CN206282996U - A kind of attachment structure of printed circuit board - Google Patents
A kind of attachment structure of printed circuit board Download PDFInfo
- Publication number
- CN206282996U CN206282996U CN201621386709.0U CN201621386709U CN206282996U CN 206282996 U CN206282996 U CN 206282996U CN 201621386709 U CN201621386709 U CN 201621386709U CN 206282996 U CN206282996 U CN 206282996U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- conductive plate
- conductive
- attachment structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000005476 soldering Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621386709.0U CN206282996U (en) | 2016-12-16 | 2016-12-16 | A kind of attachment structure of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621386709.0U CN206282996U (en) | 2016-12-16 | 2016-12-16 | A kind of attachment structure of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206282996U true CN206282996U (en) | 2017-06-27 |
Family
ID=59073566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621386709.0U Expired - Fee Related CN206282996U (en) | 2016-12-16 | 2016-12-16 | A kind of attachment structure of printed circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206282996U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107689492A (en) * | 2017-07-25 | 2018-02-13 | 深圳安培龙科技股份有限公司 | A kind of electrode silver plasm encapsulating structure applied to sensor |
-
2016
- 2016-12-16 CN CN201621386709.0U patent/CN206282996U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107689492A (en) * | 2017-07-25 | 2018-02-13 | 深圳安培龙科技股份有限公司 | A kind of electrode silver plasm encapsulating structure applied to sensor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Xu Liaofeng Inventor before: Tang Qiandong Inventor before: Gao Chaojie Inventor before: Yuan Jianchun Inventor before: Xu Wei Inventor before: Xu Xingjian |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170906 Address after: 523820 Guangdong Province, Dongguan City Dalingshan Horseshoe Village champion pen Street No. 15 Patentee after: DONGGUAN YUANCHANG ELECTRONICS Co.,Ltd. Address before: 516000 Guangdong city of Huizhou province Dayawan Petrochemical Xiangshui River Industrial Park Road West No. 18 Patentee before: HUIZHOU WEIJIAN CIRCUIT BOARD INDUSTRIAL CO.,LTD. |
|
TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 523000 Vibration Road 38, Horseshoe Kong Village, Daling Shan town, Dongguan, Guangdong Patentee after: GUANGDONG YUANCHANG ELECTRONIC CO.,LTD. Address before: 523820 No. 15, Zhuang Yuan pen street, Horseshoe Village, Daling mountain town, Dongguan, Guangdong. Patentee before: DONGGUAN YUANCHANG ELECTRONICS Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170627 |
|
CF01 | Termination of patent right due to non-payment of annual fee |