CN216288405U - Efficient radiator based on turbulent flow enhanced heat exchange - Google Patents
Efficient radiator based on turbulent flow enhanced heat exchange Download PDFInfo
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- CN216288405U CN216288405U CN202122875855.7U CN202122875855U CN216288405U CN 216288405 U CN216288405 U CN 216288405U CN 202122875855 U CN202122875855 U CN 202122875855U CN 216288405 U CN216288405 U CN 216288405U
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Abstract
The utility model relates to the technical field of turbulent flow enhanced heat exchange, in particular to a high-efficiency radiator based on turbulent flow enhanced heat exchange, which comprises a radiating base, radiating fins and trapezoidal wings, wherein the radiating base is provided with a plurality of radiating fins; the heat dissipation substrate is formed into a horizontal plate-shaped structure and is integrally arranged into a quadrangular plate shape; the radiating fins are of vertical plate-shaped structures, are provided with a plurality of fins and are respectively vertically arranged on the surface of the radiating base at intervals; the utility model relates to a heat dissipation device for a micro chip, which is characterized in that a plurality of trapezoidal wings are arranged between every two spaced heat dissipation fins, the heat dissipation device is applied to heat exchange and heat dissipation at the position of the micro chip, a heat dissipation channel for turbulent flow enhanced heat transfer is realized by arranging a plurality of heat dissipation fins which are vertically and alternately arranged on the surface of a heat dissipation base, the trapezoidal wings with wide top and narrow bottom are arranged at the channel, airflow is induced to flow to the roots of the heat dissipation base and the heat dissipation fins, and meanwhile, the installation of the trapezoidal wings is also provided with attack angles, so that longitudinal vortexes are formed between the channels to increase the heat and mass exchange of fluid near a main flow area and a wall surface and enhance the heat transfer.
Description
Technical Field
The utility model relates to the technical field of turbulent flow enhanced heat exchange, in particular to a high-efficiency radiator based on turbulent flow enhanced heat exchange.
Background
With the rapid iteration and performance upgrade of electronic products, the chip operation capability of electronic products is continuously improved, and the chip packaging volume is also developed towards miniaturization. However, as the core area of the chip is continuously reduced, the unit heat flux is increased, if the heat dissipation is not timely, the computing capability is reduced due to the overhigh temperature, and the risk of burning the chip can be caused by long-term high-temperature operation; in order to ensure long-time high-load operation of the chip, a radiator with stronger heat dissipation capability becomes the current urgent need, otherwise, the work requirement and the work efficiency are seriously influenced. Although the heat radiator is adopted to radiate the chip at present, for example, the common straight fin heat radiator adopts an air cooling radiating mode, the existing straight fin heat radiator has poor radiating function, and particularly, the temperature of a base plate and the roots of fins of the heat radiator is higher, so that the integral radiating effect is poor.
Disclosure of Invention
In order to solve the above problems, the present invention aims to disclose a heat sink based on turbulent flow enhanced heat exchange, and particularly to a heat sink based on turbulent flow enhanced heat exchange, which effectively enhances the heat exchange effect at the bottom of the heat sink, and reduces the working temperature of an electronic product chip.
In order to achieve the purpose, the utility model adopts the technical scheme that: a high-efficiency radiator based on turbulent flow enhanced heat exchange is characterized in that the radiator mainly comprises a radiating base, radiating fins and trapezoidal wings; the heat dissipation substrate is formed into a horizontal plate-shaped structure and is integrally arranged into a quadrangular plate shape; the radiating fins are of vertical plate-shaped structures and are provided with a plurality of fins which are respectively vertically arranged on the surface of the radiating base at intervals; the trapezoidal wings are provided with a plurality of trapezoidal wings, and each trapezoidal wing is respectively installed between every two spaced radiating fins.
Preferably, the heat dissipation fins are quadrilateral plate-shaped bodies, the heat dissipation fins are arranged in parallel at intervals along the length direction of the heat dissipation base from the bottom edges, and the length of the bottom edges of the heat dissipation fins is flush with the width of the heat dissipation base.
Preferably, an airflow channel is arranged between every two adjacent heat dissipation fins, and the width of the airflow channel is 1-10 mm.
Preferably, the trapezoidal wing is integrally formed into a trapezoidal-like sheet structure and is obliquely connected to the surface of the heat dissipation substrate, the shorter side of the trapezoidal wing is a bottom edge and is fixedly connected with the surface of the heat dissipation substrate, and the distance between the trapezoidal wing and the edge of the heat dissipation substrate is 0-7.25 mm; the longer side of which is arranged obliquely upwards.
Preferably, the height of the trapezoidal wing is lower than that of the radiating fins, and the trapezoidal wing is arranged at an airflow channel between the two radiating fins to form a flow guide platform.
Preferably, the heat dissipation base, the heat dissipation fins and the trapezoidal wings are made of heat-conducting metal materials in an integrated forming mode.
Preferably, the heat dissipation base, the heat dissipation fins and the trapezoidal wings are all made of copper heat conductors or aluminum heat conductors.
Preferably, the bottom surface of the heat dissipation substrate is a heat-generating electronic product connection surface.
Preferably, the heat dissipation substrate is provided with a bolt hole which is vertically through, and is connected with the heating electronic product through the bolt hole from the bottom surface.
The utility model has the beneficial effects that: the utility model is applied to heat exchange and radiation at a microchip, the integral structure is integrally formed into a microminiature structure, a heat radiation channel for turbulent flow enhanced heat exchange is realized by arranging a plurality of heat radiation fins which are vertically and alternately arranged on the surface of a heat radiation base, meanwhile, a trapezoidal wing with a wide top and a narrow bottom is arranged at the channel, airflow is induced to flow to the heat radiation base and the root of the heat radiation fins, a boundary layer viscosity influence area at the bottom of the channel and the downstream of the heat radiation fins is damaged, and meanwhile, an attack angle is also arranged on the installation of the trapezoidal wing, so that longitudinal vortex is formed between the channels to increase the heat and mass exchange of fluid near a main flow area and a wall surface, and the heat exchange is further enhanced. The utility model can treat a large amount of heat dissipation, simultaneously solves the space and cost limitation, and has the characteristics of simple structure, convenient use, easy maintenance and the like in the integral design.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a front view structural view of the present invention.
Fig. 3 is a top view structural view of the present invention.
Reference is made to the accompanying drawings in which: 1-radiating base, 2-radiating fins, 3-trapezoidal wings and 4-bolt holes.
Detailed Description
The following detailed description of embodiments of the utility model refers to the accompanying drawings:
a high-efficiency radiator based on turbulent flow enhanced heat exchange mainly comprises a radiating base 1, radiating fins 2 and trapezoidal wings 3; the row number and the height of the radiating fins 2, the space between the adjacent radiating fins 2 at intervals and the included angle between the trapezoidal wing 3 and the radiating base 1 can be adjusted according to the specific installation environment and the radiating conditions; the heat dissipation substrate 1 is formed into a horizontal plate-shaped structure and is integrally arranged into a quadrangular plate shape; the radiating fins 2 are of a vertical plate-shaped structure, are provided with a plurality of fins and are vertically arranged on the surface of the radiating base 1 at intervals; the radiating fins 2 are quadrilateral plate-shaped bodies and are arranged in parallel along the length direction of the radiating base 1 from the bottom edges at intervals, and the length of the bottom edges of the radiating fins 2 is flush with the width of the radiating base 1; an airflow channel is arranged between every two adjacent heat dissipation fins 2, and the width of the airflow channel is 1-10 mm;
the trapezoidal wings 3 are arranged in a plurality, and each trapezoidal wing 3 is respectively arranged between every two spaced radiating fins 2; the trapezoidal wings 3 are integrally formed into a trapezoidal-like sheet structure, are obliquely connected to the surface of the heat dissipation substrate 1, have the shorter side as the bottom side, are fixedly connected with the surface of the heat dissipation substrate 1, and have the distance of 0-7.25mm from the edge of the heat dissipation substrate 1; the longer side of the upper part is arranged obliquely upwards; the height of the trapezoidal wing 3 is lower than that of the radiating fins 2, and the trapezoidal wing is arranged at an airflow channel between the two radiating fins 2 to form a flow guide table; in this embodiment, the trapezoidal wings 3 may be installed singly, or arranged in multiple rows, distributed equidistantly, or densely distributed along the airflow direction, the channels of the heat dissipating fins 2 are provided with the trapezoidal wings 3 with wide top and narrow bottom, the width of the long sides of the trapezoidal wings 3 and the channels is adjustable, and the optimal proportion range is 0.5-0.75; the trapezoid wings 3 and the heat dissipation substrate 1 form a certain angle, the angle is adjustable, and the optimal angle range is 30-60 degrees;
further, the heat dissipation base 1, the heat dissipation fins 2 and the trapezoidal wings 3 are integrally formed and made of heat-conducting metal materials; more specifically, both are copper heat conductors or aluminum heat conductors; the bottom surface of the heat dissipation substrate 1 is a heating electronic product connecting surface; the heat dissipation substrate 1 is provided with a bolt hole 4 which is through up and down and is connected with the heating electronic product through the bolt hole 4 from the bottom surface; in this embodiment, the heat dissipation substrate 1 is provided with a connection device for connecting to a chip, the connection device includes a bolt, and a necessary fixing member may be additionally provided, when the heat dissipation substrate 1 is provided with the bolt hole 4, the bolt is connected to the bolt hole 4, so as to bolt the heat dissipation substrate 1 and an electronic product to be heat dissipated into a whole, the fixing member is connected to the electronic product as a reinforcing element, and then connected to the heat dissipation substrate 1, thereby implementing the chip heat dissipation connection structure of the heat dissipation substrate 1 and the electronic product.
The working process of the embodiment comprises the following steps: when the heat dissipation fan of the electronic product is started, air flows through the heat dissipation base 1 from the rectangular channel between the adjacent heat dissipation fins 2, and when the air flows through the trapezoidal wings 3 in the rectangular channel, longitudinal vortexes are formed at the two sides and the downstream of the trapezoidal wings 3 under the action of the trapezoidal wings 3, boundary layer viscosity influence areas at the bottom of the channel and the downstream of the heat dissipation fins 2 are damaged, and heat exchange between the chip radiator and the air is enhanced.
In the embodiment, a row of trapezoidal wings 3 is additionally arranged in a rectangular channel formed between adjacent radiating fins 2, referring to fig. 3, when the size of the chip radiator is large, longitudinal vortexes formed by air flowing through the row of trapezoidal wings 3 are not enough to strengthen heat exchange between the whole chip radiator and the air, the row of trapezoidal wings 3 is additionally arranged, the longitudinal vortexes formed by air flowing through the trapezoidal wings 3 are distributed in the whole rectangular channel, the heat exchange effect is further improved, and the row number of the trapezoidal wings 3 is determined by adjusting the size and the radiating condition of the chip radiator.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, and those skilled in the art may make modifications and variations within the spirit of the present invention, and all modifications, equivalents and modifications of the above embodiments according to the technical spirit of the present invention are within the scope of the present invention.
Claims (9)
1. A high-efficiency radiator based on turbulent flow enhanced heat exchange is characterized in that the radiator mainly comprises a radiating base, radiating fins and trapezoidal wings; the heat dissipation substrate is formed into a horizontal plate-shaped structure and is integrally arranged into a quadrangular plate shape; the radiating fins are of vertical plate-shaped structures and are provided with a plurality of fins which are respectively vertically arranged on the surface of the radiating base at intervals; the trapezoidal wings are provided with a plurality of trapezoidal wings, and each trapezoidal wing is respectively installed between every two spaced radiating fins.
2. The efficient heat sink based on turbulent flow enhanced heat exchange of claim 1, wherein the heat dissipation fins are quadrilateral plate-shaped bodies, the heat dissipation fins are installed in parallel at intervals along the length direction of the heat dissipation base from the bottom edges, and the length of the bottom edges of the heat dissipation fins is flush with the width of the heat dissipation base.
3. The efficient heat radiator based on turbulent flow enhanced heat exchange of claim 2, wherein an airflow channel is arranged between every two adjacent heat dissipation fins, and the width of the airflow channel is 1-10 mm.
4. The efficient heat radiator based on turbulent flow enhanced heat exchange of claim 3, wherein the trapezoidal wings are integrally formed into a trapezoidal-like sheet structure and obliquely connected to the surface of the heat radiating substrate, the shorter side of the trapezoidal wings is a bottom side and is fixedly connected with the surface of the heat radiating substrate, and the distance between the trapezoidal wings and the edge of the heat radiating substrate is 0-7.25 mm; the longer side of which is arranged obliquely upwards.
5. The efficient heat sink based on turbulent flow enhanced heat exchange of claim 4, wherein the height of the trapezoidal wings is lower than that of the heat dissipating fins, and a flow guiding platform is formed at the airflow channel between the two heat dissipating fins.
6. The efficient heat sink based on turbulent flow enhanced heat exchange of claim 5, wherein the heat dissipation base, the heat dissipation fins and the trapezoidal wings are made of heat-conducting metal by integral molding.
7. The efficient heat sink based on turbulent flow enhanced heat exchange of claim 6, wherein the heat dissipation base, the heat dissipation fins and the trapezoidal wings are all made of copper heat conductors or aluminum heat conductors.
8. The efficient heat sink based on turbulent flow enhanced heat exchange of claim 7, wherein the bottom surface of the heat dissipation substrate is a connection surface of a heat-generating electronic product.
9. The efficient heat radiator based on turbulent flow enhanced heat exchange of claim 8, wherein the heat radiating substrate is provided with a bolt hole which is through up and down and is connected with the heating electronic product through the bolt hole from the bottom surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122875855.7U CN216288405U (en) | 2021-11-23 | 2021-11-23 | Efficient radiator based on turbulent flow enhanced heat exchange |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122875855.7U CN216288405U (en) | 2021-11-23 | 2021-11-23 | Efficient radiator based on turbulent flow enhanced heat exchange |
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| CN216288405U true CN216288405U (en) | 2022-04-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114885593A (en) * | 2022-07-08 | 2022-08-09 | 苏州市华盛源机电有限公司 | Be applied to graphite alkene radiator among photovoltaic inverter |
| WO2023213247A1 (en) * | 2022-05-06 | 2023-11-09 | 中兴通讯股份有限公司 | Heat dissipation structure, and device having heat dissipation structure and to be subjected to heat dissipation |
-
2021
- 2021-11-23 CN CN202122875855.7U patent/CN216288405U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023213247A1 (en) * | 2022-05-06 | 2023-11-09 | 中兴通讯股份有限公司 | Heat dissipation structure, and device having heat dissipation structure and to be subjected to heat dissipation |
| CN117062385A (en) * | 2022-05-06 | 2023-11-14 | 中兴智能科技南京有限公司 | Heat radiation structure and equipment needing heat radiation |
| CN114885593A (en) * | 2022-07-08 | 2022-08-09 | 苏州市华盛源机电有限公司 | Be applied to graphite alkene radiator among photovoltaic inverter |
| CN114885593B (en) * | 2022-07-08 | 2022-09-27 | 苏州市华盛源机电有限公司 | Be applied to graphite alkene radiator among photovoltaic inverter |
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