CN208298114U - Modular cooling pad of notebook computer connector - Google Patents
Modular cooling pad of notebook computer connector Download PDFInfo
- Publication number
- CN208298114U CN208298114U CN201821076268.3U CN201821076268U CN208298114U CN 208298114 U CN208298114 U CN 208298114U CN 201821076268 U CN201821076268 U CN 201821076268U CN 208298114 U CN208298114 U CN 208298114U
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- Prior art keywords
- link block
- card slot
- connection
- peg
- notebook computer
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Abstract
The utility model discloses a kind of modular cooling pad of notebook computer connectors, including being rectangular parallelepiped structure and mutually the first link block and the second link block that connect and fix, first link block has clamping protrusion on one end end face of the second link block, second link block has clamping groove on one end end face of the first link block, clamping protrusion is removably in link slot, first link block far from one end end face of the second link block have the first connection-peg, the section of first connection-peg is in cross, second link block far from one end end face of the first link block have the second connection-peg, each second connection-peg and each first connection-peg face one by one；There is the first card slot in the side outer rim of first link block, there is the second card slot in the same side outer rim of the second link block, the spacing between adjacent first card slot is equal to the spacing between adjacent second card slot.It is connected by way of clamping, realizes that rapidly assembly and disassembly structural strength is high, it is reliable and stable.
Description
Technical field
The utility model belongs to computer fittings technical field, and in particular to a kind of modular cooling pad of notebook computer
Connector.
Background technique
Laptop has the advantages such as small in size, light-weight, easy to carry compared with desktop computer, either outer to go to work
Make or travel, can carry, it is very convenient.With the progress of computer technology, the processing capacity day of laptop
Benefit improves, and calorific value is also increasing, but since the space of laptop limits, heat-sinking capability is undesirable always, because
This, many users like external dedicated heat radiator for notebook computer.
Wherein, cooling pad is a kind of common heat radiator for notebook computer, can effectively help laptop into
Row heat dissipation, guarantees the normal operation of laptop.But due to the structure problem of existing heat radiator for notebook computer, not only
Heat dissipation effect is bad, and assembly difficulty is big, structural strength is insufficient.Solving problem above becomes the task of top priority.
Utility model content
To solve the technical problem that heat dissipation effect is bad, assembly difficulty is big, structural strength is insufficient, the utility model provides one
Kind modular cooling pad of notebook computer connector, it is simple and reliable, can rapidly assembly and disassembly, structural strength is high.
To achieve the above object, technical solutions of the utility model are as follows:
A kind of modular cooling pad of notebook computer connector, including being rectangular parallelepiped structure and mutually connecting and fixing
First link block and the second link block, first link block have along its length on one end end face of the second link block
The clamping protrusion outwardly protruded, second link block have convex for limiting clamping on one end end face of the first link block
The clamping groove risen, in the raised removably link slot of the clamping, first link block far from the second link block one
The first connection-peg on end face at least one in column structure is held, the section of first connection-peg along its length is in
Cross, second link block far from one end end face of the first link block have at least one and the first grafting head shapes phase
With the second connection-peg, each second connection-peg and each first connection-peg face one by one；Outside the side of first link block
The first card slot that the oriented sunken inside of array distribution is formed on edge, array distribution is oriented in the same side outer rim of second link block
The second card slot that sunken inside is formed, between the spacing between two neighboring first card slot is equal between two neighboring second card slot
Away from the first card slot near the second link block and the spacing between the second card slot near the first link block are equal to adjacent two
Spacing between a first card slot.
Using the above structure, between the first link block and the second link block can quickly and easily assembly and disassembly, and
It can be carried out quickly and easily with other components by the first card slot, the second card slot, the first connection-peg and the second connection-peg
Assembly and disassembly are carried out by snap fit, realization is quickly and easily assembled and disassembled, and structural strength is high, and it is reliable and stable, it is easy to use.
As preferred: the clamping protrusion is rectangle of same size along the section of the first link block length direction, and
Area is gradually reduced away from the direction of the first link block, and the clamping groove runs through along the thickness direction of the second link block, and
Width is gradually increased from notch to slot bottom direction, when in the raised link slot of the clamping, the end face of clamping protrusion and card
The slot bottom of access slot is bonded, and outer wall is bonded with the cell wall of clamping groove.Using the above structure, the first link block and the second connection are improved
Connection reliability between block.
As preferred: the thickness of the clamping protrusion is identical as the thickness of the first link block.Using the above structure, it improves
It is clamped the structural strength of protrusion, to improve the connection reliability between the first link block and the second link block.
As preferred: array distribution has the perforative loss of weight of through-thickness on first link block and the second link block
Hole.Using the above structure, under the premise of guaranteeing the first link block and the second connecting block structure intensity, light-weight design is realized,
And improve the capacity of heat transmission of cooling pad.
As preferred: the lightening hole is positive hexagon.Using the above structure, further ensure the first link block and
The structural strength of second link block.
As preferred: being equipped with perforative first mounting hole of through-thickness on first link block, first installation
Hole close to far from the first card slot side side wall, when force on the second link block be equipped with through-thickness it is perforative second installation
Hole, second mounting hole is close to the side side wall far from the second card slot.Using the above structure, convenient for the installation of radiator fan, both
The capacity of heat transmission for improving cooling pad in turn ensures the structural strength of the first link block and the second link block.
As preferred: first mounting hole and the second mounting hole are cuboid.Using the above structure, stabilization can
It leans on.
As preferred: array distribution has and the first installation on side side wall of first link block far from the first card slot
First heat release hole of hole connection, array distribution has and the second peace on side side wall of second link block far from the second card slot
The second heat release hole of hole connection is filled, first heat release hole and the second heat release hole are regular hexagonal prism shape.Using the above structure,
One heat release hole and the second heat release hole are in honeycomb, are conducive to radiator fan and radiate, further improve cooling pad of notebook computer
Heating conduction.
Compared with prior art, the utility model has the beneficial effects that
Using modular cooling pad of notebook computer connector provided by the utility model, structure novel, it is easy to accomplish,
It is connected by way of clamping, realizes that rapidly assembly and disassembly structural strength is high, it is reliable and stable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of the first link block；
Fig. 3 is the structural schematic diagram of the second link block；
Fig. 4 is the usage state diagram of the utility model.
Specific embodiment
The utility model is described in further detail with attached drawing with reference to embodiments.
As shown in FIG. 1 to 3, a kind of modular cooling pad of notebook computer connector, including the first link block 1 and
Two link blocks 2, first link block 1 and the second link block 2 are rectangular parallelepiped structure and mutually connect and fix, and length, width
Degree and thickness are all the same.First link block 1 has convex along its length on one end end face of the second link block 2
Clamping protrusion 11 out, second link block 2 have on one end end face of the first link block 1 for limiting clamping protrusion
11 clamping groove 21, the clamping protrusion 11 removably in link slot 21, can make the first link block 1 and the second connection
Block 2 is reliably connected, and easy to disassemble and assembling.
Further, the clamping protrusion 11 is rectangle of same size along the section of 1 length direction of the first link block,
And area is gradually reduced away from the direction of the first link block 1, to guarantee that clamping protrusion 11 is strong with the connection of the first link block 1
The thickness of degree, clamping protrusion 11 is identical as the thickness of the first link block 1.The clamping groove 21 is along the thickness side of the second link block 2
To running through, and width is gradually increased from notch to slot bottom direction, and when in the raised 11 link slots 21 of the clamping, the clamping is convex
Rise 11 end face be bonded with the slot bottom of clamping groove 21, outer wall is bonded with the cell wall of clamping groove 21.
It is in the first of a column structure there are two having on one end end face of first link block 1 far from the second link block 2
Connection-peg 12, the section of first connection-peg 12 along its length are in cross, and second link block 2 is far from the first connection
There are two the second connection-peg 22 identical with 12 shape of the first connection-peg, each second connection-pegs 22 for tool on one end end face of block 1
Face by the first connection-peg 12 and the second connection-peg 22 enables adjacent component one by one with each first connection-peg 12
It is enough to be reliably connected with the first link block 1 and the second link block 2, and will not rotate.
The first card slot 13 that the oriented sunken inside of array distribution is formed in the side outer rim of first link block 1, described the
The second card slot 23 that the oriented sunken inside of array distribution is formed in the same side outer rim of two link blocks 2, two neighboring first card slot 13
Between spacing be equal to the spacing between two neighboring second card slot 23, near the second link block 2 the first card slot 13 with most
Spacing between the second card slot 23 of the first link block 1 is equal to the spacing between two neighboring first card slot 13.Pass through
The design of one card slot 13 and the second card slot 23 makes the first link block 1 and the second link block 2 rapidly be connected to adjacent auxiliary section
On part, it is convenient to operate, reliable and stable.
Under the premise of guaranteeing the first link block and the second connecting block structure intensity, to realize light-weight design, improves and dissipate
The capacity of heat transmission of heat pad, array distribution has the perforative loss of weight of through-thickness on first link block 1 and the second link block 2
Hole a, the lightening hole a are regular hexagonal prism shape.
Perforative first mounting hole 14 of through-thickness is equipped on first link block 1, which leans on
The nearly side side wall far from the first card slot 13, when force and be equipped with perforative second installation of through-thickness on the second link block 2
Hole 24, second mounting hole 24 is close to the side side wall far from the second card slot 23.First mounting hole 14 and the second mounting hole
24 be cuboid.Also, in order to improve the capacity of heat transmission of cooling pad, in first link block 1 far from the first card slot 13
Side side wall on array distribution have the first heat release hole 15 being connected to the first mounting hole 14, it is separate in second link block 2
Array distribution has the second heat release hole 25 being connected to the second mounting hole 24, first heat dissipation on the side side wall of second card slot 23
Hole 15 and the second heat release hole 25 are regular hexagonal prism shape.
The use state of the utility model is as follows:
After referring to Figure 1~Fig. 4, the first link block 1 and the connection of the second link block 2, the first card slot 13 and the can be passed through
Two draw-in groove 23 and the second cooling pad connector 4 are clamped, and pass through a certain number of the utility model and the second cooling pad connector
4, can quick-assembling obtain latticed cooling pad of notebook computer main body, then pass through the first fixing piece 5 and the second fixing piece 6
Lock seaming, keeps the overall structure of cooling pad of notebook computer solid and reliable, also, can also be in the first mounting hole 14 and the second installation
Radiator fan 3 is installed in hole 24, improves the heat-sinking capability of cooling pad of notebook computer, wherein pass through 15 He of the first heat release hole
The design of second heat release hole 25, can be improved the heat-sinking capability of radiator fan 3.
Finally, it should be noted that foregoing description is only the preferred embodiment of the utility model, the common skill of this field
Art personnel are under the enlightenment of the utility model, under the premise of without prejudice to the utility model aims and claim, can make
Multiple similar expressions, such transformation are each fallen within the protection scope of the utility model.
Claims (8)
1. a kind of modular cooling pad of notebook computer connector, it is characterised in that: including be rectangular parallelepiped structure and mutually
The first link block (1) and the second link block (2) connected and fixed, the one of first link block (1) close second link block (2)
Have the clamping outwardly protruded along its length raised (11) on the end face of end, second link block (2) is close to the first link block
(1) have on one end end face for limiting the clamping groove (21) for being clamped raised (11), the clamping raised (11) is removably
In link slot (21), it is in at least one on one end end face of first link block (1) separate second link block (2)
The first connection-peg (12) of column structure, the section of first connection-peg (12) along its length are in cross, and described the
Two link blocks (2) are far from identical as the first connection-peg (12) shape at least one on one end end face of the first link block (1)
The second connection-peg (22), each second connection-peg (22) and each first connection-peg (12) face one by one；
The first card slot (13) that the oriented sunken inside of array distribution is formed in the side outer rim of first link block (1), described the
The second card slot (23) that the oriented sunken inside of array distribution is formed in the same side outer rim of two link blocks (2), two neighboring first card
Spacing between slot (13) is equal to the spacing between two neighboring second card slot (23), near the first of the second link block (2)
Card slot (13) and the spacing between the second card slot (23) of the first link block (1) are equal to two neighboring first card slot (13)
Between spacing.
2. modular cooling pad of notebook computer connector according to claim 1, it is characterised in that: the clamping is convex
It is rectangle of same size that (11), which are played, along the section of the first link block (1) length direction, and area is away from the first connection
The direction of block (1) is gradually reduced, and the clamping groove (21) is run through along the thickness direction of the second link block (2), and width is from notch
Be gradually increased to slot bottom direction, when in raised (11) the link slot (21) of the clamping, the end face of clamping protrusion (11) with
The slot bottom of clamping groove (21) is bonded, and outer wall is bonded with the cell wall of clamping groove (21).
3. modular cooling pad of notebook computer connector according to claim 2, it is characterised in that: the clamping is convex
The thickness for playing (11) is identical as the thickness of the first link block (1).
4. modular cooling pad of notebook computer connector according to claim 1, it is characterised in that: described first
Array distribution has the perforative lightening hole (a) of through-thickness on link block (1) and the second link block (2).
5. modular cooling pad of notebook computer connector according to claim 4, it is characterised in that: the lightening hole
(a) be positive hexagon.
6. modular cooling pad of notebook computer connector according to claim 1, it is characterised in that: described first
Link block (1) is equipped with perforative first mounting hole (14) of through-thickness, and first mounting hole (14) is close to far from the first card
The side side wall of slot (13), when force on the second link block (2) be equipped with perforative second mounting hole (24) of through-thickness, should
Second mounting hole (24) is close to the side side wall far from the second card slot (23).
7. modular cooling pad of notebook computer connector according to claim 6, it is characterised in that: first peace
It fills hole (14) and the second mounting hole (24) is cuboid.
8. modular cooling pad of notebook computer connector according to claim 6 or 7, it is characterised in that: described
First link block (1) has first be connected to the first mounting hole (14) far from array distribution on the side side wall of the first card slot (13)
Heat release hole (15), array distribution has and the second peace on side side wall of second link block (2) far from the second card slot (23)
The second heat release hole (25) of hole (24) connection is filled, first heat release hole (15) and the second heat release hole (25) are regular hexagonal prism
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821076268.3U CN208298114U (en) | 2018-07-06 | 2018-07-06 | Modular cooling pad of notebook computer connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821076268.3U CN208298114U (en) | 2018-07-06 | 2018-07-06 | Modular cooling pad of notebook computer connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208298114U true CN208298114U (en) | 2018-12-28 |
Family
ID=64701064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821076268.3U Active CN208298114U (en) | 2018-07-06 | 2018-07-06 | Modular cooling pad of notebook computer connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208298114U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113316349A (en) * | 2020-02-27 | 2021-08-27 | 技嘉科技股份有限公司 | Heat sink device |
| JP2021136442A (en) * | 2020-02-27 | 2021-09-13 | 技嘉科技股▲ふん▼有限公司Giga−Byte Technology Co., Ltd. | Heat radiator |
-
2018
- 2018-07-06 CN CN201821076268.3U patent/CN208298114U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113316349A (en) * | 2020-02-27 | 2021-08-27 | 技嘉科技股份有限公司 | Heat sink device |
| JP2021136442A (en) * | 2020-02-27 | 2021-09-13 | 技嘉科技股▲ふん▼有限公司Giga−Byte Technology Co., Ltd. | Heat radiator |
| EP3872601A3 (en) * | 2020-02-27 | 2021-11-03 | Giga-Byte Technology Co., Ltd. | Heat dissipation device |
| JP7118186B2 (en) | 2020-02-27 | 2022-08-15 | 技嘉科技股▲ふん▼有限公司 | Heat dissipation device |
| US11612050B2 (en) | 2020-02-27 | 2023-03-21 | Giga-Byte Technology Co., Ltd. | Heat dissipation device |
| CN113316349B (en) * | 2020-02-27 | 2024-05-24 | 技嘉科技股份有限公司 | Heat dissipation device |
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