CN113453422A - Packaging structure of PLCC optical module and manufacturing method thereof - Google Patents

Packaging structure of PLCC optical module and manufacturing method thereof Download PDF

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CN113453422A
CN113453422A CN202110717091.0A CN202110717091A CN113453422A CN 113453422 A CN113453422 A CN 113453422A CN 202110717091 A CN202110717091 A CN 202110717091A CN 113453422 A CN113453422 A CN 113453422A
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plcc
pad
optical module
length
pcb pad
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CN113453422B (en
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羊杨
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Embedway Technologies Shanghai Corp
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Embedway Technologies Shanghai Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The invention discloses a packaging structure of a PLCC optical module and a manufacturing method thereof, wherein the packaging structure comprises: a PLCC optical module having pins comprising a first portion and a second portion; a PCB pad having opposing first and second surfaces; wherein the PLCC optical module is arranged on the first surface; the first portion is fixedly connected with the PCB pad, and the length of the first portion is not less than that of the second portion. According to the scheme, through the length design of the PCB bonding pad and the excavation processing of the nearest reference plane, the complete transmission of high-speed signals can be guaranteed, and the impedance is improved.

Description

Packaging structure of PLCC optical module and manufacturing method thereof
Technical Field
The invention relates to the technical field of PLCC optical module packaging, in particular to a packaging structure of a PLCC optical module and a manufacturing method thereof.
Background
The PLCC (plastic Leaded Chip carrier) is a special pin Chip package, which is a kind of Chip package, the pins of the package are bent inwards at the bottom of the Chip and led out from four sides of the package, and the package is T-shaped, is a plastic product and is generally applied to circuits such as logic LSI, DLD and the like.
The PLCC optical module adopts a surface mounting mode, has high density and small size, is a multi-path parallel transmitting-receiving integrated optical module, has a single-path rate of 10.3125Gpbs, is mainly applied to the field of parallel optical interconnection such as a back plate and the like, and has the characteristics of small electromagnetic radiation, strong anti-interference capability and the like. The transmission wavelength of the PLCC optical module is 850nm, the MT/MPO type tail fiber interface adopts a PLCC packaging form, the working temperature range is-55-85 ℃, and the product can be applied to various parallel transmission fields, such as backboard interconnection, parallel optical interconnection, radar and processor interconnection and the like.
In the prior art, due to the size of the PCB pad, a long stub (stub) is arranged when the PIN of the PLCC optical module is welded with the PCB pad, so that resonance of high-frequency points is caused, meanwhile, large reflection is caused, and the energy of signal transmission is lost.
Disclosure of Invention
In view of this, the present invention provides a package structure of a PLCC optical module and a method for manufacturing the same, which can ensure complete transmission of high-speed signals and improve impedance by designing the length of a PCB pad and performing a hollow process on a nearest reference plane.
In order to achieve the purpose, the invention provides the following technical scheme:
a packaging structure of a PLCC optical module comprises:
a PLCC optical module having pins comprising a first portion and a second portion;
a PCB pad having opposing first and second surfaces;
wherein the PLCC optical module is arranged on the first surface; the first portion is fixedly connected with the PCB pad, and the length of the first portion is not less than that of the second portion.
Preferably, in the above package structure, the length of the second portion is not greater than 0.5 mm.
Preferably, in the above package structure, the package further includes:
the first dielectric layer is arranged on the second surface;
and the copper layer is arranged on the first dielectric layer and deviates from the second surface.
Preferably, in the above package structure, the copper layer has a hollowed-out region, and the hollowed-out region is disposed opposite to the PCB pad.
Preferably, in the above package structure, the PCB pad is a differential wire pad; the differential line bonding pad comprises two ground bonding pads arranged in parallel and two signal bonding pads arranged in parallel; the two signal bonding pads are positioned between the two ground bonding pads, and the extension directions of the ground bonding pads and the signal bonding pads are the same;
wherein the vertical projection of the two signal pads on the copper layer is positioned in the hollowed area.
Preferably, in the above package structure, the width and the length of each of the ground pads and the signal pads are both W and L, and the distances between the ground pads and the signal pads and between the two signal pads are both D.
Preferably, in the above package structure, the hollow area is a rectangle, a side of the rectangle in the first direction is W0, and a side of the rectangle in the extending direction is L0; l0 ═ L, W0 ═ 2W + 3D.
Preferably, in the above package structure, the ground pad has a through hole therein for the pin to pass through the through hole to connect with the copper layer.
The invention also provides a manufacturing method of the packaging structure of the PLCC optical module, which comprises the following steps:
providing a PLCC optical module, wherein the PLCC optical module is provided with a pin, and the pin comprises a first part and a second part;
providing a PCB pad having opposing first and second surfaces;
wherein the PLCC optical module is arranged on the first surface; the first portion is fixedly connected with the PCB pad, and the length of the first portion is not less than that of the second portion.
Preferably, the above manufacturing method further includes:
arranging a first medium layer on the second surface;
and arranging a copper layer on the first dielectric layer, wherein the copper layer is deviated from the second surface.
As can be seen from the above description, in the package structure of the PLCC optical module and the manufacturing method thereof provided by the technical solution of the present invention, the PLCC optical module is disposed on the first surface of the PCB pad, the first portion of the pin is welded and fixed to the PCB pad, and the length of the second portion is reduced by optimizing the length of the PCB pad, so that the length of the second portion is smaller than the length of the first portion, thereby ensuring complete transmission of a high-speed signal, and further, by hollowing out the nearest reference plane of the PCB pad, the impedance of an impedance region can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic diagram of a package structure of a conventional PLCC optical module;
fig. 2 is a schematic diagram of a package structure of a PLCC optical module according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a differential wire bonding pad according to an embodiment of the present invention;
FIG. 4 is a top view of a PCB pad provided by an embodiment of the present invention;
FIG. 5 is a schematic diagram of the shape and dimensions of a copper layer after being hollowed out according to an embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing a package structure of a PLCC optical module according to an embodiment of the present invention;
fig. 7 is a flowchart of a manufacturing method of a package structure of another PLCC optical module according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background art, in the prior art, due to the size of the PCB pad provided by a manufacturer, a long stub is generated when the PIN of the PLCC optical module is welded to the PCB pad, which causes resonance of high frequency points and large reflection, and thus, energy of signal transmission is lost.
In the prior art, according to a reference PCB pad provided by a manufacturer, a cross-sectional view of a PLCC optical module surface mounted on a PCB pad is shown in fig. 1, where fig. 1 is a schematic view of a package structure of a conventional PLCC optical module, the package structure includes a PLCC optical module 10 and a PCB pad 12, the PCB pad 12 has a first surface and a second surface opposite to each other, the PLCC optical module 10 has a pin 11, and the pin 11 includes a first portion a1, a second portion a2, a third portion A3 and a fourth portion a4, where the PLCC optical module 10 is disposed on the first surface of the PCB pad 12, the first portion a1 is horizontally welded and fixed to the PCB pad 12, and the third portion A3 is vertically welded and fixed to the PCB pad 12. The second surface is further provided with a first dielectric layer 14 and a copper layer 15 arranged on the first dielectric layer 14 and deviating from the second surface, a second dielectric layer 16 is further arranged on one side of the PCB bonding pad 12, the second dielectric layer 16 is flush with the PCB bonding pad 12, a second part A2 of the pin 11 is located on the surface of the second dielectric layer 16 and bears a second part A2, and the second part A2 is prevented from being broken in a suspension mode.
Because the contact point position of the PCB pad 12 and the pin 11 is forward, a stub is formed at the rear end of the pin 11 of the PLCC optical module 10, that is, the second part a2 of the pin 11, which easily causes resonance of a high frequency point and also causes large reflection, so that the energy of signal transmission is lost.
Wherein the length of the second portion a2 is T, the length of the PCB pad 12 is L1, and the total length of the PCB pad 12 and the second portion a2 is L'.
Given the installation and dimensional tolerances, assuming T is 1mm, the stub length T is given by the following equation with the resonant frequency wavelength, λ being the wavelength:
Figure BDA0003135391310000051
when T is 1mm, the corresponding wavelength is 4mm, that is, the resonant frequency is 35GHz, the typical 10.3125Gbps signal rising edge is 15ps, the maximum bandwidth is 0.5/15ps ═ 33GHz, and the resonant frequency is very close to 35GHz, so that the energy transmission of signal transmission in the bandwidth is blocked.
Since the external interface rate of the PLCC optical module 10 reaches 10.3125Gpbs, the PLCC optical module belongs to the high-speed signal category, and the high-speed design of the pin 11 and the PCB bonding pad 12 area is particularly important.
In view of this, the present invention provides a package structure of a PLCC and a method for manufacturing the same, which can ensure complete transmission of high-speed signals and improve impedance, and the package structure includes:
a PLCC optical module having pins comprising a first portion and a second portion;
a PCB pad having opposing first and second surfaces;
wherein the PLCC optical module is arranged on the first surface; the first portion is fixedly connected with the PCB pad, and the length of the first portion is not less than that of the second portion.
The invention improves the influence of impedance and stub through the length design of the PCB bonding pad and the excavation processing of the nearest reference plane, has low cost and obvious effect, ensures the effective transmission of high-speed signal energy at high speed, and improves the impedance.
As can be seen from the above description, in the package structure of the PLCC optical module and the manufacturing method thereof provided by the technical solution of the present invention, the PLCC optical module is disposed on the first surface of the PCB pad, the first portion of the pin is welded and fixed to the PCB pad, and the length of the second portion is reduced by optimizing the length of the PCB pad, so that the length of the second portion is smaller than the length of the first portion, thereby ensuring complete transmission of a high-speed signal, and further, by hollowing out the nearest reference plane of the PCB pad, the impedance of an impedance region can be improved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 2, fig. 2 is a schematic diagram of a package structure of a PLCC optical module according to an embodiment of the present invention, and as shown in fig. 2, the package structure includes:
a PLCC optical module 21, the PLCC optical module 21 having pins 22, the pins 22 comprising a first part B1, a second part B2, a third part B3 and a fourth part B4;
a PCB pad 24, the PCB pad 24 having opposing first and second surfaces;
wherein, the PLCC optical module 21 is arranged on the first surface of the PCB pad 24; the first part B1 is fixedly connected with the PCB pad 24 horizontally, the third part B3 is fixedly connected with the PCB pad 24 vertically, and the length of the first part B1 is not less than that of the second part B2.
In the embodiment of the invention, the length of the PCB pad 24 can be optimized, the length of the PCB pad 24 is increased, that is, the welding area between the PCB pad 24 and the first part B1 is increased, so as to reduce the length of the second part B2, and the length of the second part B2 is smaller than that of the first part B1, so that the reflection and loss of a high-speed signal from the PCB pad 24 to the pin 22 of the PLCC optical module 21 can be reduced, the complete transmission of the high-speed signal is ensured, and the method is low in cost and obvious in effect.
In an embodiment of the invention, the length T2 of the second portion B2 is not more than 0.5 mm.
Compared with the embodiment shown in fig. 1, in fig. 2 of the embodiment of the present invention, the original length L1 of the PCB pad 24 is changed to L2, so that T2 is L-L2 ≦ 0.5mm, that is, the length T2 of the second portion B2 is less than or equal to 0.5mm, as shown in fig. 2, if T2 is 0.5mm at the maximum, the resonance frequency corresponding to the length T2 of the modified second portion B2 is 70GHz, which is far beyond the maximum bandwidth 33GHz of the 10.3125Gbps signal. Namely, the energy of signal transmission is not influenced by the stub, and the complete transmission of signals is ensured.
As shown in fig. 2, the package structure further includes:
a first dielectric layer 25 disposed on the second surface, and a copper layer 26 disposed on the first dielectric layer 25 away from the second surface. The first dielectric layer 25 may be 0.1mm, the dielectric constant may be 4, and the copper layer 26 may have a thickness of 2 mils.
It should be noted that a second dielectric layer 27 is further disposed on one side of the PCB pad 24, the second dielectric layer 27 is flush with the PCB pad 24, and the second portion B2 of the pin 22 is located on the surface of the second dielectric layer 27 to bear the second portion B2, so as to prevent the second portion B2 from breaking in a flying manner.
In an embodiment of the present invention, the copper layer 26 has a hollowed-out region 28, and the hollowed-out region 28 is disposed opposite to the PCB pad 24.
In the embodiment of the present invention, the PCB pad 24 is a differential wire pad.
As shown in fig. 3, fig. 3 is a schematic structural diagram of a differential line pad provided in an embodiment of the present invention, where the differential line pad includes two ground pads G arranged in parallel and two signal pads S arranged in parallel; the two signal bonding pads S are positioned between the two ground bonding pads G, and the extending directions of the ground bonding pads G and the signal bonding pads S are the same;
wherein a vertical projection of two of the signal pads S on the copper layer 26 is located within the hollowed-out region 28. Thus, the impedance of the pad 24 region becomes higher and is closer to the impedance of the high-speed signal line, so that various signal integrity problems caused by impedance mismatch can be reduced, and signal reflection can be reduced. As shown in fig. 4, fig. 4 is a top view of a PCB pad according to an embodiment of the present invention, and the dashed box represents the hollowed area 28.
It should be noted that the differential line pads are arranged in G, S, S, G (G denotes a ground pad, and S denotes a signal pad), and the structure is a typical coplanar coupling line structure, where the width and length of the ground pad G and the signal pad S are both W and L, and the distances between the ground pad G and the signal pad S and between the two signal pads S are both D.
It should be noted that the signal pads S are connected with traces (not shown), the ground pads G are grounded, and each ground pad G has a through hole (not shown) therein, so that the pin 22 is connected with the copper layer 26 through the through hole. The through hole is a vertical structure, and the ground pad G and the first dielectric layer 25 have the through hole, and the pin 22 can penetrate through the through hole to be connected with the copper layer 26 because the wall of the through hole has copper.
Usually, the width of the trace is much smaller than the width W of the PCB pad 24, which is about 0.5W, and since the impedance of the PCB pad 24 and the trace is inversely proportional to the line width, the impedance of the PCB pad 24 area is much lower than the impedance of the trace, and the reflection is severe.
Because the PCB pad 24 has too low impedance and needs to reduce the capacitance, the present invention hollows out the nearest reference plane below the PCB pad 24 to increase the impedance, that is, hollows out the middle region of the copper layer 26, where the shape and size of the hollows are shown in fig. 5, and fig. 5 is a schematic diagram of the shape and size of the copper layer after hollowing out provided by the embodiment of the present invention.
As shown in fig. 5, by performing the recess in the middle region of the copper layer 26, the recess region 28 may have a rectangular shape, a side length of the rectangular shape in the first direction (horizontal direction) is W0, a side length in the extending direction (vertical direction) is L0, L0 is L, and W0 is 2W + 3D.
It should be noted that the perpendicular projection of the two signal pads S on the copper layer 26 is located in the hollowed area 28, so that the impedance of the PCB pad 24 area can be increased, the impedance mismatch with the trace area can be reduced, and the signal reflection can be reduced.
As can be seen from the above description, in the package structure of the PLCC optical module provided by the technical solution of the present invention, the PLCC optical module is disposed on the first surface of the PCB pad, the first portion of the pin is welded and fixed to the PCB pad, and the length of the second portion is reduced by optimizing the length of the PCB pad, so that the length of the second portion is smaller than the length of the first portion, thereby ensuring complete transmission of a high-speed signal, and further, by hollowing out the nearest reference plane of the PCB pad, the impedance of an impedance region can be improved.
Based on the foregoing embodiment, another embodiment of the present invention further provides a method for manufacturing a package structure of a PLCC optical module, as shown in fig. 2 and 6, fig. 6 is a flowchart of a method for manufacturing a package structure of a PLCC optical module according to an embodiment of the present invention, where the method includes:
step S11: providing a PLCC optical module 21, the PLCC optical module 21 having pins 22, the pins 22 comprising a first part B1 and a second part B2; it should be noted that the pin 22 further has a third portion B3 and a fourth portion B4;
step S12: providing a PCB pad 24, the PCB pad 24 having opposing first and second surfaces;
wherein the PLCC optical module 21 is arranged on the first surface; the first portion B1 is fixedly connected with the PCB pad 24, and the length of the first portion B1 is not less than that of the second portion B2. The length of the second part B2 is not more than 0.5 mm.
In the embodiment of the invention, the length of the PCB pad 24 can be optimized, the length of the PCB pad 24 can be prolonged, the welding area between the PCB pad 24 and the first part B1 can be increased, and the length of the second part B2 can be reduced, so that the length of the second part B2 is smaller than that of the first part B1, the reflection and loss of a high-speed signal from the PCB pad 24 to the pins 22 of the PLCC optical module 21 can be reduced, the complete transmission of the high-speed signal can be ensured, the cost is low, and the effect is obvious.
Based on the manufacturing method shown in fig. 6, as shown in fig. 7, fig. 7 is a flowchart of a manufacturing method of a package structure of another PLCC optical module according to an embodiment of the present invention, where the manufacturing method further includes:
step S13: arranging a first medium layer 25 on the second surface;
step S14: a copper layer 26 is provided on said first dielectric layer 25 facing away from said second surface.
It should be noted that a second dielectric layer 27 is further disposed on one side of the PCB pad 24, the second dielectric layer 27 is flush with the PCB pad 24, and the second portion B2 of the pin 22 is located on the surface of the second dielectric layer 27 to bear the second portion B2, so as to prevent the second portion B2 from breaking in a flying manner.
Wherein the copper layer 26 has a hollowed out region 28, the hollowed out region 28 being disposed opposite the PCB land 24. The present invention increases the impedance by hollowing out the PCB pad 24 proximate the reference plane, i.e., by hollowing out the middle region of the copper layer 26 to increase the impedance of the impedance region.
The invention improves the influence of impedance and stub through the length design of the PCB pad 24 and the excavation processing of the nearest reference plane, has low cost and obvious effect, ensures the effective transmission of high-speed signal energy at high speed, and improves the impedance.
As can be seen from the above description, in the package structure of the PLCC optical module and the manufacturing method thereof provided by the technical solution of the present invention, the PLCC optical module is disposed on the first surface of the PCB pad, the first portion of the pin is welded and fixed to the PCB pad, and the length of the second portion is reduced by optimizing the length of the PCB pad, so that the length of the second portion is smaller than the length of the first portion, thereby ensuring complete transmission of a high-speed signal, and further, by hollowing out the nearest reference plane of the PCB pad, the impedance of an impedance region can be improved.
The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other. As for the manufacturing method disclosed in the embodiment, since it corresponds to the package structure of the PLCC disclosed in the embodiment, the description is relatively simple, and the relevant points can be referred to the package structure part of the PLCC for explanation.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A packaging structure of a PLCC optical module is characterized in that the packaging structure comprises:
a PLCC optical module having pins comprising a first portion and a second portion;
a PCB pad having opposing first and second surfaces;
wherein the PLCC optical module is arranged on the first surface; the first portion is fixedly connected with the PCB pad, and the length of the first portion is not less than that of the second portion.
2. The package structure of claim 1, wherein the length of the second portion is no greater than 0.5 mm.
3. The package structure of claim 1, further comprising:
the first dielectric layer is arranged on the second surface;
and the copper layer is arranged on the first dielectric layer and deviates from the second surface.
4. The package structure of claim 3, wherein the copper layer has a hollowed-out region disposed opposite the PCB pad.
5. The package structure of claim 4, wherein the PCB pad is a differential line pad; the differential line bonding pad comprises two ground bonding pads arranged in parallel and two signal bonding pads arranged in parallel; the two signal bonding pads are positioned between the two ground bonding pads, and the extension directions of the ground bonding pads and the signal bonding pads are the same;
wherein the vertical projection of the two signal pads on the copper layer is positioned in the hollowed area.
6. The package structure according to claim 5, wherein the ground pad and the signal pad have a width W and a length L, and the distances between the ground pad and the signal pad and between the two signal pads are D.
7. The package structure of claim 6, wherein the hollowed area is rectangular, and the side of the rectangle in the first direction is W0, and the side of the rectangle in the extending direction is L0; l0 ═ L, W0 ═ 2W + 3D.
8. The package structure of claim 7, wherein the ground pad has a via therein for the pin to connect with the copper layer through the via.
9. A manufacturing method of a packaging structure of a PLCC optical module is characterized by comprising the following steps:
providing a PLCC optical module, wherein the PLCC optical module is provided with a pin, and the pin comprises a first part and a second part;
providing a PCB pad having opposing first and second surfaces;
wherein the PLCC optical module is arranged on the first surface; the first portion is fixedly connected with the PCB pad, and the length of the first portion is not less than that of the second portion.
10. The method of manufacturing according to claim 9, further comprising:
arranging a first medium layer on the second surface;
and arranging a copper layer on the first dielectric layer, wherein the copper layer is deviated from the second surface.
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CN115799213B (en) * 2023-02-13 2023-04-21 长鑫存储技术有限公司 Packaging substrate, semiconductor structure and electronic equipment thereof
WO2024169083A1 (en) * 2023-02-13 2024-08-22 长鑫存储技术有限公司 Packaging substrate, and semiconductor structure and electronic device having same

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