CN217469099U - Laser system - Google Patents

Abstract

The application discloses laser system belongs to the technical field of photoelectricity. The laser system includes: a laser, a printed circuit board and a heat sink; the laser is fixed on the printed circuit board, and the part of the printed circuit board covered by the laser is provided with a hollow area, and the cold head of the radiator penetrates through the hollow area to be abutted against the laser. The laser device solves the problems that the laser device is poor in heat dissipation performance and low in reliability. The application is used for light emission.

Description

Laser system

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser system.

Background

With the development of the optoelectronic technology, the laser is widely used, and the requirement for the reliability of the laser is higher and higher.

In the related art, a base plate of the laser is soldered to a Printed Circuit Board (PCB) to fix the laser to the PCB. Electrode pins connected with the light-emitting chip in the laser need to be connected with corresponding bonding pads on the printed circuit board, so that the required current is transmitted to the light-emitting chip in the laser through the printed circuit board, the light-emitting chip is excited to emit light, and the light emission of the laser is further realized.

The light emitting chip in the laser can generate larger heat when emitting light, and the heat dissipation effect of the laser in the related technology is poorer, so that the risk that the light emitting chip is damaged under the action of the heat is higher, and the reliability of the laser is lower.

SUMMERY OF THE UTILITY MODEL

The application provides a laser system, which can solve the problem that the reliability of a laser is low. The laser system includes:

a laser, a printed circuit board and a heat sink;

the laser device is fixed on the printed circuit board, a hollow area is arranged on the part, covered by the laser device, of the printed circuit board, and the cold head of the radiator penetrates through the hollow area to abut against the laser device.

Optionally, an edge region in the bottom of the laser is fixed to an annular region in the printed circuit board surrounding the hollowed-out region.

Optionally, the laser includes a bottom plate and a frame, the frame surrounds the bottom plate, an inner wall of the frame is fixed to a side surface of the bottom plate, and a bottom of the laser includes an end surface of the frame in the axial direction and a bottom surface of the bottom plate;

the edge region includes the one end face of the bezel.

Optionally, the edge region further comprises a partial region in the bottom surface of the bottom plate.

Optionally, the laser is located in the hollow area, and a side wall of the laser is fixed to an inner wall of the hollow area.

Optionally, the edge of the cold head is spaced from the edge of the hollowed-out area.

Optionally, a heat conducting material is filled between the cold head and the laser, and a heat conductivity coefficient of the heat conducting material is greater than 1 watt/meter-degree.

Optionally, the heat conducting material comprises heat conducting silicone grease, and/or the thickness of the heat conducting material ranges from 0.05 mm to 0.1 mm.

Optionally, the laser includes a plurality of electrode pins, the printed circuit board includes a plurality of pads corresponding to the plurality of electrode pins one to one, and each of the electrode pins is electrically connected to the corresponding pad;

the electrode pins comprise at least one positive electrode pin and at least one negative electrode pin, and the shape of the bonding pad corresponding to the positive electrode pin is different from the shape of the bonding pad corresponding to the negative electrode pin.

Optionally, the laser system further comprises: the heat dissipation substrate is located on one side, far away from the laser, of the printed circuit board, a hollowed-out area is arranged on the portion, covered by the laser, of the heat dissipation substrate, and a cold head of the heat dissipation substrate penetrates through the hollowed-out area in the heat dissipation substrate and the hollowed-out area in the printed circuit board to abut against the laser.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser system that this application provided, the part that is covered by the laser instrument in the printed circuit board has the fretwork district, and the cold head of radiator can directly pass this fretwork district laser instrument and offset. The heat that laser instrument produced when giving out light can directly give off through the cold head of radiator like this, can improve the radiating effect of laser instrument, reduces the risk that the luminous chip in the laser instrument is damaged by the heat of gathering, improves the reliability of laser instrument.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser system according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of another laser system according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 5 is a schematic diagram of a further laser system provided in an embodiment of the present application;

FIG. 6 is a schematic diagram of a laser system according to another embodiment of the present application;

FIG. 7 is a schematic diagram of another laser system according to another embodiment of the present application;

fig. 8 is a schematic structural diagram of another laser system according to another embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, the following detailed description of the embodiments of the present application will be made with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is wider and wider, for example, the laser can be used as a light source of a laser projection device in laser projection. The reliability of the laser device affects the service performance and the service life of the laser projection equipment, so the requirement for the reliability of the laser device is higher and higher at present. The laser instrument can produce more heat including the luminous chip that is used for sending laser, this luminous chip when sending the laser, and this thermal speed of giving off is faster, can reduce the heat more to luminous chip's damage risk, guarantees the reliability of laser instrument.

The laser is fixed to the printed circuit board, and each electrode pin (also called a gold finger) electrically connected to the light emitting chip in the laser is soldered to a corresponding pad on the printed circuit board. Each electrode pin receives current through the printed circuit board, and then transmits the current to the light emitting chip who connects, arouses the light emitting chip to send out laser. In the correlation technique, the whole bottom surface of laser instrument passes through the solder and welds with printed circuit board, and the heat that produces of emitting chip need loop through the bottom of laser instrument like this in the laser instrument, and solder and printed circuit board transmission between laser instrument and the printed circuit board just can realize thermal giving off, and the route that should heat give off is longer, and the radiating rate is slower, and emitting chip has certain damage risk.

The embodiment of the application provides a laser system, can make the heat that produces when giving out light to send out the chip in the laser instrument give off light give off relatively fast, improves the heat dispersion of laser instrument, reduces the damage risk of sending out light chip in the laser instrument, improves the reliability of laser instrument.

Fig. 1 is a schematic structural diagram of a laser system provided in an embodiment of the present application, fig. 2 is a schematic structural diagram of another laser system provided in an embodiment of the present application, and fig. 3 is a schematic structural diagram of another laser system provided in an embodiment of the present application. Fig. 2 may be an exploded view of the laser system shown in fig. 1, and fig. 3 may be a bottom view of the laser system shown in fig. 1.

As shown in fig. 1 to 3, the laser system 10 includes: a laser 101, a printed circuit board 102 and a heat sink 103. The laser 101 is fixed on the printed circuit board 102, a portion of the printed circuit board 102 covered by the laser 101 has a hollow-out area L, and the cold head 1031 of the heat sink 103 abuts against the laser 101 through the hollow-out area L. Fig. 1 to 3 illustrate only a part of the structure of the laser 101.

The bottom of the laser 101 is fixed to the printed circuit board 102, and the cold head 1031 of the heat sink 103 abuts against the bottom of the laser 101. Therefore, heat generated by the light emitting chip in the laser 101 during light emitting can be directly transmitted to the cold head 1031 of the heat sink 103 through the bottom of the laser 101, and then is dissipated by the heat sink 103, so that components required to be dissipated by the heat are reduced, a heat dissipation path is shortened, the heat dissipation performance of the laser 101 can be improved, and the reliability of the laser 101 is ensured.

Alternatively, the shape of the hollow area L in the printed circuit board 102 may be a rectangle, a square, a circle, an ellipse, or any other shape, which is not limited in the embodiment of the present application. Optionally, the shape of the hollow-out area L may be the same as the shape of the cold head of the heat sink 103, so as to maximally ensure that more areas in the laser 101 are in contact with the cold head of the heat sink 103, thereby maximizing the heat dissipation area.

To sum up, in the laser system provided by the embodiment of the present application, the portion covered by the laser in the printed circuit board has a hollowed-out area, and the cold head of the heat sink can directly pass through the hollowed-out area and offset the laser. The heat that laser instrument produced when giving out light can directly give off through the cold head of radiator like this, can improve the radiating effect of laser instrument, reduces the risk that the luminous chip in the laser instrument is damaged by the heat of gathering, improves the reliability of laser instrument.

Fig. 4 is a schematic structural diagram of a laser according to an embodiment of the present disclosure. Referring to fig. 1 to 4, the laser 101 may include: a base plate 1011, a bezel 1012, a light emitting chip 1013, and a plurality of electrode pins 1014.

The bottom plate 1011 and the rim 1012 are fixed, and the bottom plate 1011 and the rim 1012 can enclose a receiving space, which is also a groove. For example, the frame 1012 may surround the base 1011, and the inner wall of the frame 1012 is fixed to the side of the base 1011. The bottom plate 1011 has a plate-like structure. The plate-like structure has two opposite and larger plate faces and a plurality of smaller side faces connecting the two faces. In the embodiment of the present application, a plate surface of the bottom plate 1011 facing the accommodating space is referred to as a top surface (or a mounting surface) of the bottom plate 1011, and a plate surface of the metal bottom plate 101 deviating from the accommodating space is referred to as a bottom surface of the bottom plate 1011. The frame 1012 has a frame-like structure. The two ends of the frame-shaped structure in the axial direction are respectively provided with two opposite annular end surfaces, and the frame-shaped structure is also provided with an inner wall and an outer wall which are connected with the two end surfaces. For example, the axial direction of the rim 1012 in the laser 101 shown in fig. 4 is the z direction. The portion of laser 101 where substrate 1011 is located is the bottom of laser 101 and the portion where border 1012 is located may be the side wall of laser 101. The bottom of the laser 101 may include a bottom surface of the base plate 1011 and an annular end surface of the rim 1012 in the axial direction thereof, which surrounds the bottom surface of the base plate 1011, and which may be flush with the bottom surface of the base plate 1011. The structure of the base 1011 and the rim 1012 may be referred to as a laser package.

The light emitting chip 1013 is located in an accommodating space enclosed by the bottom plate 1011 and the frame 1012, and specifically, the light emitting chip 1013 is located on the bottom plate 1011 and surrounded by the frame 1012. The electrode leads 1014 are used to connect the light emitting chip 1013 within the region surrounded by the frame 1012 and the circuitry outside the region surrounded by the frame 1012. The electrode pins 1014 may also be referred to as gold fingers. The electrode pins 1014 include at least one positive pin for connection with a positive pole of an external power source and at least a negative pin for connection with a negative pole of the external power source. Each of the light emitting chips 1013 is connected to a positive electrode pin and a negative electrode pin to emit laser light by current transmitted between the positive electrode pin and the negative electrode pin. It should be noted that the number of the light emitting chips 1013 in the laser 101 may be one or multiple, and the embodiment of the present application is described by taking an example in which the laser 101 includes multiple light emitting chips 1013.

The laser 101 in the embodiment of the present application may be a laser with any structure, the parts included in the lasers with different structures may be different, and the form and material of the same part may also be different. For example, the material of the base plate 1011 may be metal, and the material of the base plate 1011 may include copper, such as oxygen-free copper. Since the thermal conductivity of oxygen-free copper is high, it can be ensured that the heat generated by the light emitting chip 1013 is dissipated relatively quickly. The frame 1012 may be made of ceramic, and the ceramic frame 1012 will be referred to as a ceramic frame 1012.

Referring to fig. 1 and 4, the ceramic frame 1012 may surround the bottom plate 1011, and the inner wall of the ceramic frame 1012 is fixed to the side of the bottom plate 1011. For example, the ceramic rim 1012 and the base plate 1011 may be fixed by brazing. The electrode pins 1014 may be located on an outer wall of the ceramic rim 1012, such as may be a metal sheet secured to the outer wall of the ceramic rim 1012. The inner wall of the ceramic rim 1012 may have a raised step J on which a plurality of spaced conductive regions Q (see fig. 3) may be formed, the conductive regions Q being electrically connected to the electrode leads 1014 via connection structures (not shown) in the ceramic rim 1012. The conductive region Q is used to electrically connect with the light emitting chip 1013 so as to ensure that the light emitting chip 1013 can be electrically connected with the conductive pin 1014 through the conductive region Q. The conductive region Q is also a bonding region of the light emitting chip 1013. Alternatively, in the laser 101 with other optional structures, the material of the frame 1012 may also be metal. The inner wall of the frame 1012 may not be protruded with a step provided with a conductive region, and the electrode pin 1014 may be a metal bar-shaped structure directly penetrating the frame 1012.

With continued reference to fig. 4, the laser 101 may further include a plurality of reflecting prisms 1015, a plurality of heat sinks 1016, a sealing glass 1017, and a collimating mirror group 1018. The plurality of reflection prisms 1015 correspond one-to-one to the plurality of light emitting chips 1013 in the laser 101, and each reflection prism 1015 is located on the light emitting side of the corresponding light emitting chip 1013. The plurality of heat sinks 1016 also correspond one-to-one to the plurality of light emitting chips 1013, and each light emitting chip 1013 is attached to the base plate 1011 through the corresponding heat sink 1016. Specifically, each heat sink 1016 is attached to the base plate 1011, and each light emitting chip 1013 is located on a side of the corresponding heat sink 1016 remote from the base plate 1011. The heat sink 1016 may assist in the dissipation of heat generated by the corresponding light emitting chip 1013. The sealing glass 1017 is located on a side of the rim 1012 away from the base plate 1011, such as may be fixed to an annular surface of the rim 1012 away from the base plate 1011. The collimating lens group 1018 is located on the side of the sealing glass 1017 away from the bottom plate 1011. The collimating lens group 1018 may include a plurality of collimating lenses, which correspond to the plurality of light emitting chips 1013 one to one. The laser light emitted from each light emitting chip 1013 may be emitted to the corresponding reflection prism 1015, and emitted by the reflection prism 1015 in a direction away from the base plate 1011 (e.g., the z direction in fig. 4), and further emitted through the sealing glass 1017 to the corresponding collimating lens of the light emitting chip 1013 in the collimating lens group 1018, so as to be collimated by the collimating lens and emitted.

The laser 101 in the embodiment of the present application may be a monochromatic laser. For example, the plurality of light emitting chips 1013 in the laser 101 are each configured to emit laser light of the same color. The plurality of light emitting chips 1013 in the laser 101 may be all connected in series, and the laser 101 may include only two electrode pins 1014, where one of the two electrode pins 1014 is a positive electrode pin and the other is a negative electrode pin. Alternatively, the laser 101 in the embodiment of the present application may be a multi-color laser. For example, the plurality of light emitting chips 1013 in the laser 101 may include a plurality of types of light emitting chips, each type of light emitting chip being configured to emit laser light of one color, and the color of the laser light emitted by different types of light emitting chips being different. Each type of light emitting chips 1013 in such a laser 101 may be connected in series, and the number of electrode pins 1014 in the laser 101 may be 2 times the number of light emitting chips 1013. Alternatively, there may be a common electrode pin 1014 for the different kinds of light emitting chips 1013, and in this case, the number of the electrode pins 1014 may be less than 2 times the number of the light emitting chips 1013.

In the embodiment of the present application, the laser 101 includes six electrode pins 1014 respectively disposed on two opposite sides of the outer wall of the frame 1012, and three electrode pins 1014 are disposed on each side. Alternatively, the polarity of the electrode pins 1014 on the same side may be the same. As shown in fig. 3, the laser 101 may have six conductive regions Q on the steps protruded on two opposite sides of the inner wall of the bezel 1012, each conductive region Q having three conductive regions Q, each conductive region Q being connected to one electrode pin 1014 through a connection portion in the bezel 1012.

The plurality of light emitting chips 1013 in the laser 101 may be arranged in a plurality of rows or a single row. Alternatively, each type of light emitting chip 1013 may be arranged in a row, where two ends of each row of light emitting chips 1013 are respectively provided with a positive electrode pin and a negative electrode pin, and each row of light emitting chips 1013 is connected with two electrode pins at two ends thereof. For example, three rows of light emitting chips 1013 may be included in the laser 101 shown in fig. 3.

As shown in fig. 1-3, the laser system 10 may include only one laser 101. Alternatively, the laser system 10 may also include a plurality of lasers 101, and the printed circuit board 102 may have a plurality of hollow-out areas L corresponding to the plurality of lasers 101 one to one. The heat sink 103 may have a plurality of cold heads corresponding to the plurality of lasers 101 one to one, and each cold head abuts against the bottom of the corresponding laser 101 through one hollow-out region L; alternatively, the laser system 10 may include a plurality of heat sinks 103 in one-to-one correspondence with the plurality of lasers 101. Fig. 5 is a schematic structural diagram of another laser system provided in an embodiment of the present application. As shown in fig. 5, the laser system 10 may include two lasers 101.

In the embodiment of the present application, the printed circuit board 102 in the laser system 10 may include an insulating board, and connecting wires and pads for mounting electronic components on the insulating board. The printed circuit board 102 may be coated with an insulating layer in areas other than the area where the pads are located.

Alternatively, the laser 101 and the printed circuit board 102 are fixed by soldering. The area of the printed circuit board 102 for attachment to the laser 101 may be provided with a pad to which the laser 101 is soldered by solder. Such as solder. Illustratively, as shown in fig. 2, the printed circuit board 102 includes an annular region H surrounding the hollow region L. Alternatively, the annular region H may be covered with a conductive material, and the conductive material of the annular region H is a pad. Alternatively, the conductive material in the annular region H of the printed circuit board 102 may be grounded, such as by a conductive trace disposed in the printed circuit board 102. The conductive material in the annular region H may be an annular metal sheet.

With continued reference to fig. 1 and fig. 2, the laser 101 may cover an area around the hollow-out area Q in addition to the hollow-out area Q in the printed circuit board 102. Such as laser 101, also covers the annular region H. The edge region in the base of the laser 101 may be fixed with this annular region H in the printed circuit board 102. For example, solder can be provided between the edge region in the base of the laser 101 and the annular region H, and the solder can be melted to secure the laser 101 to the printed circuit board 102.

Alternatively, in conjunction with the structure of the laser 101 shown in fig. 4, an edge region in the bottom of the laser 101 (i.e., a region where it is fixed to the printed circuit board 102) may include an annular surface of the side of the bezel 1012 facing away from the sealing glass 1017 (i.e., one end surface of the bezel 1012), and may also include a partial region in the bottom surface of the base plate 1011. The partial region of the bottom surface may include an edge region of the bottom surface, for example, the edge region may be annularly distributed on four sides of the bottom surface, or may also include only edge regions on any one side, any two sides, or any three sides of the bottom surface, which is not limited in the embodiments of the present application. Since the light emitting chip 1013 is provided on the base plate 1011, heat generated when the light emitting chip 1013 emits laser light is dissipated through the base plate 101. The base plate 1011 is also in contact with the printed circuit board 102, so that the printed circuit board 102 assists in dissipating the heat, thereby improving the heat dissipation performance of the laser. Alternatively, the edge region in the base of the laser 101 may also comprise only the annular surface of the side of the rim 1012 facing away from the sealing glass 1017, i.e. only this annular surface of the rim 1012 is in contact with the printed circuit board 102, while the base plate 1011 is not in contact with the printed circuit board 102.

Alternatively, the width (i.e., the ring width) of each position of the annular region H may be substantially the same, and the width of the annular region H may range from 0.67 mm to 3 mm. In the related art, the length of the bottom surface of the laser 101 may be 8.5 mm, and the width thereof may be 6 mm, and then the entire bottom surface of the laser 101 is directly soldered to the printed circuit board, and the soldering area is 6 × 8.5 — 51 mm square. In the embodiment of the present application, the welding area of the two can be made the same as that in the related art. Illustratively, the width of the annular region H may be 1.67 mm, and the sum of the length and the width of the bottom surface of the laser 101 may be 18.6 mm. Therefore, the welding reliability of the laser 101 and the printed circuit board 102 can be ensured, and an additional reinforcing structure does not need to be designed for the laser system.

Alternatively, the laser 101 may cover only the hollow area L in the printed circuit board 102. For example, fig. 6 is a schematic structural diagram of a laser system according to another embodiment of the present disclosure. As shown in fig. 6, the laser 101 may be located in the hollow area L, and a sidewall of the laser 101 (e.g., an outer wall of the frame 1012 of the laser 101) and an inner wall of the hollow area L are fixed by an adhesive. The volume of the laser 101 in such a laser system can be small. For another example, the laser system 10 may further include an additional fixing structure to fix the laser 101 and the printed circuit board 102 by the additional fixing structure.

The printed circuit board 102 also has pads corresponding to the respective electrode pins 1014 of the laser 101. Each electrode lead 1014 in the laser 101 may be directly soldered to a corresponding pad by solder or connected to a corresponding pad by a wire (e.g., gold wire bonding between the electrode lead and the pad). The current delivered to the electrode pins 1014 in the laser 101 can thus be controlled by the printed circuit board 102.

Alternatively, the shape of the pad corresponding to the positive electrode pin among the plurality of electrode pins 1014 may be different from the shape of the pad corresponding to the negative electrode pin. Welding machine can discern the pad that each electrode pin needs to be connected through the difference of shape like this, and then welds correspondingly, so can reduce welding machine to the discernment error rate of pad, guarantee that the welding is prevented staying.

Illustratively, a plurality of pads in the printed circuit board 102 corresponding to the plurality of electrode pins 1014 in the laser 101 may be distributed on opposite sides of the laser 101, and at least two pads on each side may be arranged in a row. For example, the pads on the first side of the two opposite sides all correspond to the positive electrode pins, and the pads on the second side all correspond to the negative electrode pins, so that the pads on the first side can be in a first shape, and the pads on the second side can be in a second shape. In the embodiment of the present application, the first shape is a square, the second shape is a circle, and the first shape and the second shape may also be a triangle, a pentagon or other shapes, which is not limited in the embodiment of the present application. As shown in fig. 2 and 3, six pads P corresponding to the six electrode pins 1014 of the laser 101 in the printed circuit board 102 are distributed on two opposite sides of the laser 101, and three pads P are disposed on each side. The shape of the pads P on different sides is different. If the three bonding pads P on the left side correspond to the positive electrode pins, the three bonding pads P are square; three pad P on right side all corresponds the negative pole pin, and these three pad P are circular. For another example, the first side and the second side are both provided with three pads, two pads at two ends of the three pads at the first side correspond to the positive electrode pin, and one pad in the middle corresponds to the negative electrode pin, so that the two pads at the two ends can be in the first shape, and the pad in the middle can be in the second shape. Two pads at two ends of the three pads at the second side correspond to the negative electrode pins, and one pad in the middle corresponds to the positive electrode pin, so that the two pads at the two ends can be in a second shape, and the pad in the middle can be in a first shape. This is not illustrated in the embodiments of the present application.

In this embodiment, the heat sink 103 may be an air-cooled heat sink, a liquid-cooled heat sink, or another heat sink, which is not limited in this embodiment. With continued reference to fig. 1, the heat sink 103 may include a cold head 1031 and a plurality of heat dissipating fins 1032 connected to the cold head 1031. Alternatively, the liquid-cooled heat sink may include only the cold head and no heat sink fins.

In the embodiment of the present application, the bottom of the laser 101 is fixed to the printed circuit board 102, and then the cold head 1031 of the heat sink 103 may abut against the bottom plate 1011 of the laser 101. The cold head 1031 and the bottom plate 1011 may adopt a zero-fitting design, that is, the two are not fixed by other components. Illustratively, the heat sink 103 is fixed in position by a first fixing device, the printed circuit board 102 is fixed in position by a second fixing device, and the arrangement of the relative positions of the first fixing device and the second fixing device can ensure that the cold head 1031 of the heat sink 103 abuts against the bottom plate 1011 of the laser 101.

Alternatively, as shown in fig. 1, the cold head 1031 of the heat sink 103 may be in direct contact with the bottom plate 1011 of the laser 101, or, as shown in fig. 7, a heat conductive material 104 may be further provided between the cold head 1031 of the heat sink 103 and the bottom plate 1011 of the laser 101 so as to abut against the bottom plate 1011 through the heat conductive material 104. Since flatness of the cold head 1031 of the heat sink 103 and the base plate 1011 of the laser 101 may be difficult to ensure, if the cold head 1031 is brought into direct contact with the base plate 1011, there may be a case where the cold head 1031 is not brought into contact with a part of the base plate 1011, so that heat at that part is difficult to be dissipated through the heat sink 103. Set up heat conduction material 104 between the bottom plate 1011 of laser instrument 101 in this application embodiment, can improve the roughness of the contact surface of cold head 1031 and bottom plate 1011 through this heat conduction material 104, guarantee that cold head 1031 and bottom plate 1011 pass through heat conduction material 104 in close contact with, improve the heat conduction effect.

Illustratively, the thermal conductivity of the thermally conductive material may be relatively high, such as greater than 1 watt/meter-degree (W/(m · K)). The thermally conductive material may be thermally conductive silicone grease. The heat conductive silicone grease is in the form of a paste, and the gap between the cold head 1031 and the base plate 1011 can be sufficiently filled with the heat conductive silicone grease. Alternatively, on the basis of ensuring that the cold head 1031 is in close contact with the base plate 1011, the thinner the thickness of the heat conductive material is, the faster the heat transmitted to the base plate 1011 by the cold head 1031 is dissipated. For example, the thermally conductive material may have a thickness in the range of 0.05 mm to 0.1 mm.

Referring to fig. 1 and fig. 7, in the embodiment of the present disclosure, the size of the hollow area L of the printed circuit board 102 may be slightly larger than the size of the cold head 1031 of the heat sink 103. When the cold head 1031 is located in the hollow area L of the printed circuit board 102, an edge of the cold head 1031 is spaced apart from an edge of the hollow area L. Therefore, the transverse pressure generated by the cold head 1031 on the laser 101 can be avoided, and the influence on the heat dissipation quality of the laser 101 can be avoided. Optionally, the peripheral edge of the cold head 1031 may be spaced from the peripheral edge of the hollow-out area L by a distance in a range of 0.5 mm to 1 mm.

Optionally, fig. 8 is a schematic structural diagram of another laser system according to another embodiment of the present application. As shown in fig. 8, the laser system 10 in the embodiment of the present application may further include a heat dissipation substrate 105 based on the structure shown in fig. 2. The heat dissipation substrate 105 is located on a side of the printed circuit board 102 away from the laser 101, and a portion of the heat dissipation substrate 105 covered by the laser 101 also has a hollow area. The cold head 1031 of the heat sink 103 may abut the laser 101 through a hollowed-out area in the heat dissipation substrate 105 and a hollowed-out area in the printed circuit board 102. The hollow-out area in the heat dissipation substrate 105 and the hollow-out area in the printed circuit board 102 may completely coincide. Alternatively, the heat dissipating substrate 105 and the printed circuit board 102 may have the same shape and size. Alternatively, the structure formed by the heat dissipation substrate 105 and the printed circuit board 102 may be directly referred to as a printed circuit board.

The heat-dissipating substrate 105 may be used to carry a printed circuit board. The heat sink substrate 105 may also be used to aid in the heat dissipation of the laser 101 and other components disposed on the printed circuit board 102. Alternatively, the heat dissipation substrate 105 may be a metal substrate, such as a copper substrate. The heat dissipation substrate 105 may also be made of a tungsten-copper alloy, a molybdenum-copper alloy, or a copper-molybdenum-copper (i.e., including a copper layer, a molybdenum layer, and a copper layer stacked in sequence).

To sum up, in the laser system provided by the embodiment of the present application, the portion covered by the laser in the printed circuit board has a hollowed-out area, and the cold head of the heat sink can directly pass through the hollowed-out area and offset the laser. The heat that laser instrument produced when giving out light can directly give off through the cold head of radiator like this, can improve the radiating effect of laser instrument, reduces the risk that the luminous chip in the laser instrument is damaged by the heat of gathering, improves the reliability of laser instrument.

The embodiment of the application also provides a projection device, which can comprise the laser system, and the laser system can be used as a light source in the projection device. The projection device can also comprise a light valve and a lens, wherein laser emitted by the laser system can be emitted into the light valve, the light valve can modulate the received laser based on the picture to be projected, and the modulated laser can be emitted into the lens so as to form a projection picture through the lens.

It should be noted that in the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. In the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. Like reference numerals refer to like elements throughout.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A laser system, comprising: a laser, a printed circuit board and a heat sink;

the laser device is fixed on the printed circuit board, a hollow area is arranged on the part, covered by the laser device, of the printed circuit board, and the cold head of the radiator penetrates through the hollow area to abut against the laser device.

2. The laser system of claim 1, wherein an edge region in the bottom of the laser is secured to an annular region in the printed circuit board surrounding the hollowed out region.

3. The laser system according to claim 2, wherein the laser comprises a base plate and a frame, the frame surrounds the base plate, the inner wall of the frame is fixed with the side surface of the base plate, and the bottom of the laser comprises one end surface of the frame in the axial direction and the bottom surface of the base plate;

the edge region includes the one end face of the bezel.

4. The laser system of claim 3, wherein the edge region further comprises a partial region in the bottom surface of the base plate.

5. The laser system of claim 1, wherein the laser is positioned in the hollowed-out region, and wherein a side wall of the laser is fixed to an inner wall of the hollowed-out region.

6. The laser system of any of claims 1 to 5, wherein an edge of the cold head is spaced from an edge of the hollowed out region.

7. The laser system of any one of claims 1 to 5, wherein a thermally conductive material is filled between the cold head and the laser, the thermally conductive material having a thermal conductivity greater than 1W/m-degree.

8. The laser system of claim 7, wherein the thermally conductive material comprises thermally conductive silicone grease, and/or wherein the thermally conductive material has a thickness in a range from 0.05 mm to 0.1 mm.

9. The laser system according to any one of claims 1 to 5, wherein the laser comprises a plurality of electrode pins, the printed circuit board comprises a plurality of pads in one-to-one correspondence with the plurality of electrode pins, and each of the electrode pins is electrically connected to the corresponding pad;

the electrode pins comprise at least one positive electrode pin and at least one negative electrode pin, and the shape of the bonding pad corresponding to the positive electrode pin is different from the shape of the bonding pad corresponding to the negative electrode pin.

10. The laser system of any of claims 1 to 5, further comprising: the heat dissipation substrate is located on one side, far away from the laser, of the printed circuit board, a hollowed-out area is arranged on the portion, covered by the laser, of the heat dissipation substrate, and a cold head of the heat dissipation substrate penetrates through the hollowed-out area in the heat dissipation substrate and the hollowed-out area in the printed circuit board to abut against the laser.

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