CN114515459A - Five-coordinate four-linkage semiconductor laser processing system - Google Patents
Five-coordinate four-linkage semiconductor laser processing system Download PDFInfo
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- CN114515459A CN114515459A CN202210177578.9A CN202210177578A CN114515459A CN 114515459 A CN114515459 A CN 114515459A CN 202210177578 A CN202210177578 A CN 202210177578A CN 114515459 A CN114515459 A CN 114515459A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000001914 filtration Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 12
- 239000000498 cooling water Substances 0.000 claims description 5
- 230000003749 cleanliness Effects 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 10
- 239000007787 solid Substances 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract description 5
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D33/00—Filters with filtering elements which move during the filtering operation
- B01D33/04—Filters with filtering elements which move during the filtering operation with filtering bands or the like supported on cylinders which are impervious for filtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D33/00—Filters with filtering elements which move during the filtering operation
- B01D33/70—Filters with filtering elements which move during the filtering operation having feed or discharge devices
- B01D33/76—Filters with filtering elements which move during the filtering operation having feed or discharge devices for discharging the filter cake, e.g. chutes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D33/00—Filters with filtering elements which move during the filtering operation
- B01D33/80—Accessories
- B01D33/801—Driving means, shaft packing systems or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of laser processing, and discloses a five-coordinate four-linkage semiconductor laser processing system which comprises a structural main body, wherein a workbench is arranged at the bottom of the structural main body, a material collecting assembly is arranged in the middle of the top of the workbench, a material guide assembly is movably connected in the middle of the interior of the workbench, and a first material port is formed in one side of the interior of the workbench. According to the invention, through filtering the passing water flow by using the filter belt, the debris carried in the water flow is intercepted to the surface of the filter belt, is intensively guided to the right position of the workbench under the action of the filter belt and is guided out from the second material port, and meanwhile, the water flow penetrating through the filter belt directly drops to the surface of the water guide plate and is guided out from the first material port on the left side of the workbench along the inclined water guide plate, so that the workbench can limit and support the laser equipment and the clamping assembly, and the liquid and the solid in the waste liquid can be separately collected.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a five-coordinate four-linkage semiconductor laser processing system.
Background
A five-coordinate four-linkage laser numerical control machine tool is a process test instrument used in the field of mechanical engineering, and five-axis linkage refers to that at least five coordinate axes (three linear coordinates and two rotation coordinates) are arranged on one machine tool, and can simultaneously coordinate and move to process under the control of a computer numerical control system.
However, the workbench of the conventional five-coordinate four-linkage laser numerical control machining machine tool can only be used as a supporting platform for supporting the equipment assembly and the clamping assembly, so that the function of the workbench is relatively single, and the utilization rate of the workbench is reduced.
Therefore, a five-coordinate four-linkage semiconductor laser processing system is designed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a five-coordinate four-linkage semiconductor laser processing system, which solves the problems that a workbench on the conventional five-coordinate four-linkage laser numerical control processing machine tool can only be used as a supporting platform for supporting an equipment assembly and a clamping assembly, so that the function of the workbench is single, and the utilization rate of the workbench is reduced.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a five coordinates four-linkage semiconductor laser processing system, includes the main structure body, the bottom of main structure body is provided with the workstation, the intermediate position department at workstation top is provided with the subassembly that gathers materials, the inside intermediate position department swing joint of workstation has the guide subassembly, the inside one side of workstation is provided with first material mouth, the inside one side of keeping away from first material mouth of workstation is provided with the second material mouth, the both ends that one side of workstation is close to second material mouth one side all are provided with the extension board, the inside bottom of workstation sets up the water deflector, the top of water deflector evenly is provided with the multiunit guiding gutter.
Further, the subassembly that gathers materials includes the silo, the inside one side of silo is provided with the swash plate, the inside one side of keeping away from the swash plate of silo is provided with the inclined plane, the inside top in silo all evenly is provided with the multiunit bracing piece, the both sides of bracing piece all respectively with inclined plane and the adjacent one side fixed connection of swash plate.
Further, the guide subassembly includes the motor, the output of motor is provided with first guide roll, the bottom of swash plate one end is rotated and is connected with the second guide roll, the outside cover of first guide roll and second guide roll is equipped with the filter belt, the filter belt is the slope of below the right side, and the filter belt is the angle of slope below the right side 5.
Further, the water deflector and the guiding gutter 7 are both inclined towards the lower left, and the inclination of the water deflector and the guiding gutter 7 towards the lower left is all 5 °.
Furthermore, the two ends of the first guide roller and the two ends of the second guide roller are respectively provided with a bearing seat, and the first guide roller and the second guide roller are respectively and rotationally connected with the two ends of one side inside the workbench and the two groups of one ends adjacent to the support plates through the mutual matching of the bearing seats and the bearings.
Further, the swash plate inclines to the lower right, and the angle at which the swash plate inclines to the lower right is 25 °.
Further, the inclined surface is inclined toward the lower left, and the angle at which the inclined surface is inclined toward the lower left is 25 °.
Further, the method specifically comprises the following steps:
firstly, clamping a workpiece on a working platform, wherein a rotary spindle system comprises a headstock, a tailstock and two brackets, so that the heavy shaft workpiece can be conveniently clamped, and a laser head is arranged on a Z axis, is positioned right above the working platform and is centrally controlled by a control console;
the debris generated in the laser processing directly falls onto the surface of the filter belt along the trough, and meanwhile, the output end of the motor drives the first guide roller to rotate under the action of electric power and drives the filter belt and the second guide roller on the other side to rotate, so that the debris falling onto the surface of the filter belt is better guided to the right position of the workbench in a centralized manner under the action of the filter belt, the debris generated in the laser cutting process is conveniently cleaned in a centralized manner, and the surface cleanliness of the workbench is ensured;
step three, when cooling water is needed to cool the section to be processed in the laser processing procedure, water flow guided out along the workbench carries debris to drop into the material groove, then the water flow passing through is filtered by the filter belt, so that the debris carried in the water flow is intercepted on the surface of the filter belt, and then the intercepted slag is guided to the right side of the workbench and guided out from the second material port under the action of the motor;
And step four, directly dripping the water flow permeated by the filter belt onto the surface of the water guide plate, and guiding the water flow out of the first material port on the left side of the workbench along the inclined water guide plate and the guide groove.
The beneficial effects of the invention are as follows:
1. the invention is characterized in that through the arranged material groove, the motor, the first guide roller, the second guide roller, the filter belt, the support plate, the water guide plate and the guide groove, when cooling water is needed to cool a section to be processed in a laser processing procedure, water flow guided out along a workbench carries debris to drop into the material groove, then the filter belt is used for filtering the passing water flow, so that the debris carried in the water flow is intercepted on the surface of the filter belt, then the output end of the motor drives the first guide roller to rotate under the action of electric power and drives the filter belt and the second guide roller on the other side to rotate, thereby the debris which fall to the surface of the filter belt and are intercepted are better concentrated and guided to the position on the right side of the workbench under the action of the filter belt and are guided out from the second material opening, meanwhile, the water flow which penetrates through the filter belt directly drops to the surface of the water guide plate and is guided out from the first material opening on the left side of the workbench along the inclined water guide plate and the guide groove, thereby make the workstation carry out spacing support to laser equipment and centre gripping subassembly, can also realize collecting alone the liquid in the waste liquid and solid to make the function of workstation more extensive.
2. According to the filter belt protection device, the material groove and the supporting rod are arranged, the supporting rod is used for shielding the material groove, when a workpiece falls to the surface of the workbench without being clamped and fixed, the workpiece can be placed on the surface of the supporting rod, the phenomenon that the loosened workpiece directly impacts the filter belt is avoided, the filter belt is protected, the service life of the workbench is prolonged to a certain extent, and the normal use of the workbench is guaranteed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial perspective view of the present invention;
FIG. 3 is a schematic view of a part of the structure of the working table of the present invention;
FIG. 4 is an enlarged view of A of FIG. 1 according to the present invention;
FIG. 5 is an enlarged view of B of FIG. 2 according to the present invention.
In the figure: 1. a structural body; 2. a work table; 3. an aggregate assembly; 301. a trough; 302. a sloping plate; 303. a support bar; 304. a bevel; 4. a material guiding assembly; 401. a motor; 402. a first guide roller; 403. a second guide roller; 404. a filter belt; 5. a support plate; 6. a water guide plate; 7. a diversion trench; 8. a first material port; 9. and a second material port.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to FIGS. 1-5: the utility model provides a five coordinates four-linkage semiconductor laser processing system, including structure subject 1, structure subject 1's bottom is provided with workstation 2, the intermediate position department at 2 tops of workstation is provided with the subassembly 3 that gathers materials, 2 inside intermediate position departments swing joint of workstation have guide subassembly 4, 2 inside one side of workstation is provided with first material mouth 8, one side that first material mouth 8 was kept away from to the inside of workstation 2 is provided with second material mouth 9, both ends that one side of workstation 2 is close to second material mouth 9 one side all are provided with extension board 5, the inside bottom of workstation 2 sets up water deflector 6, the top of water deflector 6 evenly is provided with multiunit guiding gutter 7.
In the invention, water flow guided out along a workbench 2 carries debris to drip into a trough 301, then the water flow passing through is filtered by a filter belt 404, so that the debris carried in the water flow is intercepted on the surface of the filter belt 404, then an output end of a motor 401 drives a first guide roller 402 to rotate under the action of electric power and drives the filter belt 404 and a second guide roller 403 on the other side to rotate, so that the debris intercepted on the surface of the filter belt 404 is better guided to the right side position of the workbench 2 in a centralized way under the action of the filter belt 404 and is guided out from a second material opening 9, meanwhile, the water flow penetrating through the filter belt 404 directly drips onto the surface of a water guide plate 6 and is guided out from a first material opening 8 on the left side of the workbench 2 along an inclined water guide plate 6 and a guide groove 7, so that the workbench 2 can carry out limit support on laser equipment and a clamping assembly, and can realize independent collection of liquid and solid in waste liquid, thereby making the function of the table 2 more extensive.
Please refer to fig. 1, 2, 3, 4 and 5, the collecting component 3 includes a trough 301, an inclined plate 302 is disposed on one side inside the trough 301, an inclined plane 304 is disposed on one side of the inside of the trough 301 away from the inclined plate 302, a plurality of sets of support rods 303 are uniformly disposed on the top end inside the trough 301, two sides of each support rod 303 are fixedly connected to one side of the inclined plane 304 adjacent to the inclined plate 302, the trough 301 is shielded by the support rods 303, and when a workpiece drops to the surface of the worktable 2 without being clamped and fixed, the workpiece is put on the surface of the support rods 303, so that the workpiece which is loosened is prevented from directly impacting the filter belt 404, thereby protecting the filter belt 404, prolonging the service life of the worktable 2 to a certain extent, and ensuring the normal use of the worktable 2.
Please refer to fig. 1, 2, 3 and 4, the guiding assembly 4 includes a motor 401, a first guiding roller 402 is disposed at an output end of the motor 401, a second guiding roller 403 is rotatably connected to a bottom end of one end of the sloping plate 302, a filter belt 404 is sleeved outside the first guiding roller 402 and the second guiding roller 403, the filter belt 404 inclines to a lower right, an angle of the filter belt 404 inclining to the lower right is 5 °, and the filter belt 404 is utilized to separate liquid and solid in the waste liquid.
Please refer to fig. 1, 3 and 5, the water deflector 6 and the guiding gutter 7 are both inclined towards the lower left, and the inclination of the water deflector 6 and the guiding gutter 7 towards the lower left is 5 °, so that the water flow guided out by the water deflector 6 is more concentrated by the surface of the guiding gutter 7, and the water flow is prevented from sliding off from the two ends of the top of the water deflector 6.
Please refer to fig. 1, bearing seats are disposed at two ends of the first guide roller 402 and the second guide roller 403, and the first guide roller 402 and the second guide roller 403 are respectively rotatably connected to two ends of one side of the inside of the workbench 2 and one end of the two adjacent support plates 5 through the cooperation of the bearing seats and the bearings.
Referring to fig. 1, 2, 3, 4 and 5, the inclined plate 302 is inclined towards the lower right, and the inclined plate 302 is inclined towards the lower right by 25 degrees, so that the water stains on the edge of the trough 301 are better guided to the surface of the filter belt 404 by the inclined plate 302 inclined towards the lower right by 25 degrees.
Referring to fig. 1, 2, 3 and 5, the inclined plane 304 is inclined towards the lower left, and the inclined plane 304 is inclined towards the lower left by an angle of 25 °, and the inclined plane 304 inclined towards the lower left by an angle of 25 ° is better for guiding the water stain at the edge of the trough 301 to the surface of the filter belt 404.
Please refer to fig. 1, 2, 3, 4 and 5, which specifically includes the following steps:
Firstly, clamping a workpiece on a working platform, wherein a rotary spindle system comprises a headstock, a tailstock and two brackets, so that a heavy shaft workpiece can be conveniently clamped, and a laser head is arranged on a Z shaft, is positioned right above the working platform 2 and is centrally controlled by a control platform;
secondly, the chips generated in the laser processing directly fall onto the surface of the filter belt 404 along the trough 301, meanwhile, the output end of the motor 401 drives the first guide roller 402 to rotate under the action of electric power, and drives the filter belt 404 and the second guide roller 403 on the other side to rotate, so that the chips falling onto the surface of the filter belt 404 are better guided to the right position of the workbench 2 in a concentrated manner under the action of the filter belt 404, the chips generated in the laser cutting process are conveniently cleaned in a concentrated manner, and the surface cleanliness of the workbench 2 is ensured;
thirdly, when cooling water is needed to cool the section to be processed in the laser processing procedure, the water flow guided out along the workbench 2 carries debris to drop into the trough 301, and then the water flow passing through is filtered by the filter belt, so that the debris carried in the water flow is intercepted on the surface of the filter belt 404, and then the intercepted slag is guided to the right side of the workbench 2 and guided out from the second material port 9 under the action of the motor 401;
Step four, the water flow penetrating through the filter belt 404 directly drops to the surface of the water guide plate 6 and is guided out from the first material port 8 on the left side of the workbench 2 along the inclined water guide plate 6 and the guide groove 7.
In summary, when the present invention is used, when cooling water is needed to cool a section to be processed in a laser processing process, water flow guided out along the worktable 2 carries debris to drop into the trough 301, the filter belt 404 is used to filter the water flow passing through, so that the debris carried in the water flow is trapped on the surface of the filter belt 404, then the output end of the motor 401 drives the first guide roller 402 to rotate under the action of electric power, and drives the filter belt 404 and the second guide roller 403 on the other side to rotate, so that the debris trapped on the surface of the filter belt 404 is better guided to the right side position of the worktable 2 under the action of the filter belt 404, and is guided out from the second material port 9, and meanwhile, the water flow penetrating through the filter belt 404 directly drops onto the surface of the water guide plate 6, and is guided out from the first material port 8 on the left side of the worktable 2 along the inclined water guide plate 6 and the guide groove 7, thereby make workstation 2 can carry out spacing support to laser equipment and centre gripping subassembly, can also realize collecting alone the liquid in the waste liquid and solid, thereby make the function of workstation 2 more extensive, and utilize bracing piece 303 to shelter from silo 301, when the machined part is under the fixed tight of centre gripping not, when dropping to workstation 2 surface, can take on the surface of bracing piece 303, the machined part of having avoided not hard up down directly produces the impact to filter belt 404, thereby the realization is to the protection of filter belt 404, workstation 2's life has been prolonged to a certain extent, thereby workstation 2's normal use has been guaranteed.
The above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A five-coordinate four-linkage semiconductor laser processing system comprises a structure body (1), and is characterized in that: the bottom of main structure body (1) is provided with workstation (2), the intermediate position department at workstation (2) top is provided with the subassembly (3) that gathers materials, the intermediate position department swing joint of workstation (2) inside has guide subassembly (4), the inside one side of workstation (2) is provided with first material mouth (8), the inside one side of keeping away from first material mouth (8) of workstation (2) is provided with second material mouth (9), the both ends that one side of workstation (2) is close to second material mouth (9) one side all are provided with extension board (5), the inside bottom of workstation (2) sets up water deflector (6), the top of water deflector (6) evenly is provided with multiunit guiding gutter (7).
2. The five-coordinate four-linkage semiconductor laser processing system according to claim 1, wherein: subassembly (3) of gathering materials includes silo (301), the inside one side of silo (301) is provided with swash plate (302), one side that swash plate (302) was kept away from to the inside of silo (301) is provided with inclined plane (304), the inside top of silo (301) all evenly is provided with multiunit bracing piece (303), the both sides of bracing piece (303) all respectively with inclined plane (304) and swash plate (302) adjacent one side fixed connection.
3. The five-coordinate four-linkage semiconductor laser processing system according to claim 1, wherein: guide subassembly (4) include motor (401), the output of motor (401) is provided with first guide roll (402), the bottom of swash plate (302) one end is rotated and is connected with second guide roll (403), the outside cover of first guide roll (402) and second guide roll (403) is equipped with filtering belt (404), filtering belt (404) below the right side slope, and the angle of filtering belt (404) below the right side slope is 5.
4. The five-coordinate four-linkage semiconductor laser processing system according to claim 1, wherein: the water deflector (6) and the diversion trench (7) incline towards the lower left, and the inclination of the water deflector (6) and the diversion trench (7) towards the lower left is 5 degrees.
5. The five-coordinate four-linkage semiconductor laser processing system according to claim 3, wherein: bearing seats are arranged at two ends of the first guide roller (402) and the second guide roller (403), and the first guide roller (402) and the second guide roller (403) are respectively and rotatably connected with two ends of one side inside the workbench (2) and two groups of one ends of the support plates (5) adjacent to each other through the mutual matching of the bearing seats and the bearings.
6. The five-coordinate four-linkage semiconductor laser processing system according to claim 1, wherein: the inclined plate (302) inclines towards the lower right, and the angle of inclination of the inclined plate (302) towards the lower right is 25 degrees.
7. The five-coordinate four-linkage semiconductor laser processing system according to claim 1, wherein: the inclined surface (304) inclines towards the lower left, and the angle of inclination of the inclined surface (304) towards the lower left is 25 degrees.
8. A five-coordinate four-linkage semiconductor laser processing method is characterized in that: the method specifically comprises the following steps:
firstly, clamping a workpiece on a working platform, wherein a rotary spindle system comprises a headstock, a tailstock and two brackets, so that the heavy shaft workpiece can be conveniently clamped, and a laser head is arranged on a Z axis, is positioned right above the working platform (2) and is centrally controlled by a control console;
Step two, the chips generated in the laser processing directly fall onto the surface of a filter belt (404) along a material groove (301), meanwhile, the output end of a motor (401) drives a first guide roller (402) to rotate under the action of electric power, and drives the filter belt (404) and a second guide roller (403) on the other side to rotate, so that the chips falling onto the surface of the filter belt (404) are better guided to the right side position of a workbench (2) in a concentrated manner under the action of the filter belt (404), the chips generated in the laser cutting process are convenient to be cleaned in a concentrated manner, and the surface cleanliness of the workbench (2) is ensured;
step three, when cooling water is needed to cool the section to be processed in the laser processing procedure, debris carried by water flow guided out along the workbench (2) drops into the trough (301), and then the water flow passing through is filtered by using a filter belt, so that the debris carried by the water flow is intercepted on the surface of the filter belt (404), and then the intercepted slag is guided to the right side of the workbench (2) and guided out from the second material port (9) under the action of a motor (401);
and fourthly, directly dripping the water flow permeated by the filter belt (404) onto the surface of the water guide plate (6), and leading out from the first material port (8) on the left side of the workbench (2) along the inclined water guide plate (6) and the guide groove (7).
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| CN202210177578.9A CN114515459A (en) | 2022-02-25 | 2022-02-25 | Five-coordinate four-linkage semiconductor laser processing system |
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| CN202210177578.9A CN114515459A (en) | 2022-02-25 | 2022-02-25 | Five-coordinate four-linkage semiconductor laser processing system |
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| US5073694A (en) * | 1991-02-21 | 1991-12-17 | Synthes (U.S.A.) | Method and apparatus for laser cutting a hollow metal workpiece |
| CN204637731U (en) * | 2015-04-03 | 2015-09-16 | 南通钜盛数控机床有限公司 | A kind of retracting device of Digit Control Machine Tool cooling fluid |
| CN205414711U (en) * | 2016-03-10 | 2016-08-03 | 南京新华人防设备有限公司 | Laser cutting machine workbench |
| CN109454334A (en) * | 2018-10-24 | 2019-03-12 | 西安交通大学 | A kind of medium-temperature reinforced system and method for laser-impact |
| CN213531243U (en) * | 2020-09-07 | 2021-06-25 | 青岛捷辉机械科技有限公司 | Laser cutting machine waste residue collection device |
| CN213857101U (en) * | 2020-09-25 | 2021-08-03 | 吴江市富明机械有限公司 | Novel lathe |
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