CN115955763A - Power module and electronic equipment of ball grid array encapsulation - Google Patents

Abstract

The application provides a power module and electronic equipment of ball grid array encapsulation is applicable to power equipment technical field, and this power module includes: a substrate including a first surface and a second surface disposed opposite to each other; the chip is used for realizing DC/DC voltage conversion of the power supply module and is arranged on the first surface; at least one passive device for performing output processing on the DC/DC conversion voltage, disposed on the second surface; the spherical pin is used for being connected with electronic equipment, the electronic equipment performs voltage conversion through a power supply module, the spherical pin is arranged on the first surface, the protruding height of the spherical pin relative to the first surface is M, the protruding height of the chip relative to the first surface is N, and M is larger than N.

Description

Power module and electronic equipment of ball grid array encapsulation

Technical Field

The present disclosure relates to power devices, and more particularly, to a power module and an electronic device packaged in a ball grid array.

Background

The main components of the power supply module include a power switch, a control Integrated Circuit (IC), an input capacitor, an output capacitor, a power inductor, and resistors and capacitors for signal processing. The power switch is usually a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or an Insulated Gate Bipolar Transistor (IGBT), and the control IC may be a driving chip or a Pulse Width Modulation (PWM) control chip, or a combination of the two. At present, power supplies and semiconductor manufacturers are developing the package integration technology of power modules, and the integration schemes of power supplies manufacturers and semiconductor manufacturers gradually generate intersection in the field of chip-level semiconductor package integration, and mostly adopt the structures of integrated MOSFETs, ICs, passive devices (such as inductors, resistors, capacitors, and the like), embedded Printed Circuit Boards (PCBs) or other substrates, and adopt the interconnection mode of gold wire or copper wire bonding. The MOSFET is used as a switch, is controlled or driven by the IC to complete the pulse width modulation of the input voltage, and outputs the voltage required by the load through the filtering of the inductor and the capacitor.

Along with the development of social digitalization, the current of a power module for supplying power is required to be larger and larger, and the current corresponding solutions of the power modules with medium and small power and medium and small current cannot meet the requirements of a large-current power module on small area and high heat dissipation.

Disclosure of Invention

The application provides a power module of ball grid array encapsulation, through with thin chip plastic envelope at the base plate second surface, can make full use of the space of base plate, realize power module's extremely miniaturization. In addition, the chip is welded by using solder paste or heat dissipation glue through a surface sputtering metal layer, so that the heat dissipation capacity of the power module is improved, and the efficiency of the chip is effectively improved.

In a first aspect, a power module is provided, which includes: a substrate including a first surface and a second surface disposed opposite to each other; the chip is used for realizing DC/DC voltage conversion of the power supply module and is arranged on the first surface; at least one passive device for performing output processing on the DC/DC conversion voltage, disposed on the second surface; the spherical pin is used for being connected with electronic equipment, the electronic equipment performs voltage conversion through a power supply module, the spherical pin is arranged on the first surface, the protruding height of the spherical pin relative to the first surface is M, the protruding height of the chip relative to the first surface is N, and M is larger than N.

The substrate may be a printed circuit board, and the ball pins are input/output terminals of a power module packaged by a ball grid array.

The chip is composed of a MOSFET, is a DC/DC voltage converter and plays a role in DC/DC voltage conversion.

The passive devices can be resistors, capacitors, inductors, converters and the like, and can perform functions of filtering output voltage, storing energy and the like.

It is to be understood that the chip and the ball-shaped leads are mounted on the first surface of the substrate, and the lower surface of the chip does not exceed the lower surfaces of the ball-shaped leads for mounting of the power module.

Optionally, a first plastic package layer is arranged on the first surface, the chip is arranged in the first plastic package layer, the height of the first plastic package layer relative to the protrusion of the first surface is L, and M is greater than L.

Alternatively, the chip may be a flip chip.

Alternatively, the chip surface may be sputtered with a metal layer.

Optionally, the surface of the metal layer may be provided with solder paste or heat-dissipating glue.

It should be understood that the chip can be plastically packaged on the substrate in a flip-chip manner, so that the thickness of the module can be effectively reduced; meanwhile, the chip is welded through the connecting layer, the connecting layer can be solder paste or heat dissipation glue, a metal layer is sputtered on the surface, the heat of the chip is dissipated through the upper path and the lower path, the heat dissipation path of the chip is shortened, and the heat dissipation efficiency is enhanced.

Optionally, the substrate is provided with a first recess on the first surface; the chip is arranged in the first concave part, and the ball-shaped pin is arranged outside the first concave part.

With reference to the first aspect, in certain implementations of the first aspect, the at least one passive device includes an inductor.

It should be understood that the inductor may be a complete separate component and may be surface mounted on the substrate. The inductor is a component capable of converting electric energy into magnetic energy and storing the magnetic energy, and may be called as an inductor, an inductive element, a choke, a reactor, a dynamic reactor, or other names.

Optionally, the surface of the inductor is provided with a heat dissipation layer, and the heat dissipation layer may be a metal layer or a heat sink, which is beneficial for heat dissipation.

With reference to the first aspect, in certain implementation manners of the first aspect, the at least one passive device includes an inductor component, and the inductor component forms an inductor on the substrate through a plastic package manner.

It should be understood that a part of the inductor forming device may be soldered on the substrate and connected to the substrate by means of plastic encapsulation, thereby forming a plastic encapsulated inductor. The inductor forming device can be a framework, a winding, a shielding case, a packaging material, a magnetic core or an iron core and other components capable of forming an inductor. The inductor is a component capable of converting electric energy into magnetic energy and storing the magnetic energy, and may be called as an inductor, an inductive element, a choke, a reactor, a dynamic reactor, or other names.

Optionally, the surface of the inductor is provided with a heat dissipation layer, and the heat dissipation layer may be a metal layer or a heat sink, which is beneficial for heat dissipation.

In a second aspect, an electronic device is provided, which includes a housing, a circuit board disposed in the housing, and a power module disposed on the circuit board, wherein the power module includes: a substrate including a first surface and a second surface disposed opposite to each other; the chip is used for realizing DC/DC voltage conversion of the power supply module and is arranged on the first surface; at least one passive device for performing output processing on the DC/DC conversion voltage, disposed on the second surface; the spherical pin is used for being connected with electronic equipment, the electronic equipment performs voltage conversion through a power supply module, the sphere is arranged on the first surface, the protruding height of the spherical pin relative to the first surface is M, the protruding height of the chip relative to the first surface is N, and M is larger than N.

It should be understood that the power module converts voltage for the electronic device to enable the electronic device to operate, and the power module may be installed in the electronic device or in a voltage converter connected to the electronic device, which is not limited in this application.

The substrate may be a printed circuit board, and the ball pins are input/output terminals of a power module packaged by a ball grid array.

The chip is composed of a MOSFET, is a DC/DC voltage converter and plays a role in DC/DC voltage conversion.

The passive devices can be resistors, capacitors, inductors, converters and the like, and can perform functions of filtering output voltage, storing energy and the like.

It is to be understood that the chip and the ball-shaped leads are mounted on the first surface of the substrate, and the lower surface of the chip does not exceed the lower surfaces of the ball-shaped leads for mounting of the power module.

Optionally, a first plastic package layer is arranged on the first surface, the chip is arranged in the first plastic package layer, the height of the first plastic package layer relative to the protrusion of the first surface is L, and M is greater than L.

Alternatively, the chip may be a flip chip.

Alternatively, the chip surface may be sputtered with a metal layer.

Optionally, the surface of the metal layer may be provided with solder paste or heat-dissipating glue.

It should be understood that the chip can be plastically packaged on the substrate in a flip-chip manner, so that the thickness of the module can be effectively reduced; meanwhile, the chip is welded through the connecting layer, the connecting layer can be solder paste or heat dissipation glue, a metal layer is sputtered on the surface, the heat of the chip is dissipated through the upper path and the lower path, the heat dissipation path of the chip is shortened, and the heat dissipation efficiency is enhanced.

Optionally, the substrate is provided with a first recess on the first surface; the chip is disposed in the first recess, and the ball leads are disposed outside the first recess.

With reference to the second aspect, in certain implementations of the second aspect, the at least one passive device includes an inductor.

It should be understood that the inductor may be a complete separate component and may be surface mounted on the substrate. The inductor is a component capable of converting electric energy into magnetic energy and storing the magnetic energy, and may be called as an inductor, an inductive element, a choke, a reactor, a dynamic reactor, or other names.

Optionally, the surface of the inductor is provided with a heat dissipation layer, and the heat dissipation layer may be a metal layer or a heat sink, which is beneficial for heat dissipation.

With reference to the second aspect, in some implementations of the second aspect, the at least one passive device includes an inductor component, and the inductor component forms an inductor on the substrate through plastic encapsulation.

It should be understood that a part of the inductor forming device may be soldered on the substrate and connected to the substrate by means of plastic encapsulation, thereby forming a plastic encapsulated inductor. The inductor forming device can be a framework, a winding, a shielding case, a packaging material, a magnetic core or an iron core and other components capable of forming an inductor. The inductor is a component capable of converting electric energy into magnetic energy and storing the magnetic energy, and may be called as an inductor, an inductive element, a choke, a reactor, a dynamic reactor, or other names.

Optionally, the surface of the inductor is provided with a heat dissipation layer, and the heat dissipation layer may be a metal layer or a heat sink, which is beneficial for heat dissipation.

Drawings

Fig. 1 is a side view of a power module in a package.

Fig. 2 is a schematic side view of another power module package.

Fig. 3 is a schematic side view of a power module of a ball grid array package provided in the present application.

Fig. 4 is a schematic side view of another power supply module of a ball grid array package provided in the present application.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

The technical scheme of the embodiment of the application can be applied to a power module of Ball Grid Array (BGA).

Fig. 1 is a side view of a power module in a package. As shown in fig. 1, in a power module of a conventional package method, a passive device and a chip IC are tiled on a substrate for power supply and control, where the passive device may include one or more capacitors, resistors, inductors, and the like; the substrate may be a ceramic substrate, a printed circuit board, a flexible substrate, and the like.

It should be understood that since the passive devices and the chips are all tiled on one surface of the substrate, the occupied area of the substrate is very large, which is not favorable for miniaturization of the power module.

Fig. 2 is a schematic side view of another power module package. The Embedded Component Packaging (ECP) technology embeds a chip IC and a passive device in an ECP package substrate, and then attaches a large-sized inductor surface to the ECP substrate to construct a 3-dimensional stacked structure. The ECP packaging device is arranged on one surface of the substrate.

It will be appreciated that by packaging the chip and passive devices in an ECP module, the area of the substrate occupied by the module can be significantly reduced while the devices are highly integrated and thus have small parasitic parameters.

It should also be understood that since the power chips are inside the ECP module, dissipating heat upwards through the substrate and the inductor, and dissipating heat downwards through the substrate, the path of the heat dissipation channel is long, the thermal conductivity is small, and the heat dissipation area is small, resulting in poor heat dissipation. Meanwhile, the ECP module is limited by the height of the passive device, and the entire module cannot be miniaturized.

In view of the current requirements of large current power modules for small area and high heat dissipation, fig. 3 and 4 are schematic side views of the power modules of the ball grid array package provided in the present application.

As shown in fig. 3, the power module includes a substrate 10, a chip 20, a passive device 30, and ball pins 40.

The substrate includes a first surface 11 and a second surface 12 which are oppositely disposed, a spherical pin 40 is disposed on the first surface, and the spherical pin 40 is an Input/Output (I/O) terminal of a power module of the BGA package.

The substrate may be a Printed Circuit Board (PCB).

The chip is composed of a MOSFET, is a DC/DC voltage converter and plays a role in DC/DC voltage conversion.

It should be understood that the power module may be attached to other PCB boards through ball pins for voltage conversion.

In one possible implementation, the power module may supply power vertically through wiring within the substrate and surface components, resulting in a shorter power path, reduced current paths, and reduced heat generation.

Wherein the chip is arranged on the first surface 11 and the at least one passive component 30 is arranged on the second surface 12.

The height of the protrusion of the ball-shaped pin relative to the first surface is M, the height of the protrusion of the chip relative to the first surface is N, M is larger than N, namely the lower surface of the chip does not exceed the lower surface of the ball-shaped pin.

In a possible implementation manner, the first molding layer 50 is disposed on the first surface 11, the chip 20 is disposed in the first molding layer 50, and a protrusion height of the first molding layer 50 relative to the first surface 11 is L, where M > L. That is, the chip 20 is connected to the substrate by plastic molding.

Alternatively, the chip 20 may be a flip chip, i.e. it may be flip-chip bonded to the substrate 10 via a connection layer, which may be solder paste or heat dissipation glue.

It should be understood that the passive device 30 may be connected to the substrate 10 by surface mounting, i.e. may be soldered on the substrate 10 by a connection layer, which may be solder paste or heat dissipation glue.

In a possible implementation, the substrate is provided with a first recess on the first surface 11, the chip 20 being arranged inside the first recess, the ball-shaped pins 40 being arranged outside the first recess.

It should be understood that the passive device 30 includes an inductor. As shown in fig. 3, the inductor is a complete independent device and is soldered on the substrate 10 by surface mounting. The inductor is a component capable of converting electric energy into magnetic energy and storing the magnetic energy, and may be called as an inductor, an inductive element, a choke, a reactor, a dynamic reactor, or other names.

Optionally, the surface of the inductor is provided with a heat dissipation layer 70, which may be a metal layer or a heat sink or the like for facilitating heat dissipation.

It should be understood that the number and type of the passive devices 30 shown in the drawings are only for convenience of description, and the number and type of the passive devices 30 are not limited thereto, and the passive devices 30 may also be resistors, capacitors, inductors, converters, faders, and other passive devices that can be used in the power module and are conceivable by those skilled in the art, and the number of the passive devices may also be one or more, and the present application does not limit the present application.

Optionally, a metal layer 60 is sputtered on the surface of the first molding compound layer 50, and the metal layer is beneficial to enhancing the heat dissipation capability of the chip.

It should understand, power module's main heat source is at the chip, and the temperature of chip has apparent influence to power module's performance to, according to the scheme that this application embodiment provided, with thin chip plastic envelope at the base plate second surface, make full use of the space of base plate, the supplementary heat dissipation of chip surface sputter metal level, through tin cream or heat dissipation glue and base plate welding, promoted power module's heat-sinking capability, effectively promote the efficiency of chip.

As shown in fig. 4, the power module includes a substrate 10, a chip 20, a passive device 30, and ball pins 40.

The substrate includes a first surface 11 and a second surface 12 which are oppositely disposed, a spherical pin 40 is disposed on the first surface, and the spherical pin 40 is an Input/Output (I/O) terminal of a power module of the BGA package.

Wherein the chip is arranged on the first surface 11 and the at least one passive component 30 is arranged on the second surface 12.

The chip is composed of a MOSFET, is a DC/DC voltage converter and plays a role in DC/DC voltage conversion.

The height of the protrusion of the ball-shaped pin relative to the first surface is M, the height of the protrusion of the chip relative to the first surface is N, M is larger than N, namely the lower surface of the chip does not exceed the lower surface of the ball-shaped pin.

In a possible implementation manner, a first molding compound layer 50 is disposed on the first surface 11, the chip 20 is disposed in the first molding compound layer 50, and a protrusion height of the first molding compound layer 50 relative to the first surface 11 is L, where M > L. That is, the chip 20 is connected to the substrate by plastic molding.

Alternatively, the chip 20 may be a flip chip, i.e., may be flip chip bonded to the substrate 10.

It should be understood that the passive device 30 may be connected to the substrate 10 by surface mounting, i.e. may be soldered on the substrate 10 by a connection layer, which may be solder paste or heat dissipation glue.

In a possible implementation, the substrate is provided with a first recess on the first surface 11, the chip 20 being arranged inside the first recess, the ball-shaped pins 40 being arranged outside the first recess.

It should be understood that the passive device 30 includes an inductor.

Optionally, the passive device 30 includes an inductance component, and the inductance component forms an inductance on the substrate through plastic package. As shown in fig. 4, a part of the inductor component is soldered on the substrate 10 and is connected to the substrate 10 by means of plastic encapsulation, so as to form a plastic encapsulated inductor. The inductor forming device can be a framework, a winding, a shielding case, a packaging material, a magnetic core or an iron core and other components capable of forming an inductor.

Optionally, the surface of the inductor is provided with a heat dissipation layer 70, which may be a metal layer or a heat sink or the like for facilitating heat dissipation.

It should be understood that by plastically attaching the inductance component to the second surface of the substrate, the overall height of the module may be reduced.

It should be understood that the number and type of the passive devices 30 are shown in the figures for convenience of illustration only, and the number and type are not limited thereto, and the passive devices 30 may be resistors, capacitors, inductors, converters, graders, and other passive devices that can be used in the power module and are conceivable by those skilled in the art, and the number of the passive devices may also be one or more, and the present application is not limited thereto.

Optionally, a metal layer 60 is sputtered on the surface of the first molding compound layer 50, and the metal layer is beneficial to enhancing the heat dissipation capability of the chip.

According to the embodiment provided by the application, the chip is placed on the surface of the substrate, the metal layer is sputtered on the back surface of the chip, and the chip is connected with the substrate through the solder paste or the heat dissipation glue, so that the heat dissipation capacity is improved; the whole module achieves extremely miniaturization through a thin chip and an inductor plastic package process.

Any one of the power modules provided in the embodiments of the present application may be applied to an electronic device, where the electronic device may further include: the power supply module comprises a shell and a circuit board arranged in the shell, wherein the power supply module can be arranged on the circuit board. Because the principle of the electronic device for solving the problems is similar to that of the power module, the implementation of the electronic device can refer to the implementation of the power module, and repeated details are not repeated.

It should be understood that the electronic device is any device requiring voltage conversion, and may be applied to electronic devices such as a smart phone, a wireless router, a smart tv set-top box, a Personal Computer (PC), a wearable device, and a smart broadband. The power supply modules presented in the embodiments of the present application are intended to include, but not be limited to, applications in these and any other suitable types of electronic devices.

It is to be understood that the different embodiments may be used independently or in combination based on certain intrinsic or extrinsic relationships, and that different implementations of the embodiments may be used independently or in combination.

The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words used in this application to describe positions and orientations are provided by way of example in the drawings and can be changed as desired and are intended to be encompassed by the present application. The drawings of the present application are for illustrating relative positional relationships only and do not represent true scale.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A power module, comprising:

a substrate including a first surface and a second surface disposed opposite to each other;

the chip is used for realizing DC/DC voltage conversion of the power supply module and is arranged on the first surface;

at least one passive device for performing output processing on the DC/DC conversion voltage, disposed on the second surface;

a ball pin for connecting an electronic device, the electronic device performing voltage conversion through a power supply module, the ball pin being disposed on the first surface,

the height of the protruding part of the ball-shaped pin relative to the first surface is M, the height of the protruding part of the chip relative to the first surface is N, and M is larger than N.

2. The power module of claim 1, wherein a first plastic encapsulation layer is disposed on the first surface, the chip is disposed in the first plastic encapsulation layer, a protrusion height of the first plastic encapsulation layer relative to the first surface is L, and M > L.

3. The power supply module according to claim 1 or 2, wherein the chip is a flip chip.

4. A power supply module according to any one of claims 1 to 3, wherein the substrate is provided with a first recess on the first surface;

the chip is disposed in the first recess, and the ball leads are disposed outside the first recess.

5. The power supply module of any one of claims 1 to 4, wherein the at least one passive device comprises an inductor.

6. The power module of any one of claims 1-4, wherein the at least one passive device comprises an inductor component, and the inductor component forms an inductor on the substrate in a plastic package manner.

7. An electronic device comprising a housing, a circuit board disposed within the housing, and a power module disposed on the circuit board, wherein the power module comprises:

the substrate comprises a first surface and a second surface which are oppositely arranged;

the chip is used for realizing DC/DC voltage conversion of the power supply module and is arranged on the first surface;

at least one passive device for performing output processing on the DC/DC conversion voltage, disposed on the second surface;

a ball-shaped pin for connecting an electronic device, the electronic device performing voltage conversion through a power supply module, the ball-shaped pin being disposed on the first surface,

the protruding height of the spherical pins relative to the first surface is M, the protruding height of the chip relative to the first surface is N, and M is greater than N.

8. The electronic device according to claim 7, wherein the power module is provided with a first plastic package layer on the first surface, the chip is disposed in the first plastic package layer, a protrusion height of the first plastic package layer relative to the first surface is L, and M > L.

9. The electronic device according to claim 7 or 8, wherein the chip in the power supply module is a flip chip.

10. The electronic device according to any one of claims 7 to 9, wherein the substrate is provided with a first concave portion on the first surface;

the chip is disposed in the first recess, and the ball leads are disposed outside the first recess.

11. The electronic device of any of claims 7-10, wherein the at least one passive component comprises an inductor.

12. The electronic device according to any one of claims 7 to 10, wherein the at least one passive component comprises an inductor component, and the inductor component forms an inductor on the substrate in a plastic package manner.

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