CN113438857A

CN113438857A - Cooling cabinet, liquid cooling server equipment and system

Info

Publication number: CN113438857A
Application number: CN202010208857.8A
Authority: CN
Inventors: 刘向东
Original assignee: Alibaba Group Holding Ltd
Current assignee: Alibaba Group Holding Ltd
Priority date: 2020-03-23
Filing date: 2020-03-23
Publication date: 2021-09-24
Also published as: WO2021190403A1

Abstract

The embodiment of the application provides a cooling cabinet, liquid cooling server equipment and a system. Wherein, cooling rack includes: an outer layer cabinet frame; the inner layer cabinet body is arranged in the outer layer cabinet frame and is provided with an inner cavity for accommodating cooling liquid, so that the heating device arranged in the inner cavity is immersed in the cooling liquid; the liquid inlet and the liquid outlet are arranged on the inner-layer cabinet body and are used for accessing cooling liquid through the liquid inlet, entering the inner cavity and flowing out of the liquid outlet after passing through the inner cavity; the cable sealing joint is arranged on the inner cavity wall of the inner-layer cabinet body and is used for leading the cable into the inner cavity from the outside or leading the cable out of the inner-layer cabinet body from the inner cavity; the cables led in or out through the cable sealing joint are arranged in the space between the outer layer framework and the outer wall of the inner layer cabinet body. The scheme provided by the embodiment of the application has higher heat dissipation efficiency; in addition, the cables are uniformly distributed outside the inner-layer cabinet body, so that subsequent overhaul and maintenance are facilitated; the cabinet structure is reasonable in layout and high in integration degree.

Description

Cooling cabinet, liquid cooling server equipment and system

Technical Field

The application belongs to the technical field of computers, and particularly relates to a cooling cabinet, liquid cooling server equipment and a system.

Background

With the rapid development of cloud computing, the requirement on computing performance is higher and higher. When the performance of the server is improved, the power consumption is increased sharply, and the power consumption of the cabinet is increased by multiple times. Data show that the power density of data center cabinets has increased by a factor of 15 over the last decade. The power consumption of a cabinet in the past is generally 1.5-2 kW, but the situation of local 20-30 kW is appeared. Servers and data centers adopt air-conditioning air cooling mode, and consume a great deal of energy, space and cost, and the consumption is expanding day by day. However, as power densities steadily ramp up, the cooling capacity currently provided by many data centers is moving toward a limit, and this trend of rapidly increasing power densities can have adverse effects.

How to improve the heat dissipation efficiency and the maintenance convenience of equipment such as a server, a data center and the like and reduce the maintenance cost is a problem to be solved urgently at present.

Disclosure of Invention

In view of this, the present application provides a cooling cabinet, a liquid cooling server apparatus and a system thereof, so as to improve heat exchange efficiency and facilitate maintenance.

In one embodiment of the present application, a cooling cabinet is provided. This cooling rack includes:

an outer layer cabinet frame;

the inner-layer cabinet body is arranged in the outer-layer cabinet frame, is provided with an inner cavity for accommodating cooling liquid and is used for immersing the heating device arranged in the inner cavity in the cooling liquid;

the liquid inlet and the liquid outlet are arranged on the inner-layer cabinet body and are used for accessing cooling liquid through the liquid inlet, entering the inner cavity and flowing out of the liquid outlet after passing through the inner cavity;

the cable sealing joint is arranged on the inner cavity wall of the inner-layer cabinet body and used for leading a cable into the inner cavity from the outside or leading the cable out of the inner-layer cabinet body from the inner cavity;

the cable led in or out through the cable sealing joint is arranged in a space between the outer layer frame and the outer wall of the inner layer cabinet body.

In one embodiment of the present application, a liquid-cooled server apparatus is provided. This liquid cooling server equipment includes:

a cooling cabinet containing cooling liquid;

at least one server immersed in the cooling liquid of the cooling cabinet;

wherein the cooling cabinet comprises:

an outer layer cabinet frame;

the inner-layer cabinet body is arranged in the outer-layer cabinet frame and is provided with an inner cavity for accommodating the cooling liquid;

the cables led in or out through the cable sealing joint are arranged in a space between the outer layer frame and the outer wall of the inner layer cabinet body.

In yet another embodiment of the present application, a liquid cooled server system is also provided. This liquid cooling server system includes:

at least one liquid-cooled server device;

the management and control device is respectively connected with the at least one liquid cooling server device and is used for controlling cooling, power supply and data interaction of the at least one liquid cooling server device;

wherein the liquid cooling server apparatus includes: the cooling system comprises a cooling cabinet containing cooling liquid and at least one server immersed in the cooling liquid;

the cooling cabinet includes:

an outer layer cabinet frame;

According to the scheme provided by the embodiment of the application, because the liquid immersion cooling cabinet is adopted, and the cooling liquid for immersing the heating devices (such as servers and other equipment) is contained in the liquid immersion cooling cabinet, the liquid immersion cooling cabinet has higher heat dissipation efficiency, ensures the heat dissipation of the heating devices, and can greatly reduce the energy consumption; in addition, according to the scheme provided by the embodiment of the application, the cabinet adopts the structure of the outer layer cabinet frame and the inner layer cabinet body, cables required to be connected with the cabinet can be arranged in the space between the outer layer cabinet frame and the inner layer cabinet body, and the cables are uniformly distributed outside the inner layer cabinet body, so that the subsequent overhaul and maintenance are facilitated; in addition, the cable sealing joint for leading in or leading out the cable is arranged on the inner-layer cabinet body, so that the overflow of the cooling liquid of the inner-layer cabinet body can be effectively avoided. Overall, the technical scheme that this application embodiment provided, rack structural layout is reasonable, and the integration degree is high, be convenient for equipment and dismantlement, be convenient for change spare part, be convenient for maintain etc..

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts. In the drawings:

fig. 1a is a schematic view of a cooling cabinet according to an embodiment of the present application from a first perspective;

FIG. 1b is a schematic diagram illustrating an effect corresponding to the schematic diagram illustrated in FIG. 1 a;

fig. 2a is a schematic view of a cooling cabinet provided in an embodiment of the present application with a cabinet door removed;

FIG. 2b is a schematic diagram illustrating an effect corresponding to the schematic diagram illustrated in FIG. 2 a;

fig. 3a is a schematic diagram illustrating a second perspective view of a cooling cabinet according to an embodiment of the present application;

FIG. 3b is a schematic diagram illustrating an effect corresponding to the schematic diagram illustrated in FIG. 3 a;

fig. 4 is a schematic view illustrating an inner cavity of an inner layer cabinet of a cooling cabinet provided in an embodiment of the present application is provided with a heat generating device;

fig. 5 is an exploded view of a cooling cabinet according to an embodiment of the present application;

fig. 6 is a schematic view illustrating a connection structure of a porous plate and a fixing plate in a cooling cabinet according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an outer rack in a cooling cabinet according to an embodiment of the present application;

FIG. 8 is a schematic sectional view taken along line A-A of FIG. 2 a;

fig. 9 is a schematic diagram illustrating a connection between a server and a switch in a liquid cooling server apparatus according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a liquid cooling server system according to an embodiment of the present application.

Detailed Description

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a" and "an" typically include at least two, but do not exclude the presence of at least one.

It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1a, fig. 1b, fig. 2a, fig. 2b, fig. 3a, fig. 3b, fig. 4, and fig. 5 are schematic structural diagrams illustrating a cooling cabinet according to an embodiment of the present application. This cooling rack includes: outer frame 1, inlayer cabinet body 2, inlet 3, liquid outlet 4 and cable sealing joint 5. The inner cabinet 2 is disposed in the outer cabinet frame 1, and has an inner cavity 21 for accommodating a cooling liquid, so that the heat generating device 5 (see fig. 4) disposed in the inner cavity 21 is immersed in the cooling liquid. In a particular embodiment, the heat generating device may be wholly or partially immersed in the cooling fluid. And the liquid inlet 3 and the liquid outlet 4 are arranged on the inner-layer cabinet body 2 and are used for connecting cooling liquid into the inner cavity 21 through the liquid inlet 3 and then flowing out of the liquid outlet 4 after passing through the inner cavity. In specific implementation, the liquid inlet 3 and the liquid outlet 4 may be provided in plural, for example, as shown in fig. 3a and 3b, the liquid inlet 3 and the liquid outlet 4 are provided at two opposite ends of the inner cabinet 2. The cable sealing joint 5 is arranged on the inner cavity wall of the inner-layer cabinet body 2 and used for leading cables into the inner cavity 21 from the outside or leading the cables out of the inner cavity 21 from the inner cavity 2. The cables led in or led out through the cable sealing joint 5 are arranged in a space between the outer layer frame 1 and the outer wall of the inner layer cabinet body 2. For example, as shown in fig. 2a, 2b, 3a and 3b, a cabling region (e.g., cabling channel 13) is disposed in the space between the outer frame and the outer wall of the inner cabinet 2, and cables can be disposed in the cabling channel 13.

According to the scheme provided by the embodiment, as the liquid immersion cooling cabinet is adopted, and the cooling liquid for immersing the heating devices (such as servers and other equipment) is contained in the liquid immersion cooling cabinet, the liquid immersion cooling cabinet has higher heat dissipation efficiency, ensures the heat dissipation of the heating devices, and can greatly reduce the energy consumption; in addition, according to the scheme provided by the embodiment, the cabinet adopts the structure of the outer layer cabinet frame and the inner layer cabinet body, cables required to be connected with the cabinet can be arranged in the space between the outer layer cabinet frame and the inner layer cabinet body, and the cables are uniformly distributed outside the inner layer cabinet body, so that subsequent overhaul and maintenance are facilitated; in addition, the cable sealing joint for leading in or leading out the cable is arranged on the inner-layer cabinet body, so that the overflow of the cooling liquid of the inner-layer cabinet body can be effectively avoided. The technical scheme that this embodiment provided, rack structural layout is reasonable, and the integration degree is high, be convenient for assemble and dismantle, is convenient for change spare part, is convenient for maintain etc..

In specific implementation, referring to fig. 1a and fig. 1b,

interface flanges

30 and 40 may be disposed at the liquid inlet 3 and the liquid outlet 4, and are used for connecting external pipelines, for example, connecting the external pipelines with a circulation pump. The cooling liquid in the above embodiments may be a liquid that is not electrically conductive and has a good heat exchange effect, for example, a fluorinated liquid for engineering, or widely used synthetic oil, mineral oil, or the like may be used. In addition, the cooling cabinet provided by the embodiment can be understood as follows: for assembling and mounting panels, inserts, housings, electronic components, devices and mechanical parts or components to form an integral mounting housing. The heat generating device in this embodiment may be a specific device, such as but not limited to: a server, a switch; a specific component may also be, for example but not limited to: chip (such as CPU, GPU, ASIC, etc.), memory, network card, etc.

In order to ensure that the cable arranged between the outer layer cabinet frame 1 and the outer wall of the inner layer cabinet body 2 is not touched and interfered during normal service so as to ensure the use safety of the cabinet, a cabinet door can be additionally arranged outside the space. For example, in the structure shown in fig. 1a, 1b and 5, the outer cabinet frame 1 includes: a frame body 11 and a cabinet door 12. A gap is reserved between the frame body 11 and the outer wall of the inner-layer cabinet body 2 to form the space; a wiring area is divided in the space; the cabinet door 12 is movably connected with the frame body 11 to open or close the space. For example, the cabinet door 12 is connected to the frame body 11 by a hinge.

Referring to fig. 2a, 2b, 3a and 3b, at least one routing groove 13 may be disposed on the outer wall of the rack 11 or the inner cabinet 2 for providing the routing area. When the wiring is installed, the cable can be placed in the wiring groove and the wiring is conducted according to the wiring guiding direction of the wiring groove 13. After the wiring is completed, the corresponding wiring groove 13 can be marked with the connection object labels of the cables therein, so as to facilitate the subsequent overhaul and maintenance.

In fact, the cables are divided into different functional cables according to different signal transmission types; different functional cables can be arranged in different cabling areas. For example, as shown in fig. 2a, 2b, 3a and 3b, the frame body 11 has a plurality of vertical sides; the routing areas for routing cables with different functions are located on different vertical sides of the frame body 11. It is assumed that the cooling cabinet comprises both power supply cables and communication cables. The frame body 11 is a rectangular parallelepiped frame, and has two opposite long-side vertical surfaces, namely a front side and a rear side; a first wiring area is divided in a space formed by the inner cabinet 2 and the front side (long-side vertical side as shown in fig. 2a and 2 b) of the frame body 11; a second routing area is divided in a space formed by the inner cabinet 2 and the rear side (the back side of the long side shown in fig. 3a and 3 b) of the frame body 11; the first wiring area is used for laying one of the power supply cable and the communication cable, and the second wiring area is used for laying the other of the power supply cable and the communication cable. In particular, the first plurality of routing areas (i.e. routing slots 13) shown in fig. 2a and 2b are used for routing the power supply cables; a plurality of second routing areas (i.e., routing channels 13) are shown in fig. 3a and 3b for routing the communication cables. In addition, the first trace area shown in fig. 2a and 2b can also be used for installing a PDU (Power Distribution Unit). The PDU is a product designed for providing power distribution for the cabinet-mounted electrical equipment, has various series specifications of different functions, different mounting modes and different insertion combinations, and can provide a proper rack-mounted power distribution solution for different power supply environments.

In specific implementation, referring to fig. 5 and 7, the frame body 11 may be formed by welding a square pipe, a rectangular pipe, etc., and mainly plays a role of supporting and fixing the inner-layer cabinet body 2, and has sufficient strength and rigidity.

In an implementation solution, the inner cabinet 2 may be a box structure with an open top. For example, as shown in fig. 5, the inner cabinet 2 has a box structure with an open top, and the cross section of the box is T-shaped, the open top is large, and the body of the box is small. The cable sealing joint 5 is arranged at the upper part of the inner layer cabinet body 2. Specifically, the cable sealing joints 5 are multiple; a plurality of said cable gland fittings 5 are arranged along at least one edge of the top opening of said inner cabinet 2. For example, as shown in fig. 4, the inner cabinet 2 has a rectangular box structure having long sides in the longitudinal direction, and the plurality of cable sealing joints 5 are arranged along the long sides of the inner cabinet 2.

Referring to fig. 4, the heat generating device 10 may be placed into the inner cavity 21 of the inner cabinet 2 through the top opening. After the heat generating device 10 is placed in the inner cavity 21, an upper cover can be covered above the inner layer cabinet 2 with the top open. As shown in fig. 1a and 1b, the cooling cabinet may further include an upper cover 6; the upper cover 6 is arranged on the inner layer cabinet body 2, and seals the inner cavity 21 through a sealing strip 62 (see fig. 5 and 7), so that natural volatilization of liquid is prevented, and foreign matters such as dust are prevented from falling. In addition, the upper cover 6 may further be provided with at least one transparent window 61, so that an observer can observe the state of each device or indicator lights on some devices in the inner cabinet 2 without opening the cover.

Specifically, as shown in fig. 5, a cable arranging frame 7 may be further disposed on the inner cavity wall of the inner cabinet 2 for arranging connection cables among the heating devices 10 in the inner cavity 21. Of course, the wire management rack 7 can be divided into: a front wire arranging frame 71 and a rear wire arranging frame 72. For example, the front and rear wire frames 71 and 72 can be used to carry cable routing and fixing between the heat generating devices 10. Further, the inner cabinet body 2 is of a box body structure with an open top, the cross section of the box body is in a T shape, the top of the box body is large, and the body of the box body is small. The front wire arrangement frame 71 and the rear wire arrangement frame 72 can be respectively arranged at a step 214 formed by a T-shaped structure of the box body. The cables can extend out of the inner cabinet 2 from the front wire arrangement frame 71 or the rear wire arrangement frame 72 through cable sealing joints arranged at the joint holes 215, or the cables enter the front wire arrangement frame 71 and the rear wire arrangement frame 72 through the cable sealing joints and then extend into the inner cavity of the inner cabinet 2, so that the corresponding heating devices 10 can be connected conveniently.

In a further implementation, referring to fig. 5 and 6, the cooling cabinet further includes: a perforated plate 8 and a fixing plate 9. Referring to fig. 8, the porous plate 8 is disposed in the inner cabinet 2 and has a gap with the bottom of the inner cavity 21 to form a flow passage space 211 for the cooling liquid; and the fixing plate 9 is erected on the porous plate 8 and is used for fixing the heating device 10. A backflow channel 212 is further arranged on the inner cabinet body 2, and a liquid inlet 213 of the backflow channel 212 is positioned at the upper part of the inner cavity 21; the cooling liquid in the flow passage space 211 flows upward through the heat generating device through the through holes 81 in the porous plate 8; enters the backflow channel 212 from the liquid inlet 213. In specific implementation, the porous plate 8 can be formed by assembling a plurality of assembling plates, and two adjacent assembling plates are detachably connected.

The through holes 81 on the porous plate 8 can be uniformly distributed, and the cooling liquid enters the inner cavity 21 and contacts with the heating device for heat exchange. Because the cooling liquid passing through the through holes 81 flows uniformly, the cooling liquid can uniformly pass through each heating device in the inner cavity, and is discharged after fully exchanging heat with the heating device. If a through hole designed for cooling is arranged on the heating device from bottom to top, the layout of the through hole 81 can correspond to the lower port of the through hole of the heating device, and cooling liquid enters the through hole after entering the lower port to fully exchange heat with the heating device and then is discharged from the upper port; this is advantageous in that the coolant flows upward from below inside the heat generating device 10.

Referring to fig. 6, the fixing plate 9 is two vertical plates, and forms a U-shaped structure with the porous plate 8. As shown in fig. 6, the fixing plate 9 is provided with a mounting slideway 91 for mounting, guiding, positioning, supporting, fixing, and the like. Specifically, the mounting chute 91 may be a mounting chute or a protruding rail; correspondingly, the heating device 10 is provided with a structure adapted to the installation slideway 91. Referring to fig. 4, the heat generating device 10 may be inserted into two vertical plates of the fixing plate 9 through mounting slideways 91.

Further, the inner-layer cabinet body 2 is of a rectangular box body structure with an open top; the rectangular box body structure is provided with two opposite short side walls; referring to fig. 3a, 3b and 8, the two opposite short side walls are respectively provided with the return channel 212, the liquid outlet 4 located at the bottom of the short side wall and communicated with the return channel 212, and the liquid inlet 3 located at the bottom of the short side wall and communicated with the flow channel space 211. The liquid in the return channel has higher temperature, so the cable is influenced to a certain extent; therefore, in the present embodiment, cables are arranged at the other two long side walls of the inner layer cabinet 2.

Further, referring to fig. 5 and 7, the cooling cabinet further includes a sensor 20. The sensor 20 may include at least one of: liquid level sensor, temperature sensor. And the liquid level sensor is arranged in an inner cavity in the inner layer cabinet body and used for detecting the liquid level of the cooling liquid in the inner cavity. And the temperature sensor is arranged in the inner cavity of the inner-layer cabinet body and used for detecting the temperature of the cooling liquid in the inner cavity. In particular embodiments, the sensors 20 may be placed at multiple locations in the cooling cabinet to facilitate viewing.

As shown in fig. 1a, 1b, 2a, 2b, 3a, 3b, 7, the cooling cabinet may further comprise a lifting eye 50 for lifting and moving. Of course, the cooling cabinet may also contain transport casters 60 for carrying and moving on short roads. After being moved into position, the support posts 70 of the cooling cabinet can be adjusted to function as support and securing for the cabinet. The height of the supporting column 70 can be automatically adjusted or manually adjusted.

Fig. 8 shows a liquid path schematic diagram of the cooling cabinet, wherein the cooler cooling liquid enters the flow channel space 211 at the bottom of the inner cabinet from the liquid inlets 3 at the left and right sides of the bottom of the inner cabinet, then enters the inner cavity upwards from the porous plate 8, and is changed into hotter liquid after passing through the heating device, and then flows from the top of the inner cavity to the left and right sides of the inner cabinet 2 to enter the backflow passage 212 through the liquid inlet 213, and finally flows out from the liquid outlet 4. The liquid from the liquid outlet 4 can flow to the heat exchanger, and the warmer cooling liquid after passing through the heat exchanger is changed into the cooler liquid and then flows back to the liquid inlet 3 for reciprocating circulation.

The cooled cooling liquid enters the inner cavity, forms high-temperature liquid after exchanging heat with a heating device (such as a server) in the inner cavity, and then enters the heat exchanger for heat exchange, and the form belongs to a single-phase immersion cooling mode. The technical scheme that this application embodiment provided also can the applied function at diphase submergence cooling mode, and the device that generates heat in the inner chamber promptly generates heat, if the temperature has surpassed the boiling point of coolant liquid (like the liquid of fluoridizing), the coolant liquid will take place to vaporize, because the action of gravity, the vaporized gas can rise to inner chamber upper portion. Correspondingly, in the scheme of the embodiment, a vaporization space is reserved above the cooling liquid in the inner cavity; the top of the inner cavity can be provided with a coil pipe, and cooling water is connected in the coil pipe; the vaporized cooling liquid is pre-cooled, liquefied, sunk and refluxed.

The heat generating device at least partially immersed in the cooling liquid in the above embodiments may be: servers, switches, and other electronic devices. A server is a type of computer that runs faster and is more heavily loaded than a regular computer. A server provides computing or application services to other clients in a network. The server has high-speed computing capability, long-time reliable operation, strong I/O external data throughput capability and better expansibility. Taking a server as an example, a liquid cooling server device is provided below. This liquid cooling server equipment includes: a cooling cabinet and at least one server 100 (i.e., the heat generating device 10 shown in fig. 4 in the above embodiment). Wherein, the cooling cabinet contains cooling liquid; referring to fig. 9, at least one server 100 is immersed in the cooling fluid of the cooling cabinet. In particular implementations, the servers 100 may be entirely submerged in the cooling fluid. Referring to fig. 1a, 1b, 2a, 2b, 3a, 3b, 4, 5 and 9, the cooling cabinet comprises: outer frame 1, inlayer cabinet body 2, inlet 3, liquid outlet 4 and cable sealing joint 5. The inner cabinet 2 is disposed in the outer cabinet frame 1, and has an inner cavity 21 for accommodating a cooling liquid, so that the server 100 (i.e., the heat generating device 5 shown in fig. 4) disposed in the inner cavity 21 is immersed in the cooling liquid. And the liquid inlet 3 and the liquid outlet 4 are arranged on the inner-layer cabinet body 2 and are used for connecting cooling liquid into the inner cavity 21 through the liquid inlet 3 and then flowing out of the liquid outlet 4 after passing through the inner cavity. In specific implementation, the liquid inlet 3 and the liquid outlet 4 may be provided in plural, for example, as shown in fig. 3a and 3b, the liquid inlet 3 and the liquid outlet 4 are provided at two opposite ends of the inner cabinet 2. The cable sealing joint 5 is arranged on the inner cavity wall of the inner-layer cabinet body 2 and used for leading cables into the inner cavity 21 from the outside or leading the cables out of the inner cavity 21 from the inner cavity 2. The cables led in or led out through the cable sealing joint 5 are arranged in a space between the outer layer frame 1 and the outer wall of the inner layer cabinet body 2. For example, as shown in fig. 2a, 2b, 3a and 3b, a cabling region (e.g., cabling channel 13) is disposed in the space between the outer frame and the outer wall of the inner cabinet 2, and cables can be disposed in the cabling channel 13.

In one implementation, the server may include high-density energy-consuming devices and low-density energy-consuming devices. The mode of this scheme of adoption inserts behind the inner chamber 21, because of the cooler coolant liquid flows from the inner chamber bottom to top, compared, the temperature of the coolant liquid of bottom is lower, can be close to the inner chamber bottom as far as possible with the high density energy consumption device of server, is favorable to the heat dissipation of server like this. The high-density energy consumption device can be a device which is used for performing high-density calculation in a server and needs high energy consumption, and can comprise: chip set, memory, network card, etc. The chipset may be a processor supported on a server motherboard, and may include but is not limited to: a computing chip such as a CPU, a GPU, an ASIC, etc., a VR chip, a PCH (integrated south bridge) chip, etc. The low-density energy consumption device can be a device with lower energy consumption except the high-density energy consumption device in the server, and can be a hard disk and the like. The hard disk is one of the main storage media of the server. Hard disks may include, but are not limited to: solid state disks (SSD disks, new helium-filled hard disks), mechanical hard disks (HDD legacy hard disks), and so forth.

It should be noted here that the cooling cabinet in the liquid cooling server device provided in this embodiment may be implemented by using the structure in the foregoing embodiment, and specific implementation may refer to corresponding contents in the foregoing embodiment, which is not described herein again.

Further, the liquid cooling server device provided by this embodiment may further include an interactive machine. As shown in fig. 9, the switch 200 is immersed in the cooling fluid of the cooling cabinet. The switch 200 is electrically connected to at least one server 100, such as by a communication cable. The switch 200 may be disposed at any position within the interior cavity of the inner cabinet, and the embodiment is not particularly limited thereto. In one embodiment, as shown in fig. 9, when a plurality of servers 100 are housed in the cooling cabinet, the plurality of servers 100 and the switch 200 are arranged in a straight line, and the switch 200 is located at an intermediate position, such arrangement facilitates routing.

In addition, in this embodiment, the liquid-cooled server device may support multiple types of devices, both homogeneous and heterogeneous, for example, a cooling cabinet in the liquid-cooled server device may include only a homogeneous multicore processor of a single CPU; alternatively, the cooling liquid cabinet in the liquid-cooled server device may include a heterogeneous multi-core processor having other operation modules (such as a GPU) in addition to the CPU.

Further, the liquid cooling server device provided in this embodiment may further include: a heat exchanger (not shown). The heat exchanger is disposed outside the inner cabinet 2, and is configured to exchange heat between the cooling fluid in the inner cavity 21 and a cooling medium (such as water) in an external heat dissipation system. Still further, a circulating pump can be arranged on a cooling liquid conveying pipeline between the liquid cooling server equipment and the heat exchanger, and the conveying speed of the cooling liquid in the inner layer cabinet body can be adjusted by adjusting the rotating speed of the circulating pump, so that the heat exchange efficiency is ensured, and the heat exchanger is suitable for cooling the server immersed in the liquid under various loads.

Referring to fig. 9, the power supply cables enter the cavity through the cable gland from one side of the cooling cabinet (i.e., above as shown in fig. 9), connect to the server 100 and the switch 200, and supply power to the server 100 and the switch 200. The data cables from the switch 200 to the server 100 may be disposed in the front wire arrangement rack and/or the rear wire arrangement rack in the inner cavity of the inner cabinet 2, and do not go out of the inner cavity of the inner cabinet 2. The uplink optical fiber of the switch 200 is connected out from the uplink port of the switch 200 and is led out of the inner cavity of the inner cabinet 2 through the cable sealing joint.

Fig. 10 is a schematic structural diagram of a liquid cooling server system according to an embodiment of the present application. As shown in fig. 10, the liquid cooling server system includes: at least one liquid-cooled server apparatus 300 and a management and control device 400. The management and control apparatus 400 is respectively connected to the at least one liquid-cooling server device 300, and is configured to control cooling, power supply, data interaction, and the like of the at least one liquid-cooling server device. The liquid cooling server apparatus 300 includes: the cooling system comprises a cooling cabinet containing cooling liquid and at least one server immersed in the cooling liquid. Referring to fig. 9, at least one server 100 is immersed in the cooling fluid of the cooling cabinet. Referring to fig. 1a, 1b, 2a, 2b, 3a, 3b, 4, 5 and 9, the cooling cabinet comprises: outer frame 1, inlayer cabinet body 2, inlet 3, liquid outlet 4 and cable sealing joint 5. The inner cabinet 2 is disposed in the outer cabinet frame 1, and has an inner cavity 21 for accommodating a cooling liquid, so that the server 100 (i.e., the heat generating device 5 shown in fig. 4) disposed in the inner cavity 21 is immersed in the cooling liquid. And the liquid inlet 3 and the liquid outlet 4 are arranged on the inner-layer cabinet body 2 and are used for connecting cooling liquid into the inner cavity 21 through the liquid inlet 3 and then flowing out of the liquid outlet 4 after passing through the inner cavity. In specific implementation, the liquid inlet 3 and the liquid outlet 4 may be provided in plural, for example, as shown in fig. 3a and 3b, the liquid inlet 3 and the liquid outlet 4 are provided at two opposite ends of the inner cabinet 2. The cable sealing joint 5 is arranged on the inner cavity wall of the inner-layer cabinet body 2 and used for leading cables into the inner cavity 21 from the outside or leading the cables out of the inner cavity 21 from the inner cavity 2. The cables led in or led out through the cable sealing joint 5 are arranged in a space between the outer layer frame 1 and the outer wall of the inner layer cabinet body 2. For example, as shown in fig. 2a, 2b, 3a and 3b, a cabling region (e.g., cabling channel 13) is disposed in the space between the outer frame and the outer wall of the inner cabinet 2, and cables can be disposed in the cabling channel 13.

Fig. 10 illustrates a scheme in which the management apparatus 400 is used to control cooling of the at least one liquid-cooled server device. Each liquid cooling server equipment all is connected with a circulating pump 500, and management and control device 400 is connected with each circulating pump 500 to adjust the conveying speed of inner cabinet body cooling liquid through the rotational speed that sends corresponding control command regulation circulating pump 500 to circulating pump 500, thereby guarantee heat exchange efficiency, the server of adaptation in the immersion liquid is at the cooling under the multiple load. An automatic control module, such as a neural network model, may be preset in the management and control apparatus 400, and the neural network model is executed to obtain a control parameter (i.e., a rotation speed of the circulation pump) by obtaining relevant parameters (such as load, temperature of the cavity coolant, and the like) of each liquid-cooled server device, and taking the relevant parameters as parameters of the neural network model. The neural network model is a model which completes training by using a training sample. Of course, the control device may also send the control parameters specified by the user to the corresponding circulation pump based on the control instruction input by the user through the interactive interface.

In specific implementation, the management and control device may include, but is not limited to: the control device (e.g., a control panel with an interactive interface), the intelligent terminal (e.g., a mobile phone, a notebook computer, a desktop computer, etc.), the processing device (e.g., a server), and the like, which are disposed in the machine room, are not particularly limited in this embodiment of the present application.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A cooling cabinet, comprising:

an outer layer cabinet frame;

2. The cooling cabinet of claim 1, wherein the outer frame comprises:

a gap is reserved between the frame body and the outer wall of the inner layer cabinet body to form the space;

a wiring area is divided in the space;

and the cabinet door is movably connected with the frame body so as to open or close the space.

3. The cooling cabinet of claim 2, wherein at least one routing channel is provided on an outer wall of the rack or the inner cabinet to provide the routing area.

4. The cooling cabinet of claim 2,

according to different signal transmission types, the cables are divided into cables with different functions;

different functional cables are arranged in different wiring areas.

5. The cooling cabinet of claim 3,

the frame body is provided with a plurality of vertical sides;

and the wiring areas for laying cables with different functions are positioned on different vertical sides of the frame body.

6. The cooling cabinet of claim 4, further comprising power and communication cables;

the frame body is a rectangular frame and is provided with two opposite long-edge vertical surfaces, namely a front side and a rear side;

a first wiring area is divided in a space formed by the inner-layer cabinet body and the front side of the frame body;

a second wiring area is divided in a space formed by the inner-layer cabinet body and the rear side of the frame body;

the first wiring area is used for laying one of the power supply cable and the communication cable, and the second wiring area is used for laying the other of the power supply cable and the communication cable.

7. The cooling cabinet of any one of claims 1 to 6,

the inner layer cabinet body is of a box body structure with an open top;

the cable sealing joint is arranged at the upper part of the inner layer cabinet body.

8. The cooling cabinet of claim 7,

the cable sealing joints are multiple;

and a plurality of cable sealing joints are arranged along at least one edge of the top opening of the inner layer cabinet body.

9. The cooling cabinet of claim 7, further comprising:

the upper cover is arranged on the inner-layer cabinet body and seals the inner cavity through a sealing strip;

the upper cover is provided with at least one perspective window.

10. The cooling cabinet as claimed in any one of claims 1 to 6, wherein a wire arranging rack is arranged on the inner cavity wall of the inner-layer cabinet body for arranging connection cables required by the heat generating devices in the inner cavity.

11. The cooling cabinet of any one of claims 1 to 6, further comprising:

the perforated plate is arranged in the inner layer cabinet body, and a gap is formed between the perforated plate and the bottom of the inner cavity to form a flow passage space of cooling liquid;

the fixing plate is erected on the porous plate and used for fixing the heating device;

the inner-layer cabinet body is also provided with a backflow channel, and a liquid inlet of the backflow channel is positioned at the upper part of the inner cavity; the cooling liquid in the flow passage space flows upwards through the heating device through the through holes on the porous plate; and entering the backflow channel from the liquid inlet.

12. The cooling cabinet of claim 11,

the inner layer cabinet body is of a rectangular box body structure with an open top;

the rectangular box body structure is provided with two opposite short side walls;

the two opposite short side walls are provided with the return channel, the liquid outlet which is positioned at the bottom of the short side wall and communicated with the return channel, and the liquid inlet which is positioned at the bottom of the short side wall and communicated with the flow channel space.

13. The cooling cabinet of any one of claims 1 to 6, further comprising at least one of:

the liquid level sensor is arranged in the inner cavity of the inner-layer cabinet body and used for detecting the liquid level of the cooling liquid in the inner cavity;

and the temperature sensor is arranged in the inner cavity of the inner-layer cabinet body and used for detecting the temperature of the cooling liquid in the inner cavity.

14. A liquid-cooled server apparatus, comprising:

a cooling cabinet containing cooling liquid;

at least one server immersed in the cooling liquid of the cooling cabinet;

wherein the cooling cabinet comprises:

an outer layer cabinet frame;

15. The liquid cooled server apparatus of claim 14, wherein the outer rack comprises:

a wiring area is divided in the space;

and the cabinet door is movably connected with the frame body so as to open the space or close the space.

16. The liquid cooled server apparatus of claim 15, further comprising a power supply cable and a communication cable;

17. Liquid-cooled server apparatus according to one of claims 14 to 16,

the inner layer cabinet body is of a box body structure with an open top;

18. The liquid cooled server apparatus of claim 17, further comprising:

the upper cover is provided with at least one perspective window.

19. The liquid cooling server equipment as claimed in any one of claims 14 to 16, wherein a wire arranging rack is arranged on the inner cavity wall of the inner layer cabinet body and used for arranging connection cables required by at least one server in the inner cavity.

20. The liquid cooled server apparatus of any one of claims 14 to 16, further comprising:

the fixing plate is erected on the porous plate and used for fixing the at least one server;

21. Liquid-cooled server apparatus according to claim 20,

22. The liquid cooled server apparatus of any one of claims 14 to 16, further comprising:

the interactive machine is immersed in the cooling liquid of the cooling cabinet;

the switch is electrically connected with the at least one server.

23. The liquid cooled server apparatus of any one of claims 14 to 16, further comprising at least one of:

the liquid level sensor is arranged in the inner layer cabinet body and used for detecting the liquid level of the cooling liquid in the inner cavity;

and the temperature sensor is arranged in the inner cabinet body and used for detecting the temperature of the cooling liquid in the inner cavity.

24. The liquid cooled server apparatus of any one of claims 14 to 16, further comprising:

and the heat exchanger is arranged outside the inner-layer cabinet body and is used for carrying out heat exchange on the cooling liquid in the inner cavity and the cooling medium in the external heat dissipation system.

25. A liquid cooled server system, comprising:

at least one liquid-cooled server device;

the cooling cabinet includes:

an outer layer cabinet frame;