CN118763090A - Photosensitive assembly, preparation method thereof, camera module and electronic equipment - Google Patents

Abstract

The application discloses a photosensitive assembly, a preparation method thereof, a camera module and electronic equipment. The photosensitive assembly comprises a photosensitive chip, a circuit board, a packaging body and a buffer material, wherein the side wall of the photosensitive chip comprises a plurality of corner areas, the photosensitive chip comprises a first surface and a second surface which are arranged back to back, and the first surface comprises a photosensitive area and a non-photosensitive area; the circuit board is electrically connected with the non-photosensitive area of the photosensitive chip, the packaging body coats the circuit board and the non-photosensitive area of the photosensitive chip, the buffer material is arranged among the packaging body, the photosensitive chip and the circuit board, the elastic modulus of the buffer material is smaller than that of the circuit board, that of the photosensitive chip and that of the packaging body, the buffer material is in partial contact with the side wall of the photosensitive chip, the surface of the side wall of the photosensitive chip, which is in contact with the buffer material, is a first part, the rest part is a second part, and the second part comprises at least one corner area.

Description

Photosensitive assembly, preparation method thereof, camera module and electronic equipment

Technical Field

The application relates to the technical field of optical elements, in particular to a photosensitive assembly, a preparation method thereof, a camera module and electronic equipment.

Background

Along with the popularization of intelligent equipment, a camera module applied to the intelligent equipment is rapidly developed and advanced, and miniaturization has become a development trend of the camera module. The camera module evolved from COB (Chip On Board) to MOB (Molding On Board) and then from MOB to MOC (Molding On Chip).

The camera module generally comprises a package body, a photosensitive chip and a circuit board, wherein the photosensitive chip is easy to warp due to stress in the assembly process of the camera module, so that the imaging quality is affected, and even the photosensitive chip is possibly cracked.

At present, how to further reduce the stress to the photosensitive chip is one of the technical problems to be solved by those skilled in the art.

Disclosure of Invention

The photosensitive assembly, the preparation method thereof, the camera module and the electronic equipment provided by the embodiment of the application can solve or partially solve the defects in the prior art or other defects in the prior art.

According to the photosensitive assembly provided by the first aspect of the application, the photosensitive assembly comprises a photosensitive chip, a circuit board, a packaging body and a buffer material, wherein the side wall of the photosensitive chip comprises a plurality of corner areas, the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back mode, the first surface comprises a photosensitive area and a non-photosensitive area, the circuit board is electrically connected with the non-photosensitive area of the photosensitive chip, the packaging body coats the circuit board and the non-photosensitive area of the photosensitive chip, the buffer material is arranged among the packaging body, the photosensitive chip and the circuit board, the elastic modulus of the buffer material is smaller than the elastic modulus of the circuit board, the elastic modulus of the photosensitive chip and the elastic modulus of the packaging body, the buffer material is in local contact with the side wall of the photosensitive chip, the surface of the side wall of the photosensitive chip, which is in contact with the buffer material, is a first part, the rest part is a second part, and the second part comprises at least one corner area.

According to one embodiment of the present application, the outer side of the photosensitive chip has a cavity, and the second portion is exposed to the cavity.

According to one embodiment of the application, the second portion is in contact with the package.

According to one embodiment of the present application, the non-photosensitive region includes a wide-side region and a narrow-side region spaced apart along a first direction, the plurality of corner regions includes two first corner regions adjacent to the narrow-side region and two second corner regions adjacent to the wide-side region, the two first corner regions are disposed opposite to each other along a second direction, the two second corner regions are disposed opposite to each other along the second direction, and the second portion includes at least one of the first corner regions, and the first direction, the second direction and a thickness direction of the photosensitive chip intersect each other.

According to one embodiment of the application, the first portion comprises two of the second corner regions.

According to one embodiment of the present application, the broadside region is electrically connected to the wiring board, and the package covers the broadside region and exposes the narrow side region.

According to one embodiment of the present application, the package includes a wide side portion and a narrow side portion spaced apart along the first direction, the wide side portion covering the wide side region, and the narrow side portion being located on a side of the narrow side region away from the wide side portion along the first direction.

According to one embodiment of the present application, the side wall of the photosensitive chip further includes a connection region between adjacent corner regions, and the first portion includes at least a part of the connection region.

According to one embodiment of the present application, the photosensitive chip protrudes from the buffer material in a thickness direction of the photosensitive chip.

According to one embodiment of the application, the non-photosensitive region includes a first electrical connection region, the second location further includes at least a portion of the connection region engaged with the first electrical connection region, and the first location includes a remaining portion of the connection region.

According to one embodiment of the application, the corner region comprises: a first region extending in a first direction; and the second area extends in the second direction and is intersected with the first area, and the first direction, the second direction and the thickness direction of the photosensitive chip are intersected in pairs.

According to one embodiment of the present application, the dimension of the first region along the first direction and/or the dimension of the second region along the second direction is 0.4mm to 1mm.

According to one embodiment of the application, the dimensions of the first region in the first direction and the dimensions of the second region in the second direction are the same.

According to one embodiment of the application, the circuit board is located on a side of the second surface remote from the first surface.

According to one embodiment of the application, the circuit board surrounds the photosensitive chip.

According to one embodiment of the application, the photosensitive assembly further comprises a support plate, the support plate is located on one side, away from the first surface, of the second surface, and the circuit board is arranged on the support plate and surrounds the photosensitive chip.

According to the second aspect of the application, the camera module comprises an optical lens and the photosensitive assembly according to the first aspect of the application, wherein the optical lens is positioned on a photosensitive path of a photosensitive chip of the photosensitive assembly.

According to the electronic equipment provided by the third aspect of the application, the electronic equipment comprises an electronic equipment body and the camera module set in the second aspect of the application, wherein the camera module set is arranged in the electronic equipment body.

According to a fourth aspect of the present application, there is provided a method for manufacturing a photosensitive assembly, comprising: providing a circuit board and a photosensitive chip, wherein the front surface of the circuit board comprises a first mounting area and a second mounting area positioned at the periphery of the first mounting area, the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back mode, the first surface comprises a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip is provided with a plurality of corner areas, the side wall of the photosensitive chip comprises a first part and a second part, and the second part comprises at least one corner area; mounting the second surface of the photosensitive chip on a first mounting area of the circuit board, and electrically connecting a non-photosensitive area of the photosensitive chip with the circuit board; coating a buffer material contacted with the first part on the front surface of the circuit board; and forming a package body, wherein the package body covers the second mounting area, the non-photosensitive area and the buffer material of the circuit board.

According to a fifth aspect of the present application, there is provided a method for manufacturing a photosensitive assembly, comprising: providing a supporting plate and a photosensitive chip, wherein the front surface of the supporting plate is provided with a third mounting area, a gap area positioned at the periphery of the third mounting area and a fourth mounting area positioned at the periphery of the gap area, the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back mode, the first surface comprises a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip is provided with a plurality of corner areas, the side wall of the photosensitive chip comprises a first part and a second part, and the second part comprises at least one corner area; attaching the second surface of the photosensitive chip to the third mounting area; attaching an annular circuit board to the fourth mounting area, and electrically connecting the circuit board with a non-photosensitive area of a photosensitive chip; coating a buffer material in contact with the first portion in the gap region; and forming a package body, wherein the package body covers the circuit board, the non-photosensitive area and the buffer material.

According to a sixth aspect of the present application, there is provided a method for manufacturing a photosensitive assembly, comprising: providing an annular circuit board and a photosensitive chip, wherein the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back manner, the first surface comprises a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip is provided with a plurality of corner areas, the side wall of the photosensitive chip comprises a first part and a second part, and the second part comprises at least one corner area; the photosensitive chip is inserted into a central hole of the circuit board, and a gap is reserved between the circuit board and the photosensitive chip; coating a buffer material in contact with the first portion within the gap; and forming a package body, wherein the package body covers the circuit board, the non-photosensitive area and the buffer material.

According to one embodiment of the application, forming the package includes: providing a mold, wherein a cavity for injecting molding liquid is formed in the mold; and pressing the die on an assembly at least comprising the circuit board and the photosensitive chip, wherein the second part is positioned outside the cavity.

According to one embodiment of the application, forming the package includes: providing a mold, wherein a cavity for injecting molding liquid is formed in the mold; and pressing the die on an assembly at least comprising the circuit board and the photosensitive chip, wherein the second part is positioned in the cavity.

According to the photosensitive assembly provided by the embodiment of the application, the buffer material is only contacted with part of the side wall of the photosensitive chip, so that at least one corner area of the side wall of the photosensitive chip is not covered with the buffer material, the stress transmission mode such as the stress direction, the stress magnitude and the like around the photosensitive chip can be changed, and further the stress distribution around the photosensitive chip can be improved, so that the stress concentration position of the photosensitive chip can be transferred, the total stress of the photosensitive chip can be reduced, the problems of cracking, welding spot cracking and the like of the photosensitive chip are not easy to occur, and the packaging body is not easy to damage.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following specification.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings. The drawings are included to provide a better understanding of the present application and are not to be construed as limiting the application.

In the drawings:

FIG. 1 is a schematic longitudinal sectional view of a COB module according to the related art;

FIG. 2 is a schematic longitudinal sectional view of a related art MOB module;

FIG. 3 is a schematic longitudinal sectional view of one MOC module of the related art;

FIG. 4 is a schematic longitudinal sectional view of another MOC module of the related art;

FIG. 5 is a schematic longitudinal sectional view of still another MOC module of the related art;

FIG. 6 is a schematic diagram of a force principle of a photosensitive chip in the related art;

FIG. 7 is a schematic longitudinal sectional view of a related art MOC module provided with a cushioning material;

FIG. 8 is a schematic cross-sectional view of a related art MOC module provided with a cushioning material;

FIG. 9 is a schematic partial cross-sectional view of a related art MOC module provided with a cushioning material;

FIG. 10 is a schematic cross-sectional view of a camera module according to one embodiment of the present application;

FIG. 11 is a schematic cross-sectional view of FIG. 10 at A-A;

FIG. 12 is a schematic cross-sectional view of a camera module according to another embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of FIG. 12 at A-A;

FIG. 14 is a schematic cross-sectional view of FIG. 12 at B-B;

FIG. 15 is a schematic longitudinal cross-sectional view of a camera module according to one embodiment of the present application;

FIG. 16 is a schematic longitudinal sectional view of a camera module according to another embodiment of the present application;

FIG. 17 is a schematic top view of a photosensitive chip according to an embodiment of the present application;

FIG. 18 is a partial longitudinal cross-sectional schematic view of a camera module according to one embodiment of the application;

FIG. 19 is a flow chart of a method of fabricating a photosensitive assembly according to one embodiment of the present application;

FIG. 20 is a flow chart of a method of manufacturing a photosensitive assembly according to another embodiment of the present application; and

Fig. 21 is a flow chart illustrating a method of manufacturing a photosensitive assembly according to still another embodiment of the present application.

Reference numerals:

100. A circuit board; 110. an electronic component; 120. a second connection structure;

200. a photosensitive chip; 210. a first surface; 211. a photosensitive region;

212. A non-photosensitive region; 213. a broadside region; 214. a narrow edge region;

215. A first electrical connection region; 220. a second surface; 230. corner regions;

231. A first corner region; 232. a second corner region; 233. a first region;

234. a second region; 240. a connection region; 241. a first sub-region;

242. a second sub-region; 250. a first connection structure; 300. a package;

310. A wide edge portion; 320. a narrow edge portion; 400. a buffer material; 500. a cavity;

600. A support plate; 610. a base; 700. an optical lens; 800. a wire;

900. An optical filter.

Detailed Description

In the description of the embodiments of the present application, it should be noted that the positional or state relation indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the positional or state relation shown in the drawings, and is merely for convenience in describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the embodiments of the present application will be understood in detail by those skilled in the art.

In embodiments of the application, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Exemplary embodiments of the present application will now be described with reference to the accompanying drawings, in which various details of embodiments of the present application are included to facilitate understanding, and are to be considered merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

In addition, the embodiments of the present application and the features of the embodiments may be combined with each other without collision. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1, the COB module generally includes a circuit board 100, a photosensitive chip 200, an optical lens 700, an optical filter 900 and a base 610, wherein the photosensitive chip 200 is mounted on the front surface of the circuit board 100, the photosensitive chip 200 is electrically connected with the circuit board 100 through a wire 800, at least one electronic component 110 is mounted on the front surface of the circuit board 100, the electronic component 110 is located on the periphery of the photosensitive chip 200, the base 610 is fixed on the front surface of the circuit board 100 and surrounds the photosensitive chip 200 and the electronic component 110 by glue, the optical lens 700 is fixed on one end of the base 610 far away from the circuit board 100 by glue, the end of the base 610 far away from the circuit board 100 has an opening, the opening is located on a photosensitive path of the photosensitive chip 200, and the optical filter 900 is mounted on the opening.

In order to avoid the electronic component 110 and the wires 800, a certain gap needs to be kept between the base 610 and the electronic component 110 and the wires 800, which increases the size of the base 610 in the horizontal direction and the vertical direction, and thus the overall size of the COB module is larger.

In order to meet the miniaturization requirement of the camera module, the MOB module and the MOC module are generated. As shown in fig. 2, the MOB module encapsulates the electronic component 110 using the molding body 301, so that a space required for avoiding the electronic component 110 in a horizontal direction is omitted, and thus the size of the MOB module in the horizontal direction can be smaller than that of the COB module. Fig. 3 to 5 show MOC modules of different structural forms. As shown in fig. 3 to 5, the MOC module generally adopts the molding body 301 to simultaneously package the electronic component 110 and the wire 800, so that a space required for avoiding the electronic component 110 and the wire 800 in the horizontal direction and the vertical direction is omitted, and thus, compared with the MOB module, the MOC module can be smaller in size in the horizontal direction and the vertical direction.

As shown in fig. 6, the photosensitive chip 200 is typically attached to the front surface of the circuit board 100 by DA (Die Attach) glue, and the molding body 301 covers part of the area of the circuit board 100 and the photosensitive chip 200, and the molding body 301 and the photosensitive chip 200 and the molding body 301 and the circuit board 100 are rigidly bonded. When the external temperature changes, stress is generated between the molded body 301 and the photosensitive chip 200 and between the molded body 301 and the wiring board 100. Since the molding temperature of the molded body 301 is higher than 150 ℃ in the molding process, the baking temperature is 80 ℃ in the baking stage, and the environmental temperature may also change many times in the subsequent process, the thermal expansion coefficient of the photosensitive chip 200 is smaller than that of the molded body 301, the DA glue and the circuit board 100, in other words, the shrinkage or expansion degree of the photosensitive chip 200 is minimal at the same environmental temperature compared with the circuit board 100 and the molded body 301, so that when the environmental temperature changes drastically, the stress is concentrated on the photosensitive chip 200, resulting in larger deformation of the photosensitive chip 200. For example, as shown in fig. 6, when the ambient temperature changes drastically, the periphery of the photosensitive chip 200 may be tilted upward to form smiling face curvature. After the photosensitive chip 200 is bent, the imaging quality of the camera module is affected, so that the field curvature is too large, and the edge effect of the final imaging image is poor.

Taking the sinking MOC module as an example, in order to reduce stress to which the photosensitive chip 200 is subjected during the formation of the molded body 301, as shown in fig. 7 to 9, a buffer material 400 is disposed between the photosensitive chip 200 and the circuit board 100, in other words, the buffer material 400 surrounds the photosensitive chip 200, the circuit board 100 surrounds the buffer material 400, and the elastic modulus of the buffer material 400 is smaller than the elastic modulus of the circuit board 100, the elastic modulus of the photosensitive chip 200, and the elastic modulus of the molded body 301. When assembling the MOC module, the annular circuit board 100 is firstly attached to the surface of the support plate 600, then the photosensitive chip 200 is placed in the central hole of the circuit board 100, the photosensitive chip 200 is attached to the surface of the support plate 600 through DA glue, the buffer material 400 is coated on the gap between the photosensitive chip 200 and the circuit board 100, and then the molded body 301 covering the circuit board 100, the buffer material 400 and part of the photosensitive chip 200 is formed through a molding process or a compression molding process. Since the elastic modulus of the buffer material 400 is smaller than the elastic modulus of the circuit board 100, the elastic modulus of the photosensitive chip 200, and the elastic modulus of the molded body 301, the buffer material 400 can absorb part of stress generated by the molded body 301 and the circuit board 100 in the process of forming the molded body 301, so that stress applied to the photosensitive chip 200 by the molded body 301, the circuit board 100, and the DA glue can be reduced, and the risk of warping of the photosensitive chip 200 can be reduced.

However, since the stress generated from the circuit board 100 and the molding body 301 is more likely to be concentrated at the junction of different materials and the portion where the stress transmission direction turns, such as the corner, and the interface of the molding body 301 and the cushioning material 400 is adjacent to the edge of the photosensitive chip 200, the stress received at the corner of the photosensitive chip 200 is more likely to be concentrated at the portion of the non-photosensitive region 212 of the photosensitive chip 200 adjacent to the edge. The first surface 210 of the photo-sensing chip 200, that is, the surface of the photo-sensing chip 200 facing the optical filter 900, includes a photo-sensing region 211 and a non-photo-sensing region 212. In addition, since the non-photosensitive area 212 of the photosensitive chip 200 is generally provided with components such as a micro lens, a logic circuit, a pad, etc., the non-photosensitive area 212 of the photosensitive chip 200 is relatively sensitive to stress, and the stress concentration at these parts easily causes damage problems such as cracking, solder joint cracking, etc. of the photosensitive chip 200, thereby affecting the performance and reliability of the whole camera module.

Based on this, as shown in fig. 10 to 16, an embodiment of the present application provides a photosensitive assembly including a photosensitive chip 200, a wiring board 100, a package 300, and a buffer material 400. The side wall of the photosensitive chip 200 includes a plurality of corner regions 230, the photosensitive chip 200 includes a first surface 210 and a second surface 220 opposite to each other, the first surface 210 includes a photosensitive region 211 and a non-photosensitive region 212, the circuit board 100 is electrically connected with the non-photosensitive region 212 of the photosensitive chip 200, the package body 300 wraps the circuit board 100 and the non-photosensitive region 212 of the photosensitive chip 200, the buffer material 400 is disposed between the package body 300, the photosensitive chip 200 and the circuit board 100, the elastic modulus of the buffer material 400 is smaller than the elastic modulus of the circuit board 100, the elastic modulus of the photosensitive chip 200 and the elastic modulus of the package body 300, the buffer material 400 is in local contact with the side wall of the photosensitive chip 200, the surface of the side wall of the photosensitive chip 200, which is in contact with the buffer material 400, is a first portion, the rest portion is a second portion, and the second portion includes at least one corner region 230.

According to the embodiment of the application, the buffer material 400 is only contacted with part of the side wall of the photosensitive chip 200, so that at least one corner area 230 of the side wall of the photosensitive chip 200 is not covered by the buffer material 400, and the stress transmission modes such as stress direction, stress magnitude and the like between the package 300, the buffer material 400 and the circuit board 100 can be changed, so that the stress distribution around the photosensitive chip 200 can be improved, the stress concentration position of the photosensitive chip 200 can be transferred, the stress concentration position at the corner of the photosensitive chip 200 can be transferred from the position of the non-photosensitive area 212 adjacent to the edge of the non-photosensitive area to other positions, and the total stress of the photosensitive chip 200 can be reduced, so that the problems of cracking, welding spot cracking and the like of the photosensitive chip 200 are not easy to occur, and the package 300 is not easy to damage.

It should be noted that, as shown in fig. 15, the circuit board 100 may be located on a side of the second surface 220 of the photosensitive chip 200 away from the first surface 210 thereof, in other words, the second surface 220 of the photosensitive chip 200 may be attached to the surface of the circuit board 100. Of course, as shown in fig. 16, the circuit board 100 may also surround the photosensitive chip 200, that is, the circuit board 100 is annular and located at the periphery of the photosensitive chip 200. In some embodiments, as shown in fig. 14, the photosensitive assembly may further include a support plate 600, where the support plate 600 is located on a side of the second surface 220 of the photosensitive chip 200 away from the first surface 210 thereof, the photosensitive chip 200 and the circuit board 100 are both disposed on the support plate 600, and the circuit board 100 surrounds the photosensitive chip 200.

As an example, the surface of the circuit board 100 is mounted with at least one electronic component 110, and the electronic component 110 may include, but is not limited to, components including a resistor, a capacitor, an inductor, a transistor, or the like. The electronic component 110 may be mounted on the surface of the circuit board 100 by a surface mount technology (Surface Mounting Technology, SMT). In order to reduce the height of the electronic component 110 protruding from the circuit board 100, the electronic component 110 may be embedded in the circuit board 100. The package 300 can encapsulate the electronic components 110 to avoid interference between adjacent electronic components 110. Thus, not only can the required spacing between adjacent electronic components 110 be reduced, so that the entire photosensitive assembly can have a smaller size in the horizontal direction, but also the number of electronic components 110 that are allowed to be mounted on the circuit board 100 can be increased without changing the size of the photosensitive assembly.

In some embodiments, as shown in fig. 10 and 11, the outside of the photosensitive chip 200 has a cavity 500, the buffer material 400 is in contact with a first portion of the sidewall of the photosensitive chip 200, and a second portion of the sidewall of the photosensitive chip 200 is exposed to the cavity 500, in other words, the second portion of the photosensitive chip 200 is not in contact with the buffer material 400 nor the package 300. In the case that the photosensitive chip 200 is mounted on the surface of the circuit board 100, the cavity 500 is formed between the second portion of the photosensitive chip 200 and the package 300; as shown in fig. 11, in the case where the circuit board 100 surrounds the photosensitive chip 200, the cavity 500 is provided between the second portion of the photosensitive chip 200 and the circuit board 100. The cavity 500 may isolate at least one corner region 230 of the photo-sensing chip 200 from the circuit board 100 or the package 300, so that a stress source of the corner region 230 may be cut off, and a problem of stress concentration in the corner region 230 may be avoided.

In still other embodiments, as shown in fig. 12 and 13, the buffer material 400 contacts a first portion of the sidewalls of the photosensitive chip 200, and a second portion of the sidewalls of the photosensitive chip 200 contacts the package 300, in other words, at least one corner region 230 of the photosensitive chip 200 contacts the package 300. Wherein the package 300 may include, but is not limited to, a molded body, the material of which may include a hot melt material or a thermosetting material; the buffer material 400 may include, but is not limited to, epoxy (Epoxy Molding Compound, EMC), resin, or adhesive. Since the package 300 is in contact with at least one corner region 230 of the photo-sensing chip 200 in the embodiment of the application, at the corner of the photo-sensing chip 200 corresponding to the corner region 230, the package 300 is in contact with not only the portion of the non-photo-sensing region 212 adjacent to the corner region 230 but also the corner region 230, in other words, the material in contact with the corner of the photo-sensing chip 200 is the same material, so that stress transmission is continuous at the corner, and thus the stress concentration portion at the corner of the photo-sensing chip 200 is transferred from the position of the non-photo-sensing region 212 adjacent to the edge thereof to the bottom of the sidewall of the photo-sensing chip 200, and the bottom of the sidewall of the photo-sensing chip 200 is typically a silicon material with a higher degree of stress resistance. It can be seen that the embodiment of the present application can reduce the risk of damage to the photosensitive chip 200, and can also reduce the total stress to which the photosensitive chip 200 is subjected.

In still other embodiments, the buffer material 400 contacts a first portion of the sidewall of the photosensitive chip 200, at least one corner region 230 of a second portion of the photosensitive chip 200 is exposed in the cavity 500, and at least another corner region 230 of the second portion may contact the package body 300.

In some embodiments, as shown in fig. 10, the corner region 230 includes a first region 233 and a second region 234, the first region 233 extends in a first direction, the second region 234 extends in a second direction and intersects the first region 233, the first direction, the second direction, and the third direction intersect one another, and the third direction is a thickness direction of the photosensitive chip 200. It should be noted that, the first direction, the second direction, and the third direction may be generally understood as having included angles between the first direction and the second direction, between the second direction and the third direction, and between the first direction and the third direction. For example, the first direction is perpendicular or approximately perpendicular to the second direction, the second direction is perpendicular or approximately perpendicular to the third direction, and the first direction is perpendicular or approximately perpendicular to the third direction. As an example, in the embodiment of the present application, the first direction may be the x direction in the drawing, the second direction may be the y direction in the drawing, and the third direction may be the z direction.

In some embodiments, the extending direction of the first region 233 is perpendicular to the extending direction of the second region 234, i.e., the first direction is perpendicular to the second direction. In this case, the corner region 230 has an L-shape in projection on a plane perpendicular to the third direction.

In some embodiments, the dimension of the first region 233 along the first direction and/or the dimension of the second region 234 along the second direction is 0.4mm to 1mm. For example, the dimension of the first region 233 in the first direction and/or the dimension of the second region 234 in the second direction is 0.5mm. By limiting the extension dimensions of the first region 233 and the second region 234 within the above-described range, the stress transmission manner between the package body 300 and the buffer material 400 can be effectively changed on the premise of ensuring the buffer performance of the buffer material 400, and the risk of damage to the corner of the photosensitive chip 200 can be reduced.

As an example, the size of the first region 233 in the first direction is the same as the size of the second region 234 in the second direction. Simulation shows that when the dimension of the first region 233 in the first direction is the same as the dimension of the second region 234 in the second direction, the corner region 230 of the photo-sensing chip 200 is subjected to the smallest stress.

As shown in fig. 15 and 17, the photosensitive chip 200 includes a first surface 210 and a second surface 220 disposed opposite to each other, the first surface 210 includes a photosensitive region 211 and a non-photosensitive region 212, the non-photosensitive region 212 includes a wide region 213 and a narrow region 214 spaced apart along a first direction, and the photosensitive region 211 is located between the wide region 213 and the narrow region 214 along the first direction. As the name suggests, the size of the broadside region 213 in the first direction is greater than the size of the narrow side region 214 in the first direction. As an example, the package body 300 covers the wide side region 213 of the photo chip 200 and exposes the narrow side region 214 of the photo chip 200, in other words, the narrow side region 214 of the photo chip 200 does not cover the package body 300.

In some embodiments, the broadside region 213 of the photo-sensing chip 200 is electrically connected to the circuit board 100. As an example, the photosensitive chip 200 and the wiring board 100 may be electrically connected through a Wire Bump (WB) process. For example, as shown in fig. 12, the broadside region 213 of the photosensitive chip 200 is provided with a first connection structure 250 such as a pad, and the surface of the wiring board 100 is provided with a second connection structure 120 such as a pad, and the first connection structure 250 is connected to the second connection structure 120 through a wire 800. The material of the wire 800 may include, but is not limited to, at least one of gold, silver, and copper.

In the embodiment of the application, the size of the photosensitive chip 200 in the first direction can be reduced by designing the wide area 213 and the narrow area 214 in the non-photosensitive area 212 of the photosensitive chip 200 and providing the first connection structure 250 in the wide area 213, thereby reducing the overall size of the photosensitive chip 200. In addition, since the edge of the photosensitive chip 200 adjacent to the narrow-side region 214 is closer to the photosensitive region 211, the embodiment of the application can make the stress center of the photosensitive chip 200 closer to the geometric center of the photosensitive region 211 by covering the package 300 on the wide-side region 213 of the photosensitive chip 200 and exposing the narrow-side region 214 of the photosensitive chip 200, thereby effectively improving the field curvature of the camera module.

In some embodiments, the plurality of corner regions 230 of the photosensitive chip 200 includes two first corner regions 231 and two second corner regions 232, the two first corner regions 231 are disposed opposite to each other in a second direction, the first corner regions 231 are closer to the narrow-side regions 214 in a first direction than the second corner regions 232, the two second corner regions 232 are disposed opposite to each other in a second direction, the second corner regions 232 are closer to the wide-side regions 213 in the first direction than the first corner regions 231, the second portion includes at least one first corner region 231, the first direction, the second direction, and the third direction intersect each other, and the third direction is a thickness direction of the photosensitive chip 200.

Since the first corner region 231 is closer to the narrow-side region 214 of the photosensitive chip 200 than the second corner region 232 in the first direction, in other words, the first corner region 231 is closer to the photosensitive region 211 of the photosensitive chip 200 than the second corner region 232, the stress concentration of the first corner region 231 is more likely to cause damage to the non-photosensitive region 212 of the photosensitive chip 200, and even to affect the photosensitive region 211 of the photosensitive chip 200. By leaving at least one first corner region 231 of the photosensitive chip 200 uncovered by the buffer material 400, the present embodiment can reduce the risk of damage to the first corner region 231 of the photosensitive chip 200, and also reduce the risk of damage to the photosensitive region 211 due to stress concentration in the first corner region 231.

For example, the first site includes one of the first corner regions 231 and two second corner regions 232, and the second site includes the other first corner region 231, in other words, one of the first corner regions 231 and two second corner regions 232 of the photosensitive chip 200 are in contact with the buffer material 400, and the other first corner region 231 of the photosensitive chip 200 is in contact with the package body 300. The simulation shows that the stress applied to the first corner region 231 contacting the package 300 is reduced to 60%, and the total stress applied to the whole photosensitive chip 200 is also reduced. As another example, the first site includes two second corner regions 232, and the second site includes two first corner regions 231, in other words, two second corner regions 232 of the photosensitive chip 200 are in contact with the buffer material 400, and two first corner regions 231 of the photosensitive chip 200 are in contact with the package body 300. Simulation shows that the stress applied to the two first corner regions 230 and the two second corner regions 232 is reduced, and the total stress applied to the whole photosensitive chip 200 is obviously reduced. For another example, the second portion includes two first corner regions 231 and two second corner regions 232, in other words, both the two first corner regions 231 and the two second corner regions 232 of the photosensitive chip 200 are in contact with the package body 300. Simulation shows that the total stress to which the entire photosensitive chip 200 is subjected is significantly reduced in this case.

In some embodiments, as shown in fig. 17 and 18, the package body 300 includes a wide side portion 310 and a narrow side portion 320 spaced apart along the first direction, the wide side portion 310 covering the wide side region 213, the narrow side portion 320 being located on a side of the narrow side region 214 away from the wide side portion 310 along the first direction, in other words, the narrow side region 214 of the photosensitive chip 200 does not cover the package body 300. As the name suggests, the dimension of the wide edge portion 310 in the first direction is greater than the dimension of the narrow edge portion 320 in the first direction. The advantages of this arrangement are that: since the width-side region 213 of the photo-sensing chip 200 is larger in size in the first direction than the width-side region 214 thereof, the optical center of the photo-sensing chip 200 is offset from the geometric center thereof, and the optical center of the photo-sensing chip 200 is closer to the width-side region 214 thereof in the first direction. Therefore, in the present application, by covering the wide edge portion 310 of the package 300 on the wide edge area 213 of the photosensitive chip 200, and simultaneously making the narrow edge portion 320 of the package 300 far away from the narrow edge area 214 of the photosensitive chip 200, the stress applied to the wide edge area 213 of the photosensitive chip 200 and the stress applied to the narrow edge area 214 of the package 300 are symmetrical with respect to the optical center of the photosensitive chip 200 in the curing and molding process of the package 300, in other words, the stress applied to two opposite sides of the photosensitive chip 200 by the package 300 is substantially the same, so that the stress position of the photosensitive chip 200 is prevented from being shifted on one side, and the problems such as falling or deformation of the corner or edge of the photosensitive chip 200 are avoided. In addition, the narrow-side area 214 of the photosensitive chip 200 has a smaller size in the first direction, that is, has smaller strength, and in the embodiment of the application, the narrow-side portion 320 of the package 300 is located on the side of the narrow-side area 214 away from the wide-side portion 310 along the first direction, so that the narrow-side portion 320 can be prevented from stressing the narrow-side area 214 of the photosensitive chip 200, so that the narrow-side portion 320 only stresses the side wall of the photosensitive chip 200, and the risk of damaging the narrow-side area 214 of the photosensitive chip 200 can be reduced.

As an example, as shown in fig. 12, the broadside region 213 of the photosensitive chip 200 is provided with a first connection structure 250 such as a pad, the surface of the wiring board 100 is provided with a second connection structure 120 such as a pad, the first connection structure 250 is connected to the second connection structure 120 through a wire 800, and the broadside portion 310 of the package body 300 covers the first connection structure 250, the second connection structure 120, the wire 800, and the broadside region 213 of the photosensitive chip 200.

In still other embodiments, the photosensitive chip 200 includes a first surface 210 and a second surface 220 disposed opposite, the first surface 210 including a photosensitive region 211 and a non-photosensitive region 212, the non-photosensitive region 212 including an escape region surrounding the photosensitive region 211 and a peripheral region surrounding the escape region, the package 300 covering the peripheral region, the buffer material 400 contacting a first portion of a sidewall of the photosensitive chip 200, and a second portion of the sidewall of the photosensitive chip 200 including at least one corner region 230. For example, the second portion of the photo chip 200 includes all corner regions 230, in other words, all corner regions 230 of the photo chip 200 are in contact with the package body 300.

In some embodiments, the sidewalls of the photosensitive chip 200 further include connection regions 240 between adjacent corner regions 230, and the first portion includes at least a portion of the connection regions 240. For example, the buffer material 400 contacts all of the connection regions 240 of the sidewalls of the photo-sensing chip 200, and the package 300 contacts all of the corner regions 230 of the sidewalls of the photo-sensing chip 200. As another example, the buffer material 400 contacts at least one corner region 230 of the sidewalls of the photo-sensing chip 200 and all of the connection regions 240, and the package 300 contacts the remaining corner regions 230 of the sidewalls of the photo-sensing chip 200. For another example, the buffer material 400 contacts at least one corner region 230 and a portion of the connection region 240 of the sidewalls of the photo-sensing chip 200, and the package 300 contacts the remaining corner region 230 and the remaining connection region 240 of the sidewalls of the photo-sensing chip 200.

As an example, as shown in fig. 10, the non-photosensitive region 212 of the photosensitive chip 200 includes a first electrical connection region 215, and the first electrical connection region 215 is provided with a first connection structure such as a pad. Wherein the second location includes at least a portion of the connection region 240 that engages the first electrical connection region 215 and at least one corner region 230, and the first location includes a remaining portion of the connection region 240. Thus, at least a portion of the connection region 240 engaged with the first electrical connection region 215 is avoided when the buffer material 400 is coated on the sidewall of the photosensitive chip 200, so that the buffer material 400 is prevented from being coated to overflow upward too much to cover the first electrical connection region 215.

For example, as shown in fig. 12, the connection region 240 includes a first sub-region 241 and a second sub-region 242, the first sub-region 241 being joined to the first electrical connection region 215, in other words, the first sub-region 241 being adjacent to the first electrical connection region 215 and sharing the same edge. Wherein the second portion may comprise all of the first sub-region 241 and at least one corner region 230, the first portion comprising all of the second sub-region 242. In other embodiments, the second portion may also include a portion of the first sub-region 241 and at least one corner region 230, the first portion including the remaining first sub-region 241 and all of the second sub-region 242.

In some embodiments, the photosensitive chip 200 protrudes from the buffer material 400 along a third direction, which is a thickness direction of the photosensitive chip 200. As an example, a portion of the first portion of the photosensitive chip 200 is in contact with the buffer material 400, and another portion of the first portion is in contact with the package body 300. Wherein a portion of the first location is located below another portion of the first location along the third direction. This has the advantage that the buffer material 400 is prevented from being coated excessively to overflow up to the first surface 210 of the photosensitive chip 200 when the buffer material 400 is coated, so that the buffer material 400 can be prevented from covering the pads provided on the surface of the photosensitive chip 200. For example, in the case where the photo chip 200 is mounted on the surface of the circuit board 100, the surface of the photo chip 200 away from the circuit board 100, i.e., the first surface 210 is higher than the surface of the buffer material 400 away from the circuit board 100. As another example, in the case where the circuit board 100 surrounds the photosensitive chip 200, the circuit board 100 and the photosensitive chip 200 are mounted on the surface of the support plate 600, and the surface of the photosensitive chip 200 away from the support plate 600, i.e., the first surface 210, and the surface of the circuit board 100 away from the support plate 600 are higher than the surface of the buffer material 400 away from the support plate 600.

As shown in fig. 10 to 16, the embodiment of the application further provides an image capturing module, which includes an optical lens 700 and the above photosensitive assembly, where the optical lens 700 is located on the photosensitive path of the photosensitive chip 200.

It should be noted that, the image capturing module according to the embodiment of the present application may be a fixed-focus image capturing module or a moving-focus image capturing module. If the camera module is a moving focus camera module, the camera module further comprises a driving member, such as a motor, connected to the optical lens 700 for driving the optical lens 700 to move along the photosensitive path, so as to change the distance between the optical lens 700 and the photosensitive chip 200, and further adjust the focal length of the camera module.

In some embodiments, the camera module may further include an optical filter 900, where the optical filter 900 is disposed at an end of the package 300 away from the photosensitive chip 200 along the third direction and is located in the photosensitive path of the photosensitive chip 200. The incident light passes through the optical lens 700 and the optical filter 900 in sequence and then is emitted to the photosensitive region 211 of the photosensitive chip 200, and the incident light is subjected to photoelectric conversion in the photosensitive region 211 of the photosensitive chip 200 to form an image. The filter 900 may include, but is not limited to, an infrared cut filter and/or a full-spectrum filter, where the infrared cut filter may filter infrared rays in the incident light, and the full-spectrum filter may allow infrared rays in the incident light to pass through.

In addition, the embodiment of the application also provides electronic equipment, which comprises an electronic equipment body and the camera module, wherein the camera module is arranged in the electronic equipment body.

As shown in fig. 19, the embodiment of the present application further provides a method for preparing a photosensitive assembly, where the preparing method 1000 includes:

S100, providing a circuit board 100 and a photosensitive chip 200, wherein the front surface of the circuit board 100 comprises a first mounting area and a second mounting area positioned at the periphery of the first mounting area, the photosensitive chip 200 comprises a first surface 210 and a second surface 220 which are arranged in a back-to-back way, the first surface 210 comprises a photosensitive area 211 and a non-photosensitive area 212, the side wall of the photosensitive chip 200 is provided with a plurality of corner areas 230, the side wall of the photosensitive chip 200 comprises a first part and a second part, and the second part comprises at least one corner area 230;

S110, attaching the second surface 220 of the photosensitive chip 200 to the first mounting area of the circuit board 100, and electrically connecting the non-photosensitive area 212 of the photosensitive chip 200 with the circuit board 100;

S120, coating a buffer material 400 contacted with the first position on the front surface of the circuit board 100;

S130, forming a package body 300, where the package body 300 encapsulates the second mounting area, the non-photosensitive area 212 and the buffer material 400 of the circuit board 100.

Thus, the photosensitive chip 200 is mounted on the front surface of the circuit board 100, and the package 300 encapsulates the second mounting area of the circuit board 100, the non-photosensitive area 212 of the photosensitive chip 200, and the buffer material 400. Since the buffer material 400 is only in contact with the first portion of the sidewall of the photosensitive chip 200, the second portion of the sidewall of the photosensitive chip 200 is not covered with the buffer material 400, in other words, at least one corner region 230 of the photosensitive chip 200 is not covered with the buffer material 400, the stress transmission modes such as stress direction and stress magnitude between the package 300, the buffer material 400 and the circuit board 100 can be changed, and further the stress distribution around the photosensitive chip 200 can be improved, so that not only the stress concentration position of the photosensitive chip 200 can be transferred, but also the stress concentration position of the corner of the photosensitive chip 200 can be transferred from the position of the non-photosensitive region 212 adjacent to the edge thereof to other positions, and the total stress of the photosensitive chip 200 can be reduced, so that the problems of cracking, solder joint cracking and the like of the photosensitive chip 200 are not easy to occur, and the package 300 is not easy to damage.

As shown in fig. 20, the embodiment of the present application further provides another method for preparing a photosensitive assembly, where the preparing method 2000 includes:

S200, providing a support plate 600, a photosensitive chip 200 and an annular circuit board 100, wherein the front surface of the support plate 600 has a third mounting area, a gap area located at the periphery of the third mounting area, and a fourth mounting area located at the periphery of the gap area, the photosensitive chip 200 includes a first surface 210 and a second surface 220 which are disposed opposite to each other, the first surface 210 includes a photosensitive area 211 and a non-photosensitive area 212, the sidewall of the photosensitive chip 200 has a plurality of corner areas 230, the sidewall of the photosensitive chip 200 includes a first portion and a second portion, and the second portion includes at least one corner area 230;

s210, attaching the second surface 220 of the photosensitive chip 200 to the third mounting area;

s220, attaching the circuit board 100 to the fourth mounting area, and electrically connecting the circuit board 100 with the non-photosensitive area 212 of the photosensitive chip 200;

s230, coating a buffer material 400 contacted with the first position on the gap area;

S240, forming a package body 300, where the package body 300 encapsulates the circuit board 100, the non-photosensitive region 212 and the buffer material 400.

Thus, the photosensitive chip 200 and the circuit board 100 are mounted on the front surface of the support plate 600, the circuit board 100 surrounds the photosensitive chip 200, the buffer material 400 is located between the circuit board 100 and the photosensitive chip 200, and the package 300 encapsulates the circuit board 100, the non-photosensitive area 212 of the photosensitive chip 200, and the buffer material 400. Since the buffer material 400 is only in contact with the first portion of the sidewall of the photosensitive chip 200, the second portion of the sidewall of the photosensitive chip 200 is not covered with the buffer material 400, in other words, at least one corner region 230 of the photosensitive chip 200 is not covered with the buffer material 400, the stress transmission modes such as stress direction and stress magnitude between the package 300, the buffer material 400 and the circuit board 100 can be changed, and further the stress distribution around the photosensitive chip 200 can be improved, so that not only the stress concentration position of the photosensitive chip 200 can be transferred, but also the stress concentration position of the corner of the photosensitive chip 200 can be transferred from the position of the non-photosensitive region 212 adjacent to the edge thereof to other positions, and the total stress of the photosensitive chip 200 can be reduced, so that the problems of cracking, solder joint cracking and the like of the photosensitive chip 200 are not easy to occur, and the package 300 is not easy to damage.

As shown in fig. 21, the embodiment of the present application further provides a method for preparing a photosensitive assembly, where the preparing method 3000 includes:

S300, providing an annular circuit board 100 and a photosensitive chip 200, wherein the photosensitive chip 200 comprises a first surface 210 and a second surface 220 which are arranged in a back-to-back way, the first surface 210 comprises a photosensitive area 211 and a non-photosensitive area 212, the side wall of the photosensitive chip 200 is provided with a plurality of corner areas 230, the side wall of the photosensitive chip 200 comprises a first part and a second part, and the second part comprises at least one corner area 230;

s310, inserting the photosensitive chip 200 into a central hole of the circuit board 100, wherein a gap is reserved between the circuit board 100 and the photosensitive chip 200;

S320, coating a buffer material 400 in contact with the first position in the gap;

S330, forming a package body 300, wherein the package body 300 covers the circuit board 100, the non-photosensitive area 212 and the buffer material 400.

Thus, the circuit board 100 surrounds the photosensitive chip 200, the buffer material 400 is located between the circuit board 100 and the photosensitive chip 200, and the package 300 encapsulates the circuit board 100, the non-photosensitive region 212 of the photosensitive chip 200, and the buffer material 400. Since the buffer material 400 is only in contact with the first portion of the sidewall of the photosensitive chip 200, the second portion of the sidewall of the photosensitive chip 200 is not covered with the buffer material 400, in other words, at least one corner region 230 of the photosensitive chip 200 is not covered with the buffer material 400, the stress transmission modes such as stress direction and stress magnitude between the package 300, the buffer material 400 and the circuit board 100 can be changed, and further the stress distribution around the photosensitive chip 200 can be improved, so that not only the stress concentration position of the photosensitive chip 200 can be transferred, but also the stress concentration position of the corner of the photosensitive chip 200 can be transferred from the position of the non-photosensitive region 212 adjacent to the edge thereof to other positions, and the total stress of the photosensitive chip 200 can be reduced, so that the problems of cracking, solder joint cracking and the like of the photosensitive chip 200 are not easy to occur, and the package 300 is not easy to damage.

In some embodiments, the package body 300 may be formed in such a manner that step S130, step S240, or step S330 may include: providing a mold, wherein a cavity for injecting molding liquid is formed in the mold; the mold is pressed to an assembly at least comprising the circuit board 100 and the photosensitive chip 200, and the second part is positioned outside the cavity. After the molding liquid is cured to form the package 300, the cavity 500 is formed on the outer side of the photosensitive chip 200, and the second portion of the sidewall of the photosensitive chip 200 is exposed to the cavity 500. In this case, the second portion of the photosensitive chip 200 is not in contact with the buffer material 400 nor the package 300. In the case that the photosensitive chip 200 is mounted on the surface of the circuit board 100, the cavity 500 is formed between the second portion of the photosensitive chip 200 and the package 300; in the case that the circuit board 100 surrounds the photosensitive chip 200, the cavity 500 is formed between the second portion of the photosensitive chip 200 and the circuit board 100. The cavity 500 may isolate at least one corner region 230 of the photo-sensing chip 200 from the circuit board 100 or the package 300, thereby cutting off the stress source of the corner region 230 and avoiding the problem of stress concentration in the corner region 230.

In still other embodiments, the package body 300 may be formed in such a manner that step S130, step S240, or step S330 may include: providing a mold, wherein a cavity for injecting molding liquid is formed in the mold; the mold is pressed to an assembly at least comprising the circuit board 100 and the photosensitive chip 200, and the second part is located inside the cavity. Thus, after the molding liquid is cured to form the package body 300, the package body 300 is in contact with the second portion of the sidewall of the photosensitive chip 200, in other words, the package body 300 is in contact with at least one corner region 230 of the photosensitive chip 200. Since the package 300 is in contact with at least one corner region 230 of the photo-sensing chip 200 in the embodiment of the application, at the corner of the photo-sensing chip 200 corresponding to the corner region 230, the package 300 is in contact with not only the portion of the non-photo-sensing region 212 adjacent to the corner region 230 but also the corner region 230, in other words, the material in contact with the corner of the photo-sensing chip 200 is the same material, so that stress transmission is continuous at the corner, and thus the stress concentration portion at the corner of the photo-sensing chip 200 is transferred from the position of the non-photo-sensing region 212 adjacent to the edge thereof to the bottom of the sidewall of the photo-sensing chip 200, and the bottom of the sidewall of the photo-sensing chip 200 is typically a silicon material with a higher degree of stress resistance. It can be seen that the embodiment of the present application can reduce the risk of damage to the photosensitive chip 200, and can also reduce the total stress to which the photosensitive chip 200 is subjected.

It should be noted that, in the case where the circuit board 100 is located on the side of the second surface 220 of the photosensitive chip 200 away from the first surface 210 thereof and in the case where the circuit board 100 is located at the periphery of the photosensitive chip 200, the mold is pressed onto the assembly formed by the circuit board 100 and the photosensitive chip 200; in the case where the photosensitive chip 200 and the circuit board 100 are disposed on the support plate 600 and the circuit board 100 surrounds the photosensitive chip 200, the mold is pressed onto the assembly formed by the support plate 600, the circuit board 100 and the photosensitive chip 200.

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps recited in the present disclosure may be performed in parallel or sequentially or in a different order, provided that the desired results of the technical solutions of the present disclosure are achieved, and are not limited herein.

The above detailed description should not be taken as limiting the scope of the present disclosure. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.

Claims (23)

1.A photosensitive assembly, comprising:

the side wall of the photosensitive chip comprises a plurality of corner areas, the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back mode, and the first surface comprises a photosensitive area and a non-photosensitive area;

the circuit board is electrically connected with the non-photosensitive area of the photosensitive chip;

the packaging body is used for coating the circuit board and the non-photosensitive area of the photosensitive chip;

The buffer material is arranged among the packaging body, the photosensitive chip and the circuit board, the elastic modulus of the buffer material is smaller than that of the circuit board, that of the photosensitive chip and that of the packaging body, the buffer material is in partial contact with the side wall of the photosensitive chip, the surface of the side wall of the photosensitive chip, which is in contact with the buffer material, is a first part, the rest part is a second part, and the second part comprises at least one corner area.

2. The photosensitive assembly of claim 1, wherein an outside of the photosensitive chip has a cavity, and the second portion is exposed to the cavity.

3. The photosensitive assembly of claim 1, wherein the second location is in contact with the encapsulant.

4. A photosensitive assembly according to claim 3, wherein said non-photosensitive region comprises a broadside region and a narrow side region spaced apart along a first direction, a plurality of said corner regions comprising two first corner regions adjacent said narrow side region and two second corner regions adjacent said broadside region, said first corner regions being oppositely disposed along a second direction, said second corner regions being oppositely disposed along said second direction, said second location comprising at least one of said first corner regions, said first direction, said second direction intersecting said thickness direction of said photosensitive chip.

5. The photosensitive assembly of claim 4, wherein said first location comprises two of said second corner regions.

6. The photosensitive assembly of claim 4, wherein the broadside region is electrically connected to the wiring board, and the encapsulant covers the broadside region and exposes the narrow side region.

7. The photosensitive assembly of claim 6, wherein the package includes a broadside portion and a narrow side portion spaced apart along the first direction, the broadside portion overlying the broadside region, the narrow side portion being located on a side of the narrow side region away from the broadside portion along the first direction.

8. The photosensitive assembly of claim 1, wherein the sidewall of the photosensitive chip further comprises a connection region between adjacent corner regions, the first location comprising at least a portion of the connection region.

9. The photosensitive assembly of claim 8, wherein the photosensitive chip protrudes from the buffer material in a thickness direction of the photosensitive chip.

10. The photosensitive assembly of claim 8, wherein the non-photosensitive region comprises a first electrical connection region, the second location further comprises at least a portion of the connection region engaged with the first electrical connection region, the first location comprises a remaining portion of the connection region.

11. The photosensitive assembly of claim 1, wherein the corner region comprises:

a first region extending in a first direction; and

And the second area extends in the second direction and is intersected with the first area, and the first direction, the second direction and the thickness direction of the photosensitive chip are intersected in pairs.

12. The photosensitive assembly of claim 11, wherein a dimension of the first region along the first direction and/or a dimension of the second region along the second direction is 0.4 mm-1 mm.

13. The photosensitive assembly of claim 11, wherein a dimension of the first region along the first direction is the same as a dimension of the second region along the second direction.

14. The photosensitive assembly according to any one of claims 1 to 10, wherein the wiring board is located on a side of the second surface remote from the first surface.

15. The photosensitive assembly according to any one of claims 1 to 10, wherein the wiring board surrounds the photosensitive chip.

16. The photosensitive assembly according to any one of claims 1 to 10, further comprising a support plate located on a side of the second surface remote from the first surface, the circuit board being provided on the support plate and surrounding the photosensitive chip.

17. A camera module, comprising:

an optical lens; and

A photosensitive assembly according to any one of claims 1 to 16, said optical lens being located in a photosensitive path of a photosensitive chip of said photosensitive assembly.

18. An electronic device, comprising:

An electronic device body; and

The camera module of claim 17, wherein the camera module is disposed within the electronic device body.

19. A method of manufacturing a photosensitive assembly, comprising:

Providing a circuit board and a photosensitive chip, wherein the front surface of the circuit board comprises a first mounting area and a second mounting area positioned at the periphery of the first mounting area, the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back mode, the first surface comprises a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip is provided with a plurality of corner areas, the side wall of the photosensitive chip comprises a first part and a second part, and the second part comprises at least one corner area;

mounting the second surface of the photosensitive chip on a first mounting area of the circuit board, and electrically connecting a non-photosensitive area of the photosensitive chip with the circuit board;

coating a buffer material contacted with the first part on the front surface of the circuit board; and

And forming a packaging body, wherein the packaging body coats the second mounting area, the non-photosensitive area and the buffer material of the circuit board.

20. A method of manufacturing a photosensitive assembly, comprising:

Providing a supporting plate, a photosensitive chip and an annular circuit board, wherein the front surface of the supporting plate is provided with a third installation area, a gap area positioned at the periphery of the third installation area and a fourth installation area positioned at the periphery of the gap area, the photosensitive chip comprises a first surface and a second surface which are arranged back to back, the first surface comprises a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip is provided with a plurality of corner areas, the side wall of the photosensitive chip comprises a first part and a second part, and the second part comprises at least one corner area;

attaching the second surface of the photosensitive chip to the third mounting area;

attaching the circuit board to the fourth mounting area, and electrically connecting the circuit board with a non-photosensitive area of the photosensitive chip;

Coating a buffer material in contact with the first portion in the gap region; and

And forming a packaging body, wherein the packaging body coats the circuit board, the non-photosensitive area and the buffer material.

21. A method of manufacturing a photosensitive assembly, comprising:

Providing an annular circuit board and a photosensitive chip, wherein the photosensitive chip comprises a first surface and a second surface which are arranged in a back-to-back manner, the first surface comprises a photosensitive area and a non-photosensitive area, the side wall of the photosensitive chip is provided with a plurality of corner areas, the side wall of the photosensitive chip comprises a first part and a second part, and the second part comprises at least one corner area;

the photosensitive chip is inserted into a central hole of the circuit board, and a gap is reserved between the circuit board and the photosensitive chip;

coating a buffer material in contact with the first portion within the gap; and

And forming a packaging body, wherein the packaging body coats the circuit board, the non-photosensitive area and the buffer material.

22. The method of any one of claims 19 to 21, wherein forming the package comprises:

Providing a mold, wherein a cavity for injecting molding liquid is formed in the mold; and

And pressing the die on an assembly at least comprising the circuit board and the photosensitive chip, wherein the second part is positioned outside the cavity.

23. The method of any one of claims 19 to 21, wherein forming the package comprises:

Providing a mold, wherein a cavity for injecting molding liquid is formed in the mold; and

And pressing the die on an assembly at least comprising the circuit board and the photosensitive chip, wherein the second part is positioned in the cavity.