CN114263902B - Mixed steam generation system - Google Patents
Mixed steam generation system Download PDFInfo
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- CN114263902B CN114263902B CN202111469260.XA CN202111469260A CN114263902B CN 114263902 B CN114263902 B CN 114263902B CN 202111469260 A CN202111469260 A CN 202111469260A CN 114263902 B CN114263902 B CN 114263902B
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- 239000012159 carrier gas Substances 0.000 claims abstract description 85
- 238000010517 secondary reaction Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 103
- 238000003860 storage Methods 0.000 claims description 33
- 238000009826 distribution Methods 0.000 claims description 22
- 238000004321 preservation Methods 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 54
- 239000007789 gas Substances 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/10—Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier
- Y02P80/15—On-site combined power, heat or cool generation or distribution, e.g. combined heat and power [CHP] supply
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application provides a mixed steam generating system, which comprises a steam generating device, a concentration compensating device and a conveying pipeline; the steam generating device comprises a first steam output channel which is communicated with the conveying pipeline through a flow passage control element; the concentration compensation device comprises a carrier gas compensation pipeline; the flow channel control element is controlled to take mixed steam which is generated in the steam generating device and is smaller than a preset concentration threshold value as a carrier gas source, and the mixed steam is injected into the concentration compensating device through the conveying pipeline and the carrier gas compensating pipeline to carry out secondary reaction. The mixed steam generation system is adopted, so that the concentration of the supplied mixed steam is stable, and a better drying effect is obtained.
Description
Technical Field
The application relates to the field of semiconductor manufacturing equipment, in particular to a mixed steam generation system.
Background
Semiconductor manufacturing processes are a series of complex steps that accurately produce very small features on a wafer substrate. Drying the wafer surface after cleaning is a very important step. Since a small amount of liquid (usually water) remains on the wafer surface after the cleaning process is completed, if the drying is insufficient, defects such as water mark are formed on the wafer surface, so that the quality of the drying effect directly affects the product yield performance of the wafer surface.
The isopropyl alcohol (IPA) drying process is a drying process commonly used in wet cleaning processes, and is based on the principle that the low surface tension and volatile properties of IPA are utilized to replace water with higher surface tension on the surface of a silicon wafer, and then hot nitrogen (N) 2 ) Blow-drying to thoroughly dry the water film on the surface of the wafer.
However, controlling the concentration and stability of the IPA vapor in the reaction chamber during the IPA drying process is a great technical difficulty.
In view of this, there is a need for an improvement in the prior art mixed steam generation system to address the above-described problems.
Disclosure of Invention
The application aims to disclose a mixed steam generation system which is used for solving the technical problem that the concentration and stability of IPA steam are difficult to control in the drying process, so that the defects of water mark and the like on the surface of a dried wafer are avoided.
To achieve the above object, the present application provides a hybrid steam generating system comprising:
the concentration compensation device is connected with the steam generation device;
the steam generation device comprises a first steam output channel which is communicated with the conveying pipeline through a flow passage control element; the concentration compensation device comprises a carrier gas compensation pipeline;
and controlling the flow channel control element to take mixed steam which is generated in the steam generating device and is smaller than a preset concentration threshold value as a carrier gas source, and injecting the mixed steam into the concentration compensating device through the conveying pipeline and the carrier gas compensating pipeline to perform secondary reaction.
As a further development of the application, the flow control element divides the first steam outlet channel into an upper line and a lower line, on which a first concentration monitor is arranged.
As a further development of the application, the delivery conduit is provided with a first one-way valve.
As a further improvement of the application, the steam generating device and the concentration compensating device each further comprise a liquid supply device, the liquid supply device comprising a liquid storage tank for containing a solution and a liquid inlet pipeline communicated with the liquid storage tank, the liquid inlet pipeline being provided with a first throttle valve to control the flow rate of the solution.
As a further improvement of the application, the steam generating device and the concentration compensating device each further comprise a heat preservation device for accommodating the liquid storage tank, and a heat conducting medium with constant temperature is filled between the heat preservation device and the liquid storage tank.
As a further improvement of the application, the steam generating device and the concentration compensating device also comprise a liquid level sensor arranged in the liquid storage tank and used for monitoring the liquid level position of the solution.
As a further improvement of the present application, the vapor generation device further includes an external carrier gas source for providing carrier gas, and a carrier gas supply line communicating with the external carrier gas source; the carrier gas supply line includes an inlet end configured with a second throttle valve to control the flow of the carrier gas.
As a further improvement of the application, the carrier gas supply pipeline and the carrier gas compensation pipeline both further comprise gas outlet ends, the gas outlet ends extend into the solution, the gas outlet ends are provided with carrier gas distribution units for distributing the carrier gas into bubbles, and the side walls of the carrier gas distribution units are annularly provided with a plurality of gas outlet holes with uniform sizes so as to ensure that the bubbles are uniform and keep a set distance from the liquid level of the solution.
As a further improvement of the application, the top surface of the carrier gas distribution unit is provided with air inlet holes with equal aperture, and the air inlet holes and the air outlet holes are mutually communicated to form a first channel for the carrier gas to circulate and the circulation paths are equal.
As a further improvement of the application, the carrier gas distribution unit is provided with a hollow cavity, the bottom of the hollow cavity is concavely provided with a plurality of diversion trenches with equal size and in central scattering distribution, and the diversion trenches are mutually communicated with the air outlet holes to form a second channel for the carrier gas to circulate and the circulation paths are equal.
As a further improvement of the application, the concentration compensation device also comprises a second steam output channel which is arranged above the liquid storage tank and communicated with the outside, and a second concentration monitor and a second one-way valve are arranged on the second steam output channel.
Compared with the prior art, the application has the beneficial effects that: and a conveying pipeline is arranged between the steam generating device and the concentration compensation device, a flow passage control element is arranged to connect the first steam output channel with the conveying pipeline, and mixed steam which is generated in the steam generating device and is smaller than a preset concentration threshold value is used as a carrier gas source to be injected into the concentration compensation device to carry out secondary reaction through controlling the flow passage control element. By adopting the mixed steam generation system, the concentration of the output mixed steam meets the requirement and is stable, so that a better wafer surface drying effect is obtained.
Drawings
FIG. 1 is a schematic diagram of a hybrid steam generating system according to one embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of the carrier gas distribution unit in one embodiment of the mixed vapor generation system shown in FIG. 1;
FIG. 3 is a cross-sectional view of a carrier gas distribution unit in the mixed vapor generation system shown in FIG. 1 in another embodiment;
FIG. 4 is a schematic diagram of a hybrid steam generating system according to an alternate embodiment of the present disclosure;
FIG. 5 is a schematic illustration of a hybrid steam generating system in accordance with another alternative embodiment of the present disclosure;
fig. 6 is a block diagram of the circuit connection of the mixed steam generating system shown in fig. 1.
Detailed Description
The present application will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the present application, and functional, method, or structural equivalents and alternatives according to the embodiments are within the scope of protection of the present application by those skilled in the art.
It should be understood that, in the present application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present technical solution and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present technical solution.
Referring to fig. 1 to 6, a specific embodiment of a mixed steam generating system according to the present application is shown.
Referring to fig. 1, 4 and 5, the hybrid steam generation system 100 includes: a steam generator 1, a concentration compensation device 2, and a delivery pipe 3 for communicating the steam generator 1 and the concentration compensation device 2; wherein the steam generating device 1 and the concentration compensating device 2 each comprise a liquid supply device (i.e., a liquid supply device 11 and a liquid supply device 21), and a heat retaining device (i.e., a heat retaining device 14 and a heat retaining device 24).
The liquid supply device 11 includes a liquid storage tank 111 for containing a solution 114 and a liquid inlet pipe 112 communicating with the liquid storage tank 111, the liquid inlet pipe 112 being provided with a first throttle valve 113, the flow rate of the solution 114 entering the liquid storage tank 111 from the liquid inlet pipe 112 being controlled by controlling the first throttle valve 113; a liquid level sensor 115 for monitoring the liquid level of the solution 114 is provided in the liquid storage tank 111. The first throttle valve 113 and the liquid level sensor 115 are electrically connected to a control circuit (not shown). Note that, the solution 114 is not completely filled in the liquid storage tank 111, and a proper space needs to be left above the liquid storage tank for containing the vapor of the solution 114.
In this embodiment, the solution 114 is isopropyl alcohol (IPA), and isopropyl alcohol vapor is supplied through the vapor generating device 1 for a wafer drying process after wet etching or cleaning. Solution 114 includes, but is not limited to, isopropyl alcohol, and in other embodiments of the present application, solution 114 may be other solutions that require conversion to steam for processing. One end of the liquid inlet pipe 112 communicates with a solution source (not shown), and the other end communicates with the liquid reservoir 111, and is capable of supplying a solution 114 into the liquid reservoir 111. It should be noted that to reduce the disturbance to the system caused by the liquid supply process, one end of the liquid inlet line 112 extends below the liquid level of the solution 114.
A level sensor 115 is provided on a side wall of the reservoir 111 to monitor the level of the solution 114 in the reservoir 111. In the present embodiment, the liquid level sensor 115 includes a first liquid level sensor 115a, a second liquid level sensor 115b, and a third liquid level sensor 115c. The first liquid level sensor 115a is located at the highest allowable liquid level position, the third liquid level sensor 115c is located at the lowest allowable liquid level position, and the second liquid level sensor 115b is located at the most appropriate set liquid level position. Note that, the height positional relationship of the first liquid level sensor 115a, the second liquid level sensor 115b, and the third liquid level sensor 115c is only schematically shown in fig. 1, 4, and 5. Because of the influence of the remaining space in the liquid storage tank 111 on the vapor pressure of isopropyl alcohol, the liquid level position of isopropyl alcohol needs to be strictly controlled according to the application, namely, the first liquid level sensor 115a, the second liquid level sensor 115b and the third liquid level sensor 115c are positioned near the set liquid level position, and the height difference between the first liquid level sensor and the second liquid level sensor is controlled within the preset range. In order to ensure normal process and continuous and stable formation of isopropyl alcohol vapor, a first throttle valve 113 is disposed on the liquid inlet pipe 112 to control the content of the solution 114 in the liquid storage tank 111. When the first liquid level sensor 115a detects that the liquid level of the solution 114 in the liquid storage tank 111 is higher than the position where the first liquid level sensor is located, the control circuit closes the first throttle valve 113, and the liquid inlet pipeline 112 stops supplying liquid into the liquid storage tank 111; when the liquid level of the solution 114 is lower than the position of the first liquid level sensor 115a, the first throttle valve 113 is controlled by the control circuit to control the flow rate of the injected solution 114, so that the content of the solution 114 in the liquid storage tank 111 is controlled within a certain range.
It should be further noted that, the liquid level sensor 115 includes, but is not limited to, an optical liquid level sensor, a floating ball type liquid level sensor, a capacitive liquid level sensor, etc., and the relevant arrangement of the liquid level sensor 115 can be adjusted accordingly according to different types.
The liquid storage tank 111 is placed in the heat insulating device 14, and a heat conductive medium 141 having a constant temperature is filled between the heat insulating device 14 and the liquid storage tank 111. In this embodiment, the heat conducting medium 141 is deionized water, and the application does not limit the initial temperature of the heat conducting medium 141, and the temperature of the solution 114 can be adjusted by using the temperature of the heat conducting medium 141 as a process adjustable parameter, so as to control the concentration of the solution 114 in the generated steam. Compared with the existing electric heating method and the like, the heat transfer process of water bath heat preservation is stable, isopropanol steam can be formed without heating under normal temperature conditions for isopropanol, the temperature of the heat conducting medium 141 can be set to be room temperature, and potential safety hazards caused by directly heating flammable and explosive chemicals such as isopropanol can be avoided. In addition, since the temperature of the solution 114 is controlled by the heat conductive medium 141, the temperature of the heat conductive medium 141 is an important parameter for maintaining the stability of the steam supply. The heat conducting medium 141 is filled around the liquid storage tank 111, so that the temperature of the solution 114 in the liquid storage tank 111 is relatively stable, and the rate and concentration of generated steam are relatively stable.
It should be further noted that the heat conducting medium 141 includes, but is not limited to, deionized water, and may be a liquid such as oil. Since the temperature of the solution 114 is controlled by the heat conducting medium 141, the temperature of the heat conducting medium 141 may be maintained by providing a cooling fin 143 or other temperature adjusting device with a temperature raising or lowering function on the heat preservation device 14, and a medium circulation pipe 142 connected to the temperature adjusting device, and adjusting the temperature of the heat conducting medium 141 flowing circularly by the cooling fin 143 (i.e., a lower concept of the temperature adjusting device), so that the liquid filled between the liquid storage tank 111 and the heat preservation device 14 controls the temperature, and the temperature of the solution 114 in the liquid storage tank 111 is adjusted to be kept constant. The structures of the liquid supply device 12 and the heat preservation device 14 in the steam generating device 1 are the same as those of the liquid supply device 11 and the heat preservation device 24 in the concentration compensation device 2, and will not be described again here.
Referring to fig. 1, the vapor generating device 1 further includes an external carrier gas source (not shown) for providing a carrier gas, and a carrier gas supply line 121 communicating with the external carrier gas source; the carrier gas supply line 121 includes an inlet end (not identified) where a second throttle valve 123 is configured to control the flow rate of the carrier gas, and an outlet end (not identified) where the outlet end extends into the solution 114 and is installed with a carrier gas distribution unit 122 for distributing the carrier gas into bubbles, and a plurality of uniformly sized outlet holes 1222 are annularly arranged on a sidewall 1221 of the carrier gas distribution unit 122 so that the generated bubbles are uniform and maintain a set distance from the liquid surface of the solution 114. The second throttle valve 123 is electrically connected with the control circuit
In this embodiment, the carrier gas is nitrogen, in order to ensure that the ratio of the carrier gas in the liquid storage tank 111 to the solution 114 is always stable and that the isopropyl alcohol vapor is stably supplied, a second throttle valve 123 is disposed at the air inlet end of the carrier gas supply pipe 121, the second throttle valve 123 is controlled by the control circuit to further control the content of the carrier gas entering the liquid storage tank 111 from the carrier gas supply pipe 121, and the carrier gas in the carrier gas supply pipe 121 is not reversed. The carrier gas is introduced into the solution 114, a carrier gas distribution unit 122 is installed at the gas outlet end of the carrier gas supply pipeline 121, and in order to ensure that the generated bubbles keep a set distance from the liquid surface of the solution 114, a plurality of gas outlet holes 1222 with uniform sizes are annularly arranged on the side wall 1221 of the carrier gas distribution unit 122, so that the carrier gas is distributed into bubbles with uniform sizes to overflow from the solution 114, and the vapor component of the solution 114 is carried under the normal temperature condition, thereby forming a carrier gas flow containing the vapor component of the solution 114.
The carrier gas includes, but is not limited to, nitrogen, but may be other inert gases or other gases required by the process.
Referring to fig. 2, in the present embodiment, the carrier gas distribution unit 122 is cylindrical, an air inlet hole 1223 with an equal aperture is disposed on the top surface of the carrier gas distribution unit, and the air inlet hole 1223 is communicated with the air outlet holes 1222 annularly disposed on the side wall 1221 to form a first channel 1224 through which the carrier gas flows and the flow paths are equal, and in this case, the carrier gas flow path is 1000. Since the air flow into the first passage 1224 is the same as the air bubbles formed at the air outlet 1222, and a constant temperature environment is provided by the heat preservation device 14, the concentration of the mixed vapor formed when the air bubbles collapse (i.e., the mixed vapor of isopropyl alcohol and nitrogen) is also the same. In addition, by controlling the first throttle valve 113 and the second throttle valve 123, it is ensured that the ratio of the carrier gas in the liquid storage tank 111 to the solution 114 is always stable, and further, the concentration stability of the mixed vapor generated in the vapor generating device 1 is ensured.
Referring to fig. 3, in another embodiment, the carrier gas distribution unit 122 has a hollow cavity 1225, the bottom of the hollow cavity 1225 is concaved to form a plurality of equal-sized flow guide grooves 1226 with central scattering distribution, and the flow guide grooves 1226 are mutually communicated with the air outlet holes 1222 annularly arranged on the side wall 1221 to form a second channel 1227 for the carrier gas to circulate and have equal circulation paths, and at this time, the carrier gas circulation path is 2000.
It should be further noted that the structure of the carrier gas distribution unit 122 includes, but is not limited to, the two types of structures provided that the cross-section of the flow channels (such as the first channel 1224 and the second channel 1227) along any one of the extending directions thereof is ensured to be equal, so that the air flows in the flow channels are equal and the size of the air bubbles formed at the air outlet holes 1222 is uniform, and the specific size of the air bubbles can be adjusted according to the requirement. By setting the flow passage, the carrier gas introduced into the carrier gas supply pipeline 121 is split and distributed into bubbles with uniform size, and when the bubbles overflow from the solution 114 and break, the concentration of mixed steam formed by the bubbles and the steam component of the solution 114 carried by the bubbles is stable, thereby avoiding the technical problem of unstable mixed steam concentration caused by uneven size of the bubbles split and distributed by the carrier gas distribution unit 122.
Referring to fig. 1, 4 and 5, the steam generating device 1 further includes a first steam output channel 13, the first steam output channel 13 includes a second pipe 131 and a first pipe 132, a flow path control element 133 is disposed between the second pipe 131 and the first pipe 132 and connected to one end of the delivery pipe 3, and a first concentration monitor 134 is disposed on the second pipe 131. The concentration compensation device 2 comprises a carrier gas compensation pipeline 221, a second steam output channel 23 which is arranged above the liquid storage tank 211 and communicated with the outside, and a second concentration monitor 231 and a second one-way valve 232 which are arranged on the second steam output channel 23. The flow channel control element 133, the first concentration monitor 134, the first check valve 31, the second concentration monitor 231, and the second check valve 232 are all electrically connected to the control circuit.
When the first concentration monitor 134 monitors that the concentration of the mixed vapor generated in the vapor generating device 1 is less than the preset concentration threshold, the control circuit controls the flow passage control element 133 to close the first pipeline 132, so that the second pipeline 131 is communicated with the conveying pipeline 3, and the mixed vapor enters the carrier gas compensation pipeline 221 from the second pipeline 131 through the conveying pipeline 3, as shown in the gas path 102 in fig. 1. At this time, the mixed vapor generated in the vapor generating device 1 (i.e., the mixed vapor of IPA and nitrogen) serves as the carrier gas source of the carrier gas compensation line 221 in the concentration compensation device 2, and the secondary reaction is performed in the concentration compensation device 2. When the first concentration monitor 134 monitors that the concentration of the mixed steam generated in the steam generating device 1 reaches the preset concentration threshold, the control circuit controls the flow passage control element 133 to close the conveying pipeline 3, and the second pipeline 131 and the first pipeline 132 are communicated, so that the mixed steam generated in the steam generating device 1 is conveyed from the first steam output channel 13 to the receiving device 4, as shown in the gas path 101 in fig. 1. The first check valve 31 is provided on the delivery pipe 3, so that the interference of the reverse flow of the gas in the concentration compensation device 2 can be avoided. The flow control element 133 may be a T-ball three-way valve or other type of element as long as gas flow control is enabled.
In the present embodiment, since only one concentration compensating device 2 is provided, the second check valve 232 is provided on the second steam output passage 23. The mixed steam generated in the steam generating device 1 is used as a carrier gas source to perform secondary reaction in the concentration compensating device 2, and likewise, a second concentration monitor 231 arranged in the second steam output channel 23 monitors the mixed steam generated in the concentration compensating device 2, if the second concentration monitor 231 monitors that the concentration of the generated mixed steam reaches a preset concentration threshold value, a control circuit opens a second one-way valve 232, and the output path of the mixed steam is shown as a gas path 103 in fig. 1; and otherwise, the second check valve 232 is closed to stop outputting the mixed steam.
It should be noted that, the working principles of the carrier gas compensation pipeline 221 and the second concentration monitor 231 in the concentration compensation device 2 are the same as the working principles of the carrier gas supply pipeline 121 and the first concentration monitor 134 in the vapor generating device 1, and the same technical scheme is referred to the above, and will not be repeated herein. In the present embodiment, the receiving device 4 is a wafer drying device to dry the wafer by the generated mixed vapor. The receiving device 4 includes, but is not limited to, a wafer drying device, and can be adjusted according to actual requirements.
In a variant embodiment, as shown with reference to fig. 4, the first steam output channel 13 and the second steam output channel 23 may be connected first and then to the receiving means 4. In this embodiment, it should be noted that a third check valve 135 needs to be added to the first steam output channel 13 to avoid interference of the mixed steam in the first steam output channel 13 and the second steam output channel 23.
In another variant embodiment, referring to fig. 5, a plurality of concentration compensation devices 2 may be sequentially connected after the steam generating device 1, and the concentration of the mixed steam entering the receiving device 4 may be more accurate and more stable.
Please refer to the first embodiment for the same technical scheme in the above two embodiments, and the description thereof is omitted herein.
A delivery pipe 3 provided with a first check valve 31 is provided between the steam generating device 1 and the concentration compensating device 2, and a flow path control element 133 is provided to connect the first steam output passage 13 with the delivery pipe 3, and the flow path control element 133 is controlled to inject mixed steam generated in the steam generating device 1, which is smaller than a preset concentration threshold, into the concentration compensating device 2 as a carrier gas source to perform a secondary reaction. By adopting the mixed steam generating system 100, the concentration of the output mixed steam meets the requirement and is stable, so that a better wafer surface drying effect is obtained.
The above list of detailed descriptions is only specific to practical embodiments of the present application, and they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the spirit of the present application should be included in the scope of the present application.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (9)
1. A hybrid steam generating system, comprising:
the concentration compensation device is connected with the steam generation device;
the steam generation device comprises a first steam output channel which is communicated with the conveying pipeline through a flow passage control element;
the concentration compensation device comprises a carrier gas compensation pipeline;
the steam generating device further comprises a liquid supply device, wherein the liquid supply device comprises a liquid storage tank for containing solution and a liquid inlet pipeline communicated with the liquid storage tank, and the liquid inlet pipeline is provided with a first throttle valve to control the flow rate of the solution;
the steam generating device also comprises an external carrier gas source for providing carrier gas and a carrier gas supply pipeline communicated with the external carrier gas source; the carrier gas supply pipeline comprises an air inlet end, and the air inlet end is provided with a second throttle valve to control the flow of the carrier gas;
and controlling the flow channel control element to take mixed steam which is generated in the steam generating device and is smaller than a preset concentration threshold value as a carrier gas source, and injecting the mixed steam into the concentration compensating device through the conveying pipeline and the carrier gas compensating pipeline to perform secondary reaction.
2. A mixed steam generating system according to claim 1, wherein the mixed steam generating system comprises,
the flow channel control element divides the first steam output channel into a first pipeline positioned at the front end and a second pipeline positioned at the rear end, and a first concentration monitor is arranged on the first pipeline.
3. A mixed steam generating system according to claim 1, wherein the mixed steam generating system comprises,
the conveying pipeline is provided with a first one-way valve.
4. A mixed steam generating system according to claim 1, wherein the mixed steam generating system comprises,
the steam generating device and the concentration compensating device also comprise a heat preservation device for accommodating the liquid storage tank, and a heat conducting medium with constant temperature is filled between the heat preservation device and the liquid storage tank.
5. A mixed steam generating system according to claim 1, wherein the mixed steam generating system comprises,
the steam generating device and the concentration compensating device also comprise a liquid level sensor arranged in the liquid storage tank and used for monitoring the liquid level position of the solution.
6. A mixed steam generating system according to claim 1, wherein the mixed steam generating system comprises,
the carrier gas supply pipeline and the carrier gas compensation pipeline also comprise air outlet ends, the air outlet ends extend into the solution, the air outlet ends are provided with carrier gas distribution units for distributing the carrier gas into bubbles, and the side walls of the carrier gas distribution units are annularly provided with a plurality of air outlet holes with uniform sizes so that the bubbles are uniform and keep a set distance with the liquid level of the solution.
7. The hybrid steam generating system as recited in claim 6, wherein,
the top surface of the carrier gas distribution unit is provided with air inlets with equal apertures, and the air inlets are mutually communicated with the air outlets to form a first channel for the carrier gas to circulate and the circulation paths are equal.
8. The hybrid steam generating system as recited in claim 6, wherein,
the carrier gas distribution unit is provided with a hollow cavity, the bottom of the hollow cavity is concaved inwards to form a plurality of diversion trenches with equal size and in central scattering distribution, and the diversion trenches are mutually communicated with the air outlet holes to form a second channel for the carrier gas to circulate and the circulation paths are equal.
9. A mixed steam generating system according to claim 1, wherein the mixed steam generating system comprises,
the concentration compensation device further comprises a second steam output channel which is arranged above the liquid storage tank and communicated with the outside, and a second concentration monitor and a second one-way valve are arranged on the second steam output channel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111469260.XA CN114263902B (en) | 2021-12-03 | 2021-12-03 | Mixed steam generation system |
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| CN202111469260.XA CN114263902B (en) | 2021-12-03 | 2021-12-03 | Mixed steam generation system |
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| CN114263902A CN114263902A (en) | 2022-04-01 |
| CN114263902B true CN114263902B (en) | 2023-08-25 |
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