CN1562398A - Optimized piezo driven micro spraying device and fabricating method - Google Patents

Optimized piezo driven micro spraying device and fabricating method Download PDF

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Publication number
CN1562398A
CN1562398A CN 200410003470 CN200410003470A CN1562398A CN 1562398 A CN1562398 A CN 1562398A CN 200410003470 CN200410003470 CN 200410003470 CN 200410003470 A CN200410003470 A CN 200410003470A CN 1562398 A CN1562398 A CN 1562398A
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China
Prior art keywords
spray orifice
film
micro
spray
piezoelectric
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CN 200410003470
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Chinese (zh)
Inventor
周兆英
朱俊华
杜桂彬
冯焱颖
张毓笠
史文勇
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Beijing Boda Micro Nano Technology Co Ltd
Tsinghua University
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Beijing Boda Micro Nano Technology Co Ltd
Tsinghua University
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Priority to CN 200410003470 priority Critical patent/CN1562398A/en
Publication of CN1562398A publication Critical patent/CN1562398A/en
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Abstract

An optimized microsprayer driven piezoelectrically is composed of a membrane with spray orifices, an elastic cavity membrane and piezoelecric sheet on whose both surfaces the aluminium electrodes are plated. said elastic cavity membrane is combined with said piezoelectric sheet to form a piezoelectric transducer. said orifice membrane is adhered with said electric cavity membrane to form a closed liquid cavity. Its advantages are no water membrane, and increased flow.

Description

A kind of Piezoelectric Driving micro-spray device and processing method thereof of optimization
Technical field
The present invention relates to intravital device, belong to medical instruments field medicinal atomized back input people.
Background technology
At present, (Inhalation Drug Therapy, little spray IDT) has obtained paying close attention to widely to be used for the inhaled drugs treatment.As a kind of non-invasively treating method with few side effects, IDT is asthma and other pulmonary disease Therapeutic Method commonly used, and its market potential is about 12,000,000,000 dollars.In addition, in treatment of diabetes, IDT also is the potential alternative method of traditional injection of insulin method.
Inventor's past attempts has been developed a kind of piezoelectric driven array micro spray of using towards IDT, and its structure as shown in Figure 1.This device comprises spray orifice film 1, elastic cavity film 4, circular piezoelectric sheet 5 and contact conductor 7.Spray orifice film 1 adopts bulk silicon technological to etch the first half that groove is a liquid chambers 2 on silicon chip, utilizes ICP technology to etch micro-spraying hole array 6 then, and wherein typical injection diameter is 10 μ m, and the spray orifice number is 600.Elastic cavity film 4 adopts bulk silicon technological to etch the Lower Half of feed liquid pipeline 3 and liquid chambers 2.Spray orifice film 1 bonds together the liquid chambers 2 that the back forms sealing with elastic cavity film 4.Piezoelectric patches 5 bonds together the formation piezoelectric transducer with elastic cavity film 4.The piezoelectric patches upper and lower surface is coated with the aluminum electrode, and its polarised direction is a thickness direction.
Piezoelectric driven array micro spray is based on Piezoelectric Driving ink-jet printer its working principles, and (Micro Electro-Mechanical Systems, MEMS) technology processes to utilize Micro Electro Mechanical System.The mist particle diameter that this miniature spray produces distributes and concentrates, and mist particle diameter is more suitable for atomization inspiration treatment.Piezoelectric driven array micro spray is applied to atomization inspiration treatment and has the following advantages: (1) Piezoelectric Driving can not cause the physical/chemical of medicine to change, to almost not infringement of medicine; (2) control is simple flexibly, and a piezoelectric actuator can be used for the injection of a plurality of nozzles simultaneously, thereby can be issued to enough flows in rational driving frequency; (3) low in energy consumption, volume is little; (4) the MEMS height is integrated may make cost reduce greatly with producing in batches.Its operation principle is: piezoelectric transducer vibrates under the alternating voltage effect, and with liquid chambers in the liquid phase mutual effect, the porch that the pressure wave of generation is delivered to nozzle causes liquid jet to be drop from nozzle ejection and then atomizing.The size of drop is relevant with the amplitude and the frequency of driving voltage with speed.
But described piezoelectric driven array micro spray also exists a lot of problems.These problems comprise: (1) is not all spray orifices liquid droplets all on the spray orifice film, thereby has reduced injection dosage in each Piezoelectric Driving, make each dosage be lower than design flow, can not accurately control injection dosage; (2) the moisture film problem of bubble and spray orifice outer surface also is the total problem that the little spray of miniature array of spray orifice is arranged, and is bigger to the influence of droplet jet, even can cause the little spray of miniature array not work, especially more obvious to the influence of array droplet jet; (3) under the smaller situation of spray orifice, little jet flow amount is smaller.Because these problems, the piezoelectric driven array micro spray distance enters inhaler market and also has certain distance.Solution to these problems on the basis of the working mechanism of clear and definite piezoelectric driven array micro spray is when previous urgent requirement.
Summary of the invention
The objective of the invention is to solve the moisture film problem of the spray orifice outer surface that existing piezoelectric driven array micro spray exists and under the smaller situation of spray orifice, the smaller problem of little jet flow amount.
Another object of the present invention be solve that existing piezoelectric driven array micro spray exists in each Piezoelectric Driving, be not all spray orifices liquid droplets all on the spray orifice film.
A further object of the invention provides the processing method of elastic cavity film of the present invention.
The invention provides a kind of Piezoelectric Driving micro-spray device of optimization, comprise the spray orifice film, elastic cavity film and piezoelectric patches, piezoelectric patches and elastic cavity film bond together the formation piezoelectric transducer, the piezoelectric patches upper and lower surface is coated with the aluminum electrode, polarised direction is a thickness direction, it is characterized in that: described spray orifice film and elastic cavity film bonding form the liquid chambers of sealing, and described spray orifice film outer surface is provided with groove structure; Spray orifice on the described spray orifice film is arranged in the bottom surface of described groove structure.
Piezoelectric patches of the present invention drives and produces pressure wave and distributes on the spray orifice film, described spray orifice is positioned at pressure peak place corresponding on the spray orifice film.
A kind of embodiment of the present invention is positioned at the center of spray orifice film for the spray orifice on the described spray orifice film.
Another kind of embodiment of the present invention is positioned at the center and the close wall place, limit of spray orifice film for the spray orifice on the described spray orifice film.
The degree of depth of liquid chambers of the present invention is 50~150 μ m.
The invention discloses the spray orifice film processing method in the piezoelectric driven array micro spray device, adopt plasma etching method on silicon chip, to process micro-spraying hole, it is characterized in that the execution as follows successively of this processing method:
1) two-sided growth SiO 2, two-sided deposit Si 3N 4
2) lower surface photoetching, etching Si 3N 4And SiO 2, form plasma etching micro-spraying hole graphical window;
3) lower surface plasma etching monocrystal silicon forms the micro-spraying hole of an end opening;
4) lower surface growth SiO 2, deposit Si 3N 4, with the micro-spraying hole that forms in the protection step 3);
5) upper surface photoetching, etching Si 3N 4And SiO 2, organizator silicon etch pattern window;
6) anisotropic etch monocrystal silicon upper surface makes that micro-spraying hole becomes through hole described in the step 3), and forms groove structure;
7) upper and lower surface removal Si 3N 4And SiO 2
By structure and the technological design that piezoelectric driven array micro spray is carried out, it is more even to make that its droplet jet distributes, and has effectively avoided the moisture film problem, has improved flow simultaneously.
Description of drawings
Fig. 1 is existing piezoelectric driven array micro spray structural representation.
Fig. 2 is the structural representation of the embodiment of piezoelectric driven array micro spray device of the present invention.
The comparison diagram that spray orifice inlet face pressure wave distributed and spray orifice is arranged when Fig. 3 was f=35.759KHz.
Fig. 4 is the spray orifice facial plane figure of the embodiment of piezoelectric driven array micro spray device of the present invention.
Fig. 5 a is the work flow sketch of the elastic cavity film in the piezoelectric driven array micro spray device of the present invention.
Fig. 5 b is the work flow sketch of the spray orifice film in the piezoelectric driven array micro spray device of the present invention.
The specific embodiment
According to requirement of using and correlational study achievement in the past, the embodiment of the piezoelectric driven array micro spray structure of the optimization of the present invention's design as shown in Figure 3.This device is mainly by spray orifice film 13, and elastic cavity film 9 and piezoelectric patches 10 constitute.Spray orifice film 13 utilizes ICP technology to etch micro-spraying hole array 12 earlier, adopts bulk silicon technological to etch groove structure then on silicon chip, and makes micro-spraying hole become through hole, and the diameter of micro-spraying hole is controlled between 3~30 μ m, and length is 30 μ m, and the spray orifice number is 4000.Elastic cavity film 9 is that to adopt bulk silicon technological to etch diameter respectively in the upper and lower surface of silicon chip be 10mm, the degree of depth is the remainder behind the circular groove of 100 μ m and 200 μ m, its thickness is 100 μ m, and feed liquid pipeline 11 is the circular groove while etching of 100 μ m with the degree of depth.The groove structure of spray orifice film 13 is upwards bonded together the liquid chambers 8 that forms sealing with elastic cavity film 9.Piezoelectric patches 10 bonds together the formation piezoelectric transducer with elastic cavity film 9.Circular piezoelectric sheet upper and lower surface is coated with the aluminum electrode, and its polarised direction is a thickness direction.14 is contact conductor.Spray orifice 12 on the spray orifice film 13 is arranged in the bottom surface of described groove structure.
The work of piezoelectric micromotor spray has three characteristics.The one, little spray is operated in the resonant frequency point of device, at resonant frequency point, and the vibration amplitude maximum of piezoelectric transducer, thereby it is also maximum to be delivered to the amplitude of pressure wave of spray orifice, the easiest formation of drop; The 2nd, under the identical situation of other working condition, the size and the driving frequency of drop are inversely proportional to, and frequency is high more, and drop is more little; The 3rd, at resonant frequency point, pressure wave forms standing wave in liquid chambers, same order resonant frequency not, standing wave mode difference.Because spray orifice should be arranged in the zone of pressure wave amplitude maximum, so, should have different spray orifices according to pressure standing wave mode and arrange at the different operating frequency.If spray orifice is arranged in the less place of pressure, this spray orifice liquid not only can not form jet and atomizing is drop, and can form big drop or liquid film on the spray orifice face, causes little spray cisco unity malfunction.
Because corresponding to the pressure standing wave mode of identical order, the work of piezoelectric driven array micro spray divides p type and two resonant frequencies of q type vibration.P type mode of oscillation accounts for leading mode corresponding to the piezoelectric transducer vibration, and the order of pressure standing wave mode is identical with the order of the structural vibration mode of piezoelectric transducer.For p type mode of oscillation, pressure wave does not almost change along thickness direction.Q type mode of oscillation accounts for leading mode corresponding to the spray orifice film, and the order of pressure standing wave mode is identical with the order of the structural vibration mode of spray orifice film, and pressure wave changes along thickness direction.Therefore, p type vibration resonance frequency is only the device operating frequency that we need.
For the axial symmetry mode of oscillation, pressure wave is all bigger in spray orifice face center amplitude, and corresponding to non-axial symmetry mode of oscillation, pressure wave is all less in spray orifice center membrane amplitude.For the consideration of droplet jet directivity, the axial symmetry mode of oscillation is comparatively ideal device operating frequency.
Figure 3 shows that the distribution of the pressure wave when little spray is operated in resonant frequency point f=35.759KHz, it is axisymmetric, pressure wave radially has two peak Distribution, respectively at the center of spray orifice film with near wall place, limit, this just illustrates in order to improve little jet flow amount, spray orifice should centralized arrangement at the center of spray orifice film corresponding pressure peak value with near wall place, limit, and near should arrange spray orifice less in the nodal circle place as far as possible.Dash area is that existing spray orifice arranges that obvious most of spray orifice all is arranged in the less place of pressure, so this layout does not meet designing requirement among Fig. 3; The spray orifice of the embodiment of the invention shown in Figure 4 is arranged then to distribute with pressure wave and is coincide, and promptly is arranged in the center and the close wall place, limit of spray orifice film.
Compare with the little spray of Piezoelectric Driving shown in Figure 1, optimization Piezoelectric Driving micro-spray device of the present invention has following advantage:
1, the distribution of spray orifice on the spray orifice film of novel piezoelectric driving array micro spray meets the distribution of pressure wave, helps the injection of drop;
2, improve the rigidity and the intensity of spray orifice film when shortening spray orifice length, on the spray orifice film, designed groove structure, but because the propagation of pressure wave in liquid chambers is radial, in the little spray of Piezoelectric Driving shown in Figure 1, the limit wall of these grooves will hinder near the transmission of the pressure wave the spray orifice, therefore groove structure upwards can effectively be avoided this shortcoming; On the other hand, little when being sprayed on work, its surface forms moisture film extremely easily, hinders little spray work; With groove structure upwards after, spray orifice film upper surface just has been divided into that it is enough little zone, the nozzle hole number in each zone is just few a lot of like this, thereby the probability of formation moisture film just greatly reduces.
3, because the thickness of existing silicon chip all is 400 μ m generally, and the vibration cavity film of little spray only needs 100 μ m, and the degree of depth of liquid chambers just is 300 μ m like this.Learn that after deliberation liquid chambers is thick more, the resistance that pressure wave is subjected to when propagating in liquid is big more.Therefore, the degree of depth that reduces liquid chambers helps the transmission of pressure wave, and the injection of drop.
In the prior art, the processing of spray orifice film is that first bulk silicon etching goes out groove, and ICP etches micro-spraying hole then, and micro-spraying hole was bad near that face heat radiation of bulk silicon etching when Jia Gong shortcoming was the ICP etching like this, caused micro-spraying hole to become taper hole.In order to overcome above-mentioned technical barrier, the present invention adopts piezoelectric driven array micro spray processing technique as shown in Figure 5 to carry out the processing of spray orifice film.The processing of spray orifice film 13 and elastic cavity film 9 is based on the MEMS technology, adopts the silicon fine process, and the bonding employing silicon-silicon bond of spray orifice film 13 and elastic cavity film closes, and has so just effectively avoided manual problems such as aligning in bonding.Wherein, micro-spraying hole employing inductive couple plasma etching (Inductively Coupled Plasma, ICP) method is processed on silicon chip,
The work flow of elastic cavity film 9 and spray orifice film 13 is shown in Fig. 5 a and Fig. 5 b, and wherein, 17 is monocrystal silicon, and the monocrystal silicon thickness that uses among the present invention is 400 μ m, and 16 is silicon dioxide (SiO 2), 15 is silicon nitride (Si 3N 4).The processing process of elastic cavity film is: 1) two-sided growth SiO 2, two-sided deposit Si 3N 42) lower surface photoetching, etching Si 3N 4And SiO 2, form lower surface bulk silicon etching window; 3) anisotropic etch monocrystal silicon lower surface 100 μ m; 4) upper surface photoetching, etching Si 3N 4And SiO 2, form upper surface bulk silicon etching window; 5) the upper and lower surperficial 100 μ m of anisotropic etch monocrystal silicon; 6) upper and lower surface removal Si 3N 4And SiO 2
The processing process of spray orifice film is: 1) two-sided growth SiO 2, two-sided deposit Si 3N 42) lower surface photoetching, etching Si 3N 4And SiO 2, form ICP etching micro-spraying hole graphical window; 3) lower surface ICP etching single crystal silicon 40 μ m form the micro-spraying hole of an end opening; 4) lower surface growth SiO 2, deposit Si 3N 4, with the micro-spraying hole that forms in the protection step 3); 5) upper surface photoetching, etching Si 3N 4And SiO 2, organizator silicon etch pattern window; 6) anisotropic etch monocrystal silicon upper surface, corrosion depth 370 μ m make that micro-spraying hole becomes through hole described in the step 3), and form groove structure; 7) upper and lower surface removal Si 3N 4And SiO 2

Claims (6)

1. the Piezoelectric Driving micro-spray device of an optimization, comprise the spray orifice film, elastic cavity film and piezoelectric patches, piezoelectric patches and elastic cavity film bond together the formation piezoelectric transducer, the piezoelectric patches upper and lower surface is coated with the aluminum electrode, polarised direction is a thickness direction, it is characterized in that: described spray orifice film and elastic cavity film bonding form the liquid chambers of sealing, and described spray orifice film outer surface is provided with groove structure; Spray orifice on the described spray orifice film is arranged in the bottom surface of described groove structure.
2. Piezoelectric Driving micro-spray device according to claim 1 is characterized in that: described piezoelectric patches drives and produces pressure wave and distributes on the spray orifice film, described spray orifice is positioned at pressure peak place corresponding on the spray orifice film.
3. Piezoelectric Driving micro-spray device according to claim 1 and 2 is characterized in that: described spray orifice is positioned at the center of spray orifice film.
4. Piezoelectric Driving micro-spray device according to claim 1 and 2 is characterized in that: described spray orifice is positioned at the center and the close wall place, limit of spray orifice film.
5. Piezoelectric Driving micro-spray device according to claim 1 is characterized in that: the degree of depth of described liquid chambers is 50~150 μ m.
6. the spray orifice film processing method in the piezoelectric driven array micro spray device adopts plasma etching method to process micro-spraying hole on silicon chip, it is characterized in that the execution as follows successively of this processing method:
1) two-sided growth SiO 2, two-sided deposit Si 3N 4
2) lower surface photoetching, etching Si 3N 4And SiO 2, form plasma etching micro-spraying hole graphical window;
3) lower surface plasma etching monocrystal silicon forms the micro-spraying hole of an end opening;
4) lower surface growth SiO 2, deposit Si 3N 4, with the micro-spraying hole that forms in the protection step 3);
5) upper surface photoetching, etching Si 3N 4And SiO 2, organizator silicon etch pattern window;
6) anisotropic etch monocrystal silicon upper surface makes that micro-spraying hole becomes through hole described in the step 3), and forms groove structure;
7) upper and lower surface removal Si 3N 4And SiO 2
CN 200410003470 2004-03-26 2004-03-26 Optimized piezo driven micro spraying device and fabricating method Pending CN1562398A (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101539122B (en) * 2009-04-21 2011-01-12 北京航空航天大学 Hole type multi-cavity colloid thrustor
CN101859742B (en) * 2005-01-25 2012-07-04 精工爱普生株式会社 Device mounting structure, method of mounting device, liquid-jet head, and printer
CN105032717A (en) * 2015-09-18 2015-11-11 京东方科技集团股份有限公司 Frame-sealing-glue coating nozzle and frame-sealing-glue coating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101859742B (en) * 2005-01-25 2012-07-04 精工爱普生株式会社 Device mounting structure, method of mounting device, liquid-jet head, and printer
CN101539122B (en) * 2009-04-21 2011-01-12 北京航空航天大学 Hole type multi-cavity colloid thrustor
CN105032717A (en) * 2015-09-18 2015-11-11 京东方科技集团股份有限公司 Frame-sealing-glue coating nozzle and frame-sealing-glue coating device
US10543498B2 (en) 2015-09-18 2020-01-28 Boe Technology Group Co., Ltd. Sealant coating nozzle and sealant coating apparatus

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