CN1318839C - Automatic optical detecting system for blemish assembly on printed circuit board - Google Patents
Automatic optical detecting system for blemish assembly on printed circuit board Download PDFInfo
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Abstract
The present invention relates to an automatic optical detection system of flaw components on a printed circuit board, which comprises three units of operating system architecture, actual practice identification, classification detection, etc. The system architecture unit establishes software architecture, hardware architecture, and an automatic positioning printed circuit board by the hardware architecture, retrieves images to a computer, and establishes the data of a standard package, a virtual image reference moulding board, a standard detection board, an on-line detection program, a component flaw, etc. by the software architecture, which can supply for establishing component standard detection value and relevant environmental parameters during the off-line operation, and supply for detecting component flaw states on the printed circuit board during the production on-line operation; the actual practice identification unit utilizes a figure comparison method or a normalization related coefficient method to carry out the operation of identification and calibration; the classification detection unit carries out classification calculation for the components on the printed circuit board carried out identification and calibration so as to accurately detect and obtain the flaw components comprising short item, deflection, polarity reverse, bridge connection, too big or too small soldering quantity, etc.
Description
Technical Field
The invention relates to an automatic optical detection system for defective components on a printed circuit board, which is particularly suitable for an assembly line of the printed circuit board and is designed for detecting the common or expected defective phenomena of component missing, skew, polarity reversal, bridging, excessive or too little soldering and the like.
Background
In factories, the degree of commercialization of the inspection machine for Printed Circuit Boards (PCBs), Surface Mounting Designs (SMDs) or Surface Mounting Technologies (SMT) has been high. In the case of Surface Mount Device (SMD) inspection machines, the detectable items are substantially the same for each product, but the differences in product are speed and some special functions (e.g., stereoscopic vision inspection for solder joints). The characteristics of the inspection machine for the current inter-bay Surface Mount Design (SMD) are briefly described as follows:
1. detecting items: the Surface Mount Design (SMD) detection between the workshops has been developed for a short time, so that the detection items of various machines have not changed much so far; the related detection items in the component part include: missing parts, skew, tombstone, polarity, shift, etc. The welding spot related detection items comprise: excessive tin, less tin, bridging, tin, and lead. In addition, in IC character Recognition, Optical Characteristic Verification (OCV) is preferred rather than conventional Optical Characteristic Recognition (OCR), on one hand, the character breaking degree may be too high due to laser imprinting, and on the other hand, the character imprinted by the IC is a predictable result, so that it is only necessary to determine whether the imprinting is correct or not.
2. A moving mechanism: the design of the dual-axis stage (X-YTable) on the inspection tool for Surface Mount Device (SMD) between the bays is very diversified, such as a design in which a load Charge Coupled Device (CCD) moves together with the light source, a design in which a load Printed Circuit Board (PCB) moves, and a design in which a load Charge Coupled Device (CCD) moves along the X axis and a load Printed Circuit Board (PCB) moves along the Y axis, but the inspection tool with speed as the key point mainly moves the Printed Circuit Board (PCB).
3. The image taking mechanism: in order to increase the detection range of the detection device for Surface Mount Device (SMD), the resolution of the Charge Coupled Device (CCD) for detection is also continuously increased. In addition, the use of digital and color charge-coupled devices (CCDs) has increased substantially; the color information improves the detection effect to a certain extent, the image quality obtained by a digital charge-coupled device (CCD) is better than that of an analog type, and the digital focusing function of the product is called by the manufacturer, so that the detection result is not influenced by the height of the component.
4. Light source: the light source system is considered a commercial secret by the shop owner to entirely enclose the light source group with a charge-coupled device (CCD), but there are also very simple inspection machines that use only white ring fluorescent lamps. Light Emitting Diode (LED) Light sources have become the best choice for many inspection tools because of their stability, but the Light source forms have many variations such as circular, square, matrix-matched refractors. The light sources of most inspection tools are mainly used for uniform illumination, so that the switching of different light sources to obtain more various image information is less likely to happen.
In the field of Surface Mount Device (SMD) inspection machines using visible light, the development is mainly directed to the detection of possible failures, and requires higher speed and lower misjudgment rate. And the SMD visual inspection does not use too complicated algorithm but is applied properly with the basic algorithm that is generally used.
In addition, the manufacturers who manufacture SMT inspection machines and their product functions in the factory (as shown in table one), among them, it is recognized that the automated optical inspection system (AOI) designed in israel is the strongest worldwide:
| manufacturer(s) | Product function |
| Orbotech (Israel high agency) | (see page 4 for each test function item) ■ function (a.b.c.d.e.f.h.i.) ■ 5 or 13 CCD, positional accuracy measurement of X, Y and θ for xenon flash lamp annular optical illumination ■ package, solder paste printing defects of package misplacement (OCV), solder empty, short circuit, IC foot stick solder empty, bubble (wave soldering) ■ 2D: non-melted tin, flatness of tin spot and lack ofThe defects of the 2.5D solder paste printing such as the stained and scattered solder paste and poor printing precision of cracks and gaps are as follows: solder paste printing thickness control standard |
| TERADYNE (USA) | ■ function (a.b.d.g.f.h.) |
| ■ 5 pins defect of CCD and LED light source ■ plug-in unit | |
| Sony (Japan Jiantaifeng, forest electric international) | ■ appearance inspection machine (Solder Paste inspection machine) high resolution. The vertical 29um is multiplied by the horizontal 24um ■, and the printing state of the solder paste on the substrate is detected by performing calculation using the image obtained by the upper side illumination and the image obtained by the horizontal side illumination |
| Omron (japanese economical agency) | ■ function (a.d.f.) ■ OCR: 32 characters can be read at one time without registering a character code library ■ for cold joint and ball joint |
| HIROX (Japanese emperor Shigao agent) | ■ 3D Rotary visual inspection system (for QC laboratory) |
| Samsung (hongqi, ping cheng agency of Korea) | ■ PCB detection |
| MVP (American Ma agent) | ■ AOI/automatic optical parts inspection machine |
| CYBEROPTICS (American Lei Ke agency) | ■ function (a.b.c.d.e.f.g.h.i.) ■ OCV |
| Agilent (agency of Bay harbor building platform of Dublin of Ireland) | ■ function (a.c.d.e.f.g.h.) ■ OCR, OCV ■ 2D tin test: thickness, position and quantity of tin |
| De Lao (Tai Shang) | ■ function (a.b.c.d.e.f.g.h.) ■ white reflection, gold finger surface flaw, PCB surface scratch ■ board bending, board warping, software automatic correction ■ special light source and CCD Camera automatic compensation function |
| From Tianxin technology, Ltd (Taiji) | ■ PCB bare board inspection, BGA inspection |
| CHANG-YU TECHNOLOGY Co.,Ltd. | ■ LED brightness and wavelength detection |
| GOOD WILL INSTRUMENT Co.,Ltd. | ■ testing and assembling circuit board |
| Dongjie semiconductor technology | ■ inspection of PCB, BGA defects ■ inspection of TFT LCD panel defects |
| Berge science and technology Inc | ■ PCB surface flaw detection and BGA detection ■ IC broken pin detection system ■ micron-scale precision positioning system |
| Kayan-Yan-Si-Tech-S-stockings Co., Ltd (Tai Shang) | ■ IN-LINE visual inspection machine and PCB test system |
| Functional item notation on the right of the table: (e.) polarity (polarity) (a.) missing part (f.) solder bridge (b.) error (wrong) (g.) pin displacement/bending (c.) skew (misalignment) (h.) solder/processes (d.) tombstone (i.) joint quality) | |
Table one: maker for manufacturing SMT (surface mount technology) detection machine and product function comparison thereof
Disclosure of Invention
The present invention aims to provide an automatic optical inspection system (AOI) for an automatic optical inspection system of a defective component on a printed circuit board, which is different from the conventional technology in that a novel and distinctive three-layer architecture including a program a (a-Prog.), a program B (B-Prog.) and a program C (C-Prog.) is planned at the initial stage of a software architecture of the system architecture, and the three-layer architecture has great flexibility in use and can be independently executed respectively, and the main advantages are described as follows:
procedure a (a-Prog.): the method is to provide a design end to establish a standard component database, and can add a new standard component or correct the detection parameters of the established standard component in the database. Therefore, a component database maintainer at a design end can set detectable defect types for the standard component and select a detection method according to various defect types. Meanwhile, because the components on the Printed Circuit Board (PCB) have high repeatability, each component can be repeatedly used only by establishing a standard image once and storing the standard image in a standard component database of the A program (A-Prog.), and the training operation time is saved.
Procedure B (B-Prog.): the method is provided for the distribution or use end to complete the setting of the position and detection items of the detection component in a quite intuitive component frame selection operation mode, and can establish the detection data of the standard detection board for each different order for the on-line detection program to detect the whole batch of Printed Circuit Boards (PCBs).
Procedure C (C-Prog.): when the user end is provided to operate on the production line, especially the Printed Circuit Board (PCB) with different layout (layout) is frequently changed, the C procedure (C-Prog.) can immediately carry out the batch detection only by calling the Printed Circuit Board (PCB) to the detection data completed by the B procedure (B-Prog.) when the layout is changed.
The present invention is amenable to industry variations, including:
1. in the component part; as semiconductor manufacturing processes are continuously improved, the size of components is smaller and smaller, and the placement density of PCB components is also improved, the invention can overcome the defect along with the improvement of CCD resolution. In addition, some components use newly developed packaging technology (such as BGA), and the present invention can also be solved by using a penetrating inspection technology (such as X-ray) or a multi-lens stereoscopic vision scheme.
2. In the PCB industry: the main development direction of the invention is to detect the products such as the motherboard, the interface card, etc. used in the PC, if the products develop to the saturation stagnation state in the future, the key detection technology can still be applied to many other emerging products using the PCB as the framework, such as the mobile phone, the PDA, etc.
3. In the chip packaging industry: the extension direction of the invention is the detection capability with smaller scale, the high-magnification lens and the linear scanning camera are used for image capture, and the invention can shorten the whole development time and quickly establish a detection machine suitable for the chip packaging industry (BGA) by matching with the mature algorithm developed by the front section.
Furthermore, the development of the present invention aims to replace manual visual inspection and to enhance the quality and speed of the inspection. The most important key part of the success of an automatic optical detection system is the development of detection algorithms. The detection algorithm aims at extracting representative characteristic pointer values from detection images and setting a proper judgment rule aiming at detection items of different components so as to judge whether a detection target is a good product or a defective product. The good detection algorithm needs to have good detection effect and also needs to pursue the lowest calculation complexity; the lower the complexity, the faster the calculation speed, and the industrial applicability of the algorithm is greatly improved. The detection algorithm used in the invention is to observe the component characteristics in the detected image, combine and apply the component characteristics by a simple algorithm, quantify the image characteristics into pointer values, and determine a judgment rule of good products/defective products after a certain number of detected image (including good products and defective products) experiments.
In order to clearly obtain the image characteristics of the assembly, an appropriate light source system is also needed to assist the image capture. The light source system functions not only to provide sufficient illumination to capture an image, but further to highlight features of the assembly. The variety of the light source system is very diverse, and even a single kind of light source can be changed in many forms; the AOI system needs a light source system which can be matched with various detection algorithms to have a good detection effect. The invention designs a set of mutually matched and applicable detection algorithm and a usable program-controlled light source system at the same time so as to develop a detection machine suitable for detecting defects of various components.
The application range and the field of the invention comprise:
(1) CCD accurate mobile positioning
(2) Detection algorithm and automatic collocation control of light source system
(3) Various defect detections of components on the PCB, such as chip resistors (resistors), chip capacitors (capacitors), small outline package integrated circuits (SOPs), and quad flat package integrated circuits (QFPs), are listed in table two:
(No defect occurred in the blank part list process)
Table two: the invention can detect the component types on the PCB and the defect items thereof
The present invention will be described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a diagram of the hardware architecture of the detection system of the present invention;
FIG. 2 is a schematic diagram of the software architecture of the detection system of the present invention;
FIG. 3 is a flow chart of the A procedure for building standard components in the software architecture of the present invention;
FIG. 4 is a flowchart of the procedure B1 for creating the reference template of the PCB virtual CCD in the software architecture according to the present invention;
FIG. 5 is a flow chart of the present invention for establishing a B procedure for detecting PCB data in a software architecture;
FIG. 6 is a flow chart of the on-line detection C program in the software architecture of the present invention;
FIG. 7 is a flowchart of a D procedure for inspecting PCB defect data in the software architecture of the present invention;
FIG. 8 is a flow chart of the on-line automatic positioning in the embodiment of the present invention;
FIG. 9 is a schematic diagram of an offline virtual reference template image for recognition in practice of the present invention;
FIG. 10 is a conceptual flow chart of setting a standard feature value in the detection method of the present invention;
FIG. 11 is an orthographic view of an IC pin bridging defect of the present invention;
FIG. 12 is a diagram of the results of the element orthographic projection process of the present invention.
Detailed Description
The invention develops an automatic optical detection system suitable for a flaw component on a PCB assembly line, which takes common or predictable flaw practice identification on a production line as a design consideration point, and the detection system architecture, the practice identification and the classification detection method are respectively used as three units, and are described as follows:
the detection system comprises a detection system architecture unit:
the design of the detecting system architecture is divided into a hardware architecture and a software architecture control design, and will be discussed by two implementation parts of off-line operation and on-line operation respectively, wherein:
the off-line operation; the detection system is based on the productivity of the production line, and can supply required information by only using one PC as an operation environment under the cost consideration; the main function is to establish the standard detection value of the device and the related environmental parameters, which is also called Training (Training) operation.
The online operation; the Inspection system is based on quality control in an auxiliary production line, and is mainly used for inspecting the defect state of the device to be inspected, so the Inspection system is also called Inspection (Inspection) operation.
The hardware architecture (as shown in FIG. 1); comprises a biaxial carrier 10(X-Y Table) which is a load image vision device 11(CCD) and an LED Ring Light source 12(Ring LED Light), and is controlled by a drive Controller 13(Driver Controller) to move to a printed circuit board 16(PCB) placing position designated by a user; wherein,
the image viewer 11(CCD), for image capture, converts analog image signals into digital image signals via an image capture card 14(Frame Grabber).
The LED Ring type Light source 12(Ring LED Light): the light source is controlled by a Digital/Analog Converter (DSP) 15 to provide a proper light source illumination mode according to different detection project requirements, so that various light source combinations can be generated by program control.
The driving controller 13, the image capture card (14) and the digital-to-analog converter (DAC) controller 15 are all controlled through a PC 17 as a working platform.
According to the hardware architecture, during an off-line training stage, a standard Printed Circuit Board (PCB) is loaded with a detection carrying platform in a manual mode; in the on-line detection stage, when one PCB is detected, the system sends a signal for replacing the PCB, stops all detection actions until one PCB to be detected is replaced, continues to send a detection instruction, and then starts detection.
The software architecture (as shown in FIG. 2); in the actions of establishing standard components and detecting a piece of PCB data in a PCB detection system, considering off-line operation of practical identification, in order to prevent off-line training action from influencing the operation of a production line, the invention designs a concept of virtual CCD (virtual CCD) to assist and improve the operation of software off-line operation. The method comprises the following steps:
I. procedure a to establish standard components (a-Prog.): the main function is to provide a database of standard cells (A01-A05) built at the design end, which can add new standard cells or modify the testing parameters of the standard cells already built in the database.
The design-side device database maintainer sets defect types 21 of the standard devices in the standard device database [ (a01 to a05],. times.) and stores standard device data 2 (. times.) that are standard device feature values by selecting appropriate inspection algorithms 22 for each defect type, creating image data 23 of the standard devices, and creating data streams (as shown in fig. 3) of parameters 24 required for inspection.
II. B1 procedure (B1-Prog) to create PCB virtual CCD data B10 (FIG. 2): the main function is to create a Reference Template (Reference Template) data B15 created by storing the whole standard PCB information and using the concept of virtual CCD, including the data for setting the PCB information B11, setting the moving biaxial carrier 10 to the fixed position B12, selecting the image combination method B13, etc., the combined image B14 can be provided to the off-line operation program to simulate the action of capturing the image by the real CCD (as shown in FIG. 4).
III, establishing a B procedure for detecting PCB data [ as shown in figure 2, (B-Prog.) ]: the main function is to establish a standard detection board data B2 and generate training data B20 for distribution or use end to perform batch detection by on-line detection procedure. The user can select the dut B21 on the standard inspection board from the standard cell database (a01 to a05) and read the virtual CCD data B10 (as shown in fig. 2), and create the automatic positioning data B23 and create or select the standard cell B24, and select the cell inspection item B22, and move the biaxial carrier to record the cell position B25 (as shown in fig. 5). Therefore, the B procedure can conveniently and rapidly adjust and detect the items of the PCB produced by the new order.
IV, C program for online detection [ as in fig. 2, (C-Prog.) ]: the main function is to utilize the training data B20(· trn) file (as shown in fig. 5) of the B program to perform the inspection of the whole batch of PCBs to be tested C10, and obtain the inspection result data C11(· inp) and the defect data C12, C15(· fut) of each PCB.
Referring to fig. 6, it can be further seen that the implementation process of the C procedure includes reading the training data B20, loading the entire batch of PCBs to be tested C10, automatically positioning each PCB C16, and then performing testing on the PCBs to be tested C17, so as to read the testing result data C11 (. inp) and the defect data C12 (. fut) of each PCB.
V, D procedure for inspecting PCB defect data [ see FIG. 2, (D-Prog,) ]: the main function is to use the D procedure to indicate the defect data C12 of each PCB generated by the C procedure (D0), including the defective component position D01 and the defect type D02, for repair (as shown in FIG. 7).
In FIG. 7, it can be seen that the D process is executed to read the virtual CCD data B10 and read defect data C12, and to reveal the defective component location D01 and defect type D02 on each PCB on the computer display 18.
(II) a real-estate identifying unit:
in the above software architecture of the present invention, considering the reference templates respectively established by the automatic PCB positioning and the off-line virtual CCD on the production line, both of them adopt the Pattern Matching method or the Normalized correlation coefficient method (Normalized correlation coefficient), which is described as follows:
(I) automatic positioning of PCB On-Line (On-Line);
when each PCB is detected on line, the PCB cannot reach the correct positioning every time because of the influence of external factors of the conveyor, and the subsequent detection operation is influenced to cause judgment errors, so the automatic positioning method is designed.
The timing and flow of the off-line training operation and the on-line inspection operation using the automatic positioning of the PCB (as shown in fig. 8) are described as follows:
[a] when a standard PCB is built by using the B program in an off-line Training operation (Training), the PCB location feature B3 is first boxed and the feature-related position B4 of the component on the PCB is recorded. The feature-related position (B4 includes the position of the image relative to the biaxial stage 10, and the position of the locating feature B3 relative to the image.
[b] Before each PCB is detected by the C program, the X-axis or (and) Y-axis offset of the dual-axis stage 10 caused by the conveyor or the positioning mechanism is automatically calculated according to the previously set positioning feature B3, and the X-axis or (and) Y-axis offset of the PCB is corrected and aligned while the dual-axis stage 10 is moved.
The X or (and) Y axis offset is obtained by searching C2 from the positioning feature B3 of the B program by using a Pattern Matching method to find out a possible position on the PCB to be tested, and comparing the position coordinate C3, that is, comparing the possible position on the PCB to be tested with the feature-related position B4 recorded during offline Training (Training); when the deviation occurs, the difference between the two is the deviation of the X or (and) Y axis, and the CCD position C4 should be corrected to the correct position, so as to facilitate moving the CCD C5 to the position above the PCB for detecting the C17.
(II) establishing a PCB reference template by using an Off-Line (Off-Line) virtual CCD;
the virtual CCD is provided as a reference template B15 that is undistorted, at the same magnification as the real CCD. The CCD magnification of the invention is 640 multiplied by 480/23 multiplied by 17 (pixels)/mm2), one PCB (23 multiplied by 20 cm)2) The total image is approximately 6400 × 6300 pixels (pixels). The virtual CCD function is the simulated real CCD, so that the whole PCB reference template B15 can be established. The virtual CCD is currently generated by the B1 process (as shown in FIG. 4), and the B and D processes are run off-line. The image of the reference template B15 created by the virtual CCD is generated, and the process outline steps are as follows (as shown in fig. 7) regardless of the movement of the biaxial stage 10 in the X-axis or Y-axis:
(a) moving the CCD on the double-shaft carrying platform by a fixed distance 40 to generate a first image before moving and a second image after moving; the fixed distance 40 is about 1/3 (the expected overlap area) the length and width of the image.
(b) The same CCD position is fixed using only the same light source as a judgment processing image.
(c) The image overlap region 43 is a region for numerical analysis.
(d) The overlapping area 43 of the first image 41 and the second image 42 is obtained by calculation, and is cut out from the second image 42.
To cut out the overlapped image, the present invention uses the overlapped area 43 on the first image 41 as the recognition template of Pattern Matching (Pattern Matching) method, and searches the similar area on the second image 42 to cut out from the second image 42.
(III) a classification detection unit:
the classification detection method of the present invention can be called a defect classification algorithm, and is mainly divided into an off-line (or training) operation and an on-line (or detection) operation.
During off-line operation, the standard component characteristic value 50 is first extracted from the standard component data of the a procedure, and the detection frame 51 is set to facilitate on-line operation for testing 52, and the relevant characteristic values of the standard component and the component to be tested are compared or compared, and the qualified component characteristic value is stored 5 (as shown in fig. 10).
1.A processing model for detecting the missing part and the skew of the capacitor;
when the capacitance on the PCB lacks a part and takes a gray scale image, two conditions are presented: (A) when the capacitor on the PCB lacks the part, the position of the component does not contain a circuit, and 2 when the capacitor on the PCB lacks the part, the vertical central position of the component contains a circuit and passes through. The capacitance is present in a standard component on the PCB.
In practical inspection, the components on the PCB are allowed to have slight deviation and are not defective, so the invention aims to obtain the correct component position by using Pattern Matching method in the first stage and then propose an algorithm to judge whether the components are missing (or faulty) in the second stage.
The first stage-the Pattern Matching (Pattern Matching) method-gets the correct component position. The threshold value setting of Acceptance (Acceptance) of the graph comparison method has no certain standard, so the invention firstly adopts a lower threshold value of Acceptance (Acceptance) to lead the result of the graph comparison method to contain the conditions of (A) correct components, (B) missing part misjudgment, and (C) wrong part misjudgment, and the like, and then carries out classification and screening by using the characteristic difference of the standard components and the misjudgment blocks. And in the second stage, an algorithm is proposed to judge whether the capacitor is in a missing state. For convenience of explanation, the Black Percentage (Black Percentage) method is hereinafter referred to.
The second stage-Black Percentage (Black Percentage) method-judges whether the capacitor is defective. The method is intended to use a suitable light source for illumination, resulting in differences between the characteristics of the capacitor itself and the image characteristics of missing or faulty components on a Printed Circuit Board (PCB). For example, the gray level distribution map of the component block (as shown in table three) is observed, the table three contains a dotted line, so that it can be clearly distinguished that the gray level distribution map of the standard component 01 does not contain any pixel (pixel) on the left side of the dotted line, and the gray level distribution maps of the other misjudged components 02, 03, and 04 contain image pixels on the left side of the dotted line.
Table three: gray scale distribution chart of misjudgment component and standard component
2. A bridging (short) detection processing model;
the bridging defect phenomenon only occurs on the device with the IC pin, and fig. thirteen is an enlarged view of the square flat package integrated circuit (QFP) IC pin with the bridging defect.
Considering the trouble that the range of the tin foot detection area in practice is possibly caused by deviation when the detection area is manually selected in an off-line training operation, slight deviation of a PCB in a tolerance range or slight deviation of a component in the tolerance range in an on-line detection operation; if the detection area is selected in a frame, an incorrect action occurs, and a subsequent algorithm cannot correctly judge the detection result due to the deviation of the detection starting point and the position of the judgment detection point.
The present invention is intended to solve the problem of positioning by searching the IC pins in the detection area, and then detect the IC pins by using an Image Projection (Image Projection) method, which is described as follows:
(A) extended detection region (invert region): because the number of the detection IC pins is set during off-line training operation, the position of the detection area needs to be informed in a manual mode, and in order to avoid the deviation of human factors, the central position of the detection area is not changed when a user determines the position of the detection area, so that the size of the original detection area is increased.
(B) Speckle search (Find Stripe): after binarization, the IC pin presents the speckle characteristics between black and white, and the locating action is carried out by using a speckle search method (Find Stripe method). Because the situation that the circuit of the bottom plate is hidden among the IC pins can be caused, the circuit is influenced by the heights of the IC pins at two sides, the brightness of the received light source is reduced, and the brightness can be eliminated by using a binarization mode; however, in some IC pin rows, if the first IC pin side may also contain a backplane circuit line, in order to maintain the significant features of the IC pins, it is not intended to be completely eliminated by the binarization method, because the brightness of the light source received by the first IC pin is higher than that of the backplane circuit passing through between the IC pins.
Considering the practical identification, the speckle search (Find Stripe) method estimates the position of the second IC pin as the starting point of the speckle search (Find Stripe) comparison area by using the speckle mark with the interval of black-white-black in the enlarged detection area (inventory), searches the correct position of the second IC pin, and can obtain the position of the first IC pin by using the known IC pin width.
(C) Image Projection (Image Projection) method; the algorithm is as follows:
(a) selecting a detection area;
(b) carrying out image binarization processing;
(c) performing image orthographic projection processing to obtain gray scale accumulation;
(d) numerical analysis: setting the detection starting point, the pitch of the IC pins, the width of the IC pins and the number of the IC pins can calculate the correct position of the IC pins, and if the integrated value of the binary gray-scale degrees among the IC pins is too high, the occurrence of bridging flaws at the position is judged (as shown in FIG. 11).
3. A polarity reversal detection processing model;
in the PCB assemblies (including SOPs and QFPs) discussed in the present invention, the polarity representation is divided into strip polarity and hole polarity. The polarity reversal phenomenon has no appearance flaw on the component, and the function of the component is lost mainly due to the reversal of the placement position of the component, so the polarity direction of the component can be marked by a mark, and the position of the polarity can be found by using the mark. This section describes the detection model of the strip polarity and the detection model of the hole polarity, respectively.
(A) A strip polarity detection model;
the body of the component to be tested mainly comprises two kinds of information of a component serial number and a component polarity, and the information is separated from the background by utilizing binarization processing. Because the gray scale degree of the serial number and the polarity of the component is the same, the two types of information need to be further separated; the positions of all the strip-shaped polarity marks are at the tail end of the component body, so according to the characteristics related to the positions, the positions of the component body are set by the detection frame, the image in the detection frame is processed by an orthographic projection method to obtain the result of figure 12, the orthographic projection processing can convert two-dimensional image data into numerical data of a one-dimensional array, and the numerical data is further used for taking the position of the maximum value, so that the positions of the polarity strips on the component can be known.
(B) A porous polarity detection model;
most QFP devices use recessed circular holes to indicate the polarity positions, and the recessed degree and aperture size of the circular holes will vary with different types of QFP devices.
The polar hole is irradiated by lateral light, and a white annular diaphragm appears around the circular hole, so the invention further judges the position of the polar hole by utilizing the reflection characteristic formed by the lateral light and using the required light ring information for strengthening the morphological processing method (Morphology) in the image processing. The method is introduced as follows:
(a) and (3) binarization processing: for polarity detection, the information required to be obtained from the image is the presence or absence of a polarity circular hole, so that one gray-scale image can be used for removing the unnecessary gray-scale values by means of binarization. After binarization, the ring-shaped aperture can be slightly separated from the background, but still part of noise is mixed, and the noise needs to be further eliminated by morphological processing operation.
(b) Form treatment: for morphological processing, we usually design a suitable matrix and apply specific algorithms to the graph to be processed to eliminate or enhance some signals. The present invention intends to use the image Erosion (Erosis) algorithm to eliminate the noise and the image expansion (interpolation) algorithm to enhance the signal. Thus, most of the ring-shaped aperture signal can be successfully retained and the main noise can be eliminated.
(c) Particle treatment: because the surface of the QFP assembly body is smooth, and only the position of a concave polar hole can reflect light when side light imaging is carried out, the invention aims to use particle processing (Blob process) to calculate the number of pixels (pixels) occupied by white dot particles in an image, namely the particle Area (Blob Area), as the basis for detecting whether the polar hole appears in a detection Area.
(d) Numerical analysis: the particle area can be used as the detection parameter value of the standard, but the particle area includes the noise that is not completely removed except the processed ring-shaped aperture area. Therefore, in the design of the detection parameter value for circular hole type polarity detection, the calculated total particle area should be multiplied by a weight to filter the particle area occupied by noise, and the setting of the weight value should be determined by further experiments. When the particle area obtained after the piece to be detected is processed is smaller than the detection parameter value, the defect condition with reversed polarity can be judged.
4. A detection model of soldering amount;
the QFP device on the PCB may generate secondary defects with excessive tin and too little tin in the SMT process. And taking a gray scale image of a tin soldering point with normal QFP tin amount on the PCB. The detection method is briefly described as follows:
(A) and setting the solder foot spacing D and the solder foot width W, and cutting out the soldering point image of the QFP assembly containing N solder feet at intervals of (D + W) xi (i is more than or equal to 0 and less than N, i belongs to an integer) by using an image cutting method by taking S as a starting point.
(B) The following parameter values were calculated using the solder dot images cut out in the above item (a).
Let UiIs the average value of the gray scale of a tin soldering point under the environment of an upper layer light source, i is more than or equal to 0 and less than N, i belongs to an integer
LiIs the average value of the gray scale of the soldering point under the environment of the lower layer light source, i is more than or equal to 0 and less than N, i belongs to an integer
(C) The average value of the gray scale of the soldering points is calculated by utilizing the upper and lower light sources, and then the normal tin amount, the excessive tin amount and the too small tin amount are separated out by utilizing a classification method (Classfix) in visual treatment.
Further illustrative examples of the use of the present invention are as follows:
the detection system developed by the invention considers the requirements on the actual production line, the program design comprises a three-layer structure (A, B and C programs), a virtual CCD (B1 program) and detection result report output (D program), the operation flow of the system is completely described by using a PCB example according to the structure and the detection method, and the components to be detected comprise 78 components including a chip resistor, a chip capacitor and a quad flat package integrated circuit (QFP).
(A) Procedure a to establish standard components (a-Prog.): firstly, a standard component database is established in the program A, the steps are that after the CCD is moved to a standard component to be detected, a standard component image is selected, and detection items and detection algorithms of the components are set.
(B) B1 procedure for creating PCB virtual CCD data (B1-Prog.): here, the length of the PCB is 225mm, the width of the PCB is 230mm, and the moving distance required by the CCD to capture the image is set (as shown in the B1-Prog operation screen of fig. 34), when the operation is performed, the CCD automatically captures the sub-images of the PCB in sequence, and combines all the sub-images into a whole piece of complete standard PCB information to establish a Reference Template (Reference Template) for the off-line operation program to simulate the action of capturing the image by the real CCD. The completed complete PCB image is combined.
(C) Establishing a B procedure (B-Prog.) for detecting PCB data: the PCB is browsed off-line by using the image combined by the B1-Prog, the position of the component on the PCB is selected, the detection range can be slightly enlarged during selection so as to search the position of the component, the corresponding standard component is selected from the standard component database completed by the A-Prog, and the item to be detected is selected.
(D) Procedure C of the on-line detection procedure (C-Prog.): and utilizing a standard detection version data file generated by the B-Prog to carry out the inspection of the whole batch of PCBs to be detected and generating the detection data and the flaw information of each PCB.
(E) D procedure for inspecting PCB defect data (D-Prog.): the C-Prog generated defect information is used to indicate the location of defective components and the type of defect. .
The automatic optical inspection system (AOI) provided by the invention has the following advantages:
1. quality consistency: the machine does not cause inconsistent quality standards due to human factors such as mental state, laziness, negligence, fatigue and the like, so that products with poor quality are passed out of factories.
2. And (3) improving the judgment capability: some defects such as empty solder, solder bridge, solder ball, etc. of SMT can not be found out by naked eyes, the detection time of AOI system is short, and the defects have high judgment on the defects and can not be missed.
3. And (3) real-time reaction: AOI, in cooperation with the Statistical Process Control (SPC) function, can quickly feed back the relevant information of the collected defective products, find the process problems in real time and adjust the parameters of the machine, thereby maintaining the stability of the process and reducing the loss caused by the defective products.
4. Reduce inadvertent injury: the AOI system is a non-contact detection system, which can reduce or eliminate the chance that the hand contacts the product, so as to avoid the damage of static electricity, handprint and the like to the product.
In summary, the development of the automatic optical inspection system (AOI) for defective components on a printed circuit board of the present invention not only can reduce the production cost, increase the inspection speed and reduce the false rate, but also can achieve the level of total inspection, the consistency of the efficiency, efficiency and quality is far better than the conventional manual inspection, and in the present situation, customers gradually regard AOI as the basic requirement of product quality, so that the domestic industry is a necessary trend to develop AOI and quickly introduce AOI into the product.
Claims (10)
1. An automatic optical inspection method for defective components on a printed circuit board, comprising:
(1) procedure a to build a database of standard components: after moving the image vision device CCD to the standard component to be detected, framing and capturing the standard component image, and setting the detection items and detection algorithms of all the components;
(2) b1 procedure for creating virtual image viewer CCD data of printed circuit board PCB: setting the information of the PCB, including the length, the width and the moving distance required by the image vision device CCD to shoot the image, automatically shooting the subimages of the PCB in sequence by the image vision device CCD during execution, combining all the subimages into complete standard PCB information to establish a reference template, and combining the complete PCB image;
(3) establishing a B procedure for detecting PCB data of the printed circuit board: browsing the PCB off-line by using the combined image, selecting the position of the component on the PCB, selecting the corresponding standard component from the standard component database, and selecting the item to be detected;
(4) procedure C for on-line detection: using the generated standard detection board data file to detect the whole batch of PCB to be detected and generating the detection data and flaw information of each PCB;
(5) d, inspecting the PCB flaw data of the printed circuit board: utilizing the generated defect information to indicate the position and the defect type of the defective component;
the method adopts an automatic optical detection system comprising a system architecture unit, a practical identification unit and a classification detection unit, wherein the system architecture unit is provided with a hardware architecture and a software architecture, so that a user can perform practical identification and classification detection during off-line operation and on-line operation, the off-line operation is to establish a standard detection value and relevant environmental parameters of a component to be detected on the printed circuit board, and the on-line operation is to perform detection on the defect state of the component to be detected on the printed circuit board.
2. The method of claim 1, wherein the standard cell database of the A program is used for user to set the defect type of the detectable standard cell.
3. The method of claim 1 wherein the standard cell image data is obtained by setting the defect type of the standard cell and selecting an appropriate inspection algorithm.
4. The method of claim 1, wherein the B1 program sets distance data for moving the biaxial stage to a fixed position.
5. The method of claim 1, wherein the B1 program is used for offline operations in performing real estate identification to create a reference template, the B1 program sets the data for selecting image combinations by:
(a) moving an image vision device on a double-shaft carrying platform for a fixed distance to generate a first image before moving and a second image after moving;
(b) the same image vision device only uses the same LED annular light source as the basis for judging the image;
(c) the image overlapping area is a numerical analysis area;
(d) the overlapping region of the first image and the second image is obtained by calculation, and is cut out from the second image.
6. The method of claim 6, wherein the fixed distance is 1/3 image length.
7. The method of claim 6, wherein the overlap area of the first image is used as a recognition template for pattern matching when the overlap image is cut, and a similar area is searched for in the second image to cut the second image.
8. The method of claim 1, wherein the B program uses a pattern matching method in the real estate identifying unit to first frame and record the positioning characteristics of the PCB and record the relative positions of the characteristics of the components on the PCB when selecting to read the standard component data to be tested, thereby finding the X-axis or Y-axis offset of the dual-axis stage, or the X-axis and Y-axis offsets, so that the offset can be corrected when moving the dual-axis stage to calibrate and establish the automatic positioning data of the PCB.
9. The method of claim 10, wherein the relative positions of features of the component on the printed circuit board include the position of the image relative to the biaxial stage and the position of the locating feature relative to the image.
10. The method of claim 1, wherein the B program reads the dummy CCD data of the B1 program.
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| CNB021538298A CN1318839C (en) | 2002-11-28 | 2002-11-28 | Automatic optical detecting system for blemish assembly on printed circuit board |
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| TWI651589B (en) * | 2018-02-05 | 2019-02-21 | 志聖工業股份有限公司 | Detecting method of circuit board and exposing method of circuit board |
| TWI700644B (en) * | 2019-04-02 | 2020-08-01 | 精英電腦股份有限公司 | Synchronous positioning device and method for circuit board or plate member |
| TWI715289B (en) * | 2019-11-14 | 2021-01-01 | 新加坡商鴻運科股份有限公司 | Device and method for setting product printing parameters and storage medium |
| CN112801328A (en) * | 2019-11-14 | 2021-05-14 | 鸿富锦精密电子(天津)有限公司 | Product printing parameter setting device, method and computer readable storage medium |
| CN112801328B (en) * | 2019-11-14 | 2023-10-31 | 富联精密电子(天津)有限公司 | Product printing parameter setting device, method and computer readable storage medium |
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