CN113646171A - Resin composition and resin sheet - Google Patents

Resin composition and resin sheet Download PDF

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Publication number
CN113646171A
CN113646171A CN202080025129.1A CN202080025129A CN113646171A CN 113646171 A CN113646171 A CN 113646171A CN 202080025129 A CN202080025129 A CN 202080025129A CN 113646171 A CN113646171 A CN 113646171A
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resin
resin composition
mass
filler
manufactured
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奥野真奈美
久保有希
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a resin composition which can exert higher moisture barrier property and is suitable for forming a sealing part of a light emitting element such as an organic EL element, an optical semiconductor such as a high-brightness LED, a light receiving element such as a solar cell and the like. A resin composition comprising the following components (A) to (C): (A) a thermoplastic resin; (B) a hygroscopic filler; and (C) a plate-like filler, wherein the resin composition has a water content of 1500ppm or less.

Description

Resin composition and resin sheet
Technical Field
The present invention relates to a resin composition and a resin sheet, and more particularly to a resin composition and a resin sheet suitable for sealing electronic devices, particularly light-emitting devices such as organic el (electroluminescence) devices, optical semiconductors such as high-luminance LEDs, and light-receiving devices such as solar cells.
Background
Organic EL devices have recently attracted attention because they are light-emitting devices using organic materials as light-emitting materials and can emit light with high luminance at low voltage. However, the organic EL element has very weak resistance to moisture, and has the following problems: the light-emitting material (light-emitting layer) is modified by moisture to reduce the luminance, or does not emit light, or the interface between the electrode and the light-emitting layer is peeled off by the influence of moisture, or the metal is oxidized to have high resistance. Therefore, in order to block the inside of the element from moisture in the outside air, for example, the following operations are performed: the sealing layer is formed from a resin composition so as to cover the entire surface of the light-emitting layer formed on the substrate, and the organic EL element is sealed.
As a resin composition suitable for such sealing use of an organic EL element, a resin composition containing a hygroscopic filler in a resin composition is known. For example, patent document 1 discloses a sealing resin composition containing a hygroscopic metal hydroxide, and a sealing sheet comprising a support and a resin composition layer formed from the sealing resin composition. Patent document 2 discloses a film suitable for sealing an organic EL element, which includes, as a resin composition layer, "a moisture-absorbing resin composition layer containing a moisture-absorbing filler" and "a protective resin composition layer containing no moisture-absorbing filler or containing a small amount of a moisture-absorbing filler.
Documents of the prior art
Patent document
Patent document 1: international publication No. 2017/057708
Patent document 2: international publication No. 2011/016408.
Disclosure of Invention
Problems to be solved by the invention
These resin sheets absorb moisture in the outside air by the moisture-absorbing layer containing the moisture-absorbing filler to protect the organic EL element from moisture, but since there is newly a problem that moisture captured by the moisture-absorbing filler reaches the organic EL element with the passage of time and causes deterioration, it cannot be said that the resin sheets are sufficiently suitable for sealing applications of a portion such as an organic EL element where high moisture barrier property (moisture barrier property) is required.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin composition and a resin sheet which can exhibit a higher moisture barrier property and are suitable for sealing applications.
Means for solving the problems
The present inventors have conducted extensive studies to solve the above problems, and as a result, have found that the above problems can be solved by blending a hygroscopic filler and a plate-like filler in a thermoplastic resin and setting the water content to a predetermined range, and have completed the present invention. That is, the present invention includes an aspect having the following features;
[1] a resin composition comprising the following components (A) to (C):
(A) a thermoplastic resin;
(B) a hygroscopic filler; and
(C) the plate-shaped filler is filled in the filling material,
the resin composition has a water content of 1500ppm or less;
[2] the resin composition according to [1], wherein (A) the thermoplastic resin is a polyolefin resin;
[3] the resin composition according to [1] or [2], wherein the content of the (B) hygroscopic filler is 10% by mass or more and 80% by mass or less based on 100% by mass of the nonvolatile matter of the resin composition;
[4] the resin composition according to any one of [1] to [3], (C) the content of the plate-like filler is 10 to 80% by mass based on 100% by mass of the nonvolatile matter of the resin composition;
[5] the resin composition according to any one of [1] to [4], wherein the mass ratio of the (B) hygroscopic filler to the (C) plate-like filler (hygroscopic filler: plate-like filler) is 10:1 to 1: 5;
[6] the resin composition according to any one of [1] to [5], wherein (B) the hygroscopic filler is a semi-calcined hydrotalcite;
[7] the resin composition according to any one of [1] to [6], wherein the (C) plate-like filler is at least 1 selected from plate-like glass, uncalcined hydrotalcite, smectite (smectite) and synthetic fluorophlogopite;
[8] the resin composition according to any one of [1] to [7], wherein (C) the plate-like filler has an average particle diameter to thickness ratio of 2 or more;
[9] a resin sheet comprising a support and, provided on the support, a resin composition layer comprising the resin composition according to any one of [1] to [8 ];
[10] the resin sheet according to [9], which is used for sealing an electronic device;
[11] the resin sheet according to [9], which is used for sealing an organic EL device;
[12] an electronic device sealed with the resin sheet of [9 ];
[13] an organic EL device sealed with the resin sheet described in [9 ].
ADVANTAGEOUS EFFECTS OF INVENTION
The present invention can provide a resin composition and a resin sheet which exhibit higher moisture barrier properties and are suitable for sealing applications such as light-emitting elements such as organic EL elements, optical semiconductors such as high-brightness LEDs, and light-receiving elements such as solar cells.
Detailed Description
The present invention will be described below in terms of preferred embodiments thereof;
[ resin composition ]
The resin composition of the present invention contains, as essential components, (a) a thermoplastic resin, (B) a hygroscopic filler, and (C) a plate-like filler, and has a water content of 1500ppm or less.
< (A) thermoplastic resin
The thermoplastic resin (hereinafter also referred to as component (a)) used in the present invention may be used without particular limitation, and examples thereof include polyolefin resins, polyester resins, cycloolefin resins, phenoxy resins, polyvinyl acetal resins, polyimide resins, polyamideimide resins, polyethersulfone resins, polysulfone resins, and (meth) acrylic resins. Among these, polyolefin resins are preferred in view of adhesiveness and resistance to adhesive moisture and heat. These thermoplastic resins may be used alone in 1 kind, or 2 or more kinds may be used in combination.
(polyolefin resin)
The polyolefin-based resin usable in the present invention is not particularly limited as long as it has a skeleton derived from an olefin monomer. Examples of known polyolefin-based resins include those described in patent documents 1 and 2. The polyolefin resin is preferably a polyethylene resin, a polypropylene resin, a polybutene resin, or a polyisobutylene resin. These polyolefin resins may be homopolymers, copolymers such as random copolymers and block copolymers. Examples of the copolymer include a copolymer of 2 or more kinds of olefins and a copolymer of an olefin and a monomer other than olefins such as a non-conjugated diene and styrene. Examples of preferable copolymers include ethylene-nonconjugated diene copolymers, ethylene-propylene-nonconjugated diene copolymers, ethylene-butene copolymers, propylene-butene-nonconjugated diene copolymers, styrene-isobutylene-styrene copolymers, and the like. As the polyolefin resin, for example, an isobutylene-modified resin described in international publication No. 2011/62167, a styrene-isobutylene-modified resin described in international publication No. 2013/108731, and the like can be preferably used.
The polyolefin resin preferably contains a polyolefin resin having an acid anhydride group (i.e., carbonyloxycarbonyl group (-CO-O-CO-)) and/or a polyolefin resin having an epoxy group, from the viewpoint of imparting excellent physical properties such as adhesiveness and resistance to moist heat of adhesion. Examples of the acid anhydride group include a group derived from succinic anhydride, a group derived from maleic anhydride, and a group derived from glutaric anhydride. The acid anhydride group may have 1 or 2 or more. The polyolefin resin having an acid anhydride group can be obtained by, for example, graft-modifying a polyolefin resin with an unsaturated compound having an acid anhydride group under radical reaction conditions. In addition, the unsaturated compound having an acid anhydride group may be subjected to radical copolymerization together with an olefin or the like. Similarly, the polyolefin resin having an epoxy group can be obtained by graft-modifying a polyolefin resin with an unsaturated compound having an epoxy group such as glycidyl (meth) acrylate, 4-hydroxybutyl acrylate glycidyl ether, or allyl glycidyl ether under a radical reaction condition. In addition, an unsaturated compound having an epoxy group may be subjected to radical copolymerization together with an olefin or the like. The polyolefin resin may be used in 1 kind or 2 kinds or more, and a polyolefin resin having an acid anhydride group and a polyolefin resin having an epoxy group may be used in combination.
The concentration of the acid anhydride group in the polyolefin resin having an acid anhydride group is preferably 0.05 to 10mmol/g, and more preferably 0.1 to 5 mmol/g. The concentration of the acid anhydride group can be obtained from the value of the acid value defined as the mg number of potassium hydroxide required for neutralizing 1g of the acid present in the resin in accordance with JIS K2501. The amount of the polyolefin resin having an acid anhydride group in the polyolefin resin is preferably 0 to 70% by mass, and more preferably 10 to 50% by mass.
The concentration of epoxy groups in the polyolefin resin having epoxy groups is preferably 0.05 to 10mmol/g, more preferably 0.1 to 5 mmol/g. The epoxy group concentration can be determined from the epoxy equivalent obtained in accordance with JIS K7236-1995. The amount of the polyolefin resin having an epoxy group in the polyolefin resin is preferably 0 to 70% by mass, and more preferably 10 to 50% by mass.
The polyolefin-based resin particularly preferably contains both a polyolefin-based resin having an acid anhydride group and a polyolefin-based resin having an epoxy group, from the viewpoint of imparting excellent physical properties such as moisture permeation resistance. In such polyolefin-based resins, a crosslinked structure can be formed by reacting an acid anhydride group and an epoxy group by heating, and a sealant layer having excellent moisture permeation resistance and the like can be formed. The formation of the crosslinked structure may be performed after the sealing, but in the case of a sealing object such as an organic EL element which is weak against heat, for example, it is preferable to seal the object by using a sealing film and to form the crosslinked structure in advance at the time of manufacturing the sealing film. The ratio of the polyolefin resin having an acid anhydride group to the polyolefin resin having an epoxy group is not particularly limited as long as an appropriate crosslinked structure can be formed, and the molar ratio of the epoxy group to the acid anhydride group (epoxy group: acid anhydride group) is preferably 100:10 to 100:200, more preferably 100:50 to 100:150, and particularly preferably 100:90 to 100: 110.
The number average molecular weight of the polyolefin resin is not particularly limited, and is preferably 1,000,000 or less, more preferably 750,000 or less, even more preferably 500,000 or less, even more preferably 400,000 or less, even more preferably 300,000 or less, particularly preferably 200,000 or less, and most preferably 150,000 or less, from the viewpoint of providing a varnish of the resin composition with good coatability and good compatibility with other components in the resin composition. On the other hand, the number average molecular weight is preferably 1,000 or more, more preferably 3,000 or more, even more preferably 5,000 or more, even more preferably 10,000 or more, even more preferably 30,000 or more, and particularly preferably 50,000 or more, from the viewpoints of preventing the coating film from sagging (ハジキ) when the varnish of the resin composition is applied, imparting moisture permeation resistance to the formed resin composition layer, and improving the mechanical strength. The number average molecular weight in the present invention can be measured by Gel Permeation Chromatography (GPC) (in terms of polystyrene). The number average molecular weight obtained by the GPC method was specifically calculated by using LC-9A/RID-6A manufactured by Shimadzu corporation as a measuring apparatus, Shodex K-800P/K-804L/K-804L manufactured by Showa Denko K.K. as a column, toluene or the like as a mobile phase, at a column temperature of 40 ℃ and using a calibration curve of standard polystyrene.
The polyolefin-based resin in the present invention is preferably amorphous from the viewpoint of suppressing the decrease in fluidity due to the thickening of the varnish. The term "non-crystalline" as used herein means that the polyolefin resin does not have a definite melting point, and for example, a polyolefin resin in which no clear peak is observed when the melting point is measured by DSC (differential scanning calorimetry) of the polyolefin resin can be used.
Next, specific examples of the polyolefin-based resin will be described. Specific examples of the polyisobutylene resin include "OPPANOL B100" (viscosity-average molecular weight: 1,110,000) manufactured by BASF corporation and "B50 SF" (viscosity-average molecular weight: 400,000) manufactured by BASF corporation.
Specific examples of the polybutene-based resin include: "HV-1900" (polybutene, number average molecular weight: 2,900) manufactured by JX energy (JX エネルギー), "HV-300M" (modified product of maleic anhydride-modified liquid polybutene ("HV-300" (number average molecular weight: 1,400)) manufactured by Toho chemical industries, number average molecular weight: 2,100, number of carboxyl groups constituting an acid anhydride group: 3.2/1 molecule, acid value: 43.4mgKOH/g, acid anhydride group concentration: 0.77 mmol/g).
Specific examples of the styrene-isobutylene copolymer include: "SIBSTAR T102" (styrene-isobutylene-styrene block copolymer, number average molecular weight: 100,000, styrene content: 30% by mass) "manufactured by KANEKA, and" T-YP757B "(maleic anhydride-modified styrene-isobutylene-styrene block copolymer, acid anhydride group concentration: 0.464mmol/g, number average molecular weight: 100,000) manufactured by Star light PMC," T-YP766 "(glycidyl methacrylate-modified styrene-isobutylene-styrene block copolymer, epoxy group concentration: 0.638mmol/g, number average molecular weight: 100,000) manufactured by Star light PMC," T-YP8920 "(maleic anhydride-modified styrene-isobutylene-styrene copolymer, acid anhydride group concentration: 0.464mmol/g, number average molecular weight: 35,800) manufactured by Star light PMC," T-YP8930 "(glycidyl methacrylate-modified styrene-isobutylene-styrene copolymer, epoxy group concentration: 0.638mmol/g, number average molecular weight: 48,700).
Specific examples of the polyethylene resin or the polypropylene resin include: "EPT X-3012P" (ethylene-propylene-5-ethylidene-2-norbornene copolymer) manufactured by Mitsui chemical, "EPT 1070" (ethylene-propylene-dicyclopentadiene copolymer) manufactured by Mitsui chemical, and "TAFMERA 4085" (ethylene-butene copolymer) manufactured by Mitsui chemical.
Specific examples of the propylene-butene copolymer include: "T-YP 341" (glycidyl methacrylate-modified propylene-butene random copolymer, amount of butene units based on 100 mass% of the total of propylene units and butene units: 29 mass%, epoxy group concentration: 0.638mmol/g, number average molecular weight: 155,000), "T-YP 279" (maleic anhydride-modified propylene-butene random copolymer, amount of butene units based on 100 mass% of the total of propylene units and butene units: 36 mass%, acid anhydride group concentration: 0.464mmol/g, number average molecular weight: 35,000), "T-YP 276" (glycidyl methacrylate-modified propylene-butene random copolymer, amount of butene units based on 100 mass% of the total of propylene units and butene units: 36 mass%), epoxy group concentration: 0.638mmol/g, number average molecular weight: 57,000), T-YP312 (maleic anhydride-modified propylene-butene random copolymer, manufactured by starlight PMC corporation, amount of butene units based on 100 mass% of the total of propylene units and butene units: 29 mass%, acid anhydride group concentration: 0.464mmol/g, number average molecular weight: 60,900), manufactured by star PMC, "T-YP 313" (glycidyl methacrylate-modified propylene-butene random copolymer, the amount of butene units based on 100 mass% of the total of propylene units and butene units: 29 mass%, epoxy group concentration: 0.638mmol/g, number average molecular weight: 155,000), manufactured by star PMC, "T-YP 429" (maleic anhydride-modified ethylene-methyl methacrylate copolymer, the amount of methyl methacrylate units relative to 100 mass% of the total of ethylene units and methyl methacrylate units: 32 mass%, acid anhydride group concentration: 0.46mmol/g, number average molecular weight: 2,300), manufactured by starlight PMC corporation, "T-YP 430" (maleic anhydride-modified ethylene-methyl methacrylate copolymer, amount of methyl methacrylate units relative to 100 mass% of the total of ethylene units and methyl methacrylate units: 32 mass%, acid anhydride group concentration: 1.18mmol/g, number average molecular weight: 4,500), T-YP431 (glycidyl methacrylate-modified ethylene-methyl methacrylate copolymer, epoxy group concentration: 0.64mmol/g, number average molecular weight: 2,400), T-YP432 (glycidyl methacrylate-modified ethylene-methyl methacrylate copolymer, epoxy group concentration: 1.63mmol/g, number average molecular weight: 3,100).
The content of the component (a) in the resin composition of the present invention is not particularly limited. However, from the viewpoint of providing good coatability and compatibility and ensuring good moisture heat resistance and handling property (suppressing sticking), the content is preferably 80% by mass or less, more preferably 75% by mass or less, even more preferably 70% by mass or less, even more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less, relative to 100% by mass of the nonvolatile component of the resin composition. On the other hand, from the viewpoint of improving moisture permeation resistance and also improving transparency, the content is preferably 1% by mass or more, more preferably 3% by mass or more, even more preferably 5% by mass or more, even more preferably 7% by mass or more, even more preferably 10% by mass or more, particularly preferably 35% by mass or more, and most preferably 40% by mass or more, relative to 100% by mass of nonvolatile components in the resin composition.
(B) hygroscopic filler
The hygroscopic filler (hereinafter, also referred to as component (B)) used in the present invention is not particularly limited as long as it is a filler having hygroscopicity, and examples thereof include metal oxides such as calcium oxide, magnesium oxide, and calcined hydrotalcite, and layered metal hydroxides such as semi-calcined hydrotalcite. As the hygroscopic filler, calcined hydrotalcite, semi-calcined hydrotalcite, and calcium oxide are preferable, and semi-calcined hydrotalcite is particularly preferable. Although the semi-calcined hydrotalcite is excellent in moisture absorption performance, the problem of deterioration of the organic EL element due to moisture trapping is also significant, but in the present invention, since the trapped moisture can be suppressed from reaching the organic EL element by the plate-like filler, the moisture absorption performance of the semi-calcined hydrotalcite can be sufficiently exhibited, and thus a resin composition particularly preferable from the viewpoint of moisture barrier properties can be obtained. These hygroscopic fillers may be used alone in 1 kind, or 2 or more kinds may be used in combination. The hygroscopic filler in the present invention is a filler having a saturated water absorption rate of 1 mass% or more as defined below.
The uncalcined hydrotalcite may be, for example, a natural hydrotalcite (Mg)6Al2(OH)16CO3·4H2O) or the like, e.g., a metal hydroxide having a layered crystal structure, e.g., a layer [ Mg ] serving as a basic skeleton1-XAlX(OH)2]X+And an intermediate layer [ (CO)3)X/2·mH2O]X-And (4) forming. The uncalcined hydrotalcite in the present invention is a concept of a hydrotalcite-like compound including synthetic hydrotalcite and the like. Examples of the hydrotalcite-like compound include compounds represented by the following formula (I) and the following formula (II).
[M2+ 1-xM3+x(OH)2]x+·[(An-)x/n·mH2O]x- (I)
(in the formula, M2+Represents Mg2+、Zn2+Metal ion of equivalent valence 2, M3+Represents Al3+、Fe3+Aliovalent 3 valent metal ion, An-Represents CO3 2-、Cl-、NO3 -The anion with the valence of n is equal to the anion, x is more than 0 and less than 1, m is more than or equal to 0 and less than 1, and n is a positive number. )
In the formula (I), M2+Preferably Mg2+，M3+Preferably Al3+，An-Preferably CO3 2-。
M2+ xAl2(OH)2x+6-nz(An-)z·mH2O (II)
(in the formula, M2+Represents Mg2+、Zn2+Aliovalent 2-valent metal ion, An-Represents CO3 2-、Cl-、NO3 -An n-valent anion, x is a positive number of 2 or more, z is a positive number of 2 or less, m is a positive number, and n is a positive number. )
In the formula (II), M2+Preferably Mg2+，An-Preferably CO3 2-。
The semi-calcined hydrotalcite is a metal hydroxide having a layered crystal structure, which is obtained by calcining an uncalcined hydrotalcite and in which the amount of interlayer water is reduced or eliminated. The term "interlayer water" as used herein means "H" described in the above-mentioned compositional formula of the uncalcined natural hydrotalcite and hydrotalcite-like compound2O”。
On the other hand, calcined hydrotalcite is a metal oxide having an amorphous structure, which is obtained by calcining uncalcined hydrotalcite or semi-calcined hydrotalcite and in which not only interlayer water but also hydroxyl groups are eliminated by condensation dehydration.
Uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by saturated water absorption. The saturated water absorption of the semi-calcined hydrotalcite is 1 mass% or more and less than 20 mass%. On the other hand, the non-calcined hydrotalcite has a saturated water absorption of less than 1 mass%, and the calcined hydrotalcite has a saturated water absorption of 20 mass% or more.
The "saturated water absorption" in the present invention means: the rate of increase in mass relative to the initial mass after measuring the initial mass using a scale weighing 1.5g of uncalcined hydrotalcite, semi-calcined hydrotalcite or calcined hydrotalcite and leaving the mixture to stand for 200 hours in a small environmental tester (SH-222 manufactured by ESPEC) set at atmospheric pressure, a temperature of 60 ℃ and a relative humidity of 90%, can be determined by the following formula (i):
saturated water absorption (mass%) is 100 × (mass after moisture absorption-initial mass)/initial mass (i).
The saturated water absorption of the semi-calcined hydrotalcite is preferably 3 mass% or more and less than 20 mass%, more preferably 5 mass% or more and less than 20 mass%.
The uncalcined hydrotalcite, the half-calcined hydrotalcite and the calcined hydrotalcite can be distinguished from each other by the thermogravimetric analysis-measured thermogravimetric weight loss ratio (thermogravimetric reduction ratio). The thermal weight loss rate of the semi-calcined hydrotalcite at 280 ℃ is less than 15 mass%, and the thermal weight loss rate thereof at 380 ℃ is 12 mass% or more. On the other hand, the thermal weight loss rate of the uncalcined hydrotalcite at 280 ℃ is 15 mass% or more, and the thermal weight loss rate of the calcined hydrotalcite at 380 ℃ is less than 12 mass%.
For thermogravimetric analysis, 5mg of hydrotalcite was weighed in an aluminum sample tray and heated from 30 ℃ to 550 ℃ at a heating rate of 10 ℃ per minute in an atmosphere with a nitrogen flow rate of 200 mL/minute in an open state without lid using TG/DTA EXSTAR6300 manufactured by Hitachi High-Tech Science. The thermal weight loss ratio can be determined by the following formula (ii):
the thermal weight loss ratio (mass%) was 100 × (mass before heating-mass at a predetermined temperature)/mass before heating (ii).
The uncalcined hydrotalcite, semi-calcined hydrotalcite and calcined hydrotalcite can be distinguished from each other by the peak and relative intensity ratio measured by powder X-ray diffraction. The semi-calcined hydrotalcite exhibits a peak split into 2 peaks in the vicinity of 8-18 DEG 2 [ theta ] by powder X-ray diffraction, or exhibits a peak having a shoulder peak by synthesis of two peaks, and the relative intensity ratio (low-angle side diffraction intensity/high-angle side diffraction intensity) between the diffraction intensity of a peak or shoulder peak appearing on the low-angle side (low-angle side diffraction intensity) and the diffraction intensity of a peak or shoulder peak appearing on the high-angle side (high-angle side diffraction intensity) is 0.001-1,000. On the other hand, the uncalcined hydrotalcite has only one peak in the vicinity of 8 to 18 °, or the relative intensity ratio of the diffraction intensity of the peak or shoulder appearing on the low angle side to the peak or shoulder appearing on the high angle side is out of the above range. The calcined hydrotalcite has no characteristic peak in the region of 8 ° to 18 ° and has a characteristic peak at 43 °. For the powder X-ray diffraction measurement, a powder X-ray diffraction apparatus (Empyrean, manufactured by PANALYTIC CORPORATION) was used, and the counter cathode was a counter cathode
Figure BDA0003282004300000081
Under the conditions that the voltage is 45V, the current is 40mA, the sampling width is 0.0260 degree, the scanning speed is 0.0657 degrees/s, and the diffraction angle range (2 theta) is 5.0131-79.9711 degrees. The peak search (peak search) can utilize the peak search function of the software attached to the diffraction device, and the minimum significance is 0.50, the minimum peak point is 0.01 degrees, the maximum peak point is 1.00 degrees,Peak base line width was 2.00 °, and the method was the minimum value of the second order differential ".
The BET specific surface area of the hydrotalcite is preferably 1 to 250m2A concentration of 5 to 200m2(ii) in terms of/g. The BET specific surface area of hydrotalcite can be calculated by a BET multipoint method by adsorbing nitrogen gas on the surface of a sample using a specific surface area measuring apparatus (Macsorb HM Model 1210, manufactured by MOUNTECH) according to the BET method.
The average particle diameter of the hydrotalcite is preferably 1 to 1,000nm, and more preferably 10 to 800 nm. The average particle diameter of hydrotalcite is a median particle diameter of a particle size distribution obtained by measuring the particle size distribution by laser diffraction scattering method (JIS Z8825) and preparing the particle size distribution on a volume basis.
As the hydrotalcite, hydrotalcite surface-treated with a surface treatment agent can be used. As the surface treatment agent used for the surface treatment, for example, higher fatty acids, alkylsilanes, silane coupling agents, and the like can be used, and among them, higher fatty acids and alkylsilanes are preferable. The surface treatment agent may be used in 1 kind or 2 kinds or more.
Examples of the higher fatty acid include higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid, palmitic acid, and the like, and among them, stearic acid is preferable. 1 or 2 or more of them may be used.
Examples of the alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, and n-octadecyldimethyl (3- (trimethoxysilyl) propyl) ammonium chloride. 1 or 2 or more of them may be used.
Examples of the silane coupling agent include epoxy silane coupling agents such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyl (dimethoxy) methylsilane and 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane; amino silane coupling agents such as 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane; ureido silane coupling agents such as 3-ureidopropyltriethoxysilane; vinyl silane coupling agents such as vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethyldiethoxysilane; styrene-based silane coupling agents such as p-styryltrimethoxysilane; acrylate-based silane coupling agents such as 3-acryloxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatopropyltrimethoxysilane, and sulfide-based silane coupling agents such as bis (triethoxysilylpropyl) disulfide and bis (triethoxysilylpropyl) tetrasulfide; phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazolesilane, triazinesilane and the like. 1 or 2 or more of them may be used.
The surface treatment of hydrotalcite may be carried out, for example, by: while stirring and dispersing the untreated hydrotalcite at room temperature by a mixer, the surface treatment agent is added by spraying and stirred for 5 to 60 minutes. As the mixer, a known mixer can be used, and examples thereof include a mixer such as a V-type mixer (blender), a ribbon mixer (ribbon blender), and a double cone mixer (バブルコーンブレンダー), a mixer such as a Henschel mixer (Henschel mixer) and a concrete mixer, a ball mill, a chopper mill (chopper mill), and the like. When the hydrotalcite is pulverized by a ball mill or the like, the above-mentioned higher fatty acid, alkylsilane, or silane coupling agent may be added to perform surface treatment. The amount of the surface treatment agent to be used varies depending on the kind of hydrotalcite, the kind of the surface treatment agent, and the like, and is preferably 1 to 10 parts by mass based on 100 parts by mass of hydrotalcite without surface treatment. In the present invention, the hydrotalcite subjected to surface treatment is also included in the "hydrotalcite" in the present invention.
The content of the component (B) in the resin composition of the present invention is not particularly limited as long as the effects of the present invention can be exerted, and is preferably 10% by mass or more and 80% by mass or less, more preferably 15% by mass or more and 75% by mass or less, and further more preferably 20% by mass or more and 70% by mass or less with respect to 100% by mass of the nonvolatile component of the resin composition. (B) When the content of the component (b) is 10% by mass or more, the moisture absorption performance can be more effectively exhibited. Further, by setting the content of the component (B) to 80% by mass or less, film formability in film formation, adhesion performance of the resin composition, surface smoothness and the like can be further improved.
(C) plate-like packing
The plate-like filler (hereinafter, also referred to as component (C)) used in the present invention is not particularly limited as long as the effect of the present invention is exhibited, and the plate-like filler (C) in the present invention does not include the hygroscopic filler (B). That is, the plate-like filler (C) in the present invention is a plate-like filler having a saturated water absorption of less than 1 mass%. Examples of the plate-like filler (C) include plate-like glasses (e.g., a glass, C glass, and E glass), uncalcined hydrotalcite, and layered silicate minerals. Examples of the layered silicate mineral include: kaolinite, halloysite (halloysite), talc, smectites, mica, and the like. Among the mica, synthetic fluorophlogopite is preferable from the viewpoint of excellent transparency. The plate-like filler is preferably a plate-like glass, an uncalcined hydrotalcite, a smectite, or a synthetic fluorophlogopite, in view of having a high particle diameter-to-thickness ratio (aspect ratio), exhibiting moisture barrier properties, and excellent transparency. These plate-like fillers may be used alone in 1 kind, or 2 or more kinds may be used in combination.
The content of the component (C) in the resin composition of the present invention is not particularly limited as long as the effects of the present invention can be exerted, and is preferably 10% by mass or more and 80% by mass or less, and more preferably 30% by mass or more and 70% by mass or less, relative to 100% by mass of the nonvolatile component of the resin composition. When the content of the component (C) is 10% by mass or more, the effect of the moisture barrier property can be more effectively exhibited. Further, by setting the content of the component (C) to 80% by mass or less, film formability in film formation, adhesion performance of the resin composition, surface smoothness and the like can be further improved.
The plate-like filler preferably has an average particle diameter to thickness ratio (average particle diameter/average thickness) of 2 or more, more preferably 5 or more. By setting the average particle diameter/thickness ratio to 2 or more, the low moisture permeability can be more effectively exhibited.
The average thickness of the plate-like filler is preferably 0.01 to 20 μm, more preferably 0.05 to 10 μm.
The average thickness of the plate-like filler can be measured by the following method. The thickness of each of the 100 particles was measured using a Scanning Electron Microscope (SEM), and the average value of the measured values was calculated. In this case, each particle can be observed and measured by a scanning electron microscope, the resin is filled with the filler (particle group), molding is performed, the molded article is fractured, and the fracture surface can be observed and measured. In any of the measurement methods, the specimen stage of the scanning electron microscope is adjusted by the specimen stage fine-moving device so that the cross section (thickness plane) of the particle becomes perpendicular to the irradiation electron beam axis of the scanning electron microscope.
The average particle diameter of the plate-like filler is preferably 0.05 μm or more, more preferably 0.1 μm or more, and still more preferably 0.2 μm or more. From the viewpoint of transparency, the thickness is preferably 200 μm or less, more preferably 150 μm or less, and still more preferably 100 μm or less.
The average particle diameter of the plate-like filler can be measured by a laser diffraction-scattering method based on Mie scattering theory. Specifically, the measurement can be performed by: the particle size distribution of the filler was prepared on a volume basis by using a laser diffraction particle size distribution measuring apparatus, and the median particle size was defined as an average particle size. As the measurement sample, a product obtained by dispersing a filler in water using ultrasonic waves can be preferably used. As the laser diffraction scattering type particle size distribution measuring apparatus, LA-500 manufactured by horiba, Ltd can be used.
The mass ratio of the hygroscopic filler to the plate-like filler (hygroscopic filler: plate-like filler) in the resin composition of the present invention is not particularly limited as long as the effects of the present invention can be exerted, and is preferably 10:1 to 1:5, more preferably 8:1 to 1:4, and further preferably 5:1 to 1:2.5, from the viewpoint of high moisture barrier property.
The resin composition of the present invention may contain a filler other than the hygroscopic filler and the plate-like filler, within a range not impairing the effects of the present invention. Examples of the filler other than the hygroscopic filler and the plate-like filler include inorganic fillers such as silica, alumina, barium sulfate, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium zirconate, calcium zirconate, and silicate, organic fillers such as rubber particles, silicone powder, nylon powder, and fluororesin powder. The content of the filler other than the hygroscopic filler and the plate-like filler is preferably 50 mass% or less, more preferably 30 mass% or less, even more preferably 20 mass% or less, and even more preferably 10 mass% or less, assuming that the total amount of the hygroscopic filler and the plate-like filler is 100 mass%.
(D) an adhesion promoter
The resin composition of the present invention may further contain an adhesion promoter (hereinafter, also referred to as component (D)). The tackifier is also called a thickener (tagrifier) and is a resin that is blended into a plastic polymer to impart tackiness. The tackifier is not particularly limited, and a terpene resin, a modified terpene resin (hydrogenated terpene resin, terpene-phenol copolymer resin, aromatic modified terpene resin, etc.), coumarone resin, indene resin, petroleum resin (aliphatic petroleum resin, hydrogenated alicyclic petroleum resin, aromatic petroleum resin, aliphatic-aromatic copolymer petroleum resin, alicyclic petroleum resin, dicyclopentadiene petroleum resin, hydrogenated products thereof, etc.) are preferably used.
Examples of commercially available products that can be used as the tackifier include the following commercially available products. Examples of the terpene Resin include YS Resin PX and YS Resin PXN (both manufactured by Yasuhara Chemical Co., Ltd.), examples of the aromatic modified terpene Resin include YS Resin TO and TR series (both manufactured by Yasuhara Chemical Co., Ltd.), examples of the hydrogenated terpene Resin include CLEARON P, CLEARON M and CLEARON K series (both manufactured by Yasuhara Chemical Co., Ltd.), examples of the terpene phenol copolymer Resin include YS POLYSTER 2000, POLYSTER U, POLYSTER T, POLYSTER S and MightyAce G (both manufactured by Yasuhara Chemical Co., Ltd.), examples of the hydrogenated alicyclic petroleum Resin include Escorez5300 series and 5600 series (both manufactured by Exxon Mobil Co., Ltd.), examples of the aromatic petroleum Resin include ENDEX155 (manufactured by Eyman Chemical Co., Ltd.), and examples of the aliphatic copolymer petroleum Resin include Quonon 1325 and Quinone (Quinone, and others, Quintone1345 (all manufactured by Raynaud corporation, Japan) and the like, and examples of the saturated hydrocarbon resin include ARKON P100, ARKON P125, ARKON P140, TFS13-030 (all manufactured by Seikagaku corporation), and the like.
The softening point of the tackifier is preferably 50 to 200 ℃, more preferably 90 to 180 ℃, and even more preferably 100 to 150 ℃ from the viewpoint that the sheet is softened and has desired heat resistance in the laminating step of the resin composition sheet. The softening point can be measured by the ring and ball method in accordance with JIS K2207.
The viscosity-imparting agent may be used in 1 kind or in combination of 2 or more kinds. The content of the tackifier in the resin composition is not particularly limited. However, in the case of using the tackifier, the content thereof is preferably 80% by mass or less, more preferably 60% by mass or less, further preferably 50% by mass or less, and particularly preferably 40% by mass or less with respect to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of maintaining good moisture permeability resistance of the resin composition. On the other hand, in the case of using an adhesion promoter, the content thereof is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 15% by mass or more, based on 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of having sufficient adhesiveness.
Among them, petroleum resins are preferred from the viewpoint of the adhesiveness, moisture permeation resistance, transparency, and the like of the resin composition. As the petroleum resin, there are used,examples thereof include aliphatic petroleum resins, aromatic petroleum resins, aliphatic aromatic copolymer petroleum resins, alicyclic petroleum resins, and the like. Among them, aromatic petroleum resins, aliphatic aromatic copolymer petroleum resins, and alicyclic petroleum resins are more preferable from the viewpoints of adhesion, moisture permeation resistance, compatibility, and the like of the resin composition. In addition, from the viewpoint of improving transparency, an alicyclic petroleum resin is particularly preferable. As the alicyclic petroleum resin, a product obtained by hydrotreating an aromatic petroleum resin may be used. In this case, the hydrogenation ratio of the alicyclic petroleum resin is preferably 30 to 99%, more preferably 40 to 97%, and still more preferably 50 to 90%. If the hydrogenation ratio is too low, the transparency tends to be deteriorated by coloring, and if the hydrogenation ratio is too high, the production cost tends to be increased. The hydrogenation rate being determined by the hydrogen of the aromatic ring before and after hydrogenation1The ratio of the peak intensities in H-NMR was determined. As the alicyclic petroleum resin, a hydrogenated petroleum resin containing a cyclohexane ring and a dicyclopentadiene hydrogenated petroleum resin are particularly preferable. The petroleum resin may be used in 1 kind or in combination of 2 or more kinds. The number average molecular weight Mn of the petroleum resin is preferably 100 to 2,000, more preferably 700 to 1,500, and further preferably 500 to 1,000.
(E) curing agent
The resin composition of the present invention may further contain a curing agent (hereinafter, also referred to as component (E)) from the viewpoint of improving the curability of the resin composition. The curing agent is not particularly limited, and examples thereof include amine-based curing agents, guanidine-based curing agents, imidazole-based curing agents, phosphonium-based curing agents, and phenol-based curing agents. The curing agent may be used in 1 kind or in combination of 2 or more kinds.
The amine-based curing agent is not particularly limited, and examples thereof include: quaternary ammonium salts such as tetramethylammonium bromide and tetrabutylammonium bromide; diazabicyclo compounds such as DBU (1, 8-diazabicyclo [5.4.0] undecene-7), DBN (1, 5-diazabicyclo [4.3.0] nonene-5), DBU-phenolate, DBU-octanoate, DBU-p-toluenesulfonate, DBU-formate, and DBU-phenolnovolak resin salts; tertiary amines such as benzyldimethylamine, 2- (dimethylaminomethyl) phenol, and 2,4, 6-tris (diaminomethyl) phenol (TAP), and salts thereof, and dimethylurea compounds such as aromatic dimethylurea, aliphatic dimethylurea, and aromatic dimethylurea; and the like. 1 kind of them may be used or 2 or more kinds may be used in combination.
The guanidine-based curing agent is not particularly limited, and examples thereof include: dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5, 7-triazabicyclo [4.4.0] dec-5-ene, 7-methyl-1, 5, 7-triazabicyclo [4.4.0] dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecyl biguanide, 1-dimethylbiguanide, 1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide and the like. 1 kind of them may be used or 2 or more kinds may be used in combination.
The imidazole-based curing agent is not particularly limited, and examples thereof include: 1H-imidazole, 2-methyl-imidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methyl-imidazole, 2-phenyl-4, 5-bis (hydroxymethyl) -imidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-imidazole, 2-dodecyl-imidazole, 2-heptadecylimidazole, 1, 2-dimethyl-imidazole, and the like. 1 kind of them may be used or 2 or more kinds may be used in combination.
The phosphonium-based curing agent is not particularly limited, and examples thereof include: triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl) triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like. 1 kind of them may be used or 2 or more kinds may be used in combination.
The kind of the phenolic curing agent is not particularly limited, and there may be mentioned: phenol-based curing agents having a triazine skeleton, phenol novolak (phenol novolak) curing agents having a triazine skeleton, MEH-7700, MEH-7810, MEH-7851 (manufactured by Minghu chemical Co., Ltd.), NHN, CBN, GPH (manufactured by Nippon chemical Co., Ltd.), SN170, SN180, SN190, SN475, SN485, SN495, SN375, SN395 (manufactured by Nippon Steel chemical Co., Ltd.), TD2090 (manufactured by DIC Co., Ltd.), and the like. Specific examples of the phenol-based curing agent having a triazine skeleton include LA3018 (manufactured by DIC). Specific examples of the triazine skeleton-containing phenol novolak curing agent include LA7052, LA7054, and LA1356 (available from DIC corporation). 1 kind of them may be used or 2 or more kinds may be used in combination.
The content of the curing agent in the resin composition of the present invention is not particularly limited. However, in the case of using the curing agent, the content thereof is preferably 5% by mass or less, more preferably 1% by mass or less, with respect to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of preventing a decrease in moisture permeation resistance. On the other hand, in the case of using the curing agent, the content thereof is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, with respect to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of suppressing the tack (tack).
< (F) resin having functional group reactive with epoxy group
In the case where a polyolefin resin having an epoxy group is used as the component (a) in the resin composition of the present invention, it is preferable to use a resin (F) having a functional group reactive with an epoxy group (hereinafter, may be simply referred to as the "component (F)") as the component for forming a crosslinked structure with the component (a). Examples of the functional group reactive with an epoxy group include a hydroxyl group, a phenolic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride group is preferable. Examples of the acid anhydride group include a group derived from succinic anhydride, a group derived from maleic anhydride, and a group derived from glutaric anhydride. Examples of the resin include polyolefin resins (excluding the polyolefin resin having an acid anhydride group as the component (a)), acrylic resins, melamine resins, phenol resins, urea resins, polyester resins, alkyd resins, polyurethane resins, polyimide resins, and the like, and polyolefin resins are preferable. The polyolefin resin as the component (F) is not an acid anhydride group but has a hydroxyl group, a phenolic hydroxyl group, an amino group, a carboxyl group, and the like, and other functional groups are the same as those of the above-mentioned component (a), and polybutene is preferable.
The content of the component (F) in the resin composition of the present invention is not particularly limited. However, in the case of using the component (F), the content thereof is preferably 30% by mass or less, more preferably 20% by mass or less, with respect to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of preventing the decrease in moisture permeability resistance. On the other hand, in the case of using the component (F), the content thereof is preferably 5% by mass or more, more preferably 10% by mass or more, relative to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of suppressing the sticking.
< (G) resin having functional group reactive with acid anhydride group
In the case where a polyolefin resin having an acid anhydride group is used as the component (a) in the resin composition of the present invention, it is preferable to use a resin (G) having a functional group reactive with an acid anhydride group (hereinafter, may be simply referred to as the "component (G)") as the component for forming a crosslinked structure with the component (a). Examples of the functional group reactive with an acid anhydride group include a hydroxyl group, a primary or secondary amino group, a thiol group, an epoxy group, and an oxetanyl group, and an epoxy group is preferable. Examples of the resin include polyolefin resins (excluding the polyolefin resin having an epoxy group as the component (a)), acrylic resins, melamine resins, phenol resins, urea resins, polyester resins, alkyd resins, polyurethane resins, polyimide resins, and the like, and polyolefin resins are preferable. The polyolefin resin as the component (G) is the same as the above-mentioned polyolefin resin as the component (a), and preferably polybutene is used, except that the functional group is not an epoxy group, and includes a hydroxyl group, a primary or secondary amino group, a thiol group, an epoxy group, an oxetane group, and the like.
The content of the component (G) in the resin composition of the present invention is not particularly limited. However, in the case of using the component (G), the content thereof is preferably 30% by mass or less, more preferably 20% by mass or less, relative to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of preventing a decrease in moisture permeation resistance. On the other hand, in the case of using the component (G), the content thereof is preferably 5% by mass or more, more preferably 10% by mass or more, relative to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of suppressing the sticking.
(H) plasticizer
The resin composition of the present invention may further contain (H) a plasticizer (hereinafter, may be simply referred to as "(H) component"). By using the component (H), the flexibility and moldability of the resin composition can be improved. The component (H) is not particularly limited, and a material which is liquid at room temperature can be preferably used. Specific examples of the plasticizer include: and liquid polyalphaolefins such as paraffin process oil, naphthene process oil, liquid paraffin, polyethylene wax, polypropylene wax, mineral oil such as vaseline, castor oil, cottonseed oil, rapeseed oil, soybean oil, palm oil, coconut oil, vegetable oil such as olive oil, liquid polybutene, hydrogenated liquid polybutene, liquid polybutadiene, and hydrogenated liquid polybutadiene. The plasticizer used in the present invention is preferably liquid polyalphaolefin, and particularly preferably liquid polybutadiene. The liquid polyalphaolefin is preferably a liquid polyalphaolefin having a low molecular weight from the viewpoint of adhesiveness, and a liquid polyalphaolefin having a weight average molecular weight of 500 to 5,000, and more preferably 1,000 to 3,000 is preferable. These plasticizers may be used alone in 1 kind, or in combination of 2 or more kinds. The term "liquid" as used herein means a state of a plasticizer at room temperature (25 ℃). When the component (H) is used, the content thereof is preferably 50% by mass or less with respect to 100% by mass of the nonvolatile component of the resin composition, from the viewpoint of not adversely affecting the organic EL element.
< other additives >
The resin composition of the present invention may optionally contain various additives other than the above-described components to such an extent that the effects of the present invention are not impaired. Examples of such additives include resins other than the above-mentioned component (a), component (F) and component (G) (for example, epoxy resins, urethane resins, acrylic resins, polyamide resins, etc.); thickeners such as Orben, Benton, and the like; silicon-based, fluorine-based, or polymer-based defoaming agents or leveling agents; adhesion imparting agents such as triazole compounds, thiazole compounds, triazine compounds, and porphyrin compounds; and so on.
< Water content >
The resin composition of the present invention has a water content of 1500ppm or less. The water content is preferably 1450ppm or less, more preferably 1400ppm or less. When the water content is more than 1500ppm, it becomes difficult to exhibit high moisture barrier properties. The water content can be calculated by the method described in the following examples.
< pressure sensitive adhesive >
The resin composition of the present invention is preferably a pressure-sensitive adhesive. The pressure-sensitive adhesive means an adhesive that adheres by applying a pressure for a short time at normal temperature, and is well known to those skilled in the art. The resin composition of the present invention is more preferably a pressure-sensitive adhesive containing (D) an adhesion promoter and having tackiness.
< method for producing resin composition >
The method for producing the resin composition of the present invention is not particularly limited, and examples thereof include: and a method of adding the compounding ingredients, adding a solvent if necessary, and mixing them using a kneading roll, a rotary mixer, or the like.
< use >)
The resin composition of the present invention can be used as a transparent member for a light transmitting portion and a light extracting portion of an optical semiconductor device having a light emitting element or a light receiving element such as an EL element (organic or inorganic), a high-luminance LED element, or a solar cell. For example, a cured film obtained from the resin composition of the present invention can be used as it is as a transparent panel or the like for forming a light transmitting portion or a light extracting portion. There is a general tendency that the term "panel" is used for an article having a high hardness (rigidity), and the term "film" or "sheet" is used for an article having a low hardness (rigidity), and the term "panel" is also used herein in the sense of an article having a high hardness (rigidity).
When the resin composition of the present invention is formed into a film, for example, a varnish (resin composition varnish) prepared by mixing the components of the resin composition and an organic solvent using a kneading roll, a rotary mixer, or the like is applied to a support subjected to a mold release treatment, and the organic solvent is removed from the varnish applied to the support by heating (blowing hot air or the like) and/or pressure reduction treatment using a known machine, whereby a resin composition formed into a film (hereinafter, also referred to as a "film-shaped resin composition") can be obtained.
As the support for the release-treated support, for example, polyolefins such as polyethylene, polypropylene, polyvinyl chloride and the like; a cycloolefin polymer; polyesters such as polyethylene terephthalate (hereinafter, may be abbreviated as "PET") and polyethylene naphthalate; a polycarbonate; plastic films (preferably PET films) such as polyimide, and metal foils such as aluminum foil, stainless steel foil, and copper foil. Examples of the release treatment of the support subjected to the release treatment include release treatment using a release agent such as a silicone resin-based release agent, an alkyd resin-based release agent, or a fluororesin-based release agent.
The solid content of the resin composition varnish is preferably 20 to 80% by mass, and more preferably 30 to 70% by mass.
The heating condition for removing the organic solvent from the varnish of the resin composition is not particularly limited, but is preferably about 50 to 130 ℃ for about 2 to 10 minutes.
Examples of the organic solvent include: ketones such as acetone, Methyl Ethyl Ketone (MEK), and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate, cellosolves such as cellosolve, carbitols such as butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. The organic solvent may be used alone in 1 kind, or 2 or more kinds may be used in combination.
The thickness of the film-like resin composition varies depending on the apparatus and the application position to which the film-like resin composition is applied, and is preferably in the range of 1 to 1000. mu.m, and more preferably in the range of 2 to 800. mu.m.
The film-shaped resin composition formed on the support is preferably protected with a protective film in advance in order to protect the resin composition before curing, and for example, a protective film subjected to a release treatment may be laminated in advance on the film-shaped resin composition formed on the support using a known machine. Examples of the machine for laminating the protective film include a roll laminator, a press machine, and a vacuum pressure type laminator.
As the protective film subjected to the mold release treatment, for example, a film formed of polyolefin such as polyethylene, polypropylene, polyvinyl chloride or the like; a cycloolefin polymer; polyesters such as polyethylene terephthalate (hereinafter, may be abbreviated as "PET") and polyethylene naphthalate; a polycarbonate; a plastic film (preferably a PET film) such as polyimide, or a support made of a metal foil such as aluminum foil, stainless steel foil, or copper foil, is subjected to a mold release treatment. Examples of the mold release treatment include mold release treatment using a mold release agent such as a silicone resin mold release agent, an alkyd resin mold release agent, or a fluororesin mold release agent.
< resin sheet >
The resin sheet of the present invention comprises a support and a resin composition layer comprising the resin composition of the present invention provided on the support.
< electronic device >
An electronic device in which an electronic element is sealed with the resin sheet of the present invention can be manufactured, for example, by laminating the resin sheet of the present invention on an electronic element on a substrate.
Examples
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to the following examples, and it goes without saying that the present invention can be carried out by appropriately changing the examples within a range that can be adapted to the gist described above and below, and all of them are included in the technical scope of the present invention. Unless otherwise specified, "parts" and "%" in the amounts of the components and the copolymerized units mean "parts by mass" and "% by mass", respectively.
The materials used in the examples and comparative examples are as follows.
(A) Composition (I)
"HV-1900" (manufactured by JX energy Co., Ltd.): polybutene having a number average molecular weight of 2,900
"HV-300M" (manufactured by Toho chemical industries Co., Ltd.): maleic anhydride-modified liquid polybutene having an acid anhydride group concentration of 0.77mmol/g and a number average molecular weight of 2,100
"T-YP 341" (manufactured by Star light PMC): glycidyl methacrylate-modified propylene-butene random copolymer (SWASOL solution, 20% solid content), propylene unit/butene unit of 71%/29%, epoxy group concentration of 0.638mmol/g, and number average molecular weight of 155,000
(B) Composition (I)
"DHT-4C" (manufactured by Kyowa chemical Co., Ltd.): semi-calcined hydrotalcite with average particle size of 400nm and BET specific surface area of 15m2/g
(C) Composition (I)
"PDM-5B" (manufactured by TOPY INDUSTRIAL CO., LTD.): synthetic fluorophlogopite having an average particle diameter of 5 μm and an average particle diameter to thickness ratio of 40 "FTD 010-F01" (manufactured by Nippon Steel works): plate-like glass filler having an average particle diameter of 10 μm and an average particle diameter to thickness ratio of 25
(D) Composition (I)
"ARKON P125" (manufactured by Okawa chemical Co., Ltd.): saturated hydrocarbon resin containing cyclohexane ring, softening point of 125 deg.C
(E) Composition (I)
2,4, 6-tris (diaminomethyl) phenol (hereinafter, abbreviated as "TAP") (manufactured by KayakuAkzo Co., Ltd.): an amine-based curing agent.
< example 1 >
Varnishes having the compounding ratios shown in table 1 below were prepared according to the following procedures. Maleic anhydride-modified liquid polybutene (HV-300M, manufactured by Toho chemical industries Co., Ltd.), polybutene (HV-1900, manufactured by JX energy Co., Ltd.), half-calcined hydrotalcite (hygroscopic filler; DHT-4C, manufactured by Kyowa chemical Co., Ltd.) and synthetic fluorophlogopite (plate-like filler; PDM-5B, manufactured by TOPY industries Co., Ltd.) were dispersed in a product obtained by dissolving a saturated hydrocarbon resin (tackifier; ARKON P125, manufactured by Takawa chemical Co., Ltd.) containing cyclohexane rings in SWASOL so that the solid content became 60% by using a three-roll mill to obtain a mixture. To the obtained mixture, a glycidyl methacrylate-modified propylene-butene random copolymer (T-YP341 manufactured by Astro PMC Co., Ltd., SWASOL solution, solid content 20%), an amine-based curing agent (TAP manufactured by Kayaku Akzo Co., Ltd.), and toluene were blended, and the obtained mixture was uniformly dispersed by a high-speed rotary mixer to obtain a varnish of a resin composition. The varnish thus obtained was uniformly applied to a release-treated surface of a PET film "SP 4020" (PET: 50 μm, trade name of Toyo Cloth Co., Ltd.) treated with a silicone-based release agent by a die coater, and heated at 130 ℃ for 30 minutes to obtain a resin sheet having a resin composition layer with a thickness of 25 μm, and then dried at 150 ℃ for 24 hours.
< example 2 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in example 1 except that a plate-like glass filler (FTD010-F01, manufactured by Nippon Denko Co., Ltd.) was used in place of synthetic fluorophlogopite (plate-like filler; PDM-5B, manufactured by TOPY industries).
< example 3 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in example 1, except that the amount of synthetic fluorophlogopite (plate-like filler; PDM-5B, manufactured by TOPY industries, Ltd.) was changed from 100 parts to 50 parts.
< example 4 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in example 1, except that the amount of synthetic fluorophlogopite (plate-like filler; PDM-5B, manufactured by TOPY industries, Ltd.) was changed from 100 parts to 150 parts.
< comparative example 1 >
Varnishes having the compounding ratios shown in table 1 below were prepared according to the following procedures. Maleic anhydride-modified liquid polybutene (HV-300M, manufactured by Toho chemical industries Co., Ltd.), polybutene (HV-1900, manufactured by JX energy Co., Ltd.) and half-calcined hydrotalcite (hygroscopic filler; DHT-4C, manufactured by Kyoho chemical Co., Ltd.) were dispersed in a product obtained by dissolving a saturated hydrocarbon resin (tackifier; ARKON P125) containing a cyclohexane ring in SWASOL so that the solid content became 60% by using a three-roll mill to obtain a mixture. To the obtained mixture, a glycidyl methacrylate-modified propylene-butene random copolymer (T-YP341 manufactured by Astro PMC Co., Ltd., SWASOL solution, solid content 20%), an anionic polymerization type curing agent (TAP manufactured by Kayaku Akzo Co., Ltd.), and toluene were blended, and the obtained mixture was uniformly dispersed by a high-speed rotary mixer to obtain a varnish of a resin composition. The varnish thus obtained was uniformly applied to a release-treated surface of a PET film "SP 4020" (PET: 50 μm, trade name of Toyo Cloth Co., Ltd.) treated with a silicone-based release agent by a die coater, and heated at 130 ℃ for 30 minutes to obtain a resin sheet having a resin composition layer with a thickness of 25 μm, and then dried at 150 ℃ for 24 hours.
< comparative example 2 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in comparative example 1 except that synthetic fluorophlogopite (plate-like filler; PDM-5B, manufactured by TOPY industries, Ltd.) was used in place of semi-calcined hydrotalcite (hygroscopic filler; DHT-4C, manufactured by Kyowa chemical Co., Ltd.).
< comparative example 3 >
Varnish of a resin composition and a resin sheet were produced in the same manner as in comparative example 1 except that a plate-like glass filler (FTD010-F01, manufactured by Nippon Denko Co., Ltd.) was used in place of semi-calcined hydrotalcite (hygroscopic filler; DHT-4C, manufactured by Kyowa chemical Co., Ltd.).
< comparative example 4 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in example 1, except that drying at 150 ℃ for 24 hours was not performed.
< comparative example 5 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in example 2, except that drying at 150 ℃ for 24 hours was not performed.
< comparative example 6 >
A varnish of a resin composition and a resin sheet were produced in the same manner as in example 1, except that the drying was performed at 150 ℃ for 24 hours and at 150 ℃ for 1 hour.
< evaluation of Total light transmittance >
The resin sheets prepared in examples and comparative examples were cut into a size of 50mm in length and 20mm in width, and the cut resin sheets were laminated on a glass plate (a microscope slide (slide glass) S1112 (manufactured by Songgao glass industries, Ltd.) having a length of 76mm, a width of 26mm and a thickness of 1.2 mm) using a batch vacuum laminator (V-160 manufactured by Nichigo-Morton Co., Ltd.) under a condition that a temperature was 80 ℃ and a decompression time was 30 seconds, and then the glass plate was pressed at a pressure of 0.3MPa for 30 seconds, and then the PET film of the resin sheet was peeled off, and an optical fiber spectrophotometer (MCPD-7700, model 311C, manufactured by Otsuka electronics, MC-2564(24V, 150W standard) equipped with integrating spheres having a diameter of 80mm (model SRS-99-010, a reflectance) was used, the light transmittance spectrum of the exposed cured resin composition layer was measured, and the total light transmittance (%) at a wavelength of 450nm was calculated and evaluated according to the following criteria. The distance between the integrating sphere and the sample (laminate) was set to 0mm, and glass was used as a reference;
good (∘): over 90 percent
Poor (x): less than 90%.
< determination of Ca sealing Performance >
Alkali-free glass of 50mm × 50mm square was washed with boiling isopropyl alcohol for 5 minutes and dried at 150 ℃ for 30 minutes or more. After washing, UV ozone washing was performed. Using this glass, calcium (purity: 99.8%) (thickness: 200nm) was vapor-deposited using a mask having a distance of 2mm from the end. The films prepared in examples and comparative examples were bonded to a PET-attached Al1N30 (aluminum foil: 30 μm, PET: 25 μm, trade name of Toyoyo aluminum Co., Ltd.) composite film, and bonded to alkali-free glass deposited with calcium in a glove box using a thermal laminator (ラミパッカー DAiSY A4(LPD2325) manufactured by FUJIPLA Co., Ltd.) to obtain a sample for evaluation.
When calcium comes into contact with water, it becomes calcium oxide, and becomes transparent. Therefore, the intrusion of moisture into the sample for evaluation can be evaluated by measuring the sealing distance x (mm) from the end portion to the calcium film of the sample for evaluation.
First, the sealing distance from the end of the sample for evaluation to the calcium film was measured by using Measuring Microscope MF-U manufactured by Mitutoyo corporation, and the value was X2.
Next, a sample for evaluation was put into a constant temperature and humidity chamber set at a temperature of 85 ℃ and a relative humidity of 85% RH. When "the sealing distance X1(mm) from the end to the calcium film of the sample for evaluation after the sample was put into the thermostatic and humidistatic cell" was increased by 0.1mm as compared with "the sealing distance X2(mm) from the end to the calcium film of the sample for evaluation before the sample was put into the thermostatic and humidistatic cell", the sample for evaluation was taken out from the thermostatic and humidistatic cell, and this time was defined as the reduction start time t (hour).
The constant K is calculated based on the following fick diffusion equation:
Figure BDA0003282004300000201
(in the formula, X1 represents the sealing distance (mm) from the end to the calcium film of the sample for evaluation after being charged into the thermostatic and humidistatic cell, t represents the time (hour) at which X1 is X2+0.1 and X2 represents the sealing distance (mm) from the end to the calcium film of the sample for evaluation before being charged into the thermostatic and humidistatic cell).
Using the obtained K, the time at which X became 2mm was calculated as the start time of the invasion of water into the calcium membrane. The higher the moisture barrier property is, the slower the moisture invasion speed is, and the longer the time for starting the moisture invasion is;
good (∘): over 120 hours
Poor (x): 120 hours or less.
< measurement of Water content >
The resin sheets prepared in examples and comparative examples were cut into a length of 70mm and a width of 40mm, folded, placed in a sufficiently dried quartz container, and placed in an electric furnace (VA-21 type, mitsubishi chemical) directly connected to a karl fisher tester (CA100 type, mitsubishi chemical). In N2In the gas flow, the temperature of the electric furnace was raised to 250 ℃, and the absolute amount of water desorbed from the measurement sample was measured by a conventional method by capturing the water in the Karl Fischer measurement solution. The water content (ppm) was calculated as the ratio of the absolute amount of water to the mass of the measurement sample.
The compositions and test results of the resin compositions of examples and comparative examples are shown in table 1 below. As is clear from table 1, the resin composition of the present invention can exhibit higher moisture barrier properties.
[ Table 1]
Figure BDA0003282004300000221
Industrial applicability
The resin composition of the present invention exhibits higher moisture barrier properties and is suitable for sealing parts of light-emitting elements such as organic EL elements, optical semiconductors such as high-brightness LEDs, light-receiving elements such as solar cells, and the like.
The present application is based on the Japanese laid-open application of Japanese patent application 2019 and 063027, the entire contents of which are included in the present specification.

Claims (13)

1. A resin composition comprising the following components (A) to (C):
(A) a thermoplastic resin,
(B) Hygroscopic filler, and
(C) the plate-shaped filler is filled in the filling material,
the resin composition has a water content of 1500ppm or less.
2. The resin composition according to claim 1, wherein the thermoplastic resin (A) is a polyolefin resin.
3. The resin composition according to claim 1 or 2, wherein the content of the (B) hygroscopic filler is 10% by mass or more and 80% by mass or less based on 100% by mass of the nonvolatile component of the resin composition.
4. The resin composition according to any one of claims 1 to 3, wherein the content of the (C) plate-like filler is 10% by mass or more and 80% by mass or less based on 100% by mass of nonvolatile components in the resin composition.
5. The resin composition according to any one of claims 1 to 4, wherein the mass ratio of the hygroscopic filler (B) to the plate-like filler (C), i.e., the ratio of the hygroscopic filler to the plate-like filler, is 10:1 to 1: 5.
6. The resin composition according to any one of claims 1 to 5, wherein the hygroscopic filler (B) is a semi-calcined hydrotalcite.
7. The resin composition according to any one of claims 1 to 6, wherein the plate-like filler (C) is at least one selected from the group consisting of plate-like glass, uncalcined hydrotalcite, smectite and synthetic fluorophlogopite.
8. The resin composition according to any one of claims 1 to 7, wherein the average particle diameter to thickness ratio of the plate-like filler (C) is 2 or more.
9. A resin sheet having:
a support, and
a resin composition layer comprising the resin composition according to any one of claims 1 to 8 provided on the support.
10. The resin sheet according to claim 9, which is used for sealing an electronic device.
11. The resin sheet according to claim 9, which is used for sealing an organic EL device.
12. An electronic device sealed with the resin sheet described in claim 9.
13. An organic EL device sealed with the resin sheet described in claim 9.
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