CN203174958U - Wall surface ceramic plate - Google Patents
Wall surface ceramic plate Download PDFInfo
- Publication number
- CN203174958U CN203174958U CN 201320172016 CN201320172016U CN203174958U CN 203174958 U CN203174958 U CN 203174958U CN 201320172016 CN201320172016 CN 201320172016 CN 201320172016 U CN201320172016 U CN 201320172016U CN 203174958 U CN203174958 U CN 203174958U
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- ceramic wafer
- ceramic
- metope
- layer
- steel wire
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Abstract
The utility model provides a wall surface ceramic plate which is not easy to crush and is capable of being attached to a wall surface firmly. In the wall surface ceramic plate, a ceramic plate body is formed by overlapping an outer layer, a core layer and an inner layer in a three-layer structure; the outer layer and the inner layer are ceramic layers made of ceramic material; a steel wire layer is manufactured between the outer layer and the inner layer, and the steel wire layer is the core layer; and the top and the bottom of the ceramic plate body are respectively provided with cuboid bulges for jointing more than two ceramic plates respectively, which are a top jointing block and a bottom jointing block respectively. Further, the steel wire layer consists of alternately arranged small-aperture steel wire meshes. More further, the top jointing block and the bottom jointing block are respectively arranged on two sides of the ceramic plate body; and after the upper and the lower ceramic plates are jointed, the outer surface of the ceramic plate body is flush to the inner surface of the ceramic plate body. Preferably, concave-convex textures for increasing the adhesive strength between the ceramic plate body and the wall surface are arranged on one side, close to the wall surface, of the inner layer.
Description
Technical field
The utility model relates to a kind of constructional materials, is specifically related to a kind of metope ceramic wafer.
Background technology
Metope ceramic wafer (also being ceramics, walltile etc.), elegant in appearance owing to having behind its surface making glaze layer, the embodiment as Chinese tratitional technology and culture is subjected to liking of most of people deeply; But blemish in an otherwise perfect thing is that people cause the fragmentation of metope ceramic wafer easily in transportation, installation and the daily life of metope ceramic wafer are used, inconvenience and limitation that this brings for people's use.
Summary of the invention
Technical problem to be solved in the utility model is at above-mentioned deficiency of the prior art, and a kind of non-friable and firm metope ceramic wafer that is adhered to metope of energy is provided.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of metope ceramic wafer, and the ceramic wafer body is formed by stacking by skin, sandwich layer and nexine three layer construction; Outer and nexine is the ceramic layer of ceramic material; Make steel wire floor between skin and the nexine, steel wire floor is above-mentioned sandwich layer;
The top of ceramic wafer body and bottom are manufactured with the projection for the rectangular shape that the ceramic wafer more than two is spliced respectively, are respectively top splicing block and bottom splicing block.
Further be: above-mentioned steel wire floor is made up of staggered fine pore gauze wire cloth.
Further be: above-mentioned top splicing block and bottom splicing block are arranged in the both sides of ceramic wafer body, and after two ceramic wafers spliced up and down, the external surface of ceramic wafer body was concordant with inner surface.
Preferably: above-mentioned nexine is near the Z-Correct bump mapping Z-correct that is manufactured with on metope one side for increasing ceramic wafer body and metope bonding force.
The utility model compared with prior art has the following advantages:
The utility model metope ceramic wafer when firing this metope ceramic wafer, selects for use the less gauze wire cloth of mesh as sandwich layer, forms steel wire floor, then the both sides of steel wire floor skin 4 and the nexine 2 with ceramic material is wrapped up; Thereby increased the toughness of the utility model metope ceramic wafer, be difficult for fragmentation, can transport safely; Be difficult for fragmentation after simultaneously also having guaranteed to be adhered to metope; In order to guarantee the utility model ceramic wafer difficult drop-off after being adhered to metope, we have made splicing block at the ceramic wafer upper and lower side; This splicing block has increased the bond area between the ceramic wafer body, has guaranteed the fixing between the ceramic wafer;
After the utility model metope ceramic wafer splices mutually, from outside watch (as shown in Figure 2) still to have only a match line, integral surface is concordant; But but compare (not having splicing block) structure of tradition butt joint, increased the coated area of adhesives, finally increased the fixing after bonding.
Description of drawings
Fig. 1 is the perspective view of the utility model single ceramic plate;
Fig. 2 is two ceramic wafers spliced effect schematic diagrames up and down.
Description of reference numerals:
1-top splicing block, 2-nexine, 3-steel wire floor, 4-skin, 5-bottom splicing block.
The specific embodiment
Below in conjunction with drawings and Examples the utility model specific embodiment is described:
As shown in Figure 1 and Figure 2, it shows a kind of specific embodiment of the present utility model, a kind of metope ceramic wafer of the utility model, and the ceramic wafer body is formed by stacking by skin 4, sandwich layer and nexine 2 three layer constructions; Skin 4 and nexine 2 are the ceramic layer of ceramic material; Make steel wire floor 3 between skin and the nexine, steel wire floor 3 is above-mentioned sandwich layer;
The top of ceramic wafer body and bottom are manufactured with the projection for the rectangular shape that the ceramic wafer more than two is spliced respectively, are respectively top splicing block 1 and bottom splicing block 5.
Above-mentioned ceramic wafer body refers to whole ceramic wafer, and the ceramic wafer body is used for being adhered to metope by constructional materials (concrete etc.), and its surface near metope is inner surface, and its surface away from metope is external surface;
When firing this metope ceramic wafer, select for use the less gauze wire cloth of mesh as sandwich layer, form steel wire floor, then the both sides of steel wire floor skin 4 and the nexine 2 with ceramic material wrapped up; Thereby increased the toughness of the utility model metope ceramic wafer, be difficult for fragmentation, can transport safely; Be difficult for fragmentation after simultaneously also having guaranteed to be adhered to metope; In order to guarantee the utility model ceramic wafer difficult drop-off after being adhered to metope, we have made splicing block at the ceramic wafer upper and lower side; This splicing block has increased the bond area between the ceramic wafer body, has guaranteed the fixing between the ceramic wafer.
Preferably, above-mentioned steel wire floor 3 is made up of staggered fine pore gauze wire cloth, and said fine pore refers to the aperture of steel wire here; The steel that we can be called steel wire all can be understood as fine pore.
General, above-mentioned top splicing block 1 and bottom splicing block 5 are arranged in the both sides of ceramic wafer body, and after two ceramic wafers spliced up and down, the external surface of ceramic wafer body was concordant with inner surface.After whole metope ceramic wafer splices mutually, from outside watch (as shown in Figure 2) still to have only a match line, integral surface is concordant; But but compare (not having splicing block) structure of tradition butt joint, increased the coated area of adhesives, finally increased the fixing after bonding.
In order further to increase the fixing between layered ceramic plate and the metope, above-mentioned nexine 2 is near the Z-Correct bump mapping Z-correct that is manufactured with on metope one side for increasing ceramic wafer body and metope bonding force.Described Z-Correct bump mapping Z-correct has not only increased in the friction of ceramic wafer body and metope, has meanwhile also increased the area of filling adhesives, has further increased bonding reliability.
By reference to the accompanying drawings the utility model preferred embodiment has been done detailed description above, but the utility model is not limited to above-mentioned embodiment, in the ken that those of ordinary skills possess, can also under the prerequisite that does not break away from the utility model aim, make a variety of changes.
Do not break away from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific embodiment, scope of the present utility model is defined by the following claims.
Claims (4)
1. metope ceramic wafer is characterized in that: the ceramic wafer body is formed by stacking by outer (4), sandwich layer and nexine (2) three layer construction; Outer (4) and nexine (2) are the ceramic layer of ceramic material; Make steel wire floor (3) between skin and the nexine, steel wire floor (3) is above-mentioned sandwich layer;
The top of ceramic wafer body and bottom are manufactured with the projection for the rectangular shape that the ceramic wafer more than two is spliced respectively, are respectively top splicing block (1) and bottom splicing block (5).
2. a kind of metope ceramic wafer as claimed in claim 1, it is characterized in that: described steel wire floor (3) is made up of staggered fine pore gauze wire cloth.
3. a kind of metope ceramic wafer as claimed in claim 1, it is characterized in that: described top splicing block (1) and bottom splicing block (5) are arranged in the both sides of ceramic wafer body, after two ceramic wafers spliced up and down, the external surface of ceramic wafer body was concordant with inner surface.
4. a kind of metope ceramic wafer as claimed in claim 1 is characterized in that: be manufactured with the Z-Correct bump mapping Z-correct for increasing ceramic wafer body and metope bonding force on close metope one side of described nexine (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320172016 CN203174958U (en) | 2013-04-09 | 2013-04-09 | Wall surface ceramic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320172016 CN203174958U (en) | 2013-04-09 | 2013-04-09 | Wall surface ceramic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203174958U true CN203174958U (en) | 2013-09-04 |
Family
ID=49071682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320172016 Expired - Fee Related CN203174958U (en) | 2013-04-09 | 2013-04-09 | Wall surface ceramic plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203174958U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103625351A (en) * | 2013-12-23 | 2014-03-12 | 北京天坛海乔客车有限责任公司 | Motor home and compartment thereof |
| CN111417760A (en) * | 2017-10-30 | 2020-07-14 | Xylo科技股份公司 | Wall board with adhesive coating |
-
2013
- 2013-04-09 CN CN 201320172016 patent/CN203174958U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103625351A (en) * | 2013-12-23 | 2014-03-12 | 北京天坛海乔客车有限责任公司 | Motor home and compartment thereof |
| CN111417760A (en) * | 2017-10-30 | 2020-07-14 | Xylo科技股份公司 | Wall board with adhesive coating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20160409 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |