CN203826385U - Solid state transmitter panel - Google Patents
Solid state transmitter panel Download PDFInfo
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- CN203826385U CN203826385U CN201420061960.4U CN201420061960U CN203826385U CN 203826385 U CN203826385 U CN 203826385U CN 201420061960 U CN201420061960 U CN 201420061960U CN 203826385 U CN203826385 U CN 203826385U
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- pixel
- led
- base station
- packaging part
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
The application provides a solid state transmitter panel comprising a first submount, a second submount, optical transmitters and encapsulant parts, wherein each pixel area is provided with at least one optical transmitter, the first submount comprises an installation surface, the second submount is placed on the installation surface of the first submount, the second submount comprises a plurality of recessed parts placed on the top surface of the second submount, each recessed part limits one pixel area, and the encapsulant parts at least partially covers the optical transmitters. Through the solid state transmitter panel, flexibility is realized when each pixel is driven, and different colors of combination of light from an LED can be emitted through the solid state transmitter panel.
Description
Technical field
The utility model relates to soild state transmitter panel.
Background technology
The solid-state device that light-emitting diode (LED) is is light by electric energy conversion, light-emitting diode generally includes the one or more semi-conducting material active layers (active layer) between relative doped layer (doped layer).When bias voltage (bias) is applied to doped layer, hole and electronics are injected in active layer, and in active layer, their are recombinated and generate light.Light is launched from active layer, and launches from all surface of LED.
The result of technological progress of 10 years or longer time is that LED has the less area of coverage, and (occupy-place region, footprint), has improved emission effciency, and has reduced cost in the past.Than other reflectors, LED also has the service life of increase.For example, the service life of LED can surpass 50,000 hours, and the service life of incandescent lamp bulb is approximately 2,000 hours.LED is can also be than other light sources more durable and can consume energy still less.Because the reason of these and other, LED becomes and becomes more and more popular, and LED is used in now in the application in field of incandescent lamp, fluorescent lamp, Halogen lamp LED and other reflectors traditionally more and more.
In order to use LED chip in tradition application, well-known, LED chip is enclosed in in packaging part, protection environment and/or machinery, color are selected to provide, light is assembled, etc.LED packaging part also comprises lead-in wire (lead), contact chip (contact, contact) or the trace (trace) for LED packaging part being electrically connected to external circuit.In typical two pins shown in Fig. 1 (pin, pin) LED packaging part/member 10, single led chip 12 is arranged on reflector 13 by scolder adhesive or conductive epoxy resin.One or more wire-bonded (wire bond) are connected to lead-in wire 15A and/or 15B by the resistance contact chip of LED chip 12, and lead-in wire can be attached to reflector 13 or form with reflector is whole.Reflector 13 can be filled with sealant portion (encapsulant) material 16 and wavelength converting material, and such as phosphor, wavelength converting material can be included in whole LED chip or in sealant portion.The light of the first wavelength of being launched by LED can be absorbed by phosphor, and this phosphor can be launched the light of second wave length responsively.Then whole assembly can be closed in transparent protection resin 14, and protection resin can be molded as the shape of lens with the directed or setting by the light from LED chip 12 transmittings.
Be illustrated in the traditional LED packaging part 20 in Fig. 2, can be more suitable for generating the high power operation of more heats.In LED packaging part 20, one or more LED chips 22 are installed on the carrier such as printed circuit board (PCB) (PCB) carrier, substrate or base station (submount) 23.The solid metal reflector 24 being arranged on base station 23 reflects away from packaging part 20 around LED chip 22 and by the light of being launched by LED chip 22.Reflector 24 also provides mechanical protection to LED chip 22.Between resistance contact chip on LED chip 22 and electric trace 25A, 25B on base station 23, form one or more wire-bonded and link 21.Then LED chip 22 after installation is covered with sealant portion 26, and sealing agent portion is when providing environment and mechanical protection, also as lens to chip.Solid metal reflector 24 is typically attached to carrier by scolder or epobond epoxyn.
Fig. 3 shows another LED packaging part 30, and it comprises shell 32, and is embedded at least in part the lead frame 34 in shell 32.For installing, the surface of packaging part 30 is provided with lead frame 34.The part of lead frame 34 exposes by the chamber in shell 32, and wherein three LED36a-c are arranged on other parts that are connected to lead frame in the part of lead frame 34 by wire-bonded 38.Can use dissimilar LED36a-c, some packaging parts have the LED of red, green and blue transmitting.Packaging part 30 comprises the pin export structure with six pins 40, and lead frame is arranged such that the light of each transmitting in LED36a-c can be independently controlled by the pin 40 of tackling mutually.This allows packaging part to launch multiple color synthetic (color combination) from LED36a-c.
Different LED packaging parts, such as at those shown in Fig. 1-3, can be for indicating and display (large and little all can) is used as light source.Big screen LED base display (being often expressed as giant screen) becomes more and more common at many indoor and outdoor locations, such as in sports field, runway, concert, and in large-scale public domain, also become more and more common, such as the Times Square in New York.Use current techniques, the size of some in these displays and screen can reach 60 inches high and 60 inches wide.Along with technological progress, can expect, will develop larger screen.
These screens can comprise millions of or hundreds thousand of " pixel " or " picture element module ", and wherein each can comprise one or more LED chips or packaging part.Picture element module can be used the LED chip of high efficiency and high brightness, and this chip allows display, even while facing toward sunlight by day, be visible from relative distant place.In some signs, each pixel has independent LED chip, and picture element module have few to three or four LED(such as one red, one green and one blue), these LED allow pixels from the combined transmit of ruddiness, green glow and/or blue light, to go out the light of many different colours.Picture element module can be arranged as rectangular mesh, and this rectangular mesh can comprise hundreds thousand of LED or LED packaging part.In the display of a type, grid can be that 640 modules are wide and 480 modules are high, and wherein the size of screen depends on the actual size of picture element module.Along with the increase of pixel quantity, the complexity that interconnects of display is also increasing.This interconnects complexity can be one of capital cost of these displays, and can be one of major failure source in the manufacture process of this display and in service life.
Utility model content
The utility model provides a kind of soild state transmitter panel, comprising: a kind of soild state transmitter panel, it is characterized in that, and comprising: the first base station, comprises mounting surface; Be positioned at the second base station in the described mounting surface of described the first base station, described the second base station comprises a plurality of recesses on the top surface that is positioned at described the second base station, and described in each, recess limits a pixel region; Be arranged at least one optical transmitting set of pixel region described in each; And sealant portion, cover at least in part described at least one optical transmitting set.
Further, described the first and second base stations comprise that electricity interconnects structure, and described in each, optical transmitting set is electrically connected on described the first base station in described pixel region.
Further, described in each pixel region around three reflectors below at least: provide ruddiness reflector, the reflector of green glow is provided and the reflector of blue light is provided.
Further, described the first base station comprises PCB.
Further, described the second base station comprises PCB core.
Further, described the second base station comprises preimpregnation material.
Further, described in each, optical transmitting set is electrically connected on described the first base station by wire-bonded in described pixel region.
Further, described in each, pixel region is filled with sealant material at least in part, and described sealant material is at least in part around described optical transmitting set.
Further, described in each, pixel region has square occupy-place region.
Further, the region between described pixel region of described the second base station is black.
The beneficial effects of the utility model are, allow to have flexibility when driving each pixel so that it can launch the different colours from the combination of the light of LED.
Accompanying drawing explanation
Fig. 1 is the end view of traditional light emission diode package member;
Fig. 2 is the end view of another traditional light emission diode package member;
Fig. 3 is the plan view of another traditional light emission diode package member;
Fig. 4 is according to the plan view of LED packaging part of the present utility model execution mode;
Fig. 5 is the end view that is illustrated in the LED packaging part in Fig. 4;
Fig. 6 is another end view that is illustrated in the LED packaging part in Fig. 4;
Fig. 7 is according to the plan view of light-emitting diode display of the present utility model execution mode;
Fig. 8 shows according to the interconnective summary view between the LED in a LED packaging part of the present utility model;
Fig. 9 is according to the plan view of another execution mode of LED packaging part of the present utility model;
Figure 10 shows according to the interconnective summary view between the LED in another LED packaging part of the present utility model;
Figure 11 is according to the plan view of another execution mode of LED packaging part of the present utility model;
Figure 12 is according to the plan view of another execution mode of LED packaging part of the present utility model;
Figure 13 is according to the plan view of another execution mode of LED packaging part of the present utility model;
Figure 14 is according to the plan view of another execution mode of LED packaging part of the present utility model;
Figure 15 is according to the plan view of light-emitting diode display of the present utility model execution mode;
Figure 16 is according to the plan view of another execution mode of light-emitting diode display of the present utility model;
Figure 17 is according to the perspective view of another execution mode of LED packaging part of the present utility model;
Figure 18 is the plan view that is illustrated in the LED packaging part in Figure 17, wherein not at LED shown in pixel;
Figure 19 is the plan view of in the pixel in the LED packaging part of Figure 17 and Figure 18;
Figure 20 is that the LED packaging part shown in Figure 17 and Figure 18 is along the end view of section line 20-20 intercepting;
Figure 21 is the bottom view of the LED packaging part shown in Figure 17 and Figure 18;
Figure 22 is the end perspective view of the LED packaging part shown in Figure 17 and Figure 18;
Figure 23 is another bottom view of the LED packaging part shown in Figure 17 and Figure 18, wherein has a pin numbering and arranges;
Figure 24 is according to the summary view of the execution mode of a pin appointment in LED packaging part of the present utility model execution mode;
Figure 25 shows according to the utility model and utilizes in the LED packaging part of the pin appointment shown in Figure 24 interconnective summary view between LED;
Figure 26 is according to the plan view of another execution mode of light-emitting diode display of the present utility model; And
Figure 27 is according to the plan view of another execution mode of light-emitting diode display of the present utility model.
Figure 28 a-28d shows for the manufacture of according to the method for the reflector panel of execution mode of the present utility model.
Figure 29 is according to the top plan view of the reflector panel of execution mode of the present utility model.
Figure 30 is the viewgraph of cross-section of the face mask/base station combination according to execution mode of the present utility model.
Figure 31 is according to the perspective view of the reflector panel of execution mode of the present utility model.
Figure 32 is according to the top plan view of the reflector panel of execution mode of the present utility model.
Figure 33 is the top plan view according to the transmitter module of execution mode of the present utility model.
Figure 34 is the top plan view according to the pixel of execution mode of the present utility model.
Figure 35 is according to the viewgraph of cross-section of the transmitter module of execution mode of the present utility model.
Figure 36 a-36d shows for the manufacture of according to the method for the optical transmitting set panel of execution mode of the present utility model.
Figure 37 shows according to the viewgraph of cross-section of the transmitter module during the intermediate fabrication steps of execution mode of the present utility model.
Figure 38 shows according to the viewgraph of cross-section of the transmitter module during the intermediate fabrication steps of execution mode of the present utility model.
Figure 39 shows according to the viewgraph of cross-section of the transmitter module during the intermediate fabrication steps of execution mode of the present utility model.
Figure 40 a-40c shows and manufactures according to the method for the reflector panel of execution mode of the present utility model.
Figure 41 a-41d shows and manufactures according to the method for the reflector panel of execution mode of the present utility model.
Embodiment
The light-emitting diode display that the utility model relates to improved LED packaging part and utilizes this LED packaging part, and comprise " many pixels " packaging part according to LED packaging part of the present utility model.That is to say, this packaging part comprises more than one pixel, and each in pixel comprises one or more light-emitting diodes.Different execution modes comprises for the signal of telecommunication being applied to the different characteristic of the LED of pixel.In some embodiments, the corresponding signal of telecommunication can be applied to each in pixel, to control their transmitting color and/or intensity, and in other embodiments, can be by same electrical signal controlling in two or more pixels.In pixel, have in the execution mode of a plurality of LED, one or more in the LED in each pixel can be by signal controlling separately, and the LED in different pixels can be controlled by same signal in other embodiments.In some in these execution modes, can control with same signal the transmitting of two or more pixels, and each in pixel can be by signal controlling separately in other embodiments.
In some embodiments, term pixel is understood with its general sense, is interpreted as the element of image, and processed and control respectively in display system.In some of these execution modes, all pixels or some pixels can comprise redness, green and blue-light-emitting LED, and the intensity that at least some in pixel are arranged to each LED for allowing in pixel can be controlled.This color that allows the light of each pixel transmitting is the combination of red, green and blue light, and allows to have flexibility when driving each pixel so that it can launch the different colours from the combination of the light of LED.
In other embodiments, packaging part can comprise can launch monochromatic pixel, and these packaging parts are used in different application simultaneously, such as illumination or back lighting.In some of these execution modes, pixel can transmitting white and can be comprised at least one blue led with one or more phosphors, and the white light combination of LED transmitting blue light and phosphor light.In these execution modes, different other can allow to control each LED in each pixel, and LED can be driven by identical drive signals in other embodiments.In some embodiments, pixel can comprise one or more white emission diodes of being combined with red emission diode, to reach the transmitting of expectation pixel, such as expectation colour temperature.In other embodiments, the transmitting of the LED in pixel can controlledly be made, so that pixel is transmitted in the different-colour in colour temperature spectrum from cold to warm.
According to packaging part of the present utility model, a lot of different shape and sizes can be comprised, and the pixel of varying number can be arranged.In some embodiments, packaging part can be square, and can have 2 and take advantage of 2,4 to take advantage of 4,8 pixels of taking advantage of the forms such as 8.In other execution mode, packaging part can be rectangle, and than the pixel in another direction, can have in one direction pixel still less.For example, packaging part can have 2 and take advantage of 3,4,5,6 etc., 3 to take advantage of 4,5,6,7 etc., or 4 take advantage of 4,5,6,7,8 etc. pixel format.In other execution mode, pixel can be the linear array of pixel 2,3,4,5 equal lengths.These are only some in the shape of packaging part, and other packaging part is leg-of-mutton, circular or irregular shape simultaneously.
Some advantages that are better than prior art list pixel packaging part are provided according to LED packaging part of the present utility model.By reducing the material cost such as blaster fuse frame material, LED packaging part can cause every pixel cost lower.Spacing between neighbor also can reduce, and keeps youth primary (lambertian) beam profile simultaneously.By reducing the spacing between pixel, can manufacture more high-resolution display.By reducing cost of disposal and picking up assembly and placing modules cost, display manufacturing cost also can reduce.The interconnective complexity of pixel also can reduce, and has therefore reduced material cost and display manufacturing level.This also may out of order potential interconnecting in the whole life-span at display by having reduced.
The utility model can relate to many different packaging part types, and wherein some execution modes are below surface-mount devices.Be understandable that, the utility model also can be used together with other packaging part types (such as the packaging part having for the pin of through hole mounting process).
According to LED packaging part of the present utility model, can be used in LED sign and display, but be understandable that, they can be used in a lot of different application.LED packaging part can be compatible from different industrial standards, and they are suitable for use in LED substrate sign, grooved luminescent characters (channel letter lighting) or common back lighting and illumination application.Some execution modes can comprise flat top emitting surface, and they are compatible with can coordinate with fluorescent tube.These are only according to the sub-fraction in many different application of LED packaging part of the present utility model.
According to LED packaging part of the present utility model, single LED chip or many LED chips can be comprised, and the reflector around one or more LED chips can be comprised.Upper surface around the shell of each reflector can comprise the material that forms contrast with the light of being launched by LED chip.Be exposed to the part of the shell in cup, and/or the reflecting surface in cup can comprise that reflection is from the material of the light of LED chip.In some in these execution modes, from the light of LED chip transmitting, can be the light of white light or other wavelength change, and the surface of the base station in reflector and the reflecting surface of cup can be white or can otherwise launch the light of white light or wavelength change.The contrast upper surface of reflector can be multiple different colours, but is black in some embodiments.
With reference to specific implementations, described the utility model herein, but be understandable that, the utility model can be with multiple multi-form enforcement, and should not be construed as and be limited to the execution mode of setting forth herein.Especially, multiple different LED chip, reflector and lead frame setting outside the above those can be provided, and sealant portion can provide further feature, with reliability and the emission characteristics that improves LED packaging part and utilize the display of this LED packaging part.Although the different execution modes of LED packaging part discussed herein are used in light-emitting diode display, LED packaging part also can be used in many different illuminations application.
Be understandable that, when the element such as layer, region or substrate be represented as be positioned at another element " on " time, it can be to be directly positioned on another element, or also can have medium element.In addition, relativeness term, such as " top " and " below ", and similar term, can be used for describing the relation in a layer or another region herein.Be understandable that, the difference that these terms are intended to also comprise the orientation of describing in figure is directed.
Although first, second grade of term can be for describing various elements, member, region, layer and/or part herein, these elements, member, region, layer and/or part should not limited by these terms.These terms are only for distinguishing an element, member, region, layer or part and another region, layer or part.Therefore the first element discussed below, the first member, first area, ground floor or first, also can be called as the second element, second component, second area, the second layer or second portion, and not deviate from instruction of the present utility model.
The viewgraph of cross-section schematic diagram of execution mode reference of the present utility model described herein is the summary schematic diagram of execution mode of the present utility model.Therefore, the actual (real) thickness of layer can be different, and can be expected that, for example, due to manufacturing technology and/or tolerance that produce with variation schematic diagram shape.Execution mode of the present utility model should not be understood to be limited to the given shape in region shown here, but should comprise, for example, by manufacture, caused in deviation in shape.Due to normal manufacturing tolerance, be illustrated as or be described as the region of square or rectangle, will typically there is feature rounding or arc.Therefore, region shown in the figure is summary in essence, and their shape is not intended to the accurate shape in the region of tracing device, and is not intended to limit scope of the present utility model.
Fig. 4-7 show an execution mode according to many pixels emitter package part 50 of the present utility model, and Fig. 7 illustrates in greater detail the pixel reflector can be used on according in execution modes more of the present utility model.Packaging part comprises that being arranged as 2 takes advantage of 2 form or four pixel 52a-d of layout, and packaging part 50 has the foursquare area of coverage substantially.Packaging part 50 can comprise the feature for different installation methods, and shown execution mode has the feature that allows surface to install.That is to say, packaging part 50 comprises the surface-mount devices (SMD) with pin and lead frame structure, pin and lead frame structure have and are arranged to use surface mounting technology, and packaging part can be arranged on the structural pin output such as printed circuit board (PCB) (PCB).As mentioned above, be understandable that, the utility model also can be applied to other emitter package part types outside SMD, such as pin is installed emitter package part.Packaging part 50 comprises shell or the base station 54 that is carrying integral lead frame 56.Lead frame 56 comprise for by electrical signal conduction to the optical transmitting set of packaging part and also a plurality of conductive connection parts of the auxiliary heat that generated by reflector of dissipating divide.
Shell or base station (" shell ") 54 can be formed or by being combined to form of material by multiple different materials, and can have different materials in different piece.Receptible sheathing material is an electric insulation, such as dielectric material.Shell 54 can comprise, comprises at least in part the ceramic material such as aluminium oxide, aluminium nitride, carborundum, or such as the polymeric material of polyamide and polyester.In some embodiments, shell 54 can comprise the dielectric material with relative high-termal conductivity, such as aluminium nitride and aluminium oxide.In other embodiments, base station 54 can comprise printed circuit board (PCB) (PCB), sapphire or silicon or any other applicable material, such as the T-Clad heat that can obtain from the Bei Gesi company (The Bergquist Company of Chanhassen) of the kind Haas of Minnesota covers insulated substrate material.For PCB execution mode, can use different PCB types, such as the printed circuit board (PCB) of standard FR-4 type PCB, metal-cored PCB or any other type.
Lead frame 56 can be used in different packaging part execution modes with multitude of different ways layout and multiple varying number part.Pixel can have identical one or more reflectors, and such as LED, and in some embodiments, different pixels can have the LED of varying number.As best visible in Fig. 7, packaging part 50 can comprise three LED58a-c of every pixel, and lead frame 56 is arranged to for the signal of telecommunication is applied to LED58a-c in the embodiment shown.Lead frame 56 for example comprises, for the signal of telecommunication (, PCB) is conducted to the conductive pieces of LED58a-c from packaging part mounting surface.Lead frame can also comprise and is used to LED to provide steadiness is installed and is used to the heat of dissipation reflector that the feature in auxiliary heat path is provided.Lead frame can also comprise the physical features such as hole, cavern part etc., to improve stability and the reliability of packaging part, and in some embodiments for helping the waterproof sealing between retaining member.In the U.S. Patent Application Serial Number the 13/192nd of authorizing people such as old (Chan), No. 293, exercise question are for having described these different characteristics in " water-proof surface erecting device packaging part (Water Resistant Surface Mount Device Package) ", and this application is contained in this by quoting as proof by integral body.
The manufacture of lead frame 56 can complete by punching press, injection mo(u)lding, cutting, etching, bending or the combination by other known methods and/or method, to reach expectation structure.For example, conductive pieces can by the metal stamping partly side by side punching press of veneer of associated metal (for example by), suitably bending and fully separated or all or part of shaping of shell after fully separation manufacture.
Lead frame 56 can be made by conducting metal or metal alloy, such as being made by copper, copper alloy and/or the material of other applicable low-resistance anti-corrosions erosion or the combination of material.It should be noted, the thermal conductivity of lead-in wire is auxiliary to a certain extent dissipates the heat conduction from LED58a-c.
Shell 54 can have multiple different shape and size, and is cardinal principle square or rectangle in the illustrated embodiment, and shell has upper surface 60 and lower surface 62(optimal visibility in Fig. 5 and Fig. 6), and the first side surface 64 and the second side surface 66.The top of shell is divided and is further comprised groove or chamber 72, and this groove or chamber start to extend from upper surface 60, enter the main body of shell 54 and arrive lead frame 56.The LED58a-c of each pixel is arranged on the lead frame 56 in a corresponding chamber 72, and the light that comes from LED is launched through chamber 72 from packaging part 50.Each chamber 72 can have angled side surface, and this side surface has formed the reflector light reflecting with help around the reflector of LED58a-c and left from packaging part 50.In some embodiments, reflection insert or ring (not shown) can be along chamber being positioned at least partly and being fixed of 72 side surface 74.The reflectivity effect of this ring and the emission angle of packaging part can be by chamber 72 tapers are strengthened, and this ring upcountry towards the inside of shell and carried in the enclosure.Be only exemplary mode, the reflector angles that is about 50 degree provides applicable reflectivity and viewing angle.
In some embodiments, chamber 72 can use packing material (or sealant portion) to fill at least in part, and this packing material can be protected lead frame 56 and LED58a-c and make the position stability of what LED of lead frame.In some embodiments, packing material can cover the part that reflector and lead frame 56 expose by chamber 72.Packing material can be chosen as and there is predetermined optical characteristics to strengthen the projection from the light of LED, and in some embodiments, the only substantial transparent that packing material is launched for the reflector by packaging part.Packing material can also be flat, makes it have the level height roughly the same with upper surface 60, or it can be shaped as lens, such as hemisphere or bullet shaped.Alternately, packing material can be recessed in one or more chambeies 72 fully or partly.Packing material can be made by the combination of resin, epoxy resin, thermoplastics type's condensation polymer, glass and/or other applicable materials or material.In some embodiments, can by Material Addition in packing material to strengthen transmitting from light to LED, absorption and/or propagation and/or from transmitting, absorption and/or the propagation of the light of LED.
Shell 54 can be by preferably electric insulation and heat conducting material are made.Such material is well known in the art, and can comprise (but nonrestrictive) some pottery, resin, epoxy resin, thermoplastic plastic, condensation polymer (for example, polyphthalamide (PPA)) and glass.Packaging part 50 and its shell 54 can be by any one formation and/or assemblings in multiple known method well known in the art.For example, shell 54 can, such as by injection mo(u)lding, around lead frame, form or molded.Alternately, shell can form in the mode of part, for example, in the mode of top section and base section, forms, and wherein on base section, is formed with conductive pieces.Then top section and base section are used known method and material to be bonded together, such as using epoxy resin, adhesive or other applicable connecting materials to be bonded together.
According to packaging part of the present utility model, can use multiple different reflector, packaging part 50 utilizes LED58a-c.Different execution modes can have the different LED chip of the light of transmitting different colours, and in the embodiment shown, each pixel in packaging part 50 comprises redness, green and blue emission LED chip, and this chip can produce the blend color transmitting of the multiple different wave length that comprises white light.
LED chip structure, feature and their manufacture and operation are known and only briefly discuss at this substantially in the art.LED chip can have the many different semiconductor layers of arranging by different way, and can launch different colours.The layer of LED chip can be used already known processes manufacture, and suitable technique can be the manufacturing process of metal organic chemical vapor deposition (MOVCD).The layer of LED chip comprises substantially and is clipped in the first relative doped epitaxial layer and the active layer/region between the second doped epitaxial layer, and it is all formed on growth substrate or growth wafer successively.The LED chip being formed on wafer can be monolithic, and is used in different application, such as being arranged in packaging part.Be understandable that, growth substrate/wafer can remain the part of final one chip LED chip, or growth substrate can completely or partially be removed.
Will also be appreciated that extra play and add ons also can be included in LED chip, include but not limited to, buffer, nucleus (nucleation), contact chip and current distribution layer and light are extracted layer and element out.Active region can comprise single quantum well (SQW), multiple quantum well (MQW), double-heterostructure or superlattice structure.
Active region and doped layer can be made by different materials system, such system WeiⅢ family (Group-III) nitride based materials system.III group-III nitride refers to those semiconducting compounds that form between these III family elements (being generally aluminium (Al), gallium (Ga), indium (In)) in nitrogen and the periodic table of elements.These terms also refer to ternary compound or quaternary compound, such as aluminum gallium nitride (AlInGaN) and indium gallium nitride aluminium (AlInGaN).In a preferred embodiment, doped layer is that gallium nitride (GaN) and active region are InGaN.In interchangeable execution mode, doped layer can be AlGaN, aluminum gallium arsenide (AlGaAs) or phosphorus InGaAsP aluminium (AlGaInAsP) or InGaP aluminium (AlInGaP) or zinc oxide (ZnO).
Growth substrate/wafer can be made by many materials such as silicon, glass, sapphire, carborundum, aluminium nitride (AlN), gallium nitride (GaN), applicable substrate can be 4H type carborundum, although also can use the carborundum type that comprises that 3C type, 6H type and 15R are many types of.Carborundum has some advantage, such as more mate the lattice more closely of III group-III nitride than sapphire, and can make III group-III nitride film have higher quality.Carborundum also has very high heat conductivity, makes the gross output of the III group-III nitride device on carborundum not be subject to the dissipation of heat of substrate to limit (as some are formed on the contingent situation of device on sapphire).SiC substrate can obtain from Ke Li (Cree) research institute of the Durham (Durham) in New York, and the method for manufacturing them is set forth in scientific literature Re.34, on 861, and at United States Patent (USP) the 4.946th, No. 547 and the 5th, sets forth in 200, No. 022.LED can also comprise supplementary features, and such as conductive profile structure and current distribution layer, all these can use known method to be formed by known materials deposition.
By conductivity and heat conducting jointing material (such as scolder, adhesive, coating, film, sealant portion, lotion, grease and/or other applicable materials), LED58a-c can be mounted to and be electrically coupled to lead frame 56.In a preferred embodiment, use the welded gasket on LED bottom, LED can be electrically coupled to and be fixed to their pads separately, makes scolder invisible from top.Wire-bonded 74(is illustrated in Fig. 7) can be included between LED58a-c and lead frame 56 and extend.
Different execution mode of the present utility model can have can depend on that the differing needles output of different factors arranges, and described factor is such as the quantity of LED, LED's interconnects and each degree of separation and the independent construction quality of each and/or the LED in pixel in pixel.Fig. 7 shows packaging part 50, and this packaging part has 8 pins 76 in its pin export structure, and according to the execution mode that interconnects structure 80 of the present utility model, can utilize the pin output of 8 pins shown in Fig. 8.Interconnect structure 80 and show four pixel 52a-d, each comprises three LED58a-c, and the electrical connection between LED58a-c can be provided by the lead frame 56 and/or the wire-bonded 74 that are illustrated in Fig. 7.The signal of telecommunication on pin V1 and V2 provides energy with driving LED, and V1 drives the first pixel 52a and the 3rd pixel 52c and V2 to drive other two pixel 52b, 52d.Signal of telecommunication R1, G1 on pin and B1 control the transmitting of the LED58a-c in the first two pixel 52a, 52b, and synchronous signal R2, G2 and B2 control the transmitting of the LED58a-c in latter two pixel 52c, 52d.This arranges the dynamic control that allows pixel 52a-d, and each pixel is controlled by driving and control signal combination separately.In illustrated embodiment, V1, R1, G1 and B1 control the transmitting of the first pixel 52a, and V1, R2, G2 and B2 control the transmitting of the 3rd pixel 52c.Similarly, V2, R1, G1 and B1 control the transmitting of the second pixel 52b, and V2, R2, G2 and B2 control the transmitting of the 4th pixel 52d.
Be understandable that, different packaging parts can have the pin of varying number aspect their pin export structure, and pixel and LED can be interconnected in a different manner by different lead frame structure and wire-bonded.Fig. 9 shows another execution mode according to LED packaging part 100 of the present utility model, and it also has four pixel 102a-d that take advantage of 2 layouts with 2.Packaging part further comprises shell 104 and lead frame 106, and wherein each can be with same procedure described above and material manufacture.Each in pixel 102a-d also can comprise one or more LED, and to described above those are similar, the execution mode illustrating has three LED108a-c.Packaging part 100 also comprises wire-bonded 110, so that being electrically connected between lead frame 106 and LED108a-c in pixel 102a-d to be provided.
Packaging part 100 also includes the pin export structure of 16 pins 112, Figure 10 shows a kind of execution mode that interconnects structure 120 according to of the present utility model, this execution mode can with there is the structure of 16 pins 112 and be combined with as four pixels in Fig. 9 execution mode.Interconnecting structure 120 is provided by lead frame 106 and wire-bonded 110, and allows the discrete control of pixel 102a-d.That is to say, each in pixel 102a-d have it for the pin of power signal is separately provided, and for the pin group separately of control of LED108a-c transmitting aspect of its pixel is provided.For pixel 102a, it is upper that power signal can be provided in pin V11, and the signal of controlling the transmitting of LED108a-c provides on pin R11, G11 and B11.For pixel 102b, power provides on pin V12, and LED controls and provides on pin R12, G12 and B12.By V22, R22, G22 and B22, power and control provide in the same manner to pixel 102c, and by V21, R21, G21 and B21, power and control provide to pixel 102d.Than packaging part 50 described above, this set needs more pin 112, but allows to control respectively each the transmitting in pixel 102a-d.These are only and to interconnect two in structure by the multiple differing needles export structure providing according to packaging part of the present utility model.
As discussed above, according to packaging part of the present utility model, can be provided with except those the 2 multiple different matrix layout taken advantage of 2 layouts shown in packaging part 50 and packaging part 100.Figure 11 shows has another execution mode of taking advantage of the packaging part 130 of six pixel 132a-f that 3 matrix layout arrange with 2.Figure 12 shows has another execution mode of taking advantage of the packaging part 140 of eight pixel 142a-h that 4 matrix layout arrange with 2.Each in packaging part 130,140 comprises shell, has and those similar lead frames described above, pin and wire-bonded, but is arranged to for holding the pixel of greater number.Each pixel can comprise the LED of varying number, and each pixel illustrating has three LED as previously discussed.
According to LED packaging part of the present utility model, also can arrange with array or linear placement.Figure 13 show have with 2 take advantage of two pixel 152a-b that 1 linear format arranges according to another execution mode of LED packaging part 150 of the present utility model.Figure 14 show have with 4 take advantage of four pixel 162a-d that 1 linear format arranges according to another execution mode of LED packaging part 160 of the present utility model.Each in packaging part also comprises above-described shell, lead frame, pin and wire-bonded, and each pixel can comprise LED as previously discussed.
Above-described a plurality of LED packaging part can be installed together to form display, and the display of different sizes has the packaging part of varying number.Figure 15 shows has 16 above-described 2 parts of taking advantage of the display 170 of 2 LED packaging part 50, is surface mounted to display pannel 172.Packaging part 50 has eight pins 76 and display pannel 172 can have the dynamic driving that interconnects to allow the pixel 52a-d in above-described each packaging part 50.Panel can comprise the multiple different structure arranging with many different modes, and an execution mode comprises the printed circuit board (PCB) (PCB) with conductive trace at least in part, and packaging part and the trace that install on surface electrically contact.Be understandable that, typical displays can have more packaging part to form display, and some displays have enough packaging parts so that hundreds thousand of pixels to be provided.
Above-described other packaging parts can similarly be arranged in display.Figure 16 shows has 16 above-described 2 another part of taking advantage of the display 180 of 2 LED packaging part 100, is surface mounted to display pannel 182.These packaging parts have 16 pins, and display pannel 182 can comprise the above-described discrete driving that interconnects to allow pixel 102a-d.Panel 182 can comprise the printed circuit board (PCB) (PCB) with conductive trace at least in part, and complete display also can have very many packaging parts 100.
By arrange a plurality of pixels on single package, pixel can be set to (i.e. nearer spacing) closer proximity to each other, and this will make light-emitting diode display have higher resolution.Meanwhile, than using single pixel LED packaging part, many pixels packaging part allows to reduce the complexity in light-emitting diode display.In some embodiments, LED packaging part can have the spacing of scope in 0.5 to 3.0 millimeter, and spacing can be in the scope of 1.0 to 2.0 millimeters in other embodiments.In other execution mode, the spacing between pixel can be about 1.5 millimeters.
The quantity that depends on the pixel in packaging part, packaging part can also have the area of coverage of different sizes.Take advantage of 2 LED packaging part 50,100 for above-described 2, the area of coverage can be square or rectangle, and the side that some execution modes have (side, the length of side) is in the scope of 2 to 6 millimeters.In other embodiments, side can be in the scope of 3 to 5 millimeters.At some substantially in foursquare execution mode, side can be in the scope of 3 to 4 millimeters, and at some substantially in the execution mode of rectangle, and side can be in the scope of 3-4 millimeter and another side can be in the scope of 4-5 millimeter.Be understandable that, these are only according to some in the size of LED packaging part of the present utility model, thus these sizes can increase with packaging part in the pixel quantity that increases proportional.
According to the different execution modes of LED packaging part of the present utility model, can comprise and be greater than above-described 2 matrix layout of taking advantage of 2 matrix layout, comprise that 4 take advantage of 4,5 to take advantage of 5,6 to take advantage of 6 etc.Figure 17-22 show have with 4 take advantage of 16 pixels 202 that 4 matrix layout arrange according to another execution mode of LED packaging part 200 of the present utility model.Packaging part 200, has shell 204, lead frame 206 and the wire-bonded 208 by above-described those same materials, by same process, made.Each pixel can comprise one or more LED, and the execution mode illustrating has the pixel that comprises those three similar LED to the above.
The different execution modes of packaging part 200 can have lead frame, and described lead frame has the pin of varying number, and lead frame and wire-bonded interconnect LED by different way.In the execution mode illustrating, lead frame 206 comprises the pin export structure with 20 pins 210, as best illustrating in Figure 21 and Figure 22.Pin 210 extends from the side surface of packaging part, and is installed with the surface of providing convenience by bending to the below of shell 204, such as being surface mounted to display pannel.The basal surface of packaging part 200 also can comprise can the picked and a plurality of polarity indicators of place machine for packaging part is installed with correct orientation.With reference now to Figure 21,, the polarity indicator 212 of "+" shape is arranged on the corner of packaging part 200, but is understandable that, polarity indicator can be multiple different shape, and can be placed on a plurality of different positions.For example, Figure 22 is arranged on the different corner of packaging part 200 by triangle polarity indicator 214.
With reference to Figure 23,20 pins 210 are numbered as 1-20 around the periphery of packaging part.Figure 24 shows the function of being implemented by the signal of telecommunication being arranged on different pin 210.Pin 1-4 is designated as R1P, R2P, R3P and R4P, and each provides power to the red LED in four pixels.Pin 12-15 is designated as GB1P, GB2P, GB3P and GB4P, and each provides power to green LED and blue led in four pixels.Pin 5-8 is designated as R1, R2, R3 and R4, and each is controlling the transmitting of four red LED in pixel.Similarly, pin 9-11 and 16 is designated as G1, G2, G3 and G4, and each is controlling the transmitting of four green LED in pixel.Finally, pin 17-20 is designated as B1, B2, B3 and B4, and each is controlling the transmitting of four blue leds in pixel.
Figure 25 shows when utilizing the pin output specific mode be illustrated in Figure 24, between the LED in different pixels, interconnects an execution mode of 240.Be applied to pin 1-4(R1P-R4P) each signal of telecommunication, the red LED 208a of each that all power is applied to pixel 202 in voluntarily, and be applied to the transmitting of the red LED 208a in the row of signal controlling pixel 202 of pin 5-8.This row and column arranges the transmitting that allows to control single red LED.For example, the second row and can be by being applied to pin 2(R2P in the transmitting of the red LED R8 of secondary series) and pin 6(R2) the signal of telecommunication control.
Can use similar step to control the luminous of green LED 208b and blue led 208c.Be applied to pin 12-15(GB1P-GB4P) the signal of telecommunication power is applied to green LED 208b and the blue led 208c in the row separately of pixel 202.Be applied to pin 9-11 and pin 16(G1-G4) the row separately of signal controlling pixel 202 in the transmitting of green LED 208b, and be applied to pin 17-20(B1-B4) the row separately of signal controlling pixel 202 in the transmitting of blue led 208c.This row and column arranges and allows to control single green and blue transmitting.For example, in pixel the second row and can be by being applied to pin 14(GB2P in the transmitting of the green LED G8 of secondary series) and pin 10(G2) the signal of telecommunication control.In pixel the second row and can be by being also applied to pin 14(GB2P in the transmitting of the blue led B8 of secondary series) and pin 18(B2) the signal of telecommunication control.It is this that to interconnect setting be to be only used in a kind of according in multiple setting the in embodiment of the present utility model.
Owing to using packaging part described above, a plurality of 4 take advantage of 4LED packaging part can install together to form display, and wherein the display of different size has the packaging part of varying number.Figure 26 shows the execution mode of a part for display 300 or display, and a part for this display or display has 60 4 takes advantage of 4 packaging parts 200, with 6, takes advantage of 10 layout to be mounted to display pannel 302.Display pannel 302 can comprise for the interconnecting of the pin export structure of 20 pins of packaging part 200, to allow the driving of pixel 202.Display pannel 302 can comprise a plurality of different structures of arranging with a plurality of different modes, and wherein an execution mode is at least part of comprises the printed circuit board (PCB) (PCB) with conductive trace, and wherein package surface is mounted to trace and is electrically connected to.
Figure 27 shows another execution mode of display 350, and this display has 70 4 and takes advantage of 4LED packaging part, with 6, takes advantage of 12 layout to be arranged on display floater 352.Panel 352 can comprise for the interconnecting of the pin export structure of 20 pins of packaging part 200, to allow the driving of pixel 202.Understand, typical display will have more packaging part to form display, and some of them display has enough packaging parts so that hundreds thousand of pixels to be provided.
Referring again to Figure 17, packaging part 200 can be arranged so that the upper surface of shell 204 has a kind of color, and this color forms contrast with the color of the light sending from packaging part 200 by groove/cavity 211.In most cases, the light sending from cavity 211 can comprise the combination of the light sending by LED208a to 208c.In some embodiments, the upper surface that LED can send white light and shell can comprise a kind of color that forms contrast with white light.Multiple different colours such as blue, brown, grey, redness, green, purple etc. can be used, and the execution mode illustrating has black on surface thereon.Black colorant can be used multiple different known method to be employed.This black colorant can be employed in the molding process of shell 204, or the subsequent step place in packaging part manufacturing process uses diverse ways such as screen printing, Ink Jet Printing, japanning to be employed.The LED surperficial with contrast authorizing the people's such as Chen the U.S. Patent application series the 12/875th that is entitled as " with the surperficial LED packaging part (LED Package With Contrasting Face) of contrast ", in No. 873, be described, the whole content of this application is incorporated into this by quoting as proof.
Figure 28 a to Figure 28 d shows the manufacture method of reflector panel.In Figure 28 a and Figure 28 b, barrier (barrier) 402 is used adhesives 406 to be fixed in base station (submount) 404, make like this barrier 402 on base station 404 or on.Because material is added into base station 404, with adding technology (additive process, additive process, additive color process), set up this pixel region array.Barrier 402 is aligned on base station 404 to limit a plurality of chambeies as pixel region 408, and then, as shown in Figure 28 c, at least one optical transmitting set 410 is installed in each pixel region 408 in mounting surface 411.In this embodiment, mono-of 3 LED(red, one green and one blue) in pixel region 408, be mounted to mounting surface 411.Finally, in Figure 28 d, the chamber of barrier 402 is filled with material so that sealant portion 412 to be provided, and sealing agent portion covers the reflector 410 in pixel region 408 at least in part.In this embodiment, barrier 402 is mounted in the mask (mask) in the mounting surface of base station 404.Mask can be manufactured by multiple different material, for example, comprise PPA and PCB.In another embodiment, barrier 402 can be formed by the molded sealant portion that is fixed to base station mounting surface 411.In another execution mode, barrier 402 can form by form recess in base station, make like this mounting surface be absorbed in base station and barrier on mounting surface.
Figure 29 is the top view that can be incorporated into the mask 500 of reflector panel.Mask 500 has the square hole in incision mask, and this square hole will limit pixel region when mask 500 is fixed to base station.Square hole is because square hole provides the window of maximum space efficiency for pixel by use.In some embodiments, use drill bit to produce hole in the situation that, the corner in hole can be rounding.In this special execution mode, mask 500 comprises that 4 take advantage of 6 of 4 basic module 502 to take advantage of 4 array, amounts to 384 pixel aperture.Understand, can use more or less basic module to provide in the array sizes that needs and array non-4 to take advantage of 4 basic module can be used equally.As shown in this article, PPA is a kind of suitable material that can be used to manufacture mask 500.Other materials such as polyester can be used equally.Mask 400 can be manufactured with multiple distinct methods, for example, such as molded, punching press or boring.Material and manufacture method should be selected to provide mask 500, this mask by can not being out of shape, having good thermal stability, stick to silicone/epoxy fully, there is the thermal coefficient of expansion similar to the base station that will be fixed to (CTE), with the good hardness of rational elongation and non-smooth surface preferably.
Again with reference to Figure 28, barrier 402(mask, in this embodiment) useful binders is attached to base station 404.In one embodiment, can use liquid phase glue.Paraffin paper (stencil, masterplate) can be employed and use in conjunction with controlled high-viscosity glue.It is same possible using various Writing methods (writing method) to apply glue.In other embodiments, solid phase glue can be suitable.In this situation, can make glue form solid-state grid (shape of coupling barrier 402) to be applied to the mounting surface 411 of base station 404 with process for stamping.Solid-state glue can be shaped at one time with barrier equally, has reduced process time and has improved alignment (alignment).Multiple different glue will be satisfied the demand, suitable glue will fully stick to barrier 402 and base station 404 both and after solidifying, will minimally ooze out.Preferably, glue will have good heat/UV stable.In some embodiments, it is favourable with solid-state glue, using b grading technology (b-staging process).Thereby B classification is well known in the art and describes the technique of utilizing heat or ultraviolet light to allow structure to be graded from adhesive removing solvent.In other words, adhesive application, assembling, and solidify between, mask barrier 402 and base station 404 can be held a period of time and need not complete at once all manufacturing steps.For example, this will allow the distortion immediately of product to transport or to assemble in various positions.Room temperature vulcanization in this technique (RTV) material can be used as adhesive.
Figure 30 is the viewgraph of cross-section of another execution mode of barrier/base station combination 600, and wherein barrier has been the second base station 604 of mask functions.In some embodiments, the first and second base stations can with by the second base station being mounted to together with the barrier that the first base station produces, use.Here pcb board is used to the first base station 602, wherein top surface or PCB core 606 or prepreg 608.Prepreg has been well known in the art and has described " pre-preg " composite fibre wherein having existed such as the basis material of epoxy resin.This fiber usually adopts the form of braiding, and with matrix, this fiber is bonded to miscellaneous part together in manufacture process.In this specific execution mode, the second base station 604 has been shaped to the effect of mask.Mask material can be PCB core equally; Mask can be prepreg in other cases.Use common PCB material, the second base station 604 can be produced and be attached at PCB production equipment place the mounting surface 610 of PCB base station 602.Some operable other suitable subtractive methods (subtractive methods) are boring, excision (for example using laser) or punching press.
In other embodiments, by subtractive processes (that is, by removing material), produce barrier, wherein from the material of the top surface of base station, be removed to produce the mounting surface of depression.Remaining base station material limits barrier and therefore limits pixel region.Therefore, use adding technology or subtractive processes both one of the protruding barrier that limits pixel region on mounting surface is provided is possible.
It is the stereogram of reflector panel 700 that Figure 31 to Figure 34 shows the various views of reflector panel 700: Figure 31; Figure 32 shows the top plan view of reflector panel 700; Figure 33 is one 4 close-up illustration of taking advantage of 4 modules 704; And Figure 34 shows the feature of single pixel 706.Reflector panel 700 comprises PCB base station 702.Each module 704 comprises 16 independent pixels 706.Optical transmitting set within each pixel (not also being included) is electrically connected within base station 702.PCB can comprise to pixel 706 provides the internal power of electric power and control signal to interconnect.Suitable base station material will have low transparency, good rigidity, the CTE similar to barrier/mask material, good thermal stability and stick to well silicone/epoxy.Module 704 is manufactured together with PCB base station 702, PPA mask and solid epoxy resin adhesive.
Figure 35 shows with the viewgraph of cross-section of module 704 of installing and be connected to the optical transmitting set 710 of base station 702.Mask 708 provides the protruding barrier on mounting surface 713, and this barrier limits pixel region 712.Optical transmitting set 710 is electrically connected to trace 718 by wire-bonded 714 in the mounting surface 713 of base station 702.Sealant portion 716 materials are filled the pixel region 712 being limited by mask 708 and cover optical transmitting set 710 and wire-bonded 714.Sealant portion 716 can carry out dual-use function: sealing agent portion not only protects the element within pixel region 712 but also make to be shaped from the light outwards sending of reflector 710.Sealant portion (execution (performed) or molded on base station) can be designed to as lens, and the specific optics output from pixel is provided.
Figure 36 a to Figure 36 d shows the other method for the manufacture of soild state transmitter panel 800.In this embodiment, as shown in Figure 36 a, first optical transmitting set 410 is installed in the mounting surface 411 of base station 404.Then, as shown in Figure 36 b, integral sealer portion 802 is overmolded to light source 410 tops to limit pixel 806.Therefore, in this embodiment, barrier is limited by the sidewall of sealant portion 802, and light source 410 is positioned in the mounting surface 411 of barrier.Can use a plurality of adding technologies that comprise transfer molding, distribute molding, injection molding etc.Sealant portion material should select to provide the good light output efficiency, rigidity, uniformity of base station 404, compact CTE, and the good adhesiveness to base station 404.For example, applicable material comprises epoxy resin and silicones.As previous, note, when sealant portion 802 is attached to base station 404, sealing agent portion can be used as lens, and the lensization part of these lens is alignd with pixel region 806.
With reference to Figure 36 b, during molding process, in the region between pixel 806, some residual materials that are called " burr (flash) " 804 remain on base station 404.As will be discussed below, in Figure 36 c, burr 804 remove the gap between pixel 806.As shown in Figure 36 d, once burr 804 are removed totally, packing material 808 can put on base station 404, puts in the gap between pixel 806.
Figure 37 shows the viewgraph of cross-section that does not complete module 800 of the manufacture process that mediates (seeing Figure 36 d), and wherein burr 804 can be seen in the base station mounting surface 411 between pixel 806.In precision, be in important these application, such as in display, due to the burr 804 when remaining, during as light guide therefor, transmission is from the light (as shown by arrows) of the reflector 410 between neighbor 806, and therefore the burr 804 of remnants are less desirable.This impact is called pixel cross-talk, and can cause fuzzy and reduce resolution.In order to make the minimum of crosstalking, burr 804 should remove from the surface of the base station 404 between pixel 806.
Burr 804 can remove from base station 404 in a different manner.For example, the part of burr 804 can machinery removes (for example, utilizing saw), optics removes (for example, utilizing laser) or chemistry removes (for example, utilizing etching).When removing burr 804, importantly do not cut/burn below base station 404.If use PCB base station, also can be advantageously, the layout of design trace, can not extend along the region between pixel 806 trace.
For making the other method of adverse effect minimum of pixel cross-talk, be for example, in light guide path (, burr 804), to introduce discontinuity or isolation to disturb the transmission between pixel 806.For example, as shown in figure 38, before adding sealant portion 802, V-notch 810 is formed in the base station between pixel 806.When applying sealant portion 802, this material is coated on V-notch region.The Invalid path that V-notch 810 causes light to advance between pixel 806, crosstalks to reduce.This partition method has been eliminated removing the demand of burr 804 completely.If use PCB base station, trace should will not extend in the region of application V-notch.Also be necessary, in applying the process of sealant portion 802, closely to control the amount of sealant portion.
Figure 39 shows and uses for making the cross-sectional view of module 800 of the another method of pixel cross-talk minimum.This specific execution mode comprises that spacer 811 for example, disturbs the transmission between pixel 806 with introducing discontinuity or isolation in light guide path (, burr 804).For example, as shown in figure 39, optical transmitting set 410 is installed on the spacer 811 being positioned in base station mounting surface 411.Spacer 811 makes pixel 806 projection and away from mounting surface 411 1 segment distances, making the optical path in remaining burr 804 is not the straight line path from a pixel to one other pixel.A plurality of hard angles (hard angle) and surface are introduced in kink in optical path (kink), and the light quantity of transmitting between pixel 806 by whole internal reflection is reduced on the plurality of hard angle and surface significantly.Reflector 410 can utilize via hole 813 to be electrically connected to base station 404 through spacer 811.
Referring again to Figure 36 d, in sealant portion 802, be applied to after base station 404 and any unwanted burr 804 are removed, gap filling material 808 can put on the region of the base station 404 between pixel 806.This process should be controlled to avoid pixel 806 is polluted well.Gap filling material 808 should be selected to make on its sidewall that adheres to well pixel 806.Gap filling material 808 should have dark color.Ideally, gap filling material 808 by be black so that the emitting surface of pixel 806 and the maximum contrast between pixel peripheral region to be provided.In some embodiments, can use blacking.Applicable coating will have good mobile performance, good heat/UV/ humidity stability and the good adhesiveness to sealant portion 802 and base station 404.
Gap filling material 808 can apply with multiple diverse ways.For example, as shown in Figure 40 a to Figure 40 c, can use stencilling (stencil) method.In sealant portion 802, be applied to after base station 404 and any unwanted burr 80 are removed, paraffin paper 812 is positioned over template 800 tops, and the emitting surface of pixel 806 is covered into as shown in Figure 40 a.Then, as shown in the arrow in Figure 40 b, the whole surface that gap filling material 808 can cross module 800 applies.In Figure 40 c, paraffin paper 812 is removed, and the pixel 806 staying be can't help gap filling material 808 and covered.Multiple material can be used for paraffin paper 812, and applicable material has following performance: low morphotropism, to the good resistance of chemical cleaning, in processing procedure, protect the rational material hardness of sealant portion 802.
In Figure 41 a to Figure 41 d, illustrated for applying the other method of gap filling material 808.Process comprises dark sensitization gap filling material 808 is put on to sealant portion 802 and base station 404 tops (Figure 41 b).Then,, as shown in Figure 41 c, gap filling material 808 is exposed in the radiation/light of specific amount.By close control amount of radiation, according to the photoosmosis energy of the radiation of using, some materials 808 in the gap between pixel 806 will can not remove.As shown in Figure 41 d, developing (development) afterwards, gap filling material 808 is removable to having certain depth, makes the emitting surface of this gap filling material and pixel 806 coplanar.Baking procedure subsequently can be necessary, to make gap filling material 808 sclerosis.
Alternatively, as shown in Figure 41 c, gap filling material 808 can remove mechanically, for example, and such as grinding or cutting.In this case, gap filling material 808 is without sensitization, and only can in removing process, bear mechanical pressure.Should be understood that, multiple material can be used as gap fillers, and multiple diverse ways can be used for gap fillers being put on to module and removing from module.
Although the utility model is described in detail with reference to its specific structure, other forms are also possible.Reflector panel can have multiple different shape and size, can multiple different mode arrange and can be made by multiple different material.Pixel can multiple different mode and is arranged with multiple different style.Pixel can be used multiple different features interconnection, and has a plurality of interconnection structures.Therefore, spirit and scope of the present utility model should not be limited to above-mentioned form.
Claims (10)
1. a soild state transmitter panel, is characterized in that, comprising:
The first base station, comprises mounting surface;
Be positioned at the second base station in the described mounting surface of described the first base station, described the second base station comprises a plurality of recesses on the top surface that is positioned at described the second base station, and described in each, recess limits a pixel region;
Be arranged at least one optical transmitting set of pixel region described in each; And
Sealant portion, covers described at least one optical transmitting set at least in part.
2. soild state transmitter panel according to claim 1, is characterized in that, described the first and second base stations comprise that electricity interconnects structure, and described in each, optical transmitting set is electrically connected on described the first base station in described pixel region.
3. soild state transmitter panel according to claim 1, is characterized in that, described in each, pixel region is around three reflectors below at least: provide ruddiness reflector, the reflector of green glow is provided and the reflector of blue light is provided.
4. soild state transmitter panel according to claim 1, is characterized in that, described the first base station comprises PCB.
5. soild state transmitter panel according to claim 4, is characterized in that, described the second base station comprises PCB core.
6. soild state transmitter panel according to claim 4, is characterized in that, described the second base station comprises preimpregnation material.
7. soild state transmitter panel according to claim 1, is characterized in that, described in each, optical transmitting set is electrically connected on described the first base station by wire-bonded in described pixel region.
8. soild state transmitter panel according to claim 1, is characterized in that, described in each, pixel region is filled with sealant material at least in part, and described sealant material is at least in part around described optical transmitting set.
9. soild state transmitter panel according to claim 1, is characterized in that, described in each, pixel region has square occupy-place region.
10. soild state transmitter panel according to claim 1, is characterized in that, the region between described pixel region of described the second base station is black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420061960.4U CN203826385U (en) | 2014-02-08 | 2014-02-08 | Solid state transmitter panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420061960.4U CN203826385U (en) | 2014-02-08 | 2014-02-08 | Solid state transmitter panel |
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| CN203826385U true CN203826385U (en) | 2014-09-10 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878626A (en) * | 2018-06-29 | 2018-11-23 | 京东方科技集团股份有限公司 | A kind of display panel and production method, display device |
| CN109360493A (en) * | 2018-11-21 | 2019-02-19 | 厦门天马微电子有限公司 | A kind of backlight module, display panel and electronic equipment |
-
2014
- 2014-02-08 CN CN201420061960.4U patent/CN203826385U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878626A (en) * | 2018-06-29 | 2018-11-23 | 京东方科技集团股份有限公司 | A kind of display panel and production method, display device |
| CN109360493A (en) * | 2018-11-21 | 2019-02-19 | 厦门天马微电子有限公司 | A kind of backlight module, display panel and electronic equipment |
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Granted publication date: 20140910 |