CN114545684A - Backlight module and display panel - Google Patents
Backlight module and display panel Download PDFInfo
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- CN114545684A CN114545684A CN202210121942.XA CN202210121942A CN114545684A CN 114545684 A CN114545684 A CN 114545684A CN 202210121942 A CN202210121942 A CN 202210121942A CN 114545684 A CN114545684 A CN 114545684A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133609—Direct backlight including means for improving the color mixing, e.g. white
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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Abstract
The application provides a backlight unit and display panel, backlight unit includes: the LED light source comprises a substrate, a backlight source and a light reflecting retaining wall, wherein the backlight source is arranged on the substrate and comprises a plurality of light mixing units which are arranged in an array manner, each light mixing unit comprises two rows of LED chips which are arranged in a staggered manner, and each row of LED chips comprises a red LED chip, a green LED chip and a blue LED chip; the light emitting color of any one LED chip in the light mixing unit is different from the light emitting colors of all the adjacent LED chips; the light reflecting retaining wall is arranged on the substrate and surrounds the light mixing unit, the light reflecting retaining wall is used for mixing the light units, one end of each light mixing unit is three, and the LED chips are separated from the other end of each light mixing unit. The backlight module can improve the uniformity of mixed light.
Description
Technical Field
The application belongs to the technical field of show, especially, relate to a backlight unit and display panel.
Background
The backlight module is a device for providing a light source for a liquid crystal box in a display panel, and the luminous effect and the performance parameters of the backlight module directly influence the visual effect of the display panel. LED light emitting devices have excellent photoelectric properties and small size, and thus become the mainstream light source of backlight modules. The LED light-emitting elements used by the direct type backlight module are gradually miniaturized, and after the size of the LED light-emitting elements is reduced, the LED light-emitting elements in the backlight module are more densely arranged, so that the light mixing distance and the module thickness are reduced, the energy conservation, the light thinning and the high color gamut of the display panel are realized, and the problem of uneven light mixing is easily caused.
Disclosure of Invention
The embodiment of the application provides a backlight module and a display panel, which are used for solving the problem of uneven light mixing of the conventional backlight module.
In a first aspect, an embodiment of the present application provides a backlight module, including:
a substrate;
the backlight source is arranged on the substrate and comprises a plurality of light mixing units arranged in an array manner, each light mixing unit comprises two rows of LED chips arranged in a staggered manner, and each row of LED chips comprises a red LED chip, a green LED chip and a blue LED chip; the light emitting color of any one LED chip in the light mixing unit is different from the light emitting colors of all the adjacent LED chips;
the light-reflecting retaining wall, the light-reflecting retaining wall set up in on the base plate, the light-reflecting retaining wall encircles mix the light unit and will mix in the light unit three of one end the LED chip separates with the three of other one end the LED chip.
Optionally, the width of the LED chip is 20-500 μm.
Optionally, the distance between two adjacent LED chips in the light mixing unit is 20-500 μm.
Optionally, a triangle formed by connecting the three LED chips at one end of the light mixing unit is equal to a triangle formed by connecting the three LED chips at the other end of the light mixing unit.
Optionally, a triangle formed by connecting lines of the three LED chips at one end of the light mixing unit is an isosceles triangle or an equilateral triangle; and/or the presence of a gas in the gas,
and a triangle formed by connecting lines of the three LED chips at the other end of the light mixing unit is an isosceles triangle or an equilateral triangle.
Optionally, the reflective retaining wall is an adhesive layer mixed with a high-reflection material.
Optionally, the reflecting barriers surrounding the three LED chips in the light mixing unit are arranged in a surrounding manner to form a rectangle, a circle, a hexagon, a trapezoid, a triangle or an irregular polygon.
Optionally, the height of the reflective retaining wall is greater than that of the LED chip.
In a second aspect, an embodiment of the present application further provides a display panel, where the display panel includes the backlight module as described in any one of the above embodiments.
In the backlight source of the backlight module provided by the embodiment of the application, each light mixing unit is provided with two rows of LED chips which are arranged in a staggered manner, the staggered arrangement can enable the distance difference between each LED chip and two adjacent LED chips in the adjacent rows to be smaller, and the situation that the LED chips are closer to the aligned LED chips and are further away from the adjacent unaligned LED chips when the LED chips are arranged in an aligned manner cannot occur. Meanwhile, the positions of the LED chips in the row can be adjusted according to requirements, so that each LED chip and one or two adjacent LED chips in the same row have a proper light mixing distance, and a proper light mixing distance is also formed between each LED chip and one or two adjacent LED chips in the adjacent row, so that a required light mixing effect is realized. Each row of LED chips comprises a red LED chip, a green LED chip and a blue LED chip, and the light emitting color of any LED chip in the light mixing unit is different from the light emitting colors of all adjacent LED chips, namely, the color of any LED chip is different from that of one or two adjacent LED chips in the same row, and the color of any LED chip is different from that of one or two adjacent LED chips in the adjacent row. At the moment, three mutually adjacent LED chips are a red LED chip, a green LED chip and a blue LED chip, and the full-color-domain spectrum can be obtained by mixing the light of the three LED chips. The backlight includes a plurality of mixed light units that the array was arranged, and three-colour LED chip distribution position is more even, can obtain better mixed light effect, and whole backlight unit's colour gamut also can obtain improving simultaneously. Meanwhile, a light reflecting retaining wall is further arranged in the backlight module and can reflect light emitted to the side face back, so that the light efficiency is improved, the light emitting rate is higher under the same energy consumption, meanwhile, the reflected light can be further mixed, and the light mixing uniformity is further improved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a backlight module provided in the embodiment of the present application.
Fig. 2 is a schematic view of another viewing angle of the backlight module shown in fig. 1.
Fig. 3 is a schematic view of a first arrangement of the backlight sources in the backlight module shown in fig. 1.
Fig. 4 is a schematic view of a second arrangement of the backlight sources in the backlight module shown in fig. 1.
Fig. 5 is a schematic view of a third arrangement of the backlight sources in the backlight module shown in fig. 1.
Fig. 6 is a schematic view of a fourth arrangement of the backlight sources in the backlight module shown in fig. 1.
Fig. 7 is a schematic view of a fifth arrangement of the backlight sources in the backlight module shown in fig. 1.
Fig. 8 is a schematic view of a sixth arrangement of the backlight sources in the backlight module shown in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a backlight module and a display panel, which are used for solving the problem of uneven light mixing of the conventional backlight module.
The backlight module provided by the embodiment of the application can be applied to a display panel. The display panel generally includes a back plate, a backlight module, a diffusion plate, an optical film assembly, a middle frame, a liquid crystal layer, and an upper frame, which are sequentially disposed from bottom to top. The backlight module provides a light source for the display panel, and the light mixing uniformity of the backlight module is directly related to the display effect of the display panel.
In order to more clearly describe the structure of the backlight module according to the embodiments of the present application, the backlight module will be described with reference to the accompanying drawings.
For example, please refer to fig. 1 and fig. 2 for understanding, fig. 1 is a schematic structural diagram of an embodiment of a backlight module according to an embodiment of the present disclosure. Fig. 2 is a schematic view of another viewing angle of the backlight module shown in fig. 1. The backlight module includes: the backlight source 200 is arranged on the substrate 100, the backlight source 200 comprises a plurality of light mixing units 210 which are arranged in an array, each light mixing unit 210 comprises two rows of LED chips 211 which are arranged in a staggered manner, and each row of LED chips 211 comprises a red LED chip 211R, a green LED chip 211G and a blue LED chip 211B; the light emitting color of any one of the LED chips 211 in the light mixing unit 210 is different from the light emitting colors of all the adjacent LED chips 211; the reflective wall 300 is disposed on the substrate 100, and the reflective wall 300 surrounds the light mixing unit 210 and separates the LED chips 211 from the other end of the light mixing unit 210.
In the backlight source 200 of the backlight module provided by the embodiment of the application, each light mixing unit 210 has two rows of LED chips 211 arranged in a staggered manner, and the staggered arrangement can make the distance difference between each LED chip 211 and two adjacent LED chips 211 in adjacent rows smaller, so that the situation that the LED chips 211 are closer to the aligned LED chips 211 and are farther from the adjacent misaligned LED chips 211 when aligned and arranged does not occur. Meanwhile, the positions of the LED chips 211 in the row can be adjusted according to requirements, so that each LED chip 211 and one or two adjacent LED chips 211 in the same row have a proper light mixing distance, and a proper light mixing distance is also formed between each LED chip 211 and one or two adjacent LED chips 211 in the adjacent row, so that a required light mixing effect is realized. Each row of LED chips 211 includes a red LED chip 211R, a green LED chip 211G, and a blue LED chip 211B, and the light emitting color of any LED chip 211 in the light mixing unit 210 is different from the light emitting colors of all adjacent LED chips 211, that is, any LED chip 211 is different from one or two adjacent LED chips 211 in the same row, and is different from one or two adjacent LED chips 211 in the adjacent row. At this time, three LED chips 211 adjacent to each other are necessarily a red LED chip 211R, a green LED chip 211G, and a blue LED chip 211B, and the full-color-domain spectrum can be obtained by mixing the three. Backlight 200 includes a plurality of mixed light units 210 that the array was arranged, and three-colour LED chip 211 distribution position is more even, can obtain better mixed light effect, and whole backlight unit's colour gamut also can obtain improving. Meanwhile, the light reflecting retaining wall 300 is further arranged in the embodiment, the light reflecting retaining wall 300 can reflect the light which is emitted to the side face back, so that the light efficiency is improved, the light emitting rate is higher under the same energy consumption, meanwhile, the light which is reflected back can be further mixed, and the light mixing uniformity is further improved. The light-reflecting retaining wall 300 separates the light-mixing unit 210 into two independent light-mixing spaces, so that the light emitted by the LED chips 211 in different light-mixing spaces will not affect each other, and thus the light-mixing effect of each light-mixing space can be controlled more accurately, and the light-mixing uniformity of each light-mixing space can be improved.
The arrangement of the LED chips 211 that can meet the arrangement requirement of the LED chips 211 in the light mixing unit 210 can be applied to the scheme of the present application. Illustratively, the arrangement of the light mixing unit 210 is described in detail below with reference to fig. 3 to 8. Referring to fig. 3, fig. 3 is a schematic diagram of a first arrangement of the backlight source 200 in the backlight module shown in fig. 1, where three LED chips 211 in a previous row in the light mixing unit 210 are R (red LED chips 211R)/B (blue LED chips 211B)/G (green LED chips 211G), and three LED chips 211 in a next row are G/R/B. The green LED chips 211G in the next row face the position between the red LED chips 211R and the blue LED chips 211B in the previous row, and at this time, the green LED chips 211G in the next row may be directly opposite to the gap between the red LED chips 211R and the blue LED chips 211B in the previous row, or may be locally located below the red LED chips 211R or the blue LED chips 211B in the previous row. The red LED chips 211R of the next row face the positions between the green LED chips 211G and the blue LED chips 211B of the previous row, and at this time, the red LED chips 211R of the next row may be a gap between the blue LED chips 211B and the green LED chips 211G of the previous row, or may be locally located below the blue LED chips 211B or the green LED chips 211G of the previous row. The green LED chips 211G in the previous row face the portion between the red LED chips 211R and the blue LED chips 211B in the next row, and at this time, the green LED chips 211G in the previous row may face the gap between the red LED chips 211R and the blue LED chips 211B in the next row, or may be locally located above the red LED chips 211R or the blue LED chips 211B in the next row. At this time, the three LED chips 211 at one end of the light mixing unit 210 include a first row of red LED chips 211R, a first row of blue LED chips 211B, and a second row of green LED chips 211G. The three LED chips 211 at the other end of the light mixing unit 210 include a first row of green LED chips 211G, a second row of red LED chips 211R, and a second row of blue LED chips 211B. Referring to fig. 4, fig. 4 is a schematic diagram of a second arrangement of the backlight source 200 in the backlight module shown in fig. 1, wherein three LED chips 211 in the upper row of the light mixing unit 210 are B/R/G, and three LED chips 211 in the lower row are G/B/R. The green LED chips 211G in the next row face the positions between the blue LED chips 211B and the red LED chips 211R in the previous row, and at this time, the green LED chips 211G in the next row may be directly opposite to the gap between the blue LED chips 211B and the red LED chips 211R in the previous row, or may be locally located below the blue LED chips 211B or the red LED chips 211R in the previous row. The blue LED chips 211B of the next row face the position between the red LED chips 211R and the green LED chips 211G of the previous row, and at this time, the blue LED chips 211B of the next row may be a gap facing the red LED chips 211R and the green LED chips 211G of the previous row, or may be locally located below the red LED chips 211R or the green LED chips 211G of the previous row. The green LED chips 211G in the previous row face the portion between the blue LED chips 211B and the red LED chips 211R in the next row, and at this time, the green LED chips 211G in the previous row may be directly facing the gap between the blue LED chips 211B and the red LED chips 211R in the next row, or may be locally located above the blue LED chips 211B or the red LED chips 211R in the next row. At this time, the three LED chips 211 at one end of the light mixing unit 210 include a first row of blue LED chips 211B, a first row of red LED chips 211R, and a second row of green LED chips 211G. The three LED chips 211 at the other end of the light mixing unit 210 include a first row of green LED chips 211G, a second row of blue LED chips 211B, and a second row of red LED chips 211R. Referring to fig. 5, fig. 5 is a schematic view of a third arrangement of the backlight source 200 in the backlight module shown in fig. 1, wherein three LED chips 211 in the upper row of the light mixing unit 210 are G/R/B, and three LED chips 211 in the lower row are B/G/R. The blue LED chips 211B of the next row face the positions between the green LED chips 211G and the red LED chips 211R of the previous row, and at this time, the blue LED chips 211B of the next row may be a gap facing the green LED chips 211G and the red LED chips 211R of the previous row, or may be locally located below the green LED chips 211G or the red LED chips 211R of the previous row. The green LED chips 211G in the next row face the position between the red LED chips 211R and the blue LED chips 211B in the previous row, and at this time, the green LED chips 211G in the next row may be directly opposite to the gap between the red LED chips 211R and the blue LED chips 211B in the previous row, or may be locally located below the red LED chips 211R or the blue LED chips 211B in the previous row. The blue LED chips 211B of the previous row face the portion between the green LED chips 211G and the red LED chips 211R of the next row, and at this time, the blue LED chips 211B of the previous row may be directly opposite to the gap between the green LED chips 211G and the red LED chips 211R of the next row, or may be locally located above the green LED chips 211G or the red LED chips 211R of the next row. At this time, the three LED chips 211 at one end of the light mixing unit 210 include a first row of green LED chips 211G, a first row of red LED chips 211R, and a second row of blue LED chips 211B. The three LED chips 211 at the other end of the light mixing unit 210 include a first row of blue LED chips 211B, a second row of green LED chips 211G, and a second row of red LED chips 211R. Referring to fig. 6, fig. 6 is a schematic diagram illustrating a fourth arrangement manner of the backlight source 200 in the backlight module shown in fig. 1, in which three LED chips 211 in a previous row in the light mixing unit 210 are R/G/B, and three LED chips 211 in a next row are B/R/G. The blue LED chips 211B of the next row face the position between the red LED chips 211R and the green LED chips 211G of the previous row, and at this time, the blue LED chips 211B of the next row may be a gap facing the red LED chips 211R and the green LED chips 211G of the previous row, or may be locally located below the red LED chips 211R or the green LED chips 211G of the previous row. The red LED chips 211R of the next row face the position between the green LED chips 211G and the blue LED chips 211B of the previous row, and at this time, the red LED chips 211R of the next row may be a gap facing the green LED chips 211G and the blue LED chips 211B of the previous row, or may be locally located below the green LED chips 211G or the blue LED chips 211B of the previous row. The blue LED chip 211B of the previous row faces the portion between the red LED chip 211R and the green LED chip 211G of the next row, and at this time, the blue LED chip 211B of the previous row may be a gap facing the red LED chip 211R and the green LED chip 211G of the next row, or may be locally located above the red LED chip 211R or the green LED chip 211G of the next row. At this time, the three LED chips 211 at one end of the light mixing unit 210 include a first row of red LED chips 211R, a first row of green LED chips 211G, and a second row of blue LED chips 211B. The three LED chips 211 at the other end of the light mixing unit 210 include a first row of blue LED chips 211B, a second row of red LED chips 211R, and a second row of green LED chips 211G. Referring to fig. 7, fig. 7 is a schematic diagram illustrating a fifth arrangement of the backlight 200 in the backlight module shown in fig. 1, wherein three LED chips 211 in a previous row in the light mixing unit 210 are B/G/R, and three LED chips 211 in a next row are R/B/G. The red LED chips 211R of the next row face the positions between the blue LED chips 211B and the green LED chips 211G of the previous row, and at this time, the red LED chips 211R of the next row may be a gap facing the blue LED chips 211B and the green LED chips 211G of the previous row, or may be locally located below the blue LED chips 211B or the green LED chips 211G of the previous row. The blue LED chips 211B of the next row face the positions between the green LED chips 211G and the red LED chips 211R of the previous row, and at this time, the blue LED chips 211B of the next row may be a gap facing the green LED chips 211G and the red LED chips 211R of the previous row, or may be locally located below the green LED chips 211G or the red LED chips 211R of the previous row. The red LED chips 211R of the previous row face the part between the blue LED chips 211B and the green LED chips 211G of the next row, and at this time, the red LED chips 211R of the previous row may be a gap facing the blue LED chips 211B and the green LED chips 211G of the next row, or may be locally located above the blue LED chips 211B or the green LED chips 211G of the next row. At this time, the three LED chips 211 at one end of the light mixing unit 210 include a first row of blue LED chips 211B, a first row of green LED chips 211G, and a second row of red LED chips 211R. The three LED chips 211 at the other end of the light mixing unit 210 include a first row of red LED chips 211R, a second row of blue LED chips 211B, and a second row of green LED chips 211G. Referring to fig. 8, fig. 8 is a schematic diagram illustrating a sixth arrangement of the backlight source 200 in the backlight module shown in fig. 1, wherein three LED chips 211 in the upper row of the light mixing unit 210 are G/B/R, and three LED chips 211 in the lower row are R/G/B. The red LED chips 211R of the next row face the position between the green LED chips 211G and the blue LED chips 211B of the previous row, and at this time, the red LED chips 211R of the next row may be a gap facing the green LED chips 211G and the blue LED chips 211B of the previous row, or may be locally located below the green LED chips 211G or the blue LED chips 211B of the previous row. The green LED chips 211G in the next row face the positions between the blue LED chips 211B and the red LED chips 211R in the previous row, and at this time, the green LED chips 211G in the next row may be directly opposite to the gap between the blue LED chips 211B and the red LED chips 211R in the previous row, or may be locally located below the blue LED chips 211B or the red LED chips 211R in the previous row. The red LED chips 211R of the previous row face the portion between the green LED chips 211G and the blue LED chips 211B of the next row, and at this time, the red LED chips 211R of the previous row may be a gap facing the green LED chips 211G and the blue LED chips 211B of the next row, or may be locally located above the green LED chips 211G or the blue LED chips 211B of the next row. At this time, the three LED chips 211 at one end of the light mixing unit 210 include a first row of green LED chips 211G, a first row of blue LED chips 211B, and a second row of red LED chips 211R. The three LED chips 211 at the other end of the light mixing unit 210 include a first row of red LED chips 211R, a second row of green LED chips 211G, and a second row of blue LED chips 211B. The above-mentioned six kinds of setting modes of mixing the light unit 210 all can satisfy the demand of this application embodiment, realize promoting the purpose of mixing the light effect to improve whole backlight unit's colour gamut simultaneously.
The LED chips 211 in the backlight module provided in the embodiment of the present application may be ordinary-sized LED chips 211, or Mini LED chips 211 having a width of 20-500 μm, and no matter which specification of the LED chips 211 is used, the light mixing uniformity of the corresponding backlight module can be improved to a certain extent, and the effect of improving the color mixing effect can also be achieved. Compared with the traditional LED chip 211, the Mini LED chip 211 has a smaller size, and the arrangement design of the LEDs is more critical, so that the effect is particularly significant when the LED chip 211 in the backlight module provided by the embodiment of the present application is the Mini LED chip 211.
When the LED chips 211 are Mini LED chips 211, the distance between two adjacent LED chips 211 in the light mixing unit 210 is not too far, and for example, the distance between two adjacent LED chips 211 in the light mixing unit 210 is 20 to 500 μm. In practical operation, the distance between two adjacent LED chips 211 can be selected according to the specific specification and light mixing requirement of the LED chips 211, and is not specifically limited herein. By adjusting the distance between two adjacent LED chips 211, different light mixing effects can be realized as required.
Referring to fig. 1, in order to improve the uniformity of the light mixing, a triangle formed by connecting three LED chips 211 at one end of the light mixing unit 210 may be equal to a triangle formed by connecting three LED chips 211 at the other end of the light mixing unit 210. At this time, the three LED chips 211 at one end and the three LED chips 211 at the other end of the light mixing unit 210 have a symmetrical arrangement, and the light emitting colors and positions thereof have a certain complementary effect, so that the uniformity of light mixing can be further improved.
The light mixing uniformity can also be improved by controlling the distance between the LED chips 211, for example, referring to fig. 1, a triangle formed by connecting three LED chips 211 at one end of the light mixing unit 210 is an isosceles triangle or an equilateral triangle; at this time, the distances between the three LED chips 211 are partially or completely the same, and the light mixing effect of the three LED chips 211 at one end of the light mixing unit 210 is further improved. Of course, a triangle formed by connecting lines of the three LED chips 211 at the other end of the light mixing unit 210 may also be an isosceles triangle or an equilateral triangle. Similarly, at this time, the light mixing effect of the three LED chips 211 at the other end of the light mixing unit 210 is further improved.
The reflective wall 300 is a glue layer mixed with a high reflective material. The high-reflection material may be a reflection material commonly used for backlight modules such as titanium dioxide, etc., the adhesive layer is generally white silica gel, and the adhesive layer mixed with the high-reflection material is formed on the substrate 100 by means of dispensing or printing.
The reflective barriers 300 surrounding the three LED chips 211 in the light mixing unit 210 are defined to form an independent light mixing space, and the shape of the reflective barriers can be selected according to the light mixing requirement, for example, the reflective barriers can be rectangular, circular, hexagonal, trapezoidal, triangular, irregular polygonal, or the like. Referring to fig. 1 and fig. 2, in the present embodiment, the reflective barriers 300 surrounding the three LED chips 211 in the light mixing unit 210 are rectangular, and the size of each rectangular light mixing space is the same, so that a more uniform light mixing effect can be achieved.
Referring to fig. 2, in order to obtain a better light mixing effect, the height of the reflective wall 300 may be set to be greater than the height of the LED chip 211. At this moment, light can be concentrated in respective independent light mixing spaces, mutual interference of the LED chips 211 in different light mixing spaces is weakened, and a good light mixing effect is guaranteed.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. The backlight module provided by the embodiment of the present application is introduced in detail, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (9)
1. A backlight module, comprising:
a substrate;
the backlight source is arranged on the substrate and comprises a plurality of light mixing units arranged in an array manner, each light mixing unit comprises two rows of LED chips arranged in a staggered manner, and each row of LED chips comprises a red LED chip, a green LED chip and a blue LED chip; the light emitting color of any one LED chip in the light mixing unit is different from the light emitting colors of all the adjacent LED chips;
the light-reflecting retaining wall, the light-reflecting retaining wall set up in on the base plate, the light-reflecting retaining wall encircles mix the light unit and will mix in the light unit three of one end the LED chip separates with the three of other one end the LED chip.
2. The backlight module as claimed in claim 1, wherein the width of the LED chip is 20-500 μm.
3. The backlight module as claimed in claim 2, wherein the distance between two adjacent LED chips in the light mixing unit is 20-500 μm.
4. The backlight module according to any of claims 1 to 3, wherein a triangle formed by connecting lines of three LED chips at one end of the light mixing unit is equal to a triangle formed by connecting lines of three LED chips at the other end of the light mixing unit.
5. The backlight module according to any of claims 1 to 3, wherein a triangle formed by connecting lines of the three LED chips at one end of the light mixing unit is an isosceles triangle or an equilateral triangle; and/or the presence of a gas in the atmosphere,
and a triangle formed by connecting lines of the three LED chips at the other end of the light mixing unit is an isosceles triangle or an equilateral triangle.
6. The backlight module as claimed in claim 1, wherein the light-reflecting walls are glue layers mixed with high-reflection materials.
7. The backlight module as claimed in claim 1, wherein the reflecting walls surrounding the three LED chips in the light mixing unit are rectangular, circular, hexagonal, trapezoidal, triangular or irregular polygonal.
8. The backlight module as claimed in claim 1, wherein the height of the reflective wall is greater than that of the LED chip.
9. A display panel comprising a backlight module according to any one of claims 1-8.
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