CN113629211A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN113629211A CN113629211A CN202110857216.XA CN202110857216A CN113629211A CN 113629211 A CN113629211 A CN 113629211A CN 202110857216 A CN202110857216 A CN 202110857216A CN 113629211 A CN113629211 A CN 113629211A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention provides a display panel, a preparation method thereof and a display device, wherein the display panel comprises a substrate, a luminescent material layer positioned on the substrate and a packaging structure positioned on the luminescent material layer, wherein an ultraviolet absorbent is added in the packaging structure, so that the damage of light in an ultraviolet band to luminescent materials below the packaging structure can be reduced, the damage capability of the light in the ultraviolet band to the display panel is reduced, the optical stability of the display panel after being irradiated by the sun is further improved, and the color temperature variation after being irradiated is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
Organic Light-Emitting Diode (OLED) display screens are used worldwide due to the advantages of high contrast, wide color gamut, fast response time and the like, and ultraviolet irradiation energy in different areas is different due to different latitudes and longitudes in different regions worldwide. In order to research the use limit of solar illumination experimental conditions of the OLED display screen, an artificial solar illumination experiment is often adopted to simulate the solar illumination service life of the OLED display screen.
It is known from the prior experience that the OLED display screen can destroy the luminescent material after being illuminated by the sun, thereby affecting the electric lamp characteristic of the display panel and the color temperature, for example, the color temperature is reduced, and the lighting color temperature of the OLED display screen is yellow after being illuminated by the sun.
Disclosure of Invention
The invention aims to provide a display panel, a preparation method thereof and a display device, and aims to reduce the damage capability of solar illumination on a luminescent material so as to increase the optical stability of the display panel after the solar illumination.
In one aspect, the present invention provides a display panel comprising:
a substrate;
a light emitting material layer on the substrate;
and the packaging structure is positioned on the luminescent material layer, and an ultraviolet absorbent is added in the packaging structure.
Further preferably, the package structure includes:
the sealing layer is positioned on the luminescent material layer, and the ultraviolet absorber is added into the sealing layer;
a lithium fluoride layer on the capping layer;
and the thin film packaging layer is positioned on the lithium fluoride layer.
Further preferably, the package structure includes:
a capping layer on the light emitting material layer;
a lithium fluoride layer on the capping layer, wherein the ultraviolet absorber is added in the lithium fluoride layer;
and the thin film packaging layer is positioned on the lithium fluoride layer.
Further preferably, the package structure includes:
a capping layer on the light emitting material layer;
a lithium fluoride layer on the capping layer;
and the film packaging layer is positioned on the lithium fluoride layer, and the ultraviolet absorbent is added into the film packaging layer.
Further preferably, the absorption band of the ultraviolet absorbent is 170-420 nm.
In another aspect, the present invention provides a method for manufacturing a display panel, including:
providing a substrate;
forming a light emitting material layer on the substrate;
and forming a packaging structure on the luminescent material layer, wherein an ultraviolet absorbent is added in the packaging structure.
Further preferably, the step of forming an encapsulation structure on the light emitting material layer includes:
forming a sealing cover layer on the luminescent material layer, wherein the ultraviolet absorber is added into the sealing cover layer;
forming a lithium fluoride layer on the capping layer;
a thin film encapsulation layer on the lithium fluoride layer.
Further preferably, the step of forming an encapsulation structure on the light emitting material layer includes:
forming a capping layer on the light emitting material layer;
forming a lithium fluoride layer on the capping layer, wherein the ultraviolet absorbent is added into the lithium fluoride layer;
a thin film encapsulation layer on the lithium fluoride layer.
Further preferably, the step of forming an encapsulation structure on the light emitting material layer includes:
forming a capping layer on the light emitting material layer;
forming a lithium fluoride layer on the capping layer;
and the ultraviolet absorber is added into the thin film packaging layer.
In still another aspect, the present invention provides a display device including:
the display panel of any of the above;
a polarizing plate on the display panel;
a cover plate on the polarizer.
The invention has the beneficial effects that: the display panel comprises a substrate, a luminescent material layer positioned on the substrate and a packaging structure positioned on the luminescent material layer, wherein an ultraviolet absorbent is added in the packaging structure, so that the damage of light in an ultraviolet band to the luminescent material below the packaging structure can be reduced, the damage capability of the light in the ultraviolet band to the display panel is reduced, the optical stability of the display panel after being irradiated by the sun is further improved, and the color temperature variation after being irradiated is reduced.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic molecular structure diagram of an ultraviolet absorber UV531 provided by the embodiment of the invention;
fig. 3 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, where the display panel 10 includes a substrate 11, a light emitting material layer 12 located on the substrate 11, and a package structure 13 located on the light emitting material layer 12, and an ultraviolet absorber is added in the package structure 13. In the present embodiment, the Encapsulation structure 13 includes a capping layer 131 (CPL) on the light emitting material layer 12, a lithium fluoride layer 132 on the capping layer 131, and a Thin Film Encapsulation layer 133 (TFE) on the lithium fluoride layer 132.
In this embodiment, the light emitting material layer 12 may include an anode on the substrate 11, a hole injection layer on the anode, a hole transport layer on the hole injection layer, a light emitting layer on the hole transport layer, an electron transport layer on the light emitting layer, an electron injection layer on the electron transport layer, and a cathode on the electron injection layer. The light emitting layer may include red, blue, and green sub-pixels. The light emitting material layer 12 may further include an electron blocking layer between the hole transport layer and the light emitting layer, and a hole blocking layer between the electron transport layer and the light emitting layer.
The anode is connected with the anode of the device, wherein the driving voltage is applied to the anode, a hole in the anode can move to a light emitting layer in the device under the driving of the driving voltage, the anode needs to have certain light transmittance when the device works, so that light emitted from the inside of the device can be observed by the outside, and the most commonly used material of the anode is ITO. The hole injection layer can modify the anode of the device and can smoothly inject holes from the anode into the hole transport layer. The hole transport layer serves to transport holes to the light emitting layer. The electron blocking layer blocks electrons from the cathode at the interface of the light emitting layer of the device, increasing the concentration of electrons at the interface of the light emitting layer of the device. The emissive layer is where the device electrons and holes recombine to form excitons which then de-excite to emit light. The hole blocking layer can block holes from the anode at the interface of the light emitting layer of the device, so that the recombination probability of electrons and holes at the interface of the light emitting layer of the device is improved, and the light emitting efficiency of the device is improved. The electron transport layer serves to transport electrons from the cathode into the light emitting layer of the device. The electron injection layer serves to modify the cathode and transport electrons to the electron transport layer. The electrons in the cathode will move towards the light-emitting layer of the device under the driving of the driving voltage applied to the device, and then recombine with the holes from the anode in the light-emitting layer.
In this embodiment, the capping layer 131 may be an organic liquid molecule, and the material of the thin film encapsulation layer 133 may be an organic substance. The ultraviolet absorber is added in the capping layer 131 to absorb light energy in an ultraviolet band. The ultraviolet absorbent is a light stabilizer, can absorb the ultraviolet part in sunlight and a fluorescent light source, does not change, and has the following characteristics: 1) can strongly absorb ultraviolet rays; 2) the thermal stability is good, the change caused by heating can not occur even in the processing process, and the thermal volatility is small; 3) the chemical stability is good, and adverse reaction with material components in the product is avoided; 4) the miscibility is good, and the water-soluble paint can be uniformly dispersed in materials, does not bloom and does not exude; 5) the photochemical stability of the absorbent is good, and the absorbent is not decomposed and discolored; 6) colorless, nontoxic and odorless; 7) soaking and washing resistance; 8) low cost and easy obtaining; 9) insoluble or poorly soluble in water. Ultraviolet absorbers are classified into salicylates, benzones, benzotriazoles, substituted acrylonitriles, triazines, and hindered amines according to their chemical structures.
In the present embodiment, the absorption band of the ultraviolet absorbent is preferably 170-420 nm. Further preferably, UV531 may be mixed with the capping layer 131, and the molecular structure of UV531 (2-hydroxy-4-n-octoxybenzophenone) is shown in FIG. 2, wherein UV531 can strongly absorb ultraviolet light with a wavelength of 240-340 nm. The experimental analysis revealed that the capping layer 131 had an extinction coefficient of 0.9 at 390nm and a transmittance of 10% at 380 nm. After the capping layer 131 is modified by adding the ultraviolet absorber (e.g., UV531), when the addition concentration of the UV531 is 0.5%, the extinction coefficient for 390nm light is 0.95, and the transmittance for 380nm light is 5%, after the ultraviolet absorber is added, the color temperature of the display panel 10 is increased by 60K after the display panel is illuminated, so that the addition of the ultraviolet absorber can increase the extinction coefficient, reduce the transmittance, and increase the color temperature (compared with the color temperature of the display panel without the ultraviolet absorber after being illuminated by the sun). Since the color temperature of the display panel 10 is reduced after the sun is illuminated, the color temperature of the display panel 10 can be reduced less after the ultraviolet absorber is added, namely, the color temperature variation is reduced.
Optionally, the ultraviolet absorber may be added to the lithium fluoride layer 132 or the thin film encapsulation layer 133, which may also reduce damage of solar illumination to the luminescent material layer 12 below, thereby improving stability of the luminescent material after solar illumination, and reducing color temperature variation of the display panel 10 after solar illumination.
In some embodiments, UV absorbers such as UV-P and UV770 may also be used to add to the package structure 13.
In the display panel 10 provided in the embodiment of the invention, the ultraviolet absorber is added in the encapsulation structure 13 (the capping layer 131, the lithium fluoride layer 132, or the thin film encapsulation layer 133) to absorb light energy in an ultraviolet band, so that the damage of light in an UV band to carrier mobility in the luminescent material layer 12 can be reduced, the optical stability of the luminescent material layer 12 under solar illumination and UV illumination is further ensured, and the color temperature variation of the display panel 10 under solar illumination is reduced.
Referring to fig. 3, fig. 3 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, where the method for manufacturing the display panel 10 includes the following steps S1-S3.
Step S1: a substrate 11 is provided.
In this embodiment, the substrate 11 may include a glass substrate and a flexible substrate on the glass substrate, and a Thin Film Transistor (TFT) may be formed on the flexible substrate.
Step S2: a light emitting material layer 12 is formed on the substrate 11.
Specifically, an anode, a hole injection layer on the anode, a hole transport layer on the hole injection layer, a light emitting layer on the hole transport layer, an electron transport layer on the light emitting layer, an electron injection layer on the electron transport layer, and a cathode on the electron injection layer may be sequentially formed on the substrate 11 by an evaporation process to form the light emitting material layer 12 on the substrate 11.
Step S3: and forming an encapsulation structure 13 on the luminescent material layer 12, wherein an ultraviolet absorbent is added into the encapsulation structure 13.
In this embodiment, the step of forming the package structure 13 may include: forming a capping layer 131 on the luminescent material layer 12, wherein the ultraviolet absorber is added in the capping layer 131; forming a lithium fluoride layer 132 on the capping layer 131; a thin film encapsulation layer 133 on the lithium fluoride layer 132. Specifically, the material of the capping layer 131 is organic liquid molecules, the ultraviolet absorber is a solid, and the material of the capping layer 131 and the ultraviolet absorber may be mixed first, and then the capping layer 131 with the ultraviolet absorber added may be formed on the light emitting material layer 12 by evaporation.
Optionally, the step of forming the package structure 13 may include: forming a capping layer 131 on the light emitting material layer 12; forming a lithium fluoride layer 132 on the capping layer 131, wherein the ultraviolet absorber is added to the lithium fluoride layer 132; a thin film encapsulation layer 133 on the lithium fluoride layer 132. Specifically, the ultraviolet absorber and the lithium fluoride are physically mixed, and then the lithium fluoride layer 132 to which the ultraviolet absorber is added is formed on the luminescent material layer 12 by evaporation.
Optionally, the step of forming the package structure 13 may include: forming a capping layer 131 on the light emitting material layer 12; forming a lithium fluoride layer 132 on the capping layer 131; and a thin film encapsulation layer 133 on the lithium fluoride layer 132, wherein the ultraviolet absorber is added into the thin film encapsulation layer 133.
According to the preparation method of the display panel 10 provided by the embodiment of the invention, the ultraviolet absorbent is added into the packaging structure 13, and the damage of solar illumination to the luminescent material can be reduced without increasing the film thickness of the display panel 10, so that the optical stability of the display panel 10 after solar illumination is increased, and the color temperature variation of the display panel 10 after solar illumination is reduced.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a display device 100 according to an embodiment of the present invention, where the display device 100 includes the display panel 10, a polarizer 14 located on the display panel 10, an optical adhesive layer 15 located on the polarizer 14, and a cover plate 16 located on the optical adhesive layer 15. The display device 100 provided by the embodiment of the invention has the same beneficial effects as the display panel 10, and the description thereof is omitted.
The above description of the embodiments is only for helping understanding the technical solution of the present invention and its core idea; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel, comprising:
a substrate;
a light emitting material layer on the substrate;
and the packaging structure is positioned on the luminescent material layer, and an ultraviolet absorbent is added in the packaging structure.
2. The display panel of claim 1, wherein the encapsulation structure comprises:
the sealing layer is positioned on the luminescent material layer, and the ultraviolet absorber is added into the sealing layer;
a lithium fluoride layer on the capping layer;
and the thin film packaging layer is positioned on the lithium fluoride layer.
3. The display panel of claim 1, wherein the encapsulation structure comprises:
a capping layer on the light emitting material layer;
a lithium fluoride layer on the capping layer, wherein the ultraviolet absorber is added in the lithium fluoride layer;
and the thin film packaging layer is positioned on the lithium fluoride layer.
4. The display panel of claim 1, wherein the encapsulation structure comprises:
a capping layer on the light emitting material layer;
a lithium fluoride layer on the capping layer;
and the film packaging layer is positioned on the lithium fluoride layer, and the ultraviolet absorbent is added into the film packaging layer.
5. The display panel of claim 1, wherein the absorption band of the UV absorber is 170-420 nm.
6. A method for manufacturing a display panel, comprising:
providing a substrate;
forming a light emitting material layer on the substrate;
and forming a packaging structure on the luminescent material layer, wherein an ultraviolet absorbent is added in the packaging structure.
7. The method according to claim 6, wherein the step of forming an encapsulation structure on the light-emitting material layer comprises:
forming a sealing cover layer on the luminescent material layer, wherein the ultraviolet absorber is added into the sealing cover layer;
forming a lithium fluoride layer on the capping layer;
a thin film encapsulation layer on the lithium fluoride layer.
8. The method according to claim 6, wherein the step of forming an encapsulation structure on the light-emitting material layer comprises:
forming a capping layer on the light emitting material layer;
forming a lithium fluoride layer on the capping layer, wherein the ultraviolet absorbent is added into the lithium fluoride layer;
a thin film encapsulation layer on the lithium fluoride layer.
9. The method according to claim 6, wherein the step of forming an encapsulation structure on the light-emitting material layer comprises:
forming a capping layer on the light emitting material layer;
forming a lithium fluoride layer on the capping layer;
and the ultraviolet absorber is added into the thin film packaging layer.
10. A display device, comprising:
the display panel of any one of claims 1-5;
a polarizing plate on the display panel;
a cover plate on the polarizer.
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Cited By (1)
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Application publication date: 20211109 |