CN114858315A - Pressure sensing electronic skin and manufacturing process thereof - Google Patents
Pressure sensing electronic skin and manufacturing process thereof Download PDFInfo
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- CN114858315A CN114858315A CN202210366868.8A CN202210366868A CN114858315A CN 114858315 A CN114858315 A CN 114858315A CN 202210366868 A CN202210366868 A CN 202210366868A CN 114858315 A CN114858315 A CN 114858315A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a pressure sensing electronic skin and a manufacturing process thereof.A circuit structure is printed on the upper surface of a lower layer flexible substrate by an ink-jet printing technology, and the circuit structure comprises two capacitor plates, an inductance coil which respectively surrounds the periphery of each capacitor plate and a parasitic circuit which connects the two inductance coils; then preparing a dielectric layer on the dried circuit structure and the flexible substrate at the periphery of the circuit structure; before the dielectric layer is completely cured, the flexible substrate with the three-layer structure is folded in half, so that the two capacitance plates are just parallel and opposite to each other and form a capacitor together with the dielectric layer between the two capacitance plates, the two inductance coils, the parasitic circuit and the capacitor formed after folding form an LC circuit together, and the manufacturing of the pressure sensing electronic skin is completed after curing. The method has the advantages of simple process and low manufacturing cost, and the prepared pressure sensing electronic skin can realize non-humanized flexible pressure detection; the monitoring is reliable and the sensitivity is high.
Description
Technical Field
The invention belongs to the technical field of bionics, relates to bionic skin, and particularly relates to a manufacturing process and a manufacturing process of pressure sensing electronic skin.
Background
The skin is the largest organ of the human body and is one of the direct channels that the human beings use to perceive the external environment. The electronic skin is a novel electronic device which is manufactured by means of flexible electronic technology and has excellent perception performance like human skin. The intelligent sensing device can convert various external stimuli (such as changes of pressure, temperature and humidity) into monitorable electrical signals so as to assist artificial intelligence in sensing changes of the external environment. With the development of flexible electronic technology and artificial intelligence technology, the research on the design, manufacture and sensitivity of electronic skin structures is becoming a hot research day by day.
At present, the traditional electronic skin based on metal and semiconductor materials has difficulty in meeting the requirements of ductility and portability in practical use due to the lack of flexibility and poor wearability. Even if the material is replaced to make it initially malleable, it is difficult to mass produce the product because of the high cost of the manufacturing process (e.g., MEMS lithography, sputtering, evaporation, etching, packaging, etc.), the cumbersome manufacturing steps, and the long manufacturing time period. Meanwhile, the method lacks direct feedback between theoretical design and device manufacturing, and oriented optimization of device performance is difficult to perform directly through design. Moreover, many electronic skins need to provide external power supplies manually, so that strict limitations are imposed on application scenes, and the electronic skins are not beneficial to practical popularization.
Therefore, a pressure sensing electronic skin which has excellent bending and stretching performance, is passive and wireless, has low design and manufacturing cost and can be manufactured in large scale and in batch is needed at present, and the requirement of artificial intelligence on external pressure sensing is met.
Disclosure of Invention
Aiming at the problems of poor ductility, external power supply, high manufacturing cost and the like of artificial skin applied to each joint of a robot, the invention provides the pressure sensing electronic skin integrated by the micro-pressure sensor which is flexible, has no built-in power supply and transmits wireless information, can realize dynamic monitoring of pressure change of each joint of the robot, assists the robot to sense external pressure change and acquire pressure information, and thus, the robot is organically connected with an environment interaction system, a sensing system and a control system.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the invention provides a pressure sensing electronic skin, which comprises a flexible lower substrate, a flexible upper substrate and an LC circuit between the upper substrate and the lower substrate, wherein the flexible lower substrate and the flexible upper substrate are formed by folding a flexible substrate, and the LC circuit consists of capacitor plates respectively arranged on the upper substrate and the lower substrate, an inductance coil surrounding the capacitor plates, a parasitic circuit connecting the two inductance coils and a dielectric layer arranged between the two capacitor plates. The pressure sensing electronic skin provided by the invention is matched with an external non-contact vector network analyzer to analyze the resonance frequency of the LC circuit, so that the pressure acting on the surface of the skin can be measured, and the passive pressure sensing measurement is realized.
Aiming at different moving joints of different types of robots, the size and the shape of a flexible pressure sensor (LC circuit) in the pressure sensing electronic skin can be changed according to the specific joint size and actual different pressure working conditions without influencing the function realization. The pressure sensing electronic skin is attached to the surface of the robot joint, and the manufacturing material of the sensor has good ductility.
The invention can also prepare a plurality of LC circuits between the flexible lower substrate and the flexible upper substrate according to the requirement so as to realize the distributed multipoint pressure sensing measurement on the pressure sensing electronic skin.
The existing bionic robot does not simply simulate a certain action of a human or a machine like a traditional robot, and many other asynchronous states such as running, jumping, going upstairs and downstairs and the like are included in the design. Moreover, many mankind can't survey on the spot and need all adjust the design frame correspondingly according to the demand with the help of the operating mode that the robot accomplished, like the pressure detection of high-risk occasion, narrow and small space etc.. The flexible micro-pressure sensor attached to the surface of the robot joint can sense the external pressure, and the distance between capacitor plates in the sensor can be changed by the up-and-down fluctuation of the pressure, so that the capacitance value is changed, and the conversion from physical signals to electric signals is realized. And then, the resonance frequency change of an LC circuit in the sensor is sensed through an external vector network analyzer, so that the change of external pressure is analyzed, and the dynamic real-time monitoring of the external pressure is realized. Through the feedback of the pressure information, the subsequent control command can be applied, or the links such as design, algorithm and the like can be optimized.
The invention also provides a pressure sensing electronic skin manufacturing process which is characterized by comprising the following steps:
and 5, before the dielectric layer is completely cured, folding the flexible substrate with the three-layer structure in half, enabling the two capacitance polar plates to be just parallel and opposite to each other and form a capacitor together with the dielectric layer between the two capacitance polar plates, enabling the two inductance coils, the parasitic circuit and the capacitor formed after folding to form an LC circuit together, and finishing the manufacture of the pressure sensing electronic skin after curing.
The process method can realize the three-dimensional communication of the multilayer circuits of the pressure sensing electronic skin and realize the pressure detection in the Z-axis direction.
In the preparation steps of the invention, the full ink-jet printing technology is used for directly printing the microcircuit on the flexible substrate, the traditional MEMS technology is not needed, the process flow is simple, the operation is simple and convenient, the sputtering pollution is avoided, the cost is low, and the method is suitable for batch manufacturing. Moreover, because the design drawing can be directly drawn by CAD software, the design parameters of the inductor and the capacitor in the circuit can be adjusted, and the requirements of various different pressure test working conditions can be met. The selected substrate material has good flexibility, ductility and electrical insulation, and can meet various individual installation requirements. The selected dielectric material has good dielectric property, and meets the requirement of manufacturing the capacitor. The whole flexible micro-pressure sensor can feed back the fluctuation of the electric signal in real time along with the pressure fluctuation, and has reliable monitoring and high sensitivity.
Compared with the prior art, the invention has the following beneficial effects:
the method is applied to the live pressure monitoring of the robot joint and is directly attached to the detection part. The asynchronous state of the robot, the pressure born by the mechanical arm and the like can be detected through the device, the pressure change generated by the change of the external environment is converted into the change of an electric signal, the detection error caused by the fact that the traditional solid-state sensor cannot be completely attached is reduced, and meanwhile, the excellent bending and extending performance can also help to improve the detection precision.
The pressure sensing electronic skin device is simple in packaging process, and complex steps of laser grooving, plasma cleaning, plastic packaging and the like of traditional semiconductor packaging are not needed.
The pressure sensing electronic skin device has no internal power supply, and can improve the portability to a certain extent; the wireless transmission of electric signals can realize real-time dynamic monitoring to a certain extent.
The design drawing of the pressure sensing electronic skin device is directly finished in a Computer Aided Design (CAD), the distance and the facing area of the capacitor plate, the number of turns, the line width, the shape, the size and other parameters of the inductance coil are adjustable, and various working condition requirements can be met. A plurality of circuit structures can be printed in an array mode by using an ink jet printing technology so as to form an array type sensor element, the design and manufacturing cost is low, and the array type sensor element is very suitable for batch processing and manufacturing.
Drawings
FIG. 1 is a simplified three-dimensional block diagram of a pressure sensing electronic skin in an embodiment of the present invention.
Fig. 2 is a schematic diagram of a flexible substrate in step 1 of preparing a pressure sensing electronic skin according to an embodiment of the present invention, in which fig. 2(a) is a top view of the flexible substrate, and fig. 2(b) is a cross-sectional view of fig. 2(a) a-a.
Fig. 3 is a schematic diagram of a circuit structure fabricated on a flexible substrate in step 2 of fabricating a pressure sensing electronic skin according to an embodiment of the present invention, in which fig. 3(a) is a top view and fig. 3(b) is a cross-sectional view.
Fig. 4 is a schematic diagram of a dielectric layer formed on a circuit structure of a flexible substrate in step 4 of forming a pressure sensing electronic skin according to an embodiment of the present invention, in which fig. 4(a) is a top view and fig. 4(b) is a cross-sectional view.
Fig. 5 is a schematic view of a pressure sensing electronic skin obtained by folding a flexible substrate having a three-layer structure in half to form a five-layer structure in step 5 of preparing the pressure sensing electronic skin according to an embodiment of the present invention, where fig. 5(a) is a top view and fig. 5(b) is a cross-sectional view.
Fig. 6 is a partially cut-away schematic view of fig. 1.
FIG. 7 is a schematic diagram of the LCD circuit of FIG. 1 with the flexible substrate and dielectric layer removed.
Reference numerals: the capacitor comprises a flexible substrate 1, an inductance coil 2, a capacitance polar plate 3, a parasitic circuit 4, a circuit structure 5, a dielectric layer 6, a capacitor upper polar plate 7, a capacitor lower polar plate 8, a flexible upper substrate 9 and a flexible lower substrate 10.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The device of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, 6 and 7, the invention provides a pressure sensing electronic skin, which comprises a flexible lower substrate 10, a flexible upper substrate 9 and an LC circuit between the upper and lower substrates, wherein the flexible lower substrate 10 and the flexible upper substrate 9 are formed by folding a flexible substrate 1 in half, the LC circuit is composed of capacitor plates 3 respectively arranged on the upper and lower substrates, an inductance coil 2 surrounding the capacitor plates 3, a parasitic circuit 4 connecting the two inductance coils 2 and a dielectric layer 6 arranged between the two capacitor plates 3, wherein the upper surface of the flexible lower substrate 10 is a capacitor lower plate 8, and the lower surface of the middle flexible upper substrate 9 is a capacitor upper plate 7. The pressure sensing electronic skin provided by the invention is matched with an external non-contact vector network analyzer to analyze the resonance frequency of the LC circuit, so that the pressure acting on the surface of the skin can be measured, and the passive pressure sensing measurement is realized.
The principle of the invention for measuring pressure is as follows:
the pressure sensing electronic skin is manufactured into a corresponding size according to the requirement and is attached to the surface of a skeleton, when the external pressure sensing electronic skin is pressed, the distance between the capacitor plates 3 in the sensor can be changed by the up-and-down fluctuation of the pressure, so that the capacitance value of the capacitor is changed, and the conversion from physical signals to electric signals is realized. And then, the resonance frequency change of an LC circuit in the sensor is sensed through an external vector network analyzer, so that the change of external pressure is analyzed, and the dynamic real-time monitoring of the external pressure is realized. Through the feedback of the pressure information, the subsequent control command can be applied, or the links such as design, algorithm and the like can be optimized.
As shown in fig. 2 to 5, the present invention also provides a process for manufacturing a pressure sensing electronic skin, comprising the steps of:
and 5, before the dielectric layer 6 is completely cured, folding the flexible substrate 1 with the three-layer structure in half to form a five-layer structure, enabling the two capacitance plates 3 to be just parallel and opposite to each other and form a capacitor together with the dielectric layer 6 between the two capacitance plates 3, enabling the two inductance coils 2, the parasitic circuit 4 and the capacitor formed after folding to form an LC circuit together, and finishing the manufacture of the pressure sensing electronic skin after curing.
In step 1, the flexible substrate 1 is made of a flexible material with good ductility, high insulation, high temperature resistance and low dielectric loss, and the thickness of the flexible substrate 1 is 0.5-2mm, and is optimally 1 mm.
Further preferably, the flexible material is a carbon-containing organic polymer material, such as Polyimide (PI), which has excellent comprehensive properties and can substantially meet the requirements of various complex working conditions.
As a preferred embodiment, in step 2, the circuit structure 5 is a symmetrical circuit, and the capacitor plates 3 at two ends and the inductor coil 2 are about the middle parasitic circuit 4, so that the two capacitor plates 3 are opposite to each other in the up-down direction after being folded in step 5.
In this embodiment, the parasitic circuit 4 is a conductive lead wire connecting the two inductance coils 2.
As a preferred embodiment, in step 2, the ink used in the inkjet printing of the present invention is a nano conductive ink, specifically a metal nano material conductive ink (a mixture of metal nano material and solvent), such as a conductive silver ink.
As a preferred embodiment, in step 2, the hydrophilic and hydrophobic conditioning treatment is performed on the upper surface of the flexible substrate 1 according to the kind of the ink-jet printing ink before the ink-jet printing circuit structure 5. The purpose of this work is that the combination between the ink that does benefit to the inkjet and flexible substrate 1 is more stable, avoids producing printing line disorder, prints the problem such as crosstalk each other between the ink droplet, influences circuit shaping quality.
In a preferred embodiment, step 2, the substrate flexible substrate 1 is irradiated with UV lamps for a period of time, typically 40-60 seconds, most preferably 55 seconds, prior to ink jet printing of the circuit structure 5.
In step 3, the flexible substrate 1 printed with the circuit structure 5 is dried and cured at high temperature in a vacuum drying oven. The solvent volatilization speed of the conductive ink is improved through vacuum drying, and the forming of the circuit structure 5 is accelerated.
As a preferred embodiment, the thickness of the printed circuit structure 5 is in the order of micrometers, most preferably around 20 micrometers, which is used to meet the circuit requirements without affecting the dielectric layer 6.
In step 4, the dielectric layer 6 is made of a flexible dielectric material with good ductility, high resistivity and large dielectric constant.
In step 4, as a preferred embodiment, the dielectric layer 6 is made of polydimethylsiloxane by using an inkjet printing technology. Of course, the dielectric layer 6 can also be prepared by applying polydimethylsiloxane on the surface of the circuit structure 5 by spin coating.
The capacitance value of the capacitor depends not only on the dielectric constant of the dielectric material and the area of the capacitor plates 3 facing each other, but also on the relative distance between the capacitor plates 3, i.e., the thickness of the dielectric layer 6. The thickness of the dielectric layer 6 can be controlled by controlling the number of print layers. During inkjet printing of the dielectric layer 6, the print head should be properly selected to avoid satellite drops from being generated, thereby affecting print quality. After the preparation of the dielectric layer 6 is completed, the PDMS needs to be kept still for a period of time so that the PDMS has certain curing property preliminarily, and the subsequent folding and packaging are facilitated.
The advantages of the invention are as follows:
the pressure sensing electronic skin device designed by the invention does not need an internal power supply and a transmission lead. The invention is mainly applied to pressure monitoring at the joints of the robot, the pressure fluctuation sensed by the robot can be converted into the resonance frequency fluctuation of the LC circuit, the conversion from physical signals to electric signals is realized, and then the invention is externally connected with a vector network analyzer, so that high-sensitivity and real-time display can be ensured.
The manufacturing process of the pressure sensing electronic skin device designed by the invention uses the full ink-jet printing technology, can adjust design parameters at any time according to actual conditions, and has the advantages of direct feedback, simple operation, convenience and rapidness. And the array printing can be realized, the printing cost is low, the manufacturing period is greatly shortened, and the manufacturing efficiency is improved.
The pressure sensing electronic skin device designed by the invention is simple and easy to package, and various expensive operations in the traditional semiconductor package are avoided. The pressure detection in the Z-axis direction is realized by the aid of a three-dimensional hierarchical structure.
The flexible pressure sensing electronic skin device designed by the invention is applied to the joints of the robot and is superior to the traditional wired pressure sensing electronic skin device. The prepared material has excellent ductility and dynamically adjustable design parameters, so that the material is suitable for robot joints with different sizes and different actual measurement scenes, and the portability is greatly improved.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several technical improvements and modifications can be made without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims (10)
1. A process for manufacturing a pressure sensing electronic skin, comprising the steps of:
step 1, preparing a lower layer of flexible substrate, wherein the flexible substrate is made of flexible and malleable marginal materials;
step 2, printing a circuit structure on the upper surface of the lower-layer flexible substrate by an ink-jet printing technology, wherein the circuit structure comprises two capacitor plates, inductance coils which surround the periphery of each capacitor plate respectively, and a parasitic circuit which connects the two inductance coils;
step 3, drying the flexible substrate printed with the circuit structure for later use;
step 4, preparing a dielectric layer on the dried circuit structure and the flexible substrate around the dried circuit structure to obtain a three-layer structure;
and 5, before the dielectric layer is completely cured, folding the flexible substrate with the three-layer structure in half, enabling the two capacitance polar plates to be just parallel and opposite to each other and form a capacitor together with the dielectric layer between the two capacitance polar plates, enabling the two inductance coils, the parasitic circuit and the capacitor formed after folding to form an LC circuit together, and finishing the manufacture of the pressure sensing electronic skin after curing.
2. The pressure sensing electronic skin manufacturing process of claim 1, wherein: in step 1, the flexible substrate is made of polyimide.
3. The pressure sensing electronic skin manufacturing process of claim 1, wherein: in the step 2, the circuit structure is a symmetrical circuit, so that the two capacitor plates are opposite up and down after being folded in the step 5.
4. The pressure sensing electronic skin manufacturing process of claim 1, wherein: and 2, performing hydrophilic and hydrophobic regulation treatment on the upper surface of the flexible substrate according to the type of the ink-jet printing ink before the ink-jet printing circuit structure.
5. The pressure sensing electronic skin manufacturing process of claim 1, wherein: in step 2, the substrate flexible substrate is irradiated with an ultraviolet lamp for a period of time prior to ink jet printing of the circuit structure.
6. The pressure sensing electronic skin manufacturing process of claim 1, wherein: and 3, drying and curing the circuit on the flexible substrate printed with the circuit structure in a vacuum drying oven at a high temperature.
7. The pressure sensing electronic skin manufacturing process of claim 1, wherein: the thickness of the printed circuit structure is in micron order.
8. The pressure sensing electronic skin manufacturing process of claim 1, wherein: in step 4, the dielectric layer is made of a flexible material with good ductility, high resistivity and large dielectric constant.
9. The pressure sensing electronic skin manufacturing process of claim 8, wherein: in step 4, the dielectric layer is made of polydimethylsiloxane by adopting an ink-jet printing technology.
10. A pressure sensing electronic skin, manufactured by the manufacturing process of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210366868.8A CN114858315A (en) | 2022-04-08 | 2022-04-08 | Pressure sensing electronic skin and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210366868.8A CN114858315A (en) | 2022-04-08 | 2022-04-08 | Pressure sensing electronic skin and manufacturing process thereof |
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| CN114858315A true CN114858315A (en) | 2022-08-05 |
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| CN202210366868.8A Pending CN114858315A (en) | 2022-04-08 | 2022-04-08 | Pressure sensing electronic skin and manufacturing process thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1982000541A1 (en) * | 1980-08-06 | 1982-02-18 | J Vandebult | Modified resonant tag circuit constructions and fabrication processes therefor |
| CN101490565A (en) * | 2006-07-10 | 2009-07-22 | 3M创新有限公司 | Flexible inductive sensor |
| CN103698060A (en) * | 2013-12-25 | 2014-04-02 | 中北大学 | Wireless passive high-temperature pressure sensor with temperature compensation and temperature compensation algorithm thereof |
| CN107544701A (en) * | 2016-06-24 | 2018-01-05 | 意法半导体亚太私人有限公司 | The capacitive touch pressure sensor being configured to by flexible substrate |
| CN107894293A (en) * | 2017-11-09 | 2018-04-10 | 东南大学 | A kind of highly sensitive flexible passive wireless pressure sensor |
-
2022
- 2022-04-08 CN CN202210366868.8A patent/CN114858315A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1982000541A1 (en) * | 1980-08-06 | 1982-02-18 | J Vandebult | Modified resonant tag circuit constructions and fabrication processes therefor |
| CN101490565A (en) * | 2006-07-10 | 2009-07-22 | 3M创新有限公司 | Flexible inductive sensor |
| CN103698060A (en) * | 2013-12-25 | 2014-04-02 | 中北大学 | Wireless passive high-temperature pressure sensor with temperature compensation and temperature compensation algorithm thereof |
| CN107544701A (en) * | 2016-06-24 | 2018-01-05 | 意法半导体亚太私人有限公司 | The capacitive touch pressure sensor being configured to by flexible substrate |
| CN107894293A (en) * | 2017-11-09 | 2018-04-10 | 东南大学 | A kind of highly sensitive flexible passive wireless pressure sensor |
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