CN217769122U - Electronic bearing assembly, control cabinet and polishing robot - Google Patents

Abstract

The utility model relates to an electron carrier assembly, switch board and polishing robot, electron carrier assembly includes: the electronic module comprises a plate body, a first circuit board and a second circuit board, wherein the plate body is used for bearing the electronic module and comprises a strong current area and a weak current area; the shell is connected with the plate body and is surrounded with the plate body to form a heat dissipation cavity; the radiator forms radiating airflow in the radiating cavity; the baffle, the baffle is located the heat dissipation intracavity and will the heat dissipation chamber divide into first heat dissipation district and the second heat dissipation district that communicates each other, the radiator is located in the first heat dissipation district, first heat dissipation district with the position in strong electric district is corresponding, the second heat dissipation district with the position in weak electric district is corresponding. The electronic bearing component has a good heat dissipation effect and is convenient for realizing a high IP grade. The cabinet body comprises the electronic bearing assembly and has a high IP grade. The grinding robot comprises a cabinet body and has a high IP grade.

Description

Electronic bearing assembly, control cabinet and polishing robot

Technical Field

The utility model relates to a power electronic technology field especially relates to electron carrier assembly, switch board and polishing robot.

Background

The control cabinet is formed by assembling switch equipment, measuring instruments, protective electrical appliances and auxiliary equipment in a closed or semi-closed metal cabinet or on a screen according to the electrical wiring requirements, and the arrangement of the control cabinet meets the requirements of normal operation of an electric power system, is convenient to overhaul and does not endanger the safety of people and surrounding equipment.

In the current control cabinet, electronic structures such as a control module, a driving module, an I/O module and the like all independently function. Therefore, the various modules are independently radiated during heat radiation, the heat radiation effect is poor, and an effective whole body cannot be formed.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide an electronic bearing assembly, a control cabinet and a polishing robot for solving the heat dissipation problem of the control cabinet.

An electronic carrier assembly, the electronic carrier assembly comprising:

the electronic module comprises a plate body, a first circuit board and a second circuit board, wherein the plate body is used for bearing an electronic module and comprises a strong current area and a weak current area;

the shell is connected with the plate body and is surrounded with the plate body to form a heat dissipation cavity;

the radiator forms radiating airflow in the radiating cavity;

the baffle, the baffle is located the heat dissipation intracavity and will the heat dissipation chamber divide into first heat dissipation district and the second heat dissipation district that communicates each other, the radiator is located in the first heat dissipation district, first heat dissipation district with the position in strong electric district is corresponding, the second heat dissipation district with the position in weak electric district is corresponding.

In one embodiment, the housing has an air inlet and an air outlet, the heat sink is disposed on a sidewall of the air inlet, and the flow direction of the heat dissipating airflow is from the air inlet to the air outlet.

In one embodiment, the heat sink includes a plurality of heat absorbing members and an airflow generator having an air outlet facing the heat absorbing members, the heat absorbing members are uniformly arranged in the first heat dissipation area at intervals, and the heat absorbing members extend along a flowing direction of the heat dissipation airflow.

In one embodiment, the airflow generator, the heat absorbing member and the baffle are sequentially distributed by taking the flowing direction of the heat dissipating airflow as a reference direction.

In one embodiment, the baffle is disposed in the housing and extends into the heat dissipation chamber, the heat absorbing member is disposed on the plate, and a projection of the baffle on a plane where a cross section of the heat absorbing member is located coincides with a portion of the heat absorbing member with a flowing direction of the heat dissipation airflow as a reference direction.

In one embodiment, the baffle is spaced from the plate body.

In one embodiment, the first heat dissipation area and the ferroelectric area are respectively located on two sides of a board body, a through hole for communicating the first heat dissipation area and the ferroelectric area is formed in the board body, and a part of the structure of any one of the heat absorbing members passes through the through hole to be connected with the electronic module of the ferroelectric area.

A control cabinet, comprising:

the cabinet body is provided with two through openings;

in the above electronic bearing assembly according to any one of the embodiments, the electronic bearing assembly is disposed in the cabinet body, and the two through openings are respectively in one-to-one correspondence with the air inlet and the air outlet.

In one embodiment, the control cabinet further includes two protection pieces, and the two protection pieces are respectively arranged in the two through holes in a one-to-one correspondence manner.

An abrading robot, the abrading robot comprising:

a polishing device;

the control cabinet according to any one of the above embodiments, wherein the control cabinet is connected to the polishing device to control a polishing process of the polishing device.

In the above-mentioned electronic bearing component, the board body includes a strong current region and a weak current region. It can be understood that the strong electric region is used for bearing modules with higher power consumption, such as a rectifying module, a driving module and the like, and the heat productivity of each module of the strong electric region is high; the weak current area is used for bearing modules with relatively low power consumption, such as the control module and the I/O module, and the heat productivity of each module in the weak current area is small or basically no heat is generated. The arrangement of the sub-regions is beneficial to the electronic bearing assembly to form an effective whole.

Furthermore, the first heat dissipation area corresponds to the position of the strong electric area, and the heat radiator can be used for dissipating heat of the strong electric area in a targeted manner. The second heat dissipation area corresponds to the weak current area in position, and the second heat dissipation area is communicated with the first heat dissipation area, so that heat dissipation airflow formed by the radiator can flow from the first heat dissipation area to the second heat dissipation area. So set up, can make the radiator to the regional division of radiating chamber through the baffle and to the heat dissipation of strong electric zone pertinence ground to compromise the heat dissipation to weak electric zone.

Drawings

FIG. 1 is a schematic isometric view of an electronic carrier assembly according to one embodiment;

FIG. 2 is a front view of the electronic carrier assembly shown in FIG. 1;

FIG. 3 is an isometric view of a portion of the electronic carrier assembly shown in FIG. 1;

FIG. 4 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 1;

fig. 5 is an axial side view of the plate body shown in fig. 1.

Reference numerals: 10. an electronic carrier assembly; 100. a plate body; 110. a ferroelectric region; 120. a weak current region; 130. perforating; 200. a housing; 210. an air inlet; 220. an air outlet; 300. a heat sink; 310. a heat absorbing member; 320. an airflow generator; 400. a baffle plate; 500. a heat dissipation cavity; 510. a first heat dissipation area; 520. a second heat dissipation area.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

An embodiment of the present invention provides a control cabinet (not shown, the same below) including a cabinet body (not shown, the same below) and an electronic bearing assembly 10. The electronic bearing assembly 10 is arranged in the cabinet body.

Referring to fig. 1 to fig. 3, an electronic bearing assembly 10 according to an embodiment of the present invention includes a plate 100, a housing 200, a heat sink 300 and a baffle 400. The board body 100 is used for carrying an electronic module, and the board body 100 includes a strong current region 110 and a weak current region 120. The housing 200 is connected to the board body 100 and encloses the board body 100 to form a heat dissipation chamber 500. The heat sink 300 forms a heat dissipating airflow within the heat dissipating chamber 500. The baffle 400 is disposed in the heat dissipation chamber 500 and divides the heat dissipation chamber 500 into a first heat dissipation area 510 and a second heat dissipation area 520 which are communicated with each other. The heat sink 300 is disposed in the first heat dissipation area 510. The first heat dissipation area 510 corresponds to the location of the strong electric area 110, and the second heat dissipation area 520 corresponds to the location of the weak electric area 120.

The first heat dissipation area 510 corresponds to the ferroelectric area 110. The above-mentioned position corresponds to that the orthographic projection of the strong electric region 110 on the board body 100 is located in the projection area of the first heat dissipation region 510 on the board body 100. The positions of the second heat dissipation area 520 and the weak current area 120 are the same, and are not described again.

In the electronic carrier assembly 10, the board body 100 includes a strong current region 110 and a weak current region 120. It can be understood that, if the strong electric region 110 is used for bearing modules with higher power consumption, such as a rectifying module, a driving module, and the like, the heat productivity of each module of the strong electric region 110 is large; the weak current region 120 is used to carry modules with relatively low power consumption, such as a control module and an I/O module, and the heat generation amount of each module in the weak current region 120 is small or basically no heat generation. Such a zoned arrangement advantageously forms an effective integral part of the electronic carrier assembly 10.

Further, the first heat dissipation area 510 corresponds to the location of the ferroelectric area 110, since the heat sink 300 can dissipate heat of the ferroelectric area 110 in a targeted manner. The second heat dissipation area 520 corresponds to the weak current area 120, and since the second heat dissipation area 520 is communicated with the first heat dissipation area 510, the heat dissipation airflow generated by the heat sink 300 can flow from the first heat dissipation area 510 to the second heat dissipation area 520. With this arrangement, the partition of the heat dissipation chamber 500 by the baffle 400 can make the heat sink 300 radiate heat to the strong current region 110 in a targeted manner, and also radiate heat to the weak current region 120.

Furthermore, since the strong current module and the weak current module are respectively disposed in the strong current region 110 and the weak current region 120, on one hand, electromagnetic interference between the modules can be reduced, and no additional anti-interference processing is required; on the other hand, so set up structure compacter, can reduce to walk the line.

Referring to fig. 1, in one embodiment, the housing 200 defines an air inlet 210 and an air outlet 220. The heat sink 300 is provided on a sidewall of the intake port 210. As such, the heat sink 300 can draw air through the air inlet 210 to form a heat dissipating airflow within the heat dissipating chamber 500. The heat dissipation airflow can flow out of the heat dissipation chamber 500 through the air outlet 220, so as to form a circulating heat dissipation airflow, and the heat of each module is discharged to achieve the heat dissipation effect. The flow direction of the heat dissipating airflow is a direction from the air inlet 210 to the air outlet 220. It will be appreciated that, so configured, the direction of the flow of the heat dissipating air flow within the heat dissipating chamber 500 is simple. That is, the gas may be drawn through only the single gas inlet 210 and discharged through only the gas outlet 220.

In the prior art, each module has an independent heat dissipation structure, so each module needs independent air inlet 210 and air outlet 220, and therefore a plurality of openings are formed in the cabinet body to enable the air inlets 210 and the air outlets 220 to be communicated with the outside.

In each embodiment, because the air channel in the heat dissipation chamber 500 is simple, the housing 200 only has the air inlet 210 and the air outlet 220 to circulate the heat dissipation air flow. Therefore, the opening on the cabinet body can be relatively reduced, so that the relative sealing performance of the cabinet body is improved. In other words, so set up the IP grade that can be convenient for improve the switch board, be convenient for improve the protective effect of the cabinet body.

It can be understood that the cabinet body is provided with two through openings, and the positions of the two through openings correspond to the positions of the air inlet 210 and the air outlet 220 one by one, so that the air inlet 210 and the air outlet 220 exchange air flow with the outside.

In one embodiment, the control cabinet further comprises two guards (not shown, the same applies below). The two protection pieces are respectively arranged in the two through holes in a one-to-one correspondence mode. The IP grade of the cabinet body can be improved through the protection effect of the two protection parts, namely the isolation protection effect of the cabinet body is improved, so that the working environment of each equipment structure in the cabinet body is not affected by various external factors. The guard may be a filter structure such as a protective net. Of course, the protection member may be provided with other structures having a protection function, and is not limited herein.

Referring to fig. 3, in one embodiment, the heat sink 300 includes a plurality of heat absorbing members 310 and an airflow generator 320 with an outlet facing the heat absorbing members 310. A plurality of heat absorbing members 310 are uniformly spaced within the first heat dissipation area 510. It will be appreciated that the heat absorbing member 310 is capable of absorbing heat from the respective modules. The heat absorbing member 310 may be made of various materials having better thermal conductivity, such as metal.

The plurality of heat absorbing members 310 are each disposed to extend in a flow direction of the heat dissipating airflow. It will be appreciated that the surface area of the heat absorbing member 310 is directly related to the heat absorbing efficiency. Therefore, by arranging the plurality of heat absorbing members 310 to extend along the flowing direction of the heat dissipating airflow, the time of the heat dissipating airflow contacting the surface of the heat absorbing member 310 can be increased, and the heat exchange between the heat absorbing member 310 and the heat dissipating airflow can be increased, thereby improving the heat dissipating effect.

Referring to fig. 3 and 4, in one embodiment, the airflow generator 320, the heat absorbing member 310 and the baffle 400 are sequentially distributed with the flowing direction of the heat dissipating airflow as a reference direction. So set up, can guarantee baffle 400 keep out the wind effect. The direction of the flow of the heat-dissipating air flow is indicated by the arrow K in fig. 4.

The baffle 400 is disposed in the housing 200 and extends into the heat dissipation chamber 500. The heat absorbing member 310 is disposed on the plate body 100. With the flowing direction of the heat dissipating airflow as a reference direction, the projection of the baffle 400 on the plane of the cross section of the heat absorbing member 310 is partially overlapped with the heat absorbing member 310. One of the cross-sections of the heat absorbing member 310 can be seen in plane M in fig. 3.

It can be understood that there is a space between the heat absorbing member 310 and the housing 200 to ensure that there is enough space in the first heat dissipation area 510 for heat exchange, thereby ensuring the heat dissipation effect of the heat sink 300. The heat absorbing member 310 blocks the flow of the heat dissipating air flow at least to some extent due to the outlet of the air flow generator 320 facing the heat absorbing member 310. That is, the resistance to the flow of the heat dissipating air flow between the plurality of heat absorbing members 310 is greater than the resistance to the flow of the heat dissipating air flow in the space between the heat absorbing members 310 and the housing 200. In other words, the heat dissipating airflow is easily directly flowed away from the space between the heat absorbing member 310 and the housing 200 without passing through the heat absorbing member 310.

In the present embodiment, with reference to fig. 4, a projection of a plane of a cross section of the baffle 400 and the heat absorbing member 310 is partially overlapped with the heat absorbing member 310, that is, in a flowing direction of the heat dissipating airflow, the baffle 400 can block the heat dissipating airflow from flowing out of the first heat dissipating area 510 from a space between the heat absorbing member 310 and the housing 200. That is, the baffle 400 can ensure that the heat dissipating airflow flows between the heat absorbing members 310, so as to ensure that the heat dissipating airflow and the heat absorbing members 310 can exchange heat sufficiently, thereby improving the heat dissipating effect of the heat sink 300.

With continued reference to fig. 4, in one embodiment, the baffle 400 is spaced apart from the plate body 100. That is, the baffle 400 located on the housing 200 extends toward a side close to the plate body 100 but does not extend to contact with the plate body 100. In this way, the first heat dissipation area 510 can be ensured to communicate with the second heat dissipation area 520.

In some embodiments, the baffle 400 on the housing 200 may further extend toward the board body 100 to contact the board body 100, that is, two sides of the baffle 400 are respectively connected to the housing 200 and the board body 100 to divide the heat dissipation chamber 500 into a first heat dissipation area 510 and a second heat dissipation area 520 which are relatively isolated. At this time, the baffle 400 may be provided with a plurality of ventilation holes (not shown, the same applies below), and the plurality of ventilation holes and the plurality of heat absorbing members 310 are arranged in a one-to-one correspondence at intervals, so as to ensure that the heat dissipating airflow can circulate in the heat dissipating chamber 500.

Referring to fig. 4 and 5, in one embodiment, the first heat dissipation area 510 and the power dissipation area 110 are respectively located on two sides of the board body 100. The plate body 100 is formed with a through hole 130 for communicating the first heat dissipation region 510 and the power transmission region 110. Part of the structure of any heat absorbing member 310 is connected to the electronic module of the strong electric region 110 through the through hole 130. The heat absorbing member 310 is directly connected to the electronic module and can directly absorb heat emitted from the electronic module. In contrast to the simple arrangement of the first heat dissipation area 510 and the power dissipation area 110 on two sides of the board body 100, the heat of the electronic module is transferred to the heat absorbing member 310 through the board body 100. In this embodiment, the heat absorbing member 310 can directly absorb heat of the electronic module, thereby improving heat absorbing efficiency. The heat dissipation efficiency of the electronic module is relatively improved.

In one embodiment, a grinding robot (not shown, the same below) includes grinding devices (not shown, the same below) and a control cabinet. The control cabinet is connected with the polishing device to control the polishing process of the polishing device. The polishing robot comprises a control cabinet, and the IP grade of the polishing robot can be improved, so that the applicable environment of the polishing robot is increased.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. An electronic carrier assembly, comprising:

the electronic module comprises a plate body, a first circuit board and a second circuit board, wherein the plate body is used for bearing the electronic module and comprises a strong current area and a weak current area;

the shell is connected with the plate body and is surrounded with the plate body to form a heat dissipation cavity;

the radiator forms radiating airflow in the radiating cavity;

the baffle, the baffle is located in the heat dissipation intracavity and will the heat dissipation chamber divide into first radiating area and the second radiating area that communicate each other, the radiator is located in the first radiating area, first radiating area with the position in strong electric zone is corresponding, the second radiating area with the position in weak electric zone is corresponding.

2. The electronic carrier assembly of claim 1, wherein the housing defines an air inlet and an air outlet, the heat sink is disposed on a sidewall of the air inlet, and the flow direction of the heat dissipating airflow is from the air inlet to the air outlet.

3. The electronic carrier assembly of claim 2, wherein the heat spreader includes a plurality of heat absorbing members and an airflow generator having an outlet facing the heat absorbing members, the plurality of heat absorbing members are uniformly spaced within the first heat dissipation area, and each of the plurality of heat absorbing members extends along a flow direction of the heat dissipation airflow.

4. The electronic carrier assembly of claim 3, wherein the airflow generator, the heat sink and the baffle are sequentially disposed in a direction of the heat dissipating airflow.

5. The assembly as claimed in claim 4, wherein the baffle is disposed in the housing and extends into the heat dissipation chamber, the heat absorbing member is disposed on the plate, and a projection of the baffle on a plane of a cross-section of the heat absorbing member coincides with a portion of the heat absorbing member with reference to a flowing direction of the heat dissipation airflow.

6. The electronic carrier assembly of claim 5, wherein the bezel is spaced from the plate body.

7. The electronic carrier assembly of claim 3, wherein the first heat dissipation area and the ferroelectric area are respectively disposed on two sides of a board body, the board body is formed with a through hole for communicating the first heat dissipation area and the ferroelectric area, and a portion of the heat sink passes through the through hole to be connected to the electronic module of the ferroelectric area.

8. A control cabinet, characterized in that the control cabinet comprises:

the cabinet body is provided with two through openings;

the electronic carrier assembly of any of claims 2-7, wherein the electronic carrier assembly is disposed in the cabinet, and the two ports are located in one-to-one correspondence with the air inlet and the air outlet, respectively.

9. The control cabinet of claim 8, further comprising two shielding members, wherein the two shielding members are respectively disposed in the two through holes in a one-to-one correspondence.

10. A grinding robot, comprising:

a polishing device;

the control cabinet of claim 8 or 9, connected to the grinding device for controlling the grinding process of the grinding device.

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