CN118441230A - Inhibition C5F10Method for interaction between O and metal interface and application - Google Patents
Inhibition C5F10Method for interaction between O and metal interface and application Download PDFInfo
- Publication number
- CN118441230A CN118441230A CN202410907003.7A CN202410907003A CN118441230A CN 118441230 A CN118441230 A CN 118441230A CN 202410907003 A CN202410907003 A CN 202410907003A CN 118441230 A CN118441230 A CN 118441230A
- Authority
- CN
- China
- Prior art keywords
- copper material
- copper
- metal
- gas
- sodium citrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 51
- 239000002184 metal Substances 0.000 title claims abstract description 51
- 230000003993 interaction Effects 0.000 title claims abstract description 31
- 230000005764 inhibitory process Effects 0.000 title description 4
- 239000010949 copper Substances 0.000 claims abstract description 207
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 169
- 229910052802 copper Inorganic materials 0.000 claims abstract description 162
- 239000000463 material Substances 0.000 claims abstract description 96
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000008139 complexing agent Substances 0.000 claims abstract description 31
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 27
- 239000011259 mixed solution Substances 0.000 claims abstract description 25
- 238000004381 surface treatment Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000008367 deionised water Substances 0.000 claims abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 8
- 238000005406 washing Methods 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims abstract description 4
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 55
- 239000001509 sodium citrate Substances 0.000 claims description 55
- 239000000243 solution Substances 0.000 claims description 52
- 239000013078 crystal Substances 0.000 claims description 29
- 239000007769 metal material Substances 0.000 claims description 18
- 239000004280 Sodium formate Substances 0.000 claims description 8
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 claims description 8
- 235000019254 sodium formate Nutrition 0.000 claims description 8
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 claims description 8
- 229940039790 sodium oxalate Drugs 0.000 claims description 8
- 238000010292 electrical insulation Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 abstract description 30
- 238000000354 decomposition reaction Methods 0.000 abstract description 27
- 230000000694 effects Effects 0.000 abstract description 24
- 230000007797 corrosion Effects 0.000 abstract description 17
- 238000005260 corrosion Methods 0.000 abstract description 17
- 230000003647 oxidation Effects 0.000 abstract description 15
- 238000007254 oxidation reaction Methods 0.000 abstract description 15
- 230000008021 deposition Effects 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 9
- 239000007789 gas Substances 0.000 description 56
- 238000002474 experimental method Methods 0.000 description 30
- 238000006243 chemical reaction Methods 0.000 description 24
- 238000012360 testing method Methods 0.000 description 10
- 238000012876 topography Methods 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 8
- 239000004519 grease Substances 0.000 description 8
- 238000002441 X-ray diffraction Methods 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 5
- 241000894007 species Species 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001000 micrograph Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010301 surface-oxidation reaction Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000002932 luster Substances 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000013049 sediment Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000008364 bulk solution Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- -1 citrate ions Chemical class 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
The invention discloses a method for inhibiting interaction between C 5F10 O and a metal interface and application thereof, belonging to the technical field of high voltage and insulation. The method comprises the following steps of treating the surface of a metal copper material: immersing the cleaned metallic copper material in a mixed solution of a complexing agent and N, N-dimethylformamide, isolating air, performing solvothermal treatment, cooling to room temperature, taking out the metallic copper material, washing with deionized water, and drying to obtain the solvothermal treated metallic copper material. The method is applied to the surface treatment of the metal of the electric insulation equipment by taking the insulating gas C 5F10 O as a medium. The method of the invention enables the lattice reconstruction to occur on the surface of the metal copper material, inhibits the gas-solid interface interaction of the metal copper material and the environment-friendly insulating gas C 5F10 O, improves the oxidation resistance and corrosion resistance of the surface of the metal copper material, and achieves the effects of inhibiting gas decomposition and solid deposition.
Description
Technical Field
The invention belongs to the technical field of high voltage and insulation, and particularly relates to a method for inhibiting interaction between C 5F10 O and a metal interface and application thereof.
Background
In the technical field of high voltage and insulation, in closed switch equipment, power transmission pipelines and transformers, electrical equipment is mostly made of metal materials, and an insulating medium is usually required to be added. In the prior art, sulfur hexafluoride (SF 6) is widely used as an insulating medium for high voltage switchgear, which has excellent insulating and arc extinguishing characteristics, but SF 6 is a strong greenhouse gas having a global warming potential index (GWP) of 23900 times that of carbon dioxide and an atmospheric lifetime of about 3200 years. The large amount of SF 6 brings great potential threat to the problem of greenhouse effect, and limits the use of SF 6 in power switching equipment, so that researchers are prompted to continuously search for alternative gases.
In recent years, gas-insulated metal-enclosed switchgear, gas-insulated power transmission pipelines, gas-insulated transformers and other gas-insulated electrical equipment using environment-friendly insulating gas C 5F10 O as an insulating medium have begun to be put into production in a step-by-step manner. However, the GIE device inevitably generates electrical and thermal faults during long-term operation, induces Partial Discharge (PD) and Partial Overheating (POT) in the device, and causes the internal temperature rise of the device due to the current thermal effect to make the long-term working temperature of the metal bus of the device about 90-120 ℃, and the partial region temperature under the fault condition reach 200-300 ℃, which all causes decomposition of C 5F10O/CO2 to generate various small molecular products, so that the consumption of main insulating gas is caused, and the insulation and arc extinguishing performances are reduced. Although the C 5F10 O gas has excellent environmental protection and insulation properties, it is also necessary to evaluate the C 5F10 O in terms of engineering application reliability, including gas-solid material interface stability, electrothermal stability, arc extinguishing performance, decomposition characteristics, biosafety, and the like. The ideal insulating medium should be such that the electrical equipment remains stable under complex operating conditions and even under fault conditions without substantial decomposition. However, in engineering application of practical electrical equipment, the compatibility of C 5F10 O and metallic copper is not as good as that of metallic silver and aluminum, after C 5F10 O contacts with the surface of metallic copper, gas phase decomposition and solid matter deposition can occur due to the interaction between insulating gas C 5F10 O and metallic copper interface caused by partial discharge and partial overheat fault, and the gas phase decomposition and solid matter deposition can reduce the insulating capability of equipment and even cause safety accidents. Therefore, the gas-solid stability of C 5F10 O and copper electrode materials needs to be improved. Therefore, a method for treating the metal surface of the electrical insulation equipment to inhibit the interaction of the environment-friendly insulation gas C 5F10 O and the copper-containing metal interface from generating gas phase decomposition and solid matter deposition is sought, and the method is of great significance in electrical equipment and engineering practice.
Disclosure of Invention
In order to improve the gas-solid stability of the environment-friendly insulating gas C 5F10 O and the copper material and inhibit solid precipitation on the surface of the copper material, one of the purposes of the invention is to provide a method for inhibiting the interaction of the insulating gas C 5F10 O and a metal interface from generating gas phase decomposition and solid precipitation.
It is a further object of the present invention to provide the use of the above method for surface treatment of metallic materials in electrical insulation equipment with C 5F10 O as medium. The application can help to expand the industrial application of copper and the application field of environment-friendly insulating gas C 5F10 O.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: a method of inhibiting C 5F10 O interaction with a metal interface, the method comprising treating a surface of a metallic copper material, the treating of the surface of the metallic copper material comprising the steps of: immersing the cleaned metallic copper material in a mixed solution of a complexing agent and N, N-Dimethylformamide (DMF), isolating air, performing solvothermal treatment, cooling to room temperature, taking out the metallic copper material, washing with deionized water, and drying to obtain the solvothermal treated metallic copper material.
Further, the complexing agent is selected from a sodium citrate solution, a sodium oxalate solution or a sodium formate solution.
Further, the complexing agent is sodium citrate solution.
Further, the complexing agent is sodium citrate solution with the concentration of 5-10 mmol/L.
Furthermore, in the mixed solution of the complexing agent and the N, N-dimethylformamide, the sodium citrate solution is N, N-dimethylformamide= (1-3) 1 according to the volume ratio.
Further, the solvothermal treatment is to keep 20-24 h at 190-210 ℃.
Further, the temperature rising rate is 5-7 ℃/min.
Further, the resulting solvothermal treated metallic copper material has a crystal lattice of predominantly Cu (111).
The method provided by the invention is applied to the surface treatment of the metal material in the electric insulation equipment taking the insulating gas C 5F10 O as a medium.
Compared with the prior art, the invention at least comprises the following beneficial effects:
According to the method for inhibiting interaction between C 5F10 O and the metal interface, the mixed solution of the complexing agent and DMF is adopted to carry out solvothermal treatment on the surface of the metal copper material, so that lattice reconstruction is carried out on the surface of the metal copper material, the interaction between the metal copper material and the gas-solid interface of the environment-friendly insulating gas C 5F10 O is inhibited, the oxidation resistance and corrosion resistance of the surface of the metal copper material are improved, and the effects of inhibiting gas decomposition and solid deposition are achieved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the embodiments of the present invention, and other drawings may be obtained according to these drawings for those skilled in the art.
FIG. 1 is a graph of the macroscopic topography of the effect of complexing agent species on the surface treatment of a metallic material in example 1 of the present invention.
FIG. 2 is a scanning electron microscope image of the effect of complexing agent species on the surface treatment of a metallic material in example 1 of the present invention.
FIG. 3 is a graph of the macroscopic morphology of the effect of complexing agent concentration on the surface treatment of a metallic material in example 2 of the present invention.
FIG. 4 is a graph showing the macroscopic morphology of the effect of the mixture ratio of the mixed solution on the surface treatment of the metal material in example 3 of the present invention.
FIG. 5a is an X-ray diffraction spectrum of Cu-S in example 4 of the present invention;
FIG. 5b is an X-ray diffraction spectrum of Cu in example 4 of the present invention;
the three diffraction peaks correspond to the Cu (111), cu (100) and Cu (110) crystal planes, respectively, indicating that the treated copper is still pure copper. When untreated, the main crystal plane is a Cu (100) crystal plane, lattice reconstruction occurs after treatment, the main crystal plane becomes a Cu (111) crystal plane, and the surface energy of the Cu (111) crystal plane is minimum and most stable.
FIG. 6 is a diagram showing the copper plate electrode according to example 4 of the present invention;
Wherein the plate electrode is made of red copper material; (1) Copper material (Cu) which is not subjected to solvothermal treatment and is not subjected to discharge experiment; (2) Copper material (Cu) which is not subjected to solvothermal treatment and is subjected to an overdischarge experiment; (3) Copper material (Cu-S) which is subjected to solvothermal treatment and is not subjected to discharge experiment; (4) Is copper material (Cu-S) subjected to solvothermal treatment and an overdischarge experiment.
FIG. 7 is a graph showing the surface topography of the solvothermal treated copper material and the non-solvothermal treated copper material of example 4 according to the invention as measured by a scanning electron microscope;
Wherein, (1) is copper material (Cu) which is not subjected to solvothermal treatment and is not subjected to discharge experiment; (2) Copper material (Cu) which is not subjected to solvothermal treatment and is subjected to an overdischarge experiment; (3) Copper material (Cu-S) which is subjected to solvothermal treatment and is not subjected to discharge experiment; (4) Is copper material (Cu-S) subjected to solvothermal treatment and an overdischarge experiment.
FIG. 8 is a graph showing the concentration change of a partial gas decomposition product after 48h partial discharge in a discharge experiment table (the discharge experiment insulating gas medium is a mixed gas of C 5F10 O and CO 2);
wherein, (1) is a CF 4 decomposition product; (2) Is a C 2F6 decomposition product; (3) Is C 3F8 decomposition product.
Fig. 9 is a diagram showing the elemental composition of the solid deposit (electrode center solid deposit) after 48h partial discharge in the discharge test platform (the discharge test insulating gas medium is a mixed gas of C 5F10 O and CO 2) according to example 4 of the present invention.
Detailed Description
In order to better understand the above technical solutions, the following detailed description of the technical solutions of the embodiments of the present application is made by using the accompanying drawings and the specific embodiments, and it should be understood that the specific features of the embodiments of the present application are detailed descriptions of the technical solutions of the embodiments of the present application, and not limit the technical solutions of the present application, and the technical features of the embodiments of the present application may be combined with each other without conflict.
According to the invention, X-ray diffraction spectrum detection is carried out on metallic copper (Cu) and metallic copper (Cu-S) subjected to solvothermal treatment by a mixed solution of sodium citrate and DMF, so that the treated copper is still pure copper. When not treated, the main crystal face is a Cu (100) crystal face, lattice reconstruction occurs after treatment, the main crystal face becomes a Cu (111) crystal face, and the surface energy of the Cu (111) crystal face is minimum and most stable, so that the crystal has good oxidation and corrosion resistance.
According to the invention, the surface of Cu-S still has metallic luster of metallic copper from a macroscopic level, and no trace of oxidation and corrosion by the mixed solution is generated.
According to the invention, in the mixed solution of sodium citrate and DMF, citrate and Cu 2+ are complexed, so that the generation of CuO and Cu 2 O is inhibited, meanwhile, the mixed solution of sodium citrate and DMF has a promoting effect on the reconstruction of crystal lattices, on the premise of ensuring that the electric conductivity and the heat conductivity of copper are not influenced, the surface oxidation resistance and the corrosion resistance of copper materials are improved, the gas-solid interface interaction between the surface of copper materials and environment-friendly insulating gas C 5F10 O is inhibited, and the effects of inhibiting gas decomposition and solid deposition are achieved.
In a first aspect of an embodiment of the present invention, there is provided a method for inhibiting interaction between C 5F10 O and a metal interface, the method including a treatment of a surface of a metallic copper material, including the steps of: immersing the cleaned metallic copper material in a mixed solution of a complexing agent and N, N-Dimethylformamide (DMF), isolating air, performing solvothermal treatment, cooling to room temperature, taking out the metallic copper material, washing with deionized water, and drying to obtain the solvothermal treated metallic copper material.
According to the method for inhibiting interaction between C 5F10 O and the metal interface, the mixed solution of the complexing agent and DMF is adopted to carry out solvothermal treatment on the surface of the metal copper material, so that lattice reconstruction is carried out on the surface of the metal copper material, the interaction between the metal copper material and the gas-solid interface of the environment-friendly insulating gas C 5F10 O is inhibited, the oxidation resistance and corrosion resistance of the surface of the metal copper material are improved, and the effects of inhibiting gas decomposition and solid deposition are achieved.
In some possible embodiments, the complexing agent is selected from the group consisting of sodium citrate solution, sodium oxalate solution, or sodium formate solution.
Sodium citrate is the most economical compared with sodium citrate, and the citrate ion has the least damage to the crystal lattice on the surface of metallic copper in the solution, so that the required crystal face structure is more easily and stably generated. Complexing agents act to complex with Cu 2+ in solution, thereby inhibiting the production of CuO and Cu 2 O.
Further, the complexing agent is preferably a sodium citrate solution.
Too high concentration of sodium citrate solution can lead to too low pH value of the solution, so that the solution is too strong in acidity, and can promote the surface corrosion oxidation of copper during heat treatment, while too low concentration of sodium citrate, insufficient citrate ions in the solution, insufficient complexing with Cu 2+ and poor oxidation and corrosion resistance effects.
Still further, the complexing agent is preferably sodium citrate solution having a concentration of 5 to 10 mmol/L.
Specifically, the mixed solution of sodium citrate and DMF is adopted to treat metallic copper, citrate and Cu 2+ are complexed, so that the generation of CuO and Cu 2 O is inhibited, meanwhile, the mixed solution of sodium citrate and DMF has a promoting effect on the reconstruction of crystal lattices, on the premise of ensuring that the electric conductivity and the heat conductivity of copper are not influenced, the surface oxidation resistance and the corrosion resistance of copper materials are improved, the gas-solid interface interaction between the surface of copper materials and environment-friendly insulating gas C 5F10 O is inhibited, and the effect of inhibiting gas decomposition and solid deposition is achieved.
N, N-Dimethylformamide (DMF) is a good solvent for a wide range of applications. Can be mixed with water and most organic solvents at will, has good dissolving capacity for various organic compounds and inorganic compounds, but has stronger biotoxicity at the same time, and excessive addition is easy to vaporize and spread in heat treatment, thus causing unnecessary potential safety hazard.
In some possible embodiments, the complexing agent and N, N-dimethylformamide are mixed in a volume ratio of sodium citrate solution to N, N-dimethylformamide= (1-3): 1.
Still further, sodium citrate solution is preferred, N-dimethylformamide=2:1.
In some possible embodiments, the solvothermal treatment is maintained at a temperature of from 190 to 210 ℃ from 20 to 24 h.
Temperatures exceeding 260 ℃ near the boiling point of the bulk solution can lead to vaporization of the solution, which in a closed reaction vessel can lead to excessive gas pressures and even possible explosion hazards. The heating time is not too long, the danger of explosion can be generated due to too long heating time, the treatment time is insufficient due to too short heating time, and the protection effect on oxidation and corrosion is insufficient.
In some possible embodiments, the rate of temperature increase is 5 to 7 ℃/min. Can ensure that the temperature can be stably increased to 200 ℃ at 5-7 ℃/min, and can ensure that the heating is uniform.
In some possible embodiments, the solvothermal treated metallic copper material has a crystal lattice that is predominantly Cu (111). In the previous research, the compatibility of the mixed gas of metallic copper and the environment-friendly insulating gas C 5F10 O and the decomposition products thereof is inferior to that of metallic silver and metallic aluminum materials, so the invention focuses on the treatment of metallic copper materials.
Specifically, citrate is used as a reducing agent and a complexing agent solvent, and X-ray diffraction spectrum detection is carried out on metallic copper (Cu) and metallic copper (Cu-S) subjected to solvothermal treatment by a sodium citrate and DMF mixed solution, so that the treated copper is still pure copper. When the material is not treated, the main crystal face is a Cu (100) crystal face, lattice reconstruction occurs after treatment, the main crystal face becomes a Cu (111) crystal face, the surface energy of the Cu (111) crystal face is minimum and most stable, and the material has good oxidation and corrosion resistance, so that the interaction between the environment-friendly insulating gas C 5F10 O and a gas-solid interface of copper is inhibited. The surface of Cu-S still has metallic luster of metallic copper from a macroscopic level, and has no trace of oxidation and corrosion by the mixed solution.
In a second aspect of the embodiment of the present invention, there is provided an application of the above method in surface treatment of a metal material in an electrical insulation device using an insulation gas C 5F10 O as a medium.
It can be understood that the method for inhibiting the interaction between C 5F10 O and the metal interface can be used in gas-insulated metal-enclosed switchgear (GIE) equipment such as gas-insulated power transmission pipelines, gas-insulated transformers and the like which take insulating gas C 5F10 O as a medium and have copper as a metal material. The mixed solution of sodium citrate and DMF is utilized to reconstruct the surface lattice of the copper material, and on the premise of ensuring that the electrical conductivity and the thermal conductivity of copper are not influenced, the purposes of improving the gas-solid stability of the environment-friendly insulating gas C 5F10 O and the copper material, inhibiting the interaction of the environment-friendly insulating gas C 5F10 O and a copper-containing metal interface from generating gas phase decomposition and solid deposition are achieved, the surface oxidation resistance and corrosion resistance of the copper material are improved, and the industrial application of copper and the application scene of the environment-friendly insulating gas C 5F10 O are enlarged.
Example 1
Influence of complexing agent species on the surface treatment of metallic materials
The method (one) is as follows:
1. Cleaning:
and (3) taking a metal copper sheet (6 cm multiplied by 2 cm multiplied by 1 mm), and cleaning the copper sheet by using absolute ethyl alcohol to remove dust and grease on the surface of the copper sheet. After the absolute ethyl alcohol on the surface of the copper sheet is volatilized, the dust-free rubber glove is worn in the whole process, the interference of hand dust and grease on the test is prevented, and the copper material which is not subjected to solvothermal treatment is obtained and marked as Cu.
2. And (3) solvothermal treatment:
The cleaned metal copper sheet, a sodium citrate solution with the concentration of 20mL being 7.3mmol/L, a sodium formate solution with the concentration of 2.8 mmol/L and a sodium oxalate solution with the concentration of 3.5 mmol/L are respectively put into a 50mL reaction kettle, and then 10mL DMF is dripped into the reaction kettle, and the reaction kettle is sealed to prevent air from entering. The reaction vessel was then placed in a vacuum oven and warmed to 200 c at a ramp rate of 6 c/min and maintained at 24 h c at 200 c. After the reaction is finished, the reaction kettle is naturally cooled to room temperature, the metal copper sheet is taken out, a complexing agent and DMF residual liquid floating on the surface are washed by a syringe filled with deionized water, and then the mixture is lightly blow-dried by cold air, so that the metal copper material which adopts different complexing agents to be subjected to solvothermal treatment is obtained, and the mark is Cu-S.
(II) results of experiments
FIG. 1 is a graph of the macroscopic topography of the effect of complexing agent species on the surface treatment of a metallic material. FIG. 2 is a scanning electron microscope image of the effect of complexing agent species on the surface treatment of a metallic material.
The surface topography of the copper sheet material treated by the three different complexing agents is shown in the figures 1 and 2, and the macro topography of the figure 1 shows that the surface of the copper sheet material treated by 7.3mmol/L sodium citrate and 2.8 mmol/L sodium formate is smooth and flat, and the copper sheet treated by 3.5 mmol/L sodium oxalate is slightly oxidized (reddish). As can be seen from a scanning electron microscope image (a micro-morphology image) of FIG. 2, the surface of the copper sheet material treated by 7.3mmol/L sodium citrate is flat, while the surface of the copper sheet material treated by 2.8 mmol/L sodium formate has a small amount of ravines, and the surface of the copper sheet treated by 3.5 mmol/L sodium oxalate has oxide bulges, and the copper sheet material appears as white spots under an electron microscope.
Through macroscopic observation and microscopic characterization, the sodium citrate solution has similar treatment effect with the sodium formate solution, the sodium oxalate solution has poorer treatment effect (the surface is rougher and is uneven under an electron microscope image), and because the sodium formate and the sodium oxalate have certain toxicity, the potential safety hazard is larger when the solution is prepared, and meanwhile, in view of low price, safety and innocuity of the sodium citrate, the complexing agent is preferably sodium citrate.
Example 2
Influence of complexing agent concentration on surface treatment of metallic materials
The method (one) is as follows:
1. Cleaning:
and (3) taking a metal copper sheet (6 cm multiplied by 2 cm multiplied by 1 mm), and cleaning the copper sheet by using absolute ethyl alcohol to remove dust and grease on the surface of the copper sheet. After the absolute ethyl alcohol on the surface of the copper sheet is volatilized, the dust-free rubber glove is worn in the whole process, the interference of hand dust and grease on the test is prevented, and the copper material which is not subjected to solvothermal treatment is obtained and marked as Cu.
2. And (3) solvothermal treatment:
The cleaned metal copper sheet and sodium citrate solution with the concentration of 20mL mmol/L, 3mmol/L, 5mmol/L, 7.3mmol/L, 10mmol/L and 12mmol/L are respectively put into a reaction kettle of 50 mL, then 10 mL DMF is dripped into the reaction kettle, and the reaction kettle is sealed to prevent air from entering. The reaction vessel was then placed in a vacuum oven and warmed to 200 c at a ramp rate of 6 c/min and maintained at 24h c at 200 c. After the reaction is finished, the reaction kettle is naturally cooled to room temperature, the metal copper sheet is taken out, a syringe filled with deionized water is used for washing sodium citrate and DMF residual liquid floating on the surface, and then the mixture is lightly blow-dried by cold air, so that the metal copper material subjected to solvothermal treatment with different sodium citrate concentrations is obtained, and the mark is Cu-S.
(II) results of experiments
FIG. 3 is a graph of the macroscopic topography of the effect of sodium citrate concentration on the surface treatment of metallic materials.
FIG. 3 shows surface morphology graphs of copper sheet materials treated by sodium citrate solution at five different concentrations, and the macroscopic morphology graphs of FIG. 3 show that the surface of the copper sheet materials treated by sodium citrate solution at 3mmol/L is darker, the surface of the copper sheet materials treated by sodium citrate solution at 5mmol/L, 7.3mmol/L and 10mmol/L is smooth and flat, and no oxidation trace exists, wherein the copper sheet materials treated by sodium citrate solution at 7.3mmol/L are the most bright and clean. And a small amount of oxidation traces (red at the edge) are also present on the surface of the copper sheet after 12mmol/L treatment. Therefore, in the present invention, the concentration of sodium citrate is preferably 5 to 10mmol/L, more preferably 7.3 mmol/L.
Example 3
Influence of the proportion of the Mixed solution on the surface treatment of the metallic material
The method (one) is as follows:
1. Cleaning:
and (3) taking a metal copper sheet (6 cm multiplied by 2 cm multiplied by 1 mm), and cleaning the copper sheet by using absolute ethyl alcohol to remove dust and grease on the surface of the copper sheet. After the absolute ethyl alcohol on the surface of the copper sheet is volatilized, the dust-free rubber glove is worn in the whole process, the interference of hand dust and grease on the test is prevented, and the copper material which is not subjected to solvothermal treatment is obtained and marked as Cu.
2. And (3) solvothermal treatment:
The cleaned metal copper sheet and sodium citrate solution with the volumes of 5mL, 10mL, 20mL, 30mL and 40mL and the concentration of 7.3 mmol/L are respectively put into a reaction kettle of 50 mL, and then DMF of 10mL is dripped into the reaction kettle, and the reaction kettle is sealed to prevent air from entering. The reaction vessel was then placed in a vacuum oven and warmed to 200 c at a ramp rate of 6 c/min and maintained at 24 h c at 200 c. After the reaction is finished, the reaction kettle is naturally cooled to room temperature, the metal copper sheet is taken out, a syringe filled with deionized water is used for washing sodium citrate and DMF residual liquid floating on the surface, and then the mixture is lightly blow-dried by cold air, so that the metal copper material subjected to solvothermal treatment in different mixture ratios is obtained, and the metal copper material is marked as Cu-S.
(II) results of experiments
FIG. 4 is a graph of the macroscopic topography of the effect of the mixture ratio of the mixed solution on the surface treatment of the metallic material.
Fig. 4 is a surface topography diagram of a copper sheet material treated by five different sodium citrate solutions, and as can be seen from the macroscopic topography diagram of fig. 4, the copper sheet is obviously reddened and severely oxidized after being treated by adding 5mL and 40mL of sodium citrate solution, and the copper sheet surface is smoother and smoother after being treated by adding 10mL and 30mL of sodium citrate solution, and the copper sheet surface is most intact after being treated by adding 20mL of sodium citrate solution. The method shows that too little or too much sodium citrate solution can lead to the copper sheet not being effectively protected, but is easy to oxidize to produce red copper oxide, and the required effect can be achieved when the addition amount is between 10ml and 30 ml. Therefore, in the invention, in the mixed solution of sodium citrate and DMF, the sodium citrate solution is DMF= (1-3) 1; more preferably, sodium citrate solution, dmf=2:1.
Example 4
Application of method for inhibiting interaction between C 5F10 O and metal interface in surface treatment of metal material of electrical insulation equipment using C 5F10 O as medium
The method (one) is as follows:
1. Cleaning:
and (3) cleaning the copper sheet (with the diameter of 40 mm and the thickness of 3 mm) by using absolute ethyl alcohol to remove dust and grease on the surface of the copper sheet. After the absolute ethyl alcohol on the surface of the copper sheet is volatilized, the dust-free rubber glove is worn in the whole process, the interference of hand dust and grease on the test is prevented, and the copper material which is not subjected to solvothermal treatment is obtained and marked as Cu.
2. And (3) solvothermal treatment:
Putting the cleaned red copper sheet and a sodium citrate solution with the concentration of 20mL to 7.3 mmol/L into a reaction kettle of 50 mL, dripping 10 mL of DMF into the reaction kettle, and sealing to prevent air from entering. The reaction vessel was then placed in a vacuum oven and warmed to 200 c at a ramp rate of 6 c/min and maintained at 24 h c at 200 c. After the reaction is finished, the reaction kettle is naturally cooled to room temperature, the red copper sheet is taken out, a syringe filled with deionized water is used for washing sodium citrate and DMF residual liquid floating on the surface, and then the mixture is lightly blow-dried by cold air, so that the metal copper material subjected to solvothermal treatment is obtained, and the mark is Cu-S.
3. Experimental method using C 5F10 O as insulating medium
And after the absolute ethyl alcohol inside the simulated air chamber and the needle-plate electrode volatilize, the needle-plate electrode is arranged on the conducting rod and the grounding rod, and the position between the needle-plate electrode is adjusted. Placing Cu and Cu-S in a discharge experiment platform, filling environment-friendly insulating gas C 5F10 O in the discharge experiment platform, and introducing CO 2 until the total air pressure of the mixed gas is the test air pressure. After the inflation operation is finished, the gas molecules in the simulated gas chamber are required to be kept still to ensure uniform mixing. The total gas pressure was set to 0.15 MPa and the mixed gas ratio was 10% c 5F10O/90%CO2. The experimental voltage is set to 25 kV, so that the stable partial discharge is ensured to be generated and breakdown is not generated. Maintaining the voltage required by the test, performing a partial discharge test for 48 hours, and taking out Cu and Cu-S after the completion of the partial discharge test, and detecting.
(II) results
1. FIG. 5a is an X-ray diffraction spectrum of Cu-S in the present example, and FIG. 5b is an X-ray diffraction spectrum of Cu in the present example.
As can be seen from fig. 5a and fig. 5b, in the present invention, the detection of X-ray diffraction spectrum is performed on Cu and Cu-S, which shows that, when not processed, the main crystal plane is the Cu (100) crystal plane, after processing, lattice reconstruction occurs, and the main crystal plane becomes the Cu (111) crystal plane, which indicates that the Cu-S after solvothermal processing of the mixed solution of sodium citrate and DMF in the present invention is still pure copper, but lattice reconstruction occurs, mainly the Cu (111), and the surface energy of the Cu (111) plane is low and stable, and has good oxidation and corrosion resistance properties.
2. Fig. 6 is a diagram of an example of an electrode of a copper plate applied to the present embodiment. Wherein, (1) is copper material (Cu) which is not subjected to solvothermal treatment and is not subjected to discharge experiment; (2) Copper material (Cu) which is not subjected to solvothermal treatment and is subjected to an overdischarge experiment; (3) Copper material (Cu-S) which is subjected to solvothermal treatment and is not subjected to discharge experiment; (4) Is copper material (Cu-S) subjected to solvothermal treatment and an overdischarge experiment.
As can be seen from fig. 6, the solvothermal treated copper material was brighter than the untreated copper material, and the coverage of the electrode with solid precipitates was also lower after 48h partial discharge experiments than the untreated copper material.
3. Fig. 7 is a graph showing the surface morphology of the solvothermal treated copper material and the surface morphology of the copper material without solvothermal treatment according to the present example. Wherein, (1) is copper material (Cu) which is not subjected to solvothermal treatment and is not subjected to discharge experiment; (2) Copper material (Cu) which is not subjected to solvothermal treatment and is subjected to an overdischarge experiment; (3) Copper material (Cu-S) which is subjected to solvothermal treatment and is not subjected to discharge experiment; (4) Scanning electron microscope surface topography (Cu-S) of the copper material subjected to solvothermal treatment and overdischarge experiments.
As can be seen from fig. 7, the copper surface that has not been subjected to the solvothermal treatment has micro mechanical scratches, which results in a copper material with a surface smoothness inferior to that of the copper material that has been subjected to the solvothermal treatment, and is shown as white marks in the sem image by irradiation with an electron beam. The surface of the copper electrode material subjected to solvothermal treatment is basically free from degradation and defects, and the flatness and smoothness are higher than those of a control group not subjected to solvothermal treatment.
4. Fig. 8 is a graph showing the concentration change of the partial decomposition products after 48 hours of partial discharge in the discharge experiment table. The insulating gas medium for discharge experiment is the mixed gas of C 5F10 O and CO 2.
As can be seen from fig. 8, the contents of the three gas decomposition components increase in a quasi-linear manner as partial discharge continues. Among them, CF 4 had the fastest growth rate and C 2F6 had the slowest growth rate, and the production rates of the three decomposition products of the control Cu group CF 4、C2F6、C3F8 were 0.243ppm/h (5.84 ppm/d), 0.122ppm/h (2.92 ppm/d) and 0.292ppm/h (7.01 ppm/d), respectively, under the experimental conditions. The production rates of the three decomposition products of the experimental Cu-S group CF 4、C2F6、C3F8 under the experimental conditions were 0.130ppm/h (3.13 ppm/d), 0.066ppm/h (1.58 ppm/d) and 0.199ppm/h (4.78 ppm/d), respectively, which were lower than those of the control group under the same conditions. Through three groups of repeated parallel experiments, the surface modification method of solvothermal treatment has a certain inhibition effect on the interfacial interaction of the copper material and the environment-friendly insulating gas, so that the gas decomposition component rate and content generated by partial discharge faults are reduced. In a word, along with long-time partial discharge, the copper material subjected to solvothermal treatment has a certain inhibition effect on discharge decomposition of the environment-friendly insulating gas medium, and the reduction of insulating performance of the environment-friendly insulating gas medium C 5F10 O caused by partial discharge decomposition is inhibited.
5. Fig. 9 is a diagram showing the composition of solid deposit (electrode center solid deposit) element after 48 hours of partial discharge in the discharge experiment table. The insulating gas medium for discharge experiment is the mixed gas of C 5F10 O and CO 2.
As can be seen from fig. 9, the ratio of carbon element in the solid deposit was 19.59% and 20.47% for the experimental Cu-S group and the control Cu group, respectively, which were not quite different. And oxygen is 6.32% and 11.21% respectively, the experimental group is lower than the control group; similarly, the fluorine content was 25.73% and 27.89%, respectively, and the experimental group was less than the control group. And the sodium salt (sodium citrate) is introduced into the experimental group, so that the content of sodium element is higher than that of the control group. Overall, the solvothermal treatment method of the experimental group has a certain inhibition effect on the generation of solid sediment. In short, with long-time partial discharge, the material subjected to solvothermal treatment can inhibit solid sediment generated by discharge decomposition of the environment-friendly insulating gas medium.
In summary, in this example, the surface of Cu-S still had metallic luster of metallic copper from the macroscopic level, and no trace of oxidation and corrosion by the mixed solution was observed.
In this embodiment, citrate in the mixed solution can be complexed with Cu 2+ to inhibit the generation of CuO and Cu 2 O, and at the same time, the mixed solution of sodium citrate and DMF has a promoting effect on the reconstruction of crystal lattice, so that on the premise of ensuring that the electrical conductivity and thermal conductivity of copper are not affected, the oxidation resistance and corrosion resistance of the surface of copper material are improved, and the interaction between the surface of copper material and the gas-solid interface of environment-friendly insulating gas C 5F10 O is inhibited, thereby achieving the effect of inhibiting gas decomposition and solid deposition.
In the embodiment, the mixed solution of sodium citrate and DMF is utilized to reconstruct the surface lattice of the copper material, so that the surface oxidation resistance and corrosion resistance of the copper material are improved on the premise of ensuring that the electrical conductivity and thermal conductivity of copper are not influenced, and the industrial application of copper and the application scene of environment-friendly insulating gas C 5F10 O are enlarged.
Claims (9)
1. A method of inhibiting C 5F10 O interaction with a metal interface, the method comprising treating a surface of a metallic copper material, the treating comprising the steps of: immersing the cleaned metallic copper material in a mixed solution of a complexing agent and N, N-dimethylformamide, isolating air, performing solvothermal treatment, cooling to room temperature, taking out the metallic copper material, washing with deionized water, and drying to obtain the solvothermal treated metallic copper material.
2. The method of inhibiting interaction of C 5F10 O with a metal interface of claim 1, wherein the complexing agent is selected from the group consisting of sodium citrate solution, sodium oxalate solution, and sodium formate solution.
3. The method of inhibiting interaction of C 5F10 O with a metal interface of claim 2, wherein the complexing agent is a sodium citrate solution.
4. The method of inhibiting interaction of C 5F10 O with a metal interface according to claim 3 wherein the complexing agent is a sodium citrate solution at a concentration of 5 to 10 mmol/L.
5. The method of inhibiting interaction between C 5F10 O and a metal interface according to claim 4, wherein the complexing agent and N, N-dimethylformamide are mixed in a volume ratio of sodium citrate solution to N, N-dimethylformamide= (1-3): 1.
6. The method of inhibiting interaction of C 5F10 O with a metal interface according to claim 1, wherein the solvothermal treatment is maintained at 190-210 ℃ from 20-24 h.
7. The method of inhibiting interaction of C 5F10 O with a metal interface of claim 6, wherein the rate of temperature rise is 5 to 7 ℃/min.
8. The method of inhibiting interaction of C 5F10 O with a metal interface according to claim 7, wherein the resulting solvothermal treated metallic copper material has a crystal lattice of predominantly Cu (111).
9. Use of a method of inhibiting interaction of C 5F10 O with a metal interface as claimed in any one of claims 1 to 8 for the surface treatment of metallic materials in electrical insulation equipment in which insulating gas C 5F10 O is the medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410907003.7A CN118441230B (en) | 2024-07-08 | 2024-07-08 | Inhibition C5F10Method for interaction between O and metal interface and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410907003.7A CN118441230B (en) | 2024-07-08 | 2024-07-08 | Inhibition C5F10Method for interaction between O and metal interface and application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118441230A true CN118441230A (en) | 2024-08-06 |
| CN118441230B CN118441230B (en) | 2024-09-13 |
Family
ID=92320072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410907003.7A Active CN118441230B (en) | 2024-07-08 | 2024-07-08 | Inhibition C5F10Method for interaction between O and metal interface and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118441230B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160130017A (en) * | 2015-04-30 | 2016-11-10 | 성균관대학교산학협력단 | Method for manufacturing transparent electrode and transparent electrode manufatured by the same |
| CN111549345A (en) * | 2020-05-22 | 2020-08-18 | 江苏理工学院 | Novel SLIP surface and construction method thereof |
| CN111763898A (en) * | 2020-06-01 | 2020-10-13 | 武汉大学 | Metal surface treatment for electrical insulation equipment for preventing C5F10O gas etching method |
| CN113968730A (en) * | 2021-11-11 | 2022-01-25 | 横店集团东磁股份有限公司 | Z-type ferrite composite material and preparation method and application thereof |
| US20220275507A1 (en) * | 2019-09-12 | 2022-09-01 | Novelis Inc. | Surface engineered metal substrates and related methods |
| CN115613040A (en) * | 2022-09-16 | 2023-01-17 | 崇辉半导体(江门)有限公司 | Photoresist removing liquid for removing photoresist overflowing from surface of copper substrate and preparation method thereof |
-
2024
- 2024-07-08 CN CN202410907003.7A patent/CN118441230B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160130017A (en) * | 2015-04-30 | 2016-11-10 | 성균관대학교산학협력단 | Method for manufacturing transparent electrode and transparent electrode manufatured by the same |
| US20220275507A1 (en) * | 2019-09-12 | 2022-09-01 | Novelis Inc. | Surface engineered metal substrates and related methods |
| CN111549345A (en) * | 2020-05-22 | 2020-08-18 | 江苏理工学院 | Novel SLIP surface and construction method thereof |
| CN111763898A (en) * | 2020-06-01 | 2020-10-13 | 武汉大学 | Metal surface treatment for electrical insulation equipment for preventing C5F10O gas etching method |
| CN113968730A (en) * | 2021-11-11 | 2022-01-25 | 横店集团东磁股份有限公司 | Z-type ferrite composite material and preparation method and application thereof |
| CN115613040A (en) * | 2022-09-16 | 2023-01-17 | 崇辉半导体(江门)有限公司 | Photoresist removing liquid for removing photoresist overflowing from surface of copper substrate and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 傅明利等: "C4F7N/N2混合气体的分解机理研究", 高压电器, no. 07, 16 July 2020 (2020-07-16), pages 1 - 7 * |
| 夏亚龙等: "环保型C5F10O混合气体设备研制现状与展望", 四川电力技术, vol. 46, no. 04, 20 August 2023 (2023-08-20), pages 1 - 6 * |
| 马超峰等: "六氟-2-丁炔的制备与应用研究进展", 有机氟工业, no. 02, 15 June 2020 (2020-06-15), pages 48 - 52 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118441230B (en) | 2024-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Mantilla et al. | Investigation of the insulation performance of a new gas mixture with extremely low GWP | |
| US8680421B2 (en) | Encapsulated switchgear | |
| Li et al. | Experimental study on compatibility of eco-friendly insulating medium C 5 F 10 O/CO 2 gas mixture with copper and aluminum | |
| CN109628934B (en) | Environment-friendly tin removing liquid and preparation method thereof | |
| CN111211515A (en) | Arc extinguishing and/or insulating electrical equipment | |
| WO2011090992A1 (en) | Perfluoroketones as gaseous dielectrics | |
| CN111705287B (en) | Metal surface treatment for electrical insulation equipment for preventing C4F7N etching method | |
| CN118441230B (en) | Inhibition C5F10Method for interaction between O and metal interface and application | |
| CN1597736A (en) | Purification method of polyphenyl thioether | |
| CN105032024B (en) | The removal methods of benzyl disulfide in a kind of insulating oil | |
| CN111454781A (en) | High-insulation mixed liquid capable of being used for cleaning high-voltage power equipment | |
| JPH10506959A (en) | Method for enhancing the corrosion resistance of metals and alloys by treatment with rare earth elements | |
| US3538022A (en) | Electrically conductive zinc oxide | |
| CN103240053A (en) | Corrosive sulfur removal agent for insulating oil and production method of corrosive sulfur removal agent | |
| CN103566867A (en) | Preparation method of desulfurization adsorbent for transformer oil | |
| Cong et al. | Protective performance of different passivators on oil-paper insulation containing multiple corrosive sulphides | |
| CN111763898B (en) | Metal surface treatment for electrical insulation equipment for preventing C5F10O gas etching method | |
| CN117210814B (en) | Microetching cleaning agent for copper surface of circuit board and preparation method thereof | |
| CN110578107B (en) | Processing method of antioxidant copper wire | |
| CN106782941A (en) | A kind of method for improving the resistance to discharge performance of epoxy insulation in Electrode in Gas Insulated System | |
| CN107034005B (en) | Regeneration method of deteriorated transformer oil | |
| CN113963906A (en) | Environment-friendly gas-insulated transformer and method for improving compatibility with environment-friendly gas by silver plating on surface of copper material | |
| Li et al. | Experimental Study on Compatibility of C 6 F 12 O/CO 2 Gas Mixture with Eco-friendly Insulating Medium and Copper | |
| Samarasinghe et al. | A review on influencing factors of sulphur corrosion and metal passivation in power transformers | |
| Yao et al. | Compatibility study of eco-friendly Insulating Dielectric C5-PFK-CO₂ with silver material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |