CN1411605A - Electron gun cathode assembly - Google Patents
Electron gun cathode assembly Download PDFInfo
- Publication number
- CN1411605A CN1411605A CN01806100A CN01806100A CN1411605A CN 1411605 A CN1411605 A CN 1411605A CN 01806100 A CN01806100 A CN 01806100A CN 01806100 A CN01806100 A CN 01806100A CN 1411605 A CN1411605 A CN 1411605A
- Authority
- CN
- China
- Prior art keywords
- electron gun
- cathode assembly
- alignment member
- gun cathode
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
- H01J3/02—Electron guns
- H01J3/021—Electron guns using a field emission, photo emission, or secondary emission electron source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/13—Solid thermionic cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
- H01J29/48—Electron guns
- H01J29/481—Electron guns using field-emission, photo-emission, or secondary-emission electron source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
- H01J29/48—Electron guns
- H01J29/485—Construction of the gun or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
Landscapes
- Electrodes For Cathode-Ray Tubes (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Cold Cathode And The Manufacture (AREA)
Abstract
Apparatus and method are provided for a package structure that enables mounting of a field-emitting cathode into an electron gun. A non-conducting substrate has the cathode attached and the cathode is electrically connected to a pin through the substrate. Other pins are electrically connected to electrodes integral with the cathode. Three cathodes may be mounted on a die flag region to form an electron gun suitable for color CRTs. Accurate alignment of an emitter array to the apertures in the electron gun and other electrodes such as a focusing lens is achieved. The single package design may be used for many gun sizes. Assembly and attachment of the emitter array to the electron gun during construction of the gun can lower cost of construction.
Description
Technical field
The present invention relates to be used for for example electron gun of the device of cathode ray tube (CRT), more particularly, relate to the encapsulating structure that is used for field emission apparatus is installed in electron gun.
Background technology
Cathode ray tube (CRT) and other need the device of electron beam to generally comprise an electron gun, and this electron gun has a thermionic emitters as negative electrode.Electron gun is assembled into other electrodes that comprise negative electrode and make electron beam focus on and quicken.Generally, this electron gun assembles by hand, and after the electron gun assembling, inserts negative electrode.This assembly cost height.If can be when beginning to assemble, the cathode portion that just comprises electron gun then is an advantage.
In recent years, developed the cold cathode that allows to use based on electronic field emission and replaced technology based on the negative electrode of thermionic emission.The field emission of electronics is from being taken place by molybdenum, silicon or the miniature tip (microtip) of being made by carbon-based material in recent years.Verified, can utilize ic manufacturing technology, carbon-based material or diamond-like material are integrated in (" AdvancedCVD Diamond M icrotip D evice for Extreme Applications (supplying the advanced person's of end use application the miniature most advanced and sophisticated device of CVD diamond) ", MAT, RES, SOC, SYMP, PROC (Mathematics Research association discussion collection of thesis) 509 volumes (1998)) in the gate electrode with self positioning structure integral body.Use has the field emission apparatus of built-in separated grid (extraction gate), does not need two electrodes of packing in electron gun under the thermionic emission situation.Cancel these parts and can simplify electron gun, can also reduce the length of electron gun.Carbon class negative electrode and electrode be integrated into that application in the electron gun is submitted in name on the July 19th, 1999 with inventor Rich Gorski and Keith D.Jamigon, sequence number has been 09/356851, be entitled as in the patent application of examining and transferring the possession of jointly of " compact field emission gun, and condenser lens " and be described, and this patent application is incorporated herein by reference.
So far, the known device that is used for utilizing field-transmitting cathode to assemble cathode construction and electron gun is described at United States Patent (USP) 5898262.Thereby this patent has been described a kind of mode that field emission apparatus constitutes color cathode ray tube that encapsulates.An insulating part is provided, and it has the breach that is used for an independent field emission apparatus, and this field emission apparatus has three emitter regions.United States Patent (USP) 5869924 provides a kind of insulating material (plastics) that forms by the filling shell, and pin extends by this insulating material.The direct wire-bonded of cathode assembly is to the head of pin.United States Patent (USP) 5905332 discloses the other part of the electron gun beyond the field-transmitting cathode itself.Span on the focusing block of electron gun is bigger than the interval between the field emission apparatus.
The negative electrode of electron gun quickens and concentrating element can be by aliging, separate with shim liner with a centering tool, and utilize sintering on the outward flange of each element the non-conductive ceramic fix in position and assembled.Thisly the element sintering is called " beading (glass beading) operation " on ceramic structure.Then, shim liner is removed, formed the electrical insulation parts of electron gun.When using thermionic emitters, after this assembly work, the negative electrode that barium applies is put into electron gun separately.This is essential, because frangible barium coating can not be born the high temperature under the atmospheric pressure that needs in the beading operation.
One of advantage of field emitting electronic source is that the intensity of negative electrode can allow before the beading operation electron gun to be fully assembled.This has just eliminated the secondary step of inserting thermoelectric elements after electron gun has assembled.Need utilize field-transmitting cathode can be in the high temperature under the atmospheric pressure and can not damage this true encapsulation technology.This encapsulation should be able to reduce the assembly cost based on the electron gun of field-transmitting cathode.Encapsulation also must be configured to allow negative electrode accurately to aim in electron gun.Formed structure also should allow electron gun to use in the CRT of various different recess diameters.
Summary of the invention
The invention provides a kind of electron gun cathode assembly and assembly method thereof with field-transmitting cathode.This field-transmitting cathode can be a carbon back.The non-conductive substrate that is generally the ceramic material of dish type have lead to the field emission device chip back surface such as the electrical connection that provides by wafer region.Emission array has utilized known method to grow on wafer.Three field emission wafers can be spaced apart on substrate, to form the electron gun of color CRT.Be used for wafer and be used for forming the conductive traces that is connected on the pin that passes substrate with integrated being electrically connected of electrode of negative electrode.It is spaced apart by independent separation annulus and emission array to have a dish or the container with a plurality of holes, and perhaps this gap can form by formation dish or container.Under the normal condition, substrate, pad and dish or container are by welding or brazing, be connected by bonding agent or mechanical means.Comprise dish or container and pad cathode assembly can with alignment tools and lens alignment, also aims at simultaneously with independent focusing electrode, this alignment tools is fitted in the interior aperture of dish or container.Whole then assembly utilizes known technology to carry out beading.
Description of drawings
For a more complete understanding of the present invention and advantage, with reference to the description of carrying out below in conjunction with accompanying drawing, in the accompanying drawings, identical Reference numeral indicates identical part, wherein:
Fig. 1 a illustrates the cross-sectional view of an embodiment of the cathode construction of electron gun;
Fig. 1 b illustrates the cross-sectional view of second embodiment of the cathode construction of electron gun;
Fig. 1 c illustrates the cross-sectional view of the 3rd embodiment of the cathode construction of electron gun;
Fig. 2 illustrates the cross-sectional view of the 4th embodiment of the cathode construction of electron gun;
Fig. 3 illustrates the alignment tools that is used for cathode construction and electrode alignment;
Fig. 4 illustrates the beading of cathode construction and electrode;
Fig. 5 illustrates the on-chip negative electrode shown in Figure 1 and the vertical view of electrical connection, but has removed top disc among the figure;
Fig. 6 illustrates the vertical view of on-chip three negative electrodes and electrical connection;
Fig. 7 illustrates the vertical view of an embodiment of the alignment disk that is used for three cathode constructions;
Fig. 8 illustrates the cross-sectional view of an embodiment of three cathode constructions shown in Figure 7.
Embodiment
Referring to Fig. 1 a, among the figure with 10 embodiment that always represent electron gun cathode assembly.Field emission apparatus of ceramic substrate 12 supportings, this device comprises the wafer 13 that has formed field emission array 14 on it, array 14 utilizes on October 12nd, 1998 and submits to, the common sequence number of transferring the possession of 09/169909, or submission on October 12nd, 1998, the method of disclosed formation field emission array in the patent of the common sequence number of transferring the possession of 09/169908, perhaps commonly known in the art or for example disclosed other field emission apparatus formation in United States Patent (USP) 5869924.All patents are incorporated herein by reference.Wafer 13 can utilize benchmark accurately to be placed on the select location of substrate 12.Can wafer 13 be launched in the field for the electric connector 16 of the conductive traces made by known technology is connected on the pin two 6.High temperature adhesive layer 17 can form a conductive path at the back side of wafer 13.Being used to form the bonding agent of bond layer 17, for example can be Ablebond 71-1 or Ablebond 2106.Conductive traces 18 is connected on the pad of fixing cord 20, and lead 20 is connected with the separate mesh electrode of emission array 14, and as disclosed in the above-cited patent in the application and this section, array 14 also can comprise the focusing electrode that is integrally formed in the array.Electrode can utilize known wire bonding technique in the industry to be electrically connected on the conductive welding disk on the ceramic substrate 12.Annulus 22 is the pads between alignment disk 24 and the ceramic substrate 12.Annulus 22 can be metal or pottery.The thickness of annulus 22 is chosen to make the hole 25 of disk 24 to be in matrix row 14 a distance, so that focus on the electron beam that sends from array 14 by applying selected voltage to disk 24.This distance is general big about in 0.1 to 10mm scope.Hole 25 in the disk 24 is aimed at array 14, and disk 24 can be fixed on the annulus 22 by welding or brazing.Annulus 22 can be attached on the ceramic substrate 12 on the metallization track 32 on the substrate 12 by brazing.Metallization track 32 is electrically connected with pin two 1 by via hole 28.Alignment disk 24 is of crucial importance, this be because it be mainly used in guarantee field emission array 14 correctly with other element centerings of electron gun.As described below, the outward flange of alignment disk is used for negative electrode is installed in electron gun.Be electrically connected to the condenser lens that makes on the disk 24 that disk 24 is used as in the electron gun by pin two 1.The diameter of alignment disk 24 is defined as can being placed among the CRT or other devices of various different sizes.Generally, disk 24 is made by stainless steel.Conductive traces 16 is connected on the pin two 8.Pin such as 26 and 28 for example available iron or acid bronze alloy is made.In the end in the sealing process, the contact leads (not shown) can spot weld on the pin.Lead-in wire provides the electrical connection of CRT outside.
Second embodiment of electron gun cathode assembly 11 indicates generally by 11 in Fig. 1 b.Embodiment shown in this embodiment and Fig. 1 a is similar, but has removed separation annulus 22.In this embodiment, alignment disk is formed with cylindrical sides 9 to form required interval between an alignment disk and an emission wafer.Alignment disk can utilize welding or the bonding machinery of bonding agent and electricity to be attached on the on-chip metallization track 32.Metallization track 32 is electrically connected on the pin two 1.Because eliminated and made the needs of separating annulus 22, therefore, this embodiment cost can be efficient.
The 3rd embodiment of the cathode assembly 15 of electron gun indicates generally by 45 in Fig. 1 c.Embodiment shown in this embodiment and Fig. 1 a is similar, but different be that the wafer 13 of negative electrode is connected on the metallization track 16 that is connected with pin two 6 by lead 46.Under the nonconducting situation in wafer 13 back sides, this is a preferred embodiment.
The 4th embodiment of the cathode assembly 30 of electron gun indicates generally by 30 in Fig. 2.In this embodiment, the cylindrical chamber 34 with fin 36 be used to guarantee field emission array 14 correctly with other element centerings of electron gun, and be used for negative electrode is installed in electron gun.The size of the diameter of container 34 and fin 36 can be chosen to make that assembly 30 can be placed among the CRT or other devices of various sizes.Annulus 22 inserts in the container 34, and act as pad, to provide optimal spacing between the hole 25 in array 14 and container 34.Annulus 35 inserts after negative electrode assembles, and is used for negative electrode is locked on the throne.Brazing 29 can be used for pin is fastened in the ceramic substrate 12.Container 34 is generally made by stainless steel.The advantage of hydrostatic column is by substrate 12 closely being coupled in the hole of container 34, can more easily realizing mechanical registeration.Another advantage is that this package assembling provided the extra selection of container 34 beadings to other elements of electron gun before inserting cathode assembly.
Fig. 3 and Fig. 4 illustrate electron gun cathode assembly 30 how with CRT or other devices in other electrode alignments and beading put in place (cathode assembly 10,11 and 45 will assemble in a similar manner).Be sized in the hole 25 that can be fitted into electron gun 30 and alignment tools 38 that condenser lens 39 maybe will be placed in the hole of other interior grids of this device is placed in these holes, and along the axis alignment of this device.Interval between each element of electron gun can utilize the interim pad 47 that will remove afterwards to realize.Then, use pottery 40 (Fig. 4) with electron gun 30 and other lenses or grid fix in position.Remove alignment tools 38 and pad 47 then.In addition, for example, electron gun 10 or 11 can utilize identical operation to be assembled on the assigned position in the electron gun 30.
With reference to Fig. 5, the figure shows among Fig. 1 a vertical view, but wherein removed disk 24 with the cathode assembly shown in the cross-sectional view.Can see ceramic substrate 12 from the top, emission wafer 13 and field emission array 14.Field emission wafer 13 usefulness electroconductive binders are bonded on the wafer logo area 42.Electrically conducting adhesive can form conductive path at the back side of field emission array 14.Wafer logo area 42 can be generally tungsten and be formed on the ceramic substrate 12 by metal, but copper or other metals also can provide satisfied effect.The general silk screen printing of metal (screen) fuses to pottery and with pottery.Pottery generally is an aluminium oxide, although other pottery is also satisfactory.This ceramic substrate can be by Kylocera, and Coors or other suppliers sell.Wire pad 44 provides and has been used at the electron gun element and fixing cord connects between such as 26 and 27 pin terminal.Utilizing industrial well-known technomania sound (thermosonic) to engage such as 20 conductor leading among Fig. 1 a is connected with wire pad.If have integrated focusing electrode, then independent conductor leading is connected with wire pad 44 with focusing electrode at array 14.Conductive traces such as 16 and 18 is electrically connected to pin on the various elements of electron gun or on the wafer logo area.Isolation annulus 22 has been discussed above.Its available KOVAR (a kind of alloy of steel) makes, and perhaps cancellation and formed alignings flat board can produce required interval is shown in Fig. 1 b.Figure 5 illustrates an independent field emission array, it can be used among the CRT as Monocolour electron gun.
Fig. 6 illustrates an embodiment of the three emission array assemblies that are used in the electron gun that is placed on color CRT.In this case, need a red wafer, a green wafer and a blue wafer.All three wafers 14 all are installed on the wafer logo area 42.Other pin is connected to wire pad by the conductive traces such as 18, on 44.As mentioned above, wafer logo area 42 is used for connecting by field emission wafer.For three emitter regions, disk (such as the disk among Fig. 1 a 24), or will have three holes on the container (such as the container among Fig. 2 34), each hole is provided with respect to 14.Then disk or container are fixed on the annulus 22.
With reference to Fig. 7, it shows among another embodiment that is used in packaging system, comprises the alignment disk 50 of three emission arrays.The effect of disk 50 is identical with alignment disk 24 among Fig. 1 a or Fig. 1 b.Disk comprises three holes 52.Also illustrate and formed three depressed areas 54, they are used to provide the hole to arrive the correct interval of field emission array shown in Figure 6 14.Each cathode assembly that comprises field emission array 14 all is centered in below the hole 52.In addition, can there be the depressed area, and utilizes welding or adhering method, annulus shown in Figure 5 22 is connected with alignment disk 50.The end view of this assembly is shown in Figure 8.Disk 50 can utilize above-mentioned technical glass to weld in the electron gun, and thus, at least one hole can be used for aiming on the disk.
Above disclosure and description of the present invention be illustrative and exemplary, do not deviating under the marrow condition of the present invention, can be to the details change of described device and structure and operation and assembly method.
Claims (30)
1. electron gun cathode assembly with field emission apparatus, comprise: non-conductive substrate with first and second surfaces, first surface has this field emission apparatus attached to it, this field emission apparatus has emission array, and is electrically connected to from first pin of substrate second surface extension;
At least one electric contact on the first surface, it is electrically connected at least one pin that stretches out from the substrate second surface, and this electric contact is electrically connected on the electrode of field emission apparatus; And
The alignment member that wherein has at least one hole, this hole is with respect to emission array alignment and selected distance spaced away.
2. electron gun cathode assembly as claimed in claim 1 is characterized in that, nonconducting substrate is a pottery.
3. electron gun cathode assembly as claimed in claim 1 is characterized in that field emission apparatus is a carbon back.
4. electron gun cathode assembly as claimed in claim 1 is characterized in that, field emission apparatus is electrically connected on the on-chip conduction region by electrically conducting adhesive, and conduction region further is electrically connected at least one pin that stretches out from the substrate second surface.
5. electron gun cathode assembly as claimed in claim 1 is characterized in that, the electric contact on the first surface is a pad.
6. electron gun cathode assembly as claimed in claim 1 is characterized in that, alignment member is the disk with selected diameter.
7. electron gun cathode assembly as claimed in claim 6 is characterized in that, disk wherein also comprises cylindrical sides.
8. electron gun cathode assembly as claimed in claim 1 is characterized in that, the selected distance between array and the hole utilizes the interval annulus between non-conductive substrate and the alignment member to provide.
9. electron gun cathode assembly as claimed in claim 1 is characterized in that, alignment member is the cylindrical chamber with selected diameter and end.
10. container as claimed in claim 9 also is included in a zone in the end, and this zone is suitable for this hole is positioned on the selected position with respect to emission array.
11. electron gun cathode assembly as claimed in claim 1 is characterized in that, this selected distance is approximately in 0.1 to 10mm scope.
12. electron gun cathode assembly as claimed in claim 1 is characterized in that, selected distance is selected to the electron beam of focusing from emission array.
13. the electron gun cathode assembly with three field emission apparatus comprises:
Non-conductive substrate with first and second surfaces, first surface have three field emission apparatus that adhere on it, and each field emission apparatus has emission array, and this device is electrically connected on the pin, and this pin stretches out from second surface;
A plurality of electric contacts on the first surface, each contact are electrically connected on the pin that stretches out from the substrate second surface, and this electric contact is electrically connected on the electrode of field emission apparatus; And
Alignment member with at least three holes, this hole is aimed at respect to each emission array, and selected distance spaced away.
14. electron gun cathode assembly as claimed in claim 13 is characterized in that, this nonconducting substrate is a pottery.
15. electron gun cathode assembly as claimed in claim 13 is characterized in that, field emission apparatus is a carbon back.
16. electron gun cathode assembly as claimed in claim 13 is characterized in that, field emission apparatus is electrically connected on the on-chip conduction region by electrically conducting adhesive, and conduction region further is electrically connected at least one pin that stretches out from the substrate second surface.
17. electron gun cathode assembly as claimed in claim 13 is characterized in that, selected distance is approximately in 0.1 to 10mm scope.
18. electron gun cathode assembly as claimed in claim 13 is characterized in that, this selected distance is selected to the electron beam of focusing from each emission array.
19. electron gun cathode assembly as claimed in claim 13 is characterized in that, non-conductive substrate also comprises the wafer logo area on the first surface.
20. electron gun as claimed in claim 13 is characterized in that, alignment member is the disk with selected diameter.
21. alignment member as claimed in claim 20 is characterized in that, disk wherein also comprises cylindrical sides.
22. electron gun cathode assembly as claimed in claim 13 is characterized in that, the interval between array and the hole utilizes at least one the interval annulus between non-conductive substrate and the alignment member to provide.
23. electron gun cathode assembly as claimed in claim 13 is characterized in that, alignment member is the cylindrical chamber with selected diameter and end.
24. electron gun cathode assembly as claimed in claim 23 also is included in a terminal interior zone, this zone is suitable for the hole is positioned on the select location with respect to emission array.
25. a method of making the field-transmitting cathode assembly comprises:
Non-conductive substrate and first conductive pin with first and second surfaces is provided, and this first conductive pin is electrically connected on the first surface, and stretches out from second surface;
Field emission apparatus with emission array is provided, and this device is fixed on the first surface, and this device is electrically connected with first conductive pin;
At least one electrode of field emission apparatus is electrically connected with second conductive pin, and this second conductive pin is stretched out from second surface;
Alignment member is provided, and this alignment member wherein has at least one hole and selected diameter;
Provide a pad, alignment member is placed on apart from the selected distance of substrate; And
The substrate that will be in selected spacing distance place is connected with alignment member.
26. method as claimed in claim 25 is characterized in that, method of attachment is from welding, brazing and applies the method for bonding agent and select.
27. method as claimed in claim 25 is characterized in that, alignment member is a disk, and this disk also comprises a cylindrical sides.
28. method as claimed in claim 25 is characterized in that, alignment member is a container.
29. a method that is used to assemble electron gun comprises:
Field-transmitting cathode with alignment member assembly is provided, and this alignment member has at least one hole and selected diameter;
Lens as an electron gun part are provided, and these lens have a hole;
Alignment tools in the hole that is suitable for being fitted into alignment member and lens is provided; And
Alignment tools is put into the hole of alignment member and condenser lens, so that aim at, and between alignment member and lens, place pad, between them so that selected distance to be provided with this hole; And
Beading field-transmitting cathode assembly and lens.
30. method as claimed in claim 29 is characterized in that, alignment member is a container, and this container also comprises the fin of fixing on it, to form selected diameter.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/493,379 | 2000-01-28 | ||
| US09/493,379 US6469433B1 (en) | 2000-01-28 | 2000-01-28 | Package structure for mounting a field emitting device in an electron gun |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1411605A true CN1411605A (en) | 2003-04-16 |
Family
ID=23959989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01806100A Pending CN1411605A (en) | 2000-01-28 | 2001-01-25 | Electron gun cathode assembly |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6469433B1 (en) |
| EP (1) | EP1258022A2 (en) |
| JP (1) | JP2003521095A (en) |
| KR (1) | KR20020065941A (en) |
| CN (1) | CN1411605A (en) |
| AU (1) | AU2001231158A1 (en) |
| WO (1) | WO2001056051A2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6624578B2 (en) * | 2001-06-04 | 2003-09-23 | Extreme Devices Incorporated | Cathode ray tube having multiple field emission cathodes |
| US20040245224A1 (en) * | 2003-05-09 | 2004-12-09 | Nano-Proprietary, Inc. | Nanospot welder and method |
| US7164233B2 (en) * | 2004-08-04 | 2007-01-16 | Federal Mogul World Wide, Inc. | Barium-silica glass lamp having thermally balanced lead-in wires |
| US20070145267A1 (en) * | 2005-12-12 | 2007-06-28 | Adler David L | Portable scanning electron microscope |
| US20070145266A1 (en) * | 2005-12-12 | 2007-06-28 | Avi Cohen | Electron microscope apparatus using CRT-type optics |
| JP2009289505A (en) * | 2008-05-28 | 2009-12-10 | Hitachi Ltd | Electron beam generator |
| CN104080273A (en) * | 2014-07-04 | 2014-10-01 | 中国航天科技集团公司第五研究院第五一三研究所 | LCCC ceramic transfer base |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4414485A (en) * | 1981-06-23 | 1983-11-08 | Rca Corporation | Control-screen electrode subassembly for an electron gun and method for constructing the same |
| US4482840A (en) * | 1982-09-27 | 1984-11-13 | North American Philips Consumer Electronics Corp. | CRT Cathode assembly with support means |
| US4607187A (en) * | 1984-08-22 | 1986-08-19 | Rca Corporation | Structure for and method of aligning beam-defining apertures by means of alignment apertures |
| US5196707A (en) | 1991-03-04 | 1993-03-23 | Etec Systems, Inc. | Low aberration field emission electron gun |
| JPH07147134A (en) * | 1993-11-25 | 1995-06-06 | Sony Corp | Method for assembling electron gun and jig for assembling |
| JP3338275B2 (en) * | 1996-02-28 | 2002-10-28 | 三菱電機株式会社 | Electron gun assembling apparatus and electron gun assembling method |
| JPH1064410A (en) | 1996-07-08 | 1998-03-06 | Samsung Electron Devices Co Ltd | Negative electrode structure, and electron gun for cathode-ray tube using same |
| JP3086193B2 (en) | 1996-07-08 | 2000-09-11 | 三星エスディアイ株式会社 | Cathode structure, electron gun for cathode ray tube using the same, and color cathode ray tube |
| JP2940498B2 (en) | 1996-11-25 | 1999-08-25 | 日本電気株式会社 | Cold cathode device support method |
| US5905332A (en) | 1997-09-03 | 1999-05-18 | Samsung Display Devices Co., Ltd. | Electron gun for color cathode ray tube |
| DE69823441T2 (en) * | 1997-09-30 | 2004-09-23 | Noritake Co., Ltd., Nagoya | Electron emitting source |
-
2000
- 2000-01-28 US US09/493,379 patent/US6469433B1/en not_active Expired - Lifetime
-
2001
- 2001-01-25 KR KR1020027009777A patent/KR20020065941A/en not_active Application Discontinuation
- 2001-01-25 EP EP01903327A patent/EP1258022A2/en active Pending
- 2001-01-25 WO PCT/US2001/002519 patent/WO2001056051A2/en not_active Application Discontinuation
- 2001-01-25 AU AU2001231158A patent/AU2001231158A1/en not_active Abandoned
- 2001-01-25 CN CN01806100A patent/CN1411605A/en active Pending
- 2001-01-25 JP JP2001555111A patent/JP2003521095A/en not_active Withdrawn
-
2002
- 2002-10-11 US US10/269,172 patent/US6840834B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020065941A (en) | 2002-08-14 |
| AU2001231158A1 (en) | 2001-08-07 |
| WO2001056051A2 (en) | 2001-08-02 |
| EP1258022A2 (en) | 2002-11-20 |
| WO2001056051A3 (en) | 2001-12-13 |
| JP2003521095A (en) | 2003-07-08 |
| US6840834B2 (en) | 2005-01-11 |
| US20030032362A1 (en) | 2003-02-13 |
| US6469433B1 (en) | 2002-10-22 |
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