CN1873360A - Ring type heat exchanging system - Google Patents
Ring type heat exchanging system Download PDFInfo
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- CN1873360A CN1873360A CN 200510035159 CN200510035159A CN1873360A CN 1873360 A CN1873360 A CN 1873360A CN 200510035159 CN200510035159 CN 200510035159 CN 200510035159 A CN200510035159 A CN 200510035159A CN 1873360 A CN1873360 A CN 1873360A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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Abstract
The present invention provides a ring circuit heat exchange equipment. It includes an evaporation portion, a steam conduit, a condensation portion and a reflux conduit. Said evaporation portion is a closed cavity body its interior is equipped with a multiple microflow channel capillary structure, said capillary structure can separate the cavity body space into liquid phase microflow channel zone and steam channel zone, said two channel zones are series-connected with said condensation portion respectively by means of external steam conduit and reflux conduit so as to form a complete ring circuit type heat exchange radiation system. Said condensation portion is formed from fins and condensation tube. Said invention not only has high heat transfer efficiency, but also can obtain good heat exchange effect.
Description
[technical field]
The present invention system is about a kind of heat-exchange device, refer to especially a kind of need not additionaling power and can change the loop type heat-exchange device of the comprehensive analgesic function of performance along with the high and low power output of heater element.
[background technology]
Fast development along with electronics and information industry, the high-tech electronic product is just towards more frivolous small and exquisite and multi-functional, high-speed trend development, yet under electronic component operation frequency and the continuous lifting of speed, its heat that disengages is more and more high with making, the running performance and the stability of serious threat electronic component, even Yin Gaowen and burn these expensive electronic components, to directly influence the life-span and the running quality of electronic component based on the quality of heat abstractor, for guaranteeing the normal operation of electronic component, must carry out effectively and heat radiation fast electronic component.Only existing independent forced air-cooled heat abstractor is difficult to satisfy the radiating requirements of high-frequency high-speed electronic component development, desire to make the high-tech electronic product to bring into play due function, design have high efficiency, light weight, super-silent and automatically regulate the heat energy power of moving, and can make the heat abstractor of Flexible Design with the existing small space of product with electronic component different operating power, become significant challenge and chance that industry develops advanced electronic product of future generation.
Be applied at present that the heat abstractor of existing many different structures and pattern is disclosed in the patent documentation in the heat radiation field of computer microprocessor (CPU), most typical example is to utilize heat pipe to reach the device of heat-transfer effect, its operation principle is the liquid by working fluid, the latent heat of vapour two phase change transmits heat: be included in evaporator section mat evaporation latent heat and take away a large amount of heats from thermal source, make steam fast by space in the former pipe that has vacuumized, and condense into liquid and discharge heat energy at condensation segment, and hydraulic fluid is back to evaporator section by the capillary force that capillary structure provided that is attached at the metal circular tube inwall, reaches the heat energy circulation that continues phase change.Only existing hot pipe technique has following shortcoming to be overcome, comprising:
(1) steam and withdrawing fluid be in same Guan Zhongzuo reverse flow (counter-current flow), hinders the backflow of liquid mat capillary force, and then mummification (dry-out) takes place cause heating up rapidly, limits its maximum heat-sinking capability.
(2) the coagulating liq return flow line is to utilize the capillary structure identical with evaporator section in the condensation segment, though capillary force increases with pore diameter minimizing wherein, but the frictional resistance of fluid also increases thereupon, and the latter is unfavorable for the backflow of hydraulic fluid and mummification easily takes place, limits its maximum heat-sinking capability.
For avoiding above-mentioned shortcoming, be the exploitation that loop hot-pipe is arranged, Fig. 1 is the schematic diagram of an existing loop hot-pipe, its formation comprises an evaporation part 1, is located at capillary structure 2, steam lead 3, condensation part 4, return-flow catheter 5 and compensating liquid chamber 6 in the evaporation part 1.Its operation principle also is that the liquid by working fluid, the latent heat of vapour two phase change transmit heat, also complete inner the capillary force that capillary structure 2 provides of the start of working fluid, but be better than liquid that the conventional heat pipe part mainly is working fluid, vapour two-phase respectively with different runner turnover evaporation parts 1, flowing of two-phase do not interfered with each other and heat is reached condensation part 4 shed, wherein compensating liquid chamber 6 is the amount of liquid that segment fluid flow is scattered in return when being used for compensating start, avoids evaporation part 1 mummification.Only on practice, still have many shortcomings to be overcome, comprising:
(1) the porous capillary structure system in the evaporation part 1 is made by metal powder sintered, therefore its internal void size can't obtain the architectural characteristic and the quality of homogeneous usually, not only can't effectively guide liquid, vapour two phase change of working fluid generation same degree really, and, be unfavorable for volume production because the thickness of capillary structure difficulty is controlled, low, the difficult processing cost height of finished product yield.
(2) evaporation part 1 is with cylinder design with condensation part 4, can't do good thermo-contact and reduce hot transfer efficiency with flat form and heater element or heat dissipation element, and be unfavorable for the trend of product thin design, and its restriction is arranged in application.
(3) when heat makes the water boiling at capillary structure 2 centers, might make steam, destroy original mechanism that single direction conducts heat of following along return-flow catheter 5 adverse currents.
(4) for avoiding adverse current to take place, capillary structure 2 often can far be inferior to other metal (as nickel and alloy thereof) making of copper with heat transfer property, reduce thermal response speed and heat transfer efficiency.
(5) lack the design of steam chest in the evaporation part 1, can't hold the pressure of the working fluid heat absorption back saturated vapor that produces, so the easy rising radiating effect variation consequently rapidly of temperature.
(6) radiating mode of condensation part 4 is set by the limited peripheral area of fluid transfer conduits, except that making the unfavorable factor of overall thermal resistance increase because of increasing interface thermal resistance (interface resistance) and dispersion thermal resistance (spreading resistance), the heat that also is unfavorable for the high enthalpy fluid that will flow through fast in the conduit effectively spreads out of, and seriously limits its maximum heat-sinking capability.
(7) though just maybe can accept only can handle the heat radiation of a certain certain power scope on the cooling application in some field, the heat radiation product in the time of can't solving low power ranges very; But with regard to the heat radiation that existing loop hot-pipe is applied to CPU, often only consuming very low power through the holding state (idle) after the total power start, so that in evaporation part 1, only can produce steam in a small amount, can make working fluid be pushed to the space, loop gradually but can't make enough condensate liquids be back to evaporation part 1, heating up to causing mummification eventually, is the activation problem that prior art is difficult for eliminating.
The loop-type heat exchange of high-quality heat radiation product must possess following three primary conditions: the liquid in (1) loop, vapour separate and follow single direction and conducts heat, (2) make the smooth and easy and heat absorption district that is back to the evaporation part in time of liquid to prevent mummification, and (3) change along with the high and low power of heater element and modulation heat-sinking capability voluntarily, bringing into play comprehensive analgesic function, also is the important topic that current design high-performance loop-type heat exchange heat radiation product must solve simultaneously in the lump.This creation changes the fluid gross space of thermal resistance, flow resistance, working fluid storage and the phase change kenel thereof of each element in cyclic system and distribution, loop, the design optimization that the position of condenser is set and moves many important parameters such as thermal capacity via the liquid of comprehensive consideration working fluid, vapour phase, and proposition one effectively overcomes the loop type heat-exchange device of the shortcoming of above-mentioned many prior aries.
[summary of the invention]
A kind of loop type heat-exchange device in order to quick diversion heater element heat, comprise an evaporation part, a steam lead, a condensation part and a return-flow catheter, wherein this evaporation part is a slim vacuum seal cavity, establish many microchannels capillary structure in it, this capillary structure separates steam channel district into liquid phase microchannel district and low flow resistance with cavity space, this two channel region with external steam lead and the return-flow catheter condensation part of contacting, constitutes a complete loop-type heat exchange cooling system respectively.
Be filled with in this cooling system and can change the working fluid that produces different boiling degree with temperature of heating elements, steam by low flow resistance steam lead spontaneous evaporation in the future portion is delivered to the condensation part fast, this condensation part is made of fin and condenser pipe, reach high heat transfer efficiency by enough heat absorption and the area of dissipations of provide, and provide the backflow mechanism of condensate liquid, remove effectively to overcome in the prior art and the condensation part is set with the limited peripheral area of fluid transfer conduits, overall thermal resistance is increased and seriously limit outside the unfavorable factor of its maximum heat-sinking capability, and can overcome the unreasonable design defect that steam lead and return-flow catheter can only use same caliber, and can overcome too much condensate liquid simultaneously and hoard in the condensation part, thereby cause the shortcoming of evaporation part mummification.
This loop type heat-exchange device is by the return-flow catheter that is filled up by high capillary force imbibition structure fully; the any condensing liquid quantity that refluxes from this condensation part all can be seen through like the return-flow catheter as the sponge suck the evaporation part fast; guarantee liquid, the vapour separation in the loop and follow single direction to conduct heat; and can change and quick voluntarily modulation along with the high and low power of heater element, bring into play comprehensive analgesic function.
Main creation purpose of the present invention is by the system design aid of integrating evaporation part, condensation part, steam lead and return-flow catheter, reach and both make when holding state, still can make the heat abstractor of this creation continue normal operation, effectively overcome the activation problem that prior art is difficult for eliminating, and can change and quick voluntarily modulation along with the high and low power of heater element, bring into play comprehensive analgesic function.
Another creation purpose of the present invention is the design by the evaporation part, comprise with capillary structure the evaporation part is separated that to be liquid phase microchannel district with the steam channel district of the low flow resistance of tool, in the heat absorption district be provided with than the soaking plate of its lower cover thickness of slab and corresponding to the set designs such as radiator of upper and lower cover plate outer wall in liquid phase microchannel district that liquid, the vapour of guaranteeing the evaporation part separate and follow single direction and conducts heat.
Another creation purpose of the present invention is by designing with the condensation part of evaporation part collocation, provide enough heat absorption and area of dissipations to reach high heat transfer efficiency, and provide the backflow mechanism of condensate liquid, remove effectively to overcome in the prior art and the condensation part is set with the limited peripheral area of fluid transfer conduits, overall thermal resistance is increased and seriously limit outside the unfavorable factor of its maximum heat-sinking capability, and can prevent that too much condensate liquid from hoarding in the shortcoming that wherein causes the evaporation part mummification.
A creation purpose more of the present invention is to design by the low flow resistance blank pipe of collocation evaporation part and condensation part and the steam lead that imposes insulation, and filled up by wire or wire netting fully and the return-flow catheter design of the high capillary force imbibition structure of can arrange in pairs or groups tube wall tool minute groove or sintering etc., guarantee that steam is delivered to the condensation part fast, and equal can the seeing through like the return-flow catheter as the sponge of any condensing liquid quantity that makes backflow enters the evaporation part fast, effectively overcome in the prior art and to cause too much condensate liquid to hoard in wherein because of catheter design is bad, thereby cause the shortcoming of mummification.
[description of drawings]
Be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is one of existing loop hot-pipe schematic perspective view;
Fig. 2 is one of first embodiment of a loop type heat-exchange device of the present invention stereoscopic schematic diagram;
The profile that Fig. 3 is looked by the A-A cross section by the evaporation part among Fig. 2;
Fig. 4 removes one of upper cover plate schematic perspective view for the evaporation part among Fig. 2;
Fig. 5 is one of condensation part stereogram among Fig. 2;
The profile that Fig. 6 is looked by the B-B cross section by the condensation part among Fig. 5;
Fig. 7 is one of second embodiment of a loop type heat-exchange device of the present invention stereoscopic schematic diagram;
The profile that Fig. 8 is looked by the C-C cross section by the condensation part among Fig. 7;
Fig. 9 is one of the 3rd embodiment of a loop type heat-exchange device of the present invention stereoscopic schematic diagram;
The profile that Figure 10 is looked by the D-D cross section by the condensation part among Fig. 9;
Figure 11 passes in and out one of the distributor of condensation part schematic diagram for steam; And
Figure 12 is another schematic diagram of the distributor of steam turnover condensation part.
[specific embodiment]
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
Fig. 2 sees schematic perspective view for outside first embodiment of loop type heat-exchange device of the present invention, comprises an evaporation part 10, a steam lead 30, a condensation part 50 and a return-flow catheter 70.
The profile that Fig. 3 is looked along the A-A cross section by the evaporation part among Fig. 2 10, this evaporation part 10 comprises upper cover plate 12 and lower cover 14, upper cover plate 12 constitutes a flat cavity 16 that seals with lower cover 14, be provided with many microchannels capillary structure that wire netting constituted of several layers of consolidation arrangement in it, this capillary structure separates steam channel district 16b into liquid phase microchannel district 16a and low flow resistance with cavity space.The upper and lower cover plate 12,14 of evaporation part 10 is the inner concavity lid of being made by the good material of thermal conductivity, these lower cover 14 bottoms are a slab 14a near steam channel district 16b one side, and be a thin plate 14b away from steam channel district 16b one side, a heat-absorbent surface 22 is formed at the bottom of slab 14a.
Fig. 4 removes one of upper cover plate 12 schematic perspective view for the evaporation part 10 among Fig. 2, wherein being evaporated the tight capillary structure that coats of portion's 10 cavitys is that the wire netting that is piled up by the multilayer consolidation closely pastes the upper cover plate 12 and the formed many microchannels capillary structure of lower cover 14 inwalls of obeying in cavity, this wire netting system is woven into staggered mesh by metal wire, above-mentioned capillary structure is except the formed microchannel of the original mesh of each layer wire netting, the more capillary microchannel that forms between the wire netting of multilayer consolidation, for withdrawing fluid provides powerful capillary force, the scope that this capillary structure is contained forms the liquid phase microchannel district 16a in the evaporation part 10, and cavity separated be liquid phase microchannel district 16a and steam channel district 16b, the heat-absorbent surface 22 corresponding zones of liquid phase microchannel district 16a and lower cover 14 form heat absorption district 24.When the heat-absorbent surface 22 of evaporation part 10 absorbs heat, distinguish 24 thickness by lower cover 14 thickness much smaller than its heat absorption corresponding to liquid phase microchannel district, not only can bring into play the soaking plate function in this heat absorption district 24, and the working fluid that can effectively suppress to be back to this district is subjected to contiguous high temperature heat absorption district 24 along the lateral heat conduction effect in lower cover 14 cross sections and the vaporization that heats up, so the fluid that is back in the evaporation part 10 can be delivered to this heat absorption district 24 smoothly, effectively prevent the mummification phenomenon.
The start of this loop type heat-exchange device is this system to be vacuumized and fill in it to change the working fluid that produces different boiling degree with temperature of heating elements; by low flow resistance blank pipe and impose steam lead 30 designs of insulation; the steam of the portion of spontaneous evaporation in the future 10 is delivered to the condensation part 50 with big endotherm area and big area of dissipation fast; again by fully by wire; wire netting or other high capillary force structure fill up the capillary structure that is formed; this capillary structure is connected with the capillary structure of evaporation part 10; and the return-flow catheter 70 of the high capillary force imbibition structure that constituted of can arrange in pairs or groups tube wall tool minute groove or sintering etc.; the any condensate liquid that refluxes from this condensation part 50 all can be seen through like the return-flow catheter as the sponge 70 suck evaporation part 10 fast; guarantee the liquid in the loop; vapour separates and follows single direction and conducts heat; and can be along with the height of heater element; low-power changes and modulation voluntarily, brings into play the loop type heat-exchange device of comprehensive analgesic function.
During operation, earlier coat hot interface material (TIM) and make both closely docile between the hot surface with the heat-absorbent surface 22 of lower cover 14 and heater element, heat is passed to earlier among the slab 14a of lower cover 14, reach again in the cavity 16 capillary structure that should slab 14a, to contain in working fluid wherein and produce liquid rapidly, vapour phase changes, become the boiling fluid of rapid expansion, because steam channel district 16b has the bigger flowing space, and because this boiling fluid is very high in the flow resistance of liquid phase microchannel district 16a, inevitable the entering smoothly of boiling fluid is centered around the spacious steam channel district 16b that heat absorption district 24 peripheries do not conform to capillary structure, make in the cavity 16 not reason vaporized expanding and produce too high saturation pressure, form one and have liquid, vapour separates and guarantees the evaporation part 10 that the liquid admission goes out, to drive one day folk prescription to the heat circulating system that carries out high efficiency heat radiation.
Fig. 5 is one of condensation part 50 stereogram among Fig. 2, the profile that Fig. 6 is looked by the B-B cross section by the condensation part among Fig. 5 50, this condensation part 50 comprise some condenser pipes 52, along these condenser pipe 52 bearing of trends pile up and more than condenser pipe 52 wall close thermal contact cross over pipe 56 on several radiating fins 54,, cross over pipe 58 once, wherein steam is by side's turnover under the cross over pipe 58 down; This creation is for making condensation part 50 except providing enough heat absorptions of steam and area of dissipation to reach the high heat transfer efficiency, the condensate liquid mechanism that effectively refluxes more can be provided, use and effectively overcome in the prior art, overall thermal resistance is increased and seriously limit the unfavorable factor of its maximum heat-sinking capability with the limited peripheral area of dissipation cross-over connection condensation part 50 of fluid transfer conduits.
On the practice, as desire to increase the area of dissipation of loop type heat-exchange device by the length that increases steam lead 30, then not only violate the demand of the low flow resistances of steam lead 30, also may be in low heating power (standby) state cause the steam condensation in wherein because of area of dissipation is excessive; In addition, also may under the restriction of system space, cause difficulty in the application; Again, the design of this condensation part 50 must overcome the unreasonable design defect that steam lead in the prior art 30 and return-flow catheter 70 can only use same caliber, and must overcome too much condensate liquid simultaneously and hoard space bigger in condensation part 50, thereby cause the shortcoming of evaporation part 10 mummification.
Based on reaching considering of above-mentioned functions, evaporation part 10 its radiating mode systems of this creation constitute a condensation part 50 with big endotherm area and big area of dissipation by fin 54 and condenser pipe 52 and are serially connected with between steam lead 30 and the return-flow catheter 70, enter the heat exchange that the heat-absorbent surface of the condenser pipe 52 of condensation part 50 and Qi Nei directly contacts even also have the boiling fluid of high steam content (high quality) in the loop, and its outside set radiating fin 54 and fan 80 (please join Fig. 1) of mat sheds heat, but not as in the prior art with the indirect radiating mode of condensation part 50 cross-over connections in the limited peripheral area of fluid conduit systems; Also because this condensation part 50 is to be serially connected with between steam lead 30 and the return-flow catheter 70, be convenient to steam lead 30 and use different calibers, to meet the high-hydroscopicity and pump water capacity (pumping capacity) demand of hanging down flow resistance demand and return-flow catheter 70 of steam lead 30 in the system with return-flow catheter 70.
In addition, be the excessive heat radiation that prevents to cause because of fan directly brushes by the high steam content boiling fluid in the steam lead 30, so that condensation is ahead of time hoarded in this pipe 30, cause phegma not make evaporation part 10 mummification then, so the anti-system measure that this creation is taked is steam lead 30 designs of adopting low flow resistance blank pipe and imposing insulation, comprise the material that adopts poor thermal conductivity, or the surface of steam lead 30 is coated heat-insulating material.
By the cutaway view of condensation part among Fig. 6 50 as can be known, on the condensation part 50, down be respectively equipped with upper and lower dividing plate 60,62 between cross over pipe 56,58 and the fin 54, upper and lower dividing plate 60,62 and condenser pipe 52 joints are provided with perforate, each perforate two ends of corresponding condenser pipe 52 with each respectively connects and sealing, makes upper and lower cross over pipe 56,58, condenser pipe 52 and fin 54 be combined into a complete heat exchange elements.Thereby the bottom surface of following cross over pipe 58 is a wedge shape forms a ramped shaped collecting tray 64, the bottom surface of following cross over pipe 58 and steam lead 30 and return-flow catheter 70 junctions are respectively equipped with steam inlet and phegma outlet 68,69, when steam is entered by the steam inlet 68 of descending cross over pipe 58, by heat energy being released into atmosphere by the heat radiation of each condenser pipe 52 and radiating fin 54, and make steam be condensed into liquid and be back to down the collecting tray 64 of cross over pipe 58 along the tube wall of condenser pipe 52, in the lowest part of collecting tray 64 condensate liquid mat gravity is delivered to return-flow catheter 70 through the phegma outlet 69 of following cross over pipe 58 again, and entering high capillary force imbibition structure in this return-flow catheter 70, any condensate liquid that autocondensation portion 50 is refluxed all can see through like the return-flow catheter as the sponge 70 suction evaporation parts 10 fast.
For avoiding directly entering return-flow catheter 70 by the steam that following cross over pipe 58 enters, baffle plate 66 is set or cage enters this return-flow catheter 70 to intercept most direct bypass of steam (bypass) in return-flow catheter 70 inlet, reach steam and only flow to condenser pipe 52 coolings, condensate liquid is the mat collecting tray 64 smooth purposes that flow into lowest part then.The position that steam is entered by following cross over pipe 58 and condensate liquid is flowed out by cross over pipe 58 down can need be done different arrangements and reach the effect of heat radiation according to practice.
Fig. 7 sees schematic perspective view for outside second embodiment of loop type heat-exchange device of the present invention, the profile that Fig. 8 is looked by the C-C cross section by the condensation part 50 ' among Fig. 7, the difference of itself and first embodiment is that the thinner region outer wall of upper and lower cover plate 14 of the evaporation part 10 of present embodiment installs a radiator 85 in addition respectively additional, following cross over pipe 58, steam inlet 68 ' be located at its side thereby steam and condensate liquid with phegma outlet 69 ' and pass in and out by the side of cross over pipe 58 ' under the condensation part 50 respectively.
Descend the basic structure of cross over pipe 58 ' similar as shown in Figure 8 to first embodiment.When the heat absorption of the lower cover 14 heat absorption districts of evaporation part 10, by the set radiator 85 of upper and lower cover plate 12,14 outer walls corresponding to liquid phase microchannel district, make the unlikely steam heat convection effect that is subjected to contiguous high temperature heat absorption district of the working fluid that is back to this district and the vaporization that heats up, so working fluid can be sent to smoothly this heat absorption district, further be prevented the mummification phenomenon.
This radiator 85 can be one increases the fin of area of dissipation or thermoelectric cooling device etc., since be back in the capillary structure in liquid phase microchannel district liquid stock seldom, and its flow resistance in capillary structure is very low, the temperature of fluid only needs very little heat sink getting final product usually so desire reduces wherein, therefore can adopt the short radiating fin that need not install fan (fanless) additional, only can reach by the Natural Circulation that increases area of dissipation, as long as be to reach the demand, also can be only last, lower cover 12, one of 14 correspondence position installs this radiator 85 additional, use for the Related product that the flattening design requirement is arranged, as mobile computer, especially has the generalization in market.
In addition, this creation is by being arranged at the one forming technique of evaporation part 10 upper and lower cover plate 12,14 outer walls corresponding to radiator 85 with the upper and lower cover plate 12,14 in liquid phase microchannel district, except that can reaching the purpose of simplifying the volume production processing procedure and reducing cost, more radiating efficiency can be further promoted, and the competitiveness of product in market can be directly promoted owing to simplifying installation and lifting reliability because of eliminating the interface thermal resistance.
Fig. 9 is one of the 3rd embodiment of a loop type heat-exchange device of the present invention stereoscopic schematic diagram, Figure 10 is the condensation part among Fig. 9 50 " profile looked by the D-D cross section; the difference of itself and second embodiment is that steam in the present embodiment is by last cross over pipe 56 " enter, condensate liquid is by following cross over pipe 58 " flow out; this moment is because no above-mentioned steam by-pass problem; therefore baffle plate or cage can be set; make steam by last cross over pipe 56 " enter and must pass through condenser pipe 52 " heat radiation; and make the gravity reflux of condensate liquid mat under cross over pipe 58 " collecting tray 64 "; event can be sent to working fluid evaporation part 10 smoothly, overcoming prior art easily causes too much condensate liquid to hoard in the condensation part 50 ", thus the shortcoming of evaporation part 10 mummification caused.
See also Figure 11 and Figure 12, for the steam preference of avoiding importing the condensation part enters the minority condenser pipe, cause the reduction of integral heat sink ability, can be under connecting cross over pipe (first, second embodiment) or go up in the cross over pipe (the 3rd embodiment) distributor 90 is set, this sentences first embodiment and describes for example.This distributor 90 has an inlet and 92 is used to connect steam lead, and end sealing and densely covered perforate 94 is set in the direction towards condenser pipe 52.Like this, the steam that imports condensation part 50 is able to carry out heat exchange by each condenser pipe 52 more equably, helps the further lifting of integral heat sink ability.Because the setting of distributor 90, plate washer among first embodiment or cage can omit.The inlet setting of distributor 90 can be adjusted as required, as position between can being located at down among the cross over pipe 58, as shown in figure 11; The inlet of distributor 90 can also be located at down the position of cross over pipe 58 near a side, as shown in figure 12.The phegma of following cross over pipe 58 outlet 69 can be located at down the position of cross over pipe 58 near sides, also can be arranged on down among the cross over pipe 58 between the position, as long as satisfy be under the lowest part of cross over pipe.
In sum, has the condensation part 50 in this creation loop type heat-exchange device of aforementioned feature, 50 ', 50 " remove and can significantly reduce interface thermal resistance (interface resistance) and disperse thermal resistance (spreadingresistance) and the total system thermal resistance value is reduced; the heat that helps the high enthalpy boiling fluid that will flow through fast in the steam lead 30 spreads out of fast; outside the maximum heat-sinking capability of performance; also therefore make the heater element surface temperature reduction that contact with evaporation part 10, more can effectively suppress too much condensate liquid and hoard in the condensation part 50; 50 '; 50 " the mummification phenomenon that causes the condensate liquid backflow not continue.
This creation loop type heat-exchange device is by the design of evaporation part 10, comprise with capillary structure and evaporation part 10 is separated the thin plate in the steam channel district 16b into the low flow resistance of liquid phase microchannel district 16a and tool, the thick soaking plate that are provided with in heat absorption district 24 and liquid phase microchannel district and corresponding to the set designs such as radiator 85 in the thin-walled outside of the upper and lower cover plate 12,14 of liquid phase microchannel district 16a, liquid, the vapour that can guarantee evaporation part 10 separate and do not interfere with each other, and follow the single direction heat transfer.
This creation loop type heat-exchange device by with the condensation part 50,50 ', 50 of evaporation part 10 collocation " design; provide the enough heat absorptions of steam and area of dissipation to reach high heat transfer efficiency; and to provide the backflow mechanism of condensate liquid; to remove can effectively overcome in the prior art and the condensation part is set; overall thermal resistance is increased and seriously to limit outside the unfavorable factor of its maximum heat-sinking capability; and can overcome too much condensate liquid and hoard in wherein with the limited peripheral area of fluid transfer conduits, thus the shortcoming of initiation mummification.
This creation loop type heat-exchange device is by collocation evaporation part 10 and condensation part 50,50 ', 50 " low flow resistance blank pipe also imposes steam lead 30 designs of insulation; and fully by wire or wire netting fills up and 70 designs such as the return-flow catheter of the high capillary force imbibition structure of can arrange in pairs or groups tube wall tool minute groove or sintering etc.; guarantee that steam is delivered to condensation part 50 fast; 50 '; 50 ", and any condensing liquid quantity that makes backflow all can see through like the 70 quick evaporation parts 10 that suck of the return-flow catheter as the sponge, effectively overcome in the prior art and to cause too much condensate liquid to hoard in wherein because of catheter design is improper, thereby cause the shortcoming of mummification.
This creation loop type heat-exchange device is by above-mentioned integration evaporation part 10, condensation part 50,50 ', 50 ", system's design of steam lead 30 and return-flow catheter 70; reach and both make when holding state; still can make the heat abstractor of this creation continue normal operation; effectively overcome prior art and be difficult for the activation problem got rid of; and can change and quick voluntarily modulation heat-sinking capability, bring into play omnibearing analgesic function along with the high and low power of heater element.
Claims (16)
1. loop type heat-exchange device, comprise the evaporation part that is in turn connected into the loop, steam lead, condensation part and return-flow catheter, wherein this evaporation part has a seal chamber, thereby being provided with capillary structure in the cavity separates this cavity and is steam channel district and liquid channel district, steam lead links to each other with the steam channel district to be used for that the steam of evaporation part heat absorption back generation is delivered to the condensation part, return-flow catheter links to each other with the liquid channel district and return to the evaporation part with the condensate liquid that is used for forming after the condensation of condensation part, it is characterized in that: be provided with capillary structure in the return-flow catheter, the interior capillary structure of capillary structure in this return-flow catheter and evaporation part cavity is connected, and this condensation part comprises at least one condenser pipe and the some radiating fins that pile up along the condenser pipe bearing of trend.
2. loop type heat-exchange device as claimed in claim 1 is characterized in that: wherein this condensation part also comprises cross over pipe and following cross over pipe, and the two ends of above-mentioned condenser pipe are connected with last cross over pipe and following cross over pipe respectively.
3. loop type heat-exchange device as claimed in claim 2 is characterized in that: thus wherein the bottom surface of this time cross over pipe is that the inclined-plane is forming a collecting tray in the cross over pipe down, and return-flow catheter is connected with the lowest part of collecting tray.
4. loop type heat-exchange device as claimed in claim 3 is characterized in that: wherein this steam lead is connected with the condensation part by following cross over pipe with return-flow catheter.
5. loop type heat-exchange device as claimed in claim 4 is characterized in that: wherein the close lowest part of this collecting tray is provided with a baffle plate or cage.
6. as claim 3 a described loop type heat-exchange device, it is characterized in that: wherein this steam lead is connected with the condensation part by last cross over pipe, and return-flow catheter is connected with the condensation part by following cross over pipe.
7. as each described loop type heat-exchange device of claim 2 to 6, it is characterized in that: wherein this upper and lower cross over pipe at least one of them person be provided with a distributor, the steam inlet of distributor is connected with steam lead, and one of relative with steam inlet side is provided with some perforates towards condenser pipe.
8. loop type heat-exchange device as claimed in claim 7 is characterized in that: this condensation part also comprises a fan over against radiating fin.
9. loop type heat-exchange device as claimed in claim 1, it is characterized in that: wherein this evaporation part comprises that one is used for the lower cover that contacts with heater element, the thickness of the corresponding steam channel of lower cover district part is greater than the thickness of its corresponding liquid channel district part, thereby makes the corresponding steam channel of lower cover district part form soaking plate.
10. loop type heat-exchange device as claimed in claim 9 is characterized in that: wherein the position of the corresponding heater element in this liquid channel district is the heat absorption district, and the steam channel district is looped around around this heat absorption district.
11. loop type heat-exchange device as claimed in claim 9 is characterized in that: wherein this evaporation part also comprises a upper cover plate, and the upper and lower cover plate position in the corresponding liquid channel of one of them person's outer wall district at least is provided with radiator.
12. loop type heat-exchange device as claimed in claim 1 is characterized in that: many microchannels capillary structure that the interior capillary structure of this evaporation part cavity constitutes for the wire netting by the tight arrangement of several layers.
13. loop type heat-exchange device as claimed in claim 1 is characterized in that: wherein this steam lead and return-flow catheter are made by the reelability material.
14. loop type heat-exchange device as claimed in claim 13 is characterized in that: this steam lead is for low flow resistance blank pipe and impose insulation.
15. loop type heat-exchange device as claimed in claim 13 is characterized in that: the capillary structure in this return-flow catheter is made of wire or wire netting.
16. loop type heat-exchange device as claimed in claim 15 is characterized in that: wherein the tube wall of this return-flow catheter has minute groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100351598A CN100437004C (en) | 2005-06-04 | 2005-06-04 | Ring type heat exchanging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100351598A CN100437004C (en) | 2005-06-04 | 2005-06-04 | Ring type heat exchanging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1873360A true CN1873360A (en) | 2006-12-06 |
| CN100437004C CN100437004C (en) | 2008-11-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100351598A Expired - Fee Related CN100437004C (en) | 2005-06-04 | 2005-06-04 | Ring type heat exchanging system |
Country Status (1)
| Country | Link |
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| CN (1) | CN100437004C (en) |
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| CN101900504A (en) * | 2010-08-19 | 2010-12-01 | 中冶南方工程技术有限公司 | Flat type loop heat pipe |
| CN102116588A (en) * | 2011-03-04 | 2011-07-06 | 浙江大学 | Evaporation and heat conduction device with micro passageway |
| CN102289266A (en) * | 2010-06-17 | 2011-12-21 | 鸿富锦精密工业（深圳）有限公司 | Server and server system |
| CN102474997A (en) * | 2009-07-20 | 2012-05-23 | 辛维特有限公司 | Local thermal management |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467861A (en) * | 1982-10-04 | 1984-08-28 | Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr | Heat-transporting device |
| JPH0231313B2 (en) * | 1985-12-02 | 1990-07-12 | Fujikura Densen Kk | BUNRIGATAHIITOPAIPUSHIKIKUKYONETSUKI |
| US6981543B2 (en) * | 2001-09-20 | 2006-01-03 | Intel Corporation | Modular capillary pumped loop cooling system |
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| JP2004218887A (en) * | 2003-01-10 | 2004-08-05 | Fujikura Ltd | Cooling device of electronic element |
| US7431071B2 (en) * | 2003-10-15 | 2008-10-07 | Thermal Corp. | Fluid circuit heat transfer device for plural heat sources |
-
2005
- 2005-06-04 CN CNB2005100351598A patent/CN100437004C/en not_active Expired - Fee Related
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| CN111623655A (en) * | 2019-02-27 | 2020-09-04 | 泽鸿(广州)电子科技有限公司 | Heat exchange device |
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