CN114488439B

CN114488439B - Optical module

Info

Publication number: CN114488439B
Application number: CN202210217109.5A
Authority: CN
Inventors: 张加傲; 王欣南; 于琳; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-03-07
Filing date: 2022-03-07
Publication date: 2023-09-19
Anticipated expiration: 2042-03-07
Also published as: CN114488439A

Abstract

The optical module provided by the application comprises: a circuit board and a first optical transceiver assembly; the first optical transceiver module includes: the first base is arranged on the circuit board; a first silicon optical chip disposed on the first base for receiving light not carrying a signal to generate an optical signal by modulation and to receive the optical signal from the outside; the first light source is arranged on the first base and is used for providing light which does not carry signals for the first silicon optical chip; the first secondary circuit board is arranged on the circuit board and is electrically connected with the circuit board through a solder ball, a first notch is arranged at the end part of the first secondary circuit board, the first notch surrounds the side edge of the first silicon optical chip in a semi-surrounding mode, a bonding pad is arranged on the top surface of the edge of the first notch, and the bonding pad is connected with the first silicon optical chip in a wire bonding mode; the first digital signal processing chip is arranged on the first secondary circuit board and is electrically connected with the first secondary circuit board through solder balls. The optical module provided by the embodiment of the application solves the problem of crosstalk when the wiring on the circuit board is more when the integration level of the optical module is higher.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

At present, with the continuous improvement of the transmission rate requirement of the optical module, the integration level of the optical module is higher and higher; when the integration level of the optical module is higher, the power density of the optical module is also increased, and the photoelectric devices, wires and the like arranged on the circuit board in the optical module are increased. When the number of photoelectric devices, wires and the like arranged on the circuit board is increased, the wires on the circuit board are crowded, and the problems of signal crosstalk increase among the wires and the like are easy to occur, so that the performance of the optical module is degraded.

Disclosure of Invention

The embodiment of the application provides an optical module, which aims to solve the problem that when the integration level of the optical module is high, more photoelectric devices and wires are arranged on a circuit board of the optical module, so that the transmission rate of the optical module is influenced. .

The application provides an optical module, comprising:

a circuit board;

the first optical transceiver component is electrically connected with the circuit board and is used for generating optical signals and receiving optical signals from the outside;

wherein, first light transceiver module includes:

the first base is arranged on the circuit board;

a first silicon optical chip disposed on the first base for receiving light not carrying a signal to generate an optical signal by modulation and to receive an optical signal from the outside;

The first light source is arranged on the first base and is used for providing light which does not carry signals for the first silicon optical chip;

the first secondary circuit board is arranged on the circuit board and is electrically connected with the circuit board through a solder ball, a first notch is arranged at the end part of the first secondary circuit board, the first notch surrounds the side edge of the first silicon optical chip in a semi-surrounding mode, a bonding pad is arranged on the top surface of the edge of the first notch, and the bonding pad is connected with the first silicon optical chip in a wire bonding mode;

the first digital signal processing chip is arranged on the first secondary circuit board and is electrically connected with the first secondary circuit board through solder balls.

The optical module comprises a circuit board and a first optical transceiver component, wherein the first optical transceiver component is electrically connected with the circuit board; the first optical transceiver component comprises a first base, a first silicon optical chip, a first light source, a first secondary circuit board and a first digital signal processing chip, wherein the first silicon optical chip, the first light source, the first secondary circuit board and the first digital signal processing chip are arranged on the first base, the first light source provides light which does not carry signals for the first silicon optical chip, and the first digital signal processing chip is electrically connected with the first silicon optical chip through a circuit wiring on the first secondary circuit board so as to realize signal transmission between the digital signal processing chip and the silicon optical chip, and further realize that the first optical transceiver component generates optical signals and receives optical signals from the outside of the optical module. The optical module provided by the application comprises the first base, the first silicon optical chip, the first light source, the first secondary circuit board and the first optical transceiver component of the first digital signal processing chip, so that the optical transceiver component can be conveniently and independently assembled, the production of the optical module is more manufacturability and stronger repairability, the yield and reliability of the optical module product are improved, the local detail processing is finer, and the performance is more excellent.

In the optical module provided by the application, the first secondary circuit board is arranged in the first optical transceiver component, and the transmission of the high-frequency signals between the first digital signal processing chip and the first silicon optical chip is realized through the first secondary circuit board, so that a transmission path is fully provided for the high-frequency signal transmission between the first digital signal processing chip and the first silicon optical chip. Meanwhile, in the optical module provided by the application, the first circuit board is combined with the circuit board, so that the utilization rate of the internal space of the optical module is fully increased, and sufficient space is provided for wiring of the internal circuit of the optical module, so that the optical performance, the high-frequency performance, the thermal performance and the like of the optical module are more coordinated, and the optical module is convenient to develop towards a higher speed direction.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system provided according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments;

fig. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments;

fig. 6 is a schematic diagram of an internal structure of another optical module provided in accordance with some embodiments;

FIG. 7 is an exploded schematic view of an optical module interior provided in accordance with some embodiments;

fig. 8 is a second schematic diagram of an internal structure of an optical module according to some embodiments;

FIG. 9 is a partially schematic illustration of an internal decomposition of an optical module provided in accordance with some embodiments;

FIG. 10 is an exploded schematic view of another optical module interior provided in accordance with some embodiments;

fig. 11 is a second schematic diagram of an internal structure of another optical module according to some embodiments;

fig. 12 is a front view of a first optical transceiver module provided in accordance with some embodiments;

fig. 13 is a perspective view of a first optical transceiver module provided in accordance with some embodiments;

FIG. 14 is an exploded view of a first optical transceiver module provided in accordance with some embodiments;

fig. 15 is a second perspective view of a first optical transceiver module according to some embodiments;

FIG. 16 is a schematic view of the basic structure of a base provided in accordance with some embodiments;

FIG. 17 is an exploded view of a submount and light source, silicon photonics chip, etc. provided in accordance with some embodiments;

FIG. 18 is a state diagram of use of a base provided in accordance with some embodiments;

fig. 19 is an exploded view of a first optical transceiver component according to some embodiments;

fig. 20 is a second exploded view of a partial structure of a first optical transceiver according to some embodiments;

FIG. 21 is a schematic illustration of a protective cover provided in accordance with some embodiments;

FIG. 22 is a schematic diagram of a secondary circuit board according to some embodiments;

fig. 23 is a schematic diagram ii of a secondary circuit board according to some embodiments;

FIG. 24 is a schematic top view of a secondary circuit board according to some embodiments;

FIG. 25 is a schematic diagram of a third layer of a secondary circuit board according to an embodiment of the present application;

FIG. 26 is a schematic diagram of a sixth layer of a secondary circuit board according to one embodiment of the present application;

FIG. 27 is a schematic diagram of a second layer of a secondary circuit board according to an embodiment of the present application;

fig. 28 is a schematic structural diagram of a seventh layer of a secondary circuit board according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", "some examples", "and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. By way of example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module provided in accordance with some embodiments, and fig. 4 is an exploded view of an optical module provided in accordance with some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and two side walls are combined with the two side plates to realize that the upper case 201 is covered on the lower case 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. Illustratively, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver module inside the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, devices such as the circuit board 300, the optical transceiver component and the like are conveniently installed in the shell, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when devices such as the circuit board 300 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently arranged, and the automatic implementation and production are facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located on an outer wall of the housing, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, and includes a snap-in member that mates with the cage of the host computer (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), transimpedance amplifier (Transimpedance Amplifier, TIA), clock data recovery chip (Clock and Data Recovery, CDR), power management chip, digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (for example, the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

In the embodiment of the present application, the optical module 200 further includes an optical fiber connector 400, where the optical fiber connector 400 is disposed at the optical port 205, and the optical fiber connector 400 is used to realize optical connection between an external optical fiber and the optical port, so that an optical signal channel generated by the optical transceiver component is transmitted to the external optical fiber through the optical fiber connector 400, and an optical signal output by the external optical fiber is transmitted to the optical transceiver component through the optical fiber connector 400.

In the embodiment of the present application, an optical transceiver is further disposed on the circuit board 300, and the optical transceiver is electrically connected to the circuit board 300 and is used for generating an optical signal and receiving an optical signal output by an external optical fiber. In the embodiment of the application, the optical transceiver component is connected with the optical fiber connector 400 through the optical fiber ribbon, the optical signal generated by the optical transceiver component is transmitted to the optical fiber connector 400 through the optical fiber ribbon, and the optical signal output by the external optical fiber is transmitted to the optical fiber ribbon through the optical fiber connector 400 and then transmitted to the optical transceiver component through the optical fiber ribbon. In some embodiments of the present application, one optical transceiver or two optical transceivers are disposed on the circuit board 300, however, embodiments of the present application are not limited to one or two optical receivers, and more than two optical receivers may be disposed under the condition of space permission. Illustratively, the circuit board 300 is further provided with a first optical transceiver component, or the first optical transceiver component and the second optical transceiver component on the circuit board 300.

Fig. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments, and fig. 5 shows an assembly relationship between an optical transceiver module and a circuit board 300 according to an embodiment of the application. As shown in fig. 5, the optical module provided in the embodiment of the application includes a first optical transceiver component 500, where the first optical transceiver component 500 is disposed on the circuit board 300. The first optical transceiver 500 is disposed in the middle of the circuit board 300, which is not limited to this, and may be adjusted as required.

As shown in fig. 5, a first optical transceiver 500 according to some embodiments of the present application includes a first base 510, a first light source 520, a first silicon optical chip 530, and a first sub-circuit board 540; the first base 510 is disposed on the circuit board 300, and the top of the first base 510 is used for carrying the first light source 520 and the first silicon optical chip 530; the first light source 520 is disposed on one side of the first silicon optical chip 530, the end of the first sub-circuit board 540 is provided with a first notch, and the first sub-circuit board 540 is disposed on the other side of the first silicon optical chip 530 through the first notch; the first secondary circuit board 540 is located above the circuit board 300, and the bottom of the first secondary circuit board 540 is attached to the electrical connection circuit board 300, and the top is used for carrying devices such as the first digital signal processing chip 550, and is connected to the first silicon optical chip 530 by wire bonding, so that the first digital signal processing chip 550 is only used for driving and connecting the first silicon optical chip 530, but the driving of the first silicon optical chip 530 in the present application is not limited to the first digital signal processing chip 550. Illustratively, the first sub-circuit board 540 is parallel to the circuit board 300. In some embodiments of the present application, the first light source 520 is disposed on a side of the first silicon optical chip 530 away from the gold finger on the circuit board 300, i.e. a side of the first silicon optical chip 530 close to the optical port. In some embodiments of the present application, the first base 510, the first light source 520, the first silicon optical chip 530, and the like may be referred to as a first silicon optical assembly for generating an optical signal and directly receiving an optical signal from the outside.

The first light source 520 is configured to generate light that does not carry a signal and transmit the light to the first silicon optical chip 530, and the first silicon optical chip 530 receives the light that does not carry a signal and modulates the light to output light that carries a signal, where the light that carries a signal is transmitted to the optical fiber connector 400 through the optical fiber ribbon; the optical signal transmitted from the external optical fiber is transmitted to the optical fiber ribbon inside the optical module through the optical fiber connector 400, and is transmitted to the first silicon optical chip 530 through the optical fiber ribbon, and the first silicon optical chip 530 receives the optical signal and converts it into an electrical signal. In some embodiments of the present application, to facilitate coupling of an optical signal generated by the first silicon optical chip 530 to an optical fiber ribbon and coupling of an externally input optical signal transmitted in the optical fiber ribbon to the first silicon optical chip 530, the optical fiber ribbon inside the optical module includes an emitting optical fiber ribbon and a receiving optical fiber ribbon, an optical signal light outlet of the first silicon optical chip 530 is provided with an optical outlet, an optical signal light inlet of the first silicon optical chip 530 is provided with an optical inlet, one end of the emitting optical fiber ribbon is connected to the optical fiber connector 400, the other end is connected to the optical outlet, and one end of the receiving optical fiber ribbon is connected to the optical fiber connector 400, and the other end is connected to the optical connector.

In some embodiments of the present application, the first submount 510 serves as a heat sink for the first light source 520 and the first silicon photo chip 530. Illustratively, the first base 510 is a copper block with good heat conduction capability, and is capable of performing good heat dissipation for the first light source 520 and the first silicon photo chip 530.

In the embodiment of the present application, the first optical transceiver module 500 is provided with the first secondary circuit board 540, so as to ensure the arrangement space and routing requirements of the devices such as the first digital signal processing chip 550. For example, the first digital signal processing chip 550 is disposed on the first secondary circuit board 540, and most of the wires related to the first digital signal processing chip 550 are disposed in the first secondary circuit board 540; on the one hand, the first secondary circuit board 540 is used for realizing the signal transmission between the first digital signal processing chip 550 and the first silicon optical chip 530, so that the density of high-speed signal wires for signal transmission between the first digital signal processing chip 550 and the first silicon optical chip 530 can be reduced, and the crosstalk between the first digital signal processing chip 550 and the first silicon optical chip 530 can be reduced; on the other hand, the power lines associated with the first dsp 550 are disposed inside the first pcb 540, which can effectively prevent ESD, power rail collapse, reduce ground bounce, and the like.

In the optical module with the structure shown in fig. 5, the first circuit board 540 is combined with the circuit board 300, so that the utilization rate of the internal space of the optical module can be fully expanded, and sufficient space is provided for the wiring of the internal circuit of the optical module, so that the optical performance, the high-frequency performance, the thermal performance and the like of the optical module can be more coordinated, and the optical module can be developed towards a higher speed direction.

In some embodiments of the present application, BGA (Ball Grid Array Package, ball grid array) solder balls are disposed on the back surface (the surface facing the first secondary circuit board 540) of the first digital signal processing chip 550, and are correspondingly electrically connected to corresponding pads on the first secondary circuit board 540 through the BGA solder balls.

Fig. 6 is a schematic diagram of an internal structure of another optical module according to some embodiments, and fig. 6 shows an assembly relationship between another optical transceiver module and a circuit board 300 according to an embodiment of the present application. As shown in fig. 6, in the optical module provided in some embodiments of the present application, a first optical transceiver module 500 and a second optical transceiver module 600 are included, and the first optical transceiver module 500 and the second optical transceiver module 600 are disposed on the circuit board 300. As shown in fig. 6, the second optical transceiver module 600 is disposed on the left side of the first optical transceiver module 500, but the embodiment of the application is not limited thereto, and the second optical transceiver module 600 may be disposed on the right side of the first optical transceiver module 500.

As shown in fig. 6, a second optical transceiver module 600 according to some embodiments of the present application includes a second base 610, a second light source 620, a second silicon optical chip 630, and a second sub-circuit board 640; the second base 610 is disposed on the circuit board 300, and the top of the second base 610 is used for carrying the second light source 620 and the second silicon optical chip 630; the second light source 620 is disposed on one side of the second silicon optical chip 630, the end of the second secondary circuit board 640 is provided with a second notch, and the second secondary circuit board 640 is disposed on the other side of the second silicon optical chip 630 in a matching manner through the second notch; the second secondary circuit board 640 is disposed above the circuit board 300, and the bottom of the second secondary circuit board 640 is attached to the electrical connection circuit board 300, and the top is used for carrying devices such as the second digital signal processing chip 650 and connecting the second silicon optical chip 630 through wire bonding, so that the second digital signal processing chip 650 is only used for driving and connecting the second silicon optical chip 630. Illustratively, the second sub-circuit board 640 is parallel to the circuit board 300; the second sub-circuit board 640 is located on the same side of the circuit board 300 as the first sub-circuit board 540. In some embodiments of the present application, the second base 610, the second light source 620, the second silicon optical chip 630, and the like may be referred to as a second silicon optical assembly for generating an optical signal and directly receiving an optical signal from the outside.

The second light source 620 is configured to generate and transmit light not carrying a signal to the second silicon optical chip 630, and the second silicon optical chip 630 receives the light not carrying the signal and modulates the light to output light carrying the signal, and the light carrying the signal is transmitted to the optical fiber connector 400 through the optical fiber ribbon; the optical signal transmitted from the external optical fiber is transmitted to the optical fiber ribbon inside the optical module through the optical fiber connector 400, and is transmitted to the second silicon optical chip 630 through the optical fiber ribbon, and the second silicon optical chip 630 receives the optical signal and converts it into an electrical signal. In some embodiments of the present application, to facilitate coupling of an optical signal generated by the second silicon optical chip 630 to an optical fiber ribbon and coupling of an externally input optical signal transmitted in the optical fiber ribbon to the second silicon optical chip 630, the optical fiber ribbon inside the optical module includes a transmitting optical fiber ribbon and a receiving optical fiber ribbon, an optical signal light outlet of the second silicon optical chip 630 is provided with an optical outlet connector, an optical signal light inlet of the second silicon optical chip 630 is provided with an optical inlet connector, one end of the transmitting optical fiber ribbon is connected to the optical fiber connector 400, the other end is connected to the optical outlet connector, and one end of the receiving optical fiber ribbon is connected to the optical fiber connector 400, and the other end is connected to the optical inlet connector.

In the embodiment of the present application, the second optical transceiver module 600 is provided with the second secondary circuit board 640, so as to ensure the arrangement space and wiring requirements of the devices such as the second digital signal processing chip 650. For example, the second digital signal processing chip 650 is disposed on the second secondary circuit board 640, and most of the wires related to the second digital signal processing chip 650 are disposed in the second secondary circuit board 640; on the one hand, the signal transmission between the second digital signal processing chip 650 and the second silicon optical chip 630 is realized through the second secondary circuit board 640, so that the density of high-speed signal wires for signal transmission between the second digital signal processing chip 650 and the second silicon optical chip 630 can be reduced, and the crosstalk between the two signals is reduced; on the other hand, the power lines associated with the second digital signal processing chip 650 are disposed inside the second sub-circuit board 640, which can effectively prevent ESD, power rail collapse, reduce ground bounce, and the like.

Compared with the optical module internal structure shown in fig. 5, the optical module internal structure shown in the structure shown in fig. 6 is provided with independent secondary circuit boards, so that the utilization rate of the internal space of the optical module can be further expanded; the method is more convenient for distributing the internal devices and the wiring of the optical module, avoids the crowding of the wiring of high frequency and the like caused by that all the electric chips, the optical components, the heat dissipation structures and the like are required to be carried by the limited PCB area, and further enables the optical performance, the high frequency performance, the thermal performance and the like of the optical module to be more coordinated. In this embodiment, corresponding digital signal processing chips are correspondingly disposed on the secondary circuit boards corresponding to the second optical transceiver module 600 and the first optical transceiver module 500, so that the digital signal processing chips are dedicated for the corresponding optical transceiver modules, thereby facilitating the development of the optical modules in a higher-speed direction. Meanwhile, the second optical transceiver module 600 and the first optical transceiver module 500 are both provided with independent secondary circuit boards, and corresponding digital signal processing chips are arranged on the independent secondary circuit boards, so that the optical module can be produced more easily and more repairably, the yield and reliability of the optical module product are improved, and the local detail processing is further finer and the performance is more superior.

Fig. 7 is an exploded schematic diagram of an optical module interior provided in accordance with some embodiments. As shown in fig. 7, to facilitate the assembly of the first optical transceiver module 500 on the circuit board 300, the circuit board 300 is provided with a first sink 310, and the first sink 310 is used for supporting and providing a first base 510; the first countersink 310 can conveniently adjust the relative height between the plane of the pins on the first silicon optical chip 530 and the top surface of the first sub-circuit board 540, and can conveniently mount and position the first optical transceiver component 500.

Fig. 8 is a schematic diagram of an internal structure of an optical module according to some embodiments. Further, as shown in fig. 7 and 8, a first through hole 320 is provided in the first sink 310, and the first through hole 320 penetrates through the bottom surface of the first sink 310 and the bottom surface of the circuit board 300. The first through hole 320 is used for bringing the heat dissipation boss on the housing into contact with the first optical transceiver module 500, so as to dissipate heat of the first optical transceiver module 500. In the embodiment of the present application, the first light receiving and transmitting component 500 is assembled by combining the first countersink 310 with the first through hole 320, so that the back surface of the circuit board 300 has more sufficient space for arranging devices and wires on the basis of ensuring the fixed assembly of the first light receiving and transmitting component 500 on the circuit board.

Fig. 9 is a partially schematic illustration of an internal decomposition of an optical module provided in accordance with some embodiments. As shown in fig. 9, solder balls are disposed on the back surface of the first secondary circuit board 540, corresponding pads are disposed on the circuit board 300, and the solder balls of the first secondary circuit board 540 are bonded to the corresponding pads on the circuit board 300 by solder, so as to bond the first secondary circuit board 540 to the circuit board 300 and electrically connect the first secondary circuit board 540 to the circuit board 300. Illustratively, the back surface (the surface facing the circuit board 300) of the first sub-circuit board 540 is provided with BGA solder balls through which corresponding ones of the BGA solder balls are electrically connected to corresponding ones of the pads on the circuit board 300.

Fig. 10 is an exploded schematic view of the interior of another light module provided in accordance with some embodiments. As shown in fig. 10, to facilitate the assembly of the second optical transceiver module 600 on the circuit board 300, the circuit board 300 is further provided with a second sink 330, and the second sink 330 is used for supporting the setting base 610; the second countersink 330 can be used to adjust the relative height between the plane of the pins on the second silicon optical chip 630 and the top surface of the secondary circuit board 640, and on the other hand, the second optical transceiver module 600 can be installed and positioned. In some embodiments of the present application, the second sink 330 and the first sink 310 are disposed side by side on the circuit board 300 in the direction shown in fig. 10.

Fig. 11 is a schematic diagram of an internal structure of another optical module according to some embodiments. Further, as shown in fig. 10 and 11, the second sinking groove 330 is provided with a second through hole 340, and the second through hole 340 penetrates through the bottom surface of the second sinking groove 330 and the bottom surface of the circuit board 300; the second through hole 340 is used for bringing the heat dissipation boss on the housing into contact with the second optical transceiver module 600, so as to dissipate heat of the second optical transceiver module 600.

Fig. 12 is a front view of a first optical transceiver module according to some embodiments, fig. 13 is a perspective view of a first optical transceiver module according to some embodiments, fig. 14 is an exploded schematic view of a first optical transceiver module according to some embodiments, fig. 15 is a perspective view of a first optical transceiver module according to some embodiments, and fig. 12-15 show a basic structure of a first optical transceiver module according to some embodiments of the present application.

In some embodiments of the present application, the first light source 520, the light-emitting connector 570 and the light-entering connector 580 are disposed on the same side of the first silicon optical chip 530, the light-emitting connector 570 is optically connected to the light signal light-emitting port of the first silicon optical chip 530, and the light-entering connector 580 is optically connected to the light signal light-entering port of the first silicon optical chip 530. As shown in fig. 12, the light inlet, the optical signal light inlet and the optical signal light outlet of the first silicon optical chip 530 are located at the left side of the device, i.e. towards the direction of the light inlet of the optical module, and the first light source 520, the light outlet connector 570 and the light inlet connector 580 are all disposed at the left side of the first silicon optical chip 530, so as to effectively reduce the bending and winding of the optical fiber ribbon connecting the light outlet connector 570, the light inlet connector 580 and the optical fiber connector 400, and reduce the loss of optical signal transmission.

The end of the first secondary circuit board 540 is provided with a first notch 541, and the first notch 541 surrounds the side edge of the first silicon optical chip 530 in a semi-surrounding manner, for example, two sides of the first secondary circuit board 540 surround the side edge of the first silicon optical chip 530 through the first notch 541; a plurality of bonding pads are arranged on the top surface of the edge of the first notch 541, and the first secondary circuit board 540 is connected with the first silicon optical chip 530 through bonding wires of the plurality of bonding pads. The first notch 541 surrounds the side edge of the first silicon optical chip 530 by semi-surrounding, so that the first notch 541 is opened around the side edge of the first silicon optical chip 530, so that the size of the first secondary circuit board 540 is reduced, and the influence of the arrangement of the first test circuit board 540 on the wiring of the circuit board 300 and the arrangement of devices is reduced. Illustratively, 3 sidewalls of the first notch 541 surrounds the side edge of the first silicon optical chip 530, and a plurality of bonding pads corresponding to pins of the first silicon optical chip 530 are disposed on the top surface of the first secondary circuit board 540 connected to the 3 sidewalls of the first notch 541, and the bonding pads are connected to corresponding pins on the first silicon optical chip 530 by wire bonding; the edge of the first notch 541 overlies the edge of the first pedestal 510. In some embodiments of the present application, the pins of the first silicon optical chip 530 are mainly concentrated on three side edges surrounded by the first notch 541, and pads are disposed on top of the three side edges of the first notch 541, so that the three sides of the first silicon optical chip 530 are surrounded by the first notch 541, so as to facilitate the wire bonding connection between the first silicon optical chip 530 and the first secondary circuit board 540. As shown in fig. 12, the light emitting connector 570 is disposed at one side of the first light source 520, and the light receiving connector 580 is disposed at the other side of the first light source 520.

Further, the plane of the first silicon optical chip 530 pin and the plane of the bonding pad on the first secondary circuit board 540 are located at or approximately at the same height, so as to minimize the interconnection bonding height and bonding length between the first silicon optical chip 530 pin and the bonding pad on the first secondary circuit board 540, ensure the high-frequency performance of high-speed signals, alleviate bandwidth degradation and rising edge slowing, and improve port reflection at the interconnection.

In some embodiments of the present application, the bottom of the first susceptor 510 is provided with a first step 511, and the first step 511 is configured to be disposed in the first through hole 320; providing a step 511 at the bottom of the first base 510 facilitates the positioning assembly of the first base 510 on the first sink 310. Further, the projection of the first silicon optical chip 530 on the bottom surface of the first base 510 covers the first step 511, that is, the first step 511 is located at the back of the area where the first silicon optical chip 530 is assembled and mounted on the first base 510, and since the first silicon optical chip 530 is one of the main heat generating devices in the first optical transceiver 500, the heat dissipation of the first silicon optical chip 530 is facilitated. For example, a heat conducting post is disposed on the lower housing 202 of the optical module, and the heat conducting post contacts the first step 511 to shorten the heat dissipation path of the first silicon optical chip 530, so that the heat generated by the first silicon optical chip 530 is conducted to the outer shell of the optical module and the outside of the optical module, thereby facilitating the heat dissipation of the first silicon optical chip 530.

In some embodiments of the present application, the side of the first silicon optical chip 530 not surrounded by the first notch 541 further includes a lead, and the lead on the side needs to be electrically connected to the circuit board 300, if the lead on the side of the first silicon optical chip 530 is directly connected to the circuit board 300 through wire bonding, the lead needs to cross the first base 510, which will cause the wire bonding between the lead on the side and the circuit board to be relatively long. To facilitate the electrical connection between the side pin of the first silicon optical chip 530 and the circuit board 300 and control the wire bonding connection length, the first optical transceiver module 500 further includes a first bridge 560; the first bridge 560 is provided with a circuit, and the first bridge 560 is used for electrically connecting the side pin of the first silicon optical chip 530 with the circuit board 300. Illustratively, the first bridge 560 is disposed on the first base 510, one end of the first bridge 560 is wire-bonded to the circuit board 300, and the other end of the first bridge 560 is wire-bonded to the side pin of the first silicon optical chip 530.

In some embodiments of the present application, the first bridge 560 is a substrate with a plurality of metal traces on the top surface. Each metal wire corresponds to a corresponding pin electrically connecting the circuit board 300 and the first silicon optical chip 530; the substrate may be ceramic, copper, or other substrate with good heat dissipation performance, but is not limited to ceramic, copper. For example, the first bridge 560 may be metallized to form a metal trace for the surface of the ceramic substrate.

Fig. 16 is a schematic view of a basic structure of a base provided according to some embodiments. As shown in fig. 16, in some embodiments of the present application, to facilitate the arrangement and assembly of the first light source 520 and the first silicon optical chip 530, the first base 510 includes a base body 5110, and a first mounting stage 512 and a second mounting stage 513 are disposed on top of the base body 5110, the first mounting stage 512 being used for carrying the first light source 520, and the second mounting stage 513 being used for carrying the first silicon optical chip 530. The positions of the first mounting stage 512 and the second mounting stage 513 are selected according to the assembly requirements of the first light source 520 and the first silicon photo chip 530; meanwhile, the relative height between the top surfaces of the first mount 512 and the second mount 513 is also selected according to the assembly requirements of the first light source 520 and the first silicon photo chip 530. In this embodiment of the present application, the first mounting table 512 and the second mounting table 513 are disposed on the top of the base body 5110 to achieve the division of the local functions on the top of the first base 510, so as to facilitate the implementation of the fitting height of the first light source 520, the first bridge 560, the light outlet connector 570 and the light inlet connector 580, and then facilitate the implementation of the fitting positioning of the first light source 520 and the first silicon optical chip 530 based on the division of the functions on the area of the first base 510, so as to facilitate the precise fitting of the first light source 520 and the first silicon optical chip 530. In one embodiment of the present application, the first light source 520 includes a plurality of devices, so that the optical axes of the devices are located at the same height, the step surface 5121 is disposed on the first mounting table 512, and the relative heights of the surfaces of the first mounting table 512 are adjusted by the step surface 5121. The step surface 5121 may be a convex formation surface or a concave formation surface.

In some embodiments of the present application, the first step 511 is disposed opposite the second mounting stage 513, i.e., the first step 511 is disposed on the base body 5110 away from the bottom of the second mounting stage 513. Illustratively, the first step 511 is obliquely disposed at the bottom of the base body 5110, that is, an included angle between a central axis of the first step 511 and an extending central axis of the first mounting table 512 is a predetermined angle, such as 8 °. In some embodiments, the first through hole 320 is disposed on the circuit board 300 in an inclined manner, i.e., an angle between a central axis of the first through hole 320 and a central axis of the circuit board 300 is a predetermined angle, such as 8 °.

Further, in some embodiments of the present application, a third mounting table 514, a fourth mounting table 515 and a fifth mounting table 516 are further disposed on top of the base body 5110, the third mounting table 514, the fourth mounting table 515 and the fifth mounting table 516 are located on the same side of the second mounting table 513 as the first mounting table 512, the third mounting table 514, the fourth mounting table 515 are located on one side of the first mounting table 512, the fourth mounting table 515 is located between the third mounting table 514 and the first mounting table 512, and the fifth mounting table 516 is located on the other side of the first mounting table 512. The third mounting stage 514 is used for carrying an optical outlet 570, the fourth mounting stage 515 is used for carrying a first bridge 560, and the fifth mounting stage 516 is used for carrying an optical outlet 580. The relative heights between the top surfaces of the third mounting table 514, the fourth mounting table 515, and the fifth mounting table 516 and the top surface of the second mounting table 513 are selected according to the assembly requirements of the light-out fitting 570, the first bridge member 560, and the light-in fitting 580.

Further, in some embodiments of the present application, a first space 517 is disposed between the first mount 512 and the fourth mount 515, a second space 518 is disposed between the first mount 512 and the fifth mount 516, a third space 519 is disposed between the third mount 514 and the fourth mount 515, and the use of the first space 517, the second space 518, and the third space 519 in combination facilitates thermal isolation between the first light source 520, the first bridge 560, the light-out connector 570, and the light-in connector 580 on the first base 510, and effectively prevents heat generated on the first light source 520 and the first bridge 560 from affecting the light-out connector 570 and the light-in connector 580, so as to cause deformation of the light-out connector 570 and the light-in connector 580 to result in optical coupling efficiency between the light-out connector 570, the light-in connector 580, and the first silicon optical chip 530.

Fig. 17 is an exploded view of a submount and light source, silicon photonics chip, etc. provided according to some embodiments, and fig. 18 is a submount usage status diagram provided according to some embodiments. As shown in fig. 17 and 18, the first light source 520 is disposed on the first mount 512, the first silicon optical chip 530 is disposed on the second mount 513, the optical connector 570 is disposed on the third mount 514, the first bridge 560 is disposed on the fourth mount 515, and the optical connector 580 is disposed on the fifth mount 516. When the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-emitting joint 570 and the light-in joint 580 are assembled, the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-emitting joint 570 and the light-in joint 580 can be correspondingly assembled on the corresponding mounting tables, so that the assembly precision of the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-emitting joint 570, the light-in joint 580 and the like on the mounting tables can be ensured to a certain extent, the assembly precision among the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-emitting joint 570 and the light-in joint 580 can be ensured, and the assembly of the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-emitting joint 570, the light-in joint 580 and the like is facilitated.

In some embodiments of the present application, to facilitate providing the first silicon optical chip 530 with light that does not carry signals by the first light source 520, the first light source 520 includes optical devices such as lenses in addition to lasers. Further, to realize the relative sealing of the first light source 520 and protect the laser, the first light source 520 further includes a protective cover, where the protective cover is disposed on the laser, and is a closed working environment of the laser.

Fig. 19 is an exploded view of a first optical transceiver component according to some embodiments, and fig. 20 is an exploded view of a second optical transceiver component according to some embodiments. As shown in fig. 19 and 20, the first light source 520 includes a laser 521, a collimator lens 522, and an isolator 523, and the laser 521, the collimator lens 522, and the isolator 523 are directly disposed on the first base 510. The laser 521 is directly arranged on the first base 510, so that heat generated by the laser 521 is conveniently and directly transmitted to the first base 510 with high heat conduction, and heat dissipation of the laser 521 is conveniently realized; simultaneously, the collimating lens 522 and the isolator 523 are directly arranged on the first base 510, so that the collimating lens 522 and the isolator 523 are conveniently ensured to be influenced by the same heat force, and further the coaxial stability of the optical axes of the collimating lens 522 and the isolator 523 is ensured. In some embodiments, the laser 521, the collimating lens 522, and the isolator 523 are disposed on the first mount 512. Illustratively, the straight lens 522 and the spacer 523 are disposed on the step surface 5121, and the heights of the optical axes of the collimator lens 522 and the spacer 523 are adjusted by the step surface 5121 so that the optical axes of the collimator lens 522 and the spacer 523 are at the same height as the light-emitting optical axis of the laser 521.

In some embodiments of the application, the laser 521 is wired to the circuit board 300 and is powered to emit light through the circuit board 300. The light beam emitted by the laser 521 is converted into a collimated light beam by the collimator lens 522, the collimated light beam directly passes through the isolator 523, the collimated light beam passing through the isolator 523 is transmitted to the first silicon optical chip 530, and the light beam is subjected to electro-optical modulation in the first silicon optical chip 530.

In some embodiments, the laser 521, the collimating lens 522 and the isolator 523 are sequentially disposed on the first base 510 along the length direction of the first base 510, and the first silicon optical chip 530 is obliquely disposed on the first base 510, even if the light entrance axis of the first silicon optical chip 530 forms a preset angle with the light emitting axis extending direction of the first light source 520, when the light beam output by the first light source 520 is reflected at the light entrance end surface of the first silicon optical chip 530, the reflected light beam will not return to the laser 521 along the original path, and when the reflected light beam is incident on the isolator 522, the reflected light beam will be isolated by the isolator 522, so that the light emitting performance of the laser 521 is prevented from being affected by the reflected light beam. For example, the angle between the light entrance axis of the first silicon optical chip 530 and the extending direction of the light emitting axis of the first light source 520 is 8 °, which is not limited to 8 °.

In the embodiment of the present application, the optical output connector 570 and the optical input connector 580 are used for fixing the end portions of the optical fiber ribbon, and the optical fiber end surfaces of the optical fiber ribbon are used for coupling in or outputting optical signals, when the first silicon optical chip 530 is obliquely arranged on the first base 510, the optical fiber ribbon with the flush end surface can be directly used instead of the optical fiber ribbon with the oblique end surface, so that the process procedure of processing the oblique end surface of the optical fiber ribbon can be reduced, and the processing difficulty of the optical fiber ribbon can be further reduced.

In some embodiments of the present application, the extending direction of the second mounting table 513 forms a preset angle with the extending direction of the first mounting table 512, so that when the first light source 520 and the first silicon optical chip 530 are assembled, the difficulty of optical coupling from the first light source 520 to the first silicon optical chip 530 can be reduced by positioning and assembling the first light source 520 based on the first mounting table 512 and positioning and installing the first silicon optical chip 530 based on the first mounting table 512, so that the light inlet axis of the first silicon optical chip 530 forms a preset angle with the light outlet direction of the first light source 520. Further, the extending directions of the third mounting table 514 and the fifth mounting table 516 are also at a predetermined angle with respect to the extending direction of the second mounting table 513, so as to ensure that the optical connectors 570 and the optical connectors 580 are respectively at a predetermined angle with respect to the corresponding optical ports between the first silicon optical chips 530.

In some embodiments of the present application, the base body 5110 includes a first portion 5111 and a second portion 5112, the first portion 5111 is connected to the second portion 5112, and an extending direction of the first portion 5111 forms an included angle with an extending direction of the second portion 5112; the first mounting table 512 is provided on the first portion 5111, and the second mounting table 513 is provided on the second portion 5112. For example, when the first base 510 is assembled to the circuit board 300, the extending direction of the first portion 5111 is parallel to the length direction of the circuit board 300, and the extending direction of the second portion 5112 forms an angle with the length direction of the circuit board 300 by a predetermined angle.

In some embodiments of the present application, the first notch 541 is inclined by a predetermined angle along the length direction of the first sub-circuit board 540, so as to facilitate the assembly of the first sub-circuit board 540 with the first silicon optical chip 530, and also facilitate the assembly of the first sub-circuit board 540 on the circuit board 300. The inclination angle of the first notch 541 along the length direction of the first secondary circuit board 540 may be selected according to the included angle between the light inlet axis of the first silicon optical chip 530 and the light emitting direction of the first light source 520. For example, when the angle between the light inlet axis of the first silicon optical chip 530 and the light outlet direction of the first light source 520 is 8 °, the first notch 541 is inclined by 8 ° along the length direction of the first sub-circuit board 540, which may be approximately inclined by 8 °.

In some embodiments, the first light source 520 further includes a protective cover 524, and a bottom portion of the protective cover 524 is connected to the first base 510, and forms a receiving cavity in cooperation with the first base 510 to receive the laser 521, the collimating lens 522, and the isolator 523.

Further, to improve the sealing performance of the protective cover 524, the first light source 520 further includes an optical glass block 525, where the optical glass block 525 is located at the light inlet of the first silicon optical chip 530 and located at the end of the protective cover 524, and is used for transmitting light and sealing the end of the protective cover 524. For example, the optical glass block 525 is a wedge-shaped block, the light incident surface is perpendicular to the optical axis of the collimating lens 522, and the light emergent surface is perpendicular to the light inlet axis of the first silicon optical chip 530, so as to ensure that light can be smoothly transmitted to the light inlet of the obliquely arranged first silicon optical chip 530 through the optical glass block 525 and prevent the light reflected by the light inlet of the first silicon optical chip 530 from returning to the original incident light path, so as to ensure that the horizontal light beam emitted by the laser 521 is smoothly incident to the light inlet of the obliquely arranged first silicon optical chip 530.

Fig. 21 is a schematic structural view of a protective cover provided according to some embodiments. As shown in fig. 20 and 21, in some embodiments of the present application, the protective cover 524 is a cover structure without a bottom and having an opening 5241 at one end, and the opening 5241 faces the first silicon optical chip 530. In some embodiments, the optical glass block 525 is disposed at the opening 5241, and an end surface of the opening 5241 is an inclined surface for facilitating the fitting with the first silicon photo chip 530.

In some embodiments of the present application, an end of the protective cover 524 away from the first silicon optical chip 530 protrudes from the first mounting table 512 for covering the wire bonding between the laser 521 and the circuit board 300. In some embodiments of the present application, the protective cover 524 may be made of a metal material such as copper, so that the protective cover 524 also has an electromagnetic shielding effect, and also facilitates heat dissipation of the first light source 520.

In some embodiments of the present application, the bottom of the protective cover 524 is embedded in the first space 517 and the second space 518, and the protective cover 524 is fixed by the first space 517 and the second space 518, so that positioning and installation of the protective cover 524 are facilitated. In some embodiments, a heat conducting post is disposed on the upper housing 201, and the heat conducting post contacts the top of the protective cover 524, so as to improve the heat dissipation capability of the protective cover 524, and make the heat quickly conducted to the outer shell of the optical module and the outside of the optical module.

In the embodiment of the present application, pads are disposed on the surface of the first secondary circuit board 540, circuit traces are disposed on the inner layer, and the like, so as to electrically connect the first secondary circuit board 540 with the circuit board 300, the first secondary circuit board 540 with the first digital signal processing chip 550, the first secondary circuit board 540 with the first silicon optical chip 530, and the like. The specific structure of the first sub-circuit board 540 will be described below with reference to specific examples.

Fig. 22 is a schematic structural diagram of a secondary circuit board according to some embodiments, and fig. 22 shows a use state in which the first digital signal processing chip 550 is not connected to the first secondary circuit board 540. As shown in fig. 22, a first pad matrix 542 is disposed on the top surface of the first sub-circuit board 540, and the first pad matrix 542 is used to electrically connect the first digital signal processing chip 550. The first pad matrix 542 is illustratively connected to the first digital signal processing chip 550 by solder balls. Further, the top surface of the first secondary circuit board 540 is further provided with a plurality of bonding pads 5411 for wire bonding connection with the first silicon optical chip 530, and the bonding pads 5411 are arranged on the top surface of the edge of the first notch 541 and used for wire bonding connection with the first secondary circuit board 540 by the first silicon optical chip 530; the top surface of the first sub-circuit board 540 is also provided with other pads for mounting devices such as resistors, capacitors, etc., which are not shown in detail in the drawing. The plurality of pads 5411 include high-frequency connection pads 5412 for transmitting high-frequency signals between the first digital signal processing chip 550 and the first silicon photo chip 530, and may further include pads for supplying power to the first silicon photo chip 530, etc. Illustratively, the high-frequency connection pads 5412 are in a plurality of pairs, and the high-frequency connection pads 5412 are disposed on the top surface of the edge of the first notch 541 close to the first pad matrix 542, that is, the high-frequency connection pads 5412 are disposed on the top surface of the edge of the first notch 541 in the length direction of the first sub-circuit board 540.

Fig. 23 is a schematic diagram of a secondary circuit board according to some embodiments, and fig. 23 shows a back surface structure of a first secondary circuit board 540. As shown in fig. 23, a second pad matrix 543 is provided on the bottom surface of the first sub-circuit board 540, and the first sub-circuit board 540 is electrically connected to the circuit board 300 through the second pad matrix 543. The second pad matrix 543 is illustratively connected to the circuit board 300 by solder balls.

As shown in fig. 23, in an embodiment of the present application, the second pad matrix 543 includes a plurality of pads, such as a high frequency pad, a power supply pad, a ground pad, and the like; the high-frequency bonding pad is used for transmitting high-frequency signals, the power supply bonding pad supplies power, and the grounding bonding pad is used for grounding. The second pad matrix 543 includes a high frequency signal input pad 5431, a high frequency signal output pad 5432, and a power supply pad 5433, the high frequency signal input pad 5431 being for inputting a high frequency signal to the first digital signal processing chip 550, the high frequency signal output pad 5432 being for outputting a high frequency signal to the first digital signal processing chip 550, the power supply pad 5433 being for supplying power to the first digital signal processing chip 550, and the like. In the embodiment of the present application, the high-frequency signal input pad 5431 and the high-frequency signal output pad 5432 are more than one pair; illustratively, as shown in fig. 23, there are 4 pairs of high frequency signal input pads 5431 and 4 pairs of high frequency signal output pads 5432; the 4 pairs of high-frequency signal input pads 5431 are arranged relatively intensively, and the 4 pairs of high-frequency signal output pads 5432 are arranged relatively intensively.

As shown in fig. 23, in some embodiments of the present application, 4 pairs of high-frequency signal input pads 5431 are provided on one side of the power supply pad 5433, and 4 pairs of high-frequency signal output pads 5432 are provided on the other side of the power supply pad 5433. Illustratively, the power supply pads 5433 are disposed at a central position of the second pad matrix 543. A ground pad is provided between the high frequency signal input pad 5431 and the power supply pad 5433, and a ground pad is provided between the high frequency signal output pad 5432 and the power supply pad 5433, wherein the ground pad is used for grounding, and the ground pad is used for realizing separation between the high frequency signal pad and the power supply pad, so that crosstalk between the power supply and the high frequency signal is reduced. In some embodiments, a ground pad is disposed between the pair of high frequency signal input pads 5431 and the pair, and a ground pad is disposed between the pair of high frequency signal output pads 5432, wherein the ground pad is used for grounding, and the use of the ground pad is used for separating the pair of high frequency signal pads from the pair, thereby reducing crosstalk between the high frequency signal pads.

Fig. 24 is a schematic top structure of a secondary circuit board according to some embodiments. As shown in fig. 24, in some embodiments of the present application, the first pad matrix 542 includes a first high frequency signal input pad 5421, a first high frequency signal output pad 5422, a second high frequency signal input pad 5423, and a second high frequency signal output pad 5424; wherein: the first high frequency signal input pad 5421 is used for the circuit board 300 to input a high frequency signal to the first digital signal processing chip 550 through the first sub circuit board 540, the first high frequency signal output pad 5422 is used for the first digital signal processing chip 550 to input a high frequency signal to the circuit board 300 through the first sub circuit board 540, the second high frequency signal input pad 5423 is used for the first silicon photo chip 530 to input a high frequency signal to the first digital signal processing chip 550 through the first sub circuit board 540, and the second high frequency signal output pad 5424 is used for the first digital signal processing chip 550 to input a high frequency signal to the first silicon photo chip 530 through the first sub circuit board 540.

In the embodiment of the present application, the inner layer of the first sub-circuit board 540 is provided with circuit board traces, such as an optical transmit signal trace and an optical receive signal trace, which are used for electrically connecting the first silicon optical chip 530; illustratively, the optical transmit signal trace and the optical receive signal trace are connected to the high frequency connection pad 5412 for electrically connecting the first digital signal processing chip 550 and the first silicon optical chip 530. In some embodiments of the present application, the optical transmit signal trace and the optical receive signal trace are located on different inner layers of the first sub-circuit board 540 so as to ensure that the optical transmit signal trace and the optical receive signal trace are protected from external radiation, while spontaneous radiation of the optical transmit signal trace and the optical receive signal trace is limited to the inner layers of the circuit board to reduce interference to the outside. In some embodiments, the optical transmit signal traces and the optical receive signal traces are located on non-adjacent inner layers of the first sub-circuit board 540, helping to further reduce interference. Illustratively, the light emitting signal trace is located in a first intermediate layer of the first sub-circuit board 540, the light receiving signal trace is located in a second intermediate layer of the first sub-circuit board 540, and the first intermediate layer and the second intermediate layer are non-adjacent inner layers in the first sub-circuit board 540.

Further, a high-frequency input signal trace and a high-frequency output signal trace are further disposed in the first secondary circuit board 540, the high-frequency input signal trace is used for enabling the high-frequency signal input pad 5431 to be connected with the first digital signal processing chip 550, and the high-frequency output signal trace is used for enabling the high-frequency signal output pad 5432 to be connected with the first digital signal processing chip 550. In some embodiments of the present application, the high frequency input signal trace and the high frequency output signal trace are so as to ensure that the high frequency input signal trace and the high frequency output signal trace are protected from external radiation, while spontaneous radiation of the high frequency input signal trace and the high frequency output signal trace is limited to an inner layer of the circuit board to reduce interference to the outside. In some embodiments, the high frequency input signal trace and the high frequency output signal trace are located on non-adjacent inner layers of the first sub-circuit board 540, helping to further reduce interference.

In some embodiments of the present application, the optical transmit signal trace and the high frequency input signal trace are located on the same inner layer on the first sub-circuit board 540, and the optical receive signal trace and the high frequency output signal trace are located on the same inner layer on the first sub-circuit board 540, so that the first sub-circuit board 540 is fully utilized on the basis of ensuring low interference. Illustratively, the high frequency input signal trace is located in a first intermediate layer of the first sub-circuit board 540 and the high frequency output signal trace is located in a second intermediate layer of the first sub-circuit board 540.

In some embodiments of the present application, the inner layer of the first sub-circuit board 540 further includes a third intermediate layer, and a first cavity is disposed on the third intermediate layer, where a projection of the first cavity in the direction of the first intermediate layer covers the light emission signal trace. Illustratively, the third intermediate layer is adjacent to the first intermediate layer.

In some embodiments of the present application, the inner layer of the first sub-circuit board 540 further includes a fourth intermediate layer, and a second hollow is disposed on the fourth intermediate layer, and a projection of the second external control in the direction of the second intermediate layer covers the light receiving signal trace. Illustratively, the fourth intermediate layer is adjacent to the second intermediate layer.

In some embodiments of the present application, a third hollow is further disposed on the third intermediate layer, and a projection of the third hollow in the direction of the first intermediate layer covers the high-frequency input signal trace; and a fourth hollowing is further arranged on the fourth intermediate layer, and the projection of the fourth hollowing in the direction of the second intermediate layer covers the high-frequency output signal wiring. In some embodiments of the application, the first intermediate layer and the second intermediate layer are located between the third intermediate layer and the fourth intermediate layer.

In some embodiments of the present application, a via is disposed between a pair of optical transmit signal traces, and isolation between the pair of optical transmit signal traces is achieved through the via, so as to reduce crosstalk between the pair of wires; a via hole is arranged between the pairs of the high-frequency input signal wires, and isolation between the pairs of the high-frequency input signal wires is realized through the via hole so as to reduce crosstalk between the pairs; a via hole is arranged between the pairs of the light receiving signal wires, and isolation between the pairs of the light receiving signal wires is realized through the via hole so as to reduce crosstalk between the pairs; and a via hole is arranged between the pairs of the high-frequency output signal wires, and the isolation between the pairs of the high-frequency output signal wires is realized through the via hole, so that the crosstalk between the pairs is reduced.

The first sub-circuit board 540 according to the embodiment of the present application will be described in detail below with reference to the 10-layer first sub-circuit board 540 as a specific embodiment.

Fig. 25 is a schematic structural diagram of a third layer of a secondary circuit board according to an embodiment of the present application. As shown in fig. 25, 4 pairs of optical transmit signal traces 544 and 4 pairs of high frequency input signal traces 545 are disposed on the third layer of the first sub-circuit board 540; one end of the light emission signal wire 544 is connected with the second high-frequency signal output pad 5424 through a via hole, and the other end is connected with the high-frequency connection pad 5412 for wire bonding connection with the first silicon optical chip 530 through a via hole; one end of the high-frequency input signal trace 545 is connected with the first high-frequency signal input pad 5421 through a via hole, and the other end is connected with the high-frequency signal input pad 5431 through a via hole; a via is provided between the pair of the optical transmit signal traces 544 and a via is provided between the pair of the high frequency input signal traces 545.

Fig. 26 is a schematic structural diagram of a sixth layer of a secondary circuit board according to an embodiment of the present application. As shown in fig. 26, 4 pairs of optical reception signal wirings 546 and 4 pairs of high-frequency output signal wirings 547 are provided on the sixth layer of the first sub-circuit board 540; one end of the light receiving signal trace 546 is connected to the second high-frequency signal input pad 5423 through a via hole, and the other end is connected to the high-frequency connection pad 5412 for wire bonding to the first silicon optical chip 530 through a via hole; one end of the high-frequency output signal trace 547 is connected to the first high-frequency signal output pad 5422 through a via hole, and the other end is connected to the high-frequency signal output pad 5432 through a via hole; a via hole is provided between the pair of the light receiving signal wirings 546, and a via hole is provided between the pair of the high-frequency output signal wirings 547.

In the present embodiment, the optical transmit signal trace 544 and the optical receive signal trace 546 are distributed in the different inner layers of the first sub-circuit board 540 in a crossing manner, and the high-frequency input signal trace 545 and the high-frequency output signal trace 547 are distributed in the different inner layers of the first sub-circuit board 540 in a crossing manner, so that the electromagnetic field of the optical transmit signal trace 544 and the optical receive signal trace 546 is perpendicular, and the electromagnetic field of the high-frequency input signal trace 545 and the high-frequency output signal trace 547 is perpendicular, thereby helping to reduce crosstalk coupling.

Fig. 27 is a schematic structural diagram of a second layer of a secondary circuit board according to an embodiment of the present application. As shown in fig. 27, a first cutout 5481 and a third cutout 5482 are provided on the second layer of the first sub-circuit board 540; the projection of the first cutout 5481 in the third layer direction of the first sub-circuit board 540 covers the light emission signal wiring 544, and the projection of the third cutout 5482 in the third layer direction of the first sub-circuit board 540 covers the high frequency input signal wiring 545.

Fig. 28 is a schematic structural diagram of a seventh layer of a secondary circuit board according to an embodiment of the present application. As shown in fig. 28, a second cutout 5491 and a fourth cutout 5492 are provided on the seventh layer of the first sub-circuit board 540; the projection of the second cutout 5491 in the sixth layer direction of the first sub-circuit board 540 covers the light-receiving signal wiring 546, and the projection of the fourth cutout 5492 in the sixth layer direction of the first sub-circuit board 540 covers the high-frequency output signal wiring 547.

In one embodiment of the present application, the first layer, the fourth layer, the fifth layer and the eighth layer of the 10-layer structure of the first sub-circuit board 540 are provided with reference grounds. Illustratively, the first and fourth layers serve as reference grounds for the third layer, and the fifth and eighth layers serve as reference grounds for the sixth layer.

In some embodiments of the present application, the detailed structure of the second optical transceiver module 600 may refer to the structure of the first optical transceiver module 500, and the structure of the second optical transceiver module 600 may be the same as the structure of the first optical transceiver module 500, but is not limited to the same, and may be slightly adjusted or modified based on the structure of the first optical transceiver module 500. When the second optical transceiver module 600 has the same structure as the first optical transceiver module 500, the universality of the devices in the first optical transceiver module 500 is improved, the replaceability between the two types of products is greatly improved, the product rate iteration is accelerated, and the manufacturability is stronger.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, comprising:

a circuit board;

wherein, first light transceiver module includes:

the first base is arranged on the circuit board, and a supporting surface is arranged at the edge of the first base;

a first silicon optical chip disposed on the first base for receiving light not carrying a signal to generate an optical signal by modulation and to receive an optical signal from the outside; the supporting surface surrounds the edge of the first base;

the first secondary circuit board is arranged on the circuit board and is electrically connected with the circuit board through a solder ball, a first notch is arranged at the end part of the first secondary circuit board, the first notch surrounds the side edge of the first silicon optical chip in a semi-surrounding mode, a bonding pad is arranged on the top surface of the edge of the first notch, and the bonding pad is connected with the first silicon optical chip in a wire bonding mode; the supporting surface supports and connects the bottom surface of the edge of the first notch;

the first digital signal processing chip is arranged on the first secondary circuit board and is electrically connected with the first secondary circuit board through solder balls;

The first secondary circuit board comprises a first middle layer, a second middle layer, a third middle layer and a fourth middle layer in the first secondary circuit board, wherein the first middle layer and the second middle layer are positioned between the third middle layer and the fourth middle layer; the first intermediate layer is provided with an optical emission signal wire, the second intermediate layer is provided with an optical receiving signal wire, and the optical emission signal wire and the optical receiving signal wire are high-frequency signal wires and are electrically connected with the first silicon optical chip and the first digital signal processing chip; the third intermediate layer is provided with a first hollowing, the fourth intermediate layer is provided with a second hollowing, and the first hollowing and the second hollowing cover the light emitting signal wiring and the light receiving signal wiring.

2. The optical module of claim 1, wherein the first notch surrounds three sides of the first silicon optical chip, bonding pads are respectively arranged on top surfaces of three side edges of the first notch, and the first silicon optical chip is connected with the bonding pads in a wire bonding manner;

the bonding pad comprises a high-frequency connection bonding pad, the high-frequency connection bonding pad is arranged on the top surface of the first notch edge in the length direction of the first secondary circuit board, and the high-frequency connection bonding pad is used for transmitting high-frequency signals of the first silicon optical chip and the first digital signal processing chip.

3. The optical module of claim 1, wherein a first countersink is provided on the circuit board, and a first through hole is provided in the first countersink; the bottom of first base sets up first step, first base sets up in the first heavy inslot, first step inlays and establishes in the first through-hole, first step passes first through-hole contact the casing of optical module.

4. The optical module of claim 1, wherein the first optical transceiver further comprises a first bridge member disposed on the first base and located on a side of the first silicon optical chip away from the first secondary circuit board, and one end of the first bridge member is wire-bonded to the first silicon optical chip and the other end of the first bridge member is wire-bonded to the circuit board.

5. The optical module of claim 1, wherein the first light source comprises a protective cover, a laser, a collimating lens and an isolator, the laser, the collimating lens and the isolator are sequentially arranged on the first base along the direction extending to the first silicon optical chip, the bottom of the protective cover is connected with the first base, and the protective cover is arranged on the laser, the collimating lens and the isolator;

The laser wire is connected with the circuit board.

6. The light module of claim 1 wherein the first base comprises a base body including a first portion and a second portion, the first portion being connected to the second portion, the second portion carrying the first silicon light chip, the first portion carrying the first light source, a central axis extending direction of the first portion being at a predetermined angle to a central axis extending direction of the second portion.

7. A light module as recited in claim 6, wherein the predetermined angle is 8 °.

8. A light module as recited in claim 3, wherein circuit board traces are disposed on the first secondary circuit board at a back side of the first countersink.

9. A light module as recited in claim 3, wherein the first through hole is disposed obliquely to the circuit board, and an angle between a central axis of the first through hole and a central axis of the circuit board is 8 °.

10. The optical module of claim 1, wherein the first sub-circuit board is located on a side of the first silicon optical chip adjacent to the optical module electrical port; the first secondary circuit board is parallel to the circuit board.