CN113538383B - Synchronous chip seal peeling identification method based on three-dimensional laser - Google Patents
Synchronous chip seal peeling identification method based on three-dimensional laser Download PDFInfo
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Abstract
The invention discloses a synchronous chip seal peeling identification method based on three-dimensional laser, which adopts a three-dimensional laser detection technology to acquire elevation data before and after peeling of a synchronous chip seal, constructs a three-dimensional reconstruction model of a seal test piece based on matlab compiling environment, can truly reflect the surface texture condition of the seal, can accurately position peeling point coordinates by comparing the reconstructed model before and after peeling, and draws peeling trace curves, thereby realizing calculation of seal peeling multidimensional index, providing a reliable basis for accurately evaluating chip seal peeling position and peeling severity, providing a novel thought for pavement damage detection, and providing an important basis for evaluating the service performance of asphalt pavement, analyzing driving safety and selecting pavement maintenance time.
Description
Technical Field
The invention relates to the field of pavement disease detection, in particular to a synchronous broken stone seal peeling identification method based on three-dimensional laser.
Background
The synchronous broken stone seal layer is used as a main preventive maintenance technology in a main line major maintenance plan, and can restore the road surface flatness and improve the anti-skid capability of the surface layer so as to ensure the driving safety. However, under the action of extreme temperature stress and heavy-duty vehicle load, the seal aggregate at the wheel track belt is easy to fall off, so that the state of embedding and extruding force of the aggregate is damaged, the force transmission is initiated to damage the linkage effect, the aggregate falls off along the wheel track belt, and the anti-skid performance of the pavement is attenuated. Therefore, the method is scientific, accurate and efficient to detect the falling condition of the aggregate of the synchronous crushed stone seal, is an important basis for deciding the maintenance treatment scheme of the seal falling diseases and determining the optimal maintenance time, and has important significance for researching the researches of the synchronous crushed stone seal treatment performance comparison, the evolution of the road surface anti-skid performance after treatment, the life prediction of the crushed stone seal treatment and the like.
At present, a mature method for identifying synchronous broken stone seal peeling diseases is not available, a manual field investigation method is mainly adopted to measure the peeling area of the additionally paved broken stone seal, the efficiency is low, the precision is poor, and seal peeling degree information cannot be accurately obtained. Meanwhile, the related evaluation indexes mainly adopt the quality loss of the aggregate, namely the destoner rate to evaluate the severity of the spalling of the crushed stone seal layer, can only reflect the adhesion degree between asphalt and the aggregate, and cannot reflect the point positions, the surface texture structures and the construction depth of synchronous spalling of the crushed stone seal layer. Therefore, describing the peeling degree of the crushed stone sealing layer by using the stone removal rate has great limitation, cannot reflect the real peeling state of the sealing layer from the angle of appearance damage, and cannot provide reasonable basis for road maintenance decision scientifically, accurately and in detail.
In summary, the conventional synchronous chip seal peeling recognition and evaluation method cannot accurately reflect seal peeling information in detail.
Disclosure of Invention
The invention aims to provide a synchronous chip seal peeling identification method based on three-dimensional laser, which aims to solve the problems that the existing synchronous chip seal peeling identification method is insufficient and the peeling degree is too single by adopting quality loss evaluation. The invention can identify the spalling area of the crushed stone seal layer, and provides a multi-dimensional index to describe spalling characteristics of the crushed stone seal layer so as to evaluate spalling degree of the crushed stone seal layer in detail, accurately and intuitively.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a synchronous chip seal peeling identification method based on three-dimensional laser comprises the following steps:
step 1: preparing an indoor synchronous chip seal test piece, performing peeling treatment by using a brushing test, and scanning surface textures of the indoor synchronous chip seal test piece before and after peeling on the basis of fixing and registering the indoor synchronous chip seal test piece before and after peeling to obtain three-dimensional coordinate data of an original three-dimensional laser point cloud;
step 2: based on matlab compiling environment, adopting low-pass filtering and wavelet-based filtering to carry out smooth noise reduction treatment on original three-dimensional laser point cloud three-dimensional coordinate data before and after spalling, and intercepting three-dimensional point cloud three-dimensional coordinate data of a central square area of an indoor synchronous chip seal test piece as test data;
step 3: based on matlab compiling environment, three-dimensional coordinate data of a central square area of the indoor synchronous chip seal before and after peeling are extracted, elevation coordinate differences of each point of the three-dimensional laser point cloud three-dimensional coordinates of the central square area before peeling and the three-dimensional laser point cloud three-dimensional coordinates after peeling are obtained, so that plane coordinates and elevation difference coordinates of areas with obvious elevation changes are obtained, and the plane coordinates and the elevation difference coordinates are recorded as three-dimensional difference coordinates; carrying out contour drawing on the three-dimensional difference coordinates by adopting an elevation value with the value of N (N=0.5 mm), further extracting plane coordinates corresponding to the contour with the difference of N (N=0.5 mm), and carrying out invalid coordinate rejection on the contour plane coordinates according to the unit aggregate area, wherein the contour plane coordinates can represent boundary lines of an indoor synchronous macadam seal test piece peeling region and an peeling region, namely peeling trace curve plane coordinates;
step 4: reconstructing a three-dimensional model of the indoor macadam seal after the peeling of the square area by adopting a surf function according to three-dimensional coordinate data of the three-dimensional point cloud of the indoor synchronous macadam seal after the peeling of the square area, drawing contour plane coordinates with the difference value of N (N=0.5 mm) in the three-dimensional reconstruction model of the indoor macadam seal after the peeling of the square area by adopting a plot3 function, and drawing a space closed curve which is a peeling trace curve, thereby extracting elevation coordinates corresponding to the contour plane coordinates in the three-dimensional reconstruction model of the indoor macadam seal after the peeling of the square area; the three-dimensional coordinate extraction of the peeling trace curve is realized by the obtained contour plane coordinate and the corresponding elevation coordinate;
step 5: analyzing three-dimensional morphological characteristics of the peeling trace curve, and calculating multi-dimensional peeling indexes of the indoor synchronous chip seal layer;
step 6: and calculating multi-dimensional peeling indexes of the indoor synchronous chip seal layers according to the peeling trace curve, obtaining the peeling severity evaluation indexes of the chip seal layers, and further analyzing the peeling reasons of the granules.
Further, the specific preparation process of the indoor synchronous chip seal test piece in the step 1 is as follows:
a) Preparing limestone stones with the grain diameter of 9.5-13.2mm, cleaning, drying, and heating to 170 ℃ for later use;
b) Placing SBS modified asphalt at 170 ℃ for standby;
c) Cutting round felt paper with diameter d=300 mm, flattening and placing, and heating to 60 ℃ for standby; soaking the hollow steel drum for standby;
d) Taking out felt, and spreading 17kg/m of broken stone 2 The optimal asphalt dosage is 1.35kg/m < 2 >, asphalt is uniformly smeared on the surface of felt paper, stone is instantly spread by a horizontal pushing plate, the stone is uniformly spread, after the stone is uniformly spread, a hollow steel drum is used for rolling and rough leveling, and the stone is placed on a wheel mill for rolling for 4-5 times;
e) And d) curing the molded test piece obtained in the step d) at 60 ℃ for 1h, and then standing for 1d at normal temperature in a room, so that the preparation of the indoor synchronous chip seal test piece is completed.
Further, the indoor synchronous chip seal test piece peeling treatment method in the step 1 comprises the following steps:
after the preparation of the indoor synchronous chip-sealing test piece is finished, the indoor synchronous chip-sealing test piece is refrigerated at the temperature of-15 ℃ for 12 hours, and then taken out for an accelerated brushing test, so that the peeling treatment of the indoor synchronous chip-sealing test piece is realized.
Further, the specific method for the indoor synchronous chip seal test piece fixing registration treatment before and after peeling in the step 1 is as follows:
and determining the right and left directions of the indoor synchronous chip seal test piece by a method of marking the outer edge trace of the felt paper and the ground marking mark, and carrying out fixed registration on the indoor synchronous chip seal test piece.
Further, in the step 2, the specific smooth noise reduction step based on the matlab compiling environment is as follows:
a) Smoothing three-dimensional coordinate data of the three-dimensional point cloud of the indoor synchronous chip seal layer before and after spalling by adopting a smoothfunction, and repairing elevation missing points;
b) Determining row and column positions of a central square area which represents 100mm x 100mm of the indoor synchronous chip seal test piece in the elevation data by calculating the proportional relation between the diameter length of the indoor synchronous chip seal test piece and the row and column numbers of the read elevation data;
c) And adopting a wden function to carry out secondary filtering on the intercepted elevation data of the central square area, so as to realize the retention of fine texture characteristics of a small area and the acquisition of the three-dimensional coordinates of the laser point cloud of the indoor synchronous chip-breaking seal before and after the peeling of the central square area after the smooth noise reduction.
Further, the specific method for obtaining the plane coordinates of the peeling trace curve in the step 3 is as follows:
a) Solving the difference of the elevation coordinates of each point in the three-dimensional coordinates of the laser point cloud in the central square area of the indoor synchronous chip seal before and after peeling, namely delta Z=Z Front part -Z Rear part (S) Obtaining plane coordinates X, Y and an elevation difference value delta Z of an elevation change obvious region, namely, three-dimensional difference value coordinates, and storing the three-dimensional difference value coordinates in a matrix CZ;
b) In consideration of the systematic error of indoor three-dimensional laser scanning, the elevation change data in the non-peeling area should be smaller than 0.5mm, and the elevation change of the peeling area should be larger than 0.5mm, so that a contour function is adopted to extract the elevation difference of deltaz=0.5mm to draw the contour line, and the plane coordinates of the contour line can represent the boundary line of the peeling area and the non-peeling area of the indoor synchronous chip seal test piece, thereby realizing clear identification of the peeling trace curve. Determining the coordinates of a closed contour surrounded by each peeling region by a contour function as (Xn, yn) Original, original Storing Cn and n as the number of the peeling areas of the central square indoor synchronous crushed stone seal layer respectively in each group of closed curve coordinates to finish the determination of the plane coordinates of peeling trace curve of the central square area of the indoor synchronous crushed stone seal layer; z in Front part Z is the elevation test data before exfoliation Rear part (S) Elevation test data after peeling treatment, CZ is a matrix storing three-dimensional difference coordinates X, Y and DeltaZ, (Xn, yn) Original, original For the preliminary obtained peeling trace curve plane coordinates, cn is a matrix storing peeling trace curve coordinates for each peeling region.
The concrete steps are as follows:
ΔZ＝Z front part -Z Rear part (S) ；
(Xn,Yn) Original, original ＝{(X,Y,ΔZ)∈CZAz=0.5 };
Cn＝{(X1,Y1)；(X2,Y2)…(Xn,Yn) original, original }；
Further, the specific method for eliminating the invalid coordinates based on the equivalent altitude plane coordinates of the unit aggregate area in the step 3 comprises the following steps:
based on matlab compiling environment, using polyaea function to peel trace curve plane coordinates (Xn, yn) Original, original Calculating the area of the enclosed closed area, and setting a threshold value s Granules and method for producing the same I.e. the planar area of the unit granule is removed to less than s Granules and method for producing the same To extract the plane coordinates of the curve of the effective peeling trace, wherein Sn is the plane area of each peeling region, s Granules and method for producing the same The plane area of the unit granule is (Xn, yn) which is the plane coordinate of the peeling trace curve after threshold screening, and is specifically expressed as:
Sn＝polyarea(Xn,Yn) original, original ；
(Xn,Yn)＝{(Xn,Yn) Original, original E CnI Sn>s Granules and method for producing the same }；
Further, the specific method for extracting the three-dimensional coordinates of the peeling trace curve in the step 4 is as follows:
according to three-dimensional coordinate data of indoor synchronous macadam seal layers after the square area is peeled off, reconstructing a three-dimensional model of the indoor macadam seal layers after the square area is peeled off by adopting a surf function, drawing the 0.5mm contour plane coordinate into the three-dimensional reconstruction model of the indoor macadam seal layers after the square area is peeled off by adopting a plot3 function, and extracting elevation coordinate Zn corresponding to the contour plane coordinate in the indoor synchronous macadam seal layers model of the central square area after the square area is peeled off by utilizing a find function, thereby realizing three-dimensional coordinate extraction of peeling trace curves and marking as Xn, yn and Zn.
Further, the multi-dimensional peeling index in step 5 includes peeling area, peeling volume, peeling perimeter; the peeling area refers to the area of a plane contour surrounded by each peeling trace curve formed after peeling treatment; the peeling volume refers to the total volume of the particle loss surrounded by a peeling trace curve formed after peeling treatment; the peeling perimeter is the planar curve length of the peeling trace curve.
Further, the multidimensional peeling indexes are peeling area Sn, peeling perimeter Ln and total peeling volume V, and based on matlab compiling environment, the calculation methods of various indexes are as follows:
area S of peeling n ：
Sn＝polyarea(Xn,Yn)；
S＝∑Sn；
S Phase (C) ＝S/S 1 ；
Wherein S is the total peeling area S 1 Is the area of a central square area S Phase (C) The area ratio of the peeling area to the central square area, namely the peeling rate, is used for evaluating the plane peeling degree;
exfoliation volume V n ：
V Single sheet ＝Δz×S Single sheet ；
V n ＝∑V Single sheet ＝S Single sheet ×∑Δz；(2)
V＝∑V n ；
K＝V/S；
Wherein V means total volume of exfoliation, S Single sheet Refers to dividing the peeling plane area into a plurality of units based on the laser transverse and longitudinal spacing, and the area of each unit is 0.55mm multiplied by 0.25mm and is marked as S Single sheet Δz is the difference in elevation between the front and rear of each point of the peeling edge of each peeling region, V Single sheet Refer to the volume of each unit rectangular parallelepiped, K is the peel depth for evaluating the degree of cross-sectional peeling, and is the ratio of the total peeled volume to the total peeled area.
Peeling perimeter Ln:
Ln＝∑ln；(4)
where Ln is the distance between the coordinate points at which each peeling region forms the peeling trace curve, and Ln is the circumference of the peeling trace curve.
Further, in step 6, the calculated peeling index is compared with the manual measurement result, and the accuracy of peeling identification is determined by the relative error.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention is based on three-dimensional laser detection technology, rapidly and accurately acquires the surface texture information of the crushed stone seal layer, and realizes the establishment of a three-dimensional reconstruction model by smoothing, reducing noise and repairing abnormal points, approximates to the actual apparent structure of the restored crushed stone seal layer, can sensitively identify the change of the elevation information, accurately and accurately reflect the peeling information of crushed stone seal layer granules, and realizes the extraction of peeling point positions, peeling areas, peeling volumes and peeling Zhou Changduo dimension indexes. The peeling recognition method based on the three-dimensional laser detection technology can scientifically, intuitively, rapidly and accurately evaluate the granule missing and the surface damage of the synchronous chip seal layer, simultaneously provide a novel thought for pavement damage detection, and provide technical support for driving safety analysis and pavement maintenance opportunity selection.
Further, the three-dimensional laser detection technology is adopted to acquire elevation data before and after the synchronous chip seal layer is peeled off, a three-dimensional reconstruction model of the seal layer test piece is constructed based on a matlab compiling environment, the surface texture condition of the seal layer can be truly reflected, the peeling point position coordinates can be accurately positioned by comparing the reconstructed models before and after peeling off, and peeling trace curves are drawn, so that the calculation of the multi-dimensional index of seal layer peeling is realized, a reliable basis is provided for accurately evaluating the peeling position and the peeling severity of the chip seal layer, a novel thought is provided for pavement damage detection, and an important basis is provided for evaluating the service performance of asphalt pavement, analyzing driving safety and selecting pavement maintenance opportunity.
Drawings
FIG. 1 is a schematic illustration of an inventive process;
FIG. 2 is an original image of a synchronous chip seal in a chamber before a test piece is peeled off;
FIG. 3 is an original view of a synchronous chip seal after test piece peeling;
FIG. 4 is a three-dimensional model smoothing view of a synchronous chip seal in the pre-spalling chamber, wherein (a) is a three-dimensional reconstruction model plan view and (b) is a three-dimensional reconstruction model top view;
FIG. 5 is a three-dimensional model smoothing view of an indoor synchronous chip seal after spalling, wherein (a) is a three-dimensional reconstruction model plan view and (b) is a three-dimensional reconstruction model top view;
fig. 6 is a three-dimensional model of a spall trace curve.
Detailed Description
The present invention is described in further detail below:
referring to fig. 1, which is a schematic diagram of an invention flow, a synchronous chip seal peeling identification method based on three-dimensional laser comprises the following steps:
1. preparing indoor synchronous chip seal test pieces before and after peeling, acquiring three-dimensional coordinates of laser point cloud to prepare the indoor synchronous chip seal test pieces, performing peeling treatment by using a brushing test, and scanning surface textures of the indoor synchronous chip seal test pieces before and after peeling on the basis of fixing and registering the indoor synchronous chip seal test pieces before and after peeling to acquire three-dimensional coordinate data of original three-dimensional laser point cloud; according to the detection environment, parameters such as exposure value, scanning speed, scanning interval, height limit and the like of the three-dimensional laser detection equipment are adjusted, a Gocator2380 type laser detector is adopted to scan the seal layer test piece before and after peeling, seal layer apparent texture information is obtained, and seal layer surface elevation point data is extracted.
2. Smooth noise reduction treatment for laser point cloud three-dimensional coordinate data of synchronous chip seal before and after spalling
In order to acquire multi-dimensional peeling identification index information and realize the visualization of peeling points and peeling processes, smoothing the scanned elevation data by adopting a smooth function and a wden wavelet basis function based on matlab compiling environment, removing noise points and Gao Chengyi constant points, and extracting elevation data points before and after peeling corresponding to the central square area of the indoor synchronous chip seal test piece as main test data.
3. Stripping coordinate extraction
3.1 pretreatment of the elevation data of each point before and after spalling
a) Determining the right upper direction and the right left direction of the indoor synchronous chip seal test piece by a method for marking the outer edge trace of felt paper and marking marks on the ground, and carrying out fixed registration on the indoor synchronous chip seal test piece;
b) Controlling the advancing speed of the laser emitter, and ensuring that the advancing speeds of the laser emitter before and after peeling are consistent as much as possible, so that the acquired elevation coordinate data do not deviate greatly;
3.2 extraction of the planar coordinates of the peeling trace Curve
Solving the difference value of the elevation coordinates of each point in the three-dimensional coordinates of the laser point cloud in the central square area of the indoor synchronous chip seal before and after peeling, extracting the plane coordinates with the obvious elevation change area, namely the elevation difference value not being 0, and marking the three-dimensional sitting formed by the plane coordinates and the elevation difference value coordinates as three-dimensional difference value coordinates; adopting contour function contour to extract plane coordinate whose height difference is 0.5mm, namely obtaining initial peeling trace curve plane coordinate, and marking it as (Xn, yn) Original, original The method comprises the steps of carrying out a first treatment on the surface of the Based on matlab compiling environment, s is adopted Granules and method for producing the same Pair (Xn, yn) Original, original And screening the area of the enclosed closed area to obtain the plane coordinates (Xn, yn) of the peeling trace curve.
3.3 three-dimensional coordinate extraction of the peeling trace Curve
According to three-dimensional coordinate data of indoor synchronous macadam seal layers after the square area is peeled off, reconstructing a three-dimensional model of the indoor macadam seal layers after the square area is peeled off by adopting a surf function, drawing the 0.5mm contour plane coordinate into the three-dimensional reconstruction model of the indoor macadam seal layers after the square area is peeled off by adopting a plot3 function, and extracting elevation coordinate Zn corresponding to the contour plane coordinate in the indoor synchronous macadam seal layers model of the central square area after the square area is peeled off by utilizing a find function, thereby realizing three-dimensional coordinate extraction of peeling trace curves and marking as Xn, yn and Zn.
4. Multi-dimensional exfoliation identification index extraction
Extracting multi-dimensional peeling identification indexes including peeling areas, peeling volumes and peeling circumferences according to the peeling trace curve drawn by the three-dimensional coordinates of the peeling trace curve; the peeling area refers to the area of a plane contour surrounded by each peeling trace curve formed after peeling treatment; the peeling volume refers to the total volume of the particle loss surrounded by a peeling trace curve formed after peeling treatment; the peeling perimeter refers to the length of a plane curve surrounded by peeling trace curves after peeling treatment; the exfoliation rate refers to the percentage of the exfoliation area to the area of the center square.
5. Multi-dimensional peeling recognition index calculation and peeling degree evaluation
The multi-dimensional peeling index is the peeling area S n Circumference L of peeling n Peeling volume Vn, peeling degree index is peeling rate S Phase (C) Based on matlab compiling environment, various index calculation methods are as follows:
area S of peeling n ：
S n ＝polyarea(Xn,Yn)；
S＝∑Sn；
S Phase (C) ＝S/S 1 ；
Wherein S is the total area of spalling, sn is the spalling area of each spalling region, S 1 Is a central release area S Phase (C) The area ratio of the peeling area to the central square area, namely the peeling rate, is used as an index for evaluating the peeling degree of the plane;
exfoliation volume V n ：
V Single sheet ＝Δz×S Single sheet ；
V n ＝∑V Single sheet ＝S Single sheet ×∑Δz；
V＝∑V n ；
K＝V/S；
Wherein V denotes the total volume of exfoliation, vn is the volume of exfoliation of each exfoliation region, S Single sheet Refers to dividing the peeling plane area into a plurality of units based on the laser transverse and longitudinal spacing, and the area of each unit is 0.55mm multiplied by 0.25mm and is marked as S Single sheet Δz is the difference in elevation between the front and rear of each point of the peeling edge of each peeling region, V Single sheet The volume of each unit cuboid is represented by K, and the ratio of the total spalling volume of the test piece to the total spalling area, namely the spalling depth, is used as an index for evaluating the spalling degree of the broken surface. As shown in the figure, the left cuboid stacking schematic diagram shows the position and the form of the practically peeled granules, and the height difference change value of each point position in the practically peeled granule is the height of the small cuboid, so that the calculation of the volume of the peeled granules can be converted into the summation calculation of a plurality of small cuboid volumes in the area.
Peeling perimeter Ln:
Ln＝∑ln；
where Ln is the distance between the coordinate points at which each peeling region forms the peeling trace curve, and Ln is the circumference of the peeling trace curve.
6. Exfoliation recognition result
Measuring the area of a synchronous chip seal layer peeling plane area, the peeling volume of the granules and the perimeter of the plane peeling area, comparing and analyzing with a manual measurement result, calculating the error between machine detection and manual detection, and verifying the accuracy of three-dimensional laser peeling recognition; meanwhile, calculation and analysis are performed through the results of machine detection, and the degree of flaking of the pellets is evaluated by using the planar pellet flaking rate and the profile flaking depth.
The invention will be described in detail with reference to specific examples below:
in the embodiment, synchronous chip seal peeling diseases are selected as test objects, three-dimensional elevation data before and after synchronous chip seal peeling are acquired by a three-dimensional laser detection system, the laser longitudinal spacing is 0.25mm, and the transverse precision is 0.55mm.
Referring to fig. 1, which is a flow chart of the invention, a synchronous broken stone seal peeling identification method based on a three-dimensional laser detection technology comprises the following steps:
1. preparation of indoor synchronous broken stone seal test piece before and after spalling and three-dimensional coordinate acquisition of laser point cloud
In this example, limestone and SBS modified asphalt with particle sizes of 9.5-13.2mm are selected as the granules and binder of the synchronous chip-breaking seal layer, round felt paper with a diameter of 300mm is used as the bottom surface of the seal layer, and an indoor synchronous chip-breaking seal layer test piece is formed by adopting a manual uniform spreading mode, and the indoor synchronous chip-breaking seal layer original piece is formed by referring to FIG. 2. The spalling treatment of the synchronous chip seal layer is carried out by a low-temperature accelerated wear test, and the original piece of the indoor synchronous chip seal layer after spalling is shown in the figure 3. The three-dimensional laser detection equipment independently developed by the university of Changan is adopted to carry out laser scanning on the indoor synchronous chip seal layer so as to obtain elevation data before and after the indoor synchronous chip seal layer is peeled off, in order to avoid the influence of surrounding light change on the detection environment as much as possible, the exposure value is determined to be 800 mu s through repeated debugging on the equipment, the height is limited to be 2.5mm, the measurement distance is 800mm, the longitudinal distance of laser is 0.55mm, the transverse distance is 0.25mm, and the three-dimensional coordinate data of 543X 1220 laser point cloud is obtained through scanning.
2. Three-dimensional coordinate smooth noise reduction treatment for indoor synchronous chip seal laser point cloud before and after spalling
In order to acquire multi-dimensional peeling identification index information and realize the visualization of peeling points and peeling processes, based on matlab compiling environment, smoothing scanned elevation data by adopting a smooth function and a wavelength wavelet basis function, removing noise points and Gao Chengyi constant points, performing primary smoothing by adopting a contrast algorithm with span of 0.005mm, performing secondary denoising by adopting a hard threshold rule in the wavelength function, better retaining elevation change characteristics, extracting elevation data points before and after peeling of a square area with the central side length of a corresponding sealing test piece, extracting 180-360 lines by conversion, and taking 400-800 rows of data as rectangular area elevation data with the actual length of 100mm×100mm, thereby realizing the construction of a three-dimensional reconstruction model before and after peeling.
3. Extraction of curve coordinates of peeling trace
3.1 pretreatment of the elevation data of each point before and after spalling
And determining the right and left directions of the indoor synchronous chip seal test piece by a method of marking the outer edge trace of the felt paper and the ground marking mark, and carrying out fixed registration on the indoor synchronous chip seal test piece. Meanwhile, the advancing speed of the laser transmitters is controlled, so that the advancing speeds of the laser transmitters before and after peeling are ensured to be consistent as much as possible, and the acquired elevation coordinate data do not deviate greatly.
3.2 extraction of the planar coordinates of the peeling trace Curve
Solving the difference of the elevation coordinates of each point in the three-dimensional coordinates of the laser point cloud in the central square area of the indoor synchronous chip seal before and after peeling, extracting the plane coordinates with the obvious elevation change area, namely the elevation difference not being 0, and extracting the plane coordinates and the elevation differenceThe three-dimensional sitting mark formed by the coordinates is a three-dimensional difference coordinate; adopting contour function contour to extract plane coordinate whose height difference is 0.5mm, namely obtaining initial peeling trace curve plane coordinate, and marking it as (Xn, yn) Original, original The method comprises the steps of carrying out a first treatment on the surface of the Based on matlab compiling environment, s is adopted Granules and method for producing the same Pair (Xn, yn) Original, original And screening the area of the enclosed closed area to obtain the plane coordinates (Xn, yn) of the peeling trace curve.
3.3 three-dimensional coordinate extraction of the peeling trace Curve
And reconstructing a three-dimensional model of the indoor chip seal before and after the peeling of the square area by adopting surf functions according to the three-dimensional coordinate data of the laser point clouds of the indoor synchronous chip seal before and after the peeling of the square area, and referring to the three-dimensional model of the central square area of the indoor synchronous chip seal before and after the peeling of the square area in fig. 4 and 5. Drawing the 0.5mm contour line plane coordinates into a three-dimensional reconstruction model of the indoor crushed-stone seal layer after stripping in the square area by adopting a plot3 function, and extracting elevation coordinates Zn corresponding to the contour line plane coordinates in the indoor synchronous crushed-stone seal layer model of the central square area after stripping by utilizing a find function, thereby realizing three-dimensional coordinate extraction of stripping trace curves, and marking as Xn, yn and Zn.
4. Multi-dimensional exfoliation identification index extraction
Extracting multi-dimensional peeling identification indexes including peeling areas, peeling volumes and peeling circumferences according to the drawn peeling contour curves; the peeling area refers to the area of a plane contour surrounded by each peeling trace curve formed after peeling treatment; the peeling volume refers to the total volume of the particle material missing surrounded by the peeling trace curve formed after peeling treatment, and the peeling perimeter refers to the length of the plane curve surrounded by the peeling trace curve after peeling treatment; the exfoliation rate refers to the percentage of the exfoliation area to the area of the center square.
5. Calculation of exfoliation identification index and evaluation of exfoliation degree
According to formulas (1) - (4), the exfoliation recognition index is calculated in turn, and the multidimensional exfoliation index is the exfoliation area Sn (mm) 2 ) Peeling perimeter Ln (mm), peeling volume Vn (mm) 3 ) And a peeling degree evaluation index peeling rate S Phase (C) (%) flaking depth single K (mm) and comparing with manual measurement results, co-samplingThree groups of test pieces with different needle slice contents of the broken stone seal layers are used for testing, and are marked as three broken stone seal layer test pieces with the needle slice contents of 0%,15% and 20% in the peeling 1#, the peeling 2#, and the peeling 3 #. Wherein the needle-shaped content of the No. 1 test piece is 0%; the needle-like content of the No. 2 test piece is 0%, and the flake content is 15%; the needle-like content of the 3# test piece is 10 percent and the flake content is 10 percent. The following table is provided for the calculation results:
table 1 seal test piece 1# multidimensional identification index
Table 2 seal test piece 2# multidimensional identification index
Table 3 seal test piece 3# multidimensional identification index
TABLE 4 evaluation index of degree of exfoliation
TABLE 5 exfoliation degree grading
TABLE 6 exfoliation classification
7. Exfoliation recognition result
Calculating the peeling index of the test piece, and combining the three-dimensional model of the peeling trace curve of FIG. 6 to show that the peeling perimeter, the peeling area and the maximum absolute error of the peeling volume identification index of the seal test pieces with different needle-like sheet contents are 13.3%, 10.0% and 14.2%; the relative error of the peeling rate was 2.6% and the relative error of the peeling depth was 2.3%. According to the method, the peeling area, peeling volume and peeling perimeter peeling identification index are calculated, the relative error is 1-9%, and the evaluation index error is 1-3%, so that the method can realize accurate identification of the synchronous crushed stone seal layer.
As shown by the multi-dimensional identification results and the evaluation results of the results in tables 1-3, the total peeling circumference of the 1# crushed stone seal layer is 284mm, and the total peeling area is 643mm 2 A total flaking volume of 5251mm 3 The total peeling circumference of the No. 2 macadam seal layer is 634mm, and the total peeling area is 1885mm 2 A total flaking volume of 16526mm 3 320mm total circumference and 723mm total area of spalling of 3# crushed stone seal 2 Total flaking volume 7235mm 3 The method comprises the steps of carrying out a first treatment on the surface of the As shown in Table 4, the peeling rates of # 1, # 2 and # 3 were 6.5%, 18.9% and 7.2%, respectively, and the peeling depths were 8.2mm, 8.8mm and 10.0mm, respectively. The above results indicate that the seal test piece increases with increasing needle flake content, but the needle flake content is not directly related to the flaking rate: the test piece # 2 had a significantly greater flaking rate than the test pieces # 1 and # 2, indicating that the acicular pellets resulted in easier flaking of the pellets than the flaked pellets. Meanwhile, as the needle slice content increases, the peeling depth of each broken stone seal test piece also increases, which indicates that the volume of a peeling unit body increases in a peeling area of unit area, the breaking depth of the broken stone seal is also increased, and the peeling severity is improved; and the flaking rate and flaking depth did not change with increasing needle flake content, indicating that the pellet flaking had anisotropic character of planar profile. Multi-dimensional exfoliation identification finger according to the aboveThe scale and the scale severity index divide the scale degree, as shown in tables 5 and 6, the scale degree is divided into 5 grades, namely slight scale, moderate scale, severe scale and test piece damage, so that the test piece 1 is judged to belong to secondary scale; the test piece No. 2 belongs to five-stage peeling; the 3# test piece belongs to three-level peeling, and the method can effectively divide the peeling degree of the crushed stone seal layer in sequence.
The invention has been described in further detail in connection with the specific embodiments of the invention, which are intended to be illustrative of the invention and are not to be construed as limiting the scope of the invention, which is defined by the appended claims, and any changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (9)
1. The synchronous chip seal peeling identification method based on the three-dimensional laser is characterized by comprising the following steps of;
step 1: preparing an indoor synchronous chip seal test piece, performing peeling treatment by using a brushing test, and scanning surface textures of the indoor synchronous chip seal test piece before and after peeling on the basis of fixing and registering the indoor synchronous chip seal test piece before and after peeling to obtain three-dimensional coordinate data of an original three-dimensional laser point cloud;
step 2: based on matlab compiling environment, adopting low-pass filtering and wavelet-based filtering to carry out smooth noise reduction treatment on original three-dimensional laser point cloud three-dimensional coordinate data before and after spalling, and intercepting three-dimensional point cloud three-dimensional coordinate data of a central square area of an indoor synchronous chip seal test piece as test data;
the method comprises the following specific smooth noise reduction steps based on matlab compiling environment:
a) Smoothing three-dimensional coordinate data of the three-dimensional point cloud of the indoor synchronous chip seal layer before and after spalling by adopting a smoothfunction, and repairing elevation missing points;
b) Determining row and column positions of a central square area which represents 100mm x 100mm of the indoor synchronous chip seal test piece in the elevation data by calculating the proportional relation between the diameter length of the indoor synchronous chip seal test piece and the row and column numbers of the read elevation data;
c) Adopting a wden function to carry out secondary filtering on the intercepted elevation data of the central square area, realizing fine texture feature preservation of a small area, and obtaining three-dimensional coordinates of laser point clouds of indoor synchronous chip seal layers before and after peeling of the central square area after smooth noise reduction;
step 3: based on matlab compiling environment, three-dimensional coordinate data of a central square area of the indoor synchronous chip seal before and after peeling are extracted, elevation coordinate differences of each point of the three-dimensional laser point cloud three-dimensional coordinates of the central square area before peeling and the three-dimensional laser point cloud three-dimensional coordinates after peeling are obtained, so that plane coordinates and elevation difference coordinates of areas with obvious elevation changes are obtained, and the plane coordinates and the elevation difference coordinates are recorded as three-dimensional difference coordinates; carrying out contour line drawing on the three-dimensional difference coordinates by adopting an elevation value with the value of N, further extracting plane coordinates corresponding to the contour line with the difference of N, and carrying out invalid coordinate rejection on the contour line plane coordinates according to the unit aggregate area, wherein the contour line plane coordinates can represent boundary lines of an indoor synchronous chip seal test piece peeling region and an peeling region, namely the peeling trace curve plane coordinates;
step 4: reconstructing a three-dimensional model of the indoor macadam seal after the square area is peeled by adopting a surf function according to three-dimensional coordinate data of the indoor synchronous macadam seal after the square area is peeled, drawing the plane coordinate with the difference value of N equal-altitude in the three-dimensional reconstruction model of the indoor macadam seal after the square area is peeled by adopting a plot3 function, and drawing a space closed curve which is a peeling trace curve, thereby extracting the elevation coordinate corresponding to the plane coordinate of the equal-altitude in the three-dimensional reconstruction model of the indoor macadam seal after the square area is peeled; the three-dimensional coordinate extraction of the peeling trace curve is realized by the obtained contour plane coordinate and the corresponding elevation coordinate;
step 5: analyzing three-dimensional morphological characteristics of the peeling trace curve, and calculating multi-dimensional peeling indexes of the indoor synchronous chip seal layer;
step 6: and acquiring a crushed stone seal spalling severity evaluation index according to the indoor synchronous crushed stone seal multi-dimensional spalling index, and further analyzing the grain spalling reason.
2. The synchronous chip seal peeling recognition method based on the three-dimensional laser, which is characterized in that the specific preparation process of the indoor synchronous chip seal test piece in the step 1 is as follows:
a) Preparing limestone stones with the grain diameter of 9.5-13.2mm, cleaning, drying, and heating to 170 ℃ for later use;
b) Placing SBS modified asphalt at 170 ℃ for standby;
c) Cutting round felt paper with the diameter of 300mm, flattening and placing, and heating to 60 ℃ for standby; soaking the hollow steel drum for standby;
d) Taking out the felt, and optimally using 1.35kg/m asphalt 2 Asphalt is uniformly smeared on the surface of felt paper, and the spreading amount of broken stone is 17kg/m 2 Spreading stones by using a horizontal push plate, uniformly spreading the stones, rolling and leveling by using a hollow steel drum after uniformly spreading, and placing the stones on a wheel mill for rolling for 4-5 times;
e) And d) curing the test piece molded in the step d) at 60 ℃ for 1h, and then standing for 1d at normal temperature in a room, wherein the preparation of the indoor synchronous chip seal test piece is completed.
3. The method for identifying the peeling of the synchronous chip seal layer based on the three-dimensional laser according to claim 2, wherein the peeling treatment in the step 1 is specifically:
after the preparation of the indoor synchronous chip-sealing test piece is finished, the indoor synchronous chip-sealing test piece is refrigerated at the temperature of-15 ℃ for 12 hours, and then taken out for an accelerated brushing test, so that the peeling treatment of the indoor synchronous chip-sealing test piece is realized.
4. The method for identifying the peeling of the synchronous chip seal based on the three-dimensional laser according to claim 2, wherein the specific method for the fixed registration treatment of the synchronous chip seal test piece in the peeling pre-chamber in the step 1 is as follows:
and determining the right and left directions of the indoor synchronous chip seal test piece by a method of marking the outer edge trace of the felt paper and the ground marking mark, and carrying out fixed registration on the indoor synchronous chip seal test piece.
5. The synchronous chip seal peeling identification method based on the three-dimensional laser according to claim 1, wherein the specific method for acquiring the plane coordinates of the peeling trace curve in the step 3 is as follows:
a) Solving the difference of the elevation coordinates of each point in the three-dimensional coordinates of the laser point cloud in the central square area of the indoor synchronous chip seal before and after peeling, namely delta Z=Z Front part -Z Rear part (S) Obtaining plane coordinates X, Y and elevation difference deltaZ of an area with obvious elevation change, namely three-dimensional difference coordinates, and storing X, Y and deltaZ three-dimensional difference coordinates in a matrix CZ;
b) Considering the systematic error of indoor three-dimensional laser scanning, the elevation change data in the non-peeling area should be smaller than 0.5mm, and the elevation change of the peeling area should be larger than 0.5mm, so that the contour line drawing is carried out by adopting a contour function to extract the elevation difference of delta Z=0.5 mm, and the plane coordinates of the contour lines represent the boundary lines of the peeling area and the non-peeling area of the indoor synchronous macadam seal test piece, thereby realizing clear identification of peeling trace curves, and determining the coordinates of the closed contour lines enclosed by each peeling area as (Xn, yn) through the contour function Original, original Storing Cn and n as the number of the peeling areas of the central square indoor synchronous crushed stone seal layer respectively in each group of closed curve coordinates to finish the determination of the plane coordinates of peeling trace curve of the central square area of the indoor synchronous crushed stone seal layer;
the concrete steps are as follows:
ΔZ＝Z front part -Z Rear part (S) ；
(Xn,Yn) Original, original = { (X, Y, Δz) ∈cz| Δz=0.5 };
Cn＝{(X1,Y1)；(X2,Y2)…(Xn,Yn) original, original }；
Z in Front part Z is the elevation test data before exfoliation Rear part (S) Elevation test data after peeling treatment, CZ is a matrix storing three-dimensional difference coordinates X, Y and DeltaZ, (Xn, yn) Original, original For the preliminary obtained peeling trace curve plane coordinates, cn is a matrix storing peeling trace curve coordinates for each peeling region.
6. The synchronous chip seal peeling recognition method based on the three-dimensional laser according to claim 5, wherein the specific method for carrying out invalid coordinate elimination on the plane coordinates of the equivalent high line based on the unit aggregate area in the step 3 is as follows:
based on matlab compiling environment, using polyaea function to peel trace curve plane coordinates (Xn, yn) Original, original Calculating the area of the enclosed closed area, and setting a threshold value s Granules and method for producing the same I.e. the planar area of the unit granule is removed to less than s Granules and method for producing the same The extraction of the plane coordinates of the curve of the effective peeling trace is realized by the array of the (a), and the method is specifically expressed as follows:
Sn＝polyarea(Xn,Yn) original, original ；
(Xn,Yn)＝{(Xn,Yn) Original, original E CnI Sn>s Granules and method for producing the same }；
Wherein Sn is the planar area of each peeling region, s Granules and method for producing the same The unit pellet plane area, (Xn, yn) is the peeling trace curve plane coordinate after threshold screening.
7. The synchronous chip seal peeling recognition method based on the three-dimensional laser according to claim 5, wherein the specific method for extracting the three-dimensional coordinates of the peeling trace curve in the step 4 is as follows:
according to three-dimensional coordinate data of indoor synchronous macadam seal layers after the square area is peeled off, reconstructing a three-dimensional model of the indoor macadam seal layers after the square area is peeled off by adopting a surf function, drawing 0.5mm contour plane coordinates into the three-dimensional reconstruction model of the indoor macadam seal layers after the square area is peeled off by adopting a plot3 function, and extracting elevation coordinates Zn corresponding to the contour plane coordinates in the indoor synchronous macadam seal layers of the central square area after the square area is peeled off by utilizing a find function, thereby realizing three-dimensional coordinate extraction of peeling trace curves, and marking as Xn, yn and Zn.
8. The method for identifying spalling of a three-dimensional laser-based synchronous chip seal according to claim 1, wherein the multi-dimensional spalling index in step 5 comprises spalling area Sn, spalling volume Vn, spalling perimeter Ln; the peeling area refers to the area of a plane contour surrounded by each peeling trace curve formed after peeling treatment; the peeling volume refers to the total volume of the particle loss surrounded by a peeling trace curve formed after peeling treatment; the peeling perimeter is the planar curve length of the peeling trace curve.
9. The method for identifying the peeling of the synchronous chip seal layer based on the three-dimensional laser according to claim 8, wherein in the step 5, the peeling area Sn, the peeling perimeter Ln and the peeling volume Vn are calculated as follows based on matlab compiling environment:
area S of peeling n ：
Sn＝polyarea(Xn,Yn)；
S＝∑Sn；
S Phase (C) ＝S/S 1 ；
Wherein S is the total area of spalling, sn is the spalling area representing each spalling region, S 1 For brushing the area of the core square area S Phase (C) The area ratio of the peeling area to the brushing area is used for evaluating the plane peeling degree;
exfoliation volume V n ：
V Single sheet ＝Δz×S Single sheet ；
V n ＝∑V Single sheet ＝S Single sheet ×∑Δz；
V＝∑V n ；
K＝V/S；
Wherein V means total volume of exfoliation, S Single sheet Refers to dividing the peeling plane area into a plurality of units based on the laser transverse and longitudinal spacing, wherein the area of each unit is 0.55mm multiplied by 0.25mm and is marked as S Single sheet Δz is the difference in elevation between the front and rear of each point of the peeling edge of each peeling region, V Single sheet The volume of each unit cuboid, K is the peeling depth for evaluating the section peeling degree, and is the ratio of the total peeling volume to the total peeling area;
peeling perimeter Ln:
Ln＝∑ln；
where Ln is the distance between the coordinate points at which each peeling region forms the peeling trace curve, and Ln is the circumference of the peeling trace curve.
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