CN114118334B - Miniaturized anti-metal ultrahigh frequency rfid tag - Google Patents
Miniaturized anti-metal ultrahigh frequency rfid tag Download PDFInfo
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- CN114118334B CN114118334B CN202111628622.5A CN202111628622A CN114118334B CN 114118334 B CN114118334 B CN 114118334B CN 202111628622 A CN202111628622 A CN 202111628622A CN 114118334 B CN114118334 B CN 114118334B
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- metal wire
- dielectric substrate
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 55
- 239000002184 metal Substances 0.000 title claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000003990 capacitor Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims description 41
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses a miniaturized anti-metal ultrahigh frequency rfid tag, which belongs to the field of electronic tags and comprises a dielectric substrate, an rfid radio frequency chip, an antenna and a capacitor or an inductor, wherein the rfid radio frequency chip, the antenna and the capacitor or the inductor are arranged on the dielectric substrate; the antenna comprises two annular sub-antennas, wherein the space enclosed by the two annular sub-antennas is wholly or partially opposite, and the annular sub-antennas are provided with notches to form two connecting terminals; the rfid radio frequency chip and the capacitor or the inductor are electrically connected between a pair of mutually staggered connection terminals in the two annular sub-antennas, and the other pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected. The invention not only reduces the whole volume of the label and the material consumption, but also has metallic resistance.
Description
Technical Field
The invention relates to the field of electronic tags, in particular to a miniaturized anti-metal ultrahigh-frequency rfid tag.
Background
The existing miniaturized ultrahigh frequency anti-metal tag is mostly realized by adopting a mode of loading an RFID chip by a microstrip antenna, in order to meet the production and use requirements and enable the tag antenna to be smaller, a material with a high dielectric constant and a high Q value is introduced as a substrate of the tag antenna, the working frequency band of the tag antenna of the material with a high dielectric constant is narrower, the original RF performance of the tag can be reduced in practical application, namely the reading distance is reduced by the narrow-band RFID tag, especially the application of the RFID tag and a system working in a Chinese frequency band (920-925 MHZ), and meanwhile, the tag which is circulated in the market and adopts the microstrip antenna is thicker in general although the problem of narrower bandwidth is solved.
Disclosure of Invention
Aiming at the problem that the ultrahigh frequency anti-metal tag in the prior art cannot achieve both working performance and volume size, the invention aims to provide a miniaturized anti-metal ultrahigh frequency rfid tag.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
A miniaturized anti-metal ultrahigh frequency rfid tag comprises a dielectric substrate, an rfid radio frequency chip, an antenna and a capacitor or inductor, wherein the rfid radio frequency chip, the antenna and the capacitor or inductor are arranged on the dielectric substrate; the antenna comprises two annular sub-antennas, wherein the space enclosed by the two annular sub-antennas is wholly or partially opposite, and the annular sub-antennas are provided with notches to form two connecting terminals; the rfid radio frequency chip and the capacitor or the inductor are electrically connected between a pair of mutually staggered connection terminals in the two annular sub-antennas, and the other pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected.
Further, a pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected with the first conductors, and the rfid radio frequency chip and the capacitor or the inductor are electrically connected between the two first conductors.
Further, another pair of connection terminals staggered with each other in the two annular sub-antennas are electrically connected through a second conductor, and a gap is formed between the second conductor and the first conductor.
Preferably, the dielectric substrate is in a rectangular body configuration; the two annular sub-antennas are respectively laid on the front side wall and the rear side wall of the dielectric substrate, and the rfid radio frequency chip, the capacitor or the inductor and the first conductor are all laid on the bottom wall of the dielectric substrate.
Preferably, at least one of the loop sub-antennas extends onto either the left or right side wall of the dielectric substrate.
Preferably, the other pair of connection terminals of the two annular sub-antennas, which are staggered with each other, protrude from the bottom wall of the dielectric substrate, so that the second conductors are connected in a flying-line shape.
Preferably, the annular sub-antenna is frame-shaped and comprises a metal wire A, a metal wire B, a metal wire C, a metal wire D and a metal wire E which are sequentially connected; the metal wire B is parallel to and opposite to the metal wire D, the metal wire A and the metal wire E are collinear and parallel to the metal wire C, and the free ends of the metal wire A and the metal wire E respectively form two connecting terminals of the annular sub-antenna.
Preferably, the loop sub-antenna is circular or elliptical.
Preferably, the materials of the loop sub-antenna, the first conductor and the second conductor are gold, silver, copper, iron or aluminum; the dielectric substrate is made of PCB, composite material or ceramic.
Preferably, the rfid radio frequency chip is an ultrahigh frequency radio frequency chip; the material of the capacitor or the inductor is ceramic.
By adopting the technical scheme, the antenna is deformed into a three-dimensional 8-shaped wiring mode (an electric connection mode between two annular sub-antennas), so that the volume occupied by the antenna in the tag is greatly reduced on the premise of keeping the total length of the antenna, the whole volume of the tag is reduced, the use of high-dielectric constant high-Q-value materials is reduced, and the production cost is effectively saved; in addition, the three-dimensional 8-shaped wiring formed by the two annular sub-antennas fully utilizes the wiring principle of the 2-one or 4-one-wavelength annular antennas to form two magnetic rings, and due to the fact that all or part of the two annular sub-antennas are arranged oppositely, vector magnetic fields of antenna near fields can be overlapped by the two magnetic rings to a certain extent, gain dispersion of the annular antennas caused by deformation is effectively improved and compensated, and therefore the purpose of miniaturization is achieved. Therefore, the effect of considering both the working performance and the volume size is achieved while the service performance of the tag antenna is not affected.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 2 is a bottom view of a first embodiment of the present invention.
Fig. 3 is a schematic diagram of a structure after removing a dielectric substrate according to an embodiment of the invention.
Fig. 4 is an expanded schematic view of an antenna according to a first embodiment of the invention.
Fig. 5 is an expanded schematic view of an antenna according to a second embodiment of the invention.
Fig. 6 is an expanded schematic diagram of an antenna according to a third embodiment of the present invention.
Fig. 7 is an expanded schematic diagram of another structure of an antenna according to the third embodiment of the present invention.
In the figure, a 1-dielectric substrate, a 2-rfid video chip, a 3-antenna, a 31-metal wire A, a 32-metal wire B, a 33-metal wire C, a 34-metal wire D, a 35-metal wire E, a 36-first conductor, a 37-second conductor, a 38-short conductor, a 39-transition conductor, a 4-capacitor, or an inductor.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
It should be noted that, in the description of the present invention, the positional or positional relation indicated by the terms such as "upper", "lower", "left", "right", "front", "rear", etc. are merely for convenience of describing the present invention based on the description of the structure of the present invention shown in the drawings, and are not intended to indicate or imply that the apparatus or element to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The terms "first" and "second" in this technical solution are merely references to the same or similar structures, or corresponding structures that perform similar functions, and are not an arrangement of the importance of these structures, nor are they ordered, or are they of a comparative size, or other meaning.
In addition, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., the connection may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two structures. It will be apparent to those skilled in the art that the specific meaning of the terms described above in this application may be understood in the light of the general inventive concept in connection with the present application.
Example 1
A miniaturized anti-metal ultra-high frequency rfid tag, as shown in figures 1-4, comprises a dielectric substrate 1, and an rfid radio frequency chip 2, an antenna 3 and a capacitor or inductor 4 disposed on the dielectric substrate 1. The antenna 3 comprises two annular sub-antennas, the space enclosed by the two annular sub-antennas is wholly or partially opposite, and the annular sub-antennas are provided with notches to form two connecting terminals; the rfid rf chip 2 and the capacitor or inductor 3 are electrically connected between a pair of mutually staggered connection terminals in the two annular sub-antennas, and the other pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected.
In the present embodiment, the configuration dielectric substrate 1 is configured as a rectangular body structure made of a material having a high dielectric constant and being non-metal such as PCB, composite material or ceramic. The dielectric substrate 1 includes a top wall, a bottom wall, a front side wall, a rear side wall, a left side wall, and a right side wall, and the present embodiment mainly configures and uses three of the side walls, such as the front side wall, the rear side wall, and the bottom wall.
The two connection terminals formed by the notch on the annular sub-antenna are used for being electrically connected with other elements, and in the arrangement position, the two connection terminals are suitable for making the space enclosed by the two annular sub-antennas wholly or partially opposite. For example, in the present embodiment, two loop sub-antennas are oppositely laid on the front and rear side walls of the dielectric substrate 1. Wherein the rfid radio frequency chip 2 and the capacitor or inductor 4 are disposed on the bottom wall of the dielectric substrate 1. The laying mode can be hot pressing, bonding and the like.
In this embodiment, the material of the annular sub-antenna is configured as gold, silver, copper, iron or aluminum, and the annular sub-antenna is specifically configured to have a frame-shaped overall structure, and includes a metal wire a31, a metal wire B32, a metal wire C33, a metal wire D34 and a metal wire E35 that are sequentially connected, where the annular sub-antenna may be obtained by bending one integral wire or may be obtained by welding a plurality of wires. The metal wires B32 and D34 are disposed parallel and opposite to each other, the metal wires a31 and E35 are collinear and both are parallel to the metal wire C33, and the free ends of the metal wires a31 and E35 respectively form two connection terminals of the loop-shaped sub-antenna.
Since the two loop-shaped sub-antennas are oppositely disposed on the front and rear sidewalls of the dielectric substrate 1, the two loop-shaped sub-antennas have two pairs of connection terminals staggered with each other. The first conductors 36 are electrically connected to a pair of mutually staggered connection terminals in the two loop-shaped sub-antennas, the two first conductors 36 are all laid on the bottom wall of the dielectric substrate 1, and the two first conductors 36 are parallel to each other, in this embodiment, the two first conductors 36 are electrically connected to the loop-shaped sub-antennas through the switching conductors 39, respectively. In addition, the rfid rf chip 2 is configured as an rf chip having two terminals, the capacitor or inductor 4 is a capacitor or inductor made of a ceramic material having two terminals, and the rfid rf chip 2 and the capacitor or inductor 4 are electrically connected between the two first conductors 36.
The other pair of connection terminals of the two loop sub-antennas, which are staggered with each other, are protruded from the bottom wall of the dielectric substrate 1 (or protruded from the bottom wall of the dielectric substrate 1 through a short conductor 38), and at the same time, the other pair of connection terminals are electrically connected through the second conductor 37, and a gap is formed between the second conductor 37 and the bottom wall of the dielectric substrate 1 (specifically, the first conductor 36), so that the second conductor 37 is connected between the two loop sub-antennas in a flying line shape. The first conductor 36, the second conductor 37, the short conductor 38 and the transfer conductor 39 are made of gold, silver, copper, iron or aluminum, and the loop sub-antenna, the first conductor 36, the second conductor 37, the short conductor 38 and the transfer conductor 39 are made of the same material.
By the arrangement, the antenna 3 is configured into a three-dimensional 8-shaped antenna, so that the overall size of the antenna 3 is greatly reduced, and correspondingly, the volume and the materials of the dielectric substrate 1 are reduced, and the tag is miniaturized; in addition, the antenna 3 with a three-dimensional 8-shaped structure is provided with a unique shape, so that the annular antenna which is not metal-resistant in general can well utilize a metal surface to realize the metal-resistant effect. In this embodiment, the space enclosed by the two annular sub-antennas is preferably completely opposite, so that the magnetic ring formed by the two annular sub-antennas can overlap the vector magnetic field of the near field of the antenna to the greatest extent, and gain dispersion of the annular antennas caused by deformation is effectively improved and compensated.
In another preferred embodiment, the miniaturized anti-metal ultrahigh frequency rfid tag provided by the invention further comprises a packaging shell made of a wave-absorbing material, and the dielectric substrate 1, the rfid radio frequency chip 2, the antenna 3 and the capacitor or inductor 4 which are laid on the dielectric substrate are wrapped and sealed by the packaging shell.
Example two
It differs from embodiment one in that: in this embodiment, the loop sub-antenna may also be configured in a circular shape or an elliptical shape. As shown in fig. 5, which is an expanded view of the antenna 3, after two loop-shaped sub-antennas are respectively laid on the front side wall and the rear side wall of the dielectric substrate 1, and when in use, two magnetic rings with superimposed magnetic fields can be formed, thereby achieving the effect similar to that of the first embodiment.
Example III
It differs from embodiment one in that: it can be understood that the magnetic ring formed by the two annular sub-antennas during use does not need to be completely overlapped, and only partial overlapping is needed to achieve the effects of enhancing the magnetic field strength and compensating gain dispersion of the antenna 3 caused by deformation.
As shown in fig. 6, when two loop antennas are disposed, one of which is a frame-like structure as disclosed in the first embodiment and the other of which is a circular structure as disclosed in the second embodiment, and the two loop antennas are respectively laid on the front side wall and the rear side wall of the dielectric substrate 1, the space (magnetic field) surrounded by the two loop antennas is partially opposed (superimposed) during use, and the effects of enhancing the magnetic field strength and compensating gain dispersion of the antenna 3 due to deformation can be achieved.
Similarly, as shown in fig. 7, when both loop sub-antennas have a frame-like structure, only a part of one loop sub-antenna needs to be laid on the other side wall (left side wall or right side wall) of the dielectric substrate 1, and the other loop sub-antenna is kept unchanged, so that a space (magnetic field) enclosed by the two loop sub-antennas can be formed to be partially opposite, and when the antenna is used, the magnetic field strength of the two loop sub-antennas can be reduced, but the effects of enhancing the magnetic field strength and compensating gain dispersion of the antenna 3 caused by deformation can be still achieved.
The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, and yet fall within the scope of the invention.
Claims (4)
1. A miniaturized anti-metal ultrahigh frequency rfid tag, characterized in that: the antenna comprises a dielectric substrate, an rfid radio frequency chip, an antenna and a capacitor or inductor, wherein the rfid radio frequency chip, the antenna and the capacitor or inductor are arranged on the dielectric substrate; the antenna comprises two annular sub-antennas, wherein the space enclosed by the two annular sub-antennas is wholly or partially opposite, and the annular sub-antennas are provided with notches to form two connecting terminals; the rfid radio frequency chip and the capacitor or the inductor are electrically connected between a pair of mutually staggered connection terminals in the two annular sub-antennas, and the other pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected;
A pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected with first conductors, and the rfid radio frequency chip and the capacitor or the inductor are electrically connected between the two first conductors;
The other pair of mutually staggered connection terminals in the two annular sub-antennas are electrically connected through a second conductor, and a gap is reserved between the second conductor and the first conductor;
The dielectric substrate is in a rectangular structure; the two annular sub-antennas are respectively laid on the front side wall and the rear side wall of the dielectric substrate, and the rfid radio frequency chip, the capacitor or the inductor and the first conductor are all laid on the bottom wall of the dielectric substrate;
at least one of the loop sub-antennas extends onto either the left or right sidewall of the dielectric substrate;
The other pair of mutually staggered connection terminals in the two annular sub-antennas are protruded out of the bottom wall of the dielectric substrate so as to enable the second conductors to be connected in a flying line shape;
The annular sub-antenna is in a frame shape and comprises a metal wire A, a metal wire B, a metal wire C, a metal wire D and a metal wire E which are sequentially connected; the metal wire B is parallel to and opposite to the metal wire D, the metal wire A and the metal wire E are collinear and parallel to the metal wire C, and the free ends of the metal wire A and the metal wire E respectively form two connecting terminals of the annular sub-antenna.
2. The miniaturized, metal resistant, ultra-high frequency rfid tag of claim 1, wherein: the annular sub-antenna is circular or elliptical.
3. The miniaturized, metal resistant, ultra-high frequency rfid tag of claim 1, wherein: the annular sub-antenna, the first conductor and the second conductor are made of gold, silver, copper, iron or aluminum; the dielectric substrate is made of PCB, composite material or ceramic.
4. The miniaturized, metal resistant, ultra-high frequency rfid tag of claim 1, wherein: the rfid radio frequency chip is an ultrahigh frequency radio frequency chip; the material of the capacitor or the inductor is ceramic.
Priority Applications (1)
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CN202111628622.5A CN114118334B (en) | 2021-12-28 | 2021-12-28 | Miniaturized anti-metal ultrahigh frequency rfid tag |
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CN202111628622.5A CN114118334B (en) | 2021-12-28 | 2021-12-28 | Miniaturized anti-metal ultrahigh frequency rfid tag |
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CN114118334A CN114118334A (en) | 2022-03-01 |
CN114118334B true CN114118334B (en) | 2024-07-12 |
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CN216927632U (en) * | 2021-12-28 | 2022-07-08 | 苏州微明医疗科技有限公司 | Miniaturized anti-metal ultrahigh frequency rfid tag |
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US7055754B2 (en) * | 2003-11-03 | 2006-06-06 | Avery Dennison Corporation | Self-compensating antennas for substrates having differing dielectric constant values |
KR100933278B1 (en) * | 2004-10-04 | 2009-12-22 | 에머슨 앤드 커밍 마이크로웨어 프로덕츠, 인코포레이티드 | Improved RFID Tag |
CN207817752U (en) * | 2017-09-28 | 2018-09-04 | 舟山麦克斯韦物联网科技有限公司 | A kind of novel hyperfrequency anti-metal electronic tag |
WO2021019812A1 (en) * | 2019-07-31 | 2021-02-04 | 株式会社村田製作所 | Rfic module and rfid tag |
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CN216927632U (en) * | 2021-12-28 | 2022-07-08 | 苏州微明医疗科技有限公司 | Miniaturized anti-metal ultrahigh frequency rfid tag |
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