CN113561047A - Method and device for compound polishing of inner surface of hole - Google Patents

Method and device for compound polishing of inner surface of hole Download PDF

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Publication number
CN113561047A
CN113561047A CN202111116459.4A CN202111116459A CN113561047A CN 113561047 A CN113561047 A CN 113561047A CN 202111116459 A CN202111116459 A CN 202111116459A CN 113561047 A CN113561047 A CN 113561047A
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Prior art keywords
polishing
workpiece
magnetic
hole
clamp
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CN202111116459.4A
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Chinese (zh)
Inventor
唐伟东
张继泽
姚继开
朱钰浩
刘通
覃经文
毛聪
张明军
唐昆
罗源嫱
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Changsha University of Science and Technology
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Changsha University of Science and Technology
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Priority to CN202111116459.4A priority Critical patent/CN113561047A/en
Publication of CN113561047A publication Critical patent/CN113561047A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/112Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using magnetically consolidated grinding powder, moved relatively to the workpiece under the influence of pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/12Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention discloses a method and a device for compound polishing of the inner surface of a hole, wherein the method comprises the following steps: installing the pushing mechanism at two ends of a workpiece needing to polish the inner surface of the hole, and clamping the pushing mechanism and the workpiece by using a clamp; the propelling mechanism comprises a liquid injection cavity, a magnetic mechanism is sleeved outside the workpiece, a power mechanism is connected with the magnetic mechanism, and the ultrasonic vibration device is connected with the clamp; preparing polishing solution, wherein the polishing solution comprises a magnetic substance and an abrasive, and then adding the polishing solution into the liquid injection cavity; starting a propelling mechanism and a power mechanism, wherein the power mechanism drives the magnetic mechanism to rotate, and the propelling mechanism pushes polishing solution to pass through a workpiece hole to perform a plurality of forward and reverse polishing cycles until the required polishing requirements are met; the propulsion mechanism and the power mechanism are closed. The invention realizes deburring and deterministic polishing of the inner surfaces of various types of holes, simplifies the operation technology of polishing the inner surfaces of the holes, reduces the labor intensity and obviously improves the polishing efficiency and the polishing precision.

Description

Method and device for compound polishing of inner surface of hole
Technical Field
The invention relates to the technical field of ultra-precision machining, in particular to a method and a device for compound polishing of inner surfaces of holes.
Background
With the continuous development of manufacturing technology, new products are continuously appeared, and parts with micro-holes are more and more. At present, the requirements on the processing precision and the surface quality of the inner wall of the micro holes are stricter and stricter, the inner surface quality and the precision after the micro holes are processed are not ideal enough, and the use requirements can be met only by further polishing the processed holes. Polishing is a surface treatment method in which the surface of a workpiece is modified by a polishing tool or other polishing medium. The free abrasive polishing technology is to polish the surface of a workpiece by the movement of the workpiece in free abrasives, and comprises an abrasive flow polishing technology, an abrasive water jet polishing technology, a chemical polishing technology, an electrochemical mechanical polishing technology, an electrolytic polishing technology and the like. The principle of the ultrasonic free abrasive polishing technology is that ultrasonic vibration is added for assisting polishing on the basis of free abrasive polishing, the polishing efficiency of a workpiece is improved through cavitation generated by ultrasonic vibration, and the polishing of the surface of the workpiece is realized. The abrasive flow processing is a surface finishing processing method which pushes a viscoelastic fluid abrasive with fluidity to flow on the surface of a workpiece under the action of pressure and carries out micro-cutting on the surface of the workpiece by abrasive grains in the fluid abrasive. At present, abrasive flow processing is mainly realized by extruding semi-solid abrasive flow to slowly flow in a pore channel by an extruding grinder, so that the inner surface of the pore channel is polished, the abrasive flow velocity is low, and the processing efficiency is low. And for polishing micropores, cluster holes and irregular holes with the pore diameter of less than 50 microns, the abrasive flow processing cannot be sufficient or the processing efficiency is extremely low.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art, and to provide a method and an apparatus for composite polishing of an inner surface of a hole.
The invention provides a composite polishing method for the inner surface of a hole, which specifically comprises the following steps:
s1: installing the pushing mechanism at two ends of a workpiece needing to polish the inner surface of the hole, and clamping the pushing mechanism and the workpiece by using a clamp; the pushing mechanism comprises a liquid injection cavity, and the workpiece comprises a workpiece hole; a liquid injection cavity of the propelling mechanism and a workpiece hole of the workpiece form a closed space;
s2: sleeving the magnetic mechanism outside the workpiece, connecting the power mechanism with the magnetic mechanism, and connecting the ultrasonic vibration device with the clamp;
s3: preparing polishing solution, wherein the polishing solution comprises a magnetic substance and an abrasive, and then adding the polishing solution into the liquid injection cavity;
s4: starting a propelling mechanism and a power mechanism, wherein the power mechanism drives a magnetic mechanism to rotate, the propelling mechanism pushes polishing liquid to pass through a workpiece hole and forms a rigid-flexible coupling high-speed polishing brush under the composite action of a magnetic field and ultrasonic vibration to perform forward polishing on the inner surface of the workpiece hole;
s5: after forward polishing is in place, the pushing mechanism reversely pushes polishing liquid to pass through a workpiece hole to form a rigid-flexible coupling high-speed polishing brush to perform reverse polishing on the inner surface of the workpiece hole, and one processing cycle is formed by one-time forward and reverse polishing;
s6: performing a plurality of processing cycles until the required polishing requirements are met;
s7: the propulsion mechanism and the power mechanism are closed.
Further, the propelling mechanism comprises a driving unit, a piston rod, a piston and a piston cylinder, and the piston cylinder is connected with the clamp; the piston is arranged in the piston cylinder and is abutted against the inner wall of the piston cylinder; the driving unit drives the piston rod, and the piston rod drives the piston to reciprocate in the piston cylinder.
Furthermore, the cross section of one end of the piston cylinder, which is connected with the clamp, is gradually reduced along the direction close to the clamp, and a sealing ring is arranged at one end of the clamp, which is connected with the piston cylinder.
Further, magnetic mechanism includes magnetic substance and magnetic substance mounting bracket, and the magnetic substance mounting bracket is cyclic annular, and the magnetic substance symmetry sets up on the magnetic substance mounting bracket, and the magnetic substance mounting bracket cover is outside the work piece.
Furthermore, the power mechanism comprises a motor and a transmission mechanism, wherein the motor is connected with the magnetic body mounting frame through the transmission mechanism to drive the magnetic body to rotate.
Further, the abrasive comprises one or more of silicon carbide, aluminum oxide, diamond, silicon dioxide, zirconium oxide, boron carbide and silicon nitride.
Furthermore, the magnetic substance wraps the abrasive material under the action of a magnetic field and presses the abrasive material to the inner surface of the hole of the workpiece, so that the polishing pressure between the abrasive material and the inner surface of the hole of the workpiece is increased; the workpiece generates high-frequency vibration along the axial direction of the workpiece hole under the action of the ultrasonic vibration device, and the polishing speed between the workpiece and the abrasive is increased.
The invention also provides a device for compound polishing of the inner surface of the hole, which is used for realizing the method for compound polishing of the inner surface of the hole and comprises a propelling mechanism, a clamp, a magnetic mechanism, a power mechanism and an ultrasonic vibration device; the pushing mechanisms are respectively arranged at two ends of the workpiece, one end of the clamp is connected with the pushing mechanism, and the other end of the clamp is connected with the workpiece; the magnetic mechanism is sleeved outside the workpiece; the power mechanism is connected with the magnetic mechanism and is used for driving the magnetic mechanism to rotate; the ultrasonic vibration device is connected with the clamp.
Further, the propulsion mechanism comprises a driving unit, a piston rod, a piston and a piston cylinder; the piston cylinder is connected with the clamp, and the piston is arranged in the piston cylinder and is abutted against the inner wall of the piston cylinder; the driving unit drives the piston rod, and the piston rod drives the piston to reciprocate in the piston cylinder.
Further, the magnetic mechanism comprises a magnetic body and a magnetic body mounting frame, the magnetic body mounting frame is annular, the magnetic bodies are symmetrically arranged on the magnetic body mounting frame, and the magnetic body mounting frame is sleeved outside the workpiece; the power mechanism comprises a motor and a transmission mechanism, the motor is connected with the magnetic body mounting frame through the transmission mechanism, and the magnetic body is driven to rotate.
According to the method and the device for compound polishing of the inner surface of the hole, provided by the invention, high-frequency vibration along the axial direction of the hole and pressure provided under the action of a magnetic field of a magnetic body are provided through the ultrasonic vibration device, so that a larger horizontal polishing speed and polishing pretightening force are given to an abrasive material, a high-speed rigid-flexible coupling polishing grinding brush is formed, the inner surface of the hole of a workpiece to be processed is subjected to reciprocating motion friction to remove burrs and reduce the roughness of the inner surface of the hole, the deburring and deterministic polishing of various inner surfaces of the hole are realized, the operation technology for polishing the inner surface of the hole is simplified, the labor intensity is reduced, the polishing efficiency and the polishing precision are obviously improved, and the method and the device have extremely high practicability and popularization value.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic flow chart of a method for composite polishing of an inner surface of a hole according to the present invention;
FIG. 2 is a schematic structural diagram of a composite polishing apparatus for inner surfaces of holes according to the present invention;
FIG. 3 is a schematic view of the magnetic body and the magnetic body mounting bracket according to the present invention;
fig. 4 is a schematic view of the connection of the clamp and the piston cylinder provided by the invention.
Reference numerals: 1. a drive unit; 2. a piston rod; 3. a piston; 4. a piston cylinder; 5. a clamp; 6. a workpiece; 7. a magnetic body; 8. a transmission mechanism; 9. a motor; 10. an ultrasonic vibration device; 11. polishing solution; 12. a magnetic body mounting frame; 13. and (5) sealing rings.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
As shown in fig. 1, the present embodiment provides a method for composite polishing of an inner surface of a hole, which is performed by using the apparatus shown in fig. 2 to 4, and specifically includes the following steps:
s1: two ends of each workpiece 6 are respectively sleeved in the clamps 5, the workpieces 6 are connected together through the clamps 5 to form a whole, and the pushing mechanisms are arranged on two sides of the whole; the propelling mechanism comprises a driving unit 1, a piston rod 2, a piston 3 and a piston cylinder 4, one end of the piston cylinder 4 is sleeved outside the clamp 5, and a sealing ring 13 is arranged at the joint of the clamp 5 and the piston cylinder 4, so that polishing liquid can be prevented from leaking; the piston 3 is arranged in the piston cylinder 4 and is abutted against the inner wall of the piston cylinder 4, and the liquid injection cavity is positioned in the piston cylinder 4; the driving unit 1 drives a piston rod 2, and the piston rod 2 drives a piston 3 to reciprocate in a piston cylinder 4; the workpiece 6 comprises a workpiece hole of which the inner surface is required to be polished, and a liquid injection cavity of the propelling mechanism and the workpiece hole of the workpiece 6 form a closed space; the section of one end of the piston cylinder 4, which is connected with the clamp 5, is gradually reduced along the direction close to the clamp 5, such as circular arc, and the circular arc-shaped section is gradually reduced along the advancing direction of the piston 3, so that the pressure intensity between the abrasive and the cavity is increased by reducing the cross section, and the adhesion degree of the abrasive and the processing surface is improved during polishing; the motion directions of the pistons 3 on the two sides are consistent, and when one side compresses the polishing solution, the other side releases the pressure.
S2: sleeving the magnetic mechanism outside the workpiece 6, and installing the magnetic mechanism on the outer surface of the workpiece 6 at a proper distance, wherein the power mechanism is connected with the magnetic mechanism; the magnetic mechanism comprises a magnetic body 7 and a magnetic body mounting frame 12, the magnetic body mounting frame 12 is annular and is made of a non-magnetic material, the magnetic body 7 is symmetrically arranged on the magnetic body mounting frame 12, and the magnetic body mounting frame 12 is sleeved outside the workpiece 6; the magnetic body 7 is a permanent magnet or an electromagnet, and the magnetic field intensity can be adjusted based on the processing requirement; the power mechanism comprises a motor 9 and a transmission mechanism 8, the motor 9 is connected with the magnetic body mounting frame 12 through the transmission mechanism 8 to drive the magnetic body 7 to rotate, and the motor 9 can adjust the rotating speed of the magnetic body 7 according to the flow rate of the polishing solution 11; the transmission mechanism 8 is belt transmission or gear transmission, and the motor 9 is an alternating current asynchronous motor or a cage type motor. The ultrasonic vibration device 10 is rigidly connected with the clamp 5 and drives the workpiece 6 to generate high-frequency vibration in the horizontal direction.
S3: preparing a polishing solution 11, wherein the polishing solution 11 comprises a magnetic substance and an abrasive, and then adding the polishing solution 11 into the liquid injection cavity; the polishing solution is selected from the existing commercialized magnetorheological polishing solution, and the abrasive comprises silicon carbide, aluminum oxide, diamond and silicon dioxide, or silicon dioxide, zirconium oxide, boron carbide and silicon nitride.
S4: and starting a propelling mechanism and a power mechanism, wherein the power mechanism drives the magnetic mechanism to rotate, the propelling mechanism pushes the polishing solution 11 to pass through the workpiece hole, and a rigid-flexible coupling high-speed polishing brush is formed under the composite action of a magnetic field and ultrasonic vibration to perform forward polishing on the inner surface of the workpiece hole.
S5: after the forward polishing is in place, the pushing mechanism reversely pushes the polishing solution 11 to pass through the workpiece hole to form a rigid-flexible coupling high-speed polishing brush for reversely polishing the inner surface of the workpiece hole, and one processing cycle is formed by one-time forward and reverse polishing.
The magnetic substance wraps the abrasive material under the action of the magnetic field and presses the abrasive material to the inner surface of the hole of the workpiece, so that the polishing pressure between the abrasive material and the inner surface of the hole of the workpiece is increased; the workpiece 6 is vibrated at high frequency along the axial direction of the workpiece hole by the ultrasonic vibration device 10, and the polishing speed between the workpiece 6 and the abrasive is increased.
S6: a plurality of processing cycles are performed until the desired polishing requirements are achieved.
S7: the propulsion mechanism and the power mechanism are closed.
According to the invention, the ultrasonic auxiliary processing and the magnetic grinding and polishing process are simultaneously participated, and the pressure between the abrasive and the inner surface of the workpiece hole and the speed of the abrasive along the polishing direction are increased through the combined action of the magnetic grinding and the ultrasonic vibration, so that the polishing times can be shortened to a certain extent, and the workpiece with higher precision can be obtained. By rotating the magnetic body, the magnetic substance in the polishing solution can be stressed more uniformly, and deburring and polishing of the inner surfaces of various holes can be realized.
Because the rheological property of the polishing solution is controllable, compared with the traditional abrasive flow polishing, the invention can realize the deterministic polishing of the cavity with the complex inner surface and obtain the ideal polishing effect. Meanwhile, the size of the magnetic field can be increased by expanding and increasing the number of the magnetic bodies, and the polishing efficiency is obviously improved. The invention carries out friction polishing on the inner surface of the workpiece hole by forming the rigid-flexible coupling high-speed polishing brush, ensures higher efficiency, does not introduce subsurface damage, and can efficiently eliminate a subsurface damage layer generated by grinding.
Example 2
As shown in fig. 2 to 4, the present embodiment provides a hole inner surface composite polishing apparatus for implementing the hole inner surface composite polishing method in embodiment 1, including a propelling mechanism, a clamp 5, a magnetic mechanism, a power mechanism, and an ultrasonic vibration device; the propelling mechanisms are respectively arranged at two ends of the workpiece 6 and comprise a driving unit 1, a piston rod 2, a piston 3 and a piston cylinder 4, one end of the piston cylinder 4 is sleeved outside the clamp 5, and a sealing ring 13 is arranged at the joint of the clamp 5 and the piston cylinder 4, so that the polishing solution can be prevented from leaking; the piston 3 is arranged in the piston cylinder 4 and is abutted against the inner wall of the piston cylinder 4; the driving unit 1 drives a piston rod 2, and the piston rod 2 drives a piston 3 to reciprocate in a piston cylinder 4; one end of the clamp 5 is sleeved in the piston cylinder 4, and the other end of the clamp is sleeved outside the workpiece 6; the magnetic mechanism comprises a magnetic body 7 and a magnetic body mounting frame 12, the magnetic body mounting frame 12 is annular, the magnetic body 7 is symmetrically arranged on the magnetic body mounting frame 12, and the magnetic body mounting frame 12 is sleeved outside the workpiece 6; the power mechanism comprises a motor 9 and a transmission mechanism 8, the motor 9 is connected with the magnetic body mounting frame 12 through the transmission mechanism 8 to drive the magnetic body 7 to rotate, the transmission mechanism 8 is in belt transmission or gear transmission, and the motor 9 is an alternating current asynchronous motor or a cage-type motor; the ultrasonic vibration device is rigidly connected with the clamp 5 and drives the workpiece 6 to generate high-frequency vibration along the axial direction of the hole.
In this embodiment, the driving unit 1 employs two symmetrically-associated link mechanisms or cam mechanisms to ensure that the pistons 3 on both sides move in the same manner, i.e., when one side compresses the polishing solution, the other side is just decompressed, and the driving unit 1 is preferably a controllable driving unit. The clamp 5 is externally connected with an ultrasonic vibration device 10, and the clamp and the ultrasonic vibration device are rigidly connected. The magnetic body 7 is a square permanent magnet, a cylindrical or conical magnet, or an electromagnet other than a permanent magnet.
After the present example was put into use, a comparative experiment was performed to verify the function of the ultrasonic vibration device. An inner hole polishing experiment with an ultrasonic vibration device or not was performed respectively with an elongated tube part having an inner hole diameter of 3.5mm and a length of 120mm as a workpiece made of 304 stainless steel, the ultrasonic frequency was 15KHz, and the experiment results are shown in Table 1.
TABLE 1 influence of ultrasonic vibration device on polishing efficiency
Figure DEST_PATH_IMAGE001
From the experimental results, under the same conditions of polishing pressure, abrasive grain size, abrasive concentration and surface roughness before processing, the surface roughness is reduced from Ra2.323 mu m to Ra0.315 mu m without the assistance of an ultrasonic vibration device, and the polishing needs to be carried out for 35 times; in the case of using the ultrasonic vibration device for assistance, the surface roughness was reduced from Ra2.328 μm to Ra0.306. mu.m, and the number of reciprocal polishing was reduced to 16. It can be concluded that the same polishing effect is achieved and the polishing efficiency can be improved by 54% when ultrasonic assistance is used.
The ultrasonic-assisted polishing and magnetic grinding polishing are combined, the ultrasonic vibration device provides high-frequency vibration along the axial direction of the hole and pressure provided under the action of a magnetic field of a magnetic body, abrasive materials are endowed with higher horizontal polishing speed and polishing pretightening force, a high-speed rigid-flexible coupling polishing grinding brush is formed, reciprocating motion is carried out on the inner surface of the hole of a workpiece to be processed to remove burrs and reduce the roughness of the inner surface of the hole, deburring and deterministic polishing of the inner surface of each type of hole are realized, the operation technology of polishing the inner surface of the hole is simplified, the labor intensity is reduced, the polishing efficiency and the polishing precision are obviously improved, and the ultrasonic-assisted polishing and magnetic grinding polishing device has strong practicability and popularization value.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (10)

1. The method for compound polishing of the inner surface of the hole is characterized by comprising the following steps:
s1: installing the pushing mechanism at two ends of a workpiece needing to polish the inner surface of the hole, and clamping the pushing mechanism and the workpiece by using a clamp; the pushing mechanism comprises a liquid injection cavity, and the workpiece comprises a workpiece hole; a liquid injection cavity of the propelling mechanism and a workpiece hole of the workpiece form a closed space;
s2: sleeving the magnetic mechanism outside the workpiece, connecting the power mechanism with the magnetic mechanism, and connecting the ultrasonic vibration device with the clamp;
s3: preparing polishing solution, wherein the polishing solution comprises a magnetic substance and an abrasive, and then adding the polishing solution into the liquid injection cavity;
s4: starting a propelling mechanism and a power mechanism, wherein the power mechanism drives a magnetic mechanism to rotate, the propelling mechanism pushes polishing liquid to pass through a workpiece hole and forms a rigid-flexible coupling high-speed polishing brush under the composite action of a magnetic field and ultrasonic vibration to perform forward polishing on the inner surface of the workpiece hole;
s5: after forward polishing is in place, the pushing mechanism reversely pushes polishing liquid to pass through a workpiece hole to form a rigid-flexible coupling high-speed polishing brush to perform reverse polishing on the inner surface of the workpiece hole, and one processing cycle is formed by one-time forward and reverse polishing;
s6: performing a plurality of processing cycles until the required polishing requirements are met;
s7: the propulsion mechanism and the power mechanism are closed.
2. A method for compound polishing of an inner surface of a hole according to claim 1, wherein the propelling mechanism comprises a driving unit, a piston rod, a piston and a piston cylinder; the piston cylinder is connected with the clamp, and the piston is arranged in the piston cylinder and is abutted against the inner wall of the piston cylinder; the driving unit drives the piston rod, and the piston rod drives the piston to reciprocate in the piston cylinder.
3. The method of claim 2, wherein the cross section of the end of the piston cylinder connected to the clamp is gradually reduced along the direction close to the clamp, and the end of the clamp connected to the piston cylinder is provided with a sealing ring.
4. The method of claim 1, wherein the magnetic mechanism comprises a ring-shaped magnetic body and a magnetic body mounting frame, the magnetic body is symmetrically arranged on the magnetic body mounting frame, and the magnetic body mounting frame is sleeved outside the workpiece.
5. The method as claimed in claim 4, wherein the power mechanism comprises a motor and a transmission mechanism, the motor is connected to the magnetic mount via the transmission mechanism to drive the magnetic to rotate.
6. The method of claim 1, wherein the abrasive comprises one or more of silicon carbide, aluminum oxide, diamond, silicon dioxide, zirconium oxide, boron carbide, and silicon nitride.
7. The compound polishing method for the inner surface of the hole as claimed in claim 1, wherein the magnetic substance wraps the abrasive material under the action of the magnetic field and presses the abrasive material against the inner surface of the hole of the workpiece, so as to increase the polishing pressure between the abrasive material and the inner surface of the hole of the workpiece; the workpiece generates high-frequency vibration along the axial direction of the workpiece hole under the action of the ultrasonic vibration device, and the polishing speed between the workpiece and the abrasive is increased.
8. A hole inner surface composite polishing device, which is used for realizing the hole inner surface composite polishing method of any one of claims 1 to 7, and comprises a propelling mechanism, a clamp, a magnetic mechanism, a power mechanism and an ultrasonic vibration device; the pushing mechanisms are respectively arranged at two ends of the workpiece, one end of the clamp is connected with the pushing mechanism, and the other end of the clamp is connected with the workpiece; the magnetic mechanism is sleeved outside the workpiece; the power mechanism is connected with the magnetic mechanism and is used for driving the magnetic mechanism to rotate; the ultrasonic vibration device is connected with the clamp.
9. A hole internal surface composite polishing device according to claim 8, wherein said propelling mechanism comprises a driving unit, a piston rod, a piston and a piston cylinder; the piston cylinder is connected with the clamp, and the piston is arranged in the piston cylinder and is abutted against the inner wall of the piston cylinder; the driving unit drives the piston rod, and the piston rod drives the piston to reciprocate in the piston cylinder.
10. The compound polishing device for the inner surface of a hole as claimed in claim 8, wherein the magnetic mechanism comprises a magnetic body and a magnetic body mounting frame, the magnetic body mounting frame is annular, the magnetic body is symmetrically arranged on the magnetic body mounting frame, and the magnetic body mounting frame is sleeved outside the workpiece; the power mechanism comprises a motor and a transmission mechanism, the motor is connected with the magnetic body mounting frame through the transmission mechanism, and the magnetic body is driven to rotate.
CN202111116459.4A 2021-09-23 2021-09-23 Method and device for compound polishing of inner surface of hole Pending CN113561047A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112676922A (en) * 2020-12-23 2021-04-20 南京航太机电有限公司 Magnetic grinding device and method for vibrating composite elliptical motion
CN113649942A (en) * 2021-09-03 2021-11-16 西安昆仑工业(集团)有限责任公司 Equipment and process for finishing and deburring inner bore wire groove
WO2024000759A1 (en) * 2022-06-29 2024-01-04 大连理工大学 Multi-field auxiliary abrasive flushing and polishing method and device

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