DE102010034085A1 - Embossing tools for microstructure elements - Google Patents
Embossing tools for microstructure elements Download PDFInfo
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- DE102010034085A1 DE102010034085A1 DE102010034085A DE102010034085A DE102010034085A1 DE 102010034085 A1 DE102010034085 A1 DE 102010034085A1 DE 102010034085 A DE102010034085 A DE 102010034085A DE 102010034085 A DE102010034085 A DE 102010034085A DE 102010034085 A1 DE102010034085 A1 DE 102010034085A1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/02—Dies; Accessories
- B44B5/026—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/009—Manufacturing the stamps or the moulds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H1/028—Replicating a master hologram without interference recording by embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/328—Diffraction gratings; Holograms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H2001/0296—Formation of the master hologram
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/04—Processes or apparatus for producing holograms
- G03H1/0476—Holographic printer
- G03H2001/0478—Serial printer, i.e. point oriented processing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2260/00—Recording materials or recording processes
- G03H2260/50—Reactivity or recording processes
- G03H2260/62—Direct etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2270/00—Substrate bearing the hologram
- G03H2270/10—Composition
- G03H2270/13—Metallic
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zur Herstellung von Prägewerkzeugen, die aus einem Substrat bestehen, in dessen Oberfläche Prägestrukturen für Mikrostrukturelemente, wie Hologramme, Nanostrukturen oder dergleichen, eingebracht werden. Erfindungsgemäß werden die Prägestrukturen für die Mikrostrukturelemente in die Oberfläche des Substrats mittels ultrakurzer Laserpulse aus polarisierten elektromagnetischen Wellen bzw. polarisierter elektromagnetischer Strahlung eingebracht. Es wird somit ein Verfahren der Oberflächenstrukturierung benutzt, um Prägewerkzeuge für Mikrostrukturelemente herzustellen. Damit kann die Originalstruktur direkt auf die Oberfläche eines Prägewerkzeugs übertragen und davon Folienabzüge angefertigt werden.The invention relates to a method for producing embossing tools which consist of a substrate, in whose surface embossed structures for microstructure elements, such as holograms, nanostructures or the like, are introduced. According to the invention, the embossed structures for the microstructure elements are introduced into the surface of the substrate by means of ultra-short laser pulses composed of polarized electromagnetic waves or polarized electromagnetic radiation. A surface structuring method is thus used to manufacture embossing tools for microstructure elements. This means that the original structure can be transferred directly to the surface of an embossing tool and foil prints can be made from it.
Description
Die Erfindung betrifft ein Verfahren zur Herstellung von Prägewerkzeugen, die aus einem Substrat bestehen, in dessen Oberfläche Prägestrukturen für Mikrostrukturelemente, wie Hologramme, Nanostrukturen oder dergleichen, eingebracht werden.The invention relates to a method for producing embossing tools, which consist of a substrate, in the surface of which embossed structures for microstructure elements, such as holograms, nanostructures or the like, are introduced.
Das Herstellungsverfahren des Standes der Technik, mit dem Prägewerkzeuge für Mikrostrukturelemente erzeugt werden, beinhaltet eine relativ lange Prozesskette. Zunächst wird ein sogenanntes Original in einem photolithographischen Verfahren hergestellt, wobei ein Elektronenstrahl aus einem Elektronenbeschleuniger, einer sogenannten e-Beam-Anlage, Material von der Oberfläche eines gehärteten metallischen Blechs aus Nickel abträgt. Hierbei wird mit der e-Beam-Anlage bevorzugt ein homogenes Gitter geschrieben und in Quarz geätzt. Davon werden Kopien in ein Substrat aus einem anorganisch-organischen Hybridpolymer abgeformt. Diese Kopien werden dann in einem photolithographischen Prozess mit dem Laserwriter bearbeitet, um eine laterale Strukturierung vorzunehmen.The manufacturing method of the prior art, are produced with the embossing tools for microstructure elements, involves a relatively long process chain. First, a so-called original is produced in a photolithographic process, wherein an electron beam from an electron accelerator, a so-called e-beam system, removes material from the surface of a hardened metallic sheet of nickel. Here, a homogeneous grid is preferably written with the e-beam system and etched in quartz. Of these, copies are molded into a substrate of an inorganic-organic hybrid polymer. These copies are then processed in a photolithographic process with the laserwriter to make a lateral structuring.
Das Original wird anschließend mehrfach galvanisch umkopiert, um einen Stempel für die Herstellung des Prägewerkzeugs anzufertigen. Schließlich wird mit diesem Stempel das Motiv des Originals in einer Rekombinationsanlage vervielfacht, um die gesamte Fläche eines Prägewerkzeugs auszufüllen. Letztendlich entsteht das Prägewerkzeug als galvanische Abformung dieses vervielfältigen Abdrucks.The original is then copied several times galvanically to make a stamp for the production of the embossing tool. Finally, with this stamp, the motif of the original is multiplied in a recombination plant to fill the entire surface of a stamping tool. Ultimately, the embossing tool is produced as a galvanic impression of this duplicated impression.
Dieser Herstellungsprozess ist jedoch sehr personal-, zeit- und kostenintensiv. Des Weiteren sind für die Errichtung von Fertigungsanlagen für diesen Herstellungsprozess hohe Investitionen erforderlich.However, this manufacturing process is very labor-intensive, time-consuming and cost-intensive. Furthermore, high investments are required for the construction of manufacturing facilities for this manufacturing process.
Der Erfindung liegt deshalb die Aufgabe zugrunde, ein gattungsgemäßes Sicherheitselement derart weiterzubilden, dass die Nachteile des Standes der Technik behoben werden.The invention is therefore the object of developing a generic security element such that the disadvantages of the prior art are eliminated.
Diese Aufgabe wird durch die Merkmale der unabhängigen Ansprüche gelöst. Weiterbildungen der Erfindung sind Gegenstand der abhängigen Ansprüche.This object is solved by the features of the independent claims. Further developments of the invention are the subject of the dependent claims.
Erfindungsgemäß werden die Prägestrukturen für die Mikrostrukturelemente in die Oberfläche des Substrats mittels ultrakurzer Laserpulse aus polarisierten elektromagnetischen Wellen bzw. polarisierter elektromagnetischer Strahlung eingebracht. Es wird somit ein Verfahren der Oberflächenstrukturierung benutzt, um Prägewerkzeuge für Mikrostrukturelemente herzustellen. Damit kann die Originalstruktur direkt auf die Oberfläche eines Prägewerkzeugs übertragen und davon Folienabzüge angefertigt werden.According to the invention, the embossed structures for the microstructure elements are introduced into the surface of the substrate by means of ultrashort laser pulses of polarized electromagnetic waves or polarized electromagnetic radiation. Thus, a method of surface structuring is used to produce embossing tools for microstructure elements. Thus, the original structure can be transferred directly to the surface of an embossing tool and made of it slide prints.
Bei dem erfindungsgemäßen Herstellungsverfahren kann die Originalstruktur direkt in die Oberfläche eines gehärteten metallischen Blechs eingebracht werden, so dass besonders vorteilhaft die Nanostrukturen direkt in die Oberfläche eines Prägezylinders eingebracht werden können. Die photolithographischen Prozessschritte der Originalherstellung und die anschließende galvanische Replizierung entfallen somit bei dem erfindungsgemäßen Herstellungsverfahren.In the production method according to the invention, the original structure can be introduced directly into the surface of a hardened metallic sheet, so that particularly advantageously the nanostructures can be introduced directly into the surface of a stamping cylinder. The photolithographic process steps of the original production and the subsequent galvanic replication are thus eliminated in the production process according to the invention.
Die Periode der entstehenden Mikrostrukturelemente hängt von der Wellenlänge der gepulsten Laserstrahlung ab, aber auch von der Pulsdauer und der Pulsanzahl der Laserstrahlung. Die Homogenität der Quasigitterstruktur, der sogenannten Ripples, ist limitiert durch die Homogenität des fokussierten Laserstrahls an der Oberfläche. Ein typischer Laserstrahl weist beispielsweise einen Durchmesser von etwa 20 μm auf, wobei ein größerer Durchmesser die Intensität an der Oberfläche des Substrats verringert.The period of the resulting microstructure elements depends on the wavelength of the pulsed laser radiation, but also on the pulse duration and the number of pulses of the laser radiation. The homogeneity of the quasigitter structure, the so-called ripples, is limited by the homogeneity of the focused laser beam at the surface. For example, a typical laser beam has a diameter of about 20 μm, with a larger diameter reducing the intensity at the surface of the substrate.
Die entstehenden Mikrostrukturelemente haben bevorzugt eine Periode von etwa 500 nm und eine Tiefe von einigen Hundert nm. Es sind jedoch auch feinere Strukturen mit einer Periode von weniger als 300 nm möglich.The resulting microstructure elements preferably have a period of about 500 nm and a depth of a few hundred nm. However, finer structures with a period of less than 300 nm are also possible.
Der genaue Entstehungsprozess der Mikrostrukturelemente bzw. Quasigitterstruktur ist derzeit noch nicht abschließend verstanden. Gemäß der derzeit vorherrschenden wissenschaftlichen Meinung handelt es sich um eine Mischung aus einem Selbstorganisationsprozess, der an der Oberfläche des Substrats durch den hohen Energieeintrag ausgelöst wird, und die wechselwirkende Ordnung durch die elektromagnetische Strahlung des Laserlichts. Das Ergebnis ist dann eine Gitterstruktur, die gewisse Unregelmäßigkeiten zeigt.The exact formation process of the microstructure elements or quasigitter structure is currently not fully understood. According to the current scientific opinion, it is a mixture of a self-assembly process that is triggered on the surface of the substrate by the high energy input, and the interacting order by the electromagnetic radiation of the laser light. The result is a lattice structure that shows some irregularities.
Das Substrat wird mit ultrakurzen Laserpulsen beaufschlagt, so dass Nanostrukturen auf dem Substrat entstehen. In einer bevorzugten Ausführungsform wird anschließend eine Trennschicht, beispielsweise eine Trichlorsilanverbindung, auf die Oberfläche des Prägewerkzeugs aufbracht und schließlich die Reliefstruktur in einen UV-Lack auf einer Kunststofffolie abgeformt.The substrate is subjected to ultrashort laser pulses so that nanostructures are formed on the substrate. In a preferred embodiment, a separating layer, for example a Trichlorosilane compound, applied to the surface of the embossing tool and finally molded the relief structure in a UV varnish on a plastic film.
Bevorzugt haben die Laserpulse eine Pulsdauer von weniger als 50 Pikosekunden, d. h. weniger als 50·10–12 Sekunden, bevorzugt weniger als 1 Pikosekunde, d. h. weniger als 1·10–12 Sekunden, und besonders bevorzugt von etwa 150 Femtosekunden, d. h. etwa 150·10–15 Sekunden.The laser pulses preferably have a pulse duration of less than 50 picoseconds, ie less than 50 × 10 -12 seconds, preferably less than 1 picosecond, ie less than 1 × 10 -12 seconds, and particularly preferably about 150 femtoseconds, ie approximately 150 × 10 -15 seconds.
Bevorzugt sind die elektromagnetischen Wellen der Laserpulse linear polarisiert, wobei sich eine Gitterstruktur ergibt, deren Gitterlinien senkrecht zum Richtungsvektor der elektromagnetischen Welle, dem sogenannten E-Vektor, der einfallenden Laserstrahlung ausgerichtet sind. Bekanntlich steht der Richtungsvektor des elektromagnetischen Felds einer Welle immer senkrecht auf deren Ausbreitungsrichtung und definiert die Polarisationsrichtung der Welle. Wenn zwei Bereiche mit jeweils unterschiedlicher linearer Polarisationsrichtung strukturiert werden und die beiden Polarisationsrichtungen bevorzugt senkrecht zueinander stehen, zeigen diese beiden Bereiche einen maximalen Farbkontrast.Preferably, the electromagnetic waves of the laser pulses are linearly polarized, resulting in a lattice structure whose grating lines are aligned perpendicular to the direction vector of the electromagnetic wave, the so-called E-vector, the incident laser radiation. As is known, the directional vector of the electromagnetic field of a wave is always perpendicular to its propagation direction and defines the direction of polarization of the wave. If two regions each having a different linear polarization direction are patterned and the two polarization directions are preferably perpendicular to one another, these two regions show maximum color contrast.
Alternativ sind die elektromagnetischen Wellen der Laserpulse elliptisch polarisiert, wobei sich eine Gitterstruktur ergibt, deren Gitterlinien senkrecht zur großen Hauptachse des E-Vektors der einfallenden Laserstrahlung ausgerichtet sind. Hierbei variiert die Vorzugsrichtung der Rippelstrukturen gegenüber dem Fall der linearen Polarisationsrichtung stärker und erscheint die Struktur matter.Alternatively, the electromagnetic waves of the laser pulses are elliptically polarized, resulting in a lattice structure whose grating lines are aligned perpendicular to the major axis of the E vector of the incident laser radiation. Here, the preferred direction of the ripple structures compared to the case of the linear polarization direction varies more and the structure appears dull.
Ein Spezialfall der elliptischen Polarisation stellt die zirkulare Polarisation der elektromagnetischen Wellen dar, wobei sich eine Gitterstruktur ergibt, deren Gitterlinien etwa 45° für linkszirkular polarisierte und etwa –45° für rechtszirkular polarisierte Laserstrahlung ausgerichtet sind, bezogen auf die Einfallsebene des Laserstrahls.A special case of elliptical polarization represents the circular polarization of the electromagnetic waves, resulting in a grid structure whose grid lines are aligned about 45 ° for left circular polarized and about -45 ° for right circularly polarized laser radiation, based on the plane of incidence of the laser beam.
Wenn derartige Strukturen in UV-Lack auf eine Folie abgeformt und wie in
Besonders bevorzugt besteht das Substrat mindestens auf seiner Oberfläche aus einem gehärteten Metall, insbesondere gehärtetem Nickel oder einer gehärteten Nickellegierung, einem Dielektrikum oder einer Keramik.Particularly preferably, the substrate consists at least on its surface of a hardened metal, in particular hardened nickel or a hardened nickel alloy, a dielectric or a ceramic.
Bevorzugt bestehen die Prägewerkzeuge aus einem Substrat, das zumindest an seiner Oberfläche eine Vickershärte von mindestens 100 HV-5 und bevorzugt von mindestens 150 HV-5 aufweist. In der nachfolgenden Tabelle sind einige Materialien und die dazugehörigen Vickershärten in HV-10 aufgelistet:
Diese Werte wurden mit einem stationären Prüfgerät gemäß
Mikrostrukturelemente, die mit einem erfindungsgemäßen Prägewerkzeug erzeugt werden, werden besonders bevorzugt für Sicherheitselemente zur Erhöhung des Fälschungsschutzes von Sicherheitsdokumenten, wie Banknoten, Wertpapieren, Ausweisen, Kreditkarten, Debit-Karten oder dergleichen, verwendet. D. h., mit dem erfindungsgemäßen Verfahren werden Prägewerkzeuge hergestellt, mit denen wiederum Sicherheitselemente zur Erhöhung des Fälschungsschutzes von Sicherheitsdokumenten, wie Banknoten, Wertpapieren, Ausweisen, Kreditkarten, Debit-Karten oder dergleichen, oder des Markenschutzes hergestellt werden. Der Fälschungsschutz beruht dabei im Wesentlichen darauf, dass ein visuell einfach und deutlich erkennbarer optisch variabler Effekt der Mikrostrukturen von Reproduktionsgeräten, wie beispielsweise Farbkopierern, nicht oder nur ungenügend wiedergegeben wird.Microstructure elements that are produced with an embossing tool according to the invention are particularly preferably used for security elements to increase the protection against forgery of security documents, such as banknotes, securities, identity cards, credit cards, debit cards or the like. That is, with the inventive method embossing tools are produced, which in turn security elements to increase the protection against counterfeiting of security documents, such as banknotes, securities, ID cards, credit cards, debit cards or the like, or the trademark protection are produced. The protection against counterfeiting is essentially based on the fact that it is visually simple and clearly recognizable optically variable effect of the microstructures of reproduction equipment, such as color copiers, is not or insufficiently reproduced.
Anhand der nachfolgenden Ausführungsbeispiele und den ergänzenden Figuren werden die Vorteile der Erfindung erläutert. Die Ausführungsbeispiele stellen bevorzugte Ausführungsformen dar, auf die jedoch die Erfindung in keinerlei Weise beschränkt sein soll. Des Weiteren sind die Darstellungen in den Figuren des besseren Verständnisses wegen stark schematisiert und spiegeln nicht die realen Gegebenheiten wider. Insbesondere entsprechen die in den Figuren gezeigten Proportionen nicht den in der Realität vorliegenden Verhältnissen und dienen ausschließlich zur Verbesserung der Anschaulichkeit. Des Weiteren sind die in den folgenden Ausführungsbeispielen beschriebenen Ausführungsformen der besseren Verständlichkeit wegen auf die wesentlichen Kerninformationen reduziert. Bei der praktischen Umsetzung können wesentlich komplexere Muster oder Bilder zur Anwendung kommen.Reference to the following embodiments and the additional figures, the advantages of the invention will be explained. The embodiments represent preferred embodiments, to which, however, the invention should not be limited in any way. Furthermore, the representations in the figures of better understanding are highly schematized and do not reflect the realities. In particular, the proportions shown in the figures do not correspond to the conditions present in reality and serve exclusively to improve the clarity. Furthermore, the embodiments described in the following exemplary embodiments are reduced to the essential core information for the sake of clarity. In the practical implementation much more complex patterns or images can be used.
Im Einzelnen zeigen schematisch:In detail, show schematically:
Trotzdem lassen sich kontrastreiche feine Strukturen mit Abmessungen von bis zu 10 μm erzeugen. Dadurch kann ein hologrammartiger Charakter nachgebildet werden. Solche Muster können in UV-Lack auf Plastikfolien abgeformt und anschließend bedampft werden.Nevertheless, high-contrast fine structures with dimensions of up to 10 μm can be produced. As a result, a hologram-like character can be reproduced. Such patterns can be molded in UV varnish on plastic films and then steamed.
Die Gitterstruktur aus
- • Pulsdauer: 150 fs,
- • Wellenlänge: 800 nm,
- • Wiederholrate: 5 kHz,
- • Strahldurchmesser ca. 20 μm,
- • Energie 0,2 J/cm2–2 J/cm2 (12,5 mW–140 mW),
- • linear polarisierte Strahlung,
- • pulse duration: 150 fs,
- Wavelength: 800 nm,
- • repetition rate: 5 kHz,
- • beam diameter approx. 20 μm,
- Energy 0.2 J / cm 2 -2 J / cm 2 (12.5 mW-140 mW),
- • linearly polarized radiation,
Um die Oberflächenstrukturierung auszuprägen, ist materialabhängig ein gewisser Energieübertrag auf das Substrat notwendig. Dieser Energieeintrag ist jedoch niedriger als bei der Laserablation. Denn das Material wird kurzzeitig in den flüssigen Aggregatszustand überführt. Durch die elektromagnetische Wechselwirkung des Elektronengases mit der einfallenden Laserstrahlung prägt sich die quasiperiodische Oberflächenstruktur aus. Beim Prozess der Laserablation dagegen wird Material von der Substratoberfläche durch Verdampfen abgetragen.Depending on the material, a certain transfer of energy to the substrate is necessary in order to shape out the surface structuring. However, this energy input is lower than with laser ablation. Because the material is temporarily transferred to the liquid state of aggregation. Due to the electromagnetic interaction of the electron gas with the incident laser radiation, the quasiperiodic surface structure is characterized. In the laser ablation process, on the other hand, material is removed from the substrate surface by evaporation.
Zur Bearbeitung verschiedener Bereiche eines Substrats kann gemäß
Beispielsweise wurde der Folienabzug mit einer 10 nm dicken Aluminiumschicht, einer 200 nm dicken Schicht aus Siliziumdioxid und einer 10 nm dicken Aluminiumschicht bedampft. In Reflexion erscheint der Schriftzug oder Stern annähernd schwarz auf goldenem Untergrund, in Transmission ist der Untergrund dagegen blau. Bei schräger Betrachtung erscheint der Schriftzug oder Stern in grüner Farbe.For example, the film print was vapor-deposited with a 10 nm thick aluminum layer, a 200 nm thick layer of silicon dioxide and a 10 nm thick aluminum layer. In reflection, the lettering or star appears almost black on a golden background, while in transmission the background is blue. When viewed obliquely, the lettering or star appears in green.
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- DE 102009058243 [0017] DE 102009058243 [0017]
- DE 102009056933 [0017] DE 102009056933 [0017]
Zitierte Nicht-PatentliteraturCited non-patent literature
- DIN EN ISO 6507-1:2005 bis -4:2005 [0020] DIN EN ISO 6507-1: 2005 to -4: 2005 [0020]
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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DE102010034085A DE102010034085A1 (en) | 2010-08-12 | 2010-08-12 | Embossing tools for microstructure elements |
PCT/EP2011/003948 WO2012019741A1 (en) | 2010-08-12 | 2011-08-05 | Method for producing embossing tools for microstructure elements using ultra-short laser pulses |
Applications Claiming Priority (1)
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DE102010034085A DE102010034085A1 (en) | 2010-08-12 | 2010-08-12 | Embossing tools for microstructure elements |
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DE102010034085A Withdrawn DE102010034085A1 (en) | 2010-08-12 | 2010-08-12 | Embossing tools for microstructure elements |
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WO (1) | WO2012019741A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012016204A1 (en) * | 2012-05-30 | 2013-12-05 | Eads Deutschland Gmbh | Process for nanostructuring and chemical modification of ceramic, glass, carbon, boron, silicon and composite materials |
EP2692855A1 (en) * | 2012-08-03 | 2014-02-05 | Robert Bosch GmbH | Surface structuring for cytological and/or medical applications |
DE102012110630A1 (en) * | 2012-11-06 | 2014-05-08 | Ovd Kinegram Ag | Multi-layer body and method for producing a security element |
DE102012112550A1 (en) * | 2012-12-18 | 2014-06-18 | Lpkf Laser & Electronics Ag | Method for metallizing a workpiece and a layer structure of a workpiece and a metal layer |
DE202017104373U1 (en) | 2016-07-22 | 2017-08-21 | Hofmeister S.R.O. | Cutting tool with at least two surface microstructuring forming inserts |
DE102016110403A1 (en) | 2016-06-06 | 2017-12-07 | THB Treuhandholding und Beteiligungsgesellschaft UG (hb) | Method for producing an embossing tool and embossing tool |
JP2018020378A (en) * | 2012-03-12 | 2018-02-08 | ロレックス・ソシエテ・アノニムRolex Sa | Method for engraving timepiece component and timepiece component obtained using the method |
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WO2020212729A1 (en) * | 2019-04-16 | 2020-10-22 | Aperam | Method for creating an iridescent visual effect on the surface of a material, devices for carrying out said method, and part obtained thereby |
RU2790856C1 (en) * | 2019-04-16 | 2023-02-28 | Аперам | Method for creation of rainbow visual effect on material surface, devices for its implementation and part obtained in such a way |
WO2024032836A1 (en) * | 2022-08-12 | 2024-02-15 | Matthews International GmbH | Method for matting a surface of a device for embossing or printing, and device |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104668779B (en) * | 2013-11-28 | 2017-06-06 | 梅州荣赐拉链制品有限公司 | A kind of method that metal plastic nylon zipper is processed using radium-shine technology |
DE102015100639A1 (en) * | 2015-01-16 | 2016-07-21 | Fritz Egger Gmbh & Co. Og | Device with surface structure produced by embossing and method for its production |
AU2017100354B4 (en) * | 2017-03-27 | 2017-10-05 | Ccl Secure Pty Ltd | Method for manufacturing an embossing cylinder configured for producing microstructure image effects |
US11833616B2 (en) * | 2019-04-16 | 2023-12-05 | Aperam | Method for the creation of an iridescent effect on the surface of a material, and devices for carrying out said method |
DE102020000104A1 (en) | 2020-01-10 | 2021-07-15 | Giesecke+Devrient Currency Technology Gmbh | Production of an embossing tool and embossed security elements |
EP4177057A1 (en) | 2021-11-05 | 2023-05-10 | Boegli-Gravures S.A. | Method for engraving code patterns in a solid piece's tool surface |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009056933A1 (en) | 2009-12-04 | 2011-06-09 | Giesecke & Devrient Gmbh | Security element with color filter, value document with such a security element and production method of such a security element |
DE102009058243A1 (en) | 2009-12-14 | 2011-06-16 | Giesecke & Devrient Gmbh | Thin-film element with multilayer structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6017657A (en) * | 1997-11-26 | 2000-01-25 | Bridgestone Graphic Technologies, Inc. | Method for embossing holograms into aluminum and other hard substrates |
WO2007012215A1 (en) * | 2005-07-28 | 2007-02-01 | Boegli-Gravures Sa | Method and device for the defined structuring of a surface with a laser unit |
DE102007032903A1 (en) * | 2007-07-14 | 2009-01-15 | Schepers Gmbh + Co. Kg | Method for operating a laser engraving device |
DE102008032618A1 (en) * | 2008-07-11 | 2010-01-14 | Wetzel Gmbh | Short-pulse laser engraving process and assembly to emboss the surface of aircraft skin panel with drag-reduction finish |
-
2010
- 2010-08-12 DE DE102010034085A patent/DE102010034085A1/en not_active Withdrawn
-
2011
- 2011-08-05 WO PCT/EP2011/003948 patent/WO2012019741A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009056933A1 (en) | 2009-12-04 | 2011-06-09 | Giesecke & Devrient Gmbh | Security element with color filter, value document with such a security element and production method of such a security element |
DE102009058243A1 (en) | 2009-12-14 | 2011-06-16 | Giesecke & Devrient Gmbh | Thin-film element with multilayer structure |
Non-Patent Citations (1)
Title |
---|
DIN EN ISO 6507-1:2005 bis -4:2005 |
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