CN201072751Y - Washing mould of semiconductor and integrated circuit package mold - Google Patents
Washing mould of semiconductor and integrated circuit package mold Download PDFInfo
- Publication number
- CN201072751Y CN201072751Y CNU2007200402382U CN200720040238U CN201072751Y CN 201072751 Y CN201072751 Y CN 201072751Y CN U2007200402382 U CNU2007200402382 U CN U2007200402382U CN 200720040238 U CN200720040238 U CN 200720040238U CN 201072751 Y CN201072751 Y CN 201072751Y
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- CN
- China
- Prior art keywords
- mold cleaning
- semiconductor
- integrated circuit
- mould
- cleaning element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A mold cleaning piece of semiconductor and integrated circuit sealing mould is provided, which is composed of a mold cleaning component and a connecting component; the mold cleaning component and the connecting component of each unit is arrayed in continuous blowdown mold cleaning piece by molding. The mold cleaning component is plate-shaped or needle-shaped, when in needle shape, the connecting component is provided with two connecting belts, and the two ends of the needle-shaped mold cleaning component is fixed with the connecting belts; when in plate shape, the used connecting piece is a connecting belt, and one end of the plate-shaped mold cleaning component is fixed with a connecting belt.
Description
One, technical field
The utility model relates to special-purpose cleaning device, the especially semiconductor of mould and the mold cleaning spare of integrated circuit packaging mould.
Two, background technology
The design of semiconductor and integrated circuit plastic package die and the accuracy of manufacture require very high.Plastic package die is the main technique equipment of semiconductor and integrated circuit encapsulation, belong to fixing reinforced cavate thermoset plastics plastic squeeze mould type, have tangible characteristics such as the die cavity number is many, precision is high, the terminal pin number is many, spacing is little, the encapsulation coherence request is good, reliability is high, the life-span is long.Along with semiconductor and integrated circuit mounted on surface (SMT) technology rapid development particularly, also more and more higher to the precision and the reliability requirement of Plastic Package mould.
In the operation of making semiconductor packages, with encapsulating material---poured with epoxy resin carries out thermmohardening and handles in the mould that chip, lead frame, base plate are housed behind the matched moulds.Because resin and mold materials have stronger absorption affinity (more than the 1MPa), need to use the jemmy forced stripper mechanism, because resin has part in mould residual, therefore need clean.
Because lead frame (skeleton of plastic part) is different with the material of mould, its thermal coefficient of expansion is also inconsistent, thereby the thermal expansion amount of feasible lead frame at high temperature and mould is just different, finally has influence on the compact dimensions of plastic part.It is residual that this also can cause resin to have part in mould; Therefore resin in the mould must be cleaned.
Running gate system is made up of pressure injection head, barrel, sprue, runner and cast gate.Because die cavity One's name is legion, running gate system have adopted non-equilibrium runner to arrange.All be provided with at the upper die and lower die of plastic package die and eject and resetting means.Each die cavity all has two push rods up and down, adds the push rod at runner position, and so a large amount of push rods drives by ejecting with resetting means.Semiconductor and integrated circuit adopt epoxy molding compound, and its key property is: excellent mechanical performance and electrical insulation capability; Extraordinary thermostable type, heat conductivility is good; Na+, Cl-content are extremely low, and sealing property is good; Good fluidity, quick solidifying, release property is good; Homogeneity of product, good stability.It is a kind of thermoset plastics, crosslinking curing moulding in certain temperature range.SOP semiconductor and integrated circuit plastic package die adopt electrically heated rod to heat, and establish temperature sensor temperature information is delivered to temperature controller to realize temperature adjusting.
The method system that CN1282277 removes surface contaminants on moulds in the semiconductor packaging device utilizes laser to remove the dirt of die surface in the semiconductor packaging device, for example grease, wax and residual resin.Utilize the dirt removal technology of laser to comprise laser beam irradiation to the die surface that has dirt.Laser is launched as pulse, only continues the very short time.Need multiple pulses with thorough removing dirt.In fact be difficult to clean up.
Semiconductor has been compared its unique distinction with the integrated circuit plastic package die with other mould of plastics, plastic sealed mould is fixing reinforced cavate thermoset plastics plastic squeeze mould type, have characteristics such as the position, chamber is many, precision is high, the life-span is long, its mould structure and general mould of plastics difference are very big.Complete plastic sealed mould comprises upper die and lower die and annex three parts, the upper die and lower die part of SOP plastic sealed mould.Divide according to the function of forming the mould different structure, it mainly by cast, moulding, exhaust, eject, reset, systems such as heating, temperature control, material loading, preheating, location and support form.
When epoxy seal semiconductor and integrated circuit, the lead frame of carrier band semiconductor and integrated circuit silicon chip at first is placed to the stock shelf that light aluminum alloy is made, move to then in the pre-heating system, through the constant temperature preheating of certain hour, finally filling epoxy resin and curing molding in plastic package die.
The cleaning of mould adopts the mold cleaning spare of similar lead frame shape at present, mainly comprise mold cleaning pin and mold cleaning sheet, mold cleaning spare is residual so resin in the mould must be washed out with part in the mould during mold heated, after the mold cleaning sheet is used once, just abandon, the mold cleaning sheet generally adopts copper, its cost height, and almost each class all carries out mold cleaning, and the frequency of mold cleaning still is higher.
Three, summary of the invention
The utility model purpose is: propose a kind of semiconductor of new construction and the mold cleaning spare of integrated circuit packaging mould, especially mold cleaning is effective, the mold cleaning spare that cost is low.
Technical solutions of the utility model are: the mold cleaning spare of semiconductor and integrated circuit packaging mould, it is characterized in that comprising that mold cleaning element and connector constitute, and each unit mold cleaning element and connector are arranged in platoon mold cleaning spare with the system of moulding.
The mold cleaning element is generally sheet or needle-like, and during acicular texture, connector is to be provided with two connecting bands, and the two ends and the connecting band of needle-like mold cleaning element are fixed.
When connector was sheet mold cleaning spare, the connector of use was a connecting band, and an end and the connecting band of sheet mold cleaning element are fixed.Sheet, needle-like mold cleaning element all with the system of moulding better, are convenient to the realization of technology.
Characteristics of the present utility model are: this is a kind of semiconductor of new construction and the mold cleaning spare of integrated circuit packaging mould, disposable work effective, and mold cleaning efficient height, cost is low.
Four, description of drawings
Fig. 1 is the utility model needle-like mold cleaning element connecting band schematic diagram
Fig. 1 is the utility model sheet mold cleaning element connecting band schematic diagram
Needle-like mold cleaning element 1, connector 2, sheet mold cleaning element 3, fixing hole 4.
Five, embodiment
Semiconductor and integrated circuit packaging mould mold cleaning spare comprise mold cleaning element 1,3 and connector 2, and each unit mold cleaning element and connector are arranged in platoon mold cleaning spare with the system of moulding.Adopt the injection moulding mode with illustrated mold cleaning element and the integrated preparation production of connector.The mold cleaning element is generally sheet or needle-like, and during acicular texture, connector is to be provided with two connecting bands, and the two ends and the connecting band of needle-like mold cleaning element are fixed.The number of platoon mold cleaning spare is unfixing, generally corresponding to die cavity.
Claims (3)
1. the mold cleaning spare of semiconductor and integrated circuit packaging mould is characterized in that comprising that mold cleaning element and connector constitute, and each unit mold cleaning element and connector are arranged in platoon mold cleaning spare with the system of moulding.
2. the mold cleaning spare of semiconductor according to claim 1 and integrated circuit packaging mould is characterized in that the mold cleaning element is an acicular texture, and connector is two connecting bands, and the two ends and the connecting band of needle-like mold cleaning element are fixed.
3. the mold cleaning spare of semiconductor according to claim 1 and integrated circuit packaging mould is characterized in that the mold cleaning element is a sheet, and the connector of use is a connecting band, and an end and the connecting band of sheet mold cleaning element are fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200402382U CN201072751Y (en) | 2007-06-29 | 2007-06-29 | Washing mould of semiconductor and integrated circuit package mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200402382U CN201072751Y (en) | 2007-06-29 | 2007-06-29 | Washing mould of semiconductor and integrated circuit package mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201072751Y true CN201072751Y (en) | 2008-06-11 |
Family
ID=39551307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200402382U Expired - Fee Related CN201072751Y (en) | 2007-06-29 | 2007-06-29 | Washing mould of semiconductor and integrated circuit package mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201072751Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108242402A (en) * | 2016-12-26 | 2018-07-03 | 无锡华润华晶微电子有限公司 | Clear die clamper and clear modular system |
-
2007
- 2007-06-29 CN CNU2007200402382U patent/CN201072751Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108242402A (en) * | 2016-12-26 | 2018-07-03 | 无锡华润华晶微电子有限公司 | Clear die clamper and clear modular system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080611 Termination date: 20100629 |