CN114918525A - Target material cooling back plate and welding method thereof - Google Patents
Target material cooling back plate and welding method thereof Download PDFInfo
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- CN114918525A CN114918525A CN202210579714.7A CN202210579714A CN114918525A CN 114918525 A CN114918525 A CN 114918525A CN 202210579714 A CN202210579714 A CN 202210579714A CN 114918525 A CN114918525 A CN 114918525A
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- 238000003466 welding Methods 0.000 title claims abstract description 164
- 238000001816 cooling Methods 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000013077 target material Substances 0.000 title claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 79
- 239000007787 solid Substances 0.000 claims abstract description 62
- 238000001513 hot isostatic pressing Methods 0.000 claims abstract description 37
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 32
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 32
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 238000005554 pickling Methods 0.000 claims description 29
- 239000003153 chemical reaction reagent Substances 0.000 claims description 21
- 229910000838 Al alloy Inorganic materials 0.000 claims description 18
- 238000011049 filling Methods 0.000 claims description 17
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 16
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 16
- 229910052786 argon Inorganic materials 0.000 claims description 16
- 229910017604 nitric acid Inorganic materials 0.000 claims description 16
- 239000011780 sodium chloride Substances 0.000 claims description 16
- 235000002639 sodium chloride Nutrition 0.000 claims description 16
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 10
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 10
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 9
- 235000011152 sodium sulphate Nutrition 0.000 claims description 9
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 8
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 8
- 235000011147 magnesium chloride Nutrition 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000001103 potassium chloride Substances 0.000 claims description 7
- 235000011164 potassium chloride Nutrition 0.000 claims description 7
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 7
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 7
- 235000011151 potassium sulphates Nutrition 0.000 claims description 7
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 claims description 5
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 5
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000012797 qualification Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 235000010344 sodium nitrate Nutrition 0.000 description 5
- 239000004317 sodium nitrate Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/12—Light metals
- C23G1/125—Light metals aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a target material cooling back plate and a welding method thereof, wherein solid particles are filled in a water channel of a back plate bottom plate and then are fixed with a back plate cover plate to obtain a component to be welded; performing hot isostatic pressing welding on the components to be welded to obtain a semi-finished target cooling back plate; and removing solid particles in the semi-finished target cooling back plate to obtain the target cooling back plate. According to the invention, solid particles are filled in the water channel of the back plate, so that the water channel deformation caused by hot isostatic pressing welding is avoided, and the problem of water channel leakage is further avoided; meanwhile, the welding strength and the welding bonding rate are higher; and the welding method is simple and convenient to operate and easy to popularize and use on a large scale.
Description
Technical Field
The invention belongs to the field of target manufacturing, and particularly relates to a target cooling back plate and a welding method thereof.
Background
The back plate is mainly used for bearing the sputtering objects and is fixed on the equipment machine table, so that the sputtering objects are prevented from being fixed, the sputtering objects are only required to be welded on the back plate, and the processing hole positions on the back plate are fixed on the equipment machine table. Because the sputtering object is bombarded to cause the temperature of the sputtering object to rise in the sputtering process, in order to achieve the effect of reducing the temperature, a water channel needs to be designed on the back plate, and the water is introduced into the water channel of the back plate in the sputtering process to achieve the effect of cooling the sputtering object. Generally, a water channel groove is designed on a back plate, and then a cover plate is placed in the water channel groove to complete the design of a back plate water channel through a welding technology.
Generally, the cooling of the sputtering target is an important influence factor of the sputtering process, and many target backing plates are designed with a water channel structure to enhance the cooling effect. Poor water channel quality can influence the cooling effect, and then influence sputter film quality, arouse the warning of sputter board, probably damage the board when serious.
CN113667945A discloses a preparation method of an oxygen-free copper back plate with a water channel, which comprises the following steps: carrying out first thermal annealing treatment on the blank, and carrying out rough milling treatment after shaping a first product to obtain a bottom plate; carrying out second thermal annealing treatment on the blank, and carrying out first finish milling treatment after shaping a second product to obtain a cover plate; assembling the bottom plate and the cover plate and then welding; after the second finish milling treatment, detecting the tightness of the water channel to obtain the oxygen-free copper back plate with the water channel; the method for welding the backboard with the water channel in the method is silver wax welding.
CN112372165A a welding method for target cooling backing plates, said welding method comprising the following steps: (1) machining the cover plate and the base, wherein the machined base comprises a cooling water channel; (2) contacting the cover plate machined in the step (1) with the cooling water channel, assembling the cover plate and the base, and then performing vacuum brazing to obtain a crude product of the target cooling back plate; (3) and (3) performing friction stir welding on the welding seam of the crude product of the target cooling back plate in the step (2) to obtain the target cooling back plate. The method adopts a composite welding form of vacuum brazing and friction stir welding.
The method adopts a welding method of vacuum brazing, the method has high requirements on selection and use of brazing filler metal, assembly and placement of workpieces and the like, the total welding qualification rate is low, and the condition of water channel leakage caused by the fact that the welding surface is not welded is often generated.
CN107662045A discloses a manufacturing method of an aluminum alloy product, comprising: providing a first aluminum alloy plate and a second aluminum alloy plate, wherein the surface to be welded of the first aluminum alloy plate is a first welding surface, and the surface to be welded of the second aluminum alloy plate is a second welding surface; the first welding surface is a plane, and a groove is formed in the second welding surface; or the first welding surface and the second welding surface are provided with grooves; the first welding surface and the second welding surface are oppositely arranged and attached, and a water channel structure surrounded by grooves is formed between the first welding surface and the second welding surface so as to form an initial aluminum alloy product; loading the initial aluminum alloy product into a sheath, degassing the sheath to form a vacuum sheath, and then performing a hot isostatic pressing process on the initial aluminum alloy product; and removing the vacuum sheath to obtain the aluminum alloy product. The method adopts the hot isostatic pressing technology with the temperature of 530 ℃ and 630 ℃ and the pressure of 4-10MPa to weld the aluminum alloy product with the water channel, the process temperature is close to the melting point of the material, the influence on the structure performance of the material is large, the welding bonding strength is not high, and the water channel is easy to deform.
In summary, there is a need to develop an effective welding method for a target cooling backing plate, which can not only ensure the welding bonding rate and avoid the leakage problem and the deformation problem of the backing plate of the cooling water channel, but also reduce the production cost and facilitate large-scale popularization and use.
Disclosure of Invention
The invention aims to provide a target material cooling back plate and a welding method thereof, wherein solid particles are filled in a water channel of a back plate bottom plate and then are fixed with a back plate cover plate to obtain a component to be welded; performing hot isostatic pressing welding on the components to be welded to obtain a semi-finished target cooling back plate; and removing solid particles in the semi-finished target cooling back plate to obtain the target cooling back plate. According to the invention, solid particles are filled in the water channel of the back plate, so that the water channel deformation caused by hot isostatic pressing welding is avoided, and the problem of water channel leakage is further avoided; meanwhile, the welding strength and the welding bonding rate are higher; and the welding method is simple and convenient to operate and easy to popularize and use on a large scale.
In order to achieve the purpose, the invention adopts the following technical scheme:
one of the purposes of the invention is to provide a welding method of a target cooling back plate, which comprises the following steps:
(1) after solid particles are filled in the water channel of the back plate bottom plate, the back plate bottom plate and the back plate cover plate are fixed to obtain a component to be welded;
(2) performing hot isostatic pressing welding on the components to be welded in the step (1) to obtain a semi-finished target cooling back plate;
(3) and (3) removing solid particles in the semi-finished target cooling back plate in the step (2) to obtain the target cooling back plate.
According to the invention, the target material cooling back plate is prepared by a hot isostatic pressing welding method, and solid particles are filled in the water channel of the back plate, so that the water channel deformation caused by hot isostatic pressing welding is avoided, and further, the problem of water channel leakage is avoided; meanwhile, the welding strength and the welding bonding rate are higher; and the welding method is simple and convenient to operate and easy to popularize and use on a large scale.
As a preferable technical scheme of the invention, the backboard soleplate and the backboard cover plate in the step (1) are both made of aluminum alloy.
Preferably, the edge of the water channel of the bottom plate of the back plate in the step (1) is provided with a groove.
Preferably, the back plate cover plate in the step (1) is provided with a joint which is matched with the groove.
It is worth mentioning that, during hot isostatic pressing welding, the water channel is easy to deform at a high temperature, the water channel and the solid particles are mutually extruded during deformation, the solid particles are crushed under extrusion, the particle size is reduced, and a small part of crushed particles may enter the surfaces to be welded of the backboard base plate and the backboard cover plate, so that the welding effect is influenced; in order to avoid the situation, a groove is arranged at the edge of the water channel of the back plate bottom plate, and a joint is arranged on the back plate cover plate and matched with the groove, so that solid particles are limited in the water channel, and broken particles are prevented from entering the surface to be welded.
As a preferred embodiment of the present invention, before the filling of the solid particles in step (1), the back plate bottom plate and the back plate cover plate are pickled.
Preferably, the solutes of the pickling reagent used for pickling include nitric acid and hydrofluoric acid, and the solvent includes water.
Preferably, the molar ratio of nitric acid to hydrofluoric acid in the pickling agent is (1-2):1:5, and may be, for example, 1:1:5, 1.1:1:5, 1.2:1:5, 1.3:1:5, 1.4:1:5, 1.5:1:5, 1.6:1:5, 1.7:1:5, 1.8:1:5, 1.9:1:5, 2:1:5, etc., but is not limited to the enumerated values, and other values not enumerated within the above-mentioned range of values are equally applicable.
Preferably, the time for the acid washing is 5-8min, such as 5min, 5.2min, 5.5min, 5.8min, 6min, 6.3min, 6.6min, 7min, 7.3min, 7.5min, 7.7min, 8min, etc., but is not limited to the recited values, and other values not recited in the above numerical range are also applicable.
As a preferable technical scheme of the invention, the solid particles in the step (1) are soluble solid particles.
It is worth to say that the water channel is filled with soluble solid particles, and after welding is finished, the soluble solid particles can be removed through simple water washing, the soluble solid particles cannot remain in the water channel, and the cleaning method is simple.
Preferably, the soluble solid particles comprise inorganic salt particles.
Preferably, the soluble solid particles have a melting point of 500 ℃ or higher, such as 500 ℃, 510 ℃, 520 ℃, 530 ℃, 560 ℃, 580 ℃, 600 ℃, 650 ℃, 700 ℃, 800 ℃, 900 ℃, 1000 ℃, 1100 ℃, etc., but are not limited to the recited values, and other values not recited within the above range of values are equally applicable.
It is worth to be noted that the melting point of the soluble solid particles is larger than or equal to 500 ℃, if the melting point of the soluble solid particles is too low, the solid particles are melted in the hot isostatic pressing welding process, the shape of the water channel cannot be supported, and the effect of preventing the water channel from deforming cannot be achieved.
Preferably, the inorganic salt particles include any one of sodium chloride, sodium sulfate, potassium chloride, potassium sulfate, magnesium chloride, magnesium sulfate, or aluminum sulfate or a combination of at least two thereof, typical but non-limiting examples of which include a combination of sodium chloride and sodium sulfate, a combination of sodium chloride and potassium chloride, a combination of sodium chloride and potassium sulfate, a combination of sodium chloride and magnesium chloride, a combination of sodium chloride and magnesium sulfate, a combination of sodium sulfate and potassium chloride, a combination of sodium sulfate and potassium sulfate, a combination of potassium chloride and magnesium chloride, a combination of potassium sulfate and magnesium chloride, and a combination of magnesium chloride and aluminum sulfate.
As a preferred embodiment of the present invention, the solid particles in the step (1) have a particle size of 0.2 to 0.5mm, for example, 0.2mm, 0.22mm, 0.25mm, 0.28mm, 0.3mm, 0.33mm, 0.36mm, 0.39mm, 0.42mm, 0.45mm, 0.47mm, 0.5mm, etc., but the particle size is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, in step (1), the filling height of the solid particles is less than the height of the water channel in the backboard soleplate.
As a preferable technical scheme of the invention, the fixing mode in the step (1) is argon arc welding spot welding.
It is worth to be noted that, the fixing mode in the step (1) is argon arc welding spot welding, and the specific operation mode is as follows: and performing spot welding at the junction of the back plate bottom plate and the back plate cover plate along the edge of the back plate, thereby completing the fixation.
Preferably, in the assembly to be welded in step (1), the gap between the back plate bottom plate and the back plate cover plate is less than 0.2mm, and may be, for example, 0.02mm, 0.04mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.19mm, etc., but is not limited to the values listed, and other values not listed in the above range of values are also applicable.
It is worth to say that the gap between the back plate bottom plate and the back plate cover plate is controlled to be less than 0.2mm, so that solid particles of 0.2-0.5mm can be prevented from entering a surface to be welded to influence the welding effect.
As a preferable technical scheme of the invention, before the hot isostatic pressing welding in the step (2), the water channel in the component to be welded in the step (1) is filled with the solid particles, and the inlet and the outlet of the water channel are sealed.
Preferably, the closing mode is as follows: aluminum sheets are welded at the inlet and the outlet of the water channel through argon arc welding.
In a preferred embodiment of the present invention, the pressure of the hot isostatic pressing welding in step (2) is 150-200MPa, and may be, for example, 150MPa, 155MPa, 160MPa, 165MPa, 170MPa, 175MPa, 180MPa, 185MPa, 190MPa, 200MPa, etc., but the pressure is not limited to the above-mentioned values, and other values not listed in the above-mentioned value range are also applicable.
Preferably, the temperature of the hot isostatic pressing welding in the step (2) is 300-450 ℃, for example, 300 ℃, 320 ℃, 340 ℃, 350 ℃, 360 ℃, 380 ℃, 400 ℃, 410 ℃, 430 ℃, 450 ℃ and the like, but is not limited to the values listed, and other values not listed in the above range are also applicable.
Preferably, the hot isostatic pressing welding in step (2) is performed for 2-5h, such as 2h, 2.2h, 2.5h, 2.8h, 3h, 3.3h, 3.5h, 3.8h, 4h, 4.2h, 4.4h, 4.7h, 5h, etc., but not limited to the recited values, and other values not recited in the above range of values are also applicable.
As a preferable technical scheme of the invention, before the cleaning in the step (3), aluminum sheets at the inlet and the outlet of the water channel in the semi-finished target cooling backboard in the step (2) are removed.
Preferably, the clearing in step (3) is performed by: and placing the semi-finished target cooling back plate in cleaning solution for ultrasonic cleaning.
Preferably, the cleaning liquid comprises water.
Preferably, the temperature of the ultrasonic cleaning is 80 ℃ or higher, for example, 80 ℃, 82 ℃, 85 ℃, 88 ℃, 90 ℃, 93 ℃, 95 ℃, 97 ℃, 100 ℃ or the like, but is not limited to the recited values, and other values not recited in the above numerical range are also applicable.
As a preferable technical scheme of the invention, the welding method comprises the following steps:
(1) pickling the back plate bottom plate and the back plate cover plate in a pickling reagent for 5-8min, wherein solutes of the pickling reagent comprise nitric acid and hydrofluoric acid, and a solvent comprises water; the molar ratio of nitric acid to hydrofluoric acid in the pickling reagent is (1-2) to 1: 5; after soluble solid particles with the particle size of 0.2-0.5mm and the melting point of more than or equal to 500 ℃ are filled in the water channel of the back plate bottom plate, the filling height of the solid particles is controlled to be smaller than the height of the water channel in the back plate bottom plate; fixing the backboard base plate and the backboard cover plate through argon arc welding spot welding to obtain a component to be welded, and controlling the gap between the backboard base plate and the backboard cover plate in the component to be welded to be less than 0.2 mm;
the backboard bottom plate and the backboard cover plate are both made of aluminum alloy; the edge of the water channel of the backboard bottom plate is provided with a groove; the back plate cover plate is provided with a joint which is matched with the groove; the soluble solid particles comprise inorganic salt particles; the inorganic salt particles comprise any one or the combination of at least two of sodium chloride, sodium sulfate, potassium chloride, potassium sulfate, magnesium chloride, magnesium sulfate or aluminum sulfate;
(2) filling the water channel in the component to be welded in the step (1) with the soluble solid particles, and welding aluminum sheets at the inlet and the outlet of the water channel by argon arc welding to seal the water channel; then, performing hot isostatic pressing welding on the assembly to be welded at the temperature of 150-;
(3) removing aluminum sheets at the inlet and the outlet of the water channel in the semi-finished target cooling back plate in the step (2); and then, placing the semi-finished target cooling back plate in water, and carrying out ultrasonic cleaning at the temperature of more than or equal to 80 ℃ so as to remove soluble solid particles in a water channel of the semi-finished target cooling back plate and obtain the target cooling back plate.
The second purpose of the present invention is to provide a target cooling backing plate, which is obtained by using the welding method of the target cooling backing plate of the first purpose.
The recitation of numerical ranges herein includes not only the above-recited numerical values, but also any numerical values between non-recited numerical ranges, and is not intended to be exhaustive or to limit the invention to the precise numerical values encompassed within the range for brevity and clarity.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the welding method of the target cooling back plate, the target cooling back plate is prepared through hot isostatic pressing welding, and the welding strength and the welding bonding rate are high;
(2) according to the welding method of the target cooling back plate, solid particles are filled in the water channel of the back plate, so that the water channel deformation caused by hot isostatic pressing welding is avoided, and the problem of water channel leakage is further avoided;
(3) the welding method of the target cooling back plate is simple and convenient to operate and easy to popularize and use in a large scale.
Drawings
FIG. 1 is a schematic structural view of a backplane of the present invention;
FIG. 2 is a schematic structural diagram of the back plate cover plate according to the present invention;
FIG. 3 is a schematic structural view of the target cooling backing plate of the present invention;
wherein, 1-a backboard soleplate; 2-water channel; 3-groove; 4-a back plate cover plate; 5-a linker.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
In the embodiment of the invention, the structural schematic diagram of the back plate bottom plate is shown in fig. 1, a water channel 2 is arranged on the back plate bottom plate 1, and a groove 3 is arranged at the edge of the water channel 2; the structural schematic diagram of the back plate cover plate is shown in fig. 2, and a joint 5 is arranged on the back plate cover plate 4 and matched with the groove 3. The structural schematic diagram of the target cooling back plate is shown in fig. 3, and a back plate bottom plate 1 and a back plate cover plate 4 are welded by hot isostatic pressing to obtain the target cooling back plate in fig. 3.
Example 1
The embodiment provides a target cooling back plate and a welding method thereof, wherein the welding method comprises the following steps:
(1) pickling the back plate bottom plate and the back plate cover plate in a pickling reagent for 8min, wherein solutes of the pickling reagent comprise nitric acid and hydrofluoric acid, and a solvent comprises water; the molar ratio of nitric acid to hydrofluoric acid in the pickling reagent is 1:1: 5; after filling sodium chloride with the grain diameter of 0.3mm in the water channel of the back plate bottom plate, controlling the filling height of the sodium chloride to be smaller than the height of the water channel in the back plate bottom plate; fixing the backboard base plate and the backboard cover plate through argon arc welding spot welding to obtain a component to be welded, and controlling the gap between the backboard base plate and the backboard cover plate in the component to be welded to be 0.1 mm;
the backboard bottom plate and the backboard cover plate are both made of aluminum alloy; the edge of the water channel of the backboard bottom plate is provided with a groove; the back plate cover plate is provided with a joint which is matched with the groove;
(2) filling the water channel in the component to be welded in the step (1) with the soluble solid particles, and welding aluminum sheets at the inlet and the outlet of the water channel by argon arc welding to seal the water channel; then, performing hot isostatic pressing welding on the component to be welded for 3 hours at the temperature of 400 ℃ under 180MPa to obtain a semi-finished target cooling back plate;
(3) aluminum sheets at the inlet and the outlet of the water channel in the semi-finished target material cooling back plate in the step (2) are removed; and then, placing the semi-finished target cooling back plate in water, and carrying out ultrasonic cleaning at the temperature of more than or equal to 80 ℃ so as to remove soluble solid particles in a water channel of the semi-finished target cooling back plate and obtain the target cooling back plate.
Example 2
The embodiment provides a target cooling back plate and a welding method thereof, wherein the welding method comprises the following steps:
(1) pickling the back plate bottom plate and the back plate cover plate in a pickling reagent for 5min, wherein solutes of the pickling reagent comprise nitric acid and hydrofluoric acid, and a solvent comprises water; the molar ratio of nitric acid to hydrofluoric acid in the pickling reagent is 2:1: 5; after sodium sulfate with the particle size of 0.2mm is filled in the water channel of the back plate bottom plate, the filling height of the sodium sulfate is controlled to be smaller than the height of the water channel in the back plate bottom plate; fixing the backboard bottom plate and the backboard cover plate through argon arc welding spot welding to obtain a to-be-welded assembly, and controlling the gap between the backboard bottom plate and the backboard cover plate in the to-be-welded assembly to be 0.1 mm;
the backboard bottom plate and the backboard cover plate are both made of aluminum alloy; the edge of the water channel of the bottom plate of the back plate is provided with a groove; the back plate cover plate is provided with a joint which is matched with the groove;
(2) filling the water channel in the component to be welded in the step (1) with the soluble solid particles, and welding aluminum sheets at the inlet and the outlet of the water channel by argon arc welding to seal the water channel; then, carrying out hot isostatic pressing welding on the components to be welded for 5 hours at 200MPa and 300 ℃ to obtain a semi-finished target cooling back plate;
(3) aluminum sheets at the inlet and the outlet of the water channel in the semi-finished target material cooling back plate in the step (2) are removed; and then, placing the semi-finished target cooling back plate in water, and carrying out ultrasonic cleaning at the temperature of more than or equal to 80 ℃ so as to remove soluble solid particles in a water channel of the semi-finished target cooling back plate, thereby obtaining the target cooling back plate.
Example 3
The embodiment provides a target cooling back plate and a welding method thereof, wherein the welding method comprises the following steps:
(1) pickling the back plate bottom plate and the back plate cover plate in a pickling reagent for 6min, wherein solutes of the pickling reagent comprise nitric acid and hydrofluoric acid, and a solvent comprises water; the molar ratio of nitric acid to hydrofluoric acid in the pickling reagent is 1.5:1: 5; after filling sodium chloride with the grain diameter of 0.5mm in the water channel of the back plate bottom plate, controlling the filling height of the sodium chloride to be smaller than the height of the water channel in the back plate bottom plate; fixing the backboard bottom plate and the backboard cover plate through argon arc welding spot welding to obtain a to-be-welded assembly, and controlling the gap between the backboard bottom plate and the backboard cover plate in the to-be-welded assembly to be 0.18 mm;
the backboard bottom plate and the backboard cover plate are both made of aluminum alloy; the edge of the water channel of the bottom plate of the back plate is provided with a groove; the back plate cover plate is provided with a joint which is matched with the groove;
(2) filling the water channel in the component to be welded in the step (1) with the soluble solid particles, and welding aluminum sheets at the inlet and the outlet of the water channel by argon arc welding to seal; then, performing hot isostatic pressing welding on the component to be welded for 2 hours at the temperature of 450 ℃ under the pressure of 150MPa to obtain a semi-finished target cooling back plate;
(3) removing aluminum sheets at the inlet and the outlet of the water channel in the semi-finished target cooling back plate in the step (2); and then, placing the semi-finished target cooling back plate in water, and carrying out ultrasonic cleaning at the temperature of more than or equal to 80 ℃ so as to remove soluble solid particles in a water channel of the semi-finished target cooling back plate and obtain the target cooling back plate.
Example 4
The present embodiment provides a target cooling backing plate and a welding method thereof, which are described with reference to embodiment 1, and only differ in that: in the step (1), sodium chloride is replaced by barium sulfate, and the barium sulfate is insoluble solid particles.
Example 5
The present embodiment provides a target cooling backing plate and a welding method thereof, which are described with reference to embodiment 1, and only differ in that: in the step (1), sodium chloride is replaced by sodium nitrate, and the melting point of the sodium nitrate is 306.8 ℃.
Example 6
The present embodiment provides a target cooling backing plate and a welding method thereof, which are different from the welding method described in embodiment 1 only in that: and (2) in the step (1), the gap between a back plate bottom plate and a back plate cover plate in the assembly to be welded is 0.4 mm.
Example 7
The present embodiment provides a target cooling backing plate and a welding method thereof, which are different from the welding method described in embodiment 1 only in that: and (3) the pressure of the hot isostatic pressing welding in the step (2) is 120 MPa.
Example 8
The present embodiment provides a target cooling backing plate and a welding method thereof, which are described with reference to embodiment 1, and only differ in that: and (3) the pressure of the hot isostatic pressing welding in the step (2) is 230 MPa.
Example 9
The present embodiment provides a target cooling backing plate and a welding method thereof, which are described with reference to embodiment 1, and only differ in that: in the step (2), the inlet and the outlet of the water channel are not sealed; namely, the steps (2) and (3) are as follows:
(2) filling the water channel in the component to be welded in the step (1) with the soluble solid particles; then, performing hot isostatic pressing welding on the component to be welded for 3 hours at the temperature of 400 ℃ under 180MPa to obtain a semi-finished target cooling back plate;
(3) and (3) placing the semi-finished target cooling back plate in the step (2) in water, and carrying out ultrasonic cleaning at the temperature of more than or equal to 80 ℃ to remove soluble solid particles in a water channel of the semi-finished target cooling back plate so as to obtain the target cooling back plate.
Comparative example 1
The present comparative example provides a target cooling backing plate and a welding method thereof, which are described with reference to example 1, and only differ in that: solid particles are not filled in the water channel; namely, the welding method includes the steps of:
(1) pickling the back plate bottom plate and the back plate cover plate in a pickling reagent for 8min, wherein solutes of the pickling reagent comprise nitric acid and hydrofluoric acid, and a solvent comprises water; the molar ratio of nitric acid to hydrofluoric acid in the pickling reagent is 1:1: 5; fixing the backboard bottom plate and the backboard cover plate through argon arc welding spot welding to obtain a to-be-welded assembly, and controlling the gap between the backboard bottom plate and the backboard cover plate in the to-be-welded assembly to be 0.1 mm;
the backboard bottom plate and the backboard cover plate are both made of aluminum alloy;
(2) and carrying out hot isostatic pressing welding on the assembly to be welded for 3 hours at the temperature of 400 ℃ under 180MPa to obtain the target cooling back plate.
The target cooling back plates obtained in the above examples and comparative examples were tested, and the specific contents and steps of the test were as follows:
welding bonding rate: detecting the welding bonding rate by using an ultrasonic C scanning imager;
welding qualification rate: introducing cooling water into the target cooling back plates at the designed pressure, observing the water leakage condition, and if water leaks from N target cooling back plates in the N target cooling back plates, determining the welding bonding rate as (1-N/N) multiplied by 100%;
whether the water channel of the target cooling back plate is deformed or not: judging whether the water channel is deformed or not through water flow, measuring the water flow under the designed water inlet pressure, wherein the water flow of the undeformed cooling back plate is the standard water flow, and if the deviation between the measured water flow and the standard water flow is more than 15%, determining that the water channel is deformed; and if the deviation between the measured water flow and the standard water flow is less than or equal to 15%, the water channel is not deformed.
The results of the tests of the above examples and comparative examples are shown in Table 1.
TABLE 1
From table 1, the following points can be derived:
(1) as can be seen from the examples 1-3, the target cooling back plate prepared by the welding method of the target cooling back plate has high welding bonding rate and welding qualification rate, and the water channel is not easy to deform;
(2) comparing example 1 with examples 4 and 5, it can be seen that the solid particles filled in example 4 are barium sulfate, the welding bonding rate and the welding yield of the target cooling back plate do not change greatly, the water channel does not deform, but the barium sulfate is insoluble solid particles and is difficult to clean; in example 5, the filled solid particles are sodium nitrate, the melting point of the sodium nitrate is 306.8 ℃, which is lower than or equal to 500 ℃ preferred by the invention, and when hot isostatic pressing welding is performed at 400 ℃, the sodium nitrate can be melted into a liquid state, which cannot play a role in supporting a back plate cover plate, so that the welding bonding rate is reduced, the welding qualification rate is reduced, and the water channel is deformed;
(3) comparing the embodiment 1 with the embodiment 6, it can be seen that, in the embodiment 6, the gap between the back plate bottom plate and the back plate cover plate in the assembly to be welded is 0.4mm, which exceeds the preferable range of the invention and is less than 0.2mm, so that the back plate cover plate and the back plate bottom plate cannot be tightly welded together, the welding bonding rate is reduced, the welding qualification rate is reduced, and the water channel is also deformed;
(4) comparing example 1 with examples 7 and 8, it can be seen that the hot isostatic pressing welding pressure in example 7 is 120MPa, which is lower than the preferred 150-200MPa in the invention, resulting in the reduced welding bonding rate and the reduced welding yield; in the embodiment 8, the pressure of hot isostatic pressing welding is 230MPa, which exceeds the preferable pressure of 150MPa and 200MPa of the invention, the welding bonding rate is not greatly influenced, but the excessive temperature can deform the water channel, thereby reducing the welding qualification rate;
(5) comparing example 1 with example 9, it can be seen that in example 9, the inlet and the outlet of the water channel are not sealed, and during hot isostatic pressing welding, sodium chloride filled in the water channel leaks from the inlet and the outlet of the water channel, so that the water channel cannot play a supporting role, the water channel deforms, and the welding bonding rate and the welding qualification rate are reduced;
(6) comparing example 1 with comparative example 1, it can be seen that comparative example 1 does not fill the water channel with solid particles, and the water channel is deformed during the hot isostatic pressing welding, and thus the welding bonding rate and the welding yield are decreased.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention disclosed herein fall within the scope and disclosure of the present invention.
Claims (10)
1. A welding method for a target cooling back plate is characterized by comprising the following steps:
(1) after solid particles are filled in the water channel of the back plate bottom plate, the back plate bottom plate and the back plate cover plate are fixed to obtain a component to be welded;
(2) performing hot isostatic pressing welding on the components to be welded in the step (1) to obtain a semi-finished target cooling back plate;
(3) and (3) removing solid particles in the semi-finished target cooling back plate in the step (2) to obtain the target cooling back plate.
2. The welding method of the target material cooling back plate according to claim 1, wherein the back plate bottom plate and the back plate cover plate in step (1) are both made of aluminum alloy;
preferably, in the step (1), grooves are formed in the edges of the water channels of the bottom plates of the back plates;
preferably, the back plate cover plate in the step (1) is provided with a joint which is matched with the groove.
3. The method for welding a target-cooled backing plate according to claim 1 or 2, wherein the backing plate bottom plate and the backing plate cover plate are acid-washed before the filling with the solid particles in step (1);
preferably, the solutes of the pickling reagent used for pickling comprise nitric acid and hydrofluoric acid, and the solvent comprises water;
preferably, the molar ratio of nitric acid, hydrofluoric acid and water in the acid washing reagent is (1-2) to 1: 5;
preferably, the pickling time is 5-8 min.
4. The method for welding the target cooling backing plate according to any one of claims 1-3, wherein the solid particles in step (1) are soluble solid particles;
preferably, the soluble solid particles comprise inorganic salt particles;
preferably, the melting point of the soluble solid particles is more than or equal to 500 ℃;
preferably, the inorganic salt particles comprise any one of sodium chloride, sodium sulfate, potassium chloride, potassium sulfate, magnesium chloride, magnesium sulfate or aluminum sulfate or a combination of at least two of the same;
preferably, the solid particles of step (1) have a particle size of 0.2-0.5 mm;
preferably, in step (1), the filling height of the solid particles is less than the height of the water channels in the backboard bottom plate.
5. The welding method of the target cooling backing plate according to any one of claims 1 to 4, wherein the fixing manner in the step (1) is argon arc spot welding;
preferably, in the assembly to be welded in the step (1), the gap between the back plate bottom plate and the back plate cover plate is less than 0.2 mm.
6. The method for welding the target cooling backing plate according to any one of claims 1 to 5, wherein the solid particles are used to fill the water channel in the component to be welded in the step (1) and seal the inlet and the outlet of the water channel before the hot isostatic pressing welding in the step (2);
preferably, the closing mode is as follows: and welding aluminum sheets at the inlet and the outlet of the water channel by argon arc welding.
7. The method for welding the target cooling backing plate according to any one of claims 1 to 6, wherein the pressure of the hot isostatic pressing welding in the step (2) is 150-200 MPa;
preferably, the temperature of the hot isostatic pressing welding in the step (2) is 300-450 ℃;
preferably, the time for the hot isostatic pressing welding in the step (2) is 2-5 h.
8. The method for welding the target cooling backing plate according to claim 6, wherein before the cleaning in step (3), aluminum sheets at the inlet and outlet of the water channel in the semi-finished target cooling backing plate in step (2) are removed;
preferably, the clearing in step (3) is performed by: placing the semi-finished target cooling back plate in cleaning liquid for ultrasonic cleaning;
preferably, the wash liquid comprises water;
preferably, the temperature of the ultrasonic cleaning is more than or equal to 80 ℃.
9. The method for welding the target cooling backing plate according to any one of claims 1 to 8, wherein the welding method comprises the following steps:
(1) pickling the back plate bottom plate and the back plate cover plate in a pickling reagent for 5-8min, wherein solutes of the pickling reagent comprise nitric acid and hydrofluoric acid, and a solvent comprises water; the molar ratio of nitric acid, hydrofluoric acid and water in the acid cleaning reagent is (1-2) to 1: 5; after soluble solid particles with the particle size of 0.2-0.5mm and the melting point of more than or equal to 500 ℃ are filled in the water channel of the back plate bottom plate, the filling height of the solid particles is controlled to be smaller than the height of the water channel in the back plate bottom plate; fixing the backboard base plate and the backboard cover plate through argon arc welding spot welding to obtain a component to be welded, and controlling the gap between the backboard base plate and the backboard cover plate in the component to be welded to be less than 0.2 mm;
the backboard bottom plate and the backboard cover plate are both made of aluminum alloy; the edge of the water channel of the backboard bottom plate is provided with a groove; the back plate cover plate is provided with a joint which is matched with the groove; the soluble solid particles comprise inorganic salt particles; the inorganic salt particles comprise any one or the combination of at least two of sodium chloride, sodium sulfate, potassium chloride, potassium sulfate, magnesium chloride, magnesium sulfate or aluminum sulfate;
(2) filling the water channel in the component to be welded in the step (1) with the soluble solid particles, and welding aluminum sheets at the inlet and the outlet of the water channel by argon arc welding to seal the water channel; then, performing hot isostatic pressing welding on the assembly to be welded at the temperature of 150-;
(3) removing aluminum sheets at the inlet and the outlet of the water channel in the semi-finished target cooling back plate in the step (2); and then, placing the semi-finished target cooling back plate in water, and carrying out ultrasonic cleaning at the temperature of more than or equal to 80 ℃ so as to remove soluble solid particles in a water channel of the semi-finished target cooling back plate and obtain the target cooling back plate.
10. A target cooling backing plate obtained by the method of welding the target cooling backing plate according to any one of claims 1 to 9.
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