CN215819171U - Circuit board heat radiation structure - Google Patents
Circuit board heat radiation structure Download PDFInfo
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- CN215819171U CN215819171U CN202121421137.6U CN202121421137U CN215819171U CN 215819171 U CN215819171 U CN 215819171U CN 202121421137 U CN202121421137 U CN 202121421137U CN 215819171 U CN215819171 U CN 215819171U
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- circuit board
- heat
- sheet
- heat dissipation
- heat radiating
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the utility model discloses a circuit board heat dissipation structure which comprises a heat dissipation part arranged above a circuit board, wherein a heat insulation sheet is connected between the heat dissipation part and the circuit board, and a heat conduction structure is arranged below the circuit board. According to the utility model, the heat radiating piece, the heat insulating sheet, the circuit board and the heat conducting structure are sequentially arranged from top to bottom, the heat insulating sheet is arranged between the heat radiating structure and the circuit board, the increase of the load of the heat radiating surface area of the heat radiating structure is avoided, the heat conducting structure is arranged on the circuit board, and the heat conducting through hole and the tin-coated aluminum layer are arranged on the circuit board, so that the heat radiating area of the circuit board can be increased, the heat radiating performance of the circuit board is improved, and the heat radiating efficiency of the circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation structures, in particular to a circuit board heat dissipation structure.
Background
All be equipped with the circuit board in the intelligent product includes wireless charger, the heat radiation structure of current circuit board generally sets up the aluminum sheet in the both sides of circuit board to dispel the heat, but aluminum sheet direct contact circuit board, aluminum plate's heat dissipation surface area load increases, can not take away the surface temperature who sets up the coil on the circuit board completely, leads to the radiating efficiency of circuit board lower.
Therefore, it is necessary to design a new structure to improve the heat dissipation performance of the circuit board and to improve the heat dissipation efficiency of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model provides a circuit board heat dissipation structure.
In order to solve the technical problems, the utility model aims to realize the following technical scheme: the utility model provides a circuit board heat radiation structure, including setting up the radiating piece in the circuit board top, the radiating piece with be connected with the heat insulating sheet between the circuit board, the below of circuit board is equipped with heat conduction structure.
The further technical scheme is as follows: the heat sink includes an aluminum sheet.
The further technical scheme is as follows: one side of the heat dissipation piece, which is close to the circuit board, is provided with a mounting groove, and the heat insulation sheet is arranged in the mounting groove.
The further technical scheme is as follows: the heat conductive structure includes a heat conductive sheet.
The further technical scheme is as follows: the heat conducting fin comprises a silica gel heat conducting fin.
The further technical scheme is as follows: and the circuit board is provided with a heat conduction through hole.
The further technical scheme is as follows: and a tin-aluminum layer is arranged on one side of the circuit board close to the heat insulation sheet.
The further technical scheme is as follows: the circuit board is provided with a power device, and the heat conducting fins are arranged on the outer side of the power device.
The further technical scheme is as follows: the size of the heat insulation sheet is consistent with that of the circuit board.
Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the heat radiating piece, the heat insulating sheet, the circuit board and the heat conducting structure are sequentially arranged from top to bottom, the heat insulating sheet is arranged between the heat radiating structure and the circuit board, the increase of the load of the heat radiating surface area of the heat radiating structure is avoided, the heat conducting structure is arranged on the circuit board, and the heat conducting through hole and the tin-coated aluminum layer are arranged on the circuit board, so that the heat radiating area of the circuit board can be increased, the heat radiating performance of the circuit board is improved, and the heat radiating efficiency of the circuit board is improved.
The utility model is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic perspective view of a heat dissipation structure of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic side view of a heat dissipation structure of a circuit board according to an embodiment of the present invention;
fig. 3 is a schematic front view of a circuit board according to an embodiment of the present invention.
The labels in the figures illustrate:
10. a heat sink; 20. a heat insulating sheet; 30. a circuit board; 31. a power device; 32. a thermally conductive via; 40. a heat conductive sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic perspective view of a circuit board heat dissipation structure according to an embodiment of the present invention, which can be applied to a product with a circuit board 30 to improve heat dissipation performance of the circuit board 30 and heat dissipation efficiency of the circuit board 30.
Referring to fig. 1, the above-mentioned heat dissipation structure for a circuit board includes a heat dissipation member 10 disposed above a circuit board 30, a heat insulation sheet 20 connected between the heat dissipation member 10 and the circuit board 30, and a heat conduction structure disposed below the circuit board 30.
The coil is arranged above the heat dissipation member 10, the heat dissipation member 10 is mainly used for solving the problem of heat dissipation of the coil, the heat insulation sheet 20 is arranged between the circuit board 30 and the heat dissipation member 10, the increase of the heat dissipation surface load of the heat dissipation member 10 can be avoided, the surface temperature of the coil can be completely taken away, the heat conduction structure is arranged below the circuit board 30, the heat dissipation of the circuit board 30 can be realized, the heat dissipation performance of the circuit board 30 is improved, and the heat dissipation efficiency of the circuit board 30 is improved.
In an embodiment, referring to fig. 2, the heat dissipation member 10 includes an aluminum sheet.
In one embodiment, a mounting groove is formed on one side of the heat sink 10 close to the circuit board 30, and the heat insulation sheet 20 is disposed in the mounting groove. The installation groove is provided to facilitate the fixing and installation of the heat insulation sheet 20.
In one embodiment, referring to fig. 2, the heat conducting structure includes a heat conducting sheet 40.
In the present embodiment, referring to fig. 2, the heat conducting sheet 40 includes a silica gel heat conducting sheet 40. The addition of a thermally conductive silicone sheet to the primary power device 31 on the circuit board 30 also optimizes the heat dissipation effect of the circuit board 30.
In one embodiment, referring to fig. 3, the circuit board 30 is provided with a thermal via 32. The provision of the thermally conductive vias 32 may increase the heat dissipation area of the entire circuit board 30 to improve the heat dissipation efficiency of the circuit board 30.
In one embodiment, the circuit board 30 is provided with a tin-aluminum layer on a side thereof close to the heat shield 20.
The circuit board 30 is additionally provided with a tin-aluminum surface and a via hole, so that the overall heat dissipation area is increased, and the working temperature of the circuit board 30 can be greatly reduced.
In an embodiment, the circuit board 30 is provided with a power device 31, and the heat conducting sheet 40 is disposed outside the power device 31. The heat conductive sheet 40 presses the power device 31 to dissipate heat from the power device 31.
Specifically, the circuit board 30 is provided with a power device 31 on a side thereof adjacent to the thermally conductive sheet 40.
In one embodiment, the size of the heat insulation sheet 20 is consistent with the size of the circuit board 30.
The size of the heat-conducting sheet 40 is slightly larger than that of the circuit board 30, so as to dissipate heat of the circuit board 30 as a whole.
The above-mentioned circuit board heat radiation structure, through from last down set gradually radiating piece 10, heat insulating sheet 20, circuit board 30 and heat conduction structure, set up heat insulating sheet 20 between radiating piece 10 and the circuit board 30, avoid the radiating surface area load of radiating piece 10 to increase, and set up the heat conduction structure on the circuit board 30 to and set up heat conduction via hole 32 and tin aluminium lamination on the circuit board 30, can increase the heat radiating area of circuit board 30, realize the heat dispersion of promotion circuit board 30, improve the radiating efficiency of circuit board 30.
While the utility model has been described with reference to specific embodiments, the utility model is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the utility model. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (4)
1. A circuit board heat radiation structure is characterized by comprising a heat radiation part arranged above a circuit board, wherein a heat insulation sheet is connected between the heat radiation part and the circuit board, and a heat conduction structure is arranged below the circuit board; one side of the heat dissipation piece, which is close to the circuit board, is provided with a mounting groove, and the heat insulation piece is arranged in the mounting groove; the heat conducting structure comprises a heat conducting sheet; the circuit board is provided with a heat conduction through hole; a tin-aluminum layer is arranged on one side of the circuit board close to the heat insulation sheet; the circuit board is provided with a power device, and the heat conducting fins are arranged on the outer side of the power device.
2. The circuit board heat dissipation structure of claim 1, wherein the heat dissipation member comprises an aluminum sheet.
3. The heat dissipating structure of a printed circuit board of claim 1, wherein the heat conducting sheet comprises a silicone heat conducting sheet.
4. The heat dissipating structure of a circuit board of claim 1, wherein the heat-shielding plate has a size corresponding to the size of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121421137.6U CN215819171U (en) | 2021-06-24 | 2021-06-24 | Circuit board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121421137.6U CN215819171U (en) | 2021-06-24 | 2021-06-24 | Circuit board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215819171U true CN215819171U (en) | 2022-02-11 |
Family
ID=80178438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121421137.6U Active CN215819171U (en) | 2021-06-24 | 2021-06-24 | Circuit board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215819171U (en) |
-
2021
- 2021-06-24 CN CN202121421137.6U patent/CN215819171U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221011 Address after: No. 6 Zhenlong East Road, Jiaoyitang, Tangxia Town, Dongguan City, Guangdong Province, 523716 Patentee after: DONGGUAN AOHAI TECHNOLOGY Co.,Ltd. Address before: 518000 No. 103-107 Guihua Road, Guihua community, Guanlan street, Longhua District, Shenzhen, Guangdong (Order No.) 420-8403 Patentee before: SHENZHEN SOLING COMMUNICATION TECHNOLOGY Co.,Ltd. |