CN113646884A - Heat sink and electronic component package - Google Patents
Heat sink and electronic component package Download PDFInfo
- Publication number
- CN113646884A CN113646884A CN202080024146.3A CN202080024146A CN113646884A CN 113646884 A CN113646884 A CN 113646884A CN 202080024146 A CN202080024146 A CN 202080024146A CN 113646884 A CN113646884 A CN 113646884A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- heat
- top wall
- electronic component
- wall portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 238000009423 ventilation Methods 0.000 claims abstract description 7
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention obtains good heat radiation performance through a simple and space-saving shape. The radiator of the invention comprises: a base section (10) having one surface as an electronic component contact surface (11) and the opposite surface as a heat radiation surface (12); and two heat radiation fins (30) provided on one end side and the other end side of the base section (10) in the direction in which the heat radiation surfaces (12) are continuous, the two heat radiation fins (30) each having: a side wall portion (31) protruding from the heat dissipation surface (12); and top wall portions (32) that protrude from the protruding end sides of the side wall portions (31) toward the other heat dissipation fins (30) and that ensure an external space (S1) between the top wall portions and the heat dissipation surface (12), and the two top wall portions (32) are separated from each other by ensuring a ventilation duct (A) that communicates the internal space (S2) and the external space (S1) between the top wall portions and the heat dissipation surface.
Description
Technical Field
The present invention relates to a heat sink for dissipating heat from an electronic component or the like, and an electronic component package.
Background
Conventionally, in this type of invention, for example, there is a heat sink as described in patent document 1, which includes a base portion, protruding pieces protruding upward from left and right ends of the base portion, a plurality of fins protruding outward from the protruding pieces, and a power transistor mounted on the base portion between the left and right protruding pieces, and which is configured in a substantially コ -shape.
Documents of the prior art
Patent document
Patent document 1: japanese Kokai Showa 59-103496 (refer to FIG. 1)
Disclosure of Invention
Technical problem to be solved by the invention
However, according to the above-described conventional technique, since the plurality of fins project outward from the respective projecting pieces, the overall dimension in the horizontal direction becomes large, and a large installation space is required. Also, a plurality of fins of complicated shapes have to be formed, and improvement in manufacturing is to be achieved. Therefore, it is considered that the plurality of fins are omitted, but this may lower the heat dissipation performance.
Means for solving the technical problem
In view of such a problem, the present invention provides a heat sink having the following configuration.
A heat sink is characterized by comprising: a plate-shaped base portion having one surface as an electronic component contact surface and the opposite surface as a heat radiation surface; and two heat dissipation fins provided on one end side and the other end side in a direction in which the heat dissipation surface continues in the base portion, each of the two heat dissipation fins having: a side wall portion protruding from the heat radiation surface; and top wall portions projecting from the projecting end sides of the side wall portions toward the other heat dissipating fin and ensuring an internal space between the top wall portions and the heat dissipating surface, the top wall portions being spaced apart from each other by ensuring an air passage between the top wall portions, the air passage communicating the internal space with an external space.
Effects of the invention
The present invention is configured as described above, and therefore, it is possible to obtain good heat dissipation performance by a simple and space-saving shape.
Drawings
Fig. 1 is a perspective view showing an example of a heat sink according to the present invention.
Fig. 2 is a sectional view taken along the line (II) to (II) of fig. 1, in which fig. 2 (a) shows a horizontal state and fig. 2 (b) shows a vertical state.
Fig. 3 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 4 is a sectional view taken along the line (IV) to (IV) of fig. 3, in which fig. 4 (a) shows a horizontally disposed state and fig. 4 (b) shows a vertically disposed state.
Fig. 5 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 6 is a cross-sectional view taken along the line (VI) to (VI) of fig. 5, in which fig. 6 (a) shows a horizontal state and fig. 6 (b) shows a vertical state.
Fig. 7 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 8 is an enlarged sectional view taken along the line (VIII) to (VIII) of fig. 7.
Fig. 9 is a sectional view taken along the line (IX) to (IX) of fig. 7, in which fig. 9 (a) shows a state of being horizontally disposed and fig. 9 (b) shows a state of being vertically disposed.
Fig. 10 is a perspective view showing an example of a conventional heat sink.
Fig. 11 is a table showing comparative experimental examples of the heat sink according to the present invention and the conventional heat sink.
Fig. 12 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 13 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 14 is a table showing an experimental example relating to the heat sink shown in fig. 12 and 13.
Fig. 15 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 16 (a) is a vertical sectional view showing an example of the vent hole and the flange portion, and fig. 16 (b) is a vertical sectional view showing an example of the protrusion.
Fig. 17 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 18 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 19 is a perspective view showing another example of the heat sink according to the present invention.
Fig. 20 is a disassembled perspective view of the heat sink of fig. 19.
Detailed Description
In the present embodiment, the following features are disclosed.
A first aspect of the present invention is a heat sink comprising: a base section having one surface as an electronic component contact surface and the opposite surface as a heat radiation surface; and two heat dissipation fins provided on one end side and the other end side in a direction in which the heat dissipation surface continues in the base portion, each of the two heat dissipation fins having: a side wall portion protruding from the heat radiation surface; and top wall portions that protrude from the protruding end sides of the side wall portions toward the other heat dissipating fin and that ensure an internal space between the top wall portions and the heat dissipating surface, and the two top wall portions are spaced apart from each other by ensuring an air duct that communicates the internal space and an external space (see fig. 1 to 20).
As a second feature, the air duct includes a slit portion between the two top wall portions (see fig. 1 to 9, 12 to 13, and 14 to 20).
As a third feature, the air duct includes a through portion having a through hole shape that spans the two top wall portions and having a width larger than the slit portion (see fig. 1 to 9, 13, and 17).
As a fourth feature, at least one of the two top wall portions is provided with a vent hole penetrating the top wall portion in the thickness direction (see fig. 3 to 6, 15, 16 (a), and 17).
As a fifth feature, a flange portion protruding toward the outer space is provided on the inner edge side of the venthole (see fig. 3 to 6).
As a sixth feature, a flange portion protruding toward the internal space is provided on the inner edge side of the vent hole (see fig. 15 and fig. 16 (a)).
As a seventh feature, a plurality of the vent holes and the flange portions are provided for each of the top wall portions, and two adjacent flange portions are arranged with a gap therebetween (see fig. 3 to 4, 15, and 17).
As an eighth feature, the vent hole and the flange portion are provided in plural numbers for each of the top wall portions, and two adjacent flange portions are integrally formed with a wall portion interposed therebetween (see fig. 5 to 6).
As a ninth feature, at least one of the two top wall portions is provided with a plurality of projections projecting to the outside space side, and each of the projections is formed in a bottomed cylindrical shape having a bottom portion on the side opposite to the base portion side (refer to fig. 7 to 9).
As a tenth feature, at least one of the two top wall portions is provided with a plurality of protrusions protruding toward the inner space side, and each of the protrusions is formed in a bottomed cylindrical shape having a bottom portion on the base portion side (see fig. 15 and fig. 16 (b)).
As an eleventh feature, the base portion is provided with a through-hole-shaped mounting hole provided in a range of the air duct in a plan view (see fig. 12, 13, 15, and 17 to 20).
As a twelfth feature, the top wall portion of one of the two heat radiation fins and the top wall portion of the other heat radiation fin are formed in a triangular shape in which oblique sides are arranged to face each other, and the air duct is secured between the two oblique sides facing each other (see fig. 12, 13, 15, 17 to 20)
A thirteenth characteristic is that a penetrating vent portion (see fig. 18) is provided in the side wall portion.
As a fourteenth feature, the heat sink is configured such that the heat sink is a first heat sink, and a second heat sink is provided in an internal space of the first heat sink, the second heat sink having a base portion and two heat radiating fins (see fig. 19 and 20) which have substantially the same configurations as the base portion and the two heat radiating fins.
As a fifteenth feature, an electronic component is supported in contact with the electronic component contact surface (see fig. 2, 4, 6, and 9).
< first embodiment >
Next, specific embodiments having the above-described features will be described in detail with reference to the drawings.
The heat sink 1 shown in fig. 1 to 2 includes: a plate-like base portion 10 having one surface as an electronic component contact surface 11 and the opposite surface as a heat radiation surface 12; and two heat radiating fins 30 provided on one end side and the other end side of the base portion 10 in the direction in which the heat radiating surfaces 12 are continuous, and the heat sink is configured to communicate an external space S1 with an internal space S2 surrounded by the base portion 10 and the heat radiating fins 30.
Further, the heat sink 1 illustrated in the drawings is formed by bending a single sheet of sheet metal material to form the base portion 10 and the two heat radiating fins 30 and 30, but as another example, the base portion 10 and the heat radiating fins 30 and 30 that are independent of each other may be connected by welding, fitting, or the like.
The material of the heat sink 1 includes a pure metal composed of a single metal element, a plurality of metal elements, or an alloy composed of a metal element and a non-metal element. Specific examples of the metal element include aluminum, copper, stainless steel, nickel, and magnesium.
The heat sink 1 may be formed of a single material, or may be formed of a composite material in which two or more different materials are integrally combined.
Further, the heat sink 1 of the illustrated example constitutes an electronic component package P (refer to fig. 1) by bringing the electronic component contact face 11 into contact with an electronic component X (for example, a CPU, a transistor, a thyristor, other semiconductors, and an electronic component).
The base portion 10 is formed in a rectangular flat plate shape (square flat plate shape in the example of the figure), and a surface located on one side in the thickness direction (lower side in the figure) is formed in a flat shape as an electronic component contact surface 11 for contacting the electronic component X.
The surface on the opposite side (upper side in the figure) of the base portion 10 is formed in a flat shape without unevenness, but a heat radiation fin or the like having an appropriate shape may be provided as necessary.
Each of the fins 30 integrally has: a side wall portion 31 projecting upward substantially vertically from one side of the base portion 10; and a top wall portion 32 projecting substantially parallel to the heat radiating surface 12 from the projecting end side of the side wall portion 31 toward the other heat sink 30, and having an internal space S2 between the heat radiating surface 12 and the heat sink, and the heat sinks are formed in a substantially inverted L shape.
The left and right top wall portions 32, 32 separate the opposing projecting end portions, and an air duct a communicating the internal space S2 with the external space S1 on the upper side is secured between the projecting end portions.
The air passage a is formed by a slit portion 32a that partitions the two top wall portions 32, and a through portion 32b (through hole) that is in the shape of a through hole that spans the two top wall portions 32, 32 and has a width (inner diameter according to the example of the figure) larger than the slit portion 32 a.
The slit portion 32a is elongated in a direction intersecting the direction in which the two top wall portions 32, 32 are arranged. Two slit portions 32a are provided on both sides thereof with a through portion 32b interposed therebetween.
The through portion 32b is formed in a circular through hole shape by semicircular notches provided in each of the one top wall portion 32 and the other top wall portion 32 (see fig. 1).
With the above configuration, the opening B is formed in a substantially horizontally long rectangular shape when viewed from the front on one end side and the other end side (the right end side and the left end side in fig. 2 (a)) in the direction intersecting the direction in which the two top wall portions 32, 32 are arranged.
The opening B functions as an air flow path for circulating air between the external space S1 and the internal space S2.
In the figure, reference numeral 32c denotes a notch portion for inserting a jig (for example, a screwdriver or the like) for fastening a screw or the like inserted through the mounting hole 13 with a gap.
As another example other than the illustrated example, the mounting hole 13 may be omitted. In this case, the heat sink 30 may be fixed to the electronic component X by a method other than screw fastening such as fitting or adhesion.
The heat sink 1 having the above-described structure is configured to support the electronic component X serving as a heat source in contact with the electronic component contact surface 11, thereby forming an electronic component package (see fig. 2 (a) and 2 (b)).
Next, the characteristic operational effects of the heat sink 1 having the above-described structure will be described in detail.
As shown in fig. 2 (a), when the electronic component contact surface 11 is directed downward and brought into contact with the electronic component X (hereinafter, referred to as horizontal arrangement), an updraft due to heat of the base portion 10 is generated in the air passage a, and air on both sides is drawn into the updraft, thereby forming a continuous air flow along the two-dot chain line F1 shown in the drawing.
Specifically, the air in the external space S1 enters the internal space S2 through the openings B on both sides, and flows toward the upper external space S1 through the slit portion 32a and the penetration portion 32B.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10 and the inner surfaces of the heat radiating fins 30, thereby suppressing temperature increases in the base portion 10 and the electronic component X.
As shown in fig. 2B, when the electronic component contact surface 11 is brought into contact with the electronic component X toward the side surface (hereinafter, referred to as vertical installation) of the heat sink 1, an updraft due to heat of the base portion 10 is generated in the internal space S2, and air on the air duct a side and air on the lower opening B side are drawn into the updraft, thereby forming a continuous air flow along the two-dot chain line F2 shown in the drawing.
Specifically, the air in the external space S1 enters the internal space S2 through the air duct a and the lower opening B, and flows to the upper external space S1 through the upper opening B.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10 and the inner surfaces of the heat radiating fins 30, thereby suppressing temperature increases in the base portion 10 and the electronic component X.
Thus, according to the heat sink 1, a good heat radiation performance can be obtained regardless of horizontal or vertical arrangement, by a space-saving and lightweight structure without fins or the like protruding to the outside.
Next, another embodiment of the heat sink according to the present invention will be described. In the embodiments described below, the above-described embodiments are partially modified, and therefore the modified portions will be mainly described in detail, and the same portions will be denoted by the same reference numerals and the like, and the description thereof will be omitted as appropriate.
< second embodiment >
The radiator 2 shown in fig. 3 is the radiator 1 configured as described above, and each top wall portion 32 is provided with the vent hole 33 and the flange portion 34.
A plurality of vent holes 33 are provided so as to be aligned in a direction in which the surfaces of the top wall portion 32 are continuous. A gap is ensured between the adjacent vent holes 33.
Each vent hole 33 is formed in a polygonal shape (a regular hexagonal shape according to the example of the figure), and penetrates the top wall portion 32 in the thickness direction.
The flange portion 34 is provided in a cylindrical shape (hexagonal cylindrical shape according to the example of the figure) protruding from the inner edge side of each vent hole 33 on the outer surface of the top wall portion 32 toward the outer space S1.
A plurality of the flange portions 34 are arranged so as to correspond to the plurality of vent holes 33, respectively. A gap is ensured between adjacent flange portions 34. This gap increases the heat dissipation area of the flange portion 34.
According to the illustrated example, the amount of protrusion from each flange 34 is set to be approximately the thickness of the top wall 32.
Next, the characteristic operational effects of the heat sink 2 having the above-described structure will be described in detail.
As shown in fig. 4 (a), when the heat sink 2 is horizontally disposed, a continuous air flow along the two-dot chain line F1 is formed in substantially the same manner as the heat sink 1.
Specifically, the air in the external space S1 enters the internal space S2 through the openings B on both sides, and flows to the upper external space S1 through the slit portion 32a, the penetration portion 32B, and the vent hole 33.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10, the inner surface of the heat radiating fin 30, the air holes 33, the inner surface of the flange portion 34, and the like, and exchanges heat with the air in the external space S1 also on the outer surface side of the flange portion 34, thereby suppressing temperature increases of the base portion 10 and the electronic component X.
As shown in fig. 4 (b), when the heat sink 2 is vertically disposed, a continuous air flow along the two-dot chain line F2 is formed in substantially the same manner as the heat sink 1.
Specifically, the air in the external space S1 enters the internal space S2 through the air duct a, the vent hole 33, and the lower opening B, and flows to the upper external space S1 through the upper opening B.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10, the inner surface of the heat radiating fin 30, the air holes 33, the inner surface of the flange portion 34, and the like, and exchanges heat with the air in the external space S1 also on the outer surface side of the flange portion 34, thereby suppressing temperature increases of the base portion 10 and the electronic component X.
Thus, according to the heat sink 2, a good heat radiation performance can be obtained regardless of horizontal or vertical arrangement, by a space-saving and lightweight structure without fins or the like protruding to the outside. Further, the strength of the top wall portion 32 can be enhanced by the vent hole 33 and the flange portion 34.
< third embodiment >
The radiator 3 shown in fig. 5 is the radiator 1 configured as described above, and the vent holes 35 and the flange portions 36 are provided in the top wall portions 32.
A plurality of the vent holes 35 are provided so as to be aligned in a direction in which the surfaces of the top wall portion 32 are continuous.
Each vent hole 35 is formed in a polygonal shape (a regular hexagonal shape according to the example of the figure), and penetrates the top wall portion 32 in the thickness direction.
The flange portion 36 is provided in a cylindrical shape (hexagonal cylindrical shape according to the example of the figure) protruding from the inner edge side of each vent hole 35 on the outer surface of the top wall portion 32 toward the outer space S1.
A plurality of the flange portions 36 are arranged so as to correspond to the plurality of vent holes 35, respectively. The adjacent flange portions 36, 36 share the wall portion 36a therebetween and are integrally formed. The wall portion 36a functions to reinforce the strength of the top wall portion 32.
According to the illustrated example, the amount of protrusion of each flange 36 is set to be approximately the thickness of the top wall 32.
Next, the characteristic operational effects of the heat sink 3 having the above-described structure will be described in detail.
As shown in fig. 6 (a), when the heat sink 3 is horizontally disposed, a continuous air flow along the two-dot chain line F1 is formed in substantially the same manner as the heat sink 1.
Specifically, the air in the external space S1 enters the internal space S2 through the openings B on both sides, and flows to the upper external space S1 through the slit portion 32a, the penetration portion 32B, and the vent hole 35.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10, the inner surface of the heat radiating fin 30, the air holes 35, the inner surface of the flange portion 36, and the like, and exchanges heat with the air in the external space S1 also on the outer surface side of the flange portion 36, thereby suppressing temperature increases of the base portion 10 and the electronic component X.
When the heat sink 3 is vertically disposed as shown in fig. 6 (b), a continuous air flow along the two-dot chain line F2 is formed in the same manner as the heat sink 1.
Specifically, the air in the external space S1 enters the internal space S2 through the air duct a, the vent hole 35, and the lower opening B, and flows to the upper external space S1 through the upper opening B.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10, the inner surface of the heat radiating fin 30, the air holes 35, the inner surface of the flange portion 36, and the like, and exchanges heat with the air in the external space S1 also on the outer surface side of the flange portion 36, thereby suppressing temperature increases of the base portion 10 and the electronic component X.
Thus, according to the heat sink 3, a good heat radiation performance can be obtained regardless of horizontal or vertical arrangement, by a space-saving and lightweight structure without fins or the like protruding to the outside. Further, the strength of the top wall portion 32 can be enhanced by the vent hole 35 and the flange portion 36.
< fourth embodiment >
The heat sink 4 shown in fig. 7 is the heat sink 1 configured as described above, and has a protrusion 37 protruding toward the outside space on each top wall portion 32.
A plurality of the protrusions 37 are provided so as to be aligned in a direction in which the surfaces of the top wall portion 32 are continuous.
Each protrusion 37 is formed in a bottomed cylindrical shape having a polygonal shape (hexagonal shape according to the example of the drawing) with a bottom on the side opposite to the base portion 10 side, and protrudes to the outside space S1 side (refer to fig. 8).
According to the illustrated example, the amount of projection of each projection 37 is set to approximately the thickness of the top wall portion 32.
A gap is ensured between the adjacent protrusions 37, 37. This gap ensures a wide heat dissipation area of each protrusion 37.
As another example other than the illustrated example, the strength of each top wall portion 32 can be further increased by integrally connecting the adjacent walls 37, 37.
Next, the characteristic operational effects of the heat sink 4 having the above-described structure will be described in detail.
When the heat sink 4 is horizontally disposed as shown in fig. 9 (a), a continuous air flow along the two-dot chain line F1 is formed in the same manner as the heat sink 1.
Specifically, the air in the external space S1 enters the internal space S2 through the openings B on both sides, and flows to the upper external space S1 through the air passages a such as the slit portions 32a and the penetration portions 32B.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10, the inner surfaces of the fins 30, the inner surfaces of the protrusions 37, and the like, and exchanges heat with the air in the external space S1 also on the outer surface side of the protrusions 37, thereby suppressing temperature increases in the base portion 10 and the electronic component X.
When the heat sink 4 is vertically disposed as shown in fig. 9 (b), a continuous air flow along the two-dot chain line F2 is formed in the same manner as the heat sink 1.
Specifically, the air in the external space S1 enters the internal space S2 through the air duct a and the lower opening B, and flows to the upper external space S1 through the upper opening B.
The air thus flowing contacts and exchanges heat with the heat radiating surface 12 of the base portion 10, the inner surfaces of the fins 30, the inner surfaces of the protrusions 37, and the like, and exchanges heat with the air in the external space S1 also on the outer surface side of the protrusions 37, thereby suppressing temperature increases in the base portion 10 and the electronic component X.
Thus, according to the heat sink 4, a good heat radiation performance can be obtained regardless of horizontal or vertical arrangement, by a space-saving and lightweight structure without fins or the like protruding to the outside. Further, the strength of the top wall portion 32 can be enhanced by the protrusion 37.
< comparison with conventional Structure >
Next, the results of comparing the temperature rise value, the weight, and the like of the base portion based on the computer analysis will be described with respect to the radiators 1 to 4 having the above-described configuration and the comparative example 100 having the conventional configuration (see fig. 11).
The heat sinks 1 to 4 and the comparative example 100 used heat sinks having the same external dimensions (about 60 × 59 × 10 mm).
Comparative example 100 is a heat sink in which 6 fins 120 are provided substantially in parallel with each other at intervals on the upper surface of a rectangular base portion 110.
As shown in the table of fig. 11, the heat sinks 1 to 4 have a lower temperature rise value than that of the comparative example 100 regardless of whether they are horizontally or vertically arranged, and particularly, a significantly lower temperature rise value is obtained when they are vertically arranged.
The weight of the radiators 1-4 is much lower than that of the comparative example 100.
Further, according to the heat sink 2, the vent hole 33 and the flange portion 34 are provided as a particularly preferable aspect, but as another example, the flange portion 34 may be omitted, and in this case, the ventilation effect by the vent hole 33 can be obtained. In the same way, the flange portion 36 can also be omitted from the heat sink 3.
As another example other than the above, the vent hole 33, the flange 34, and the protrusion 37 may be arranged in the top wall portion 32 of the heat sink 1 at the same time, or the vent hole 33, the flange 34, and the protrusion 37 may be arranged in an appropriate combination.
< fifth embodiment >
The heat sink 5 shown in fig. 12 is the heat sink 1 configured as described above, in which the base portion 10 is replaced with the base portion 10 ', and the top wall portions 32 of the respective fins 30 are replaced with the top wall portions 32'.
In the heat sink 5, the top wall portion 32 ' of one heat radiation fin 30 and the top wall portion 32 ' of the other heat radiation fin 30 are formed in a triangular shape in which oblique sides face each other, and the air passage a is secured by a slit portion 32a ' formed between the two opposing oblique sides.
The base portion 10 'is formed by replacing the mounting hole 13 of the base portion 10 with the mounting hole 13'.
The mounting hole 13' is a through hole provided in the range of the air duct a in a plan view. In other words, the air passage a is located on the central axis of the mounting hole 13'.
When the heat sink 5 having the above-described structure is horizontally disposed with respect to an electronic component (not shown), a flow F1 of air from the opening B toward the internal space S2 and toward the external space S1 via the slit portion 32 a' is formed substantially similarly to the heat sink 1. In the vertical arrangement, similarly to the heat sink 1 described above (see fig. 2), a flow of air entering the internal space S2 from one opening B and discharged to the external space S1 from the other opening B is formed, and the air entering the internal space S2 from the slit portion 32 a' merges into the flow (not shown).
Thus, according to the heat sink 5 configured as described above, the relatively long air passage a can be ensured by the inclined slit portion 32 a', and further, a good heat radiation performance can be obtained by a space-saving and lightweight structure without fins or the like protruding to the outside.
Further, when the heat sink 5 is fixed to an electronic component or the like by clamping with a clamping tool (for example, a screw, a bolt, or the like) inserted through the mounting hole 13', the air duct a can be used as a space for inserting a jig (for example, a screw driver or the like) for tightening the clamping tool with a gap.
In the example shown in fig. 12, the mounting holes 13 'are provided at two positions corresponding to one end side and the other end side of the air duct a (slit portion 32 a'), but one or more than three mounting holes may be provided.
< sixth embodiment >
The heat sink 6 shown in fig. 13 is formed by forming the air passage a with the slit portion 32a ' and the penetrating portion 32b ' in addition to the penetrating portion 32b ' in the heat sink 5 having the above-described configuration.
The penetrating portion 32b 'is substantially square in plan view, wider than the slit portion 32 a', and is provided across the two top wall portions 32 ', 32'.
The air flow F1 in the horizontal installation and the air flow (not shown) in the vertical installation of the heat sink 6 are substantially the same as those of the heat sink 1 and the heat sink 5 described above.
Thus, according to the heat sink 6 configured as described above, the inclined slit portions 32a 'and the penetrating portions 32 b' ensure the air passages a having a large flow area, and further, the heat sink has a space-saving and lightweight structure without fins or the like protruding to the outside, thereby obtaining excellent heat dissipation performance.
Next, with respect to the radiators 5 and 6 having the above-described configuration, the results of analyzing and comparing the temperature increase value, the weight, and the like of the base portion by a computer will be described (see fig. 14).
The samples used in this experiment all had external dimensions of about 60X 59X 10 mm.
As shown in the table of fig. 14, the heat sink 6 was tested for five samples having different one-side dimensions Q of the substantially square through-hole 32 b'.
As shown in the table of fig. 14, the temperature rise value in the horizontal setting increases as the size Q increases, and is minimum when Q is 30mm, and increases as Q increases.
In addition, it was confirmed that the temperature increase value in the vertical setting increased with the increase in the dimension Q until Q became 40 mm.
As can be seen from these configurations, the dimension Q is preferably 30mm when used in the horizontal arrangement, and the dimension Q is preferably 40mm when used in the vertical arrangement.
< seventh embodiment >
The heat sink 7 shown in fig. 15 is formed by providing the top wall portion 32 ' of the heat sink 5 configured as described above with the vent holes 33 ' and the flange portions 34 '.
A plurality of vent holes 33 'are provided at predetermined intervals along the surface of each top wall portion 32'. As shown in fig. 16 (a), each vent hole 33 'penetrates the top wall portion 32' in the thickness direction.
The flange 34 'protrudes from the entire periphery of the inner edge of the vent hole 33' toward the internal space S2, and is formed in a substantially cylindrical shape.
When the heat sink 7 is horizontally disposed with respect to an electronic component (not shown), substantially the same as the heat sink 2, a flow of air that enters the internal space S2 from the opening B and is discharged to the external space S1 through the slit portion 32a ', and a flow of air that enters the internal space S2 from the opening B and is discharged to the external space S1 through the vent hole 33' are formed (see the two-dot chain line F1 in fig. 15)
In the vertical arrangement, similarly to the heat sink 2 and the like, an air flow entering the internal space S2 from one opening B and being discharged to the external space S1 from the other opening B is formed, and the air entering the internal space S2 from the slit portion 32a 'merges into the flow, and the air entering the internal space S2 from the vent hole 33' also merges into the flow (not shown).
Thus, according to the heat sink 7 having the above-described structure, a space-saving and lightweight structure without fins or the like protruding to the outside can be obtained, and a large amount of ventilation and a large heat dissipation area can be secured by the inclined slit portions 32a ', the vent holes 33 ', the flange portions 34 ', and the like, so that good heat dissipation performance can be obtained.
In the heat sink 7 having the above-described configuration, the vent holes 33 ' and the flange portions 34 ' may be partially or entirely replaced with the protrusions 37 ' shown in fig. 16 (b). The protrusion 37' is formed in a bottomed cylindrical shape having a bottom portion on the base portion side, and protrudes toward the inner space S2 side.
According to the heat sink including the protrusion 37 ', not only a space-saving and lightweight structure without fins or the like protruding to the outside can be obtained, but also the protrusion 37 ' can provide the operational effects of enhancing the strength of the top wall portion 32 ' and improving the heat radiation performance.
As another example, the hexagonal vent holes 33, the flange portions 34, the protrusions 37, and the like may be partially or entirely replaced with the vent holes 33 ', the flange portions 34 ', the protrusions 37 ', and the like in the heat sink 7.
< eighth embodiment >
The heat sink 8 shown in fig. 17 is formed by providing a plurality of vent holes 33 ' and flange portions 34 ' to the top wall portion 32 ' of the heat sink 6 having the above-described structure.
The vent hole 33 'and the flange 34' have the same structure as the heat sink 7 (see fig. 16 (a)).
According to the heat sink 8, a large amount of air flow and a large heat dissipation area can be ensured by the inclined slit portions 32a ', the penetrating portions 32b, the vent holes 33 ', the flange portions 34 ', and the like, and further, a good heat dissipation performance can be obtained by a space-saving and lightweight structure without fins or the like protruding to the outside.
In the heat sink 8, the vent hole 33 ' and the flange 34 ' may be replaced with a protrusion 37 ' (see fig. 16 (b)).
< ninth embodiment >
The heat sink 9 shown in fig. 18 is formed by forming a plurality of ventilation portions 31a in the side wall portion 31 of the heat sink 5 having the above-described configuration.
The vent portion 31a is a slit-shaped through hole elongated in the projecting direction (upward in the example of the figure) of the side wall portion 31, and a plurality of the vent portions are provided at intervals in a direction intersecting the projecting direction.
In the heat sink 9, not only the air flow passing through the slit portions 32 a' and the opening portions B but also the air flow passing through the ventilation portions 31a of the respective side wall portions 31 can be formed, and further, a space-saving and lightweight structure without fins or the like protruding to the outside can be obtained, and thus, a good heat radiation performance can be obtained.
< tenth embodiment >
The heat sink 50 shown in fig. 19 and 20 is formed by using the heat sink 5 (see fig. 12) as a first heat sink 51 and providing a second heat sink 52 in an internal space of the first heat sink 51.
The second heat sink 52 has substantially the same structure as the base portion 10 and the fins 30 of the heat sink 5, has a substantially smaller base portion 52a and fins 52b, and is in contact with the base portion 10' of the first heat sink 51.
The base portion 52a is provided with mounting holes 52c that communicate with the respective mounting holes 13 'of the base portion 10'.
The heat sink fins 52b are formed into a substantially inverted L shape having side wall portions 52b1 and a top wall portion 52b2 integrally therewith, in substantially the same manner as the heat sink fins 30 of the heat sink 5 described above.
A gap c through which air can flow is secured between the top wall portion 32' of the first heat sink 51 and the top wall portion 52b2 of the second heat sink 52.
In the heat sink 50 having the above-described structure, the air flow passage extending from the opening B to the slit portion 32 a' can be formed in the gap c and the second heat sink 52, a wider heat radiation area can be secured by the two heat sinks 51 and 52, and further, a space-saving and lightweight structure without fins or the like protruding to the outside can be used, and thus, excellent heat radiation performance can be obtained.
The second heat sink 52 may be integrated with the first heat sink 51 by welding or the like, and the second heat sink 52 may be assembled to the first heat sink 51 as needed.
Further, in the above-described embodiment, the base portion 52a of the second heat sink 52 is brought into contact with the base portion 10 'of the first heat sink 51, but as another example, a configuration may be adopted in which a gap is provided between these base portions 52a, 10'. In this case, the side wall portion 52b1 of the second heat sink 52 may be connected to the side wall portion 31 of the first heat sink 51 by welding or the like, for example.
In the first heat sink 51 and the second heat sink 52 of the heat sink 50, the penetrating portions 32b ', the vent holes 33', the flange portions 34 ', the protrusions 37', the vent portions 31a, and the like can be appropriately arranged similarly to the heat sinks 7 to 8 (see fig. 15 to 17).
The present invention is not limited to the above-described embodiments, and can be modified as appropriate within a scope not changing the gist of the present invention.
Description of the symbols
1. 2, 3, 4, 5, 6, 7, 8, 9, 50: heat radiator
10. 10': base part
11: contact surface of electronic component
12: heat radiation surface
13': mounting hole
30: heat sink
31: side wall part
32. 32': top wall part
32a, 32 a': slit part
32b, 32 b': penetration part
33. 33', 35: vent hole
34. 34', 36: flange part
37. 37': protrusion
51: first radiator
52: second radiator
52 a: base part
52 b: heat sink
A: air duct
B: opening part
S1: exterior space
S2: inner space
Claims (15)
1. A heat sink is characterized by comprising: a base section having one surface as an electronic component contact surface and the opposite surface as a heat radiation surface; and two heat radiating fins provided on one end side and the other end side of the base portion in a direction in which the heat radiating surfaces are continuous,
the two heat sinks each have: a side wall portion protruding from the heat radiation surface; and a top wall portion projecting from a projecting end side of the side wall portion toward the other heat dissipating fin and ensuring an internal space between the top wall portion and the heat dissipating surface,
the two top wall portions are spaced apart from each other with an air duct therebetween that communicates the internal space with the external space.
2. The heat sink of claim 1,
the air passage includes a slit portion between the two top wall portions.
3. The heat sink of claim 2,
the air duct includes a through portion having a through hole shape spanning the two top wall portions and having a width larger than the slit portion.
4. The heat sink according to any one of claims 1 to 3,
at least one of the two top wall portions is provided with a vent hole penetrating the top wall portion in the thickness direction.
5. The heat sink of claim 4,
a flange portion protruding toward the outer space is provided on the inner edge side of the vent hole.
6. The heat sink of claim 4,
a flange portion protruding toward the inner space is provided on the inner edge side of the ventilation hole.
7. The heat sink according to claim 5 or 6,
the vent hole and the flange are provided in plural on each of the top wall portions, and two adjacent flanges are disposed with a gap therebetween.
8. The heat sink according to claim 5 or 6,
the vent hole and the flange portion are provided in plural numbers in each of the top wall portions, and two adjacent flange portions share a wall portion therebetween to be integrated.
9. The heat sink according to any one of claims 1 to 8,
at least one of the two top wall portions is provided with a plurality of protrusions protruding to the outside space side, and each of the protrusions is formed in a bottomed cylindrical shape having a bottom portion on the side opposite to the base portion side.
10. The heat sink according to any one of claims 1 to 8,
at least one of the two top wall portions is provided with a plurality of protrusions protruding toward the internal space, and each of the protrusions is formed in a bottomed tubular shape having a bottom portion on the base portion side.
11. The heat sink according to any one of claims 1 to 10,
the base part is provided with a through-shaped mounting hole,
the mounting hole is provided in the range of the air duct in a plan view.
12. The heat sink according to any one of claims 1 to 11,
the top wall portion of one of the two heat dissipation fins and the top wall portion of the other heat dissipation fin are formed in a triangular shape having oblique sides facing each other, and the air duct is secured between the two opposing oblique sides.
13. The heat sink according to any one of claims 1 to 12,
the side wall portion is provided with a through-shaped ventilation portion.
14. A heat sink formed by using the heat sink of any one of claims 1 to 13 as a first heat sink and providing a second heat sink in an inner space of the first heat sink, the heat sink being characterized in that,
the second heat sink has a base portion and two heat radiating fins having substantially the same structures as the base portion and the two heat radiating fins.
15. An electronic component package using the heat spreader of any one of claims 1 to 12, the electronic component package characterized in that,
the electronic component is supported by the electronic component contact surface in contact with the electronic component.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-070486 | 2019-04-02 | ||
| JP2019070486 | 2019-04-02 | ||
| JP2019127174A JP6803087B2 (en) | 2019-04-02 | 2019-07-08 | Heat sink and electronic component package |
| JP2019-127174 | 2019-07-08 | ||
| PCT/JP2020/015042 WO2020204077A1 (en) | 2019-04-02 | 2020-04-01 | Heat sink and electronic component package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113646884A true CN113646884A (en) | 2021-11-12 |
Family
ID=72746842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080024146.3A Pending CN113646884A (en) | 2019-04-02 | 2020-04-01 | Heat sink and electronic component package |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6803087B2 (en) |
| CN (1) | CN113646884A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09116055A (en) * | 1995-10-17 | 1997-05-02 | Pfu Ltd | Heat sink device and manufacture of heat sink device |
| GB0710044D0 (en) * | 2007-05-25 | 2007-07-04 | Malico Inc | Heat dissipating module with low wind resistance and high heat dissipation efficiency |
| CN103107149A (en) * | 2011-11-11 | 2013-05-15 | 昭和电工株式会社 | Liquid cooling device for power device e.g. insulated-gate bipolar transistor(igbt) used in electric vehicle, has upper and lower end sections of tap-shaped ribs that are soldered to upper wall and bottom wall of housing |
| WO2014020748A1 (en) * | 2012-08-02 | 2014-02-06 | 三菱電機株式会社 | Heat dissipation plate |
| JP2014063836A (en) * | 2012-09-20 | 2014-04-10 | Sharp Corp | Heat radiator and manufacturing method of heat radiation member |
| JP2016105441A (en) * | 2014-12-01 | 2016-06-09 | トヨタ自動車株式会社 | Power converter |
| JP6239809B1 (en) * | 2016-07-01 | 2017-11-29 | かがつう株式会社 | Heat sink and electronic component package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59103496U (en) * | 1982-12-28 | 1984-07-12 | 電設機器工業株式会社 | heat dissipation device |
| WO2018003138A1 (en) * | 2016-07-01 | 2018-01-04 | かがつう株式会社 | Heat sink and electronic component package |
| CN208210572U (en) * | 2018-06-19 | 2018-12-07 | 深圳市零度智控科技有限公司 | A kind of internet system radiator |
-
2019
- 2019-07-08 JP JP2019127174A patent/JP6803087B2/en active Active
-
2020
- 2020-04-01 CN CN202080024146.3A patent/CN113646884A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09116055A (en) * | 1995-10-17 | 1997-05-02 | Pfu Ltd | Heat sink device and manufacture of heat sink device |
| GB0710044D0 (en) * | 2007-05-25 | 2007-07-04 | Malico Inc | Heat dissipating module with low wind resistance and high heat dissipation efficiency |
| CN103107149A (en) * | 2011-11-11 | 2013-05-15 | 昭和电工株式会社 | Liquid cooling device for power device e.g. insulated-gate bipolar transistor(igbt) used in electric vehicle, has upper and lower end sections of tap-shaped ribs that are soldered to upper wall and bottom wall of housing |
| WO2014020748A1 (en) * | 2012-08-02 | 2014-02-06 | 三菱電機株式会社 | Heat dissipation plate |
| CN104509229A (en) * | 2012-08-02 | 2015-04-08 | 三菱电机株式会社 | Heat dissipation plate |
| JP2014063836A (en) * | 2012-09-20 | 2014-04-10 | Sharp Corp | Heat radiator and manufacturing method of heat radiation member |
| JP2016105441A (en) * | 2014-12-01 | 2016-06-09 | トヨタ自動車株式会社 | Power converter |
| JP6239809B1 (en) * | 2016-07-01 | 2017-11-29 | かがつう株式会社 | Heat sink and electronic component package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020170833A (en) | 2020-10-15 |
| JP6803087B2 (en) | 2020-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7489513B2 (en) | Heat dissipation device | |
| US5947192A (en) | Stack-fin radiator | |
| US6446708B1 (en) | Heat dissipating device | |
| US6819564B2 (en) | Heat dissipation module | |
| US9214405B2 (en) | Semiconductor module having heat dissipating portion | |
| JP6721930B2 (en) | Heat sink and electronic component package | |
| JP2017168778A (en) | Cooling structure of electrolytic capacitor and electrolytic capacitor unit | |
| WO2020204077A1 (en) | Heat sink and electronic component package | |
| JP7537199B2 (en) | Heat sinks, cooling devices | |
| CN113646884A (en) | Heat sink and electronic component package | |
| US9842791B2 (en) | Base with heat absorber and heat dissipating module having the base | |
| JP4115212B2 (en) | Heat sink with fan | |
| CN113424666B (en) | Radiator for radio remote unit | |
| CN108036286B (en) | Heat radiator | |
| JP2584791Y2 (en) | Heat sink structure | |
| JP6239809B1 (en) | Heat sink and electronic component package | |
| JP2016219641A (en) | Heat sink and housing for base station | |
| KR101287664B1 (en) | Heat sink module | |
| CN216903096U (en) | Soft packet of module heat radiation structure | |
| WO2020144886A1 (en) | Heat sink and electronic component package | |
| JP6964337B2 (en) | Heat sink and electronic component package | |
| CN216903715U (en) | Laser heat abstractor and laser instrument | |
| CN108253397B (en) | Heat radiator | |
| CN108019663B (en) | Plate type LED lamp | |
| JP7015532B2 (en) | Heat sink and electronic component package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |