CN207939826U - Thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex - Google Patents
Thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex Download PDFInfo
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- CN207939826U CN207939826U CN201820084802.9U CN201820084802U CN207939826U CN 207939826 U CN207939826 U CN 207939826U CN 201820084802 U CN201820084802 U CN 201820084802U CN 207939826 U CN207939826 U CN 207939826U
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- film layers
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- circuit board
- layers
- flexible printed
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- 239000000463 material Substances 0.000 title claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 238000002360 preparation method Methods 0.000 claims abstract description 30
- 239000007787 solid Substances 0.000 claims abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 18
- 238000007711 solidification Methods 0.000 claims abstract description 16
- 230000008023 solidification Effects 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims description 16
- 230000008054 signal transmission Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 135
- 239000010408 film Substances 0.000 description 86
- 230000006872 improvement Effects 0.000 description 10
- 230000005012 migration Effects 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- 230000006854 communication Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011236 particulate material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of thin material layer structures for multi-layer flexible printed circuit board and Rigid Flex, including the layers of copper and a PI film layers being from top to bottom arranged, wherein, which includes a semi-solid preparation PI film layers and the solidification PI film layers between layers of copper and semi-solid preparation PI film layers.Thin material layer structure provided by the utility model for multi-layer flexible printed circuit board and Rigid Flex, material layer structures are not only significantly simplified, it is thinned a layer structural thickness, improve stable product size and moisture-resistant and heat resistance, and signal transmission frequencies and diamagnetism interference function can be improved, and the copper particle transport phenomena between circuit connection and circuit has protection and resistant function, ensures line security normal work.
Description
Technical field
The utility model is related to a kind of field of circuit boards, more particularly to it is a kind of for multi-layer flexible printed circuit board and soft or hard
The thin material layer structure of board.
Background technology
Traditional four-layer circuit board and multilayer Rigid Flex, superstructure generally comprise from top to bottom set gradually it is upper thin
Film layer and glue-line, intermediate copper foil circuit layer+film layer+copper foil circuit layer, lower glue layer and film layer, then composite layer is as bonding
With single-sided structure 2FCCL (film layer+copper foil layer) carry out on double-sided wiring board two sides again it is compound, so as to form circuit board
Four-layer structure, the inside are the two-sided circuit boards to complete, are seen in addition not being fabricated to circuit surface on two sides is compound again simultaneously
Whole copper-clad surface, then carry out again drilling and showing methods, development be etched into circuit, then compound circuit surface protection is exhausted again
Edge layer CVL (glue-line+film layer) carry out laminating apparatus processing pressing be directly bonded in the outer layer of double-sided PCB so as to form
The outermost layer of four-layer circuit board, to see that the type four-layer circuit board is actually by structure is inside outside：Film layer+glue-line
+ copper foil circuit+film layer+glue-line+film layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer+glue-line+
Film layer+copper foil circuit+glue-line+film layer；Such multilayered structure, the number of plies is more and complicated, and entire product thickness is made to increase, soft
Softness reduces and increases assembling product difficulty, and technological process is more, and material cost is promoted, the power consumption of circuit board aspect of performance and letter
Number transmission loss increases.
The surface of double-sided PCB must have the coating of two sides insulation, structural film layer and structural adhesive layer again in addition
The structure of the film layer and glue-line that are covered on one side has to if doing four-layer circuit board structure in the double-sided circuit to complete
Plate (film layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer) two sides is further added by the 2FCCL of two layers of one-sided
(film layer+copper foil layer), centre have to carry out bonding effect by glue, to make four-layer structure circuit board integral thickness increase
Adding, such thickness has not only significantly increased the thickness of circuit board, nor convenient for the assembling of structure, and due to thickness
Increase causes product power consumption big and signal velocity consume is larger to slow down.
During use, circuit board can be made to existing wiring board by being highly prone to radiation and electromagnetic interference, such interference
Normal operation produce serious influence, while being unfavorable for the transmission of signal.Slow down since signal is interfered and transmits, causes
Circuit board can not quickly convey the central area instruction that (chip) is assigned in working condition, and eventually leading to equipment, (such as mobile phone leads to
Interrogate base station equipment) occur blunt and crashes phenomena such as stuck, communication process is obstructed.
Usual precise circuit circuit board will appear copper particle transport phenomena between energization circuit and circuit, set
It can cause circuit burning explosion on fire etc. dangerous during standby use, between circuit and circuit because collision is connected, lead to electricity
Circuit on the plate of road can not work normally safely.
Utility model content
Against the above deficiency, the purpose of this utility model is to provide a kind of for multi-layer flexible printed circuit board and soft or hard
The thin material layer structure of board, has not only significantly simplified material layer structures, is thinned a layer structural thickness, improves product size
Stable and moisture-resistant and heat resistance, and signal transmission frequencies and diamagnetism interference function can be improved, to circuit connection
Copper particle transport phenomena between circuit has protection and resistant function, ensures line security normal work.
Used technical solution is the utility model in order to achieve the above objectives：
A kind of thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex, which is characterized in that packet
Include the layers of copper that is from top to bottom arranged and a PI film layers, wherein the PI film layers include a semi-solid preparation PI film layers and positioned at layers of copper with
A solidification PI film layers between semi-solid preparation PI film layers.
As a further improvement of the utility model, at least one in both the semi-solid preparation PI film layers and solidification PI film layers
Person is black PI film layers.
The semi-solid preparation PI film layers are LDK high-frequency functions films as a further improvement of the utility model,.
The semi-solid preparation PI film layers are that anti-copper particle migrates film as a further improvement of the utility model,.
The layers of copper is sputtered Cu layer or copper foil layer as a further improvement of the utility model,.
As a further improvement of the utility model, further include coated on layers of copper upper surface a PET protection release layer or
One high temperature resistant PET release films.
The thickness of the sputtered Cu layer is 2oz microns -9oz microns as a further improvement of the utility model, the copper
The thickness of layers of foil is 6oz microns -38oz microns.
The thickness of the semi-solid preparation PI film layers is 5um-60um, the solidification as a further improvement of the utility model,
The thickness of PI film layers is 5um-50um.
The beneficial effects of the utility model are：
(1) novel material layer structures are used, multi-layer flexible printed circuit board and Rigid Flex are used for, compared to tradition
Layer structure, reduce two layers of glue-line and a film layer, significantly simplified product material layer structure, reduce manufacturing process flow and
Manually, integral product material cost is reduced, assembling space is optimized, product signal transmission speed is promoted, reduces power consumption, improve production
Product dimensionally stable and moisture-resistant and heat resistance, so that product overall performance is improved；
(2) at least one of both semi-solid preparation PI film layers and solidification PI film layers are arranged to black PI film layers, in product knot
During structure manufactures and designs, internal wiring can be effectively prevent to be fully exposed, and occur to bad aberration in product or in making
Spot can be covered effectively, allow product overall appearance to seem beautiful characteristic, and it is externally visibly internal to be also prevented from stranger
Circuit plays the role of hidden and protection circuit plate；Meanwhile wiring board or circuit for having impurity or flaw, black layer knot
Structure plays the role of hiding the flaw；
(3) use LDK high-frequency functions film as semi-solid preparation PI film layers, LDK high-frequency functions films, which have, improves signal biography
Defeated frequency and diamagnetism interference function, to improve the signal transmission performance of flexible printed circuit board, specifically, can effectively improve
Circuit board conveys the speed that instruction is assigned in central area (chip) in working condition, is quickly transferred to all parts, makes to set
Standby (such as mobile phone, communication base station equipment) quick operation occurs without blunt and phenomena such as stuck of crashing, 5G products is made to communicate
Journey is whole smooth；
(4) using anti-copper particle migration film as semi-solid preparation PI film layers, anti-copper particle migration film has low particle material
Expect anti-copper particle shift function, can effectively ensure that circuit can safely and effectively work in working condition, it is offline in energization situation
Be not in copper particle transport phenomena between road and circuit, equipment during energization use, prevent circuit and circuit it
Between copper particle transport phenomena, to prevent short circuit, circuit turn-on caused by burn on fire, battery explosion and function
The danger such as failure, to which circuit plays a very good protection；
(5) thickness of each layer of structure is optimized and performance improvement, can adjusts or be thinned each layer of structure of product
Thickness is reduced compared to traditional structure design on thickness, is kept integral material layer structural thickness thinning, is finally made product
Ultrathin typeization, more accurate to the softness higher of product flexibility printed circuit board, signal transmits faster, and assembling space is more excellent
Change.
Above-mentioned is the general introduction of utility model technical solution, below in conjunction with attached drawing and specific implementation mode, to the utility model
It is described further.
Description of the drawings
Fig. 1 is the sectional view of the utility model.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose is taken, below in conjunction with
Specific embodiment of the present utility model is described in detail in attached drawing and preferred embodiment.
Fig. 1 is please referred to, the utility model embodiment provides a kind of for multi-layer flexible printed circuit board and Rigid Flex
Thin material layer structure, including the layers of copper 1 and a PI film layers 2 that are from top to bottom arranged, wherein the PI film layers 2 include half
Cure PI film layers 21 and the solidification PI film layers 22 between copper foil layer 1 and semi-solid preparation PI film layers 21, semi-solid preparation PI film layers
21 wait for follow-up resolidification.Material layer structures provided in this embodiment, especially suitable for flexible printed circuit board and Rigid Flex
On, i.e., entire novel-section bed structure is covered in the copper-clad plate with circuit, compared to traditional layer structure, is reduced two layers
Glue-line and a film layer, have significantly simplified material layer structures, reduce technological process, reduce cost, improve the moisture-resistant of product with it is resistance to
Hot property makes product overall performance be improved.
In the present embodiment, which is sputtered Cu layer or copper foil layer, if layers of copper 1 is sputtered Cu layer, sputtered Cu layer is
It is base with PI film layers 2, sputter is carried out in PI film layers 2 and is formed.
In the present embodiment, at least one is black PI in 22 the two of the semi-solid preparation PI film layers 21 and solidification PI film layers
The realization of film layer, black can be realized by directly adding black pigment to enter in semi-solid preparation PI film layers 21 or solidification PI film layers 22.Tool
Body, there are three types of may：(1) semi-solid preparation PI film layers 21 are black, form black PI film layers, and solidification PI film layers 22 are other face
Color；(2) solidification PI film layers 22 are black, form black PI film layers, and semi-solid preparation PI film layers 21 are other colors；(3) semi-solid preparation PI
Film layer 21 and solidification PI film layers 22 are black, form black PI film layers.As long as it follows that semi-solid preparation PI film layers 21 and solidification
At least one is black in PI film layers 22.The present embodiment uses the layer structure design of black, and internal wiring can be prevented sudden and violent
Expose, prevent stranger's externally visibly internal wiring, plays the role of circuit on hidden and protection circuit plate；Meanwhile for
There are the wiring board or circuit of impurity or flaw, black layer structure to play the role of hiding the flaw.
In the present embodiment, the thickness of each layer structure can be set according to specific needs, specifically, the sputtered Cu layer
Thickness is 2oz microns -9oz microns, and the thickness of the copper foil layer is 6oz microns -38oz microns, the semi-solid preparation PI film layers 21
Thickness is 5um-60um, and the thickness of the solidification PI film layers 22 is 5um-50um.It follows that the thickness of the PI film layers 2 after optimization
Degree can be adjusted according to product integrated demand, and compared to traditional structure design, thinned, i.e., each layer is done on entire product thickness
Structural thickness can be mutually adjusted thinned, keep entire novel-section bed of material structural thickness thin, finally make flexible printed circuit board and soft
The plywood product integral thickness that hardens is thinned, and to optimize assembling space, accelerates signal velocity, promotes properties of product.
As further improvement of this embodiment, the semi-solid preparation PI film layers 21 are LDK high-frequency functions films, the LDK high
Frequency function film can be by liquid PI addition black dyes and LDK performance materials carrying out that realization is mixed evenly, using LDK
For high-frequency functions film as semi-solid preparation PI film layers 21, LDK high-frequency functions films have raising signal transmission frequencies and diamagnetism dry
Function is disturbed, to improve the signal transmission performance of flexible printed circuit board, specifically, circuit board can be effectively improved in working condition
The speed for conveying central area (chip) to assign instruction, is quickly transferred to all parts, makes equipment (such as mobile phone, communication base station
Equipment) quick operation, occur without blunt and phenomena such as stuck of crashing, keeps 5G products communication process whole smooth.
As further improvement of this embodiment, the semi-solid preparation PI film layers 21 are that anti-copper particle migrates film, the anti-copper
Particle migration film can migrate film as semi-solid preparation PI by carrying out highly purified realization to conventional PI films using anti-copper particle
Film layer 21, anti-copper particle migration film have the anti-copper particle shift function of low particulate material, can effectively ensure that in working condition
Circuit can safely and effectively work, and be not in copper particle transport phenomena during the energization between circuit and circuit, prevent
Occurring conducting collision between circuit and circuit during equipment use causes circuit burning explosion on fire etc. dangerous, to which circuit rises
To good protective effect.
Certainly, semi-solid preparation PI film layers 21 can be used as while have LDK high frequencies and the anti-copper particle migration performance of low particulate material
Film.
Meanwhile the present embodiment further include coated on 1 upper surface of layers of copper a PET protection release layer 3 or a high temperature resistant PET from
Type film plays the role of protection and product pressing application to layers of copper 1 and entire novel-section bed structure.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore identical as the utility model above-described embodiment or approximate technical characteristic is used, and obtained other structures,
It is within the protection scope of the utility model.
Claims (8)
1. a kind of thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex, which is characterized in that including
The layers of copper being from top to bottom arranged and a PI film layers, wherein the PI film layers are including a semi-solid preparation PI film layers and positioned at layers of copper and half
Cure the solidification PI film layers between PI film layers.
2. the thin material layer structure according to claim 1 for multi-layer flexible printed circuit board and Rigid Flex,
It is characterized in that, at least one is black PI film layers in both the semi-solid preparation PI film layers and solidification PI film layers.
3. the thin material layer structure according to claim 1 for multi-layer flexible printed circuit board and Rigid Flex,
It is characterized in that, the semi-solid preparation PI film layers are LDK high-frequency functions films.
4. the thin material layer knot according to claim 1 or 3 for being used for multi-layer flexible printed circuit board and Rigid Flex
Structure, which is characterized in that the semi-solid preparation PI film layers are that anti-copper particle migrates film.
5. the thin material layer structure according to claim 1 for multi-layer flexible printed circuit board and Rigid Flex,
It is characterized in that, the layers of copper is sputtered Cu layer or copper foil layer.
6. the thin material layer knot according to claim 1 or 2 for being used for multi-layer flexible printed circuit board and Rigid Flex
Structure, which is characterized in that further include PET protection release layers or a high temperature resistant PET release films coated on layers of copper upper surface.
7. the thin material layer structure according to claim 5 for multi-layer flexible printed circuit board and Rigid Flex,
It is characterized in that, the thickness of the sputtered Cu layer is 2oz microns -9oz microns, the thickness of the copper foil layer is 6oz microns of -38oz
Micron.
8. the thin material layer structure according to claim 1 for multi-layer flexible printed circuit board and Rigid Flex,
It is characterized in that, the thickness of the semi-solid preparation PI film layers is 5um-60um, the thickness of the solidification PI film layers is 5um-50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820084802.9U CN207939826U (en) | 2018-01-18 | 2018-01-18 | Thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820084802.9U CN207939826U (en) | 2018-01-18 | 2018-01-18 | Thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207939826U true CN207939826U (en) | 2018-10-02 |
Family
ID=63649495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820084802.9U Active CN207939826U (en) | 2018-01-18 | 2018-01-18 | Thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex |
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| Country | Link |
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| CN (1) | CN207939826U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021035916A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Method for coating and molding novel material layer structure of high-frequency circuit board and product thereof |
| CN112867291A (en) * | 2019-08-23 | 2021-05-28 | 李龙凯 | Novel material layer structure |
-
2018
- 2018-01-18 CN CN201820084802.9U patent/CN207939826U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021035916A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Method for coating and molding novel material layer structure of high-frequency circuit board and product thereof |
| CN112867291A (en) * | 2019-08-23 | 2021-05-28 | 李龙凯 | Novel material layer structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 516000 room 3202, unit 4, building 1, No.11 Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee after: Li Longkai Address before: 56, group 2, Lihua Road, Changling Town, Wanzhou District, Chongqing Patentee before: Li Longkai |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210728 Address after: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 516000 room 3202, unit 4, block 1, No. 11, Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee before: Li Longkai |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Country or region after: China Address before: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |