CN118291086A - Surface viscose removing water for heat-conducting silica gel gasket and preparation and use methods thereof - Google Patents

Abstract

The application provides a heat-conducting silica gel gasket surface de-viscose water and a preparation and use method thereof. The de-viscose water is applied to a heat-conducting silica gel gasket and comprises the following components in parts by weight: 200-400 parts of silicone oil, 10-50 parts of cross-linking agent, 400-700 parts of heat conducting powder, 1-5 parts of inhibitor and 4-8 parts of catalyst. By adopting silicone oil as a carrier and a cross-linking agent as a regulator, the viscosity-removed glue with different viscosity can be obtained according to the requirement; by adding the heat conducting powder, good heat conductivity of the de-viscose water can be realized; through will remove viscose water is applied to heat conduction silica gel gasket, can be under the influence not heat conduction silica gel gasket heat conduction, resilience and performance such as ageing resistance's prerequisite, adjust its single face or two-sided viscidity to promote the adaptability of heat conduction silica gel gasket under different assembly conditions.

Description

Surface viscose removing water for heat-conducting silica gel gasket and preparation and use methods thereof

Technical Field

The application relates to the technical field of heat conduction materials, in particular to glue removing water for the surface of a heat conduction silica gel gasket and a preparation and use method thereof.

Background

With the development of technology, the circuit design of modern electronic instruments and equipment is more and more complex, and the integration level is higher and higher. To ensure that these highly integrated devices operate stably, the heat generated by the individual electronic components must be conducted away efficiently and in time. The thermal interface material can be used for effectively filling an air gap between the heating device and the heat dissipation device, so that a good heat transfer passage is formed, and the heat dissipation efficiency of the device is improved.

The heat-conducting silica gel gasket is a widely used interface material and has the following characteristics: firstly, the high-strength plastic has good flexibility, can adapt to different deformations and keeps stable performance; secondly, it has good insulativity, and can avoid the interference of electric signals; in addition, it has good compressibility, can keep stable performance under different pressures; finally, it has natural viscosity on the surface, and can effectively transfer the heat generated by the electronic components to the heat dissipation device. The surface tackiness of different thermally conductive silicone gaskets varies greatly, due to the following: first, the change in hardness affects the surface tackiness of the product; secondly, the change of the heat conductivity coefficient also affects the surface viscosity of the product; in addition, variations in raw materials can also lead to differences in product surface tackiness.

However, the surface viscosity of the conventional heat-conducting silica gel gasket is difficult to adjust on the premise that the heat conduction, rebound, ageing resistance and other performances of the conventional heat-conducting silica gel gasket are not affected, and when the heat-conducting silica gel gasket is applied to an electronic element, the heat-conducting silica gel gasket is likely to have poor suitability and cannot meet the assembly condition.

Disclosure of Invention

In view of the above-mentioned problems, the present application has been made to provide a de-viscose water which overcomes the problems or at least partially solves the problems, comprising:

The de-sticking glue is applied to a heat-conducting silica gel gasket and comprises the following components in parts by weight: 200-400 parts of silicone oil, 10-50 parts of cross-linking agent, 400-700 parts of heat conducting powder, 1-5 parts of inhibitor and 4-8 parts of catalyst.

Preferably, the silicone oil is methyl vinyl silicone oil, the vinyl content is 0.2-0.6%, and the viscosity is 50-300mpa.s.

Preferably, the cross-linking agent is side chain hydrogen-containing silicone oil, the hydrogen content is 0.1-0.5%, and the viscosity is 20-1000mpa.s.

Preferably, the heat conductive powder includes at least one of aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum, copper, and carbon fiber.

Preferably, the heat conducting powder is spherical alumina with the particle size of 5-10 mu m.

Preferably, the inhibitor is ethynyl cyclohexanol.

Preferably, the platinum catalyst is at least one of a Speier catalyst and a Karstedt catalyst, and the platinum content is 3000-6000ppm.

A method of preparing the debonding glue of any of the preceding claims, comprising:

And mixing the silicone oil, the cross-linking agent, the heat conducting powder, the inhibitor and the catalyst according to the proportion to obtain the viscosity-reducing glue.

Preferably, the step of mixing silicone oil, a cross-linking agent, heat conducting powder, an inhibitor and a catalyst according to the proportion to obtain the viscosity-removed glue comprises the following steps:

Weighing silicone oil, a cross-linking agent, heat conducting powder, an inhibitor and a catalyst according to the proportion;

Adding silicone oil, a cross-linking agent, heat conducting powder and an inhibitor into a planetary mixer, and stirring at 20-26 ℃ for 20min at a rotating speed of 30rpm/min to obtain a mixed system;

and adding a catalyst into the mixed system, and stirring at the temperature of 20-26 ℃ for 20min at the rotating speed of 30rpm/min to obtain the viscosity-removed glue.

A method of using the debonding glue of any of the preceding claims, comprising:

Coating the surface of the heat-conducting silica gel gasket with de-viscose water, and baking for 5min at 90-100 ℃ to enable the de-viscose water to be solidified on the surface of the heat-conducting silica gel gasket to form a de-viscose coating with the thickness of 0.01-0.05mm, thus obtaining the de-viscose heat-conducting silica gel gasket.

The application has the following advantages:

In the embodiment of the application, compared with the problem that the surface tackiness of the traditional heat-conducting silica gel gasket is difficult to adjust, the application provides a solution for adjusting the surface tackiness of the heat-conducting silica gel gasket through de-tacking glue, which comprises the following specific steps: the de-sticking glue is applied to a heat-conducting silica gel gasket and comprises the following components in parts by weight: 200-400 parts of silicone oil, 10-50 parts of cross-linking agent, 400-700 parts of heat conducting powder, 1-5 parts of inhibitor and 4-8 parts of catalyst. By adopting silicone oil as a carrier and a cross-linking agent as a regulator, the viscosity-removed glue with different viscosity can be obtained according to the requirement; by adding the heat conducting powder, good heat conductivity of the de-viscose water can be realized; through will remove viscose water is applied to heat conduction silica gel gasket, can be under the influence not heat conduction silica gel gasket heat conduction, resilience and performance such as ageing resistance's prerequisite, adjust its single face or two-sided viscidity to promote the adaptability of heat conduction silica gel gasket under different assembly conditions.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the present application will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flow chart of steps of a method for preparing a debonding glue according to an embodiment of the present application;

FIG. 2 is a flow chart showing the steps of a method for applying a debonding glue according to an embodiment of the present application;

FIG. 3 is a schematic illustration of a usage scenario of a de-tacky adhesive according to an embodiment of the present application;

Fig. 4 is a schematic structural diagram of a thermal-conductive silicone gasket with adhesion removal according to an embodiment of the present application.

Reference numerals in the drawings of the specification are as follows:

1. A thermally conductive silicone pad; 2. removing the adhesive; 3. a scraper; 4. screen printing plate; 5. a work table; 6. and (5) removing the adhesive coating.

Detailed Description

In order that the manner in which the above recited objects, features and advantages of the present application are obtained will become more readily apparent, a more particular description of the application briefly described above will be rendered by reference to the appended drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

It should be noted that, in any embodiment of the present application, the de-viscose water is applied to a heat-conducting silica gel pad, and specifically, the de-viscose water is applied to adjust the overall or local surface viscosity of one or both sides of the heat-conducting silica gel pad.

In one embodiment of the present application, there is provided a viscosity-reducing glue comprising, by mass: 200-400 parts of silicone oil, 10-50 parts of cross-linking agent, 400-700 parts of heat conducting powder, 1-5 parts of inhibitor and 4-8 parts of catalyst.

In the embodiment of the application, compared with the problem that the surface tackiness of the traditional heat-conducting silica gel gasket is difficult to adjust, the application provides a solution for adjusting the surface tackiness of the heat-conducting silica gel gasket through de-tacking glue, which comprises the following specific steps: the de-sticking glue is applied to a heat-conducting silica gel gasket and comprises the following components in parts by weight: 200-400 parts of silicone oil, 10-50 parts of cross-linking agent, 400-700 parts of heat conducting powder, 1-5 parts of inhibitor and 4-8 parts of catalyst. By adopting silicone oil as a carrier and a cross-linking agent as a regulator, the viscosity-removed glue with different viscosity can be obtained according to the requirement; by adding the heat conducting powder, good heat conductivity of the de-viscose water can be realized; through will remove viscose water is applied to heat conduction silica gel gasket, can be under the influence not heat conduction silica gel gasket heat conduction, resilience and performance such as ageing resistance's prerequisite, adjust its single face or two-sided viscidity to promote the adaptability of heat conduction silica gel gasket under different assembly conditions.

Next, a kind of the debonding glue in the present exemplary embodiment will be further described.

In this embodiment, the silicone oil is methyl vinyl silicone oil, the vinyl content is 0.2-0.6%, and the viscosity is 50-300mpa.s. Methyl vinyl silicone oil has the following characteristics: firstly, the heat conduction material has good heat stability, can keep the chemical structure and physical properties at high temperature, and is suitable for the heat conduction scene of electronic equipment; secondly, the composite material has good compatibility, can be mixed with various heat conducting powders, keeps good heat conducting performance, and ensures the uniformity and stability of the mixture; in addition, it has excellent electrical insulation, can keep good electrical insulation performance even at high temperature, prevent the electric signal interference of the electronic equipment; finally, it has good aging resistance, and under various environmental conditions (such as high temperature, humidity, chemical exposure, etc.), it exhibits good aging resistance, contributing to the extended service life of the thermally conductive silicone gasket. The vinyl content is selected to be 0.2-0.6%, so that the methyl vinyl silicone oil can be ensured to have proper reactivity, and can effectively react with the cross-linking agent to form a stable network structure. The viscosity is selected to be 50-300mpa.s, so that proper fluidity can be provided, and the application is convenient to form a uniform coating.

In this embodiment, the cross-linking agent is a side chain hydrogen-containing silicone oil, the hydrogen content is 0.1-0.5%, and the viscosity is 20-1000mpa.s. The side chain hydrogen-containing silicone oil has the following characteristics: firstly, the adhesive has good crosslinking performance, can effectively perform crosslinking reaction with silicone oil, and enhances the mechanical strength and durability of the de-adhesive glue; secondly, the adhesive has good chemical stability, is not easily influenced by environmental factors, and is beneficial to maintaining the performance of the de-adhesive glue; in addition, the material has good thermal stability and can still maintain the performance under high-temperature environment; finally, the adhesive has good adhesive strength, and the adhesive strength of the debonding glue and the heat conducting silica gel gasket can be improved through a crosslinking reaction, so that the debonding coating and the heat conducting silica gel gasket are ensured to be stably connected. The hydrogen content is selected to be 0.1-0.5%, so that the side chain hydrogen-containing silicone oil can be ensured to have sufficient crosslinking capability, and the silicone oil can effectively react to form a stable network structure. The viscosity is selected to be 20-1000mpa.s, which can provide good handling and application properties.

In this embodiment, the heat conductive powder includes at least one of aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum, copper, and carbon fiber. Alumina has high thermal conductivity, good electrical insulation and chemical stability, is suitable for high performance applications, and is relatively low in cost. Magnesium oxide has high thermal conductivity and good electrical insulation properties, and is suitable for applications requiring good electrical and thermal insulation. Aluminum nitride has very high thermal conductivity and good electrical insulation, can provide excellent thermal management properties in electronic packages, and is particularly suitable for high performance applications. Silicon nitride has high thermal conductivity and good mechanical strength, and is suitable for applications in severe environments with high temperature resistance and impact resistance. Boron nitride has high thermal conductivity and good electrical insulation, and is excellent in high-frequency application, and is very effective in improving thermal conductivity while maintaining electrical insulation. Silicon carbide has high thermal conductivity and good mechanical properties, is stable in high temperature and high pressure environments, and is suitable for extreme conditions. Aluminum has high thermal conductivity and is lightweight, easy to process, and suitable for applications requiring good heat conduction and low weight. Copper has a very high thermal conductivity and is widely used in electronic heat dissipation applications to provide excellent thermal conductivity. The carbon fiber has high thermal conductivity and high strength, is light in weight, can provide excellent mechanical properties and thermal stability, and is suitable for high-performance lightweight applications.

In this embodiment, the heat conductive powder is spherical alumina with a particle size of 5-10 μm. Alumina itself has good thermal conductivity and electrical insulation properties and is suitable for improving the thermal conductivity of materials and preventing electrical shorting. Spherical particles have lower surface roughness and better flowability than irregularly shaped particles, helping to achieve a more uniform distribution during mixing and coating. The particle size of 5-10 μm can provide good filling property and dispersibility, and is favorable for forming a dense filling structure, thereby enhancing heat conduction efficiency.

In this embodiment, the inhibitor is ethynyl cyclohexanol. Acetylene cyclohexanol acts as an inhibitor and is capable of reacting with a cross-linking agent to control the rate and extent of cross-linking of the silicone rubber.

In this embodiment, the platinum catalyst is at least one of a Speier catalyst and a Karstedt catalyst, and the platinum content is 3000-6000ppm. The Speier catalyst rapidly catalyzes the curing reaction of silicone rubber, and is very effective even at low concentrations. The Karstedt catalyst is more stable than other platinum catalysts in the storage and use processes, can effectively catalyze the curing reaction at low temperature, is suitable for temperature-sensitive materials, has relatively small color change caused in the curing process, and is suitable for color-sensitive applications. The platinum content is selected to be 3000-6000ppm, which can provide sufficient activity while allowing control of cure speed and time by precise proportioning for optimum performance.

Referring to fig. 1, in an embodiment of the present application, a method for preparing the anti-adhesion glue according to any one of the above embodiments is provided, including:

S110, mixing silicone oil, a cross-linking agent, heat conducting powder, an inhibitor and a catalyst according to the proportion to obtain the viscosity-removed glue.

In this embodiment, the specific process of "mixing silicone oil, cross-linking agent, heat-conducting powder, inhibitor and catalyst according to the mixture ratio to obtain the de-sticking glue" in step S110 may be further described in conjunction with the following description.

Weighing silicone oil, a cross-linking agent, heat conducting powder, an inhibitor and a catalyst according to the proportion;

Adding silicone oil, a cross-linking agent, heat conducting powder and an inhibitor into a planetary mixer, and stirring at 20-26 ℃ for 20min at a rotating speed of 30rpm/min to obtain a mixed system; the crosslinking reaction can be prevented from being started in advance by adding an inhibitor; by premixing the silicone oil, the cross-linking agent and the heat conducting powder, the components can be ensured to be uniformly mixed, and aggregation or layering phenomenon is avoided;

Adding a catalyst into the mixed system, and stirring at the temperature of 20-26 ℃ for 20min at the rotating speed of 30rpm/min to obtain the viscosity-removed glue; the crosslinking reaction can be started and accelerated by adding the catalyst, so that the uniform viscosity-removed glue is obtained.

Referring to fig. 2, in an embodiment of the present application, a method for using the de-adhesive glue according to any one of the above embodiments is provided, including:

S210, coating the surface of the heat-conducting silica gel gasket with de-viscose water, and baking for 5min at 90-100 ℃ to enable the de-viscose water to be solidified on the surface of the heat-conducting silica gel gasket to form a de-viscose coating with the thickness of 0.01-0.05mm, thereby obtaining the de-viscose heat-conducting silica gel gasket.

Referring to fig. 3 and 4, in this embodiment, the specific process of "coating the surface of the thermal conductive silica gel pad with the de-viscose water and baking at 90-100 ℃ for 5 min" in step S210 can be further described in conjunction with the following description, so that the de-viscose water is cured on the surface of the thermal conductive silica gel pad to form a de-viscose coating with a thickness of 0.01-0.05mm, thereby obtaining the de-viscose thermal conductive silica gel pad ".

Placing a heat-conducting silica gel gasket 1 on the surface of a workbench 5;

Uniformly scraping the de-sticking glue 2 on the surface of the heat-conducting silica gel pad 1 through a screen printing screen 4 by using a scraper 3;

And (3) placing the heat-conducting silica gel gasket 1 coated with the debonding glue 2 into an oven, and baking for 5min at 90-100 ℃ to enable the debonding glue 2 to be solidified on the surface of the heat-conducting silica gel gasket 1 to form a debonding coating 6 with the thickness of 0.01-0.05mm, thus obtaining the debonding heat-conducting silica gel gasket.

Examples 1 to 4

Step 1: weighing vinyl silicone oil, hydrogen-containing silicone oil, heat conducting powder, acetylene cyclohexanol and platinum catalyst according to the proportion of the table 1, placing the heat conducting powder, the vinyl silicone oil, the hydrogen-containing silicone oil and the acetylene cyclohexanol in a planetary stirrer, and stirring and mixing for 20min at the stirring speed of 30 rpm/min.

Step 2: adding platinum catalyst (Karstedt catalyst), stirring at 30rpm/min, and stirring for 20min to obtain the final product.

Step 3: placing the heat-conducting silica gel gasket in the middle of a workbench, adjusting the height of a screen printing screen plate, pouring de-viscose water above the screen printing screen plate, uniformly scraping the de-viscose water on the surface of the heat-conducting silica gel gasket by using a scraper, and then placing the heat-conducting silica gel gasket into an oven, and baking at the temperature of 95 ℃ for 5min to obtain the de-viscose heat-conducting silica gel gasket.

The raw material ratios of examples 1-4 are shown in Table 1:

	Example 1	Example 2	Example 3	Example 4
					Vinyl silicone oil (g)	375	375	375	375
Hydrogen silicone oil (g)	40	38	36	33
					Heat conductive powder (g)	580	580	580	580
Acetylene cyclohexanol (g)	1	1	1	1
					Platinum catalyst (g)	4	4	4	4

Table 1 raw material ratios of examples 1-4 the results of the performance tests of examples 1-4 are shown in table 2:

TABLE 2 results of Performance test of examples 1-4

Wherein the thermal conductivity is tested according to ISO 22007-2; the test equipment is Hotdisk thermal conductivity coefficient analyzer;

the calculation formula of the blade coating thickness is as follows: blade coating thickness = debonding thermally conductive silicone gasket thickness-thermally conductive silicone gasket thickness; the test equipment is a digital display caliper;

The viscosity test method comprises the following steps: (1) Taking 300 x 230mm double-sided adhesive paper, and flatly attaching the double-sided adhesive paper to a marble platform (adopting a scraper to scrape the double-sided adhesive paper, so as to ensure that the double-sided adhesive paper is completely attached to the marble platform without bubbles; (2) Taking a sample, wherein the specification of the sample is 200 mm or 300mm, and the sample is flatly adhered to the double-sided adhesive tape of the marble platform (scraped by a scraper), so that the sample is completely adhered to the double-sided adhesive tape, and no bubbles exist; (3) Firstly, adjusting a unit to N by using a push-pull force meter, setting the direction of a test value, and fixing the direction as a pulling force direction; (4) Placing weights (30 g) on the adhesive surface of the back surface (taking care that the weights can not be placed to apply gravity), and testing by using a push-pull force meter when the weights are placed on the adhesive surface for 3-5s (determining that the numerical value of the instrument is about to be zero before testing); the test equipment was AIGU (Ai Gu) ZP (Z2) -50N.

From the test results, the de-viscose water has good thermal conductivity, can adjust the surface viscosity according to the application requirements, and has simple preparation process and wide application prospect.

While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the application.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or terminal device that comprises the element.

The application has been described in detail with reference to the heat-conductive silica gel gasket surface de-adhesive water and the preparation and use methods thereof, and specific examples are used herein to illustrate the principles and embodiments of the application, the above examples are only used to help understand the method and core idea of the application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims (10)

1. The de-sticking glue is applied to the heat-conducting silica gel gasket and is characterized by comprising the following components in parts by weight: 200-400 parts of silicone oil, 10-50 parts of cross-linking agent, 400-700 parts of heat conducting powder, 1-5 parts of inhibitor and 4-8 parts of catalyst.

2. The de-sticking glue according to claim 1, wherein the silicone oil is methyl vinyl silicone oil, the vinyl content is 0.2-0.6%, and the viscosity is 50-300mpa.s.

3. The de-sticking glue according to claim 1, wherein the cross-linking agent is a side chain hydrogen silicone oil with a hydrogen content of 0.1-0.5% and a viscosity of 20-1000mpa.s.

4. The de-tacking glue of claim 1 wherein the thermally conductive powder comprises at least one of aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum, copper, and carbon fiber.

5. The de-sticking glue of claim 1, wherein the heat conductive powder is spherical alumina with a particle size of 5-10 μm.

6. The debonding glue of claim 1, wherein the inhibitor is acetylene cyclohexanol.

7. The de-sticking glue of claim 1, wherein the platinum catalyst is at least one of a Speier catalyst and a Karstedt catalyst, and the platinum content is 3000-6000ppm.

8. A method of preparing a debonding glue according to any of the claims 1 to 7, comprising:

And mixing the silicone oil, the cross-linking agent, the heat conducting powder, the inhibitor and the catalyst according to the proportion to obtain the viscosity-reducing glue.

9. The method of claim 8, wherein the step of mixing silicone oil, cross-linking agent, heat conducting powder, inhibitor and catalyst according to the ratio to obtain the de-sticking glue comprises:

Weighing silicone oil, a cross-linking agent, heat conducting powder, an inhibitor and a catalyst according to the proportion;

Adding silicone oil, a cross-linking agent, heat conducting powder and an inhibitor into a planetary mixer, and stirring at 20-26 ℃ for 20min at a rotating speed of 30rpm/min to obtain a mixed system;

and adding a catalyst into the mixed system, and stirring at the temperature of 20-26 ℃ for 20min at the rotating speed of 30rpm/min to obtain the viscosity-removed glue.

10. A method of using the debonding glue of any of claims 1 to 7, comprising:

Coating the surface of the heat-conducting silica gel gasket with de-viscose water, and baking for 5min at 90-100 ℃ to enable the de-viscose water to be solidified on the surface of the heat-conducting silica gel gasket to form a de-viscose coating with the thickness of 0.01-0.05mm, thus obtaining the de-viscose heat-conducting silica gel gasket.