CN212266292U - Cutting and grinding processing equipment for silicon single crystal rod - Google Patents
Cutting and grinding processing equipment for silicon single crystal rod Download PDFInfo
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- CN212266292U CN212266292U CN202020548230.2U CN202020548230U CN212266292U CN 212266292 U CN212266292 U CN 212266292U CN 202020548230 U CN202020548230 U CN 202020548230U CN 212266292 U CN212266292 U CN 212266292U
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Abstract
The utility model relates to the technical field of cutting of hard and brittle materials, in particular to a cutting and grinding processing device for a silicon single crystal rod, which comprises a rotary supporting seat, a rotary worktable, an axial clamping mechanism, a wire saw cutting operating mechanism and a grinding and polishing operating mechanism; the rotary supporting seat is sleeved on the rotary shaft; the rotary worktable can be pivotally fixed on the rotary supporting seat; the axial clamping mechanism is arranged on the rotary supporting seat and comprises a rotary motor, a pressure head, a connecting pressure plate and an axial telescopic driving unit, the pressure head is connected with the rotary motor and positioned right above the rotary worktable, one end of the connecting pressure plate is connected with the rotary motor, and the other end of the connecting pressure plate is connected with the axial telescopic driving unit; the fretsaw cutting operation mechanism and the grinding and polishing operation mechanism are sequentially arranged on a rotating path of the rotary working table. The equipment in the scheme has high automation degree, and is favorable for improving the grinding and polishing efficiency of the single crystal silicon rod and improving the production benefit.
Description
Technical Field
The utility model relates to a hard and brittle material cutting technical field especially relates to a single crystal silicon rod surely grinds processing equipment.
Background
The silicon crystal is more and more widely used at present, and relates to a chain of multiple industries such as a photovoltaic industry, a semiconductor industry, a floor heating industry and the like. In actual production, preliminary processing of a silicon ingot is required in order to meet the quality parameters of the silicon crystal and the requirements of the shape and the size of the next process.
The preliminary processing of a single silicon ingot generally comprises the following steps: firstly, a long silicon single crystal rod is cut off to form a plurality of sections of short silicon crystal rods, after the cutting off is finished, the cut short silicon crystal rods are cut to form silicon crystal square stocks, and after the silicon crystal square stocks are polished, other processing devices are used for further processing the polished square stocks. In the existing production device, cutting of the silicon single crystal rod and grinding and polishing of the cut square materials are completed through different processing equipment, the automation degree is low, the transportation of the rod materials is complex, the consumed time is long, the cutting and grinding efficiency of the silicon single crystal rod is low, and the production benefit is poor.
Disclosure of Invention
Therefore, the cutting and grinding processing equipment for the silicon single crystal rod is needed to be provided, and the problems that when the existing silicon single crystal rod processing equipment is used for cutting and grinding the silicon single crystal rod, the cutting and grinding efficiency of the silicon single crystal rod is low and the production benefit is poor due to the fact that the automation degree is high and the rod material transfer is complex are solved.
In order to achieve the aim, the inventor provides cutting and grinding processing equipment for the silicon single crystal rod, wherein the cutting and grinding processing equipment comprises a rotary supporting seat, a rotary worktable, an axial clamping mechanism, a wire saw cutting operation mechanism and a grinding and polishing operation mechanism;
the rotary supporting seat is sleeved on the rotary shaft;
the rotary worktable can be pivotally fixed on the rotary supporting seat;
the axial clamping mechanism is arranged on the rotary supporting seat and comprises a rotary motor, a pressure head, a connecting pressure plate and an axial telescopic driving unit, the pressure head is connected with the rotary motor and positioned right above the rotary worktable, one end of the connecting pressure plate is connected with the rotary motor, and the other end of the connecting pressure plate is connected with the axial telescopic driving unit;
the wire saw cutting operation mechanism and the grinding and polishing operation mechanism are sequentially arranged on a rotating path of the rotary working table, the wire saw cutting operation mechanism is used for cutting the silicon single crystal rod in an opening mode, and the grinding and polishing operation mechanism is used for polishing and polishing materials behind the silicon single crystal rod in the opening mode.
As a preferred structure of the utility model, the running gear is thrown for bilateral grinding to the running gear is thrown to the mill, bilateral grinding is thrown the running gear and is included that two are relative to set up to grind and throw unit and first lift drive unit, throw the unit including grinding and throw the subassembly, grind and throw the subassembly including grinding and throwing motor, bearing box and bistrique, throw the motor and pass through the bearing box and be connected with the bistrique, first lift drive mechanism is used for driving the mill and throws unit lifting or descend.
As a preferred structure of the utility model, the unit is thrown to the mill still includes the horizontal slip subassembly, the horizontal slip subassembly includes sliding bottom, sliding rack and horizontal slip driving piece, the subassembly is thrown to the mill sets up on the sliding rack, the last horizontal slide rail that is provided with of sliding bottom, on the sliding rack was fixed in the horizontal slide rail through horizontal slider, horizontal slip driving assembly drive sliding rack followed sliding bottom horizontal slip.
As the utility model discloses a preferred structure, first lift drive unit includes mounting bracket, elevator motor and ball screw, elevator motor is fixed in the mounting bracket top, and elevator motor is connected with the ball screw transmission, grind and throw the unit and install on the sliding seat, the rolling nut in sliding seat and the ball screw is fixed, be provided with vertical slide rail on the mounting bracket, the vertical slider cover that sets up on the sliding seat is located on the vertical slide rail.
As the utility model discloses a preferred structure, coping saw cutting running gear is bilateral coping saw cutting running gear, bilateral coping saw cutting running gear includes annular coping saw cutting unit and the second lift drive unit of two relative settings, annular coping saw cutting unit is including installation panel, action wheel, driving motor, take-up pulley, tensioning motor and line of cut, driving motor is fixed in on the installation panel, and on driving motor's the output shaft was located to the action wheel cover, tensioning motor is used for adjusting the interval between take-up pulley and the action wheel, the line of cut is the annular and lays in the action wheel and the wire casing from the driving wheel, second lift drive mechanism is used for driving annular coping saw cutting unit lifting or descends.
As the utility model discloses a preferred structure, annular coping saw cutting unit still includes the tensioning arm, tensioning arm one end and tensioning motor's output shaft, the other end is connected with the tensioning main shaft, the take-up pulley cover is located on the tensioning main shaft.
As a preferred structure of the present invention, the second lift driving unit is the same as the first lift driving unit.
As the utility model discloses a preferred structure, the flexible drive unit of axial includes axial mounting bracket, axial motor, ball screw and axial sliding seat, the hookup clamp plate is fixed in on the axial sliding seat, the axial sliding seat is fixed in on the axial mounting bracket through slide rail slider structure, the axial motor is fixed in on the axial mounting bracket, and the axial motor is connected with the ball screw transmission, and the last roll nut of ball screw is connected with vertical sliding seat.
As a preferred structure of the utility model, the cutting and grinding processing equipment further comprises a bar transfer device, wherein the bar transfer device comprises a rotary reversing mechanism, a round bar clamping mechanism and a square bar clamping mechanism;
the rotary reversing mechanism comprises a steering driving mechanism and a rotary seat;
the round bar clamping mechanism and the square material clamping mechanism are respectively fixed on the side wall of the rotary seat, the round bar clamping mechanism is used for clamping a single crystal silicon rod to be processed, and the square material clamping mechanism is used for clamping a polished square material
Different from the prior art, the technical scheme has the following advantages: the utility model relates to a cutting and grinding processing device for a single crystal silicon rod, which comprises a rotary supporting seat, a rotary worktable, an axial clamping mechanism, a wire saw cutting operating mechanism and a grinding and polishing operating mechanism, wherein the single crystal silicon rod is placed on the rotary worktable, an axial telescopic driving unit in the axial clamping mechanism drives a connecting pressing plate to move, so that a pressing head presses gold at the top end of the single crystal silicon rod, the rotary supporting seat rotates around the rotary shaft, so as to drive the rotary worktable and the single crystal silicon rod fixed on the rotary worktable to rotate, the wire saw cutting operating mechanism and the grinding and polishing operating mechanism are sequentially arranged on the rotating path of the rotary worktable, when the single crystal silicon rod rotates along with the rotary supporting seat for a preset angle to the wire saw cutting operating mechanism, the wire saw cutting operating mechanism performs cutting on the single crystal silicon rod, and the rotary worktable is matched with the axial clamping mechanism to drive the single crystal, the square material polishing device is characterized in that a rotating support seat is arranged on the rotating support seat, and the rotating support seat is connected with a grinding and polishing running mechanism. In this scheme, place the monocrystalline silicon stick on rotary worktable, through the drive of gyration supporting seat, alright in order to place the monocrystalline silicon stick in proper order and carry out the four sides evolution under the coping saw cutting running gear, place the square stock after the evolution in and carry out the four sides under the running gear of throwing polishing and polish, equipment degree of automation is high, and the bar saw cuts the running gear on line and throws the running gear between transporting simply with the mill, is favorable to improving the grinding of monocrystalline silicon rod and throws efficiency, improves the productivity effect.
Drawings
Fig. 1 is a schematic view of a top view structure of an embodiment of a cutting and grinding processing device for a single crystal silicon rod according to the present invention;
fig. 2 is a schematic structural view of an embodiment of a bilateral grinding and polishing operation mechanism in a cutting and grinding processing device for a single crystal silicon rod according to the present invention;
FIG. 3 is a schematic structural view of an embodiment of a polishing unit in the cutting and grinding processing equipment for single crystal silicon rods according to the present invention;
fig. 4 is a schematic structural view of an embodiment of a bilateral wire saw cutting and operating mechanism in a single crystal silicon rod cutting and grinding processing device according to the present invention;
FIG. 5 is a schematic structural view of an embodiment of a rod transferring device in a cutting and grinding processing device for a single crystal silicon rod according to the present invention;
fig. 6 is a schematic structural view of an embodiment of a transfer and conveying assembly in a cutting and grinding processing device for single crystal silicon rods according to the present invention.
Description of reference numerals:
100. a rotary supporting seat;
110. a rotating shaft;
200. a rotary table;
300. an axial clamping mechanism;
310. a rotating electric machine;
320. connecting a pressure plate;
330. an axial telescopic drive unit; 331. an axial mounting bracket; 332. an axial sliding seat;
400. a bilateral grinding and polishing running mechanism;
410. a grinding and polishing unit; 411. grinding and polishing the motor; 412. a bearing housing; 413. grinding heads; 414. a sliding base; 415. a sliding rack; 416. a horizontal sliding drive;
420. a first elevation drive unit; 421. a mounting frame; 422. a lifting motor; 423. a ball screw; 414. a vertical slide rail; 415. a vertical slide block;
500. a bilateral fretsaw cutting operation mechanism;
510. an endless wire saw cutting unit; 511. installing a panel; 512. a driving wheel; 513. a drive motor; 514. a tension wheel; 515. a tensioning motor; 516. cutting a line; 517. a tensioning arm; 518. tensioning the main shaft;
520. a second elevation driving unit;
600. a bar transfer device;
610. a rotary reversing mechanism;
620. a round bar clamping mechanism;
630. a square stock clamping mechanism;
640. a transfer conveyor assembly.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 6, the present invention provides a cutting and grinding apparatus for silicon single crystal rod, which can be used for cutting silicon single crystal rod and grinding and polishing the silicon single crystal rod after cutting, and has high automation degree and cutting and grinding efficiency. The cutting and grinding processing equipment comprises a rotary supporting seat 100, a rotary worktable 200, an axial clamping mechanism 300, a wire saw cutting operation mechanism and a grinding and polishing operation mechanism;
the rotary support base 100 is used for driving the rotary worktable 200 fixed thereon and the axial clamping mechanism 300 to rotate together. The rotary support base 100 is sleeved on the rotary shaft 110; specifically, the rotating shaft 110 is connected to a rotating speed reduction motor, so that the rotating support base 100 is driven to rotate by the rotating shaft 110.
The rotary table 200 is used for mounting bars to be processed. Specifically, the rotary worktable 200 is pivotably fixed to the rotary support base 100, and the rotary worktable 200 itself can rotate relative to the rotary support base 100 so as to drive the bar stock arranged on the rotary worktable 200 to rotate, so as to complete the cutting of the four sides of the single crystal silicon rod and the grinding and polishing of the four side walls of the square stock after the cutting.
The axial clamping mechanism 300 is used for clamping the silicon single crystal rod in the axial direction, and prevents the silicon single crystal rod from shaking during squaring or grinding and polishing to influence normal processing. Specifically, the axial clamping mechanism 300 is arranged on the rotary support base 100, the axial clamping mechanism 300 includes a rotary motor 310, a pressure head, a connecting pressure plate 320 and an axial telescopic driving unit 330, the pressure head is connected with the rotary motor 310 and is located right above the rotary worktable 200, one end of the connecting pressure plate 320 is connected with the rotary motor 310, and the other end is connected with the axial telescopic driving unit 330; after the silicon single crystal rod is placed on rotary worktable 200, the final pressure head that drives downstream needs to contract through the flexible drive unit 330 of axial for the pressure head supports and leans on the top tightly in the upper end of silicon single crystal rod, when preventing on the one hand gyration supporting seat 100 from rotating, the bar is fixed unstably, and on the other hand prevents that the silicon single crystal rod from cutting or subsequent square stock when throwing and grinding, and the bar appears rocking, influences the machining precision.
The wire saw cutting operation mechanism and the grinding and polishing operation mechanism are sequentially arranged on a rotating path of the rotary working table 200, the wire saw cutting operation mechanism is used for cutting the silicon single crystal rod in an opening mode, and the grinding and polishing operation mechanism is used for polishing and polishing materials behind the silicon single crystal rod in the opening mode. In this embodiment, the rotary support base 100 drives the rotary table 200 and the single crystal silicon rod rotates by a preset angle to the lower side of the wire saw cutting operation mechanism, the wire saw cutting operation mechanism performs one-side squaring on the single crystal silicon rod, and then the axial clamping mechanism 300 is matched with the rotary table 200 to drive the single crystal silicon rod to rotate so as to complete the squaring at other positions. After the silicon single crystal rod is cut, the rotary supporting seat 100 rotates again to drive the rotary worktable 200 and the cut square stock to rotate for a preset angle to the position below the grinding and polishing running mechanism, so that the grinding and polishing running mechanism can grind and polish the cut square stock, and then the axial clamping mechanism 300 is matched with the rotary worktable 200 to drive the square stock to rotate, so that the other side wall side walls of the square stock can be ground and polished.
The cutting and grinding processing equipment for the silicon single crystal rod comprises a rotary supporting seat 100, a rotary working table 200, an axial clamping mechanism 300, a wire saw cutting operating mechanism and a grinding and polishing operating mechanism, wherein the silicon single crystal rod is placed on the rotary working table 200, an axial telescopic driving unit 330 in the axial clamping mechanism 300 drives a connecting pressing plate 320 to move, so that a pressing head presses gold on the top end of the silicon single crystal rod, the rotary supporting seat 100 rotates around a rotary shaft 110 to drive the rotary working table 200 and the silicon single crystal rod fixed on the rotary working table 200 to rotate, the wire saw cutting operating mechanism and the grinding and polishing operating mechanism are sequentially arranged on a rotating path of the rotary working table 200, when the silicon single crystal rod rotates to a preset angle along with the rotary supporting seat 100 to the wire saw cutting operating mechanism, the wire saw cutting operating mechanism squares the silicon single crystal rod, and the rotary working table 200 and the axial clamping mechanism 300 are matched to drive the silicon single crystal rod to, so as to complete the squaring of four sides of the silicon single crystal rod, after the squaring is completed, the rotary supporting seat 100 continues to drive the square stock after the squaring to rotate, a preset angle is rotated to the grinding and polishing running mechanism, the grinding and polishing running mechanism carries out grinding and polishing on the side wall of the square stock, and the square stock is also driven to rotate, so that the grinding and polishing of four sides of the square stock are completed. In this scheme, place the monocrystalline silicon stick on rotary worktable 200, through the drive of gyration supporting seat 100, alright in order to place the monocrystalline silicon stick in proper order and carry out the four sides evolution under the coping saw cutting running gear, place the square stock after the evolution in and polish the running gear and carry out the four sides and polish and grind down, equipment degree of automation is high, and the bar saw cuts the running gear on line and polishes the running gear and transport simply between the running gear with polishing, is favorable to improving the grinding of monocrystalline silicon rod and polishes efficiency, improves production benefits.
In the preferred embodiment shown in fig. 1 to 3, the polishing running mechanism is a double-sided polishing running mechanism 400, the double-sided polishing running mechanism 400 includes two opposite polishing units 410 and a first lifting driving unit 420, the polishing unit 410 includes a polishing assembly, the polishing assembly includes a polishing motor 411, a bearing box 412 and a grinding head 413, the polishing motor 411 is connected with the grinding head 413 through the bearing box 412, and the first lifting driving mechanism is configured to drive the polishing unit 410 to lift or lower. By adopting the bilateral grinding and polishing operation mechanism 400, two side walls of the cut silicon crystal square stock can be simultaneously polished and polished, so that the grinding and polishing efficiency can be improved, and the two grinding and polishing units 410 are oppositely arranged, so that the grinding and polishing cutting force can be mutually offset, and the square stock is more stable to fix. The grinding and polishing efficiency is higher. Specifically, grind and throw motor 411 and start, drive bistrique 413 through bearing box 412 and rotate, lean on when contacting at bistrique 413 and square stock lateral wall, alright throw the mill with square stock. In this embodiment, both sides of the square stock can be polished simultaneously, so that the rotary table 200 and the axial clamping mechanism 300 can finish polishing of four sides of the square stock by rotating the square stock by 90 degrees.
Referring to fig. 3, as a preferred embodiment of the present invention, the polishing unit 410 further includes a horizontal sliding assembly, the horizontal sliding assembly includes a sliding base 414, a sliding rack 415 and a horizontal sliding driving member 416, the polishing assembly is disposed on the sliding rack 415, a horizontal sliding rail is disposed on the sliding base 414, the sliding rack 415 is fixed on the horizontal sliding rail through a horizontal sliding block, and the horizontal sliding driving member drives the sliding rack 415 to horizontally slide along the sliding base 414. After the horizontal sliding assemblies are arranged on the two oppositely arranged grinding and polishing units 410, the grinding heads 413 can be driven by the horizontal sliding assemblies to abut against or be far away from the silicon crystal square stock after being opened, so that the distance between the grinding heads 413 of the two grinding and polishing units 410 can be adjusted to adapt to the silicon crystal square stocks with different specifications, and the universality is stronger.
Referring to fig. 2, as a preferred embodiment of the present invention, the first lifting unit is used to drive the grinding and polishing unit 410 to move up and down, so as to complete the grinding and polishing of the whole side wall of the square stock. Specifically, first lift drive unit 420 includes mounting bracket 421, elevator motor 422 and ball screw 423, elevator motor 422 is fixed in the mounting bracket 421 top, and elevator motor 422 is connected with the transmission of ball screw 423, grinding and polishing unit 410 installs on the sliding seat, and the sliding seat is fixed with the roll nut in the ball screw 423, be provided with vertical slide rail 414 on the mounting bracket 421, the vertical slider 415 cover that sets up on the sliding seat is located on vertical slide rail 414. The lifting motor 422 drives the ball screw 423 to rotate, the ball screw 423 converts the rotary motion into linear motion, and the rolling nut drives the sliding seat to move up and down, so as to drive the grinding and polishing unit 410 to move up and down. And a slide rail slider structure is arranged between the sliding seat and the mounting frame 421, so that the movement of the polishing unit 410 is more stable, and the processing precision is higher.
In the embodiment shown in fig. 4, the wire saw cutting operation mechanism is a bilateral wire saw cutting operation mechanism 500, and the bilateral wire saw cutting unit can simultaneously perform simultaneous squaring of two sides of the single crystal silicon rod, so that squaring efficiency is better. Specifically, bilateral coping saw cutting running gear 500 includes annular coping saw cutting unit 510 and the second lift drive unit 520 of two relative settings, annular coping saw cutting unit 510 is including installation panel 511, action wheel 512, driving motor 513, take-up pulley 514, tensioning motor 515 and line of cut 516, driving motor 513 is fixed in on the installation panel 511, and on the output shaft of driving motor 513 was located to action wheel 512 cover, tensioning motor 515 was used for adjusting the interval between action wheel 514 and the action wheel 512, line of cut 516 is the annular and lays in the wire casing of action wheel 512 and follow driving wheel, second lift drive mechanism is used for driving annular coping saw cutting unit 510 lifting or descends. The ring wire saw cutting unit 510 is only composed of the main driving assembly and the tensioning assembly, and is not provided with the driven guide wheel, so that the ring wire saw cutting unit 510 is more compact in structure, better in structural rigidity, and capable of continuously performing stable cutting, and the cutting efficiency is improved. The tension degree of the cutting line 516 can be adjusted only by driving the tension wheel 514 to be far away from or close to the driving wheel 512 through the tension motor 515, and the tension adjustment is simpler and more convenient.
In the preferred embodiment shown in fig. 4, the second elevation driving unit 520 has the same structure as the first elevation driving unit 420. The second lifting driving mechanism can also stably drive the annular wire saw cutting unit 510 to lift or descend, so as to ensure the squaring precision of the single crystal silicon rod.
Referring to fig. 4, as a preferred embodiment of the present invention, the circular wire saw cutting unit 510 further includes a tension arm 517, one end of the tension arm 517 is connected to an output shaft of the tension motor 515, the other end of the tension arm 517 is connected to the tension spindle 518, and the tension wheel 514 is sleeved on the tension spindle 518. Tensioning motor 515 rotates and drives tensioning arm 517 to rotate to the drive tensioning main shaft 518 position changes, finally changes the position of take-up pulley 514 and realizes the regulation of diamond cutting line 516 opening degree of progress, and the regulation is efficient.
Referring to fig. 1, as a preferred embodiment of the present invention, the axial telescopic driving unit 330 includes an axial mounting frame 331, an axial motor, a ball screw 423 and an axial sliding seat 332, the connecting pressing plate 320 is fixed on the axial sliding seat 332, the axial sliding seat 332 is fixed on the axial mounting frame 331 through a sliding rail and sliding block structure, the axial motor is fixed on the axial mounting frame 331, the axial motor is in transmission connection with the ball screw 423, and a rolling nut on the ball screw 423 is connected with the longitudinal sliding seat. The axial motor is started to drive the ball screw 423 to rotate, the ball screw 423 converts the rotary motion into linear motion, and the sliding axial sliding seat 332 slides along the axial mounting frame 331.
Referring to fig. 5, as a preferred embodiment of the present invention, the cutting and grinding processing equipment further includes a bar transferring device 600, and the bar transferring device 600 includes a rotary reversing mechanism 610, a round bar clamping mechanism 620 and a square bar clamping mechanism 630;
the rotary reversing mechanism 610 comprises a steering driving mechanism and a rotary seat, and the steering driving mechanism is a steering driving motor 513;
the round rod clamping mechanism 620 and the square material clamping mechanism 630 are respectively fixed on the side wall of the rotary seat, the round rod clamping mechanism 620 is used for clamping a single crystal silicon rod to be processed, and the square material clamping mechanism 630 is used for clamping a square material after grinding and polishing. The rotary reversing mechanism 610 is used for driving the round bar clamping mechanism 620 and the square material clamping mechanism 630 to perform position conversion so as to perform feeding clamping or take out the processed square material.
Specifically, when the single crystal silicon rod conveying mechanism conveys the single crystal silicon rod, the steering driving mechanism drives the rotary seat to rotate, so that the round rod clamping mechanism 620 is close to the single crystal silicon rod conveying mechanism, then the single crystal silicon rod is clamped, then the rotary seat rotates, the round rod clamping mechanism 620 rotates to a material taking and clamping station so as to place the single crystal silicon rod on the rotary worktable 200, after the silicon single crystal rod placed on the rotary worktable 200 is subjected to squaring and grinding, the processed square stock is rotated to a position close to the material taking and clamping station, at the moment, the square stock clamping mechanism 630 is rotated to the material taking and clamping station by the rotary base, the silicon square stock ground and ground on the rotary worktable 200 is taken down, then the revolving bed rotates and rotates square stock fixture 630 to square stock conveying station to place the square stock on square stock conveying mechanism, the last unloading of bar rotates more conveniently, and degree of automation is higher. Preferably, as shown in fig. 6, the bar stock transfer device 600 further includes a transfer conveying assembly 640, and the transfer conveying assembly 640 is configured to drive the rotary reversing mechanism 610 to move in a specific direction, so as to facilitate feeding and taking of the round bar clamping mechanism 620 and the square stock clamping mechanism 630.
It should be noted that, although the above embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, the changes and modifications of the embodiments described herein, or the equivalent structure or equivalent process changes made by the contents of the specification and the drawings of the present invention, directly or indirectly apply the above technical solutions to other related technical fields, all included in the scope of the present invention.
Claims (9)
1. The cutting and grinding processing equipment for the silicon single crystal rod is characterized by comprising a rotary supporting seat, a rotary worktable, an axial clamping mechanism, a wire saw cutting operating mechanism and a grinding and polishing operating mechanism;
the rotary supporting seat is sleeved on the rotary shaft;
the rotary worktable can be pivotally fixed on the rotary supporting seat;
the axial clamping mechanism is arranged on the rotary supporting seat and comprises a rotary motor, a pressure head, a connecting pressure plate and an axial telescopic driving unit, the pressure head is connected with the rotary motor and positioned right above the rotary worktable, one end of the connecting pressure plate is connected with the rotary motor, and the other end of the connecting pressure plate is connected with the axial telescopic driving unit;
the wire saw cutting operation mechanism and the grinding and polishing operation mechanism are sequentially arranged on a rotating path of the rotary working table, the wire saw cutting operation mechanism is used for cutting the silicon single crystal rod in an opening mode, and the grinding and polishing operation mechanism is used for polishing and polishing materials behind the silicon single crystal rod in the opening mode.
2. The cutting and grinding processing device for the silicon single crystal rod as claimed in claim 1, wherein the grinding and polishing mechanism is a bilateral grinding and polishing mechanism, the bilateral grinding and polishing mechanism comprises a grinding and polishing unit and a first lifting drive unit which are oppositely arranged, the grinding and polishing unit comprises a grinding and polishing component, the grinding and polishing component comprises a grinding and polishing motor, a bearing box and a grinding head, the grinding and polishing motor is connected with the grinding head through the bearing box, and the first lifting drive mechanism is used for driving the grinding and polishing unit to lift or descend.
3. The cutting and grinding processing equipment for the silicon single crystal rod as recited in claim 2, wherein the grinding and polishing unit further comprises a horizontal sliding assembly, the horizontal sliding assembly comprises a sliding base, a sliding rack and a horizontal sliding driving member, the grinding and polishing assembly is arranged on the sliding rack, a horizontal sliding rail is arranged on the sliding base, the sliding rack is fixed on the horizontal sliding rail through a horizontal sliding block, and the horizontal sliding driving member drives the sliding rack to horizontally slide along the sliding base.
4. The cutting and grinding processing device for the silicon single crystal rod as claimed in claim 3, wherein the first lifting driving unit comprises a mounting frame, a lifting motor and a ball screw, the lifting motor is fixed on the top of the mounting frame, the lifting motor is in transmission connection with the ball screw, the grinding and polishing unit is mounted on a sliding seat, the sliding seat is fixed with a rolling nut in the ball screw, a vertical slide rail is arranged on the mounting frame, and a vertical slide block arranged on the sliding seat is sleeved on the vertical slide rail.
5. The cutting and grinding processing device for the silicon single crystal rod according to claim 1, wherein the wire saw cutting and operating mechanism is a bilateral wire saw cutting and operating mechanism, the bilateral wire saw cutting and operating mechanism comprises two oppositely arranged ring wire saw cutting units and a second lifting and driving unit, each ring wire saw cutting unit comprises an installation panel, a driving wheel, a driving motor, a tensioning wheel, a tensioning motor and a cutting line, the driving motor is fixed on the installation panel, the driving wheel is sleeved on an output shaft of the driving motor, the tensioning motor is used for adjusting the distance between the tensioning wheel and the driving wheel, the cutting line is annularly arranged in a wire casing of the driving wheel and a driven wheel, and the second lifting and driving mechanism is used for driving the ring wire saw cutting units to lift or descend.
6. The cutting and grinding processing device for the silicon single crystal rod as recited in claim 5, wherein the annular wire saw cutting unit further comprises a tensioning arm, one end of the tensioning arm is connected with an output shaft of a tensioning motor, the other end of the tensioning arm is connected with a tensioning spindle, and the tensioning wheel is sleeved on the tensioning spindle.
7. The cutting and grinding processing apparatus for the silicon single crystal rod as set forth in claim 5, wherein the second elevation driving unit is identical in structure to the first elevation driving unit.
8. The cutting and grinding processing device for the silicon single crystal rod as claimed in claim 1, wherein the axial telescopic driving unit comprises an axial mounting frame, an axial motor, a ball screw and an axial sliding seat, the connecting pressing plate is fixed on the axial sliding seat, the axial sliding seat is fixed on the axial mounting frame through a sliding rail and sliding block structure, the axial motor is fixed on the axial mounting frame, the axial motor is in transmission connection with the ball screw, and a rolling nut on the ball screw is connected with the longitudinal sliding seat.
9. The cutting and grinding processing device for the silicon single crystal rod as claimed in claim 1, wherein the cutting and grinding processing device further comprises a bar material transfer device, and the bar material transfer device comprises a rotary reversing mechanism, a round rod clamping mechanism and a square material clamping mechanism;
the rotary reversing mechanism comprises a steering driving mechanism and a rotary seat;
the round bar clamping mechanism and the square material clamping mechanism are respectively fixed on the side wall of the rotary seat, the round bar clamping mechanism is used for clamping a single crystal silicon rod to be processed, and the square material clamping mechanism is used for clamping a polished square material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020548230.2U CN212266292U (en) | 2020-04-14 | 2020-04-14 | Cutting and grinding processing equipment for silicon single crystal rod |
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| CN202020548230.2U CN212266292U (en) | 2020-04-14 | 2020-04-14 | Cutting and grinding processing equipment for silicon single crystal rod |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113319669A (en) * | 2021-06-24 | 2021-08-31 | 福州天瑞线锯科技有限公司 | Polishing method and system for grinding surface of material rod |
| CN114506793A (en) * | 2022-01-07 | 2022-05-17 | 刘兴宇 | Ring die loading and unloading equipment for granulator |
| CN117943929A (en) * | 2024-03-26 | 2024-04-30 | 连云港浩尔晶电子有限公司 | Accidental injury prevention edging equipment for quartz wafer production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113319669A (en) * | 2021-06-24 | 2021-08-31 | 福州天瑞线锯科技有限公司 | Polishing method and system for grinding surface of material rod |
| CN113319669B (en) * | 2021-06-24 | 2022-04-08 | 福州天瑞线锯科技有限公司 | Polishing method and system for grinding surface of material rod |
| CN114506793A (en) * | 2022-01-07 | 2022-05-17 | 刘兴宇 | Ring die loading and unloading equipment for granulator |
| CN114506793B (en) * | 2022-01-07 | 2023-12-22 | 海顺新材料有限公司 | Ring mould loading and unloading equipment for granulator |
| CN117943929A (en) * | 2024-03-26 | 2024-04-30 | 连云港浩尔晶电子有限公司 | Accidental injury prevention edging equipment for quartz wafer production |
| CN117943929B (en) * | 2024-03-26 | 2024-05-28 | 连云港浩尔晶电子有限公司 | Accidental injury prevention edging equipment for quartz wafer production |
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