred or advantageous over other embodiments or constructions.

The word "about" as used with respect to an applied material formed "over" a side or surface may be used herein to mean that the applied material is "directly on," e.g. B. may be formed in direct contact with the implied side or surface. The word "about" as used with respect to an applied material formed "over" a side or surface may be used herein to mean that the applied material is "indirectly" on the implied side or surface Surface is formed with one or more additional layers, which are arranged between the implied side or surface and the applied material.

Various aspects of the disclosure are provided for devices, and various aspects of the disclosure are provided for methods. It should be understood that basic characteristics of the devices also apply to the methods, and vice versa. Therefore, for the sake of brevity, the double description of such properties may have been omitted.

For this application, a construction of the module similar to a construction of an ordinary module according to ISO 7816 be.

Such a module may be of the type of a module with two interfaces (DIF module). A DIF module 100a is in 1A shown. In accordance with ISO 7186 For example, the DIF module may have dimensions of 11.8 mm by 13.0 mm (ie, an area of about 149 mm ² ).

An antenna 104 (also as a coil 104 designated), which is intended for contactless communication, may be on a bottom, also called the first page 102S1 is designated, a carrier 102 be arranged. A chip 106 and chip contact structures 108 can also be on the first page 102S1 of the carrier 102 be arranged.

Chip pads 110 (also as ISO contact points 110 or contact points 110 may be on a top, also called the second side 102S2 designated, be arranged. A simple bridge 116 on the top 102S2 can close the coil 104 be used.

1B shows an ordinary contactless module (CL module) 100b , It may have dimensions of 8.0 mm by 8.0 mm (ie an area of about 60 mm ² ). It can have a chip on a first page 102S1 a carrier 102 is arranged. An antenna 104 (a coil 104 ), which is intended for contactless communication, may be on the first page 102S1 and on the second page 102S2 of the carrier 102 be arranged as in 1B is shown. The second page 102S2 of the CL module can be free of contact points. It can, however, be a metal plate 112 on the second page 102S2 be arranged, for example, to increase the heat dissipation.

Due to a number of windings of the coil 104 , which may be needed to realize a required inductance value, may be limited in space to realize additional structures. However, implementing structures that form an additional capacitor that can be connected in parallel with an input of the chip would reduce the number of turns of the coil 104 allow. In addition, a suitably high capacitance value would be advantageous in terms of power matching. Thus, overall performance of such structures could be significantly improved.

In various embodiments, a smart card module, e.g. As a CoM provided. One CoM module can be improved by introducing an additional capacitor structure. The smart card module may have a construction that includes a plate capacitor connected in parallel with the input pads of a chip.

In various embodiments, the capacitor may be formed as an integrated portion of the smart card module, e.g. B. can be based on a double-coated carrier. In this regard, the capacitor may be similar to the coil. For example, the support may include or consist of PET, polyimide, or any other dielectric material.

In various embodiments, due to the additional capacitor, the inductance of the coil and thus its number of turns can be reduced. As a result, additional space can be generated.

Simulations have shown that the smart card module, a smart card, and a method of forming a smart card in accordance with various embodiments can significantly improve overall performance of a CoM system.

Current CoM smart card modules may implement metal structures for heat dissipation (eg, in CL-only CoM modules) and for forming ISO pads (eg, in DIF-CoM modules).

In various embodiments, plates (eg, metal plates) of an additional capacitor may be inserted. Thus, the additional capacitor may be a plate capacitor.

C

= Kapazität in Farad

ε

= Permittivität des Dielektrikums (absolut, nicht relativ)

A

= Fläche der Plattenüberlappung in Quadratmetern

d

= Abstand zwischen Platten in Meter

A value of the additionally generated capacity can be calculated by: C = εA / d With:

C

= Capacity in farads

ε

= Permittivity of the dielectric (absolute, not relative)

A

= Area of the plate overlap in square meters

d

= Distance between plates in meters

2A shows in its lower part a cross-sectional view of a CoM smart card module 200a according to various embodiments. For comparison, a cross-sectional view of a conventional CoM smart card module is shown 100a shown in the upper area. The chip card module of 2A can be a smart card module with two interfaces (DIF module).

2 B shows in its lower part a cross-sectional view of a CoM smart card module 200b according to various embodiments. For comparison, a cross-sectional view of a conventional CoM smart card module is shown 100b shown in the upper area. The chip card module of 2 B may be a contactless (CL-only) smart card module only.

In various embodiments, the smart card module 200a . 220b a carrier 102 contain.

The carrier 102 can be a first page 102S1 with a first main surface and a second side 102S2 with a second major surface 102S2 have, wherein the first page 102S1 the second page 102S2 and, as a result, the second major surface is opposite the first major surface.

In various embodiments, the smart card module 200a . 200b a chip 106 contain. The chip 106 can over the first page 102S1 of the carrier 102 be arranged. The chip 106 may include at least one metallization layer and at least one chip contact (neither shown).

In various embodiments, the chip may be 106 at least one integrated circuit, an electronic circuit, a memory chip or an RFID chip (an electromagnetic wave identification chip, namely "radio frequency identification") or any other desired type of chip.

In various embodiments, the smart card module 200a . 200b a capacitor 220 included, which is electrically conductive to the chip 106 is coupled.

In various embodiments, the capacitor may be a first electrode 2201 and a second electrode 2202 included, which are arranged at a distance d, wherein the first electrode 2201 over the first page 102S1 of the carrier 102 arranged and the second electrode 2202 over the second page 102S2 of the carrier 102 can be arranged. The first electrode 2201 For example, on the first surface 102S1 of the carrier 102 be formed. The second electrode 2202 For example, on the second surface 102S2 of the carrier 102 be formed. The distance d may be a thickness of the carrier 102 correspond, z. B. a thickness of the carrier 102 in an area where the first electrode 2201 and the second electrode 2202 are formed.

In various embodiments, the first electrode 2201 and the second electrode 2202 contain or consist of an electrically conductive material. The electrically conductive material may be, for example, a metal, for example copper (with an electrical conductivity of about 58.1 × 10 ⁶ S / m) or a copper alloy, or may consist essentially of metal. For example, it may contain at least one of Cu, Al, Au, Ag, Pt, Ti, Ni, Sn, Zn and Pb. The first electrode 2201 and the second electrode 2202 may have the same material (s)) or different material (s).

In various embodiments, the first electrode 2201 and / or the second electrode 2202 have a thickness in the range of about 5 μm to about 100 μm, for example from about 10 μm to about 50 μm, for example from about 12 μm to about 30 μm. The first electrode 2201 and the second electrode 2202 may have the same thickness (s) or (a) different thickness (s).

The carrier 102 may include or consist essentially of a dielectric material. The dielectric material may, for example, contain or consist of a plastic material, for example a polymer. The polymer may be, for example, a polyester, for example PET or polyethylene naphthalate (PEN) or a polyimide (PI). Alternatively, the carrier 102 contain another dielectric material.

A thickness of the carrier 102 may be in a range of about 10 μm to about 100 μm, for example in a range of about 20 μm to about 80 μm, for example about 25 μm or about 75 μm.

Current CoM modules typically use one of two different types of layered structures: a layered structure containing PI, or a layered structure containing PET.

4 shows as details of areas A in 2A and 2 B Two exemplary types of layer structures of smart card modules in accordance with various embodiments. In the left area is a smart card module 200a . 200b with a carrier 102 containing or consisting of PET is shown, and in the right area is a smart card module 200a . 200b with a carrier 102 showing or consisting of PI.

In various embodiments, the carrier 102 comprising or consisting of PET having a thickness in a range of about 65 μm to about 85 μm.

In various embodiments, the carrier 102 containing or consisting of PI, having a thickness in a range of about 10 μm to about 30 μm.

The carrier 102 that contains or consists of PI may thus be thinner than the carrier 102 containing or consisting of PET. Thus, in a smart card module 200a . 200b containing or consisting of PI, the first electrode 2201 and the second electrode 2202 have a smaller distance d than in a smart card module 200a . 200b containing or consisting of PET. This allows a higher capacity in the capacitor 220 of the chip card module 200a . 200b achieved or consisting of PI.

In addition, PI can have a higher permittivity than PET (relative permittivity of polyimide: ε _r = 3.4, relative permittivity of PET: ε _r = 3.0). Thus, a higher capacity in the capacitor 220 of the chip card module 200a . 200b achieved or consisting of PI. PET may have a phase shift tanφ = 0.016 at 1 MHz, polyimide may have a phase shift tanφ = 0.018 at 1 MHz. In various embodiments, dielectric materials having even higher permittivity than polyimide may be used for the support 102 be used.

In various embodiments, the smart card module 200a . 200b an antenna 104 contain. The antenna 104 can over the first page 102S1 of the carrier 102 be arranged, for example, on the first main surface of the carrier 102 , The antenna 104 may be arranged in a plane which is substantially parallel to the first main surface. The antenna 104 may contain an electrically conductive material. For example, it may contain or consist essentially of at least one of the following materials: a metal, a metallic material, an alloy, an intermetallic compound, copper, aluminum, titanium, titanium nitride, tungsten, gold, silver, nickel, zinc, an aluminum -silicon alloy.

The antenna 104 may in various embodiments by forming a layer on or over the carrier 102 and etching the layer, for example, by copper etching technology or by aluminum etching technology.

In various embodiments, the antenna 104 contain or consist essentially of a single conductive line. The antenna 104 can in the plane to such Be arranged such that it is formed around an area, for example, around a rectangular or square area. In various embodiments, the antenna 104 , as in 3 is shown to be formed as a flat coil around the rectangular or square area.

In various embodiments, for example (but not limited to) in the case that the smart card module is the CL smart card module 220b is, the antenna can 104 additionally or exclusively over the second page 102S2 of the carrier 102 be formed. In this case, an electrically conductive connection between a portion of the first side of the antenna 104 Standing on the first side of the carrier 102 located, and a portion of the second side of the antenna 104 Standing on the second side of the carrier 102 located, and / or an electrically conductive connection between the chip 106 and the second side portion of the antenna 104 by at least one plated-through hole (not shown) in the carrier 102 is formed, be provided.

A plated-through hole should be understood to mean an aperture formed by a material, such as by stamping, soldering, laser drilling or drilling, constructed in such a way that electrical current can be passed through the plated-through hole For example, by an electrically conductive coating, for example, along an inner surface of the opening, or by a conductor, such as a wire or a contact pin, which is inserted into the opening.

In various embodiments, in the case where the antenna 104 or the section of the first side of the antenna 104 on the first page 102S1 of the carrier 102 is arranged, the first electrode 2201 laterally between the chip 106 and the antenna 104 are located. The first electrode 2201 can the chip 106 partially or completely surrounded.

In various embodiments, the first electrode 2201 be arranged in a plane passing through the antenna 104 or the section of the first side of the antenna 104 is formed.

An active area of the capacitor 220 may be defined by a region in which the first electrode 2201 and the second electrode 2202 overlap vertically. The first electrode 2201 and the second electrode 2202 Thus, in various embodiments, they may be arranged to maximize their overlap area. In various embodiments, the second electrode 2202 essentially opposite the first electrode 2201 be.

In various embodiments, the first electrode may be 2201 and / or the second electrode 2201 be substantially rectangular, substantially ellipsoidal, substantially circular, substantially polygonal or of any other shape. The first electrode 2201 For example, in various embodiments, it may include an opening into which the chip may be inserted. In various embodiments, the first electrode 2201 have an opening in which a chip contact structure 108 (please refer 3 ) can be formed.

In various embodiments, the first electrode 2201 and the second electrode 2202 be essentially congruent. In various embodiments, their shapes may differ.

In various embodiments, the smart card module 220a Furthermore, several chip pads 110 included that over the second page 102S2 are arranged. The chip contact points 110 can make an electrically conductive contact to the chip 106 from an exterior of the smart card module 200a (and / or from an exterior of a smart card into / on the smart card module 200a integrated or arranged).

In various embodiments, an electrically conductive contact between the chip 106 and the multiple chip pads 110 be provided by a plurality of plated-through holes (not shown).

The multiple chip pads 110 may be formed by a metal layer, such as a copper layer or a copper alloy layer, or may consist essentially of metal. The chip contact points 110 For example, they may contain at least one of Cu, Al, Au, Ag, Pt, Ti, Ni, Sn, Zn and Pb.

The multiple chip pads 110 may have a thickness ranging from about 5 μm to about 100 μm, for example from about 10 μm to about 50 μm, for example from about 12 μm to about 30 μm.

In various embodiments, the plurality of die pads 110 on the second main surface of the carrier 102 be laminated, for example by an adhesive, such as an adhesive.

The multiple chip pads 110 may be structured in various embodiments. During the structuring of the multiple chip pads 110 In addition, the dielectric layer 109 be structured. The structure the chip pads 110 can be carried out by lithography and etching processes. For example, non-conductive structures, such as in the form of openings, grooves, etc., may be between individual pads from the plurality of die pads 110 be arranged.

In various embodiments, other methods known in the art may be used to form and / or pattern the die pads 110 be used.

The chip contact points 110 In various embodiments, the second electrode may be used 2202 at least partially surrounded laterally.

In various embodiments, the second electrode 2202 along with the multiple chip pads 110 be formed.

In various embodiments, a structure of the plurality of die pads 110 and a portion of an electrically conductive layer, typically called the chip pads 110 thus serving as the second electrode 2202 of the capacitor 220 be used.

5 shows a schematic view of a DIF smart card module 100a , Bright areas with 110F are areas that (according to ISO 7816 ) are reserved for being used as contacts. The black areas may be modified in various embodiments to be the second electrode 2202 of the capacitor 220 to serve.

In various embodiments, the capacitor 220 electrically to the chip 106 be coupled. The capacitor 220 can, for example, parallel to the chip pads 110 to the chip 106 be electrically coupled. Thus, a capacitance of an inductive coupling system that may be transmitted through the antenna 104 and the capacitor 220 is increased compared to a capacitance value of an inductive coupling system that includes only one antenna (such as in FIG 1A . 1B . 2A (above) and 2 B (above) is shown). The higher capacitance value may allow better power adjustment.

Alternatively or additionally, the capacity may be kept similar in various embodiments, e.g. B. substantially equal to or only slightly higher than in the inductive coupling systems of 1A . 1B . 2A (above) and 2 B (above). However, there may be a smaller number of windings of the antenna 104 necessary to reach the capacity value. Is in 2A (five windings in module 100a vs. three windings in module 200a ) and in 2 B (three windings in module 100b vs. two windings in module 200b ). This allows space on the smart card module 200a . 200b be saved, for example, to reduce a size of the smart card module 200a . 200b and / or can be used to increase a size of a heat dissipation structure (in 1B the heat dissipation structure is the metal plate 112 ; in the smart card module 200a . 200b the heat dissipation structure through the first 2201 and / or the second 2202 Electrode of the capacitor 220 be formed).

3A and 3B each show a simulation of a magnetic field (as an H-field) of a CoM module 200a in accordance with various embodiments.

As shown in the upper area, the first electrode 2201 of the capacitor 220 in different embodiments directly (through the structure 332 ) with the antenna 104 and with the chip contact structure 108 be connected.

As shown in the lower section, the structure 332 for directly connecting the first electrode 2201 of the capacitor 220 with the antenna 104 and with the chip contact structure 108 not be present in various embodiments. Instead, the first electrode 2201 of the capacitor 220 for example, by the chip contact structure 108 with the chip 106 be connected, and the chip contact structure 108 can also be with the antenna 104 be electrically conductive connected.

The second electrode 2202 can with the chip 106 through plated through holes and through the chip contact structure 108 be electrically conductive connected.

In various embodiments, the first electrode 2201 and / or the second electrode 2202 be thermally conductive and can be used for heat dissipation, for example, heat generated by the chip 106 is produced.

Reducing an area on the vehicle 102 passing through the antenna 104 is required by electrically conductive coupling of the capacitor 220 to the chip 106 may allow, in various embodiments, to increase a surface area available for heat dissipation through the first electrode 2201 and / or the second electrode 2202 is provided, for example, compared to the metal plate 112 , in the 1B is shown.

In various embodiments, as in 6 shown is a smart card 600 be provided.

The chip card 700 may in various embodiments a smart card body 660 contain.

In various embodiments, the smart card 600 further a smart card module 200a . 200b in accordance with various embodiments as described above.

The chip card 700 may further include a second antenna in various embodiments 662 Also included as a booster antenna 662 is designated. The second antenna 662 can on or in the chip card body 660 be formed and can be connected to the antenna 104 of the chip card module 200a . 200b be inductively coupled. The second antenna 662 may, for example, a chip coupling area 664 which may be configured to be inductive to the antenna 104 of the chip card module 200a . 200b to pair. The chip coupling area can be formed around a chip module area in which the chip module 200a . 200b can be arranged. The chip coupling area 664 the second antenna 662 may in various embodiments, the smart card module 200a . 200b surround.

The chip card body 660 and the second antenna 662 may be formed as known in the art.

7 shows a process flow 700 a method of forming a smart card module in accordance with various embodiments.

The method may include placing a chip on a first side of a carrier (in 710 ), Forming a first electrode of a capacitor over the carrier so that the first electrode laterally at least partially surrounds the chip (in FIG 720 ), Forming a second electrode of the capacitor over a second side of the carrier opposite the first side of the carrier (in 730 ), Placing an antenna over the carrier (in 740 electrically conductively coupling the antenna to the chip, the antenna being configured to inductively couple to a second antenna formed on the smart card 750 ) and electrically conductive coupling of the capacitor to the chip (in 760 ) contain.

In various embodiments, a smart card module for a smart card is provided. The smart card module may include a carrier having a first side and an opposite second side, a chip disposed over the first side of the carrier, an antenna disposed over the carrier, the antenna being electrically conductively coupled to the chip, and configured to inductively couple to a second antenna formed on a smart card body of the smart card and include a capacitor electrically conductively coupled to the chip, the capacitor having a first electrode overlying the first side of the carrier is disposed, and a second electrode, which is disposed over the second side of the carrier contains.

In various embodiments, the antenna may be disposed on the first side of the carrier, wherein the first electrode may be laterally between the chip and the antenna.

In various embodiments, the second electrode may be substantially opposite the first electrode.

In various embodiments, the smart card module may further include a plurality of die pads disposed over the second side.

In various embodiments, the die pads may at least partially laterally surround the second electrode.

In various embodiments, the capacitor may be electrically coupled to the chip parallel to the die pads.

In various embodiments, a smart card is provided. The smart card may include a smart card body, a second antenna formed on the smart card body, and a smart card module according to any of claims 1 to 6 disposed on the smart card body, wherein the smart card module antenna may be inductively coupled to the second antenna ,

In various embodiments, a method of forming a smart card module for a smart card is provided. The method may include disposing a chip on a first side of a carrier, forming a first electrode of a capacitor over the carrier such that the first electrode laterally at least partially surrounds the chip, forming a second electrode of the capacitor over a second side of the carrier opposite the first Side of the carrier, placing an antenna over the carrier, electrically coupling the antenna to the chip, wherein the antenna is configured to inductively couple to a second antenna formed on the smart card and electrically conductively couple the capacitor to the chip Chip included.

In various embodiments, the method may further include forming a plurality of die pads over the second side of the carrier.

In various embodiments, forming a second electrode of the capacitor may be performed simultaneously with forming the plurality of die pads.

Although the invention has been particularly shown and described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined in the appended claims to deviate. The scope of the invention is, therefore, indicated by the appended claims, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited non-patent literature

• ISO 7816 [0023]
• ISO 7186 [0024]
• ISO 7816 [0074]

Claims (10)

Smart card module for a smart card, comprising: a carrier having a first side and an opposite second side; a chip disposed over the first side of the carrier; an antenna disposed over the carrier, the antenna being electrically conductively coupled to the chip and configured to inductively couple to a second antenna formed on a smart card body of the smart card; and a capacitor electrically conductively coupled to the chip, the capacitor comprising a first electrode disposed over the first side of the carrier and a second electrode disposed over the second side of the carrier. Chip card module according to claim 1, wherein the antenna is disposed on the first side of the carrier; wherein the first electrode is laterally between the chip and the antenna. The smart card module of claim 1 or 2, wherein the second electrode is substantially opposite the first electrode. A smart card module according to any one of claims 1 to 3, further comprising: a plurality of chip pads disposed over the second side. The smart card module of claim 4, wherein the chip pads enclose the second electrode at least partially laterally. Chip card module according to one of the preceding claims, wherein the capacitor is electrically coupled to the chip parallel to the chip pads. Chip card, comprising: a smart card body; a second antenna formed on the smart card body; and a chip card module according to one of claims 1 to 6, which is arranged on the chip card body, wherein the antenna of the smart card module is inductively coupled to the second antenna. A method of forming a smart card module for a smart card, the method comprising: Placing a chip on a first side of a carrier; Forming a first electrode of a capacitor over the carrier; Forming a second electrode of the capacitor over a second side of the carrier opposite the first side of the carrier; Placing an antenna over the carrier; electrically conductively coupling the antenna to the chip, the antenna being configured to inductively couple to a second antenna formed on the smart card; and electrically conductive coupling of the capacitor to the chip. The method of claim 8, further comprising: Forming a plurality of chip pads over the second side of the carrier. The method of claim 9, wherein forming a second electrode of the capacitor is performed simultaneously with forming the plurality of die pads.

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