CN2875003Y - Heat radiator for electronic element - Google Patents
Heat radiator for electronic element Download PDFInfo
- Publication number
- CN2875003Y CN2875003Y CN 200620003124 CN200620003124U CN2875003Y CN 2875003 Y CN2875003 Y CN 2875003Y CN 200620003124 CN200620003124 CN 200620003124 CN 200620003124 U CN200620003124 U CN 200620003124U CN 2875003 Y CN2875003 Y CN 2875003Y
- Authority
- CN
- China
- Prior art keywords
- electronic component
- conduit
- cooling
- unit
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 239000012809 cooling fluid Substances 0.000 claims description 37
- 239000012530 fluid Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract 6
- 239000006096 absorbing agent Substances 0.000 description 11
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 230000009183 running Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipating device for electronic components includes a storage tank, cooling liquid accommodated in the storage tank, a conduit communicated with the storage tank and allowing cooling liquid to flow therein, a suction unit for sucking the cooling liquid, a cooling unit for cooling the cooling liquid, a heat transfer unit for exchange heat with electronic components, a prolonging unit communicated with the conduit and arranged between the storage tank and the cooling unit for prolonging the flow time and flow path of the cooling liquid from the cooling unit to the storage tank. Cooling liquid can be further cooled in the prolonging unit to improve heat dissipating efficiency of the heat dissipating device.
Description
[technical field]
The utility model relates to a kind of heat abstractor, particularly relates to a kind of heat abstractor that is used for electronic component.
[background technology]
Along with scientific and technological progress, many electronic components marched toward all miniaturization, design characteristics such as high-speed, the microprocessor in the computer product (CPU) especially, characteristics attract the consumer to buy to upgrade faster especially.The height but the CPU of high-speed computation more, the heat of generation also can be healed, if can't be at once promptly with the heat band from CPU, tend to cause computer to work as problems such as machine, data damage, therefore, how handling the electronic component heat dissipation problem in when running, is that the dealer constantly makes great efforts the direction studied.
Consult Fig. 1, generally be used at present the heat abstractor 1 of electronic component, but be that heat exchange ground is connected with this electronic component 100, the hot type that produces during with these electronic component 100 runnings from, itself operate normally to keep this electronic component 100.This heat abstractor 1 comprises a heat absorbing units 11, a refrigerant 12, is pumped unit 13, and a condensing unit 14.
This heat absorbing units 11 has the absorber 111 of a hollow, an and conduit 112 that is connected with this absorber 111, this absorber 111 is in contact with one another with this electronic component 100, and can carry out heat exchange action to this electronic component 100, this conduit 112 has an inflow end 114 that communicates with this absorber 111, and one holds 114 and the outflow end 115 that communicates with this absorber 111 in contrast to this inflows.
This refrigerant 12 is placed in this absorber 111 inside, and after this absorber 111 carried out heat exchange with this electronic component 100, this refrigerant 12 carried out heat exchange with this absorber 111 again.
This is pumped unit 13 and is arranged on this conduit 112 and contiguous these inflow end 114 places, flows out this absorber 111 in order to quicken this refrigerant 12 from the inflow end 114 of this conduit 112, and heat is taken from this electronic component 100, at this, this pumps unit 13 is a pump.
This condensing unit 14 is arranged on this conduit 112 and contiguous these outflow end 115 places, and this condensing unit 14 has a condenser pipe 141 that is continuous bending and is connected with this conduit 112, and multi-disc is arranged at intervals at the fin 142 on this condenser pipe 141.When this refrigerant 12 flowed in the condenser pipe 141 of these condensing units 14, this refrigerant 12 just carried out heat exchange and discharges entrained heat with this condenser pipe 141, and by the tube wall of this condenser pipe 141 be in contact with one another with fin 142 and with heat row to the external world.
The flow through refrigerant 12 of condenser pipe 141 of this condensing unit 14, heat is being arranged to the external world, just can flow via this outflow end 115 once again and inject this absorber 111, and carry out above-mentioned heat exchanging process once more, so that the heat that produces during these electronic component 100 starts can arrange rapidly from, make this electronic component 100 stablize the purpose of normal operation and reach.
Yet, above-mentioned design, after this refrigerant 12 reduces temperature through this condensing unit 14, just flow into this absorber 111 rapidly, its flow path and flowing time are very of short duration, cause this refrigerant 12 in the conduit 112 of this heat absorbing units 11, to be difficult for having the grace time cooling, temperature can't further reduce, for the integral heat sink efficient of this heat abstractor 1, just can't be promoted again, therefore, how to improve the integral heat sink efficient of this heat abstractor 1, just become relevant dealer and urgently think the direction improved.
[utility model content]
The purpose of this utility model is to provide a kind of heat abstractor that is used for electronic component, can prolong the flow path of cooling fluid, with the radiating efficiency of further raising integral heat dissipation means.
For achieving the above object, the utility model is used for the heat abstractor of electronic component, include one and define a groove that stores that stores the space, one is placed in this stores cooling fluid in the space, one conduit for this coolant flow, one extracting unit, one cooling unit, an and heat transfer unit, this conduit has one and stores the port of export that the space is connected with this, and one store with this that space is connected and in contrast to the arrival end of this port of export, this extracting unit is arranged on this conduit and contiguous this arrival end, this cooling unit is arranged on this conduit and contiguous this port of export, this heat transfer unit is arranged on this conduit and between this extracting unit and cooling unit, this heat transfer unit contacts with electronic component, it is characterized in that:
Also comprise an extension apparatus, this extension apparatus be connected with this conduit and between this store groove and the cooling unit between, store the flow path of groove from this cooling unit to this in order to prolong this cooling fluid.
Effect of the present utility model is, after this cooling fluid reduces temperature by this cooling unit, just this extension apparatus of flowing through, store flow path and the flowing time of groove from this cooling unit to this to prolong this cooling fluid, make this cooling fluid in extension apparatus, can further cool off and reduce temperature, improve the radiating efficiency of this heat abstractor, so that this electronic component can be kept normal operation.
[description of drawings]
Fig. 1 is a user mode schematic diagram, and the heat abstractor that generally is used for electronic component is described.
Fig. 2 is a user mode schematic diagram, illustrates that the utility model is used for first preferred embodiment of the heat abstractor of electronic component.
Fig. 3 is a partial perspective view, first preferred embodiment of aid illustration Fig. 2, and wherein, an extension apparatus and stores the relative position of groove.
Fig. 4 is a user mode schematic diagram, illustrates that the utility model is used for second preferred embodiment of the heat abstractor of electronic component.
Fig. 5 is a partial perspective view, second preferred embodiment of aid illustration Fig. 4, wherein, this extension apparatus and the relative position that stores groove.
[embodiment]
Below by preferred embodiment and accompanying drawing the heat abstractor that the utility model is used for electronic component is elaborated.
Before the utility model is described in detail, be noted that in the following description similar elements is to represent with identical numbering.
Consult Fig. 2,3, the utility model is used for first preferred embodiment of the heat abstractor 3 of electronic component, include a groove 31, that stores that stores space 311 and be placed in this and store cooling fluid 32 in the space 311, conduit 33, extracting units 34, a cooling unit 35, a heat transfer unit 36 that can flow for this cooling fluid 32, and an extension apparatus 37.
This conduit 33 has one and stores the port of export 331 that space 311 is connected with this, and one stores with this that space 311 is connected and in contrast to the arrival end 332 of this port of export 331.
This extracting unit 34 is arranged on this conduit 33 and contiguous this arrival end 332, in order to extract this cooling fluid 32, makes it store space 311 via this and flows to this arrival end 332, and in the present embodiment, this extracting unit 34 is a pump.
This cooling unit 35 is arranged on this conduit 33 and contiguous this port of export 331, and have one and be the curved and cooling pipe 351 that be connected with this conduit 33 of Curved Continuous, multi-disc and this cooling pipe 351 fin that are in contact with one another 352, an and fan 353 that is arranged on the described fin 352.
This heat transfer unit 36 is arranged on this conduit 33, between this extracting unit 34 and cooling unit 35, this heat transfer unit 36 has one and is connected with this conduit 33 and is located at hollow housing 361 on this electronic component 2, and multi-disc is located at the radiating fin 362 in this housing 361 at interval.
This extension apparatus 37 is connected with this conduit 33 and stores between groove 31 and the cooling unit 35 between this, this extension apparatus 37 has one by the Heat Conduction Material manufacturing and be arranged at this and store body 371, multi-disc first dividing plate 372 on the groove 31 and multi-disc second partition 373.This body 371 has the inflow end 375 that medial surface 378,379, that a liquid fluid space 374, two is positioned at these liquid fluid space 374 two opposite sides can flow into these liquid fluid spaces 374 for this cooling fluid 32, reaching one can be for the outflow end 376 of these cooling fluid 32 these liquid fluid spaces 374 of outflow, described first dividing plate 372 is to be arranged at wherein on the medial surface 378,373 of described second partitions are arranged on another medial surface 379, and each second partition 373 is to stretch to place between wantonly two adjacent first dividing plates 372.
When these electronic component 2 starts, the heat that it produced can be passed to rapidly on this housing 361 and the described radiating fin 362, relend by this cooling fluid 32 this housing 361 inside of flowing through, and carry out heat exchange action with described radiating fin 362 simultaneously, this cooling fluid 32 continues to flow along this conduit 33, just 351 inside are managed in the cooling of this cooling unit 35 of can flowing through, and by the tube wall of this cooling pipe 351 be in contact with one another with described fin 352 and with heat row to the external world, and utilize the 353 running air-supplies of this fan and accelerate the rate of heat dispation of described fin 352, so that the temperature of this cooling fluid 32 can reduce fast.
When this cooling fluid 32 continues to flow along this conduit 33, and when entering the liquid fluid space 374 of body 371 of this extension apparatus 37, because this liquid fluid space 374 is by described first, two dividing plates 372,373 are separated to form the channel interval of a continuous bend, therefore make that flow path and the flowing time of this cooling fluid 32 in this body 371 all prolonged, and because this body 371 is by the made (aluminium for example of Heat Conduction Material, copper), its conductive coefficient is higher, this cooling fluid 32 just can be carried out heat exchange action with this body 371 in this liquid fluid space 374, and entrained heat is conducted to the external world via this body 371, so that further cooling and then reduce temperature of this cooling fluid 32, and then make this cooling fluid 32 flow into this storing storing in the space 311 of groove 31.Store groove 31 when this cooling fluid 32 flows out this by this extracting unit 34 once again, and flow to the housing 361 of this heat transfer unit 36 when inner, this cooling fluid 32 just can improve and described radiating fin 362 between exchange rate.
By above design, when this cooling fluid 32 is circulated, can accelerate row from the heat that these electronic component 2 starts are produced in this conduit 33, to improve the radiating efficiency of this heat abstractor 3, make this electronic component 2 can keep normal operation.
Consult Fig. 4,5, the utility model is used for second preferred embodiment of the heat abstractor 3 of electronic component, roughly be similar to this first preferred embodiment, different places only are: this extension apparatus 37 has one by the Heat Conduction Material manufacturing and be arranged at this and store body 371 on the groove 31, one this body 371 of perforation also is communicated with this conduit 33 and stores space 311 and be the curved runner of Curved Continuous 377, one can flow into the inflow end 375 of this runner 377 for this cooling fluid 32, and the outflow end 376 that can flow out these runners 377 for this cooling fluid 32, and should inflows hold 375 and outflow end 376 are the opposite end that lay respectively at this runner 377.
The runner 377 of this extension apparatus 37 can be in order to prolong flow path and the flowing time of this cooling fluid 32 in this body 371, when this cooling fluid 32 is flowed through this runner 377, simultaneously just carry out heat exchange action with this body 371, and entrained heat is conducted to the external world via this body 371, so that this cooling fluid 32 is further cooled off and then reduced temperature, improve the radiating efficiency of this heat abstractor 3 whereby.
Conclude above-mentioned, the utility model is used for the heat abstractor 3 of electronic component, by the extension apparatus 37 that is arranged on this conduit 33, and the flow path of this cooling fluid 32 and flowing time are prolonged, and the body 371 of this extension apparatus 37 is made by Heat Conduction Material, when this cooling fluid 32 flows in the liquid fluid space 374 of this body 371, can carry out heat exchange action with this body 371 simultaneously, and entrained heat is conducted to the external world via this body 371, so that this cooling fluid 32 is further cooled off, compared to the heat abstractor 1 that generally is used for electronic component, the cooling fluid 32 of the utility model heat abstractor 3 can be cooled to lower temperature, the heat row who is produced in the time of can be more quickly with these electronic component 2 starts from, improve the radiating efficiency of this heat abstractor 3, so can reach effect of the present utility model really.
Claims (9)
1. heat abstractor that is used for electronic component, include one and define a groove that stores that stores the space, one is placed in this stores cooling fluid in the space, one conduit for this coolant flow, one extracting unit, one cooling unit, an and heat transfer unit, this conduit has one and stores the port of export that the space is connected with this, and one store with this that space is connected and in contrast to the arrival end of this port of export, this extracting unit is arranged on this conduit and contiguous this arrival end, this cooling unit is arranged on this conduit and contiguous this port of export, this heat transfer unit is arranged on this conduit and between this extracting unit and cooling unit, this heat transfer unit contacts with electronic component, it is characterized in that:
Also comprise an extension apparatus, this extension apparatus be connected with this conduit and between this store groove and the cooling unit between, store the flow path of groove from this cooling unit to this in order to prolong this cooling fluid.
2. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that:
This extension apparatus has a body, multi-disc first dividing plate, and multi-disc second partition, this body has a liquid fluid space, two and is positioned at the medial surface of these liquid fluid space two opposite sides, the inflow end that this cooling fluid of confession flows into this liquid fluid space, reaching one supplies this cooling fluid to flow out the outflow end of this liquid fluid space, described first dividing plate is to be arranged at wherein on the medial surface, described second partition then is arranged on another medial surface, and each second partition is to stretch to place between wantonly two adjacent first dividing plates.
3. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that:
This extension apparatus has a body, and connects this body and be communicated with the runner of this conduit, the inflow end that this cooling fluid of confession flows into this runner, and one supplies this cooling fluid to flow out the outflow end of this runner.
4. as being used for the heat abstractor of electronic component as described in the claim 3, it is characterized in that:
The profile of the runner of this extension apparatus is curved for Curved Continuous, and this inflow end and outflow end lay respectively at the opposite end of this runner.
5. as being used for the heat abstractor of electronic component as described in claim 2 or 3, it is characterized in that:
The material of the body of this extension apparatus is a Heat Conduction Material.
6. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that:
This extracting unit is a pump.
7. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that:
This cooling unit has the fin that multi-disc and this conduit are in contact with one another, and a fan that is arranged on the described fin.
8. as being used for the heat abstractor of electronic component as described in the claim 7, it is characterized in that:
This cooling unit also has one and is the curved and cooling pipe that be connected with this conduit of Curved Continuous, and the described fin of this cooling unit is in contact with one another with this cooling pipe respectively.
9. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that:
This heat transfer unit has one and is connected with this conduit and is located at hollow housing on this electronic component, and multi-disc is located at the radiating fin in this housing at interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620003124 CN2875003Y (en) | 2006-02-22 | 2006-02-22 | Heat radiator for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620003124 CN2875003Y (en) | 2006-02-22 | 2006-02-22 | Heat radiator for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2875003Y true CN2875003Y (en) | 2007-02-28 |
Family
ID=37781590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620003124 Expired - Fee Related CN2875003Y (en) | 2006-02-22 | 2006-02-22 | Heat radiator for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2875003Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
| CN106132166A (en) * | 2016-08-02 | 2016-11-16 | 无锡金鑫集团股份有限公司 | A kind of multiple flow passages structure of cooling system |
| CN108682918A (en) * | 2018-05-09 | 2018-10-19 | 深圳市乐业科技有限公司 | A kind of battery with heat dissipation and dedusting function for new-energy automobile |
-
2006
- 2006-02-22 CN CN 200620003124 patent/CN2875003Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
| CN106132166A (en) * | 2016-08-02 | 2016-11-16 | 无锡金鑫集团股份有限公司 | A kind of multiple flow passages structure of cooling system |
| CN106132166B (en) * | 2016-08-02 | 2018-06-22 | 无锡金鑫集团股份有限公司 | A kind of multiple flow passages structure of cooling system |
| CN108682918A (en) * | 2018-05-09 | 2018-10-19 | 深圳市乐业科技有限公司 | A kind of battery with heat dissipation and dedusting function for new-energy automobile |
| CN108682918B (en) * | 2018-05-09 | 2020-06-05 | 谭平洋 | Battery with heat dissipation and dust removal functions for new energy automobile |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070228 |