CN113876312B - Sign detection module and manufacturing method thereof - Google Patents
Sign detection module and manufacturing method thereof Download PDFInfo
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- CN113876312B CN113876312B CN202111087053.8A CN202111087053A CN113876312B CN 113876312 B CN113876312 B CN 113876312B CN 202111087053 A CN202111087053 A CN 202111087053A CN 113876312 B CN113876312 B CN 113876312B
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- 238000001514 detection method Methods 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229920003023 plastic Polymers 0.000 claims abstract description 90
- 238000005192 partition Methods 0.000 claims abstract description 88
- 239000004033 plastic Substances 0.000 claims abstract description 88
- 238000012545 processing Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims description 54
- 230000010365 information processing Effects 0.000 claims description 49
- 238000002955 isolation Methods 0.000 claims description 46
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000012530 fluid Substances 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 17
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 10
- 239000007787 solid Substances 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000008280 blood Substances 0.000 description 4
- 210000004369 blood Anatomy 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
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- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/024—Detecting, measuring or recording pulse rate or heart rate
- A61B5/02444—Details of sensor
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
- A61B2560/0406—Constructional details of apparatus specially shaped apparatus housings
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/18—Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/18—Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
- A61B2562/182—Electrical shielding, e.g. using a Faraday cage
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/18—Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
- A61B2562/185—Optical shielding, e.g. baffles
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cardiology (AREA)
- Biomedical Technology (AREA)
- Medical Informatics (AREA)
- Biophysics (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Physiology (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The application provides a physical sign detection module and a manufacturing method of the physical sign detection module, wherein the physical sign detection module comprises a circuit board; the first detection assembly comprises a first light-emitting assembly, a first light processing assembly and a first partition wall, the first light-emitting assembly and the first light processing assembly are respectively and electrically connected with the circuit board, and the first light-emitting assembly and the first light processing assembly are respectively arranged on two sides of the first partition wall; the plastic package part is made of light-transmitting materials and is arranged on the circuit board and is coated with the first detection component. According to the plastic package part with the solid structure, the first partition wall is arranged in the plastic package part with the solid structure, so that the fixing strength of the first partition wall is increased, the first partition wall is prevented from generating welding point crack extension and fatigue failure easily when being impacted, the optical signal crosstalk can be effectively avoided, and the reliability of the physical sign detection module is enhanced.
Description
Technical Field
The application belongs to the technical field of sign monitoring, and particularly relates to a sign detection module and a manufacturing method of the sign detection module.
Background
In the existing heart rate module electronic system, signal interference exists between different devices, and then a metal shielding cover is required to be used for signal shielding and avoiding optical signal crosstalk, for example, the devices required to be shielded are arranged in a space formed by the shielding cover and the circuit board. However, in the case of dropping or receiving a large impact, the module provided with the shielding case may generate crack propagation and fatigue failure of the welding spots, resulting in reduced reliability of the shielding case. The shielding mode of the shielding cover occupies a large amount of space, which is unfavorable for the miniaturization development of the whole module. Meanwhile, with the gradual application and popularization of equipment with smaller size, the demands for miniaturization and functional diversification of devices are increasing, so that high-density integration of functional devices is required to be realized in a limited space, and the shielding cover occupies a large amount of space, which is not beneficial to realizing high-density integration of functional devices in the limited space by a module.
Disclosure of Invention
The utility model aims at providing a sign detection module and manufacturing method of sign detection module, solve the problem that current sign detection module shielding reliability is low.
In a first aspect, the present application provides a sign detection module, comprising:
a circuit board;
the first detection assembly comprises a first light-emitting assembly, a first light processing assembly and a first partition wall, wherein the first light-emitting assembly and the first light processing assembly are respectively and electrically connected with the circuit board, and the first light-emitting assembly and the first light processing assembly are respectively arranged on two sides of the first partition wall;
the plastic package part is made of light-transmitting materials and is arranged on the circuit board and is used for coating the first detection assembly.
Optionally, the sign detection module further includes a first connection portion, the plastic package portion covers the first connection portion, the first light processing component includes a first photoelectric conversion chip and a first information processing chip, the first photoelectric conversion chip is located in the plastic package portion and far away from a portion of the circuit board, and the first photoelectric conversion chip is electrically connected with the circuit board through the first connection portion.
Optionally, the first information processing chip is located between the first photoelectric conversion chip and the circuit board, and the first information processing chip is located on the circuit board and is directly electrically connected with the circuit board.
Optionally, the first connection portion is vertically disposed opposite to the circuit board, one side of the first connection portion is electrically connected to the circuit board, and the other side of the first connection portion is electrically connected to one side of the first photoelectric conversion chip facing the circuit board.
Optionally, the sign detection module further includes a second detection component and a third partition wall, the plastic package portion wraps the second detection component and the third partition wall, and the first detection component and the second detection component are respectively arranged on two sides of the third partition wall.
Optionally, the second detection component includes a second light-emitting component, the first light-emitting component and the color of light emitted by the second light-emitting component are different, the first light-emitting component is disposed in the plastic package portion near an edge of the first side of the sign detection module, the sign detection module has a second side opposite to the first side, and the second light-emitting component is disposed in the plastic package portion near an edge of the second side of the sign detection module.
Optionally, the materials of the first partition wall and the third partition wall comprise cured silver paste, and the first partition wall and the third partition wall are communicated with the reference ground of the circuit board.
Optionally, the circuit board is a rigid-flex board.
In a second aspect, the present application provides a method for manufacturing a sign detection module, the method comprising:
mounting a first light-emitting component and a first information processing chip on a circuit board, coating the first light-emitting component and the first information processing chip with plastic packaging glue, and solidifying the plastic packaging glue to form a first plastic packaging piece;
a first isolation groove and a first connecting groove are formed in the first plastic package piece, the first isolation groove is formed between the first light-emitting component and the first information processing chip, the first connecting groove is formed close to the first information processing chip, metal fluid is filled in the first isolation groove and the first connecting groove, the metal fluid is solidified, a primary isolation piece located in the first isolation groove and a first connecting part located in the first connecting groove are formed, and the first connecting part is electrically connected with the circuit board;
a first photoelectric conversion chip is arranged on the first plastic package part, the first photoelectric conversion chip is electrically connected with the first connecting part, the first photoelectric conversion chip is covered by plastic package glue, and the plastic package glue is solidified to form a second plastic package part;
and a second isolation groove is formed in the second plastic package part, metal fluid is filled in the second isolation groove and is solidified to form a secondary isolation part, and the secondary isolation part is connected with the primary isolation part, wherein the first plastic package part and the second plastic package part are made of light-transmitting materials.
Optionally, the sign detection module is further provided with a second light emitting component, a second information processing chip and a second photoelectric conversion chip, and the setting methods of the second light emitting component, the second information processing chip and the second photoelectric conversion chip are respectively the same as those of the first light emitting component, the first information processing chip and the first photoelectric conversion chip;
a third separation groove is formed in the first plastic package piece, metal fluid is filled in the third separation groove, and the metal fluid is solidified to form a third separation piece;
a fourth isolation groove is formed in the second plastic package piece, metal fluid is filled in the fourth isolation groove, and the metal fluid is solidified to form a four-time isolation piece; the third partition piece and the fourth partition piece are connected to form a third partition wall;
the first light-emitting component, the first information processing chip and the first photoelectric conversion chip are located on one side of the third partition wall, and the second light-emitting component, the second information processing chip and the second photoelectric conversion chip are located on the other side of the third partition wall.
The technical effect of the application lies in that the first partition wall is arranged in the plastic package part of the solid structure, and because the first partition wall is positioned in the plastic package part of the solid structure, the fixing strength of the first partition wall is increased, and the first partition wall is prevented from generating welding point crack expansion and fatigue failure easily when impacted, so that the optical signal crosstalk can be effectively avoided, and the reliability of the physical sign detection module is enhanced.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a schematic diagram of the overall structure of a sign detection module provided in the present application;
FIG. 2 is a schematic diagram of a component and a first molding on a circuit board;
FIG. 3 is a schematic illustration of a slot in a first molding compound;
FIG. 4 is a schematic view of the placement of partition walls and connections within the slots of the first molding compound;
FIG. 5 is a schematic diagram of a component disposed on a first molding compound;
FIG. 6 is a schematic view of a second molding member disposed over a first molding member;
fig. 7 is a schematic illustration of a slot in a second plastic package.
Reference numerals:
1. a circuit board; 2. a first light emitting component; 3. a first light processing assembly; 31. a first photoelectric conversion chip; 32. a first information processing chip; 4. a first partition wall; 5. a plastic package part; 6. a first connection portion; 7. a third partition wall; 8. a first plastic package; 9. a first isolation groove; 10. a first connection groove; 11. a primary partition member; 12. a second plastic package; 13. a second isolation groove; 14. a secondary partition member; 15. a second light emitting component; 16. a second information processing chip; 17. a second photoelectric conversion chip; 18. a third isolation groove; 19. a third partition; 20. a fourth isolation groove; 21. four partitions.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In a first aspect, as shown in fig. 1, the present application provides a sign detection module, including a circuit board 1, a first detection component and a plastic package portion 5. The circuit board 1 can be a PCB board, has the wiring that is used for electric connection in it, can be convenient for the electric connection of components and parts in this application, can avoid setting up exposed wire, saves external space, also makes components and parts be convenient for connect and dismantle.
The first detection component is used for detecting physical sign parameters of a tested user, such as parameters of blood oxygen, heart rate and the like of the tested user. The first detection component comprises a first light-emitting component 2, a first light-processing component 3 and a first partition wall 4, the first light-emitting component 2 and the first light-processing component 3 are respectively and electrically connected with the circuit board 1, the first light-emitting component 2 and the first light-processing component 3 are respectively arranged on two sides of the first partition wall 4, that is, the light emitted by the first light-emitting component 2 positioned on one side of the first partition wall 4 in the application can irradiate on human tissues, the light emitted by the first light-emitting component 2 is reflected by the human tissues to the first light-processing component 3, and the first light-processing component 3 can process the light reflected by the human tissues to form information which can be used for analysis, so that the effect of measuring parameters such as blood oxygen or heart rate and the like is achieved. The first partition wall 4 is used for preventing crosstalk of optical signals, for example, the first partition wall 4 can prevent light emitted by the first light emitting component 2 from directly irradiating the first light processing component 3 without being reflected by human tissues.
Wherein, first partition wall 4 can run through for running through plastic envelope portion 5 sets up, make the three side of first partition wall 4 all with the surface parallel and level of plastic envelope portion 5, and then further shielding the interference signal between the part of first partition wall 4 both sides, prevent effectively that the signal of the part of first partition wall 4 one side from interfering to the part of first partition wall 4 opposite side, guaranteed this application product and can normally work, simultaneously, for traditional shield cover, this application can strengthen the scope of optical signal transmission, guarantees that sufficient optical signal can be reflected to first optical processing assembly 3 by human tissue, has strengthened testing result's reliability and accuracy. For example, the first partition wall 4 can block the light signal emitted by the first light emitting component 2 from directly transmitting to the first light processing component 3 at the other side of the first partition wall 4; the first partition wall 4 may also be a structure perpendicular to the circuit board 1 and surrounding the periphery of the component to be shielded, and in this case, the cross-sectional shape of the first partition wall 4 along the direction parallel to the circuit board 1 may be a closed shape such as a rectangle or a circle. Further, the material of the first partition wall 4 may be a material capable of shielding electromagnetic signals, so that the components on two sides of the first partition wall 4 may be shielded from each other, that is, the electromagnetic signals sent by the components on one side of the first partition wall 4 are blocked by the first partition wall 4 so as not to be transmitted to the components on the other side of the first partition wall 4.
Alternatively, the first light emitting component 2 may include an LED chip capable of emitting light, where the light emitted by the LED chip may be red light, green light or infrared, the heart rate parameter is detected by the green light, the blood oxygen parameter is detected by the red light and the infrared, and the like.
The plastic package portion 5 is made of a light-transmitting material, and the plastic package portion 5 can be made of a transparent material obtained by curing a thermosetting transparent plastic package, so that light emitted by the first light-emitting component 2 is transmitted in the plastic package portion 5. The plastic package part 5 is arranged on the circuit board 1, the first detection component is covered by the plastic package part 5, the plastic package part 5 can be of a hexahedral structure, the plastic package part 5 is in seamless fixed connection with the circuit board 1, and the first detection component is integrally packaged in the plastic package part 5.
The first partition wall 4 is arranged in the plastic package part 5 of the solid structure, and the first partition wall 4 is positioned in the plastic package part 5 of the solid structure, so that the fixing strength of the first partition wall 4 is increased, the first partition wall 4 is prevented from generating welding point crack expansion and fatigue failure easily when impacted, the optical signal crosstalk can be effectively avoided, and the reliability of the physical sign detection module is enhanced.
Optionally, the sign detection module further includes a first connection portion 6, the first connection portion 6 is a conductive component, the plastic package portion 5 wraps the first connection portion 6, the first optical processing component 3 includes a first photoelectric conversion chip 31 and a first information processing chip 32, the first photoelectric conversion chip 31 may include a light emitting diode, and may convert a received optical signal into an electrical signal, and the first information processing chip 32 may process the electrical signal converted by the photodiode, so as to form a sign parameter signal that may be used for analysis. The first photoelectric conversion chip 31 is located at a portion, far away from the circuit board 1, in the plastic package portion 5, so that the first photoelectric conversion chip 31 is closer to human tissue, and further, the distance from light reflected by the human tissue to the first photoelectric conversion chip 31 is closer, so that the light quality received by the first photoelectric conversion chip 31 is better, more real and accurate physical parameter information can be obtained, the first photoelectric conversion chip 31 is electrically connected with the circuit board 1 through the first connection portion 6, and normal operation of the first photoelectric conversion chip 31 is ensured through the first connection portion 6.
Further, the number of the first connection portions 6 may be plural, and the plural first connection portions 6 are respectively connected to different paths of the circuit board 1 and the first photoelectric conversion signal, so as to ensure the reliability of the operation of the photoelectric conversion chip.
Optionally, the first information processing chip 32 is located between the first photoelectric conversion chip 31 and the circuit board 1, and the first information processing chip 32 is located on the circuit board 1 and is directly electrically connected to the circuit board 1, that is, the first information processing chip 32 and the first photoelectric conversion chip 31 are stacked at intervals in a vertical direction, so that the first photoelectric conversion chip 31 is closer to human tissue, and meanwhile, the occupied space of the first information processing chip 32 on the circuit board 1 can be reduced as much as possible, so that the three-dimensional stacked layout can be formed, and the overall size of the application is reduced.
Optionally, the first connection portion 6 is vertically disposed relative to the circuit board 1, one side of the first connection portion 6 is electrically connected with the circuit board 1, the other side of the first connection portion 6 is electrically connected with the first photoelectric conversion chip 31 towards one side of the circuit board 1, and compared with the connection of the first photoelectric conversion chip 31 and the circuit board 1 by adopting a traditional wire bonding manner, the problem that a transmission path is long due to bending of a wire is avoided by the first connection portion 6 adopted in the application, signal transmission is realized by a shortest path, and reliability of signal transmission is guaranteed.
Optionally, the sign detection module further includes a second detection component and a third partition wall 7, the plastic package portion 5 is wrapped by the second detection component and the third partition wall 7, the first detection component and the second detection component are respectively arranged at two sides of the third partition wall 7, the first detection module and the second detection module can be modules for detecting the same sign parameters, the first detection module and the second detection module are arranged together to be capable of simultaneously detecting two values of the same parameters, and the first detection module and the second detection module can be mutually referred to and compared to ensure the reliability of detection results. Meanwhile, the arrangement of the third partition wall 7 can avoid the mutual influence of the first detection module and the second detection module.
The second detection module may include a second light emitting component 15, a second light processing component and a second partition wall, where the second light emitting component 15 and the second light processing component are electrically connected with the circuit board 1 respectively, and the second light emitting component 15 and the second light processing component are disposed on two sides of the second partition wall respectively. The same plastic package part 5 covers the first detection module and the second detection module. Be provided with between first detection module and the second detection module the third partition wall 7, the signal transmission that the third partition wall 7 can separate first detection module and send to the second detection module in, influences the normal work of second module. Corresponding first light processing components 3 and second light processing components are respectively arranged for the first light emitting component 2 and the second light emitting component 15, so that the signal processing function is enhanced.
Optionally, the second detecting component includes a second light emitting component 15, the colors of the light emitted by the first light emitting component 2 and the light emitted by the second light emitting component 15 are different, that is, the sign parameters detected by the first detecting module and the second detecting module are different, for example, the light emitted by the first light emitting component 2 in the first detecting module is red light, the detected is a sign parameter such as blood oxygen, the emitted light by the second detecting module is green light, and the detected is a sign parameter such as heart rate. The first light-emitting component 2 is arranged in the plastic package part 5 near the edge of the first side of the sign detection module, the sign detection module is provided with a second side opposite to the first side, the second light-emitting component 15 is arranged in the plastic package part 5 near the edge of the second side of the sign detection module, namely, the distance between the first light-emitting component 2 and the second light-emitting component 15 is relatively far, so that the interference between the first light-emitting component 2 and the second light-emitting component 15 can be avoided as far as possible, and the authenticity and the accuracy of the detected sign parameters are ensured.
Optionally, the materials of the first partition wall 4 and the third partition wall 7 include cured silver paste, and the first partition wall 4 and the third partition wall 7 are communicated with the reference ground of the circuit board 1, so that mutual interference of components on two sides of the partition wall, especially mutual electromagnetic signal interference of components on two sides of the partition wall, can be effectively isolated, and effective electromagnetic shielding is realized.
Optionally, the circuit board 1 is a flexible-rigid board, and the flexible-rigid board is formed by pressing between the FPC circuit board 1 and the PCB circuit board 1, for example, a layer of FPC circuit board 1 is sandwiched between the PCB circuit boards 1 distributed on two sides of the FPC circuit board 1, and then pressing is performed to form the flexible-rigid board. The rigid-flex board is more flexible for traditional PCB circuit board 1, receives great impact under the condition such as rigid-flex board drops, and is difficult cracked, has strengthened the sign monitoring module of this application and has resisted the ability of great impact.
In a second aspect, the present application provides a method for manufacturing a sign detection module, as shown in fig. 2-7, the method includes:
the first light emitting component 2 and the first information processing chip 32 are mounted on the circuit board 1, the first light emitting component 2 and the first information processing chip 32 are coated by plastic packaging glue, the plastic packaging glue is solidified to form a first plastic package 8, the first light emitting component 2 and the first information processing chip 32 are coated by plastic packaging glue, the flowing plastic packaging glue flows onto the circuit board 1, the plastic packaging glue gradually penetrates through the first light emitting component 2 and the first information processing chip 32 along with the increase of the volume of the plastic packaging glue flowing onto the circuit board 1 until the plastic packaging glue completely penetrates through the first light emitting component 2 and the first information processing chip 32, the plastic packaging glue is thermosetting transparent plastic packaging material, and the flowing plastic packaging glue is heated to form the solid transparent first plastic package 8.
The first plastic package 8 is provided with a first isolation groove 9 and a first connecting groove 10, the first isolation groove 9 is formed between the first light-emitting component 2 and the first information processing chip 32, the first connecting groove 10 is close to the first information processing chip 32, and the first plastic package 8 is provided with a laser groove, so that the circuit board 1 is exposed out of a bonding pad, and the circuit board 1 and components are electrically connected conveniently. The first isolation groove 9 and the first connection groove 10 are filled with metal fluid and the metal fluid is solidified, such as silver paste, to form a primary isolation member 11 positioned in the first isolation groove 9 and a first connection portion 6 positioned in the first connection groove 10, and the first connection portion 6 is electrically connected with the circuit board 1.
A first photoelectric conversion chip 31 is disposed on the first plastic package 8, the first photoelectric conversion chip 31 is electrically connected to the first connection portion 6, the first photoelectric conversion chip 31 is covered with a plastic molding compound, and the plastic molding compound is solidified to form a second plastic package 12. The process of encapsulating the first photoelectric conversion chip 31 with the plastic encapsulant is the same as that of encapsulating the first light emitting component 2 and the first information processing chip 32 with the plastic encapsulant, and will not be described herein again.
A second isolation groove 13 is formed in the second plastic package 12, metal fluid is filled in the second isolation groove 13 and is solidified to form a secondary isolation member 14, the secondary isolation member 14 is connected with the primary isolation member 11, and the first plastic package 8 and the second plastic package 12 are made of light-transmitting materials.
Optionally, the sign detection module further mounts a second light emitting component 15, a second information processing chip 16 and a second photoelectric conversion chip 17, where the setting methods of the second light emitting component 15, the second information processing chip 16 and the second photoelectric conversion chip 17 are the same as the first light emitting component 2, the first information processing chip 32 and the first photoelectric conversion chip 31, respectively.
A third isolation groove 18 is formed in the first plastic package 8, metal fluid is filled in the third isolation groove 18 and solidified to form a third isolation piece 19, a fourth isolation groove 20 is formed in the second plastic package 12, and metal fluid is filled in the fourth isolation groove 20 and solidified to form a fourth isolation piece 21; the third partition member 19 and the fourth partition member 21 are connected to form a third partition wall 7.
The first light emitting module 2, the first information processing chip 32 and the first photoelectric conversion chip 31 are located on one side of the third partition wall 7, and the second light emitting module 15, the second information processing chip 16 and the second photoelectric conversion chip 17 are located on the other side of the third partition wall 7.
Although specific embodiments of the present application have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.
Claims (9)
1. A sign detection module, comprising:
a circuit board;
the first detection assembly comprises a first light-emitting assembly, a first light processing assembly and a first partition wall, wherein the first light-emitting assembly and the first light processing assembly are respectively and electrically connected with the circuit board, and the first light-emitting assembly and the first light processing assembly are respectively arranged on two sides of the first partition wall;
the plastic packaging part is made of light-transmitting materials, is arranged on the circuit board and coats the first detection assembly;
the physical sign detection module further comprises a first connecting part, the first connecting part is covered by the plastic package part, the first light processing assembly comprises a first photoelectric conversion chip and a first information processing chip, the first photoelectric conversion chip is positioned at a part, far away from the circuit board, in the plastic package part, and the first photoelectric conversion chip is electrically connected with the circuit board through the first connecting part;
the first information processing chip and the first photoelectric conversion chip are stacked at intervals in the vertical direction;
the material of the first partition wall comprises solidified silver paste;
the material of the first connecting part comprises solidified silver paste;
the first connection portion is close to the first information processing chip.
2. The physical sign detection module of claim 1, wherein the first information processing chip is located between the first photoelectric conversion chip and the circuit board, and the first information processing chip is located on the circuit board and is directly electrically connected to the circuit board.
3. The physical sign detection module according to claim 1, wherein the first connection portion is vertically disposed with respect to the circuit board, one side of the first connection portion is electrically connected to the circuit board, and the other side of the first connection portion is electrically connected to a side of the first photoelectric conversion chip facing the circuit board.
4. The sign detection module of claim 1 further comprising a second detection assembly and a third partition wall, wherein the second detection assembly and the third partition wall are covered by the plastic package, and the first detection assembly and the second detection assembly are disposed on two sides of the third partition wall, respectively.
5. The sign detection module of claim 4, wherein the second detection assembly comprises a second light emitting assembly, wherein the colors of the light emitted by the first light emitting assembly and the second light emitting assembly are different, the first light emitting assembly is disposed within the plastic package adjacent to an edge of the first side of the sign detection module, the sign detection module has a second side opposite the first side, and the second light emitting assembly is disposed within the plastic package adjacent to an edge of the second side of the sign detection module.
6. The physical sign detection module of claim 4, wherein the material of the third partition wall comprises cured silver paste, and the first partition wall and the third partition wall are in communication with a reference ground of the circuit board.
7. The physical sign detection module of claim 1, wherein the circuit board is a rigid-flex board.
8. A method of manufacturing a sign detection module, the method comprising:
mounting a first light-emitting component and a first information processing chip on a circuit board, coating the first light-emitting component and the first information processing chip with plastic packaging glue, and solidifying the plastic packaging glue to form a first plastic packaging piece;
a first isolation groove and a first connecting groove are formed in the first plastic package piece, the first isolation groove is formed between the first light-emitting component and the first information processing chip, the first connecting groove is formed close to the first information processing chip, metal fluid is filled in the first isolation groove and the first connecting groove, the metal fluid is solidified, a primary isolation piece located in the first isolation groove and a first connecting part located in the first connecting groove are formed, and the first connecting part is electrically connected with the circuit board;
a first photoelectric conversion chip is arranged on the first plastic package part, the first photoelectric conversion chip is electrically connected with the first connecting part, the first photoelectric conversion chip is covered by plastic package glue, and the plastic package glue is solidified to form a second plastic package part;
the first information processing chip and the first photoelectric conversion chip are stacked at intervals in the vertical direction;
a second isolation groove is formed in the second plastic package part, metal fluid is filled in the second isolation groove, the metal fluid is solidified to form a secondary isolation part, the secondary isolation part is connected with the primary isolation part, and the first plastic package part and the second plastic package part are made of light-transmitting materials;
the primary partition member and the first connecting portion are solidified by metal fluid;
the first connecting part is close to the first information processing chip relative to the primary partition piece.
9. The method according to claim 8, wherein the sign detection module is further provided with a second light emitting component, a second information processing chip, and a second photoelectric conversion chip, and the second light emitting component, the second information processing chip, and the second photoelectric conversion chip are arranged in the same manner as the first light emitting component, the first information processing chip, and the first photoelectric conversion chip, respectively;
a third separation groove is formed in the first plastic package piece, metal fluid is filled in the third separation groove, and the metal fluid is solidified to form a third separation piece;
a fourth isolation groove is formed in the second plastic package piece, metal fluid is filled in the fourth isolation groove, and the metal fluid is solidified to form a four-time isolation piece; the third partition piece and the fourth partition piece are connected to form a third partition wall;
the first light-emitting component, the first information processing chip and the first photoelectric conversion chip are located on one side of the third partition wall, and the second light-emitting component, the second information processing chip and the second photoelectric conversion chip are located on the other side of the third partition wall.
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