CN206413252U - A kind of Novel circuit board based on heat conductive silica gel - Google Patents
A kind of Novel circuit board based on heat conductive silica gel Download PDFInfo
- Publication number
- CN206413252U CN206413252U CN201720119022.9U CN201720119022U CN206413252U CN 206413252 U CN206413252 U CN 206413252U CN 201720119022 U CN201720119022 U CN 201720119022U CN 206413252 U CN206413252 U CN 206413252U
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- silica gel
- blind
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of Novel circuit board based on heat conductive silica gel, including include the first heat dissipating layer, protective layer, conductive layer, basic unit and the second heat dissipating layer successively from top to bottom；There is first through hole in first heat dissipating layer; there is the second through hole in second heat dissipating layer; circuit board also includes multiple first blind holes and multiple second blind holes; the openend of first blind hole and the first through hole UNICOM; the blind end of first blind hole is located in the protective layer; the openend of second blind hole and the second through hole UNICOM, the blind end of the second blind hole are located in the basic unit, and heat conductive silica gel is each filled with first and second blind hole；Circuit board also includes the first thermally conductive sheet and the second thermally conductive sheet through the second through hole through the first through hole, and first and second thermally conductive sheet is connected by connection sheet, has multiple radiating fins in connection sheet.Heat dissipation for circuit board effect of the present utility model is good.
Description
Technical field
The utility model is related to circuit field, and in particular to a kind of Novel circuit board based on heat conductive silica gel.
Background technology
Circuit board is the part that multiple electronic devices are integrated with thereon, especially as the progress of technology, existing circuit
More electronic devices are integrated with plate, so that the caloric value of circuit board is also increasing, if radiating is bad, circuit can be caused
The efficiency of plate declines, or even damages.
Utility model content
Utility model purpose：The utility model is intended to overcome the defect of prior art there is provided a kind of based on heat conductive silica gel
Novel circuit board.
Technical scheme：A kind of circuit board, includes the first heat dissipating layer, protective layer, conductive layer, basic unit and the successively from top to bottom
Two heat dissipating layers；Having in first heat dissipating layer has the second through hole, the circuit board in first through hole, second heat dissipating layer
Also include multiple first blind holes and multiple second blind holes, the openend of first blind hole and the first through hole UNICOM, it is described
The blind end of first blind hole is located in the protective layer, the openend of second blind hole and the second through hole UNICOM, described second
The blind end of blind hole is located in the basic unit, and heat conductive silica gel is each filled with first and second blind hole；The circuit board also includes passing through
The first thermally conductive sheet and the second thermally conductive sheet through second through hole of the first through hole are worn, first and second thermally conductive sheet leads to
Crossing in connection sheet connection, the connection sheet has multiple radiating fins.
A new step, the basic unit is made up of polyimide material.
A new step, the conductive layer is copper foil.
A new step, first and second thermally conductive sheet is made by albronze.
A new step, the connection sheet and multiple radiating fins be integrally formed, the connection sheet and multiple radiating fins by
Albronze is made.
A new step, the first through hole is the through hole of rectangular shape, and parallel with the protective layer.
A new step, second through hole is the through hole of rectangular shape, and parallel with the basic unit.
A new step, first and second heat dissipating layer is insulating radiation layer.
Beneficial effect：Circuit board of the present utility model exports heat by heat conductive silica gel, and passes through thermally conductive sheet and radiating fin
Piece so that radiating effect is strong.
Brief description of the drawings
Fig. 1 is circuit board schematic diagram.
Embodiment
Reference：1 protective layer；2 conductive layers；3 basic units；11 first heat dissipating layers；21 second heat dissipating layers；12 first heat conduction
Piece；22 second thermally conductive sheets；13 first blind holes；23 second blind holes；4th, 5 connection sheet；4.1st, 5.1 radiating fin.
A kind of circuit board, dissipates including the first heat dissipating layer 11, protective layer 1, conductive layer 2, basic unit 3 and second successively from top to bottom
Thermosphere 21；Having in first heat dissipating layer 11 has the second through hole, the circuit in first through hole, second heat dissipating layer 21
Plate also includes multiple first blind holes 13 and multiple second blind holes 23, and openend and the first through hole of first blind hole 13 join
Logical, the blind end of first blind hole 13 is located in the protective layer, and openend and the second through hole of second blind hole 23 join
Logical, the blind end of second blind hole 23 is located in the basic unit, and heat conductive silica gel is each filled with first and second blind hole；It is described
Circuit board also includes the first thermally conductive sheet 12 and the second thermally conductive sheet 22 through second through hole through the first through hole, institute
State first and second thermally conductive sheet to connect by connection sheet 4,5, there are multiple radiating fins 4.1,5.1 in the connection sheet 4,5.It is described
Basic unit is made up of polyimide material.The conductive layer is copper foil.First and second thermally conductive sheet 12,22 is by albronze system
Into.The connection sheet and multiple radiating fins are integrally formed, and the connection sheet and multiple radiating fins are made up of albronze.Institute
The through hole that first through hole is rectangular shape is stated, and it is parallel with the protective layer.Second through hole is the logical of rectangular shape
Hole, and it is parallel with the basic unit.First and second heat dissipating layer 11,21 is insulating radiation layer.
Circuit board of the present utility model, the heat of protective layer is transferred to the first heat conduction by the heat conductive silica gel in the first blind hole
Piece, then be transferred to connection sheet and shed from radiating fin；The heat of basic unit is transferred to the second thermally conductive sheet from the silica gel in the second blind hole,
Connection sheet is transferred to again to shed from radiating fin.And the heat of protective layer can also be transferred directly to the first heat dissipating layer and give out
Go, the heat of basic unit can also be transferred directly to the second heat dissipating layer and distribute.
Although the utility model is illustrated and described with regard to preferred embodiment, those skilled in the art should manage
Solution, without departing from claim limited range of the present utility model, can to the utility model carry out various change and
Modification.
Claims (8)
1. a kind of Novel circuit board based on heat conductive silica gel, it is characterised in that include the first heat dissipating layer, protection successively from top to bottom
Layer, conductive layer, basic unit and the second heat dissipating layer；Having in first heat dissipating layer in first through hole, second heat dissipating layer has
Second through hole, the circuit board also includes multiple first blind holes and multiple second blind holes, the openend of first blind hole and institute
State first through hole UNICOM, the blind end of first blind hole is located in the protective layer, the openend of second blind hole and the
Two through hole UNICOMs, the blind end of second blind hole is located in the basic unit, and thermal conductive silicon is each filled with first and second blind hole
Glue；The circuit board also includes the first thermally conductive sheet through the first through hole and the second heat conduction through second through hole
Piece, first and second thermally conductive sheet is connected by connection sheet, has multiple radiating fins in the connection sheet.
2. the Novel circuit board according to claim 1 based on heat conductive silica gel, it is characterised in that the basic unit is sub- by polyamides
Amine material is made.
3. the Novel circuit board according to claim 1 based on heat conductive silica gel, it is characterised in that the conductive layer is copper
Paper tinsel.
4. the Novel circuit board according to claim 1 based on heat conductive silica gel, it is characterised in that first and second heat conduction
Piece is made by albronze.
5. the Novel circuit board according to claim 1 based on heat conductive silica gel, it is characterised in that the connection sheet and multiple
Radiating fin is integrally formed, and the connection sheet and multiple radiating fins are made up of albronze.
6. the Novel circuit board according to claim 1 based on heat conductive silica gel, it is characterised in that the first through hole is length
The through hole of cube shape, and it is parallel with the protective layer.
7. the Novel circuit board according to claim 1 based on heat conductive silica gel, it is characterised in that second through hole is length
The through hole of cube shape, and it is parallel with the basic unit.
8. according to the Novel circuit board based on heat conductive silica gel described in claim 1, it is characterised in that first and second heat dissipating layer
It is insulating radiation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720119022.9U CN206413252U (en) | 2017-02-08 | 2017-02-08 | A kind of Novel circuit board based on heat conductive silica gel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720119022.9U CN206413252U (en) | 2017-02-08 | 2017-02-08 | A kind of Novel circuit board based on heat conductive silica gel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206413252U true CN206413252U (en) | 2017-08-15 |
Family
ID=59558039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720119022.9U Expired - Fee Related CN206413252U (en) | 2017-02-08 | 2017-02-08 | A kind of Novel circuit board based on heat conductive silica gel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206413252U (en) |
-
2017
- 2017-02-08 CN CN201720119022.9U patent/CN206413252U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105099564B (en) | Encapsulating structure and optical module | |
| TWI544868B (en) | Heat dissipation module and assembling method thereof | |
| CN104465552A (en) | Packaging structure and optical module | |
| CN207340280U (en) | A kind of computer heat radiation system flexible circuit board | |
| CN105611804B (en) | Heat conductive pad, radiator and electronic product | |
| CN113097162A (en) | Heat dissipation sheet, chip and circuit board | |
| CN104934386A (en) | Packaging structure and optical module | |
| CN206413252U (en) | A kind of Novel circuit board based on heat conductive silica gel | |
| CN108401355A (en) | A kind of Novel circuit board based on heat conductive silica gel | |
| CN212499279U (en) | Copper-clad plate with good air permeability | |
| CN204539684U (en) | A kind of large power supply module heat dissipation structure | |
| CN106922081A (en) | A kind of single-clad board | |
| CN103928413A (en) | Cooling device | |
| CN206806361U (en) | A kind of high-heat-dispersion LED surface-mounted integrated circuit | |
| CN206365149U (en) | A kind of bent aluminium base | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN207602553U (en) | Cooling fin, chip and circuit board | |
| CN105764239B (en) | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof | |
| CN207884962U (en) | A kind of high heat conduction printed circuit board | |
| CN206413251U (en) | A kind of high efficiency and heat radiation circuit board | |
| CN207911119U (en) | Pcb board | |
| CN208708009U (en) | A kind of heat dissipation type circuit board | |
| CN205789112U (en) | Circuit board and apply the memorizer of this circuit board | |
| CN206332908U (en) | Plug-in cooling circuit board | |
| CN206742282U (en) | A kind of high-power heat-dissipation SMT copper bases |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 Termination date: 20180208 |