CN206907790U - Printed conductive structure and light emitting module including the same - Google Patents
Printed conductive structure and light emitting module including the same Download PDFInfo
- Publication number
- CN206907790U CN206907790U CN201720603194.3U CN201720603194U CN206907790U CN 206907790 U CN206907790 U CN 206907790U CN 201720603194 U CN201720603194 U CN 201720603194U CN 206907790 U CN206907790 U CN 206907790U
- Authority
- CN
- China
- Prior art keywords
- line pattern
- pattern
- base material
- electrically conductive
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000007639 printing Methods 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 126
- -1 polyethylene terephthalate Polymers 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 12
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 12
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 9
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 6
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000004431 polycarbonate resin Substances 0.000 claims description 5
- 229920005668 polycarbonate resin Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920005749 polyurethane resin Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 2
- BAZVSMNPJJMILC-UHFFFAOYSA-N triadimenol Chemical compound C1=NC=NN1C(C(O)C(C)(C)C)OC1=CC=C(Cl)C=C1 BAZVSMNPJJMILC-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000007641 inkjet printing Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 238000010422 painting Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004425 Makrolon Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000007644 letterpress printing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003050 poly-cycloolefin Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- LLYXJBROWQDVMI-UHFFFAOYSA-N 2-chloro-4-nitrotoluene Chemical compound CC1=CC=C([N+]([O-])=O)C=C1Cl LLYXJBROWQDVMI-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- JSLMNNPQKHONFW-UHFFFAOYSA-N benzene naphthalene-1-carboxylic acid Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)O.C1=CC=CC=C1 JSLMNNPQKHONFW-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FYIBGDKNYYMMAG-UHFFFAOYSA-N ethane-1,2-diol;terephthalic acid Chemical compound OCCO.OC(=O)C1=CC=C(C(O)=O)C=C1 FYIBGDKNYYMMAG-UHFFFAOYSA-N 0.000 description 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a printing conductive structure and including printing conductive structure's light emitting module. The printed conductive structure includes a substrate, a first circuit pattern, a second circuit pattern and a third circuit pattern. The first circuit pattern and the second circuit pattern are formed by first conductive ink printed on one surface of the substrate. A gap is formed between the first circuit pattern and the second circuit pattern. The third circuit pattern is formed by printing a second conductive ink on the surface of the substrate. The third line pattern directly connects the first line pattern and the second line pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
Description
Technical field
The utility model on it is a kind of print conductive structure and include printing conductive structure light emitting module, particularly one
The light emitting module that prints conductive structure and include printing conductive structure of the kind with the resistance formed with mode of printing.
Background technology
As consumption electronic products, such as mobile phone, tablet personal computer and notebook computer, demand commercially are gradual
Reach saturation, dealers start center of gravity to be placed in the appearance design of consumption electronic products, with oneself consumer electricity of expectation
Sub- product can show one's talent from the numerous consumption electronic products of in the market, obtain the favor of consumer.
In order to decorate the shell of the consumption electronic products such as mobile phone, tablet personal computer or notebook computer to lift its entirety
Texture, currently used design include light emitting module being arranged in shell so that the light that light emitting module is sent may pass through outer
Pierced pattern on shell, different visual effects is presented whereby.Existing light emitting module typically use printed circuit board (PCB) as
Supply line's structure, and on a printed circuit welding kesistance to regulate and control the supply voltage of supply line.However, in face of consumption
Property electronic product slimming and green production demand, exploitation without the use of micro image etching procedure, welding processing procedure or plating system
The slimming supply line structure of journey has turned into the problem of current urgent need to resolve.
The content of the invention
The utility model on it is a kind of print conductive structure and include printing conductive structure light emitting module, by with
With mode of printing formed resistance printing conductive structure, solve light emitting module need to use micro image etching procedure, welding processing procedure or
The problem of printed circuit board (PCB) prepared by electroplating process.
A kind of printing conductive structure of the embodiment of the utility model one, including a base material, a first line pattern, one second
Line pattern and a tertiary circuit pattern.First line pattern and the second line pattern are by being printed in the one of a surface of base material
One electrically conductive ink is formed.There is a gap between first line pattern and the second line pattern.Tertiary circuit pattern is by printing
One second electrically conductive ink in the surface of base material is formed.Tertiary circuit pattern is directly connected to first line pattern and the second circuit
Pattern.First electrically conductive ink has a first resistor rate, and the second electrically conductive ink has a second resistance rate, and second resistance rate is big
In first resistor rate.
A kind of light emitting module of the embodiment of the utility model one, including foregoing printing conductive structure, a light-emitting component with
An and guide-lighting sheet material.Foregoing printing conductive structure further comprises one the 4th line pattern, and the 4th line pattern is located at base
Material.Light-emitting component is arranged at the surface of base material and is electrically connected at the second line pattern and the 4th line pattern.Guide-lighting sheet material tool
There is a storage tank.Guide-lighting sheet material is arranged at base material, and light-emitting component is located in storage tank.
According to it is above-mentioned it is disclosed in the utility model printing conductive structure and include printing conductive structure light emitting module,
Oily first electrically conductive ink is directly connected to by printing the tertiary circuit pattern formed by the second electrically conductive ink and prints formed first
Line pattern and the second line pattern, and the second resistance rate of the second electrically conductive ink is more than the first resistor of the first electrically conductive ink
Rate.Thus, you can obtain without the use of micro image etching procedure, welding processing procedure or electroplating process, and with control power supply electricity
Press the slimming supply line structure of function.
The explanation of explanation and implementation below above with respect to present disclosure is demonstrating and explain the utility model
Spirit and principle, and claims of the present utility model are provided and further explained.
Brief description of the drawings
Fig. 1 is the three-dimensional exploded view of the light emitting module of the utility model first embodiment.
Fig. 2 is the sectional view of the light emitting module of the utility model first embodiment.
Fig. 3 is the top view of the printing conductive structure of the light emitting module of the utility model first embodiment.
Fig. 4 is sectional views of the Fig. 3 along 4-4 ' hatchings.
Fig. 5 is the manufacture method flow chart of the light emitting module of the utility model first embodiment.
Fig. 6 to Fig. 8 is the manufacture method signal of the printing conductive structure of the light emitting module of the utility model first embodiment
Figure.
Fig. 9 is the sectional view of the printing conductive structure of the light emitting module of the utility model second embodiment.
Wherein, reference：
100 printing conductive structures
110 base materials
111 surfaces
120 first line patterns
130 second line patterns
140 tertiary circuit patterns
150 the 4th line patterns
160 first connection pads
170 second connection pads
180 protective layers
200 light-emitting components
300 guide-lighting sheet materials
310 first surfaces
311 storage tanks
320 second surfaces
330 adhesive agents
400 design layers
410 light transmission pattern areas
G gaps
W width
S100~S800 steps 100~step 800
Embodiment
Describe detailed features and advantage of the present utility model in detail in embodiments below, its content is enough to make any
Those skilled in the art understands technology contents of the present utility model and simultaneously implemented according to this, and according in disclosed in this specification
Hold, claims and accompanying drawing, any those skilled in the art can be readily understood upon the related mesh of the utility model
And advantage.Following embodiment is further described viewpoint of the present utility model, but non-anyways to limit this practicality
New category.
The printing conductive structure 100 of the utility model first embodiment is introduced first with including printing conductive structure 100
Light emitting module, Fig. 1 is refer to Fig. 4.Fig. 1 is the three-dimensional exploded view of the light emitting module of the utility model first embodiment.Fig. 2 is
The sectional view of the light emitting module of the utility model first embodiment.Fig. 3 is the light emitting module of the utility model first embodiment
Print the top view of conductive structure.Fig. 4 is sectional views of the Fig. 3 along 4-4 ' hatchings.As shown in Figures 1 to 4, the utility model
The light emitting module of one embodiment draws brush conductive structure 100, a light-emitting component 200, a guide-lighting design layer of sheet material 300 and one including one
400。
Printing conductive structure 100 includes a base material 110, a first line pattern 120, one second line pattern 130,1 the
Three line patterns 140, one the 4th line pattern 150, one first connection pad 160, one second connection pad 170 and a protective layer 180.Base material
110 have a surface 111.Base material 110 is, for example, plate body or pliability thin slice.Base material 110 is plastic material, such as may include to gather
Acid imide (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), gather
(ethylene naphthalate) (Polyethylene Naphthalate, PEN), polymethyl methacrylate (Polymethyl
Methacrylate, PMMA), polyethylene (PE), polypropylene (PP), polycyclic alkene resin (Polycycloolefin resin),
Polycarbonate resin (Polycarbonate resin), polyurethane resin (Polyurethane resin) or three vinegar
Acid cellulose (Triacetate Cellulose, TAC).
The line pattern 130 of first line pattern 120 and second is located at the surface 111 of base material 110.First line pattern 120
There is a clearance G between the second line pattern 130, the width W of clearance G is 0.1 millimeter (mm) to 1 millimeter (mm).First Line
Road pattern 120 with the second line pattern 130 is formed by the first electrically conductive ink for being printed in surface 111.First electrically conductive ink
For oil-based ink.For example include the powder of gold, silver, copper, platinum or other metal or alloy in first electrically conductive ink.First conductive oil
Ink has a first resistor rate, and first resistor rate is, for example, 10-4To 10-6Ohmcm (Ω cm).
Tertiary circuit pattern 140 is located at the surface 111 of base material 110, and tertiary circuit pattern 140 is directly connected to first line
The line pattern 130 of pattern 120 and second.Specifically, a part of tertiary circuit pattern 140 is stacked at first line pattern
120 sides away from base material 110, a part of tertiary circuit pattern 140 is folded to set second line pattern 130 away from base material 110
Side, between the tertiary circuit pattern 140 of another part is located between the line pattern 130 of first line pattern 120 and second
In gap G.Tertiary circuit pattern 140 is formed by one second electrically conductive ink for being printed in the surface 111 of base material 110.Second is conductive
Ink is oil-based ink.Powder or CNT in second electrically conductive ink for example including carbon, graphene.Second electrically conductive ink has
There is a second resistance rate, and second resistance rate is more than first resistor rate.Second resistance rate is, for example, 0.05 to 0.5 ohmcm
(Ω·cm)。
In the utility model first embodiment, a part of tertiary circuit pattern 140 is stacked at first line pattern
120, the tertiary circuit pattern 140 of another part is stacked at the second line pattern 120, then the tertiary circuit pattern 140 of a part
In clearance G, but it is not limited.In the utility model other embodiment, tertiary circuit pattern can be fully located at gap
In, while directly contacting first line pattern and the second line pattern.
4th line pattern 150 is located at the surface 111 of base material 110.4th line pattern 150 is by being printed in surface 111
The first electrically conductive ink formed.First connection pad 160 and the second connection pad 170 are respectively positioned on the surface 111 of base material 110.First connection pad
160 are connected to the second line pattern 130, and the second connection pad 170 is connected to the 4th line pattern.In the utility model first embodiment
In, the first connection pad 160 with the second connection pad 170 is formed by the first electrically conductive ink for being printed in surface 111, therefore First Line
Road pattern 120, the second line pattern 130, the 4th line pattern 150, the first connection pad 160 are with the second connection pad 170 in same
The surface 111 of base material 110 is printed in fabrication steps, but is not limited.In the utility model other embodiment, first
Connection pad can be formed from the second connection pad by different electrically conductive ink or conducting resinl, therefore can not be with first line pattern, second
Line pattern and the 4th line pattern are together formed on the surface of base material.The line pattern 150 of first line pattern 120 and the 4th
It is another that there is the function of being electrically connected with supply power supply (not illustrating) so that electric energy can be via the circuit of first line pattern 120 and the 4th
Pattern 150 is supplied to light-emitting component 200.
Protective layer 180 covers the part surface of base material 110, and covers first line pattern 120, the second line map simultaneously
Case 130, the line pattern 150 of tertiary circuit pattern 140 and the 4th.The material of protective layer 180 is for example including thermosetting resin or heat
Plastic resin, such as polyurethane, vinyl chloride/vinyl acetate copolymer, polymethacrylates or epoxy resin etc..Pass through guarantor
The protection of sheath 180, can prevent print conductive structure 100 on line pattern in the manufacturing process of light emitting module because friction or
Contacted with viscose and impaired or rotten, and then influence the fine ratio of product of line pattern.
Light-emitting component 200 is arranged at the first connection pad 160 and the second connection pad 170 on the surface 111 of base material 110.Luminous member
Part 200 is electrically connected with the second line pattern 130 with the 4th line pattern 150 respectively by the first connection pad 160 with the second connection pad 170
Connect.Light-emitting component 200 is, for example, light emitting diode.In the utility model first embodiment, light-emitting component 200 is arranged at base material
The first connection pad 160 and the second connection pad 170 on 110 surface 111, but be not limited.In the utility model other embodiment
In, light-emitting component also can run through base material to connect the first connection pad and the second connection pad.
Guide-lighting sheet material 300 has relative a first surface 310 and a second surface 320, and a storage tank 311.Hold
Put the first surface 310 that groove 311 is located at guide-lighting sheet material 300.Guide-lighting sheet material 300 is set with first surface 310 towards base material 110
In the surface 111 of base material 110, first line pattern 120, the second line pattern 130 is set to be located at base material with tertiary circuit pattern 140
Between 110 and guide-lighting sheet material 300.Light-emitting component 200 is located in storage tank 311.Pass through between guide-lighting sheet material 300 and base material 110
Adhesive agent 330 binds.The material of adhesive agent 330 for example including ethylene-vinyl acetate copolymer (, ethylene-vinyl
Acetate copolymer, EVA), polyurethane acryl resin or polyester acryl resin etc..
In the utility model first embodiment, first line pattern 120, the second line pattern 130 and tertiary circuit figure
Case 140 is not limited between base material 110 and guide-lighting sheet material 300.In the utility model other embodiment, first
Line pattern, the second line pattern and tertiary circuit pattern can be located at surface of the base material away from guide-lighting sheet material, and light-emitting component passes through
Base material is worn to connect the first connection pad and the second connection pad.In the utility model first embodiment, light-emitting component 200 is placed in
In the storage tank 311 on one surface 310, but it is not limited.In the utility model other embodiment, storage tank can be through leading
The first surface of tabula rasa material and the wears groove of second surface, and light-emitting component is placed in wears groove.
Design layer 400 is arranged at second surface 320 of the guide-lighting sheet material 300 away from base material 110.Design layer 400 is saturating with one
Optical pattern area 410 so that the most of light advanced in guide-lighting sheet material 300 may pass through light transmission pattern area 410 and leave luminous mould
Block.Light transmission pattern area 410 in base material 110 rectangular projection and storage tank 311 in the rectangular projection sequence of base material 110, whereby
The light that light-emitting component 200 is released is avoided directly through light transmission pattern area 410, and then the brightness for lifting light transmission pattern area 410 is equal
Even property.In the utility model first embodiment, design layer 400 is made up of light tight material, and light transmission pattern area 410 is figure
By the region of hollow out in sample layer 400, but it is not limited.In the utility model other embodiment, design layer can be by low light transmission
Material is formed, and light transmission pattern area can be then made up of high light-transmitting materials.
When the first electrically conductive ink includes silver powder, its first line pattern formed and the second line pattern length are 5
Centimetre (cm), width are 1 millimeter (mm), and thickness is 11 microns (μm), and the width of clearance G is 0.25 millimeter, the second electrically conductive ink
Include carbon dust, when tertiary circuit pattern thickness is 7 microns, the resistance between first line pattern and the second line pattern is 36
Ohm.When the width of the clearance G in above-mentioned condition is 0.35 millimeter, the electricity between first line pattern and the second line pattern
Hinder for 44 ohm.When the width of the clearance G in above-mentioned condition is 0.45 millimeter, first line pattern and the second line pattern it
Between resistance be 57 ohm.When the width of the clearance G in above-mentioned condition is 0.55 millimeter, first line pattern and the second circuit
Resistance between pattern is 63 ohm.
Above measurement data illustrates that printing conductive structure 100 of the present utility model does not need welding kesistance i.e. adjustable
Print the resistance value of conductive structure.Consequently, it is possible to when printing conductive structure 100 of the present utility model is applied to light emitting module, can
The voltage of adjustment supply light-emitting component 200 is the normal working voltage of light-emitting component 200, avoids enter into the electricity of printing conductive structure
Pressure prevents light-emitting component 200 to be damaged because of overtension higher than the normal working voltage of light-emitting component 200.
First line pattern 120, the second line pattern 130 and the 4th line pattern in the utility model first embodiment
150 direction of routing is only to illustrate example of the present utility model with shape, and those skilled in the art can be according to the utility model
Spirit be adjusted and obtain suitable configuration with actual demand.
Next the light emitting module of explanation the utility model second embodiment, refer to Fig. 9.Fig. 9 is the utility model the
The sectional view of the printing conductive structure of the light emitting module of two embodiments.The light emitting module of the utility model second embodiment similar in appearance to
The light emitting module of the utility model first embodiment, both difference is in the first line pattern in conductive structure is printed,
The laminated layer sequence of two line patterns and tertiary circuit pattern.Below only for first line pattern, the second line pattern and the 3rd
The structure of line pattern is illustrated, and something in common just repeats no more herein.
Tertiary circuit pattern 140 is located at the surface 111 of base material 110.Tertiary circuit pattern 140 is by being printed in base material 110
One second electrically conductive ink on surface 111 is formed.Second electrically conductive ink is oil-based ink.In second electrically conductive ink for example including
The powder or CNT of carbon, graphene.Second electrically conductive ink has a second resistance rate, and second resistance rate is more than the first electricity
Resistance rate.Second resistance rate is, for example, 0.05 to 0.5 ohmcm (Ω cm).
The line pattern 130 of first line pattern 120 and second is located at the surface 111 of base material 110, and at least part of first
Line pattern is stacked on tertiary circuit pattern with least part of second line pattern.In other words, at least part of first
Line pattern is stacked at side of the tertiary circuit pattern away from base material 110 with least part of second line pattern.First line
There is a clearance G, the width W of clearance G is 0.1 millimeter (mm) to 1 millimeter (mm) between the line pattern 130 of pattern 120 and second.
At least part of tertiary circuit pattern 140 is exposed in clearance G, and tertiary circuit pattern 140 is directly connected to first line pattern
120 and second line pattern 130.The line pattern 130 of first line pattern 120 and second is by being printed in the first of surface 111
Electrically conductive ink is formed.First electrically conductive ink is oil-based ink.In first electrically conductive ink for example including gold, silver, copper, platinum or other
The powder of metal or alloy.First electrically conductive ink has a first resistor rate, and first resistor rate is, for example, 10-4To 10-6Ohm
Centimetre (Ω cm).
Next the manufacture method of the light emitting module of explanation the utility model first embodiment, Fig. 2 and Fig. 5 is refer to figure
8.Fig. 5 is the manufacture method flow chart of the light emitting module of the utility model first embodiment.Fig. 6 to Fig. 8 is the utility model the
The manufacture method schematic diagram of the printing conductive structure of the light emitting module of one embodiment.The luminous mould of the utility model first embodiment
The manufacture method of block comprises the following steps (S100 to S800).
First, print the first electrically conductive ink in base material with formed the first electrically conductive ink pattern, the second electrically conductive ink pattern with
4th electrically conductive ink pattern (S100).
Specifically, using screen painting, intaglio printing, letterpress or the mode of ink jet printing by the first electrically conductive ink
The surface of base material 110 is printed in obtain the first electrically conductive ink pattern, the second electrically conductive ink pattern and the 4th electrically conductive ink pattern.
There is the gap that width is 0.1 millimeter to 1 millimeter between first electrically conductive ink pattern and the second electrically conductive ink pattern.Base material 110
For example, plate body or pliability thin slice.Base material 110 is plastic material, such as may include polyimides (Polyimide, PI), gathers
Ethylene glycol terephthalate (Polyethylene Terephthalate, PET), PEN
(Polyethylene Naphthalate, PEN), polymethyl methacrylate (Polymethyl Methacrylate,
PMMA), polyethylene (PE), polypropylene (PP), polycyclic alkene resin (Polycycloolefin resin), polycarbonate resin
(Polycarbonate resin), polyurethane resin (Polyurethane resin) or Triafol T
(Triacetate Cellulose, TAC).First electrically conductive ink is, for example, to include gold, silver, copper, platinum or other metal or alloy
Powder oil-based ink.First electrically conductive ink has first resistor rate, and first resistor rate is, for example, 10-4To 10-6Ohm li
Rice (Ω cm).In the utility model section Example, when using screen painting, the speed of printing was printed for every 1 to 5 second
The electrically conductive ink pattern of 20 centimetres of length is in the surface of base material.In the utility model another part embodiment, when using half tone
During printing, the speed of printing for every 20 centimetres of 3.3 seconds printing lengths electrically conductive ink pattern in the surface of base material.It is new in this practicality
In type another part embodiment, when using intaglio printing or letterpress, the speed of printing is 70 centimetres of printing length per second
To 90 centimetres of electrically conductive ink patterns in the surface of base material.In the utility model another part embodiment, when using intaglio process
Brush or during letterpress, the speed of printing for 83 centimetres of printing length per second electrically conductive ink pattern in the surface of base material.At this
In utility model another part embodiment, when using ink jet printing, the speed of printing is 5 millimeters of printing length per second to 50 millis
The electrically conductive ink pattern of rice is in the surface of base material.In the utility model another part embodiment, when using ink jet printing, print
The speed of brush is the electrically conductive ink pattern of 1 centimetre of printing length per second in the surface of base material.
Then, the first electrically conductive ink pattern, the second electrically conductive ink pattern and the 4th electrically conductive ink pattern are toasted with
Form first line pattern, the second line pattern and the 4th line pattern (S200).
Specifically, with the temperature of Celsius 60 to 80 degree to the first electrically conductive ink pattern, the second electrically conductive ink pattern and the
Four electrically conductive ink patterns are toasted, and the time span of baking is 5 to 15 minutes.The first electrically conductive ink figure is removed by toasting
Solvent in case, the second electrically conductive ink pattern and the 4th electrically conductive ink pattern is to form first line pattern 120, the second line map
The line pattern 150 of case 130 and the 4th.The width W of clearance G between the line pattern 130 of first line pattern 120 and second is
0.1 millimeter to 1 millimeter.During when baking temperature is too high or baking time is long and using nonrefractory base material, base material is easily heated
Deformation.
Then, the second electrically conductive ink is printed in base material to form the 3rd electrically conductive ink pattern (S300).
Specifically, using screen painting, intaglio printing, letterpress or the mode of ink jet printing by the second electrically conductive ink
The surface of base material is printed in obtain the 3rd electrically conductive ink pattern, and the 3rd electrically conductive ink pattern inserts the first electrically conductive ink pattern
In gap between the second electrically conductive ink pattern.First electrically conductive ink pattern and the second electrically conductive ink pattern are conductive by the 3rd
Ink logo is connected.Second electrically conductive ink is, for example, to include carbon, graphite, graphene, CNT or other conductive carbon materials
The oil-based ink of powder.Second electrically conductive ink has second resistance rate, and second resistance rate is, for example, 0.05 to 0.5 ohmcm
(Ω·cm).In the utility model section Example, when using screen painting, the speed of printing was grown for printing in every 1 to 5 second
The electrically conductive ink pattern of 20 centimetres of degree is in the surface of base material.In the utility model another part embodiment, printed when using half tone
During brush, the speed of printing for every 20 centimetres of 3.3 seconds printing lengths electrically conductive ink pattern in the surface of base material.In the utility model
In another part embodiment, when using intaglio printing or letterpress, the speed of printing for 70 centimetres of printing length per second extremely
90 centimetres of electrically conductive ink pattern is in the surface of base material.In the utility model another part embodiment, when using intaglio printing
Or during letterpress, the speed of printing for 83 centimetres of printing length per second electrically conductive ink pattern in the surface of base material.In this reality
With in new another part embodiment, when using ink jet printing, the speed of printing is 5 millimeters to 50 millimeters of printing length per second
Electrically conductive ink pattern in the surface of base material.In the utility model another part embodiment, when using ink jet printing, printing
Speed for 1 centimetre of printing length per second electrically conductive ink pattern in the surface of base material.
Then, the 3rd electrically conductive ink pattern is toasted to form tertiary circuit pattern (S400).
Specifically, the 3rd electrically conductive ink pattern is toasted with the temperature of Celsius 80 to 150 degree, the time length of baking
Spend for 15 to 45 minutes.The solvent in the 3rd electrically conductive ink pattern is removed to form tertiary circuit pattern 140 by toasting.First
Line pattern 120 is connected with the second line pattern 130 by tertiary circuit pattern 140.
Then, protective layer is formed in base material and covering first line pattern, the second line pattern, tertiary circuit pattern and the
Four line patterns (S500).
Specifically, in the surface of base material 110 in a manner of screen painting, intaglio printing, letterpress or ink jet printing
111 form protective layer 180, and protective layer 180 covers first line pattern 120, the second line pattern 130, tertiary circuit pattern
140 and the 4th line pattern 150.The material of protective layer can be thermosetting resin or thermoplastic resin, such as polyurethane, chloroethene
Alkene/vinyl acetate copolymer, polymethacrylates or epoxy resin etc., but be not limited.
Then, light-emitting component is set in base material and is electrically connected with the second line pattern and the 4th line pattern (S600).
Specifically, light-emitting component 200 is, for example, light emitting diode.Light-emitting component 200 is fixed on base material by conducting resinl
110 surface 111, and by the first connection pad 160 and second-order pad 170 be electrically connected in the second line pattern 130 with
4th line pattern 150.Conducting resinl is, for example, polyester resin elargol or solvent-free epoxy resin elargol.In the utility model portion
In point embodiment, after light-emitting component also can be fixed on substrate surface by viscose, then with conducting resinl be electrically connected with light-emitting component in
First line pattern and the 4th line pattern.In the utility model another part embodiment, light-emitting component can also run through base material,
Light-emitting component is electrically connected with first line pattern and the 4th line pattern with conducting resinl again.
Then, guide-lighting sheet material is set in base material (S700).
Specifically, being coated with adhesive agent 330 has the first surface 310 of storage tank 311 in guide-lighting sheet material 300, or applies
Cloth adhesive agent 330 is in the surface 111 of the base material 110 where line pattern and light-emitting component 200.Then it is glutinous by adhesive agent 330
Close guide-lighting sheet material 300 and base material 110 so that first line pattern 120, the second line pattern 130, tertiary circuit pattern 140 with
4th line pattern 150 is between base material 110 and guide-lighting sheet material 300, and light-emitting component 200 is located in storage tank 311.It is guide-lighting
The material of sheet material 300 is, for example, polyethylene terephthalate (Polyethylene Terephthalate, PET), poly- first
Base methyl acrylate (Polymethyl Methacrylate, PMMA) or makrolon (Polycarbonate).Adhesive agent 330
Material for example including ethylene-vinyl acetate copolymer (ethylene-vinyl acetatecopolymer, EVA), poly- ammonia
Ester acryl resin or polyester acryl resin.In the present embodiment, first line pattern 120, the second line pattern 130,
Three line patterns 140 and the 4th line pattern 150 are not limited between base material 110 and guide-lighting sheet material 300.At this
In utility model other embodiment, first line pattern, the second line pattern, tertiary circuit pattern and the 4th line pattern are located at
Surface of the base material away from guide-lighting sheet material.
Then, design layer is set in surface (S800) of the guide-lighting sheet material away from base material.
Specifically, in a manner of spraying, rotary coating, screen painting, intaglio printing, letterpress or ink jet printing in
The second surface 320 of guide-lighting sheet material 300 forms the design layer 400 with light transmission pattern area 410.Light transmission pattern area 410 is in base material
110 rectangular projection is with storage tank 311 in the rectangular projection sequence of base material 110.The material of design layer 400 is, for example, poly- to benzene
Naphthalate (Polyethylene Terephthalate, PET), polymethyl methacrylate (Polymethyl
Methacrylate, PMMA) or makrolon (Polycarbonate).In the utility model other embodiment, design layer is also
It can be Pattern paste paper.
Consequently, it is possible to it be can be prepared by according to aforementioned steps of manufacture without the use of micro image etching procedure, welding processing procedure or plating
Processing procedure, and with the slimming supply line structure of control supply voltage function, and including this slimming supply line structure
Light emitting module.
In the manufacture method of the light emitting module of the utility model first embodiment, electrically conductive ink pattern is printed in substrate
Afterwards, first toasted to form line pattern, then another electrically conductive ink pattern printing in substrate and is toasted to be formed
Another line pattern, but be not limited.In the manufacture method of the light emitting module of the utility model other embodiment, can first by
Whole electrically conductive ink pattern printings are after substrate, and property toast to form line pattern again.
The light emitting module of the utility model second embodiment is similar to the hair of the utility model first embodiment due to structure
Optical module, its manufacture method is also similar in appearance to the manufacture method of first embodiment.The luminous mould of first embodiment and second embodiment
Difference between the manufacture method of block is exchanged for process sequence, is just repeated no more herein.
In summary, according to above-mentioned printing conductive structure disclosed in the utility model and including printing conductive structure
Light emitting module, oily first electrically conductive ink printing shape is directly connected to by printing the tertiary circuit pattern formed by the second electrically conductive ink
Into first line pattern and the second line pattern, and the second resistance rate of the second electrically conductive ink is more than the of the first electrically conductive ink
One resistivity so that tertiary circuit pattern can be as the resistive element in printing conductive structure.Thus, you can be not required to
Using micro image etching procedure, welding processing procedure or electroplating process, and the slimming supply line knot with control supply voltage function
Structure.
Certainly, the utility model can also have other various embodiments, without departing substantially from the utility model spirit and its essence
In the case of, those skilled in the art work as can make various corresponding changes and deformation according to the utility model, but these
Corresponding change and deformation should all belong to the scope of the claims appended by the utility model.
Claims (14)
1. one kind printing conductive structure, it is characterised in that including：
One base material；
One first line pattern and one second line pattern, the one first electrically conductive ink institute shape on the surface by being printed in the base material
Into having a gap between the first line pattern and second line pattern；And
One tertiary circuit pattern, formed by being printed in one second electrically conductive ink on the surface of the base material, the tertiary circuit figure
Case is directly connected to the first line pattern and second line pattern；
Wherein, first electrically conductive ink has a first resistor rate, and second electrically conductive ink has a second resistance rate, and this
Two resistivity are more than the first resistor rate.
2. printing conductive structure according to claim 1, it is characterised in that at least part of tertiary circuit pattern is located at
In the gap between the first line pattern and second line pattern.
3. printing conductive structure according to claim 2, it is characterised in that a part of tertiary circuit pattern is stacked at
The first line pattern, the tertiary circuit pattern of another part are stacked at second line pattern.
4. printing conductive structure according to claim 1, it is characterised in that at least part of first line pattern with extremely
Least a portion of second line pattern is stacked at the side of the tertiary circuit pattern away from the base material.
5. printing conductive structure according to claim 1, it is characterised in that further comprise a protective layer, positioned at the base
The surface of material and cover the first line pattern, second line pattern and the tertiary circuit pattern.
6. printing conductive structure according to claim 1, it is characterised in that the base material is flexible substrate, and the base material
Material include polyimides, polyethylene terephthalate, PEN, polymethyl methacrylate,
Polyethylene, polypropylene, polycyclic alkene resin, polycarbonate resin, polyurethane resin or Triafol T.
7. printing conductive structure according to claim 1, it is characterised in that the width in the gap is 0.1 to 1 centimetre.
8. printing conductive structure according to claim 1, it is characterised in that first electrically conductive ink and second conductive oil
Ink is oil-based ink.
9. printing conductive structure according to claim 1, it is characterised in that first electrically conductive ink contain metal dust with
Resin, the resistivity of first electrically conductive ink is 10-4To 10-6Ohmcm.
10. printing conductive structure according to claim 1, it is characterised in that second electrically conductive ink contains carbon and resin,
The resistivity of second electrically conductive ink is 0.05 to 0.5 ohmcm.
A kind of 11. light emitting module, it is characterised in that including：
Printing conductive structure according to any claim in claim 1 to 10, the printing conductive structure further wrap
One the 4th line pattern is included, the 4th line pattern is located at the base material；
One light-emitting component, it is arranged at the base material and is electrically connected at second line pattern and the 4th line pattern；And
One guide-lighting sheet material, there is a storage tank, the guide-lighting sheet material is arranged at the base material, and the light-emitting component is placed in the storage tank
In.
12. light emitting module according to claim 11, it is characterised in that further comprise a design layer, be arranged at this and lead
Tabula rasa material and away from the base material, the design layer has a light transmission pattern area.
13. light emitting module according to claim 12, it is characterised in that the light transmission pattern area is in the rectangular projection of the base material
With the storage tank in the rectangular projection sequence of the base material.
14. light emitting module according to claim 11, it is characterised in that the first line pattern, second line pattern,
The tertiary circuit pattern and the 4th line pattern are located between the base material and the guide-lighting sheet material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105138735 | 2016-11-24 | ||
| TW105138735A TWI629806B (en) | 2016-11-24 | 2016-11-24 | Ink-printed conductive structure, light emitting module including the same, and manufacturing methods thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206907790U true CN206907790U (en) | 2018-01-19 |
Family
ID=61286066
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710387355.4A Active CN108110125B (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
| CN201720603194.3U Withdrawn - After Issue CN206907790U (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure and light emitting module including the same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710387355.4A Active CN108110125B (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN108110125B (en) |
| TW (1) | TWI629806B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108110125A (en) * | 2016-11-24 | 2018-06-01 | 昆山华冠商标印刷有限公司 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI658765B (en) * | 2018-09-28 | 2019-05-01 | 正美企業股份有限公司 | Conductive circuit structure and passive wireless sensing device using the same |
| CN111065219B (en) * | 2018-10-17 | 2021-05-25 | 昆山华冠商标印刷有限公司 | Decoration assembly |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040036780A (en) * | 2002-10-24 | 2004-05-03 | 대덕전자 주식회사 | Method of manufacturing resistor-embedded printed circuit board |
| US7113179B2 (en) * | 2004-06-23 | 2006-09-26 | Interlink Electronics, Inc. | Force sensing resistor with calibration element and method of manufacturing same |
| US20060176350A1 (en) * | 2005-01-14 | 2006-08-10 | Howarth James J | Replacement of passive electrical components |
| WO2007061033A1 (en) * | 2005-11-28 | 2007-05-31 | Sharp Kabushiki Kaisha | Illuminating device and method for manufacturing same |
| GB2459888B (en) * | 2008-05-09 | 2011-06-08 | Design Led Products Ltd | Capacitive sensing apparatus |
| JP4772919B2 (en) * | 2010-12-22 | 2011-09-14 | 株式会社東芝 | Flexible printed wiring board |
| US20150257278A1 (en) * | 2014-03-06 | 2015-09-10 | Tactotek Oy | Method for manufacturing electronic products, related arrangement and product |
| US9496171B2 (en) * | 2014-09-26 | 2016-11-15 | Texas Instruments Incorporated | Printed interconnects for semiconductor packages |
| CN105307393B (en) * | 2015-11-13 | 2017-12-19 | 惠州市金百泽电路科技有限公司 | A kind of manufacture craft for lifting electric conductive carbon printing printed circuit board resistance accuracy |
| TWI629806B (en) * | 2016-11-24 | 2018-07-11 | 正美企業股份有限公司 | Ink-printed conductive structure, light emitting module including the same, and manufacturing methods thereof |
| TWM545417U (en) * | 2016-11-24 | 2017-07-11 | 正美企業股份有限公司 | Ink-printed conductive structure and light emitting module including the same |
-
2016
- 2016-11-24 TW TW105138735A patent/TWI629806B/en active
-
2017
- 2017-05-26 CN CN201710387355.4A patent/CN108110125B/en active Active
- 2017-05-26 CN CN201720603194.3U patent/CN206907790U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108110125A (en) * | 2016-11-24 | 2018-06-01 | 昆山华冠商标印刷有限公司 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
| CN108110125B (en) * | 2016-11-24 | 2024-04-02 | 昆山华冠商标印刷有限公司 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108110125A (en) | 2018-06-01 |
| TWI629806B (en) | 2018-07-11 |
| TW201820658A (en) | 2018-06-01 |
| CN108110125B (en) | 2024-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9092096B2 (en) | Low-cost mass-produced touch sensors | |
| CN206907790U (en) | Printed conductive structure and light emitting module including the same | |
| CN102123561B (en) | Electronic sub-component used for electronic device | |
| JP2020009473A (en) | Sensor sheet and touch sensor | |
| CA3011171C (en) | Flexible printed circuit | |
| CN111610870A (en) | Touch panel | |
| CN106662953A (en) | Method for producing conductor-layer-equipped structure, substrate-equipped wiring body, substrate-equipped structure, and touch sensor | |
| CN211321530U (en) | Water-based graphene electrothermal film | |
| US20200258423A1 (en) | Method of using hand-made circuit board for learning | |
| US10893608B2 (en) | Fabric having multiple layered circuit thereon integrating with electronic devices | |
| CN105611714B (en) | Flexible printed circuit board and display device | |
| TWM545417U (en) | Ink-printed conductive structure and light emitting module including the same | |
| JP2022063203A (en) | Transparent conductive film, method for manufacturing transparent conductive film, and touch panel | |
| JP2000183481A (en) | Laminated board and data input device using the same | |
| EP3047708B1 (en) | Circuit board assembly | |
| KR200371726Y1 (en) | Multi-purpose adhesive tape capable of adhering on both sides | |
| CN110505719A (en) | Heating film and preparation method thereof | |
| CN108076581A (en) | Multi-layer flexible circuit board and preparation method thereof | |
| CN211128416U (en) | Bury electric capacity and bury resistance printed wiring board | |
| CN207053880U (en) | A kind of circuit sheet material, camera module and electronic equipment | |
| CN207475971U (en) | A kind of flexible circuit board with good insulating performance | |
| CN206510569U (en) | Printing platform and silk-screen printing device | |
| US9900981B2 (en) | Flexible circuit with partial ground path | |
| CN216773108U (en) | Capacitive membrane switch with fine gradient patterns manufactured by direct screen printing method | |
| CN107113966B (en) | Flexible circuit with partial earthing path |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180119 Effective date of abandoning: 20240402 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20180119 Effective date of abandoning: 20240402 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |