CN204927337U - Luminous AC COB LED light source of full chip - Google Patents
Luminous AC COB LED light source of full chip Download PDFInfo
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- CN204927337U CN204927337U CN201520682150.5U CN201520682150U CN204927337U CN 204927337 U CN204927337 U CN 204927337U CN 201520682150 U CN201520682150 U CN 201520682150U CN 204927337 U CN204927337 U CN 204927337U
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- Prior art keywords
- led chip
- control unit
- constant
- current control
- light source
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- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000000919 ceramic Substances 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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Abstract
The utility model discloses a luminous AC COB LED light source of full chip, including the base plate, the pad circuit of printing on the dominant surface of base plate, the base plate dominant surface be provided with with a plurality of LED chips of pad circuit interconnect, install on the pad circuit with a plurality of rectifier unit that a plurality of LED chips are connected, a plurality of rectifier unit form a bridge type rectifier circuit, and set up a plurality of LED chips with be used for the control flow mistake between a plurality of rectifier unit a plurality of constant current the control unit of the electric current size in a plurality of LED chips. The utility model discloses with LED chip package on ceramic substrate, high integration reduces the thermal resistance layer, the security performance is reliable more, improve economic benefits, use the current regulator diode to prevent the influence of voltage fluctuation to the LED chip, through the luminous effect of multiunit constant current diode cluster one -tenth multistage, improved properties of product: LED's turn -on time and light efficiency, reduce the stroboscopic phenomenon.
Description
Technical field
The utility model relates to full chip light emitting ACCOBLED light source.
Background technology
LED illumination is the again revolution of incandescent lamp, fluorescent lamp back lighting light source of continuing, by universally acknowledged for being efficient illumination product most with prospects.
Present stage, have a lot of producer to help chip ACCOBLED light source technology and mainly adopt 1 section of luminescence, light efficiency is lower, THD harmonic wave >40%, power factor about 0.9, and small-power is less demanding, substantially can accept.But the LED light source doing high-power (more than 15W, as street lamp etc.) is the requirement being difficult to meet CE Safety Approval.Meanwhile, producer is in research and development by power supply and LED surface mount elements assembling all-in-one-piece alternating current LED light source, and what mainly adopt is aluminium base, and volume is comparatively large, and the scope of application is subject to a definite limitation; Use 220V high pressure, there is the potential safety hazards such as electric leakage, be equally also difficult to by CE Safety Approval.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art, the utility model provides the design of full chip light emitting ACCOBLED light source.
Full chip light emitting ACCOBLED light source, comprising:
Substrate;
Be printed on the pad circuit on the first type surface of described substrate;
Described board main is provided with multiple LED chip interconnective with described pad circuit;
Be arranged on the multiple rectification units be electrically connected with described multiple LED chip on described pad, described multiple rectification unit forms a bridge rectifier;
And the multiple constant-current control unit for controlling the size of current flow through in described multiple LED chip be arranged between described multiple LED chip and described multiple rectification unit;
Described multiple constant-current control unit is electrically connected with multiple LED chip and is arranged in described bridge rectifier and forms the luminous loop of multistage;
Described pad is provided with weld zone, L pole and weld zone, N pole, it is for carrying out with the external power source of described full chip light emitting ACCOBLED light source the electrode that is connected.
Concrete, also comprise fluorescent powder silica gel layer, described fluorescent powder silica gel layer is arranged by box dam glue and covers on described pad and described multiple LED chip;
Concrete, the section shape of described fluorescent powder silica gel layer is in the dome shape raised up;
More specifically, described pad circuit comprises many metallic traces, and described many metallic traces form electrical functionality loop.
More specifically, described multiple LED chip comprises the first LED chip group, the second LED chip group and the 3rd LED chip group.
More specifically, described multiple constant-current control unit comprises the first constant-current control unit, the second constant-current control unit, the 3rd constant-current control unit and the 4th constant-current control unit.
More specifically, the luminous loop of described multistage comprises the luminous loop of first paragraph, the luminous loop of second segment and the 3rd section of luminous loop; Described first LED chip group is connected with described first constant-current control unit, the second constant-current control unit respectively and is arranged in described bridge rectifier and forms the luminous loop of described first paragraph; Described first LED chip group the second LED chip group of connecting is connected with described first constant-current control unit, described 3rd constant-current control unit respectively and is arranged in described bridge rectifier and forms the luminous loop of described second segment; Described first LED chip group, the second LED chip group, the 3rd LED chip group series connection are connected with described first constant-current control unit, described 4th constant-current control unit and are arranged in described bridge rectifier respectively again and form described 3rd luminescence segment loop.
Preferably, be all connected by welded wire between described multiple LED chip, between described multiple LED chip with described multiple constant-current control unit.
Preferably, described substrate is ceramic substrate, and described rectification unit is rectifier diode, and described constant-current control unit is current regulator diode.
Preferred, described multiple LED chip is installed to by silicon resin adhesive or silver paste on the first type surface of described ceramic substrate; Described rectifier diode, current regulator diode are installed on the first type surface of described ceramic substrate by described silver paste.
In sum, the utility model has following beneficial effect: LED chip, by adopting ceramic substrate, is directly encapsulated on ceramic substrate, decreases thermoresistance layer by (1), makes the performance of light-emitting device more reliable and makes production process simpler; (2) series connection current regulator diode is used can effectively to prevent voltage fluctuation on the impact of LED chip; (3) by many group current regulator diode composition multistage illumination effects, improve properties of product: the ON time of power factor, LED and light efficiency, reduction stroboscopic phenomenon.
Accompanying drawing explanation
Fig. 1 is full chip light emitting ACCOBLED light-source structure schematic diagram described in the utility model.
Fig. 2 is full chip light emitting ACCOBLED light source cross-sectional view described in the utility model.
Fig. 3 is the circuit diagram of bridge rectifier described in the utility model.
Fig. 4 is embodiment second Use Case Map of full chip light emitting ACCOBLED light source described in the utility model.
Fig. 5 is embodiment the 3rd Use Case Map of full chip light emitting ACCOBLED light source described in the utility model.
Wherein: 1: substrate; 2: pad circuit; 3:LED chip; 4: rectification unit; 5: bridge rectifier; 6: constant-current control unit; Weld zone, 21:L pole; Weld zone, 22:N pole; 7: fluorescent powder silica gel layer; 8: box dam glue; 9: welded wire; 23: metallic circuit; 31: the first LED chip groups; 32: the second LED chip groups; 33: the three LED chip groups; 61: the first constant-current control unit; 62: the second constant-current control unit; 63: the three constant-current control unit; 64: the four constant-current control unit.
Embodiment
In order to allow those skilled in the art can understand the technical solution of the utility model better, below in conjunction with accompanying drawing, the utility model is further elaborated.
Shown in Fig. 1, Fig. 2, according to full chip light emitting ACCOBLED light source of the present utility model, comprising: substrate 1; Be printed on the pad circuit 2 on the first type surface of described substrate 1; Substrate 1 first type surface is provided with interconnective multiple LED chip 3 with pad circuit 2; Be arranged on the multiple rectification units 4 be electrically connected with multiple LED chip 3 on pad circuit 2, wherein, multiple rectification unit 4 forms a bridge rectifier 5; Above-mentioned full chip light emitting ACCOBLED light source also comprises the multiple constant-current control unit 6 crossing the size of current in multiple LED chip 3 for control flow check be arranged between multiple LED chip 3 and multiple rectification unit 4; Multiple constant-current control unit 6 is electrically connected with multiple LED chip 3 and is arranged in described bridge rectifier 5 and forms the luminous loop of multistage; Pad circuit 2 being also provided with weld zone, L pole 21 and weld zone, N pole 22, being connected with the external power source of weld zone, N pole 22 with described full chip light emitting ACCOBLED light source by arranging weld zone, L pole 21.
Particularly, above-mentioned full chip light emitting ACCOBLED light source also comprises fluorescent powder silica gel layer 7, and fluorescent powder silica gel layer 7 is arranged by box dam glue 8 and covers on pad circuit 2 and described multiple LED chip 3; The section shape of fluorescent powder silica gel layer 7 is in the dome shape raised up; Wherein, the main surface area of substrate 1 is greater than fluorescent powder silica gel layer setting area on substrate 1, therefore substrate 1 can not be covered completely by fluorescent powder silica gel layer 7, and the region do not covered by fluorescent powder silica gel layer 7 is provided with weld zone, L pole 21 and weld zone, N pole 22.
More specifically, above-mentioned pad circuit 2 also comprises many metallic traces 23, and many metallic traces 23 form electrical functionality loop.
As shown in Figure 3, the luminous loop of above-mentioned multistage comprises the luminous loop of first paragraph, the luminous loop of second segment and the 3rd section of luminous loop, above-mentioned multiple LED chip comprises the first LED chip group 31, second LED chip group 32 and the 3rd LED chip group 33, and above-mentioned multiple constant-current control unit 6 comprises the first constant-current control unit 61, second constant-current control unit 62, the 3rd constant-current control unit 63 and the 4th constant-current control unit 64.Wherein, connected and be arranged in bridge rectifier 5 with described first constant-current control unit 61, second constant-current control unit 62 by the first LED chip group 31 respectively and form in the luminous loop of first paragraph; Connected with the first constant-current control unit 6, the 3rd constant-current control unit 63 and be arranged in bridge rectifier 5 respectively again formed by the first LED chip group 31 the 2nd LED group 32 of connecting in the luminous loop of second segment; Connected to connect with the first constant-current control unit 61, the 4th constant-current control unit 64 and be arranged in bridge rectifier 5 respectively again by the first LED chip group 31, second LED chip group 32, the 3rd LED chip group 33 and form in 3rd section of luminous loop.
Between above-mentioned multiple LED chips 3, be all connected by welded wire 9 between multiple LED chip 3 with multiple constant-current control unit 6; Aforesaid substrate adopts ceramic substrate, and this ceramic substrate is alundum (Al2O3) (AL
2o
3) ceramic substrate, rectification unit adopts rectifier diode, and constant-current control unit adopts current regulator diode.Because adopt alundum (Al2O3) (AL
2o
3) ceramic substrate, good heat dissipation (AL
2o
3ceramic coefficient 24W/mK, aluminium base 6W/mK), withstand voltage height (AL
2o
3pottery withstand voltage 3500-4000V, aluminium base 800-1500V), use 220V absolutely safe, easily by CE Safety Approval.
The mode that in the present embodiment, multiple LED chip, rectifier diode, current regulator diode are arranged on ceramic substrate is:
Multiple LED chip is installed on the first type surface of ceramic substrate by silicon resin adhesive or silver paste; Rectifier diode, current regulator diode is also installed on the first type surface of ceramic substrate by silver paste.
Full chip light emitting ACCOBLED light source of the present utility model operationally, weld zone 21, L pole is as external power input, and LED chip uses high voltage LED chip, when the alternating voltage of input reach lying prostrate 130 more time, the luminous loop conducting of first paragraph, the first LED chip group 31 is luminous; When the alternating voltage of input reach lying prostrate 160 more time, the luminous loop conducting of second segment, the first LED chip group 31 second LED chip group 32 of connecting is luminous; When the alternating voltage of input reaches that more than 180, volt is above, 3rd section of luminous loop conducting, the first LED chip group 31, second LED chip group 32 and the 3rd LED chip group 33 are connected luminescence, thus form the luminous loop of multistage, more the illumination effect of multistage, enhances product performance.
As shown in Figure 4,5, full chip light emitting ACCOBLED light source of the present utility model can also be made into circle and annular, realize being connected with external power source respectively by weld zone, L pole and weld zone, N pole, the multistage that the change along with external alternating voltage size realizes ACCOBLED light source is luminous.
The present embodiment is more excellent execution mode of the present utility model, and the part be not described in detail all adopts known mature technology.It should be noted that; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change and are out of shape the protection range that all should belong to the claim appended by the utility model.
Claims (9)
1. full chip light emitting ACCOBLED light source, is characterized in that, comprising:
Substrate;
Be printed on the pad circuit on the first type surface of described substrate;
Described board main is provided with multiple LED chip interconnective with described pad circuit;
Be arranged on the multiple rectification units be electrically connected with described multiple LED chip on described pad circuit, described multiple rectification unit forms a bridge rectifier;
And the multiple constant-current control unit for controlling the size of current flow through in described multiple LED chip be arranged between described multiple LED chip and described multiple rectification unit;
Described multiple constant-current control unit is electrically connected with multiple LED chip and is arranged in described bridge rectifier and forms the luminous loop of multistage;
Described pad circuit is provided with weld zone, L pole and weld zone, N pole, it is for carrying out with the external power source of described full chip light emitting ACCOBLED light source the electrode that is connected.
2. full chip light emitting ACCOBLED light source according to claim 1, is characterized in that, also comprise fluorescent powder silica gel layer, and described fluorescent powder silica gel layer is arranged by box dam glue and covers on described pad circuit and described multiple LED chip;
The section shape of described fluorescent powder silica gel layer is in the dome shape raised up.
3. full chip light emitting ACCOBLED light source according to claim 1, it is characterized in that, described pad circuit comprises many metallic traces, and described many metallic traces form electrical functionality loop.
4. full chip light emitting ACCOBLED light source according to claim 1, is characterized in that, described multiple LED chip comprises the first LED chip group, the second LED chip group and the 3rd LED chip group.
5. full chip light emitting ACCOBLED light source according to claim 4, is characterized in that, described multiple constant-current control unit comprises the first constant-current control unit, the second constant-current control unit, the 3rd constant-current control unit and the 4th constant-current control unit.
6. full chip light emitting ACCOBLED light source according to claim 5, is characterized in that, the luminous loop of described multistage comprises the luminous loop of first paragraph, the luminous loop of second segment and the 3rd section of luminous loop; Described first LED chip group is connected with described first constant-current control unit, the second constant-current control unit respectively and is arranged in described bridge rectifier and forms the luminous loop of described first paragraph; Described first LED chip group the second LED core group of connecting is connected with described first constant-current control unit, described 3rd constant-current control unit respectively and is arranged in described bridge rectifier and forms the luminous loop of described second segment; Described first LED chip group, the second LED chip group, the 3rd LED chip group series connection are connected with described first constant-current control unit, described 4th constant-current control unit and are arranged in described bridge rectifier respectively again and form described 3rd section of luminous loop.
7. full chip light emitting ACCOBLED light source according to claim 6, be is characterized in that, be all connected by welded wire between described multiple LED chip, between described multiple LED chip with described multiple constant-current control unit.
8. full chip light emitting ACCOBLED light source according to claim 7, it is characterized in that, described substrate is ceramic substrate, and described rectification unit is rectifier diode, and described constant-current control unit is current regulator diode.
9. full chip light emitting ACCOBLED light source according to claim 8, it is characterized in that, described multiple LED chip is installed to by silicon resin adhesive or silver paste on the first type surface of described ceramic substrate; Described rectifier diode, current regulator diode is installed on the first type surface of described ceramic substrate by described silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520682150.5U CN204927337U (en) | 2015-09-02 | 2015-09-02 | Luminous AC COB LED light source of full chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520682150.5U CN204927337U (en) | 2015-09-02 | 2015-09-02 | Luminous AC COB LED light source of full chip |
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| Publication Number | Publication Date |
|---|---|
| CN204927337U true CN204927337U (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520682150.5U Expired - Fee Related CN204927337U (en) | 2015-09-02 | 2015-09-02 | Luminous AC COB LED light source of full chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341199A (en) * | 2019-08-23 | 2020-06-26 | Tcl集团股份有限公司 | Light source assembly, method for reducing working current of backlight module and display device |
| CN111669869A (en) * | 2019-03-06 | 2020-09-15 | 厦门赢科光电有限公司 | COB light source and LED lamps and lanterns |
-
2015
- 2015-09-02 CN CN201520682150.5U patent/CN204927337U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669869A (en) * | 2019-03-06 | 2020-09-15 | 厦门赢科光电有限公司 | COB light source and LED lamps and lanterns |
| CN111341199A (en) * | 2019-08-23 | 2020-06-26 | Tcl集团股份有限公司 | Light source assembly, method for reducing working current of backlight module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170911 Address after: 518000 Guangdong city of Shenzhen province Baoan District two road Fuyong street Junxing Fuyuan Industrial Park A2 building 3 floor Patentee after: SHENZHEN CHUANGJIADA PHOTOELECTRIC CO.,LTD. Address before: 523000, 11B Town, Guangdong Province, Changping Town, Chang Yang garden, Dongguan, three Patentee before: Luo Yujie |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 |