CN115312433A - Combined wafer boat structure - Google Patents
Combined wafer boat structure Download PDFInfo
- Publication number
- CN115312433A CN115312433A CN202110490026.9A CN202110490026A CN115312433A CN 115312433 A CN115312433 A CN 115312433A CN 202110490026 A CN202110490026 A CN 202110490026A CN 115312433 A CN115312433 A CN 115312433A
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- supporting plates
- boat structure
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- 235000012431 wafers Nutrition 0.000 claims abstract description 80
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a combined wafer boat structure, which comprises a first frame, a second frame, two first supporting plates and two second supporting plates. Wherein the second frame is disposed opposite to the first frame. The two first supporting plates and the two second supporting plates are respectively clamped between the first frame and the second frame through a plurality of connecting rods. The two first supporting plates and the two second supporting plates are combined and penetrated by a plurality of connecting rods, a plurality of grooves are respectively arranged on the two first supporting plates and the two second supporting plates, and the grooves are respectively provided with a triangular cross section so as to correspondingly accommodate a plurality of wafers with specific sizes and specific warping degrees, thereby reducing the purchase demand of the wafer boat with special sizes and reducing the manufacturing cost of the wafers.
Description
Technical Field
The invention relates to a wafer boat structure; more particularly, the present invention relates to a combined boat structure.
Background
In recent years, due to the evolution of wafer technology, the process complexity is increased, which causes the wafer to change in parameters such as thickness and warpage after processing, and form various shapes and sizes. As a result, the typical fixed-size wafer boat cannot smoothly carry the special wafers with a specific thickness or warpage, and the manufacturer must purchase additional wafers with other sizes and shapes of trenches. And the more kinds of wafers with special sizes, the more cassettes that need to be purchased correspondingly, which adds a lot of burden to the manufacturing cost.
In view of the above, it is an urgent need in the art to provide a combined boat structure that can be disassembled and assembled according to different wafer accommodation requirements, so as to be able to carry special wafers with different thicknesses and warping degrees.
Disclosure of Invention
An objective of the present invention is to provide a combined boat structure, which can be disassembled and assembled according to different accommodation requirements to carry special wafers with different thicknesses and warping degrees, thereby reducing the purchase requirements of boats with special sizes and reducing the manufacturing cost of wafers.
To achieve the above object, the present invention discloses a combined wafer boat structure for accommodating a plurality of wafers with a specific size and a specific warpage, comprising:
the first frame and the second frame are arranged opposite to the first frame; and
two first supporting plates and two second supporting plates, which are respectively clamped between the first frame and the second frame through a plurality of connecting rods;
wherein, the two first supporting plates and the two second supporting plates are assembled and penetrated by a plurality of connecting rods, a plurality of grooves are respectively arranged on the two first supporting plates and the two second supporting plates, and each groove has a triangular cross section to correspondingly accommodate a plurality of wafers with specific dimensions and specific warping degrees.
In the assembled boat structure of the present invention, each of the plurality of grooves has a groove width for accommodating a plurality of wafers having a specific dimension and a specific warpage.
In the assembled boat structure of the present invention, the width of the trench is 2 mm.
In the assembled boat structure of the present invention, the width of the trench is 4 mm.
In the assembled boat structure of the present invention, the width of the trench is 6 mm.
In the assembled boat structure of the present invention, a trench space is formed between two adjacent trenches of the plurality of trenches to accommodate a plurality of wafers having a specific dimension and a specific warpage.
In the assembled boat structure of the present invention, the distance between the trenches is 10 mm.
In the assembled boat structure of the present invention, the distance between the trenches is 20 mm.
In the assembled boat structure of the present invention, the distance between the trenches is 6.35 mm.
In the assembled boat structure of the present invention, the distance between the trenches is 12.7 mm.
Drawings
FIG. 1 is a perspective view of the assembled boat structure of the present invention.
FIG. 2 is an exploded view of the assembled boat structure of the present invention.
FIG. 3 is a cross-sectional view of a plurality of grooves formed on a second support plate when wafers are mounted thereon in the assembled boat structure of the present invention.
Detailed Description
Hereinafter, specific examples for implementing the technical idea of the present invention will be described in detail with reference to the accompanying drawings.
The present invention relates to a combined wafer boat structure, which can be used to accommodate a plurality of wafers with specific size, specific thickness and specific warpage.
Referring to fig. 1, the assembled boat structure 100 of the present invention includes a first frame 200, a second frame 300, two first support plates 400, and two second support plates 500.
Referring to fig. 2, the second frame 300 is disposed opposite to the first frame 200, and the first support plate 400 and the second support plate 500 are respectively sandwiched between the first frame 200 and the second frame 300 through a plurality of connecting rods 600. Wherein, the two first supporting plates 400 and the two second supporting plates 500 are assembled and penetrated by the plurality of connecting rods 600, and the two first supporting plates 400 and the two second supporting plates 500 are respectively provided with a plurality of grooves 700 for correspondingly accommodating a plurality of wafers 800 with specific dimensions and specific warping degrees.
It should be noted that, when receiving a plurality of wafers 800 with a specific size and a specific warpage, the plurality of grooves 700 on the first support plate 400 and the second support plate 500 have the same number of grooves, width of grooves, and distance between grooves.
In addition, since the two first support plates 400 and the two second support plates 500 are clamped between the first frame 200 and the second frame 300 through the combination of the plurality of connecting rods 600 (e.g., screw-fastening), when a plurality of wafers 800 with other sizes and warpage are to be accommodated, the first support plates 400 and the second support plates 500 can be easily replaced by a simple disassembling step (e.g., rotating to remove the screws), so as to select the corresponding grooves 700 for accommodating the wafers 800.
As shown in fig. 3, in the assembled boat structure 100 of the present invention, the plurality of grooves 700 included in the second support plate 500 (or the first support plate 400) each have a triangular cross section TS, and a groove width W is provided between the plurality of grooves 700 for accommodating a plurality of wafers 800 having a specific size and a specific warpage.
For example, when the wafer 800 is a wafer with a diameter of 300 mm (mm) or 200 mm and the warpage of the wafer (i.e., the degree of bending of the central portion of the wafer in the height direction when the wafer is horizontally disposed) is 1-2 mm, the width W of the trench can be 2 mm. Since the trench width W is greater than or equal to the warpage of the wafer, the wafers 800 disposed adjacent to each other will have enough space in the process of transportation, thereby ensuring that the wafers 800 will not collide and be damaged while being accommodated in the trenches 700.
When the accommodated wafer 800 is a wafer with a diameter of 300 mm or 200 mm and the warpage of the wafer is 2-3 mm, the width W of the trench can be 4 mm; when the accommodated wafer 800 is a wafer with a diameter of 300 mm or 200 mm and the warpage of the wafer is 3.0-3.5 mm or more than 3.5 mm, the trench width W can be 6 mm. The above arrangement can ensure that the width W of the groove is greater than or equal to the warpage of the wafers, so that the wafers 800 are spaced by a certain gap during the period of being accommodated in the grooves 700, and the wafers 800 are not damaged by collision.
Referring to fig. 3 again, in another embodiment of the assembled boat structure of the present invention, each of the plurality of grooves 700 has a triangular cross section TS, and a groove pitch P is provided between two adjacent grooves 700 of the plurality of grooves 700, so as to accommodate a plurality of wafers 800 having a specific size and a specific warpage.
For example, when the accommodated wafer 800 is a wafer with a diameter of 300 mm and the warpage of the wafer is between 1-2 and 2-3 mm, the pitch P between the trenches can be 10 mm. When the warpage of the wafer is greater than 3.5 mm, the trench pitch P can be 20 mm. Because the pitch P of the grooves is much larger than the warp degree of the wafers, the wafers 800 disposed adjacent to each other will have enough space in the process of transportation, so as to ensure that a certain gap is formed between the wafers 800 when the wafers are accommodated in the grooves 700, and the wafers 800 will not collide and be damaged.
In another embodiment, when the accommodated wafer 800 is a wafer with a diameter of 200 mm and the warpage of the wafer is between 1-2 and 2-3 mm, the groove pitch P can be 6.35 mm. When the accommodated wafer 800 is a wafer with a diameter of 200 mm and the warpage of the wafer is greater than 3.5 mm, the trench pitch P can be made 12.7 mm. Similarly, since the pitch P of the grooves is greater than the warpage of the wafers, the wafers 800 disposed adjacent to each other will have enough space during the transportation process, and a certain gap is ensured between the wafers 800 while the wafers 800 are accommodated in the grooves 700, so that the wafers 800 will not be damaged due to collision.
It should be noted that the triangular cross section TS refers to the triangular cross section TS of the trench 700 when the modular boat structure 100 stores a plurality of wafers 800 in the horizontal direction. Wherein a long side of the triangular cross section TS is used to contact and support a periphery of the wafer 800, and a hypotenuse of the triangular cross section TS is located at a lower side of the periphery of the wafer 800. This arrangement of the wafer 800 ensures that the wafer 800 is stably placed in or out of the groove 700 by a robot (not shown), thereby effectively suppressing the wafer 800 from tilting.
In summary, the first frame 200, the second frame 300, the first support plate 400 and the second support plate 500 of the assembled boat structure of the present invention can be disassembled and assembled rapidly through the plurality of connecting rods 600, so as to meet the process requirement of special wafers, save the process preparation time, and thereby reduce the additional purchase cost of various boats and save the material cost. Moreover, only the first support plate 400 and the second support plate 500 need to be replaced, so that the flexibility of the wafer boat in the manufacturing process can be increased, the damage to the wafer with special size and shape can be avoided, and the yield of the manufacturing process can be increased. In addition, the combined boat structure of the present invention can make 8-inch and 12-inch boats have a shared design (i.e. 8-inch boat can be installed inside 12-inch boat), thereby increasing the flexibility of the application of the apparatus.
Although examples of the present invention have been described with respect to specific embodiments, they are merely examples, and the present invention is not limited thereto, and should be construed to have the broadest scope within the technical spirit disclosed in the present specification. Those skilled in the art may implement the invention in forms not described in the embodiments of the invention by combining or substituting the disclosed embodiments, but it does not depart from the scope of the invention. In addition, it is apparent that one skilled in the art can change or modify the disclosed embodiments based on the present specification, and thus, such changes or modifications fall within the scope of the present invention.
Claims (10)
1. A kind of combined boat structure, which is characterized in that it accommodates plural wafers with specific size and specific warpage, includes:
the first frame and the second frame are arranged opposite to the first frame; and
two first supporting plates and two second supporting plates, which are respectively clamped between the first frame and the second frame through a plurality of connecting rods;
wherein the two first supporting plates and the two second supporting plates are assembled and penetrated by the connecting rods, the two first supporting plates and the two second supporting plates are respectively provided with a plurality of grooves, and the plurality of grooves respectively have a triangular cross section so as to correspondingly accommodate the plurality of wafers with specific dimensions and specific warping degrees.
2. The modular boat structure of claim 1, wherein each of the plurality of slots has a slot width for accommodating the plurality of wafers having a specific size and a specific warpage.
3. The modular boat structure of claim 2, wherein the trench width is 2 mm.
4. The modular boat structure of claim 2, wherein the trench width is 4 mm.
5. The modular boat structure of claim 2, wherein the trench width is 6 mm.
6. The assembled boat structure of claim 1, wherein a trench spacing is provided between two adjacent trenches of the plurality of trenches for accommodating the plurality of wafers having a specific dimension and a specific warpage.
7. The modular boat structure of claim 6, wherein the trench pitch is 10 mm.
8. The modular boat structure of claim 6, wherein the trench pitch is 20 mm.
9. The modular boat structure of claim 6, wherein the trench pitch is 6.35 mm.
10. The modular boat structure of claim 6, wherein the trench pitch is 12.7 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110490026.9A CN115312433A (en) | 2021-05-06 | 2021-05-06 | Combined wafer boat structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110490026.9A CN115312433A (en) | 2021-05-06 | 2021-05-06 | Combined wafer boat structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115312433A true CN115312433A (en) | 2022-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110490026.9A Pending CN115312433A (en) | 2021-05-06 | 2021-05-06 | Combined wafer boat structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115312433A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09251961A (en) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | Heat-treating boat |
| US6110285A (en) * | 1997-04-15 | 2000-08-29 | Toshiba Ceramics Co., Ltd. | Vertical wafer boat |
| JP2002076108A (en) * | 2000-09-04 | 2002-03-15 | Nitto Denko Corp | Wafer cassette and method for containing wafer |
| JP2003332253A (en) * | 2002-05-15 | 2003-11-21 | Toshiba Ceramics Co Ltd | Vertical wafer boat |
| CN203445104U (en) * | 2013-09-09 | 2014-02-19 | 中芯国际集成电路制造(北京)有限公司 | Wafer support |
| TWI550758B (en) * | 2015-04-02 | 2016-09-21 | Wafer box | |
| TWM575187U (en) * | 2018-10-19 | 2019-03-01 | 辛耘企業股份有限公司 | Wafer cassette |
| TWI694872B (en) * | 2019-01-18 | 2020-06-01 | 弘塑科技股份有限公司 | Batch substrate drying equipment and substrate drying air blade device thereof |
| JP2020205384A (en) * | 2019-06-19 | 2020-12-24 | クアーズテック株式会社 | Vertical wafer boat and manufacturing method thereof |
| CN214956793U (en) * | 2021-05-06 | 2021-11-30 | 弘塑科技股份有限公司 | Combined wafer boat structure |
-
2021
- 2021-05-06 CN CN202110490026.9A patent/CN115312433A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09251961A (en) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | Heat-treating boat |
| US6110285A (en) * | 1997-04-15 | 2000-08-29 | Toshiba Ceramics Co., Ltd. | Vertical wafer boat |
| JP2002076108A (en) * | 2000-09-04 | 2002-03-15 | Nitto Denko Corp | Wafer cassette and method for containing wafer |
| JP2003332253A (en) * | 2002-05-15 | 2003-11-21 | Toshiba Ceramics Co Ltd | Vertical wafer boat |
| CN203445104U (en) * | 2013-09-09 | 2014-02-19 | 中芯国际集成电路制造(北京)有限公司 | Wafer support |
| TWI550758B (en) * | 2015-04-02 | 2016-09-21 | Wafer box | |
| TWM575187U (en) * | 2018-10-19 | 2019-03-01 | 辛耘企業股份有限公司 | Wafer cassette |
| TWI694872B (en) * | 2019-01-18 | 2020-06-01 | 弘塑科技股份有限公司 | Batch substrate drying equipment and substrate drying air blade device thereof |
| JP2020205384A (en) * | 2019-06-19 | 2020-12-24 | クアーズテック株式会社 | Vertical wafer boat and manufacturing method thereof |
| CN214956793U (en) * | 2021-05-06 | 2021-11-30 | 弘塑科技股份有限公司 | Combined wafer boat structure |
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