CN207517667U - A kind of micro-nano structure array heat-delivery surface - Google Patents
A kind of micro-nano structure array heat-delivery surface Download PDFInfo
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- CN207517667U CN207517667U CN201721482055.6U CN201721482055U CN207517667U CN 207517667 U CN207517667 U CN 207517667U CN 201721482055 U CN201721482055 U CN 201721482055U CN 207517667 U CN207517667 U CN 207517667U
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- heat
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- cone
- nano structure
- delivery surface
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- 239000002086 nanomaterial Substances 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 26
- 239000004811 fluoropolymer Substances 0.000 claims abstract description 16
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 238000010276 construction Methods 0.000 claims abstract 2
- 239000000843 powder Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims description 2
- 238000005204 segregation Methods 0.000 claims description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052731 fluorine Inorganic materials 0.000 abstract description 22
- 239000011737 fluorine Substances 0.000 abstract description 22
- 238000009835 boiling Methods 0.000 abstract description 11
- 238000009736 wetting Methods 0.000 abstract description 6
- 230000004907 flux Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 230000009466 transformation Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006911 nucleation Effects 0.000 description 4
- 238000010899 nucleation Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000010148 water-pollination Effects 0.000 description 2
- RIQRGMUSBYGDBL-UHFFFAOYSA-N 1,1,1,2,2,3,4,5,5,5-decafluoropentane Chemical compound FC(F)(F)C(F)C(F)C(F)(F)C(F)(F)F RIQRGMUSBYGDBL-UHFFFAOYSA-N 0.000 description 1
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 235000020535 bottled fortified water Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002103 nanocoating Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of micro-nano structure array heat-delivery surfaces.The heat-delivery surface includes heat dissipation base and the array structure that is formed of the cone being made of fluoropolymer and heat conduction particle in heat dissipation base surface construction.The heat-delivery surface can greatly increase effective heat exchange area, surface roughness, thermal conductivity factor, conducive to transmission of the heat to fluorine-containing working medium, be conducive to the nucleate boiling of fluorine-containing working medium, wetting ability of the fluorine-containing working medium to heat-delivery surface can be strengthened, critical heat flux density is improved, plays the role of reinforced transformation heat transfer.
Description
Technical field
The utility model is related to a kind of micro-nano structure arrays for improving heating surface, more particularly to great-power electronic integrator
The phase-change heat of part.
Background technology
In recent years, with space technology, the fast development of laser device, high-power electronic device, electronic component it is miniature
Change, integrated, high-power has become developing direction.The heat dissipation problem of these electronic components of the thing followed, which also becomes, to be restricted
The critical issue of its safety and service life.Therefore, more efficient heat dissipation technology is developed to solve these high-power heaters
The radiating and cooling problem of part is imperative.
Phase-change heat-exchange is widely applied in terms of great-power electronic integrated device heat exchange.However, current phase-change heat-exchange
It is heat sink most using common plane or the surface (such as conduit, shaft of rib, cylinder) with surface texture.These surface textures
The roughness of heat-transfer area can be increased, improve the wellability on liquid and surface, increase solid-liquid contact area or realize condensation
The enhancing being thinned with " Gregorig " effect of liquid film, is finally reached the effect for promoting heat conduction efficiency.However these strengthen table
Face structure is largely all based on millimetre-sized macro-scale range and micron-sized micro-scale, fails to give full play of heat exchange
Surface takes thermal energy power, it is difficult to solve the heat dissipation problem of high heat flux density.
With the fast development of micro-nano manufacturing technology, micro-and nano-structural surface is manufactured as possibility, so as to be expected to solve
The certainly heat dissipation problem of high heat flux density.Chinese invention patent CN 103510132B disclose it is a kind of prepared on copper material surface it is ultra-thin
The technology of super wetting nanometer or the compound porous nickel film of micro-nano, the ultra-thin super wetting nanometer or the compound porous nickel film of micro-nano have fine
Hydrophily, water can be made fully to sprawl enhanced boiling heat transfer and spray cooling heat dissipation, it can be achieved that water rapidly on copper material surface.In
It is by microflute that state utility model patent CN 206073779U, which disclose that a kind of micro-nano compound structure surface is heat sink, and the surface is heat sink,
Road group and hydrophilic nano coating composition, can fortified water boiling heat transfer.The liquid of water/vapour phase temperature is higher (100 DEG C), and big
The safe working temperature of power electronic device is relatively low (generally below 60 DEG C), it usually needs low-boiling liquid is as working medium, such as
Fluorine-containing working medium：Fluoro trichloromethane (F11,23.7 DEG C of boiling point), trifluorotrichloroethane (F113,45.7 DEG C of boiling point), Decafluoropentane
(HFC10,53.6 DEG C of boiling point) etc..Hydrophily micro-nano structure surface and fluorine-containing working medium wetability are poor, and phase-change heat-exchange is not had
Deteriorating effects are played in invigoration effect instead.
Invention content
For the disadvantages mentioned above of the prior art, the utility model provides a kind of micro-nano structure array heat-delivery surface, it with
Fluorine-containing working medium has good wetability, can strengthen the phase-change heat-exchange of fluorine-containing working medium, can solve the high fever using fluorine-containing working medium
The heat dissipation problem of current density electronic device.
To achieve the above object, the utility model uses following technical scheme：
The utility model proposes micro-nano structure array heat-delivery surface be by fluoropolymer/heat conduction on heat dissipation base surface
The array structure that Particles dispersed cone is formed, the spacing of cone center is 50~1080 microns in array；The fluoropolymer/
The height of the compound cone of heat conduction particle is 5~250 microns, and cone apex angle is 30 °~150 °；Fluoropolymer/heat conduction particle is multiple
The nanoscale protrusion that cone surface has heat conduction particle to be formed is closed, bump sizes are at 10~500 nanometers.
The heat dissipation base is one of copper material, aluminium, copper alloy, aluminium alloy.The fluoropolymer is polytetrafluoro
One kind in ethylene, segregation vinyl fluoride.The heat conduction particle is copper powder, aluminium powder, silver powder, aluminum nitride powder, alumina powder, oxidation
One or a combination set of beryllium powder object, particle size range are 0.1~10 micron.
The beneficial effects of the utility model are：Fluoropolymer is close with fluorine-containing working medium chemical property, so as to good
Good wetting；The array and the nanostructured of cone surface that the compound cone of fluoropolymer/heat conduction particle is formed considerably increase
Effective heat exchange area and surface roughness, and further enhance the wetting on fluorine-containing working medium and surface；Height is added in cone to lead
Hot particle can increase the thermal conductivity factor of cone, conducive to transmission of the heat to fluorine-containing working medium, particularly in high heat conduction particle surface shape
Into hot localised points, be conducive to the nucleate boiling of fluorine-containing working medium；The gap and hole of nanoscale between cone surface heat conduction particle
Boiling nucleation point can be increased, conducive to phase-change nucleation；On this micro-nano structure array surface, fluorine-containing working medium undergoes phase transition generation
During bubble, bubble, which generates frequency, to be accelerated, and is detached from, explosion size reduction, and the dry region area at bubble formation reduces；Micro-nano knot
Structure array surface and the good wetability of fluorine-containing working medium can strengthen fluorine-containing working medium and rewet the ability on dry surface, and then push away
Dry late, raising critical heat flux density, plays the role of reinforced transformation heat transfer.
Description of the drawings
Fig. 1 is a kind of structure diagram of specific embodiment of the utility model；
Fig. 2 is the structure diagram of the cone of the micro-nano structure array of the utility model；
In figure：Matrix 1, cone 2, fluoropolymer 3, heat conduction particle 4, nanovoids 5 between particle.
Specific embodiment
As shown in Figs. 1-2, the utility model proposes micro-nano structure array heat-delivery surface be on the surface of heat dissipation base 1
2 array of cone being made of fluoropolymer 3 and heat conduction particle 4 is constructed；In an array the spacing of cone center for 50~
1080 microns, the height of cone is 5~250 microns, and cone apex angle is 30 °~150 °；In fluoropolymer 3 and heat conduction particle 4
The cone surface of composition has bulge-structure, and for raised size at 10~500 nanometers, protrusion is the corner angle protruded by heat conduction particle
The formation such as tip；There is nano level gap 5 between nanoscale bulge-structure.
The heat dissipation base 1 is high in this way using one of copper material, aluminium or its alloy material with high thermal conductivity coefficient
The heat that heat flow density electronic device generates can quickly be transmitted to micro-nano structure array by heat dissipation base；Micro-nano structure array be by
The array that the cone that fluoropolymer 3 and heat conduction particle 4 form is formed, cone array have micron scale structures, each cone
Surface has nano-scale structures.Fluoropolymer 3 is close with fluorine-containing working medium chemical property so as to good wet, while micro-
Rice and nano-scale structures greatly increase surface roughness, so as to further enhance the wetting of fluorine-containing working medium and surface；Cone
Middle addition high heat conduction particle 4 can increase the thermal conductivity factor of cone, conducive to transmission of the heat to fluorine-containing working medium, particularly in high heat conduction
Particle surface forms hot localised points, is conducive to the nucleate boiling of fluorine-containing working medium；Nanoscale between cone surface heat conduction particle
Gap 5 can increase boiling nucleation point, conducive to phase-change nucleation.On this micro-nano structure array surface, phase occurs for fluorine-containing working medium
When becoming generation bubble, bubble, which generates frequency, to be accelerated, and disengaging, explosion size reduce, and the dry region area at bubble formation reduces；
Micro-nano structure array surface and the good wetability of fluorine-containing working medium can strengthen the ability that fluorine-containing working medium rewets dry surface,
And then dry, raising critical heat flux density is postponed, play the role of reinforced transformation heat transfer.
Particular embodiments described above has carried out into one the purpose of this utility model, technical solution and advantageous effect
Step is described in detail.It should be appreciated that the foregoing is merely specific embodiment of the utility model, it is not limited to this practicality
Novel, within the spirit and principle of the utility model, any modification, equivalent substitution, improvement and etc. done should be included in
Within the scope of protection of the utility model.
Claims (4)
1. a kind of micro-nano structure array heat-delivery surface, it is characterised in that：The micro-nano structure array heat-delivery surface is in heat dissipation base
The array structure that the cone being made of fluoropolymer and heat conduction particle of body surface construction is formed, in array between cone center
Away from being 50~1080 microns；The height of the compound cone of fluoropolymer/heat conduction particle is 5~250 microns, and cone apex angle is
30 °~150 °；The compound cone surface of fluoropolymer/heat conduction particle has the nanoscale protrusion that heat conduction particle is formed, bump sizes
At 10~500 nanometers.
2. micro-nano structure array heat-delivery surface according to claim 1, it is characterised in that：The heat dissipation base is copper
One of material, aluminium, copper alloy, aluminium alloy.
3. micro-nano structure array heat-delivery surface according to claim 1, it is characterised in that：The fluoropolymer is poly-
One kind in tetrafluoroethene, segregation vinyl fluoride.
4. micro-nano structure array heat-delivery surface according to claim 1, it is characterised in that：The heat conduction particle is copper
One or a combination set of powder, aluminium powder, silver powder, aluminum nitride powder, alumina powder, beryllium oxide powder object, particle size range are 0.1~10 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721482055.6U CN207517667U (en) | 2017-11-08 | 2017-11-08 | A kind of micro-nano structure array heat-delivery surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721482055.6U CN207517667U (en) | 2017-11-08 | 2017-11-08 | A kind of micro-nano structure array heat-delivery surface |
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| Publication Number | Publication Date |
|---|---|
| CN207517667U true CN207517667U (en) | 2018-06-19 |
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| CN201721482055.6U Expired - Fee Related CN207517667U (en) | 2017-11-08 | 2017-11-08 | A kind of micro-nano structure array heat-delivery surface |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110370782A (en) * | 2019-07-19 | 2019-10-25 | 厦门市垄江工业制品有限公司 | A kind of high-cooling property foam and preparation method thereof |
| CN110595241A (en) * | 2019-09-10 | 2019-12-20 | 西安交通大学深圳研究院 | Partitioned block type enhanced boiling heat exchange microstructure and manufacturing method thereof |
| CN112151481A (en) * | 2020-08-26 | 2020-12-29 | 曙光节能技术（北京）股份有限公司 | Surface-enhanced boiling heat dissipation structure |
| CN113305440A (en) * | 2021-05-25 | 2021-08-27 | 中国核动力研究设计院 | Micro-nano structure surface strengthening method and high-power heat exchange equipment performance improving method |
| CN115047964A (en) * | 2022-07-26 | 2022-09-13 | 苏州浪潮智能科技有限公司 | Server heat dissipation method, device, equipment and storage medium |
| CN117928289A (en) * | 2024-01-25 | 2024-04-26 | 南京理工大学 | Gradient wetting microstructure for promoting continuous and stable generation of microbubble jet boiling |
-
2017
- 2017-11-08 CN CN201721482055.6U patent/CN207517667U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110370782A (en) * | 2019-07-19 | 2019-10-25 | 厦门市垄江工业制品有限公司 | A kind of high-cooling property foam and preparation method thereof |
| CN110595241A (en) * | 2019-09-10 | 2019-12-20 | 西安交通大学深圳研究院 | Partitioned block type enhanced boiling heat exchange microstructure and manufacturing method thereof |
| CN110595241B (en) * | 2019-09-10 | 2020-11-27 | 西安交通大学深圳研究院 | Partitioned block type enhanced boiling heat exchange microstructure and manufacturing method thereof |
| CN112151481A (en) * | 2020-08-26 | 2020-12-29 | 曙光节能技术（北京）股份有限公司 | Surface-enhanced boiling heat dissipation structure |
| CN112151481B (en) * | 2020-08-26 | 2023-07-18 | 曙光数据基础设施创新技术(北京)股份有限公司 | Surface enhanced boiling heat radiation structure |
| CN113305440A (en) * | 2021-05-25 | 2021-08-27 | 中国核动力研究设计院 | Micro-nano structure surface strengthening method and high-power heat exchange equipment performance improving method |
| CN115047964A (en) * | 2022-07-26 | 2022-09-13 | 苏州浪潮智能科技有限公司 | Server heat dissipation method, device, equipment and storage medium |
| CN115047964B (en) * | 2022-07-26 | 2023-08-11 | 苏州浪潮智能科技有限公司 | Server heat dissipation method, device, equipment and storage medium |
| CN117928289A (en) * | 2024-01-25 | 2024-04-26 | 南京理工大学 | Gradient wetting microstructure for promoting continuous and stable generation of microbubble jet boiling |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180619 Termination date: 20201108 |