CN1934721A - Light-emitting device and illuminating device - Google Patents

Light-emitting device and illuminating device Download PDF

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Publication number
CN1934721A
CN1934721A CNA2005800090825A CN200580009082A CN1934721A CN 1934721 A CN1934721 A CN 1934721A CN A2005800090825 A CNA2005800090825 A CN A2005800090825A CN 200580009082 A CN200580009082 A CN 200580009082A CN 1934721 A CN1934721 A CN 1934721A
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CN
China
Prior art keywords
light
fluorophor
emitting
emitting device
particle
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Pending
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CNA2005800090825A
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Chinese (zh)
Inventor
森山严与
中西晶子
岩本正己
野木新治
小川光三
清水惠一
齐藤明子
川岛净子
三瓶友广
泉昌裕
户田雅宏
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Publication of CN1934721A publication Critical patent/CN1934721A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Disclosed is a light-emitting device (11) wherein the luminous efficiency is improved and color variations in the emitted light are reduced. Specifically, a light-emitting diode element (18) is covered with a diffusion layer (22) wherein a diffusing agent is added to a resin. A phosphor layer (23) wherein a phosphor is added to a resin is arranged on top of the diffusion layer (22). The light from the light-emitting diode element (18) is diffused by the diffusion layer (22). By exciting the phosphor layer (23) with the light diffused at the diffusion layer and having the phosphor layer (23) emit a light, the luminous efficiency is improved and color variations in the emitted light are reduced.

Description

Light-emitting device and lighting device
Technical field
The present invention relates to the light-emitting device of light-emitting component as light source, and the lighting device with this light-emitting device.
Background technology
In the past, to be in the light-emitting device of light-emitting diode as light source as the solid-state light emitting element of light-emitting component, known have on base material, set light-emitting diode and with the surface-mount type light emitting device of the mode potting resin that covers this light-emitting diode.
And, send white light in order to utilize this light-emitting device, known have a following technology: described device will utilize blue light that the blue LED element sends and the sodium yellow that utilizes the yellow light-emitting diode element to send to mix (for example, with reference to patent documentation 1).
And, known have a following technology: utilize that to contain average grain diameter in resin be that the resin bed of condensation product of the yellow luminescent phosphor of 3 μ m～50 μ m covers the blue LED element, excite yellow luminescent phosphor and the sodium yellow blend color (for example, with reference to patent documentation 2) that obtains with the blue light of blue LED element with by this blue-light-emitting.
And, as the distribution of fluorophor in resin, known have in sedimentation below the luminescent coating sedimentation shape of phosphor particle is arranged and in resin bed is all, is dispersed with the technology of the dispersion shape of phosphor particle.
Patent documentation 1: TOHKEMY 2002-43625 communique (the 3rd page, Fig. 1)
Patent documentation 2: TOHKEMY 2001-148516 communique (the 4th page, Fig. 1)
But, in the light-emitting device that has used blue LED element and yellow light-emitting diode element, there is distance between blue LED element and the yellow light-emitting diode element, so be difficult to mix equably blue light and sodium yellow, luminous efficiency is low, has the problem that becomes white light other color in addition easily.And, for being set, at least 2 light-emitting diodes that send blue light and sodium yellow respectively need the space, there is the problem of the equipment enlarging cause carrying them.
And, the resin bed that utilization contains yellow luminescent phosphor covers in the light-emitting device of blue LED element, when watching perpendicular to the direction of the outer surface of resin bed, because the central portion and the distance between the blue LED element of this resin bed are nearer than the periphery and the distance between the blue LED element of resin bed, so brightness height at the central portion blue light of the resin bed at blue LED element place, seem that blue light is bright, the white light blueing, on the other hand, periphery at resin bed, sodium yellow disperses, thereby has the problem that produces the form and aspect inequality.
But, when comparing, the luminous efficiency the when distribution of phosphor particle in resin bed is sedimentation shape and dispersion shape as can be known, disperses shape by using, and luminous efficiency improves about 20%.In white luminous light-emitting device, owing to need together improve luminous efficiency with color rendering etc., advantageous applications is disperseed shape.
But, in disperseing shape, on the base material that has set light-emitting diode during potting resin,, then produce the situation that entrains into bubble etc. if the viscosity of resin is too high.Therefore,, need to use the lower transparent resin of viscosity, but in low viscous transparent resin, there is the problem that is difficult to obtain disperseing the shape structure in the sedimentation fierceness of phosphor particle for practicality.And when having used low viscous transparent resin, phosphor particle can be deposited in the dispenser (dispenser) sometimes, brings harmful effect might for manufacturing efficient, the manufacturing cost of light-emitting device.Though be the method for filling when stir the inside of dispenser in addition, under this situation, might cause entraining into bubble, part stirs problems such as inhomogeneous.
On the other hand, the sedimentation of phosphor particle in resin can be subjected to the influence of the particle diameter of phosphor particle.The particle diameter of phosphor particle is more little, is difficult to sedimentation in transparent resin more, but the luminous efficiency of fluorophor self normally particle diameter is more little low more.Therefore, though the structure of using the little phosphor particle of particle diameter to obtain disperseing shape, but the decline of the luminous efficiency of fluorophor self offsets with the raising effect of disperseing the luminous efficiency that shape produced.Thus, can not improve the luminous efficiency of light-emitting device.
In addition, recording in patent documentation 1 and using average grain diameter in order to suppress luminance nonuniformity is the condensation product of the fluorophor of 3 μ m～50 μ m, but the condensation product that forms for aggegation phosphor particle in resin, the particle diameter of fluorophor itself does not increase, so the luminous efficiency of fluorophor depends on the particle diameter of the phosphor particle before the cohesion, therefore, utilize the condensation product of fluorophor can not improve the luminous efficiency of fluorophor.
Summary of the invention
The present invention proposes in view of the above problems, and its purpose is, a kind of light-emitting device of the form and aspect inequality that can reduce illuminant colour when can improve luminous efficiency and the lighting device that has used this light-emitting device are provided.
The light-emitting device of first aspect has: light-emitting component, and it is provided on the base material; Scattering layer, its covering luminous element; And luminescent coating, it is provided in the upper strata of scattering layer.
So the scattering layer by covering luminous element is the light scattering of self-emission device in the future, be provided in the luminescent coating on scattering layer upper strata by the optical excitation of this scattering, make luminescent coating luminous, thereby improve luminous efficiency and reduce the form and aspect inequality of illuminant colour.
In addition, in the present invention, the optical excitation fluorophor that utilizes light-emitting component to launch makes fluorophor send visible light.As light-emitting component, can enumerate for example blue LED element, ultraviolet light-emitting diode element etc.But light-emitting component is not limited thereto, so long as can excited fluophor, makes luminous element send the light-emitting component of visible light, can use various light-emitting components according to the purposes of light-emitting device, as illuminant colour of target etc.
The optical excitation that fluorophor is launched from light-emitting component, send visible light, by visible light that sends from this fluorophor and the light blend color of launching from light-emitting component, the perhaps visible light that sends from fluorophor or the blend color of visible light self, thereby the illuminant colour that obtains wishing as light-emitting device.The kind of fluorophor is not particularly limited, and according to the light of launching as the illuminant colour of target, from light-emitting component etc., suitably selects.
Scattering layer, luminescent coating can add scattering diluent in the various transparent resin of for example epoxy resin, silicones etc., fluorophor constitutes.
The light-emitting device of second aspect, in the described light-emitting device of first aspect, scattering layer has scattering diluent, and the addition of scattering diluent is 3 quality %～5 quality %.
So, be set at 3 quality %～5 quality % by addition with scattering diluent, can suppress the decline of luminous efficiency and reduce the form and aspect inequality.The addition of scattering diluent is during less than 3 quality %, and dispersion effect descends, and the uneven effect that reduces of form and aspect descends, and on the other hand, the addition of scattering diluent is during greater than 5 quality %, and the light quantity that is absorbed by base material increases, so light beam descends.
The light-emitting device of the third aspect, in first aspect or the described light-emitting device of second aspect, the composition surface of scattering layer and luminescent coating forms the cancave cambered surface to light-emitting component side depression.
So because the composition surface of scattering layer and luminescent coating is the cancave cambered surface to light-emitting component side depression, so than the situation on plane, bonding area increases, the bond strength enhancing of scattering layer and luminescent coating can suppress peeling off of scattering layer and luminescent coating.
The light-emitting device of fourth aspect has: light-emitting component, and it is provided on the base material; And luminescent coating, it contains fluorophor, visible light is sent in the optical excitation that this fluorophor is launched from light-emitting component, fluorophor contain fluorophor the formation of granule second particle, particle diameter is at the phosphor particle of 5 μ m～10 mu m ranges.
So; because luminescent coating contains fluorophor; and this fluorophor have fluorophor the formation of granule second particle, particle diameter is at the phosphor particle of 5 μ m～10 mu m ranges; even thereby use the resin for example have functional viscosity at luminescent coating; also can disperse fluorophor reliably, so can improve luminous efficiency and reduce the form and aspect inequality of illuminant colour.
In addition, the second particle of fluorophor is meant and phosphor raw material is fired when making phosphor particle the particle that the granule of fluorophor is bonded to each other.So, different with the granule gathering cohesion of fluorophor.Fluorophor is the fluorophor that is formed by the part or all of second particle of the granule of fluorophor.The ratio of the primary particle of second particleization and second particle is not preferably in 1: 1～0: 1 scope, and the particle diameter of phosphor particle that contains primary particle and second particle is preferably in the scope of 5 μ m～10 μ m.The particle diameter of the second particle of fluorophor is meant the maximum diameter of second particle.The particle diameter that use is represented with maximum diameter is at the second particle of 5 μ m～10 mu m ranges.The particle diameter of second particle (when having primary particle, comprising all particle diameters of phosphor particle of this primary particle) uses sieve etc. to carry out classification when making fluorophor and obtains.And the particle diameter of phosphor particle is the value of measuring with Ku Erte counting method (coulter counter method).The second particle of such fluorophor is bonded to each other in crystal growth process small particles and forms, thus be not easy to separate, and, demonstrate near having the luminous efficiency of the primary particle of the particle diameter suitable with maximum diameter.And surface area ratio has with the primary particle of the equal particle diameter of maximum diameter big, so have for example little feature of the sinking speed in resin of the fluorophor of dispersion.Thus, even when for example having used the resin with practical resin viscosity, the luminous efficiency that also can suppress fluorophor descends, and obtains the luminescent coating of the dispersion shape of phosphor particle dispersion.
The light-emitting device of the 5th aspect has: light-emitting component, and it is provided on the base material; And luminescent coating, it contains fluorophor, the optical excitation that this fluorophor is launched from light-emitting component and send visible light, and fluorophor contains phosphor particle, and this phosphor particle has 2 particle size distribution with the superiors of existence.
So, use has the fluorophor of phosphor particle, this phosphor particle has 2 particle size distribution with the superiors of existence, can improve the dispersity of phosphor particle in luminescent coating, so can improve luminous efficiency, and the form and aspect inequality of minimizing illuminant colour, the use amount that maybe can cut down fluorophor.
In addition, have and exist 2 phosphor particles to be meant, when for example measuring the particle size distribution of phosphor particle, have 2 or greater than 2 granularity peak by the Ku Erte counting method with superiors's particle size distribution.Such phosphor particle can obtain less than the fluorophor powder of this fluorophor powder by interpolation in the fluorophor powder of for example fluorophor in the main composition resin bed, mixing particle diameter.
The light-emitting device of the 6th aspect, aspect fourth aspect or the 5th in the described light-emitting device, luminescent coating is to fill viscosity at the resin of 0.1Pas～10Pas scope and solidify to form.
So,, can suppress bubble and entrain into luminescent coating by using the resin of viscosity in 0.1Pas～10Pas scope.
The light-emitting device of the 7th aspect, in any described light-emitting device aspect fourth aspect to the six, light-emitting component has the light-emitting diode of launching blue light, fluorophor has yellow or orange luminescence fluorophor, the blue light that this yellow or orange luminescence fluorophor are launched from light-emitting diode excites, and sends sodium yellow or orange-colored light.
So, blue light of launching by light-emitting diode and sodium yellow or the orange-colored light that excites yellow or orange luminescence fluorophor to send by the blue light that this light-emitting diode is launched, thus obtain white luminous.
The lighting device of eight aspect has: any described light-emitting device of first aspect to the seven aspects; And be configured in lens on the base material.
So by the light that sends roughly uniform light from light-emitting device and utilize the lens distribution controls to be sent, the light quantity that can obtain wishing is also carried out distribution controls.
The invention effect
According to the described light-emitting device of first aspect, because the scattering layer light scattering of self-emission device in the future by covering luminous element, be provided in the luminescent coating on scattering layer upper strata by the optical excitation of this scattering, make luminescent coating luminous, so can improve luminous efficiency and reduce the form and aspect inequality of illuminant colour.
According to the described light-emitting device of second aspect, on the basis of the effect of the described light-emitting device of first aspect,, can suppress the decline of luminous efficiency and reduce the form and aspect inequality because the addition of scattering diluent is set at 3 quality %～5 quality %.
According to the described light-emitting device of the third aspect, on the basis of the effect of first aspect or the described light-emitting device of second aspect, because the composition surface of scattering layer and luminescent coating is the cancave cambered surface to light-emitting component side depression, so compare with the situation on plane, bonding area increases, the bond strength of scattering layer and luminescent coating strengthens, and can suppress peeling off of scattering layer and luminescent coating.
According to the described light-emitting device of fourth aspect; luminescent coating contains fluorophor; this fluorophor have fluorophor the formation of granule second particle, particle diameter is at the phosphor particle of 5 μ m～10 mu m ranges; even thereby use the resin for example have functional viscosity at luminescent coating; also can disperse fluorophor reliably, so can improve luminous efficiency and reduce the form and aspect inequality of illuminant colour.
According to the described light-emitting device in the 5th aspect, use has the fluorophor of phosphor particle, this phosphor particle has 2 particle size distribution with the superiors of existence, can improve the dispersity of phosphor particle in luminescent coating, so can improve luminous efficiency, and the form and aspect inequality of minimizing illuminant colour, the use amount that maybe can cut down fluorophor.
According to the described light-emitting device in the 6th aspect, on the basis of the effect of described light-emitting device aspect fourth aspect or the 5th, luminescent coating is to form in the resin and the curing of 0.1Pas～10Pas scope by filling viscosity, so can suppress to entrain into bubble.
According to the described light-emitting device in the 7th aspect, on the basis of the effect of the described light-emitting device of either side aspect the fourth aspect to the six, blue light of being launched by light-emitting diode and sodium yellow or the orange-colored light that excites yellow or orange luminescence fluorophor to send by the blue light that this light-emitting diode is launched obtain white luminous.
According to the described lighting device of eight aspect, send roughly light uniformly from any described light-emitting device of first aspect to the seven aspects, and utilize lens that the light that sends is carried out distribution controls, so can access predetermined light quantity and carry out distribution controls.
Description of drawings
Fig. 1 is the local amplification view of the light-emitting device of expression first execution mode of the present invention.
Fig. 2 is the vertical view of the light-emitting device of Fig. 1.
Fig. 3 is the cutaway view of the light-emitting device of Fig. 1.
Fig. 4 illustrates the addition of scattering diluent of light-emitting device of Fig. 1 and the table of the relation between the light beam.
Fig. 5 is the key diagram of the second particle of the fluorophor that uses in the light-emitting device that second execution mode of the present invention is shown.
Fig. 6 is the figure that the representative particle size distribution of the fluorophor that has 2 above granularity peaks in the light-emitting device of Fig. 5 is shown.
Fig. 7 is the cutaway view of the light-emitting device of Fig. 5.
Fig. 8 is the cutaway view of an example of electrode connecting structure of light-emitting component that the light-emitting device of Fig. 5 is shown.
Fig. 9 is another routine cutaway view of electrode connecting structure of light-emitting component that the light-emitting device of Fig. 5 is shown.
Figure 10 is the cutaway view that the metewand of the dispersity of the fluorophor in the light-emitting device of Fig. 5 is shown in (a)～(d).
Figure 11 is the table of the metewand of embodiment in the light-emitting device of Fig. 5 and comparative example.
Figure 12 is the table that the relation of the mixing ratio that has the embodiment at 2 granularity peaks in the light-emitting device of Fig. 5 and have the comparative example at 1 granularity peak, luminous efficiency is shown.
Figure 13 is the cutaway view of light emitting module that the lighting device of the 3rd execution mode of the present invention is shown.
Figure 14 is the front view of the light emitting module of Figure 13.
Figure 15 is the front view of the lighting device of Figure 13.
Figure 16 is the key diagram of combination of materials example of the light emitting module of Figure 13.
Symbol description
11 light-emitting devices; 12 base materials; 18 light-emitting diodes as light-emitting component; 22 scattering layers; 23 luminescent coatings; 24 composition surfaces; 31 light-emitting devices; 32 base materials; 37 light-emitting diodes as light-emitting component; 41 fluorophor; 42 luminescent coatings; 51 lighting devices; 61 light-emitting diodes as light-emitting component; 74 scattering layers; 75 visible light conversion layers as luminescent coating; 76 lens
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.
Fig. 1 to Fig. 4 illustrates first execution mode of the present invention.Fig. 1 is the local amplification view of light-emitting device, and Fig. 2 is the vertical view of light-emitting device, and Fig. 3 is the cutaway view of light-emitting device, and Fig. 4 is the addition of scattering diluent of expression light-emitting device and the table of the relation between the light beam.
As shown in Figures 2 and 3, light-emitting device 11 has base material 12, and a plurality of light-emitting components that are formed with that for example are 3 row, 3 row on this base material 12 set portion 13 rectangularly.
Base material 12 has: have the aluminium (Al) of thermal diffusivity and rigidity or the flat substrate 14 of nickel (Ni), glass epoxy resin etc.; Be formed on the insulating barrier 15 on the substrate 14; Be formed on the lead frame 16 on the insulating barrier 15; And be formed on reflector 17 on the substrate 14 with these insulating barriers 15 and lead frame 16.
As shown in Figure 1, setting portion 13 at each light-emitting component on lead frame 16 utilizes the alloy of Cu and Ni or Au etc. to be formed with circuit pattern (Wiring pattern) 16a, the 16b of cathode side and anode-side.Setting portion 13 at each light-emitting component on this lead frame 16 is equipped with respectively as the solid-state light emitting element of light-emitting component and illuminant colour and is blue light-emitting diode (blue led chips) 18.Each light-emitting diode 18 is by the formations such as for example gallium nitride (GaN) based semiconductor of sending blue light.The bottom-side electrodes of each light-emitting diode 18 is by side's electricity/mechanical connection of chips welding and circuit pattern 16a, 16b, and the overlying electrode of light-emitting diode 18 is electrically connected with the opposing party of circuit pattern 16a, 16b by pressure welding lead-in wire 19.
Reflector 17 be for example inject PBT (polybutylene terephthalate (PBT)), PPA (poly-terephthalate amine) in the one side of substrate 14, PC resins such as (Merlon) comes moulding, set portion 13 at each light-emitting component and be formed with the resettlement section 20 that is used to accommodate each light-emitting diode 18.Resettlement section 20 forms the truncated cone of expanding gradually towards the opposition side of substrate 14.Concentric shape ground is formed with lens mount portion (perhaps lens mount portion) 21 around the resettlement section 20, and this lens mount portion 21 is used for fixing not shown lens.
The inside of each resettlement section 20 is formed with scattering layer 22 and luminescent coating 23 these two layers, and this scattering layer 22 covers light-emitting diodes 18, and this luminescent coating 23 is provided in the open side of resettlement section 20 on the upper strata of this scattering layer 22.
Scattering layer 22 is the aluminium oxide (Al that add 3 quality %～5 quality % (mass%) in having thermosetting transparent resins such as the silicones of light transmission, epoxy resin 2O 3), Ti, Ca, scattering diluents such as SiAl, Y form, and are to be filled to the position that is higher than the light-emitting diode 18 in the resettlement section 20 and to carry out hot curing by the resin that will add scattering diluent to form.At this moment, will form the flexure plane that caves in to light-emitting diode 18 sides (side below among Fig. 3) with the composition surface (boundary face) 24 of luminescent coating 23.The bent upper ends on this composition surface 24 and the interval of curved lower end are preferably for example 1 μ m～5 μ m.
Luminescent coating 23 is that the yellow fluorophor that adds required quality % in the thermosetting transparent resin with the silicones of light transmission, epoxy resin etc. forms, this yellow fluorophor is accepted the blue-light-emitting from light-emitting diode 18, the fluorescence radiation yellowly, after hot curing forms scattering layer 22, in resettlement section 20, fill resin and the hot curing of having added fluorophor, thereby form luminescent coating 23.
In addition, can illuminated in combination device 11 and lens constitute lighting device.
The effect of light-emitting device 11 then, is described.
At first, when applying predetermined direct voltage between circuit pattern 16a, the 16b of outside to each cathode side and anode-side, each light-emitting diode 18 carries out blue-light-emitting.This blue-light-emitting, incides in the luminescent coating 23 to a plurality of direction scatterings by scattering layer 22,, excites yellow fluorophor from a plurality of directions herein, makes its luminous yellowly.So, from the blue light of light-emitting diode 18 with from the sodium yellow blend color of yellow fluorophor, become white light, 20 launch to the outside from the resettlement section.
Therefore, according to this light-emitting device 11, utilize scattering layer 22 small luminous with light-emitting diode 18 to a plurality of direction scatterings, yellow fluorophor from a plurality of direction excited fluophor layers 23, make its luminous yellowly, and, send white light, so can reduce the form and aspect inequality of this white light with this sodium yellow and blue light blend color.
And the addition that adds the scattering diluent in the resin of scattering layer 22 to is 3 quality %～5 quality %, thus can reduce the form and aspect inequality of white light, and light beam is descended.The light beam that the addition of scattering diluent causes shown in the table of Fig. 4 changes.In addition, in the table of Fig. 4 be that 0 light beam when promptly not adding scattering diluent is made as 100% with the addition of scattering diluent.
Shown in the table of Fig. 4, the addition of scattering diluent is during greater than 5 quality %, and light beam descends, and addition is during less than 3 quality %, and the uneven effect that reduces of form and aspect descends.
Then, the uneven experimental data that reduces effect of form and aspect that the sample No.11～No.5 to light-emitting device 11 implements is shown.In addition, used emission wavelength as the yellow fluorophor of 545nm, as the Al of the Japanese ア エ ロ ジ Le system of scattering diluent in this experiment respectively 2O 3, as the τ silicones JCR6140 of resin De East レ (east beautiful) system.
(experimental technique)
Sample No.1 only has fluorophor
Luminescent coating
Resin (JCR6140) 89mass%
Yellow fluorophor 10mass%
Red-emitting phosphors 1mass%
The two-layer structure of sample No.2 scattering layer (5mass%)+luminescent coating
Scattering layer
Resin (JCR6140) 95mass%
Scattering diluent (Al 2O 3) 5mass%
Luminescent coating
Resin (JCR6140) 78mass%
Yellow fluorophor 20mass%
Red-emitting phosphors 2mass%
The two-layer structure of sample No.3 scattering layer (10mass%)+luminescent coating
Scattering layer
Resin (JCR6140) 90mass%
Scattering diluent (Al 2O 3) 10mass%
Luminescent coating
Resin (JCR6140) 78mass%
Yellow fluorophor 20mass%
Red-emitting phosphors 2mass%
The two-layer structure of sample No.4 scattering layer (15mass%)+luminescent coating
Scattering layer
Resin (JCR6140) 85mass%
Scattering diluent (Al 2O 3) 15mass%
Luminescent coating
Resin (JCR6140) 78mass%
Yellow fluorophor 20mass%
Red-emitting phosphors 2mass%
Sample No.5 scattering diluent mixing phosphor
Resin (JCR6140) 80mass%
Scattering diluent (Al 2O 3) 20mass%
Resin (JCR6140) 78mass%
Yellow fluorophor 20mass%
Red-emitting phosphors 2mass%
(experimental result)
For eliminating scattering layer 22 situation of the single layer structure of luminescent coating 23 is only arranged like that at decent product No.1, and decent product No.5 eliminates under scattering layer 22 added scattering diluent in luminescent coating 23 the situation of single layer structure for same like that, the periphery of 20 white lights of launching to the outside is distributed with sodium yellow from the resettlement section, fails to obtain reducing the effect of form and aspect inequality.
At decent product No.3, No.4 is that the addition of scattering diluent is under the situation of two-layer structure of each scattering layer 22 of 10 quality % (mass%) or 15 quality % and luminescent coating 23 like that, the addition of scattering diluent is more, so the viscosity increased of scattering layer 22, the crawling of generation scattering layer 22.Therefore, be distributed with sodium yellow, fail to obtain reducing the effect of form and aspect inequality at the periphery of 20 white lights of launching to the outside from the resettlement section.
Decent product No.2 is that the addition of the scattering layer 22 of 5 quality % and fluorophor is under the situation of two-layer structure of luminescent coating 23 of 20 quality % for the addition of scattering diluent like that, on the periphery of the white light of launching to the outside from resettlement section 20, almost can not see the distribution of sodium yellow, obtain the uneven effect that reduces of form and aspect of white light.
In addition, the addition of the scattering diluent of scattering layer 22 is during greater than 5 quality %, and the luminous quilt of the light-emitting diode 18 for example light quantity that absorbs of the substrate 14 of system such as Ni increases, so the light beam of 20 white lights of launching to the outside descends from the resettlement section.
Herein, also can constitute reflecting materials such as on the photosurface of this substrate 14, being coated with whitewash and form reflecting surface, thereby prevent from or suppress light beam to descend.
Then, Fig. 5 to Figure 12 illustrates second execution mode of the present invention.Fig. 5 is the key diagram of the second particle of the fluorophor that uses in the light-emitting device, Fig. 6 is the figure that the representative particle size distribution of the fluorophor that has 2 above granularity peaks in the light-emitting device is shown, Fig. 7 is the cutaway view of light-emitting device, Fig. 8 is the cutaway view of an example of electrode connecting structure that the light-emitting component of light-emitting device is shown, Fig. 9 is another routine cutaway view of electrode connecting structure that the light-emitting component of light-emitting device is shown, Figure 10 is the cutaway view that the metewand of the dispersity of fluorophor in the light-emitting device is shown in (a)～(d), Figure 11 is the table of the metewand of embodiment in the light-emitting device and comparative example, Figure 12 be the embodiment that has 2 granularity peaks in the light-emitting device is shown and have 1 granularity peak the mixing ratio of comparative example, the table of the relation of luminous efficiency.
As shown in Figure 7, light-emitting device 31 has base material 32, is formed with light-emitting component and sets portion 33 on this base material 32.
Base material 32 has: substrate 34; Be formed on the lead terminal 35 on this substrate 34; And be formed on reflector 36 on the substrate 34 with this lead terminal 35.
On the lead terminal 35 that is formed on the substrate 34, set circuit pattern (Wiring pattern) 35a, the 35b that is formed with cathode side and anode-side in the portion 33 at light-emitting component.The solid-state light emitting element that is equipped with respectively on this lead terminal 35 as light-emitting component is a light-emitting diode (blue led chips) 37.
Light-emitting diode 37 uses the light-emitting diode chip for backlight unit of blue-light-emitting type for example, light-emitting diode chip for backlight unit of ultra-violet light-emitting type etc.And, in the electrode connecting structure of light-emitting diode 37, preferably use chip connection shown in Figure 8 or floating sheet connection shown in Figure 9 etc.According to these electrode connecting structures, light-emitting diode 37 increases to the light taking-up efficient of front.
In chip shown in Figure 8 connected, the floating sheet of the backplate of light-emitting diode 37 was connected on the circuit pattern 35a, and the overlying electrode of light-emitting diode 37 is electrically connected with circuit pattern 35b by pressure welding lead-in wire 38.And in floating sheet shown in Figure 9 connected, the bump electrode 39 floating sheets such as scolding tin salient point, Au salient point, Au-Su eutectic salient point that are arranged at the back side of light-emitting diode 37 were connected on circuit pattern 35a, the 35b.In addition, Fig. 7 illustrates the light-emitting diode 37 of the chip connection of having used shown in Fig. 8.
Reflector 36 sets at light-emitting component and is formed with the resettlement section 40 that is used to accommodate light-emitting diode 37 in the portion 33.Resettlement section 40 forms the truncated cone of expanding gradually towards the opposition side of substrate 34.
Be filled with luminescent coating 42 in the resettlement section 40 that is equipped with light-emitting diode 37, this luminescent coating 42 is the transparent resin layers that contain fluorophor 41, and light-emitting diode 37 is covered by luminescent coating 42.Luminescent coating 42 is for example formed by silicones, epoxy resin etc.The electric energy that is applied on the light-emitting diode 37 is converted to blue light or ultraviolet ray by light-emitting diode 37, and the fluorophor 41 that these light are contained in the luminescent coating 42 is converted to the longer light of wavelength.And, penetrate light based on the color of the illuminant colour of the color of the light of launching from light-emitting diode 37 and fluorophor 41, for example Bai Se light from light-emitting device 31.
The luminescent coating 42 that contains fluorophor 41 is by adding fluorophor 41 and mixing in the liquid clear resin of for example silicones, epoxy resin etc., use dispenser etc. are filled into such liquid clear resin in the resettlement section 40 and form.At this moment, in order to suppress to entrain into problems such as bubble, preferably use the liquid clear resin of resin viscosity as 0.1Pas～10Pas scope.The resin viscosity of liquid clear resin is easy to generate bubble etc. during greater than 10Pas, and on the other hand, resin viscosity even use the second particle of fluorophor 41, also is difficult to form the luminescent coating 42 that disperses shape during less than 0.1Pas.
The fluorophor 41 that contains in the luminescent coating 42 is sent visible light by the light of launching from light-emitting diode 37 blue light, ultraviolet ray excited for example.Luminescent coating 42 plays the effect of illuminating part, and it is configured in light emission direction the place ahead of light-emitting diode 37.The kind of fluorophor 41 is suitably selected according to the illuminant colour as the light-emitting device 31 of purpose, is not particularly limited.
For example, use the light-emitting diode 37 of blue-light-emitting type to obtain mainly using yellow or orange luminescence fluorophor when white luminous.And,, except yellow or orange luminescence fluorophor, can also use red light-emitting phosphor in order to realize the raising of color rendering etc.As yellow or orange luminescence fluorophor, can use for example RE 3(Al, Ga) 5O 12: YAG fluorophor, AE such as Ca fluorophor (RE is be selected from Y, Gd and La at least a, below identical) 2SiO 4: silicate phosphor such as Eu fluorophor (AE is alkaline earth elements such as Sr, Ba, Ca, below identical).
And, use the light-emitting diode 37 of ultra-violet light-emitting type to obtain mainly using the RGB fluorophor when white luminous.As blue-light-emitting fluorescent material, use for example AE 3(PO 4) 6Cl 12: halogen-phosphate fluorophor, (Ba, Mg) Al that the Eu fluorophor is such 10O 17: the chlorate MClO 3 fluorescent substance that the Eu fluorophor is such etc.As the green emitting fluorophor, use (Ba, Mg) Al 10O 17: Eu, the chlorate MClO 3 fluorescent substance that the Mn fluorophor is such etc.As red light-emitting phosphor, use La 2O 2The oxysulfide fluorophor that the S:Eu fluorophor is such etc.
And, substitute above-mentioned fluorophor, can also use the nitride-based fluorophor that can access various illuminant colours (AE for example according to forming 2: Si 5N 8: Eu), oxynitride based phosphor (Y for example 2SiO 3N 4: Cc), silicon aluminum oxygen nitrogen class fluorophor (for example AEx (Si, Al) 12(N, O) 16: Eu) etc.In addition, light-emitting device 31 is not limited to white light-emitting lamp, can also constitute the light-emitting device 31 with white illuminant colour in addition.When obtaining luminous for example Neutral colour luminous beyond the white,, suitably use various fluorophor according to illuminant colour as target by light-emitting device 31.
For example shown in Figure 5, the fluorophor 41 that contains in the luminescent coating 42 has fluorophor second particle 44, the phosphor particle of second particleization after the granule 43,43 that these fluorophor three second particles 44 are fluorophor is bonded to each other.And the particle diameter of this fluorophor second particle 44 is in the scope of 5 μ m～10 μ m.In addition, when using RGB fluorophor etc. in fluorophor 41, each blue, green, red fluorophor uses has the fluorophor 41 of particle diameter at the fluorophor second particle 44 of 5 μ m～10 mu m ranges.And the situation that the fluorophor more than 2 kinds 41 beyond the hybrid RGB fluorophor uses is also identical.
Fluorophor second particle 44 shown in Figure 5 is for example made in the following manner.That is, when firing phosphor raw material and making phosphor particle, adjust firing temperature, firing time, the crystal growth state of control phosphor particle, thus can access phosphor particle with fluorophor second particle 44.And the particle diameter of fluorophor second particle 44 can be handled by the classification of for example implementing screening etc. in manufacture process and control.
Such fluorophor second particle 44 is that the granule 43,43 of fluorophor in the crystal growth process is bonded to each other and forms, and is not easily separated, and demonstrates near having the luminous efficiency of the primary particle of the particle diameter suitable with the particle diameter D of second particle 44.And, to compare with the primary particle that has with the equal particle diameter of particle diameter D, surface area is big, so have the little feature of sinking speed in the liquid clear resin.Thus, can not reduce the luminous efficiency of fluorophor 41 self, can suppress resin viscosity for example and be the sedimentation of the fluorophor 41 in the liquid-transparent resin of 0.1Pas～10Pas scope.Herein, the particle diameter of fluorophor second particle 44 is during less than 5 μ m, can not avoid the decline of the luminous efficiency of fluorophor 41 self.On the other hand, particle diameter is during greater than 10 μ m, even fluorophor second particle 44, also sedimentation in the liquid clear resin easily.
As mentioned above, use has the fluorophor 41 that particle diameter is the fluorophor second particle 44 of 5 μ m～10 μ m, even thereby using resin viscosity under the situation of the liquid clear resin of 0.1Pas～10Pas scope, also can suppress the decline of the luminous efficiency of fluorophor 41 self, reproducibility obtains phosphor particle well for disperseing the luminescent coating 42 of shape.Therefore, the light-emitting device 31 of luminous efficiency excellence can be provided.And, in the manufacture process of luminescent coating 42, for example suppress the sedimentation of phosphor particle in dispenser, so can be efficiently and make the luminescent coating 42 that disperses shape accurately.Thus, can realize the raising of the fabrication yield of light-emitting device 31, the minimizing of manufacturing cost etc.
And, for example used under the situation of light-emitting diode 37 of blue-light-emitting type, blue-light-emitting from light-emitting diode 37 passes through to obtain white luminous through the blue light between the particle of fluorophor 41 with by sodium yellow or orange-colored light blend color that blue-light-emitting excited fluophor 41 produces.Therefore, the particle diameter of fluorophor 41, shape influence big to the illuminant colour of light-emitting device 11.If the particle diameter of fluorophor 41 is big, then the slit becomes big, so if do not increase the mixing ratio of fluorophor 41, the then colour temperature that can not obtain wishing.With respect to this, have the fluorophor 41 of fluorophor second particle 44 by use, the slit that can reduce fluorophor 41 will obtain the required fluorescence scale of construction of target white temperature so can reduce.Thus, can reduce the manufacturing cost of light-emitting device 31.
Then, the example of light-emitting device 31 with following fluorophor is described, described fluorophor possesses 2 phosphor particles with the superiors of existence, replaces using second particle 44.In addition, the basic structure of light-emitting device 31 is identical.
The fluorophor 41 that contains in the luminescent coating 42 has 2 phosphor particles with the superiors of existence in particle size distribution.Specifically, as shown in Figure 6, fluorophor 41 has as the first phosphor particle group of the major part that constitutes the fluorophor 41 in the luminescent coating 42 and the average grain diameter second phosphor particle group less than the first phosphor particle group.The average grain diameter of the first phosphor particle group is preferably for example scope of 5 μ m～15 μ m under the prerequisite of luminous efficiency of keeping light-emitting device 31 etc.On the other hand, the second phosphor particle group is present between the particle of the first phosphor particle group, is used for improving the dispersity of the fluorophor 41 of luminescent coating 42, preferably has for example average grain diameter of 1 μ m～3 mu m ranges.
Like this,, can improve illuminant colour, the luminous efficiency of light-emitting device 31 by between the particle of the first phosphor particle group, there being the second phosphor particle group, or the use amount of cutting down fluorophor 41.For example, use the light-emitting diode 37 of blue-light-emitting type to obtain under the white luminous situation, by the existence second phosphor particle group between the particle of the first phosphor particle group, thus the luminous quantity of raising yellow or orange luminescence fluorophor.Therefore, can reduce and to obtain the required fluorescence scale of construction of target white temperature.In addition, under the identical situation of the fluorescence scale of construction, can improve white temperature, luminosity.
In addition, can be with light-emitting device 31 and the incompatible formation lighting device of set of lenses.
Then, with reference to the table of Figure 11 and Figure 12, each embodiment and the evaluation result thereof of second execution mode is described.
At first, embodiment 1～4, comparative example 1～3 are described.
Made in the following manner (Y, Gd) 3(Al, Ga) 5O 2: the YAG fluorophor that Cc forms.Weigh each element (Y, Gd, Ga, Ce) of scheduled volume, their dissolving backs is coprecipitated.In this coprecipitated thing after mixed aluminium oxides and the aluminium chloride, in air, under the condition shown in the table of Figure 11, fire as flux.These are respectively fired after thing pulverizes, implement to clean, separate, dry each handle, further use sieve to come classification, thereby obtain YAG fluorophor as target.The average grain diameter of YAG fluorophor is adjusted by the mesh of sieve.For example, will be less than the particle of 5 μ m with greater than the particle removal of 10 μ m among the embodiment 1 with sieve.
Observe the result of the grain shape of each the YAG fluorophor that obtains like this with SEM, the YAG fluorophor that confirms embodiment 1～4 all has second particle.In addition, each YAG fluorophor comprises the part primary particle, but its ratio is about 20%.That is, the ratio of primary particle and second particle (quantity ratio) is 2: 8.On the other hand, the YAG fluorophor of comparative example 1～3 is primary particle.And, measured the average grain diameter of these each YAG fluorophor by the Ku Erte counting method.It is the results are shown in the table of Figure 11.
Then, use each YAG fluorophor, make the light-emitting device of formation shown in Figure 7.That is, each YAG fluorophor is dispersed in the silicones that resin viscosity is 0.3Pas.After being filled into these each silicones in the resettlement section with dispenser, silicones being solidified, thereby make light-emitting device respectively.In addition, the YAG fluorophor is 10 quality % with respect to the addition of silicones.In these each light-emitting devices 31, the luminous efficiency of fluorophor, the coating that contains the silicones of fluorophor, the dispersiveness of fluorophor in silicone layer have been regulated.These measurement results are shown in the table of Figure 11.
In addition, the luminous efficiency of fluorophor is the relative value that the luminous efficiency of comparative example 3 is made as 1 o'clock.Coating for the silicones that contains fluorophor, to not have fluorophor to be deposited in the dispenser, be made as zero in the little situation of deviation of the coating weight of identical coating condition (coating is pressed, time), with fluorophor sedimentation in dispenser, be made as in the big situation of deviation of the coating weight of identical coating condition *.And, for the dispersiveness of fluorophor in silicone layer, to evenly disperse the situation of fluorophor 41 to be made as ◎ as the top of Figure 10 (a) light-emitting diode that is shown in 37, will be shown in Figure 10 (b) fluorophor 41 be dispersed in luminescent coating 42 situation on all and be made as zero, will be shown in Figure 10 (c) fluorophor 41 situation that is dispersed in half following scope of luminescent coating 42 be made as △, will be shown in Figure 10 (d) fluorophor 41 situation that is deposited to luminescent coating 42 belows be made as *.
By the table of Figure 11 as can be known, used each embodiment of fluorophor second particle, although use the transparent resin of resin viscosity, the coating of transparent resin, the fluorophor excellent dispersion in resin bed as 0.3Pas.Thus, can realize the dispersion shape structure of fluorophor 41 by the resin bed that does not entrain into bubble etc.And,, can improve luminous efficiency by the resin bed of such dispersion shape is set.In addition, even, also can access same effect having used under the situation of resin viscosity as the transparent resin of 3Pas.And, used under the situation of RGB fluorophor even confirm at fluorophor as other, by using the fluorophor second particle, also can reproducibility obtain disperseing the resin bed of shape well.
Then, embodiment 5～6, comparative example 4～6 are described.
By screening particle size range is mixed at the YAG fluorophor of 1 μ m～3 μ m in YAG fluorophor and the particle size range of 5 μ m～10 μ m, make the fluorophor of embodiment 5.Similarly, particle size range is mixed at the YAG fluorophor of 1 μ m～3 μ m in YAG fluorophor and the particle size range of 7 μ m～15 μ m, make the fluorophor of embodiment 6 by screening.In addition, comparative example 4～6 use separately respectively particle size range at the YAG fluorophor of 5 μ m～10 μ m, particle size range at the YAG fluorophor of 7 μ m～15 μ m, particle size range YAG fluorophor at 1 μ m～7 μ m.
Use each the above-mentioned embodiment and the fluorophor of comparative example, adopt the mode identical to make light-emitting device respectively with embodiment 1.At this moment, adjusting can access the fluorescence body weight (fluorophor is with respect to the combined amount of silicones) of the white temperature of 5000K.Then, measure the luminous efficiency that white temperature is the light-emitting device of 5000K.These measurement results are shown in the table of Figure 12.In addition, the luminous efficiency of fluorophor is the relative value that comparative example 4 is made as 1 o'clock.
By the table of Figure 12 as can be known, in the light-emitting device of embodiment 5,6, can reduce the combined amount that obtains the required fluorophor of equal colour temperature, and the luminous efficiency of fluorophor is descended.Thus, can reduce manufacturing cost, and the characteristic of light-emitting device is descended.
Figure 13 to Figure 16 illustrates the 3rd execution mode.Figure 13 is the cutaway view of the light emitting module of lighting device, and Figure 14 is the front view of light emitting module, and Figure 15 is the front view of lighting device, and Figure 16 is the key diagram of the combination of materials example of light emitting module.
Among Figure 15, the 51st, lighting device, this lighting device 51 has the equipment main body 52 that forms quadrangle and thin type, be formed with tetragonal peristome 53 on the surface of this equipment main body 52, in this peristome 53, be and be arranged with a plurality of tetragonal light emitting modules 54 rectangularly, form light-emitting areas 55 by these a plurality of light emitting modules 54.
As shown in figure 13, the solid-state light emitting element that each light emitting module 54 has as light-emitting component is a light-emitting diode (light-emitting diode chip for backlight unit) 61, it is face side that these a plurality of light-emitting diodes 61 are the one side that is provided in substrate 62 rectangularly, and this substrate 62 is to be formed by the material that for example glass epoxy resin, aluminium and aluminium nitride etc. have a high thermal conductivity.
Coating is as the adhesive 63 of insulating barrier on the one side of this substrate 62, this adhesive 63 be modular ratio epoxy resin low, than engineering plastics height and have insulating properties and the thermosetting resin of heat conductivity or thermoplastic resin, across the first insulating barrier 63a that is formed by this adhesive 63, bonding configuration is the conductive layer 64 of copper, gold and nickel etc. for example.Utilize this conductive layer 64 to form circuit patterns 65, on this circuit pattern 65, be the light-emitting component that is formed for installing light-emitting diode 61 rectangularly and set portion 66.Set in the portion 66 at each light-emitting component, an electrode of light-emitting diode 61 is connected with a utmost point pattern of circuit pattern 65 by the chips welding (die bonding) that is formed by silver paste as articulamentum 81, and another electrode of luminous two diode elements 61 is connected with another utmost point pattern of circuit pattern 65 by the lead-in wire 67 of wire bonding (wire bonding).
Across by the second insulating barrier 63b that forms with first insulating barrier 63a adhesive 63 of the same race and the bonding reflector 68 that disposes, this reflector 68 is formed by the material that for example glass epoxy resin, engineering plastics, aluminium and aluminium nitride etc. have high-fire resistance and high reflection characteristic on the one side side of substrate 62.On this reflector 68 with each light-emitting component set portion 66 accordingly opening be formed with a plurality of resettlement sections 69, be equipped with each light-emitting diode 61 with the state of accommodating respectively in described a plurality of resettlement sections 69.In each resettlement section 69, be that promptly the opening footpath B of the inside side is big than substrate 62 sides for the opening footpath A of face side as lens 76 sides of the opposition side of substrate 62 sides, promptly from the inside lateral surface side expansion, be formed with the reflecting surface 70 of inclination over the ground from substrate 62 lateral lenses 76 sides with resettlement section 69 inner faces.Can also on reflecting surface 70, form the high reflectance coatings of light reflectivity such as for example white titanium oxide, copper, nickel, aluminium.
Shape for resettlement section 69 has following relation: when the opening of lens 76 sides that will be opposite with substrate 62 directly is made as A, the opening of substrate 62 sides directly is made as B, the degree of depth of resettlement section 69 is made as h, when the angle of lens 76 sides expansion is made as θ, satisfies θ=tan from substrate 62 -1{ h/ (A-B) }＞45 °.
On resettlement section 69, be formed with transparent two layers the resin bed 72,73 that covers light-emitting diode 61.The resin bed 72 that directly covers the lower floor of light-emitting diode 61 is scattering layers 74, this scattering layer 74 uses for example silicones of UV resistant, rubber-like, is dispersed with to be used to make from the visible light of light-emitting diode 61, the scattering diluent of ultraviolet scattering in scattering layer 74.And, the resin bed 73 on upper strata uses silicones, epoxy resin and modified epoxy etc., constitute sedimentation the luminescent coating of visible light transformational substances such as fluorophor, be visible light conversion layer 75, the ultraviolet ray of this visible light transformational substance self-luminous in the future diode element 61 is converted to visible light.
Across by the 3rd insulating barrier 63c that forms with the first insulating barrier 63a and second insulating barrier 63b adhesive 63 of the same race and set lens 76, these lens 76 are formed by for example translucent resin such as Merlon and acrylic resin on the face side of reflector 68.Used at substrate 62 under the situation of thermosetting resin, thermosetting resin that will be of the same race with it is as the material of lens 76.And, having used at substrate 62 under the situation of thermoplastic resin, thermoplastic resin that will be of the same race with it is as the material of lens 76.
Corresponding each light-emitting diode 61, lens 76 have the lens section 77 that forms lens shape, on each lens section 77, be formed with the plane of incidence 78 of the concavity of light incident opposed to each other, the exit facet 80 that is formed with reflecting surface 79 that the light that will incide this plane of incidence 78 reflects, makes the light that incides the plane of incidence 78 and penetrate by the light of reflecting surface 79 reflections with resettlement section 69.On the exit facet 80 of these a plurality of lens sections 77, be formed with the light-emitting area 55 shared with light emitting module 54.
In addition, base material is formed by substrate 62, circuit pattern 65, reflector 68 etc.By illuminated in combination diode element 61 on this base material, form light-emitting device.By compound lens 76 on this light-emitting device etc., form light emitting module 54, utilize a plurality of light emitting modules 54 to form lighting devices 51.
And, the combination example 1,2,3,4 of the combination of materials of substrate 62, adhesive 63 (the first insulating barrier 63a, the second insulating barrier 63b, the 3rd insulating barrier 63c), conductive layer 64, reflector 68, lens 76 has been shown among Figure 16.Combination example 2,3,4 only illustrates the combination of the material different with making up example 1.
When light-emitting diode 61 was lighted, the heating of light-emitting diode 61 passed to substrate 62, conductive layer 64, reflector 68, lens 76 etc., but because of the different thermal expansion differences that produce of the material of these substrates 62, conductive layer 64, reflector 68, lens 76.Owing to will be adhesively fixed between these substrates 62, conductive layer 64, reflector 68, the lens 76 with adhesive of the same race 63, so can absorb thermal expansion difference, suppress the generation peel off, keep the state of being adhesively fixed reliably, described adhesive 63 of the same race be modular ratio epoxy resin low, than engineering plastics high thermosetting resin or thermoplastic resin.
And, configuration conductive layer 64, light-emitting diode 61, reflector 68, resin bed 72,73 and lens 76 on substrate 62, and, reflector 68 and lens 76 use adhesive of the same race 63 bonding respectively, so can improve from the thermal diffusivity of substrate 62, can suppress peeling off between substrate 62 and reflector 68 and the lens 76, warpage, can keep optical characteristics, and, can suppress the deterioration of resin bed 72,73, lens 76 etc., realize that light takes out the raising of efficient.And employed adhesive 63 is of the same race, thus the installation of lens 76 also can when making substrate, carry out, thereby the efficient height.
And the shape of resettlement section 69 is defined as has following relation: when the opening with lens 76 sides directly is made as A, the opening of substrate 62 sides directly is made as B, and the degree of depth of resettlement section 69 is made as h, when the angle of substrate 62 lateral lenses 76 sides expansion is made as θ, satisfies θ=tan -1{ h/ (A-B) }＞45 °, thus can irrespectively will take out the efficient optimization with size, the kind of light-emitting diode 61 from the light of resettlement section 69, can design resettlement section 69 easily.
And, the resin bed 73 that is arranged at the upper strata in two layers the resin bed 72,73 of covering light-emitting diode 61 of the resettlement section 69 visible light conversion layer 75 of visible light transformational substance that has been sedimentations, so can be easy to the light of more visible region is taken out, can improve light and take out efficient.And, since sedimentation the visible light transformational substance, so visible light and the ultraviolet ray from resin bed 72 irradiation of lower floor can be shone the visible light transformational substance efficiently, and, can set the thickness of the resin bed 73 on upper strata arbitrarily.
Because the resin bed 72 of lower floor is the scattering layer 74 of having sneaked into scattering diluent, so the light that can launch from light-emitting diode 61 the boundary face uniform irradiation between the visible light conversion layer 75 on the scattering layer 74 of lower floor and upper strata.
In addition, if lead-in wire 67 is positioned on two layers the boundary face of resin bed 72,73, then become the generation reason of form and aspect inequality.Lead-in wire 67 height and position is according to decisions such as the hardness of the height of light-emitting diode 61, lead-in wire 67, operations.Therefore, height at light-emitting diode 61 is about 75 μ m, 69 bottom surface is when the height of lead-in wire 67 extreme higher position is 200 μ m from the resettlement section, preferably the thickness with the resin bed 72 of lower floor is made as 250 μ m, the thickness of the resin bed 73 on upper strata is made as 750 μ m, and 69 bottom surface is when the height of the extreme higher position of lead-in wire 67 is 425 μ m from the resettlement section, preferably the thickness with the resin bed 72 of lower floor is made as 475 μ m, and the thickness of the resin bed 73 on upper strata is made as 525 μ m.So degree of depth the best of resettlement section 69 is 800 μ m～1200 μ m, more preferably 1000 μ m.
And disperseing the filler below the 10-9m in the resin bed 72 of lower floor is inorganic nanoparticles.As nano particle, use is controlled at the nano silicon oxide of the following narrow viscosity profile of 50nm etc., and weight item is 0.1%～60%, and transmission of visible light is 50%～90%.
Like this,, can improve pyroconductivity, improve thermal diffusivity substrate 62, reflector 68 and lens 76 etc. by in the resin bed 72 of lower floor, disperseing inorganic nanoparticles.
The present invention is used for using within doors, priming illumination of room external application, for motor vehicle moving body illumination etc.

Claims (8)

1. a light-emitting device is characterized in that, this light-emitting device has:
Light-emitting component, it is provided on the base material;
Scattering layer, its covering luminous element; And
Luminescent coating, it is provided in the upper strata of scattering layer.
2. light-emitting device according to claim 1 is characterized in that scattering layer has scattering diluent, and the addition of scattering diluent is 3 quality %～5 quality %.
3. light-emitting device according to claim 1 and 2 is characterized in that, the composition surface of scattering layer and luminescent coating forms the cancave cambered surface to light-emitting component side depression.
4. a light-emitting device is characterized in that, this light-emitting device has:
Light-emitting component, it is provided on the base material; And
Luminescent coating, it contains fluorophor, visible light is sent in the optical excitation that this fluorophor is launched from light-emitting component, fluorophor contain fluorophor the formation of granule second particle, particle diameter is at the phosphor particle of 5 μ m～10 mu m ranges.
5. a light-emitting device is characterized in that, this light-emitting device has:
Light-emitting component, it is provided on the base material; And
Luminescent coating, it contains fluorophor, and visible light is sent in the optical excitation that this fluorophor is launched from light-emitting component, and fluorophor contains phosphor particle, and this phosphor particle has 2 particle size distribution with the superiors of existence.
6. according to claim 4 or 5 described light-emitting devices, it is characterized in that luminescent coating is to fill and solidify viscosity to form at the resin of 0.1Pas～10Pas scope.
7. according to any described light-emitting device of claim 4 to 6, it is characterized in that,
Light-emitting component has the light-emitting diode of launching blue light,
Fluorophor has yellow or orange luminescence fluorophor, and the blue light that this yellow or orange luminescence fluorophor are launched from light-emitting diode excites, and sends sodium yellow or orange-colored light.
8. a lighting device is characterized in that, this lighting device has:
Any described light-emitting device of claim 1～7; And
Be configured in the lens on the base material.
CNA2005800090825A 2004-03-24 2005-03-23 Light-emitting device and illuminating device Pending CN1934721A (en)

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CN101459163B (en) * 2007-12-12 2011-07-06 富士迈半导体精密工业（上海）有限公司 Light emitting diode
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