CN114029577B - Reflow soldering device of low-loss Schottky rectifier tube - Google Patents
Reflow soldering device of low-loss Schottky rectifier tube Download PDFInfo
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- CN114029577B CN114029577B CN202111229156.3A CN202111229156A CN114029577B CN 114029577 B CN114029577 B CN 114029577B CN 202111229156 A CN202111229156 A CN 202111229156A CN 114029577 B CN114029577 B CN 114029577B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the field of Schottky rectifier tube welding, in particular to a reflow soldering device of a low-loss Schottky rectifier tube, which comprises a rack, a continuous conveying mechanism, a positioning and clamping mechanism and a reflow soldering mechanism, wherein the continuous conveying mechanism, the positioning and clamping mechanism and the reflow soldering mechanism are positioned above the rack, the continuous conveying mechanism comprises a rotary table and a working platform, a plurality of through mounting ports for mounting the positioning and clamping mechanism are arranged on the working platform, the reflow soldering mechanism comprises a preheating assembly, a constant temperature assembly, a reflow soldering assembly and a cooling assembly, the positioning and clamping mechanism comprises a mounting frame, a bearing assembly and a clamping assembly, the bearing assembly is horizontally arranged on the mounting frame, the clamping assembly is arranged above the bearing assembly, and one side of the clamping assembly is hinged with the top end of the bearing assembly. This application realizes continuous incessant welding operation, reduces the extravagant possibility of energy, can also realize the accurate clamping function to the circuit board of different models and size, improve equipment's processing scope through location fixture.
Description
Technical Field
The invention relates to the field of Schottky rectifier tube welding, in particular to a reflow soldering device of a low-loss Schottky rectifier tube.
Background
The schottky rectifier is a schottky diode, which is a metal-semiconductor device formed by using a noble metal (gold, silver, aluminum, platinum, etc.) a as a positive electrode and an N-type semiconductor B as a negative electrode, and using a barrier formed on a contact surface of the two to have a rectifying characteristic. Since the N-type semiconductor contains a large number of electrons and the noble metal contains only a very small number of free electrons, electrons diffuse from a high concentration of B to a low concentration of a. Obviously, there are no holes in metal a, and there is no diffusion movement of holes from a to B. As electrons diffuse from B to A, the surface electron concentration of B gradually decreases, and the surface charge neutrality is destroyed, thus forming a potential barrier with the electric field direction of B → A. However, under the action of the electric field, electrons in A also generate drift motion from A → B, so that the electric field formed by diffusion motion is weakened. When a space charge region with a certain width is established, electron drift motion caused by an electric field and electron diffusion motion caused by different concentrations reach relative balance, and a Schottky barrier is formed.
In the prior art, a reflow soldering technology is often used to solder a schottky rectifying tube onto a circuit board, air or nitrogen is heated to a sufficiently high temperature and then blown to the circuit board with a mounted element, solder on two sides of the schottky rectifying tube is melted and then bonded with a main board, and the welding operation of the schottky rectifying tube and the circuit board is realized; the feeding and discharging time of the circuit board is long, so that the energy inside the reflow soldering equipment is wasted; the device for fixing the circuit board has poor adjusting capability, which results in the fixed installation process that can not adapt to the circuit boards of different types.
Therefore, there is a need for a low-loss reflow soldering apparatus for schottky rectifiers to solve the above problems.
Disclosure of Invention
Accordingly, there is a need to provide a reflow soldering apparatus for a low-loss schottky rectifier in response to the problems of the prior art.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
the invention provides a reflow soldering device of a low-loss Schottky rectifier tube, which comprises a circuit board, a rack, a continuous conveying mechanism, a positioning and clamping mechanism and a reflow soldering mechanism, wherein the continuous conveying mechanism, the positioning and clamping mechanism and the reflow soldering mechanism are positioned above the rack, the continuous conveying mechanism is fixedly arranged on the rack, the reflow soldering mechanism is arranged on the rack and comprises a turntable and a working platform, the working platform is horizontally and fixedly arranged on the turntable, a plurality of through mounting holes for mounting the positioning and clamping mechanism are arranged on the working platform, the plurality of through mounting holes are annularly distributed around the axis of the working platform, the positioning and clamping mechanism is provided with a plurality of groups, the plurality of groups of positioning and clamping mechanisms are sequentially arranged in the plurality of through mounting holes, the reflow soldering mechanism comprises a preheating component, a constant temperature component, a reflow soldering component and a cooling component, and the preheating component, the constant temperature component, the reflow soldering component and the cooling component are annularly distributed along the axis of the working platform, preheating assembly, the constant temperature subassembly, reflow soldering subassembly and cooling module be zonulae occludens in proper order, preheating assembly, the constant temperature subassembly, the output of reflow soldering subassembly and cooling module is all including the outer loop parcel that work platform was equipped with through mounting hole department, location fixture is including the installation frame, carrier assembly and centre gripping subassembly, installation frame fixed mounting is in through mounting hole, the carrier assembly level sets up on the installation frame, the centre gripping subassembly sets up in the carrier assembly top, the circuit board level sets up between the output of carrier assembly's output and the output of centre gripping subassembly, one side of centre gripping subassembly is articulated with carrier assembly's top.
Preferably, the bearing assembly comprises a first displacement driving assembly, a second displacement driving assembly, a first bearing plate and a second bearing plate, the first displacement driving assembly and the second displacement driving assembly are both horizontally arranged on the mounting frame, and the output direction of first displacement drive assembly and second displacement drive assembly sets up perpendicularly, first loading board and second loading board all are equipped with two, two first loading boards set up respectively at the both ends of first displacement drive assembly and are connected with the output transmission of first displacement drive assembly, two second loading boards set up respectively at the both ends of second displacement drive assembly and are connected with the output transmission of second displacement drive assembly, still be equipped with the first groove of dodging that is used for installing bearing assembly on the work platform, the first groove setting of dodging is around having a perfect understanding the installing port, first displacement drive assembly and second displacement drive assembly all set up at the first inslot of dodging.
Preferably, first displacement drive subassembly is including first manual adjusting device and first two-way threaded rod, first manual adjusting device installs at the first inslot of dodging, first two-way threaded rod level sets up on the installation frame, the both ends of first two-way threaded rod respectively with installation frame both sides lateral wall coupling, the tip and the transmission of first two-way threaded rod are connected, two vertical settings are at the both ends of first two-way threaded rod respectively for two first loading boards, first two-way threaded rod and first loading board threaded connection, first loading board passes through gag lever post sliding connection with the installation frame, the length direction of gag lever post is unanimous with the length direction of first two-way threaded rod.
Preferably, the second displacement driving component comprises a second manual adjusting device and a second bidirectional threaded rod, the second manual adjusting device is installed in the first avoidance groove, the second bidirectional threaded rod is horizontally arranged on the installation frame, the length direction of the second bidirectional threaded rod is perpendicular to that of the first bidirectional threaded rod, two ends of the second bidirectional threaded rod are respectively in shaft connection with side walls on two sides of the installation frame, the end portion of the second bidirectional threaded rod is in transmission connection with the second bidirectional threaded rod, the two second bearing plates are respectively vertically arranged at two ends of the second bidirectional threaded rod, the second bidirectional threaded rod is in threaded connection with the second bearing plate, and the second bearing plate is in sliding connection with the first bearing plate.
Preferably, a sliding limiting guide rail for the second bearing plate to slide is further arranged on the side wall of one side, close to each other, of the two first bearing plates, the length direction of the sliding limiting guide rail is consistent with that of the first bearing plates, and a sliding groove in sliding fit with the sliding limiting guide rail is arranged in the second bearing plate.
Preferably, the top ends of the first bearing plate and the second bearing plate are fixedly provided with first anti-skid rubber pads for bearing the circuit board.
Preferably, the clamping assembly comprises a hinge frame, a clamping abutting plate and a transmission abutting assembly, the hinge frame is arranged on the installation frame, the hinge frame is arranged above the installation frame, one side of the bottom end of the hinge frame is hinged to one side of the top end of the installation frame, the clamping abutting plate is arranged on the hinge frame in a sliding mode, four groups of clamping abutting plates and four groups of transmission abutting assemblies are arranged, and the four groups of clamping abutting plates are in transmission connection with the four groups of transmission abutting assemblies respectively.
Preferably, the clamping abutting plate is a right-angle plate, the output end of the transmission abutting assembly is fixedly connected with one side wall of the outer corner side of the clamping abutting plate, the inner corner side of the clamping abutting plate corresponds to the first bearing plate and the second bearing plate, and the top and the side wall of the circuit board are respectively attached to two side walls of the inner corner side of the clamping abutting plate.
Preferably, the transmission is supported tight subassembly including the connecting plate, the transfer line, elastic component and arc joint board, the vertical setting of connecting plate, the connecting plate is located the centre gripping and is supported tight board directly over, the connecting plate supports tight board fixed connection with the centre gripping, the transfer line level sets up, the one end of transfer line and the lateral wall fixed connection of connecting plate, the other end of transfer line can gliding setting on articulated frame, the elastic component level sets up between connecting plate and articulated frame, the one end of elastic component and the lateral wall fixed connection of connecting plate, the other end of elastic component and the lateral wall fixed connection of articulated frame, the vertical setting of arc joint board, the top and the transfer line fixed connection of arc joint board, the bottom of arc joint board is the arc setting, its radian is unanimous with the outer wall of first double-direction threaded rod or second double-direction threaded rod.
Preferably, still including the joint subassembly, the joint subassembly is including buckle and joint board, and joint board fixed mounting is in the centre gripping and is supported the one side that the hinge end was kept away from to the tight board, still is equipped with the second on the work platform and dodges the groove, has the vertical fixed mounting of elastic buckle and dodges the inslot at the second, buckle and joint board joint.
Compared with the prior art, the beneficial effect of this application is:
1. the continuous conveying mechanism can drive the circuit board mounted on the continuous conveying mechanism to rotate in a ring shape, the circuit board can sequentially pass through the preheating assembly, the constant-temperature assembly, the reflow soldering assembly and the cooling assembly in the rotating process, so that the circuit board can sequentially realize the processes of preheating, heat preservation, welding and cooling, and can be rotated out after being cooled, the traditional conveying device is not required to be reversely moved to carry out loading and unloading operation, the working efficiency is greatly improved, continuous and uninterrupted welding operation can be realized, the utilization rate of welding equipment is improved, the possibility of energy waste is reduced, the energy-saving and environment-friendly effects are achieved, the through mounting port can also ensure the smoothness of airflow of the reflow soldering mechanism during operation, the better clamping effect of the circuit board can be realized under the condition that the function of the reflow soldering mechanism is not influenced, and the accurate clamping function of circuit boards of different types and sizes can also be realized through the positioning and clamping mechanism, the processing range of the equipment is improved, and the practical performance of the equipment is improved.
2. Bearing assembly can bear the weight of the size through operating personnel manual regulation to the function of bearing of the circuit board of adaptation to equidimension not is used for driving first loading board and second loading board respectively through setting up first displacement drive assembly and second displacement drive assembly, can adjust the length and the width that bear respectively when the adjustment, and the permeability of installing port is link up in assurance that can furthest, guarantees the welding effect of circuit board in reflow soldering mechanism.
3. The first anti-skid rubber pad can ensure that the circuit board can be well supported, so that the circuit board has certain buffering capacity when being pressed, the circuit board cannot be damaged, and the first anti-skid rubber pad has certain anti-skid capacity, prevents the circuit board from shifting in motion, and is favorable for improving the installation efficiency and the installation precision of the circuit board.
4. The clamping and tightening plate arranged as the right-angle plate can clamp and limit the top and the side wall of the circuit board, and the circuit board is guaranteed not to deviate in the welding and displacement processes.
5. The clamping assembly can be mounted on the bearing assembly through the transmission abutting assembly, the fixing function of the circuit board is achieved, the circuit board can be prevented from shifting and shaking in the operation process, the position where the circuit board needs to be welded can be avoided, and the influence on welding is avoided while the circuit board is fixed.
6. The clamping component can realize clamping and clamping of the clamping plate on the working platform, so that the position of the hinge frame mounted on the clamping and clamping plate cannot be changed, the function of stable clamping of the circuit board can be realized, and the clamping component has elasticity, so that an operator can manually remove the clamping relation between the clamping plate and the clamping plate, open the clamping and clamping plate and conveniently realize the loading and unloading functions of the circuit board.
Drawings
FIG. 1 is a first schematic perspective view of an embodiment;
FIG. 2 is a schematic perspective view of the second embodiment;
FIG. 3 is a schematic perspective view of the continuous feed mechanism and the positioning and clamping mechanism of the embodiment;
FIG. 4 is a top view of an embodiment of a positioning fixture;
FIG. 5 is a first perspective view of the positioning and clamping mechanism of the embodiment;
FIG. 6 is a schematic perspective view of a positioning and clamping mechanism according to an embodiment;
FIG. 7 is a perspective view of a mounting frame and load bearing assembly of an embodiment;
FIG. 8 is a top view of FIG. 7;
FIG. 9 is a perspective view of a clamping assembly of an embodiment;
fig. 10 is a schematic perspective view of the drive resisting assembly of the embodiment.
The reference numbers in the figures are:
1-a continuous conveying mechanism; 2-positioning the clamping mechanism; 3-reflow soldering mechanism; 1 a-a turntable; 1 b-a working platform; 1b 1-through mounting port; 1b2 — first avoidance slot; 1b 3-second avoidance slot; 2 a-a mounting frame; 2 b-a carrier assembly; 2b1 — first displacement drive assembly; 2b 11-first manual adjustment means; 2b 12-first bidirectional threaded rod; 2b2 — a second displacement drive assembly; 2b 21-second manual adjustment means; 2b 22-a second bidirectional threaded rod; 2b 3-first carrier plate; 2b 31-sliding limit rail; 2b 4-second carrier plate; 2b 41-avoidance notch; 2b 5-first non-slip rubber pad; 2 c-a clamping assembly; 2c 1-hinge frame; 2c 2-clamping and abutting plate; 2c 3-drive resisting component; 2c 31-web; 2c32 — transfer bar; 2c 33-elastic member; 2c 34-arc bayonet plate; 2 d-a clamping assembly; 2d 1-snap; 2d 2-snap plate; 3 a-a pre-heating assembly; 3 b-a thermostatic assembly; 3 c-reflow soldering assembly; 3 d-cooling module.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-4:
a reflow soldering device of a low-loss Schottky rectifier tube comprises a circuit board, a rack, a continuous conveying mechanism 1, a positioning clamping mechanism 2 and a reflow soldering mechanism 3, wherein the continuous conveying mechanism 1, the positioning clamping mechanism 2 and the reflow soldering mechanism 3 are positioned above the rack, the continuous conveying mechanism 1 comprises a turntable 1a and a working platform 1b, the working platform 1b is horizontally and fixedly arranged on the turntable 1a, the working platform 1b is provided with a plurality of through mounting ports 1b1 for mounting the positioning clamping mechanism 2, the through mounting ports 1b1 are annularly distributed around the axis of the working platform 1b, the positioning clamping mechanism 2 is provided with a plurality of groups, the positioning clamping mechanisms 2 are sequentially arranged in the through mounting ports 1b1, the reflow soldering mechanism 3 comprises a preheating component 3a, a constant temperature component 3b, a reflow soldering component 3c and a cooling component 3d, the preheating component 3a, the constant temperature component 3b, the reflow soldering component 3c and the cooling component 3d are annularly distributed along the axis of the working platform 1b, the preheating component 3a, the constant temperature component 3b, the reflow soldering component 3c and the cooling component 3d are sequentially and tightly connected, the output ends of the preheating component 3a, the constant temperature component 3b, the reflow soldering component 3c and the cooling component 3d wrap the outer ring of the working platform 1b at the position where the through mounting opening 1b1 is arranged, the positioning and clamping mechanism 2 comprises an installation frame 2a, a bearing component 2b and a clamping component 2c, the installation frame 2a is fixedly arranged in the through mounting opening 1b1, the bearing component 2b is horizontally arranged on the installation frame 2a, the clamping component 2c is arranged above the bearing component 2b, the circuit board is horizontally arranged between the output end of the bearing component 2b and the output end of the clamping component 2c, one side of the clamping component 2c is hinged with the top end of the bearing component 2 b.
Based on the above embodiment, the continuous conveying mechanism 1 can drive the circuit board mounted thereon to rotate annularly, and in the rotating process, the carried circuit board can sequentially pass through the preheating component 3a, the constant temperature component 3b, the reflow soldering component 3c and the cooling component 3d, so that the circuit board sequentially realizes the processes of preheating, heat preservation, soldering and cooling, and can be rotated out after cooling, the traditional conveying device is not required to move reversely to carry out loading and unloading operations, the working efficiency is greatly improved, continuous and uninterrupted soldering operation can be realized, the utilization rate of soldering equipment is improved, the possibility of energy waste is reduced, the effects of energy saving and environmental protection are achieved, the through mounting port 1b1 can also ensure smooth airflow of the reflow soldering mechanism 3 during operation, and a better clamping effect on the circuit board is achieved without affecting the functions of the reflow soldering mechanism 3, can also realize the accurate grip function to the circuit board of different models and size through location fixture 2, improve the processing scope of this device, improve the practicality of this application.
When the device works, the bearing component 2b is installed in the through installation opening 1b1 by the installation frame 2a, an operator finishes adjusting the clamping position of the bearing component 2b and the clamping component 2c on the positioning and clamping mechanism 2 before the equipment starts to run so as to adapt to the bearing and clamping functions of circuit boards with different sizes and models, after the position adjustment is finished, the circuit board is firstly placed on the bearing component 2b, and then the circuit board is clamped on the bearing component 2b by the clamping component 2c, thereby realizing the installation process of the circuit board, at the moment, the working platform 1b is driven to rotate by the output of the turntable 1a, the working platform 1b drives the circuit board carried in the through installation opening 1b1 to synchronously move, and the circuit board is intermittently brought into the preheating component 3a, the constant temperature component 3b, the reflow soldering component 3c and the cooling component 3d in sequence, after finishing the last cooling operation, the work platform 1b continues to output to drive the circuit board to roll out of the reflow soldering mechanism 3, thereby realizing the blanking process of the circuit board from the reflow soldering mechanism 3, after the blanking is finished, the work platform 1b continues to rotate to bring the circuit board to the front of an operator, the operator opens the bearing component 2b and the clamping component 2c, takes out the circuit board and finishes the welding, and loads the circuit board which is not finished with the welding, closes the bearing component 2b and the clamping component 2c again, and further realizes the loading process of the circuit board.
Further, as shown in fig. 3-6:
the bearing component 2b comprises a first displacement driving component 2b1, a second displacement driving component 2b2, a first bearing plate 2b3 and a second bearing plate 2b4, the first displacement driving component 2b1 and the second displacement driving component 2b2 are horizontally installed on the installation frame 2a, the output directions of the first displacement driving component 2b1 and the second displacement driving component 2b2 are vertically arranged, the first bearing plate 2b3 and the second bearing plate 2b4 are respectively provided with two, the two first bearing plates 2b3 are respectively arranged at two ends of the first displacement driving component 2b1 and are in transmission connection with the output end of the first displacement driving component 2b1, the two second bearing plates 2b4 are respectively arranged at two ends of the second displacement driving component 2b2 and are in transmission connection with the output end of the second displacement driving component 2b2, a first avoiding groove 1b2 for installing the bearing component 2b is further arranged on the working platform 1b, the first avoidance groove 1b2 is provided around the through mounting port 1b1, and the first displacement drive component 2b1 and the second displacement drive component 2b2 are both provided in the first avoidance groove 1b 2.
Based on the above-mentioned embodiment, bearing component 2b can bear the weight of the size through operating personnel manual regulation, thereby the adaptation is to the bearing function of the circuit board of equidimension not, through setting up first displacement drive component 2b1 and second displacement drive component 2b2 and being used for driving first bearing board 2b3 and second bearing board 2b4 respectively, can adjust length and the width that bears respectively when the adjustment, and the permeability that can furthest's assurance link up installing port 1b1, guarantee the welding effect of circuit board in reflow soldering mechanism 3.
When the clamping work starts, the first displacement driving assembly 2b1 is manually adjusted by an operator, the output end of the first displacement driving assembly 2b1 drives the two first bearing plates 2b3 to move oppositely or oppositely, so that the transverse length of the circuit board to be borne is controlled, the second displacement driving assembly 2b2 is manually adjusted by the operator, the output end of the second displacement driving assembly 2b2 drives the two second bearing plates 2b4 to move oppositely or oppositely, so that the longitudinal length of the circuit board to be borne is controlled, and therefore the circuit boards with different sizes can be better borne under the condition that the air permeability of the through mounting hole 1b1 is not influenced.
Further, as shown in fig. 7-8:
the first displacement driving component 2b1 includes a first manual adjusting device 2b11 and a first bidirectional threaded rod 2b12, the first manual adjusting device 2b11 is installed in the first avoidance groove 1b2, the first bidirectional threaded rod 2b12 is horizontally arranged on the installation frame 2a, two ends of the first bidirectional threaded rod 2b12 are respectively coupled with two side walls of the installation frame 2a, an end portion of the first bidirectional threaded rod 2b12 is connected with the first bidirectional threaded rod 2b12 in a transmission manner, the two first bearing plates 2b3 are respectively vertically arranged at two ends of the first bidirectional threaded rod 2b12, the first bidirectional threaded rod 2b12 is in threaded connection with the first bearing plate 2b3, the first bearing plate 2b3 is connected with the installation frame 2a through a limiting rod in a sliding manner, and a length direction of the limiting rod is consistent with a length direction of the first bidirectional threaded rod 2b 12.
Based on the above embodiment, when the first displacement driving assembly 2b1 works, an operator operates the first manual adjusting device 2b11 to drive the first bidirectional threaded rod 2b12 in transmission connection therewith to rotate, the first bidirectional threaded rod 2b12 drives the two first supporting plates 2b3 in threaded connection therewith to move in opposite directions or opposite directions during rotation, and the first supporting plate 2b3 is close to or far away from the first manual adjusting device 2b11 along the length direction, so that the circuit boards with different transverse lengths have better bearing capacity.
Further, as shown in fig. 7-8:
the second displacement driving assembly 2b2 includes a second manual adjusting device 2b21 and a second bidirectional threaded rod 2b22, the second manual adjusting device 2b21 is installed in the first avoidance slot 1b2, the second bidirectional threaded rod 2b22 is horizontally arranged on the installation frame 2a, the length direction of the second bidirectional threaded rod 2b22 is perpendicular to the length direction of the first bidirectional threaded rod 2b12, two ends of the second bidirectional threaded rod 2b22 are respectively coupled with the side walls on two sides of the installation frame 2a, the end of the second bidirectional threaded rod 2b22 is in transmission connection with the second bidirectional threaded rod 2b22, two second bearing plates 2b4 are respectively vertically arranged at two ends of the second bidirectional threaded rod 2b22, the second bidirectional threaded rod 2b22 is in threaded connection with a second bearing plate 2b4, and the second bearing plate 2b4 is in sliding connection with the first bearing plate 2b 3.
Based on the above embodiment, when the second displacement driving component 2b2 works, an operator operates the second manual adjusting device 2b21 to drive the second bidirectional threaded rod 2b22 in transmission connection therewith to rotate, the second bidirectional threaded rod 2b22 drives the two second bearing plates 2b4 in threaded connection therewith to move oppositely or oppositely in the rotating process, and the second bearing plates 2b4 approach or move away along the length direction of the second manual adjusting device 2b21, so that the circuit boards with different longitudinal lengths all have better bearing capacity, and the overall position adjustment work of the bearing component 2b can be realized by combining with the first displacement driving component 2b 1.
Further, as shown in fig. 7-8:
the two first bearing plates 2b3 are further provided with a sliding limit guide rail 2b31 for the second bearing plate 2b4 to slide on the side wall close to each other, the length direction of the sliding limit guide rail 2b31 is consistent with the length direction of the first bearing plate 2b3, and a sliding groove in sliding fit with the sliding limit guide rail 2b31 is arranged in the second bearing plate 2b 4.
When the second loading board 2b4 slides, the sliding limiting guide rail 2b31 plays a role in guiding and limiting the sliding direction of the second loading board 2b4, so that the second loading board 2b4 can move along the length direction of the first loading board 2b3 during sliding movement, and when the position of the first loading board 2b3 is adjusted, the first loading board 2b3 can drive the second loading board 2b4 connected with the first loading board to synchronously perform lateral displacement.
Further, as shown in fig. 7-8:
the top ends of the first loading plate 2b3 and the second loading plate 2b4 are fixedly provided with a first antiskid rubber pad 2b5 for loading circuit boards.
Based on the above embodiment, the first anti-slip rubber pads 2b5 arranged on the first loading plate 2b3 and the second loading plate 2b4 can ensure a better loading effect on the circuit board, so that the circuit board has a certain buffering capacity when being pressed, the circuit board is not damaged, and the circuit board has a certain anti-slip capacity, so that the circuit board is prevented from shifting in motion, and the improvement of the installation efficiency and the installation precision of the circuit board is facilitated.
Further, as shown in fig. 9-10:
the clamping component 2c comprises a hinged frame 2c1, a clamping and tightly-abutting plate 2c2 and a transmission and tightly-abutting component 2c3, the hinged frame 2c1 is arranged on the installation frame 2a, the hinged frame 2c1 is arranged above the installation frame 2a, one side of the bottom end of the hinged frame 2c1 is hinged to one side of the top end of the installation frame 2a, the clamping and tightly-abutting plate 2c2 is arranged on the hinged frame 2c1 in a sliding mode, four groups of the clamping and tightly-abutting plate 2c2 and the transmission and tightly-abutting component 2c3 are arranged, and the four groups of the clamping and tightly-abutting plate 2c2 are respectively in transmission connection with the four groups of the transmission and tightly-abutting components 2c 3.
Based on the above embodiment, when the clamping component 2c works, the operator manually operates the hinge frame 2c1 to rotate around the hinge position with the mounting frame 2a, so that the hinge frame 2c1 drives the clamping and tightening plate 2c2 mounted thereon to rotate synchronously, and the clamping and tightening plate 2c2 is matched with the first bearing plate 2b3 and the second bearing plate 2b4, thereby clamping the circuit board between the clamping and tightening plate 2c2 and the first bearing plate 2b3, and the second bearing plate 2b4, and further completing the clamping operation of the circuit board.
Further, as shown in fig. 9-10:
the clamping abutting plate 2c2 is a right-angle plate, the output end of the transmission abutting assembly 2c3 is fixedly connected with the side wall of one side of the outer corner side of the clamping abutting plate 2c2, the inner corner side of the clamping abutting plate 2c2 corresponds to the first bearing plate 2b3 and the second bearing plate 2b4, and the top and the side wall of the circuit board are respectively attached to the two side walls of the inner corner side of the clamping abutting plate 2c 2.
Based on above-mentioned embodiment, set to the right angle board through propping tight board 2c2 with the centre gripping for the centre gripping is propped tight board 2c2 and is rotated to the position after, and the reentrant corner side inside wall of propping tight board 2c2 through the centre gripping is carried out the centre gripping to the circuit board, and the centre gripping is propped tight board 2c2 and can all carry out centre gripping and spacing to the top and the lateral wall of circuit board, guarantees that the circuit board all does not take place the skew in welding and displacement process.
Further, as shown in fig. 9-10:
the transmission abutting component 2c3 comprises a connecting plate 2c31, a transmission rod 2c32, an elastic piece 2c33 and an arc-shaped clamping plate 2c34, the connecting plate 2c31 is vertically arranged, the connecting plate 2c31 is positioned right above the clamping abutting plate 2c2, the connecting plate 2c31 is fixedly connected with the clamping abutting plate 2c2, the transmission rod 2c32 is horizontally arranged, one end of the transmission rod 2c32 is fixedly connected with the side wall of the connecting plate 2c31, the other end of the transmission rod 2c32 is slidably arranged on the hinge frame 2c1, the elastic piece 2c33 is horizontally arranged between the connecting plate 2c31 and the hinge frame 2c1, one end of the elastic piece 2c33 is fixedly connected with the side wall of the connecting plate 2c31, the other end of the elastic piece 2c33 is fixedly connected with the side wall of the hinge frame 2c1 c, the arc-shaped clamping plate 2c34 is vertically arranged, the top end of the arc-shaped clamping plate 2c34 is fixedly connected with the transmission rod 2c32, and the arc-shaped clamping plate 34 is arranged, the radian of the first and second bidirectional threaded rods 2b12 and 2b22 is consistent with the outer wall of the first and second bidirectional threaded rods.
Based on above-mentioned embodiment, support tight subassembly 2c3 through the transmission and can install clamping component 2c on carrier assembly 2b, realize the fixed function of circuit board, can prevent that the circuit board from taking place the skew and rocking in the operation process to can avoid the circuit board and need the welded position, avoid producing the influence to the welding when fixed circuit board.
When the circuit board fixing device works, an operator pulls the transmission rod 2c32 to drive the arc-shaped clamping plate 2c34 to be pulled out, after the hinge frame 2c1 rotates for a certain angle, the transmission rod 2c32 is released, the transmission rod 2c32 is pushed back under the elastic force of the elastic piece 2c33, the end of the arc-shaped clamping plate 2c34 is abutted to the first bearing plate 2b3 or the second bearing plate 2b4, the clamping and abutting plate 2c2 connected with the connecting plate 2c31 is fixed in position, and then the circuit board is fixed.
Further, as shown in fig. 9-10:
still including joint subassembly 2d, joint subassembly 2d is including buckle 2d1 and joint board 2d2, joint board 2d2 fixed mounting is in the centre gripping and is supported one side that tight board 2c2 kept away from the hinged end, still be equipped with the second on work platform 1b and dodge groove 1b3, have the vertical fixed mounting of elastic buckle 2d1 in groove 1b3 is dodged to the second, buckle 2d1 and joint board 2d2 joint.
Based on above-mentioned embodiment, can realize supporting tight board 2c2 joint with the centre gripping on work platform 1b through joint subassembly 2d, thereby guarantee to install and support the articulated frame 2c1 position on tight board 2c2 at the centre gripping and can not change, and then can realize the function to the stable centre gripping of circuit board, because buckle 2d1 has elasticity, operating personnel can manually relieve buckle 2d1 and joint board 2d 2's joint relation, thereby support tight board 2c2 with the centre gripping and open, so that realize the function of getting on or off goods of circuit board.
The above examples, which are intended to represent only one or more embodiments of the present invention, are described in greater detail and with greater particularity, and are not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A reflow soldering device of a low-loss Schottky rectifier tube comprises a circuit board and is characterized by further comprising a rack, a continuous conveying mechanism (1), a positioning clamping mechanism (2) and a reflow soldering mechanism (3), wherein the continuous conveying mechanism (1) is fixedly arranged on the rack, the reflow soldering mechanism (3) is arranged on the rack, the continuous conveying mechanism (1) comprises a turntable (1a) and a working platform (1b), the working platform (1b) is horizontally and fixedly arranged on the turntable (1a), the working platform (1b) is provided with a plurality of through mounting holes (1b1) for mounting the positioning clamping mechanism (2), the plurality of through mounting holes (1b1) are annularly distributed around the axis of the working platform (1b), the positioning clamping mechanism (2) is provided with a plurality of groups, the plurality of groups of positioning clamping mechanisms (2) are sequentially arranged in the plurality of through mounting holes (1b1), the reflow soldering mechanism (3) comprises a preheating assembly (3a), a constant temperature assembly (3b), a reflow soldering assembly (3c) and a cooling assembly (3d), the preheating assembly (3a), the constant temperature assembly (3b), the reflow soldering assembly (3c) and the cooling assembly (3d) are annularly distributed along the axis of the working platform (1b), the preheating assembly (3a), the constant temperature assembly (3b), the reflow soldering assembly (3c) and the cooling assembly (3d) are sequentially and tightly connected, the output ends of the preheating assembly (3a), the constant temperature assembly (3b), the reflow soldering assembly (3c) and the cooling assembly (3d) wrap the outer ring of the working platform (1b) at the position where the mounting opening (1b1) is arranged in a penetrating manner, the positioning and clamping mechanism (2) comprises a mounting frame (2a), a bearing assembly (2b) and a clamping assembly (2c), the mounting frame (2a) is fixedly mounted in the through mounting opening (1b1), the bearing component (2b) is horizontally arranged on the mounting frame (2a), the clamping component (2c) is arranged above the bearing component (2b), the circuit board is horizontally arranged between the output end of the bearing component (2b) and the output end of the clamping component (2c), and one side of the clamping component (2c) is hinged with the top end of the bearing component (2 b);
the bearing component (2b) comprises a first displacement driving component (2b1), a second displacement driving component (2b2), a first bearing plate (2b3) and a second bearing plate (2b4), the first displacement driving component (2b1) and the second displacement driving component (2b2) are horizontally arranged on the mounting frame (2a), the output directions of the first displacement driving component (2b1) and the second displacement driving component (2b2) are vertically arranged, the first bearing plate (2b3) and the second bearing plate (2b4) are respectively provided with two first bearing plates (2b3) which are respectively arranged at two ends of the first displacement driving component (2b1) and are in transmission connection with the output end of the first displacement driving component (2b1), the two second bearing plates (2b4) are respectively arranged at two ends of the second displacement driving component (2b2) and are in transmission connection with the output end 2) of the second displacement driving component (2b2), still be equipped with on work platform (1b) and be used for installing first groove of dodging (1b2) of bearing component (2b), first groove of dodging (1b2) sets up around having a perfect understanding installation mouth (1b1), and first displacement drive assembly (2b1) and second displacement drive assembly (2b2) all set up in first groove of dodging (1b 2).
2. The reflow soldering apparatus of a low-loss schottky rectifying tube of claim 1, wherein the first displacement driving assembly (2b1) comprises a first manual adjusting device (2b11) and a first bidirectional threaded rod (2b12), the first manual adjusting device (2b11) is installed in the first evasion groove (1b2), the first bidirectional threaded rod (2b12) is horizontally arranged on the installation frame (2a), two ends of the first bidirectional threaded rod (2b12) are respectively coupled with two side walls of the installation frame (2a), an end of the first bidirectional threaded rod (2b12) is in transmission connection with the first bidirectional threaded rod (2b12), two first bearing plates (2b3) are respectively vertically arranged at two ends of the first bidirectional threaded rod (2b12), the first bidirectional 12 is in threaded connection with the first bearing plate (2b3), the first threaded rod (2b3) is in sliding connection with the installation frame (2a) through a limiting rod, the length direction of the limiting rod is consistent with the length direction of the first bidirectional threaded rod (2b 12).
3. The reflow soldering apparatus of a low-loss schottky rectifying tube of claim 2, wherein the second displacement driving assembly (2b2) comprises a second manual adjusting device (2b21) and a second bidirectional threaded rod (2b22), the second manual adjusting device (2b21) is installed in the first evasion slot (1b2), the second bidirectional threaded rod (2b22) is horizontally arranged on the installation frame (2a), the length direction of the second bidirectional threaded rod (2b22) is perpendicular to the length direction of the first bidirectional threaded rod (2b12), two ends of the second bidirectional threaded rod (2b22) are respectively coupled with the side walls on two sides of the installation frame (2a), the end of the second bidirectional threaded rod (2b22) is in transmission connection with the second bidirectional threaded rod (2b22), two second bearing plates (2b4) are respectively vertically arranged on two ends of the second bidirectional threaded rod (2b22), the second bidirectional threaded rod (2b22) is in threaded connection with the second bearing plate (2b4), and the second bearing plate (2b4) is in sliding connection with the first bearing plate (2b 3).
4. The reflow soldering apparatus of a low-loss schottky rectifying tube as claimed in claim 3, wherein the side walls of the two first bearing plates (2b3) close to each other are further provided with a sliding limit guide rail (2b31) for the second bearing plate (2b4) to slide, the length direction of the sliding limit guide rail (2b31) is consistent with the length direction of the first bearing plate (2b3), and the second bearing plate (2b4) is provided with a sliding groove in sliding fit with the sliding limit guide rail (2b 31).
5. The reflow soldering apparatus of a low-loss Schottky rectifier tube as claimed in claim 4, wherein the first non-slip rubber pad (2b5) for carrying the circuit board is fixedly mounted on the top end of the first carrying plate (2b3) and the second carrying plate (2b 4).
6. The reflow soldering device of the low-loss Schottky rectifier tube according to claim 3, wherein the clamping component (2c) comprises a hinged frame (2c1), a clamping abutting plate (2c2) and a transmission abutting component (2c3), the hinged frame (2c1) is arranged on the installation frame (2a), the hinged frame (2c1) is arranged above the installation frame (2a), one side of the bottom end of the hinged frame (2c1) is hinged to one side of the top end of the installation frame (2a), the clamping abutting plate (2c2) is arranged on the hinged frame (2c1) in a sliding manner, four groups of the clamping abutting plate (2c2) and the transmission abutting component (2c3) are arranged, and the four groups of the clamping abutting plate (2c2) are respectively in transmission connection with the four groups of the transmission abutting component (2c 3).
7. The reflow soldering device of a low-loss Schottky rectifier tube as claimed in claim 6, wherein the clamping and abutting plate (2c2) is a right-angle plate, the output end of the transmission abutting assembly (2c3) is fixedly connected with one side wall of the male corner side of the clamping and abutting plate (2c2), the female corner side of the clamping and abutting plate (2c2) corresponds to the first bearing plate (2b3) and the second bearing plate (2b4), and the top and the side walls of the circuit board are respectively attached to the two side walls of the female corner side of the clamping and abutting plate (2c 2).
8. The reflow soldering device of the low-loss Schottky rectifier tube according to claim 6, wherein the transmission abutting assembly (2c3) comprises a connecting plate (2c31), a transmission rod (2c32), an elastic member (2c33) and an arc-shaped clamping plate (2c34), the connecting plate (2c31) is vertically arranged, the connecting plate (2c31) is positioned right above the clamping abutting plate (2c2), the connecting plate (2c31) is fixedly connected with the clamping abutting plate (2c2), the transmission rod (2c32) is horizontally arranged, one end of the transmission rod (2c32) is fixedly connected with the side wall of the connecting plate (2c31), the other end of the transmission rod (2c32) is slidably arranged on the hinge bracket (2c1), the elastic member (2c33) is horizontally arranged between the connecting plate (2c31) and the hinge bracket (2c1), and one end of the elastic member (2c33) is fixedly connected with the side wall 31 of the connecting plate (2c31), the other end of elastic component (2c33) and the lateral wall fixed connection of articulated frame (2c1), arc joint board (2c34) vertical setting, the top and transfer line (2c32) fixed connection of arc joint board (2c34), the bottom of arc joint board (2c34) is the arc setting, its radian is unanimous with the outer wall of first bidirectional threaded rod (2b12) or second bidirectional threaded rod (2b 22).
9. The reflow soldering device of low-loss Schottky rectifier tube according to claim 6, characterized in that, further comprising a clamping component (2d), wherein the clamping component (2d) comprises a buckle (2d1) and a clamping plate (2d2), the clamping plate (2d2) is fixedly mounted on one side of the clamping plate (2c2) far away from the hinged end, the working platform (1b) is further provided with a second avoiding groove (1b3), the elastic buckle (2d1) is vertically and fixedly mounted in the second avoiding groove (1b3), and the buckle (2d1) is clamped with the clamping plate (2d 2).
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| CN202111229156.3A CN114029577B (en) | 2021-10-21 | 2021-10-21 | Reflow soldering device of low-loss Schottky rectifier tube |
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| CN202111229156.3A CN114029577B (en) | 2021-10-21 | 2021-10-21 | Reflow soldering device of low-loss Schottky rectifier tube |
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| US6827789B2 (en) * | 2002-07-01 | 2004-12-07 | Semigear, Inc. | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
| TWI552824B (en) * | 2011-10-18 | 2016-10-11 | 千住金屬工業股份有限公司 | Method and apparatus for forming solder bump |
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| JPH09246710A (en) * | 1996-03-04 | 1997-09-19 | Sony Corp | Surface mounting soldering method and device thereof |
| JP2004111667A (en) * | 2002-09-19 | 2004-04-08 | Minami Kk | Reflow apparatus |
| JP2004106029A (en) * | 2002-09-19 | 2004-04-08 | Tamura Seisakusho Co Ltd | Soldering device |
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