CN113365170A

CN113365170A - Loudspeaker module and electronic equipment

Info

Publication number: CN113365170A
Application number: CN202110530420.0A
Authority: CN
Inventors: 李运海; 刘宇; 褚建飞
Original assignee: Honor Device Co Ltd
Current assignee: Beijing Honor Device Co Ltd
Priority date: 2021-05-14
Filing date: 2021-05-14
Publication date: 2021-09-07

Abstract

The application provides a speaker module and electronic equipment relates to electronic equipment technical field, can promote the low frequency loudness under the prerequisite that does not increase the back cavity volume. The loudspeaker module comprises a shell, an inner core and sound-absorbing particles; the housing comprises a first housing portion and a second housing portion; the thickness of the first housing portion is greater than the thickness of the second housing portion; the first shell part is provided with a first wall plate and a second wall plate which are arranged along the thickness direction of the loudspeaker module and are arranged oppositely; the second shell part encloses a second cavity; the inner core is arranged in the first cavity, and a front cavity is formed between the inner core and the first wall plate; a part of rear cavity is formed between the inner core and the second wall plate and communicated with the second cavity to form a rear cavity; and the rear cavity is internally provided with a ventilation elongated slot, the width of the ventilation elongated slot is smaller than the diameter of the sound-absorbing particles, and the sound-absorbing particles are filled in the rear cavity. The speaker module that this application embodiment provided is applied to electronic equipment.

Description

Loudspeaker module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a loudspeaker module and electronic equipment with the loudspeaker module.

Background

The loudspeaker module is used for restoring audio electric signals such as music and voice into sound and can support the function of audio amplification, so that the loudspeaker module is more and more widely applied to electronic equipment such as mobile phones, tablet computers and notebook computers.

Along with the development of electronic equipment such as cell-phones, panel computer, people have had higher demand to the audio frequency experience of speaker module. Higher low frequency loudness can lead to better audio experience. The key factor affecting the low-frequency loudness of the speaker module is the size of the back cavity, and the larger the volume of the back cavity is, the higher the low-frequency loudness is. However, with the trend of thinning and miniaturization of electronic devices, the volume of the rear cavity is limited, which results in that the audio experience of the speaker module is difficult to be improved.

Disclosure of Invention

The embodiment of the application provides a speaker module and electronic equipment, can promote the low frequency loudness of speaker module under the prerequisite that does not increase the back cavity volume.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, some embodiments of the present application provide a loudspeaker module comprising a housing, an inner core, and sound absorbing particles.

Wherein the housing comprises a first housing portion and a second housing portion arranged side by side and secured together; the thickness of the first housing portion in the thickness direction of the speaker module is larger than the thickness of the second housing portion in the thickness direction of the speaker module. The first shell part is provided with a first wall plate and a second wall plate which are arranged along the thickness direction of the loudspeaker module and are arranged oppositely; the second housing portion encloses a second cavity.

In addition, the inner core is arranged in the first cavity, the inner core and the first wall plate are stacked, and a front cavity is formed between the inner core and the first wall plate. The inner core and the second wall plate are stacked, and a partial rear cavity is formed between the inner core and the second wall plate. The part of the rear cavity is communicated with the second cavity to form a rear cavity.

The rear cavity is internally provided with a ventilation elongated slot, the two ends of the ventilation elongated slot are respectively a first end and a second end, the first end of the ventilation elongated slot is positioned in part of the rear cavity, the second end of the ventilation elongated slot is positioned in the second cavity, the width of the ventilation elongated slot is smaller than the diameter of the sound-absorbing particles, and the sound-absorbing particles are filled in the rear cavity. The material of the sound-absorbing particles includes but is not limited to one or more of melamine, zeolite particles, glass fiber and activated carbon.

In the loudspeaker module provided by the application, because the ventilation long groove is arranged, the width of the ventilation long groove is smaller than the diameter of the sound absorption particles, the first end of the ventilation long groove is located in the partial rear cavity, and the second end of the ventilation long groove is located in the second cavity, the ventilation long groove forms an airflow channel for communicating the partial rear cavity with the second cavity, the airflow channel cannot drop the sound absorption particles, and therefore the sound absorption particles can be effectively prevented from blocking the second cavity, and the second cavity cannot be effectively utilized. From this, can promote the low frequency loudness of speaker module under the prerequisite that does not increase the back chamber volume.

In one possible implementation of the first aspect, the second end of the air-venting groove is located in an end of the second chamber body remote from the partial rear chamber. Like this, can prevent effectively that the sound granule of inhaling from blockking up each region of second cavity for whole second cavity homoenergetic can obtain effective utilization, can further promote speaker module's low frequency loudness from this.

In one possible implementation of the first aspect, the first end of the air-venting groove is located in an end of the partial rear chamber that is remote from the second chamber body. Like this, can avoid inhaling each region that the partial back chamber was blockked up to the sound granule for whole partial back chamber can obtain effective utilization, has further promoted speaker module's low frequency loudness from this.

In a possible implementation manner of the first aspect, a plurality of ribs are arranged on an inner wall of the rear cavity side by side, and the ventilation long groove is formed between two adjacent ribs. The structure is simple, and the structural strength of the rear cavity wall plate where the ventilation long groove is located cannot be affected.

In a possible implementation manner of the first aspect, a rib is arranged on an inner wall of the rear cavity, the rib includes a plurality of first rib sections arranged side by side and a second rib section connected between two adjacent first rib sections, and the ventilation long groove is formed between two adjacent first rib sections. Like this, the rib is approximately to be snakelike structure, and this simple structure realizes easily.

In one possible implementation of the first aspect, the rib is integrally formed with the rear cavity wall panel in which the rib is located. Therefore, the loudspeaker module comprises fewer parts, and the assembly efficiency is improved.

In a possible implementation manner of the first aspect, the ventilation elongated slot is a groove formed on the inner wall of the rear cavity. The structure is simple, and the inner space of the rear cavity can not be occupied.

In a possible implementation manner of the first aspect, at least part of the wall plates of the rear cavity is a corrugated plate, and the ventilation long grooves are formed between two adjacent wave crests arched towards the inside of the rear cavity. The structure can not occupy the inner space of the rear cavity, and can ensure the structural strength of the rear cavity wall plate.

In a possible implementation manner of the first aspect, the number of the air-vent long grooves is multiple, the air-vent long grooves are arranged side by side, first ends of the air-vent long grooves are located in a part of the rear cavity, and second ends of the air-vent long grooves are located in the second cavity. Thus, a plurality of airflow channels can be formed to effectively prevent the sound-absorbing particles from blocking the second cavity and causing the second cavity not to be effectively utilized.

In one possible implementation manner of the first aspect, the speaker module further includes a mesh. The sound-absorbing particles are filled in one side of the separation net, which is far away from the inner core. The separation net is used for preventing sound absorption particles from entering the inner core, so that interference of the separation net on the movement of the inner core driving device and the vibrating diaphragm is avoided.

In one possible implementation manner of the first aspect, the second housing portion has a third wall plate and a fourth wall plate which are arranged in the thickness direction of the speaker module and are arranged opposite to each other. The surface of the third wallboard and the surface of the first wallboard face the first side of the loudspeaker module, the surface of the fourth wallboard and the surface of the second wallboard face the second side of the loudspeaker module, and the first side and the second side are opposite sides of the loudspeaker module respectively. The outer surface of the second panel is flush with the outer surface of the fourth panel. Like this for the speaker module can closely laminate through the surface of second wallboard, the surface of fourth wallboard and the internal surface of back of the body lid, with the compact structure nature of guaranteeing electronic equipment. Meanwhile, the thickness of the first housing portion in the thickness direction of the speaker module is larger than that of the second housing portion in the thickness direction of the speaker module. Wherein the thickness of the first housing portion in the thickness direction of the speaker module is equal to the distance between the outer surface of the first wall plate and the outer surface of the second wall plate. The thickness of the second housing portion in the thickness direction of the speaker module is equal to the distance between the outer surface of the third wall plate and the outer surface of the fourth wall plate. Therefore, the first escape space can be formed on the side of the third wall plate facing the outer surface. When being applied to electronic equipment with this speaker module in, this first dodge space is used for dodging the fingerprint identification module.

In one possible implementation manner of the first aspect, the first housing portion further includes a first side frame, the first side frame is disposed between the first wall plate and the second wall plate, and the first side frame is disposed around edges of the first wall plate and the second wall plate. The second housing portion further includes a second side frame disposed between the third wall panel and the fourth wall panel, and the second side frame is disposed around edges of the third wall panel and the fourth wall panel. The first wall plate, the third wall plate, the first side frame and the second side frame are integrally formed into a front shell. The second wall plate and the fourth wall plate are integrally formed into a rear shell. Like this, the casing is formed by preceding shell and backshell involution assembly, can compromise assembly efficiency and assembly degree of difficulty simultaneously.

In a possible implementation manner of the first aspect, each of the front shell and the rear shell includes a metal middle plate and a plastic frame disposed at an edge of the metal middle plate. The material of the metal middle plate includes but is not limited to stainless steel, aluminum alloy, magnesium aluminum alloy and the like. The hardness of metal is great, is favorable to reducing the regional thickness in middle part of preceding shell and backshell, increases the height of first cavity and second cavity in the thickness direction of speaker module. The metal middle plate and the plastic frame may be fixed together by gluing, clamping, screwing, in-mold Injection (IMD), and the like, which is not limited herein. In some embodiments, the metal middle plate and the plastic frame are fixed together by an IMD process. In this way, the use of glue or other consumables for making the connection can be avoided. In addition, the plastic frame of the front shell can be directly pressed together with the plastic frame of the rear shell through an ultrasonic welding process, so that glue materials or other consumable materials for realizing connection are avoided.

In one possible implementation manner of the first aspect, the first side frame includes a first side wall and a second side wall which are oppositely arranged. The sound outlet channel is arranged on the first side wall. The second side frame comprises a third side wall and a fourth side wall which are oppositely arranged. The outer surface of the third side wall and the outer surface of the first side wall face the third side of the loudspeaker module. The outer surface of the fourth side wall and the outer surface of the second side wall face the fourth side of the speaker module. The third side and the fourth side are respectively opposite sides of the loudspeaker module. The outer surface of the second side wall and the outer surface of the fourth side wall are used for being attached to the side face of the battery when the loudspeaker module is applied to the electronic equipment. In some embodiments, the outer surface of the second sidewall is flush with the outer surface of the fourth sidewall. Therefore, the loudspeaker module can be tightly attached to the side face of the battery, and the structural compactness of the electronic equipment is guaranteed.

In one possible implementation form of the first aspect, the housing further comprises a third housing part. The third shell part is of a plate-shaped structure; the third housing portion is flush with the second wall plate and the fourth wall plate, and the third housing portion is integrally formed with the second wall plate and the fourth wall plate. Therefore, the structural composition of the shell can be simplified, and the assembly difficulty of the shell is reduced.

In a second aspect, some embodiments of the present application provide an electronic device, which includes a screen, a back case, a fingerprint identification module, a circuit board, and the speaker module according to any one of the above technical solutions.

The screen is including the printing opacity apron and the display screen of range upon range of setting, and the dorsal scale includes frame and back of the body lid, and printing opacity apron and back of the body lid are located the both sides of frame respectively, and printing opacity apron, frame and back of the body lid enclose into electronic equipment's inside accommodation space.

Display screen, fingerprint identification module, circuit board and speaker module are located inside accommodation space, and the first casing part of fingerprint identification module, circuit board and speaker module arranges side by side in the plane parallel with the screen, and the second casing part of speaker module is located one side of keeping away from the printing opacity apron of fingerprint identification module, and the orthographic projection region of second casing part on the printing opacity apron with the orthographic projection region overlap of fingerprint identification module on the printing opacity apron.

The inner core of the loudspeaker module is electrically connected with the circuit board, the frame is provided with a sound outlet, and the sound outlet channel of the loudspeaker module is communicated with the sound outlet.

Because the electronic equipment that this application embodiment provided includes as above any technical scheme the speaker module, consequently the same technical problem can be solved to the two to reach the same technological effect.

In one possible implementation of the second aspect, the housing further comprises a third housing portion. The third housing portion is a plate-like structure. The third housing portion is flush with the second wall and the fourth wall. And the third housing portion is integrally formed with the second wall plate and the fourth wall plate. The third shell part of the loudspeaker module is positioned on one side of the circuit board far away from the light-transmitting cover plate. And the orthographic projection area of the third shell part on the light-transmitting cover plate is overlapped with the orthographic projection area of the circuit board on the light-transmitting cover plate. The third housing portion is for protecting the sub circuit board and the electronic components integrated on the sub circuit board. Simultaneously, third casing part is neat with second wallboard, fourth wallboard for speaker module can closely laminate with the surface of back lid towards the screen, with the compact structure nature of guaranteeing electronic equipment.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is a schematic cross-sectional view of the electronic device shown in FIG. 1 at line A-A;

fig. 4 is a perspective view of a speaker module in the electronic device shown in fig. 2 and 3;

fig. 5 is a schematic structural view of the speaker module shown in fig. 4 from bottom to top;

FIG. 6 is a perspective cross-sectional view of the speaker module of FIG. 4 taken along line B-B;

FIG. 7 is a perspective cross-sectional view of the speaker module of FIG. 4 taken along line C-C;

fig. 8 is an exploded view of the speaker module of fig. 4;

FIG. 9 is a schematic view of the speaker module shown in FIG. 4 in another orientation;

fig. 10 is a schematic cross-sectional view of the core of the speaker module of fig. 6-8;

fig. 11 is a schematic view of a rear housing of the speaker module of fig. 8;

FIG. 12 is an enlarged view of area I in the rear housing shown in FIG. 11;

fig. 13 is a schematic view of another structure of a rear housing of the speaker module shown in fig. 8;

fig. 14 is a schematic view of another structure of a rear housing of the speaker module shown in fig. 8;

FIG. 15 is a schematic structural view of a rear chamber wall panel with venting slots therein according to further embodiments of the present application;

FIG. 16 is a cross-sectional structural view of the rear chamber wall panel with the venting slots in FIGS. 12-15;

FIG. 17 is a cross-sectional view of a rear chamber wall panel with venting grooves therein according to still other embodiments of the present application;

fig. 18 is a schematic cross-sectional view of a rear chamber wall panel with venting grooves therein according to further embodiments of the present application.

Detailed Description

In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", "third", "fourth" may explicitly or implicitly include one or more of the features.

In the embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The present application provides an electronic device 100, wherein the electronic device 100 is a type of electronic device having a speaker module. Specifically, the electronic device 100 includes, but is not limited to, a mobile phone, a tablet personal computer (tablet personal computer), a laptop computer (laptop computer), a Personal Digital Assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, and a wearable device.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device 100 according to some embodiments of the present disclosure, and fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. In this embodiment, the electronic device 100 is a mobile phone. Specifically, the electronic device 100 includes a screen 10, a back case 20, a main circuit board 30, a sub-circuit board 40, a connection structure 50, a battery 60, a fingerprint identification module 70, and a speaker module 80.

It is to be understood that fig. 1 and 2 and the related drawings below only schematically illustrate some components included in the electronic device 100, and the actual shape, the actual size, the actual position and the actual configuration of the components are not limited by fig. 1 and 2 and the following drawings. In addition, when the electronic apparatus 100 is a device of some other form, the electronic apparatus 100 may not include the sub circuit board 40, the connection structure 50, and the battery 60.

In addition, an XYZ coordinate system is established for the convenience of the description of the embodiments below. Specifically, the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It is understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and is not particularly limited herein.

The screen 10 is used to display images, videos, and the like. The screen 10 comprises a light-transmissive cover plate 11 and a display screen 12. The transparent cover plate 11 and the display screen 12 are stacked and fixedly connected. The light-transmitting cover plate 11 is mainly used for protecting and preventing dust of the display screen 12. The material of the transparent cover plate 11 includes, but is not limited to, glass. The display 12 may be a flexible display or a rigid display. For example, the display 12 may be an organic light-emitting diode (OLED) display, an active matrix organic light-emitting diode (AMOLED) display, a mini-OLED (mini-organic light-emitting diode) display, a micro-led (micro-organic light-emitting diode) display, a micro-OLED (micro-organic light-emitting diode) display, a quantum dot light-emitting diode (QLED) display, or a Liquid Crystal Display (LCD).

The back case 20 serves to protect internal electronics of the electronic device 100. The back case 20 includes a back cover 21 and a bezel 22. The back cover 21 is located on one side of the display 12 away from the transparent cover plate 11, and is stacked with the transparent cover plate 11 and the display 12. The frame 22 is located between the back cover 21 and the transparent cover plate 11, and the frame 22 is fixed on the back cover 21. Illustratively, the frame 22 may be fixedly attached to the back cover 21 by an adhesive. The frame 22 may also be integrally formed with the back cover 21, that is, the frame 22 and the back cover 21 are a unitary structure. The light-transmitting cover plate 11 is fixed on the frame 22. In some embodiments, the light-transmissive cover plate 11 may be fixed to the frame 22 by gluing. The light-transmitting cover plate 11, the back cover 21 and the frame 22 enclose an internal accommodating space of the electronic device 100. The inner receiving space receives the display screen 12 therein.

The main circuit board 30, the sub circuit board 40, the connection structure 50, the battery 60, the fingerprint identification module 70 and the speaker module 80 are located in the internal receiving space of the electronic device 100.

In some embodiments, referring to fig. 2, the electronic device 100 further includes a midplane 23. The middle plate 23 is fixed to the inner surface of the rim 22 for one circle. For example, the middle plate 23 may be fixed to the frame 22 by welding, and the middle plate 23 may also be integrally formed with the frame 22. The middle plate 23 serves as a structural "skeleton" of the electronic device 100, and the main circuit board 30, the sub-circuit board 40, the battery 60, the fingerprint recognition module 70, and the speaker module 80 may be fixed to the middle plate 23 by means of screw connection, snap connection, welding, or the like.

When the electronic device 100 does not include the middle plate 23, the main circuit board 30, the sub circuit board 40, the battery 60, the fingerprint identification module 70 and the speaker module 80 may be fixed to the surface of the display 12 facing the back cover 21 by screwing, clipping, welding, etc.

The main circuit board 30 is used for integrating a control chip. The control chip may be, for example, an Application Processor (AP), a double data rate synchronous dynamic random access memory (DDR), a universal flash memory (UFS), and the like. In some embodiments, the main circuit board 30 is electrically connected to the display screen 12, and the main circuit board 30 is used to control the display screen 12 to display images or video.

The main circuit board 30 may be a hard circuit board, a flexible circuit board, or a rigid-flexible circuit board. The main circuit board 30 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid FR-4 and Rogers dielectric board, or the like. Here, FR-4 is a code for a grade of flame-resistant material, and the Rogers dielectric plate is a high-frequency plate.

The sub circuit board 40 is used to integrate electronic components such as an antenna (e.g., a 5G antenna) radio frequency front end, a Universal Serial Bus (USB) device, and a vibrator.

The sub circuit board 40 may be a hard circuit board, a flexible circuit board, or a rigid-flex circuit board. The daughter circuit board 40 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid FR-4 and Rogers dielectric board, or the like.

The sub circuit board 40 is electrically connected to the main circuit board 30 through the connection structure 50 to realize data and signal transmission between the sub circuit board 40 and the main circuit board 30. The connection structure 50 may be a Flexible Printed Circuit (FPC). In other embodiments, the connecting structure 50 may also be a wire or a lacquered wire.

The battery 60 is located between the main circuit board 30 and the sub circuit board 40. The battery 60 is used for supplying power to electronic devices such as the display 12, the main circuit board 30, the sub-circuit board 40, the fingerprint identification module 70, and the speaker module 80 in the electronic apparatus 100. In some embodiments, the surface of the middle plate 23 facing the back cover 21 is provided with a battery mounting groove 23a, and the battery 60 is mounted in the battery mounting groove 23 a.

The fingerprint recognition module 70 is located on a side of the battery 60 away from the main circuit board 30. In some embodiments, the secondary circuit board 40 is provided with an avoiding gap a, and the fingerprint identification module 70 is disposed in the avoiding gap a. In other embodiments, the secondary circuit board 40 is not provided with the avoidance gap a, and the fingerprint identification module 70 and the secondary circuit board 40 are arranged side by side in the XY plane (parallel to the screen 10). The fingerprint recognition module 70 is used for recognizing the fingerprint inputted from the surface of the screen 10 far away from the back cover 21.

In some embodiments, the fingerprint recognition module 70 may be fixed to a surface of the middle plate 23 facing the back cover 21. The position that corresponds fingerprint identification module 70 on medium plate 23 is equipped with opening 23b, and fingerprint identification module 70 can discern the fingerprint of keeping away from the surface input of back lid 21 by screen 10 through this opening 23 b. In other embodiments, when the back shell 20 does not include the middle plate 23, the fingerprint identification module 70 may be fixed on the surface of the display 12 facing the back cover 21.

In some embodiments, the fingerprint identification module 70 is electrically connected to the secondary circuit board 40, and at this time, the fingerprint identification module 70 is used for sending an identified fingerprint signal to the primary circuit board 30 through the secondary circuit board 40. Further, the main circuit board 30 controls the display 12 to display an image or video according to the fingerprint signal. In other embodiments, the fingerprint identification module 70 may also be directly electrically connected to the main circuit board 30 through a connection structure such as an FPC, a wire, an enameled wire, etc.

The speaker module 80 is located on a side of the battery 60 remote from the main circuit board 30. The speaker module 80 is used for restoring audio electrical signals such as music and voice into sound, and can support the function of audio playing. In some embodiments, speaker module 80 is electrically connected to sub-circuit board 40. At this time, the audio electrical signal sent by the main circuit board 30 is transmitted to the speaker module 80 via the sub circuit board 40, and further converted into an audio signal by the speaker module 80 to be output. Specifically, the speaker module 80 has a sound outlet channel 80 d. The sound signal output from the speaker module 80 is output from the sound output channel 80 d. Referring to fig. 1 and 2, the frame 22 is provided with sound holes 22 a. The sound outlet hole 22a communicates with the sound outlet passage 80 d. The sound signal output from the sound outlet channel 80d is further output from the electronic device 100 through the sound outlet hole 22 a. In other embodiments, the speaker module 80 may also be directly electrically connected to the main circuit board 30 through a connection structure such as an FPC, a wire, an enamel wire, or the like.

The speaker module 80 further includes a first portion 80a, a second portion 80b, and a third portion 80 c. Referring to fig. 3, fig. 3 is a cross-sectional view of the electronic device 100 shown in fig. 1 at a line a-a. The first portion 80a is arranged in the XY plane side by side with the fingerprint recognition module 70 and the sub board 40. The second portion 80b is located on one side of the fingerprint identification module 70 close to the back cover 21, and the orthographic projection area of the second portion 80b on the back cover 21 overlaps with the orthographic projection area of the fingerprint identification module 70 on the back cover 21. Wherein "overlap" means "partially overlap" or "completely overlap". The third portion 80c is located on the side of the electronic component-integrated sub circuit board 40 close to the back cover 21, and the orthographic projection area of the third portion 80c on the back cover 21 overlaps with the orthographic projection area of the electronic component-integrated sub circuit board 40 on the back cover 21.

The thickness of the second portion 80b along the Z-axis is less than the thickness of the first portion 80a along the Z-axis, as limited by the fingerprint recognition module 70. The thickness of the third portion 80c in the Z-axis direction is also smaller than the thickness of the first portion 80a in the Z-axis direction, limited by the sub-circuit board 40 into which the electronic components are integrated. Further, since the thickness of the pattern recognition module 70 in the Z-axis direction is generally smaller than the thickness of the sub circuit board 40 integrated with electronic components in the Z-axis direction, the thickness of the third portion 80c in the Z-axis direction is also smaller than the thickness of the second portion 80b in the Z-axis direction. As can be seen from fig. 2 and 3, the speaker module 80 is irregular in shape due to the pressing of the fingerprint recognition module 70 and the sub-circuit board 40 integrated with electronic components along the Z-axis direction, and due to the pressing of the battery 60, the fingerprint recognition module 70 and the sub-circuit board 40 integrated with electronic components along the X-direction and the Y-direction.

It should be noted that, because the thickness of the third portion 80c along the Z-axis direction is small, the rear cavity expansion space is not usually disposed inside, but is mainly used for filling the gap between the back cover 21 and the secondary circuit board 40, so as to ensure the compactness of the electronic device 100, and shield and protect the secondary circuit board 40 when the electronic device 100 is opened (mainly, the back cover 21 is opened) for maintenance. In other embodiments, the speaker module 80 may not include the third portion 80 c.

The speaker module 80 is fixed to the surface of the middle plate 23 facing the back cover 21 mainly by a first portion 80 a. In some embodiments, the surface of the middle plate 23 facing the back cover 21 is provided with a mounting groove (not shown), and the first portion 80a of the speaker module 80 is embedded in the mounting groove and fixed by a connector such as a screw, a snap, etc. In other embodiments, when the back shell 20 does not include the middle plate 23, the speaker module 80 may be fixed to the surface of the display screen 12 facing the back cover 21 through the first portion 80 a. In some embodiments, the speaker module 80 is also secured to the sub-circuit board 40 by a third portion 80 c.

Referring to fig. 4 and 5, fig. 4 is a perspective view of the speaker module 80 in the electronic device 100 shown in fig. 2 and 3, and fig. 5 is a schematic structural diagram of the speaker module 80 shown in fig. 4 as viewed from bottom to top. In the present embodiment, the speaker module 80 includes a housing 81.

The housing 81 is provided with a fixing portion. The fixing portion includes at least one of a fixing hole 80e and a catch 80 f. The housing 81 is fixed in the electronic apparatus 100 by the fixing portion.

The housing 81 is used to protect its internal structure and encloses a front cavity and a rear cavity with the internal structure. The material of the housing 81 includes, but is not limited to, plastic, metal, and a combination of plastic and metal.

The housing 81 includes a first housing portion 811 and a second housing portion 812 arranged side by side and secured together. The thickness d1 of the first housing portion 811 in the thickness direction of the speaker module 80 is larger than the thickness d2 of the second housing portion 812 in the thickness direction of the speaker module 80.

In the above-described embodiment, the thickness direction of the speaker module 80 refers to a direction that coincides with the thickness direction of the electronic apparatus when the speaker module 80 is mounted in the electronic apparatus. The thickness direction of the speaker module 80 is also the Z-axis direction as described above.

The first housing portion 811 may be a one-piece housing or may be formed by assembling a plurality of portions. Similarly, the second housing portion 812 may be a unitary housing or may be formed from multiple pieces assembled together.

Referring to fig. 6 and 7, fig. 6 is a perspective sectional view of the speaker module 80 shown in fig. 4 taken along line B-B, and fig. 7 is a perspective sectional view of the speaker module 80 shown in fig. 4 taken along line C-C. The first housing portion 811 encloses a first cavity. The first housing portion 811 has a first wall plate 811a, a second wall plate 811b, and a first side frame 811 c. The first wall plate 811a and the second wall plate 811b are arranged in the thickness direction (i.e., the Z-axis direction) of the speaker module 80. The first wall plate 811a is disposed opposite to the second wall plate 811 b. The first side frame 811c is disposed around the edges of the first wall plate 811a and the second wall plate 811b, and the sound outlet passage 80d of the speaker module 80 is disposed on the first side frame 811 c.

The second housing portion 812 encloses a second cavity C3. The second housing portion 812 has a third wall 812a, a fourth wall 812b, and a second side frame 812 c. The third wall 812a and the fourth wall 812b are arranged in the thickness direction (i.e., the Z-axis direction) of the speaker module 80. The third wall 812a and the fourth wall 812b are disposed opposite to each other. The outer surface of the third wall 812a and the outer surface of the first wall 811a face the first side of the speaker module 80. The outer surface of the fourth wall panel 812b and the outer surface of the second wall panel 811b face the second side of the speaker module 80. The first side and the second side are opposite sides of the speaker module 80. The second side frame 812c is disposed around the edges of the third wall panel 812a and the fourth wall panel 812 b.

In the above embodiment, the outer surface of the first wall plate 811a refers to a surface of the first wall plate 811a away from the first cavity. The outer surface of the second wall plate 811b refers to the surface of the second wall plate 811b remote from the first cavity. The outer surface of the third wall panel 812a refers to the surface of the third wall panel 812a distal from the second cavity C3. The outer surface of the fourth wall 812b refers to the surface of the fourth wall 812b that is away from the second cavity C3.

The outer surface of the second wall 811b and the outer surface of the fourth wall 812b are configured to be attached to the back cover 21 of the electronic apparatus 100 when the speaker module 80 is applied to the electronic apparatus 100 shown in fig. 2 and 3. In some embodiments, the outer surface of the second wall panel 811b is flush with the outer surface of the fourth wall panel 812 b. Thus, the speaker module 80 can closely adhere to the inner surface of the back cover 21, so as to ensure the compactness of the electronic device 100.

On the basis of the above-described embodiment, according to the foregoing description, the thickness d1 of the first housing portion 811 in the Z-axis direction is larger than the thickness d2 of the second housing portion 812 in the Z-axis direction (see fig. 5). Wherein a thickness d1 of the first housing portion 811 in the Z-axis direction is equal to a distance between an outer surface of the first wall plate 811a and an outer surface of the second wall plate 811 b. The thickness d2 of the second housing portion 812 in the Z-axis direction is equal to the distance between the outer surface of the third wall 812a and the outer surface of the fourth wall 812 b. Therefore, referring to fig. 6, a first escape space M is formed at a side of the third wall 812a, which is faced by the outer surface. When the speaker module 80 is applied to the electronic device 100 shown in fig. 2 and 3, the first avoidance space M is used for avoiding the fingerprint recognition module 70.

In some embodiments, referring to fig. 8, fig. 8 is an exploded view of the speaker module 80 shown in fig. 4. The first wall plate 811a, the third wall plate 812a, the first side frame 811c and the second side frame 812c are molded as one body, which is hereinafter referred to as a front case K1. The second wall panel 811b and the fourth wall panel 812b are formed as one body, which is hereinafter referred to as a front case K2. Thus, the housing 81 is formed by assembling the front case K1 and the rear case K2, and both the assembling efficiency and the assembling difficulty can be simultaneously considered.

The materials of the front case K1 and the rear case K2 include, but are not limited to, metal and plastic.

In some embodiments, the front case K1 and the rear case K2 each include a metal middle plate and a plastic bezel disposed at an edge of the metal middle plate.

In the above embodiments, the material of the metal middle plate includes, but is not limited to, stainless steel, aluminum alloy, magnesium aluminum alloy, and the like. The hardness of the metal is higher, which is beneficial to reducing the thickness of the middle area of the front shell K1 and the rear shell K2 and increasing the height of the first cavity and the second cavity C3 in the Z-axis direction. The metal middle plate and the plastic frame may be fixed together by gluing, clamping, screwing, in-mold Injection (IMD), and the like, which is not limited herein. In some embodiments, the metal middle plate and the plastic frame are fixed together by an IMD process. In this way, the use of glue or other consumables for making the connection can be avoided. The plastic frame of the front shell K1 can be directly pressed together with the plastic frame of the rear shell K2 through an ultrasonic welding process, so that glue or other consumables used for realizing connection are avoided.

In some embodiments, referring back to fig. 5, the width W1 of the first housing portion 811 in the Y-axis direction is greater than the width W2 of the second housing portion 812 in the Y-axis direction. Thus, at least one side of the second housing portion 812 in the Y-axis direction forms a second escape space N. When the speaker module 80 is applied to the electronic apparatus 100 shown in fig. 2 and 3, the second avoiding space N can avoid the electronic components on the sub board 40.

In some embodiments, referring to fig. 9, fig. 9 is a schematic structural diagram of the speaker module 80 shown in fig. 4 in another orientation. The first side frame 811c includes a first side wall 811c1 and a second side wall 811c2 that are oppositely disposed. The sound emitting passage 80d is provided on the first side wall 811c 1. The second side frame 812c includes a third side wall 812c1 and a fourth side wall 812c2 that are oppositely disposed. The outer surface of the third sidewall 812c1 and the outer surface of the first sidewall 811c1 face the third side of the speaker module 80. The outer surface of the fourth side wall 812c2 and the outer surface of the second side wall 811c2 face the fourth side of the speaker module 80. The third side and the fourth side are opposite sides of the speaker module 80.

In the above embodiment, it should be noted that the outer surface of the first sidewall 811c1 refers to the surface of the first sidewall 811c1 away from the first cavity. The outer surface of the second sidewall 811c2 refers to the surface of the second sidewall 811c2 that is away from the first cavity. The outer surface of the third sidewall 812C1 refers to the surface of the third sidewall 812C1 that is distal from the second cavity C3. The outer surface of the fourth side wall 812C2 refers to the surface of the fourth side wall 812C2 away from the second cavity C3.

The outer surface of the second side wall 811c2 and the outer surface of the fourth side wall 812c2 are configured to be attached to the side of the battery 60 when the speaker module 80 is used in the electronic device 100 shown in fig. 2 and 3. In some embodiments, the outer surface of the second sidewall 811c2 is flush with the outer surface of the fourth sidewall 812c 2. Thus, the speaker module 80 can be closely attached to the side of the battery 60, so as to ensure the compactness of the electronic device 100.

On the basis of the above-described embodiment, according to the foregoing description, the width W1 of the first housing portion 811 in the Y-axis direction is larger than the width W2 of the second housing portion 812 in the Y-axis direction (see fig. 5). Wherein the width W1 of the first housing portion 811 in the Y-axis direction is equal to the distance between the outer surface of the first side wall 811c1 and the outer surface of the second side wall 811c2 in the Y-axis direction. The width W2 of the second housing portion 812 in the Y-axis direction is equal to the distance between the outer surface of the third side wall 812c1 and the outer surface of the fourth side wall 812c2 in the Y-axis direction. Therefore, referring to fig. 9, a second escape space N is formed on a side of the fourth wall 812b, which is faced by the outer surface. When the speaker module 80 is applied to the electronic apparatus 100 shown in fig. 2 and 3, the second avoidance space N is used to avoid the USB device.

In some embodiments, referring to fig. 4-9, the housing 81 further includes a third housing portion 813. The third housing portion 813 has a plate-like structure, and the third housing portion 813 protects the sub-circuit board 40 and electronic components integrated on the sub-circuit board 40. The material of the third housing portion 813 includes, but is not limited to, metal and plastic. In some embodiments, with continued reference to fig. 8, the third housing portion 813 is integrally formed with the second wall 811b and the fourth wall 812 b. Thus, the structural composition of the housing 81 can be simplified, thereby reducing the difficulty of assembling the housing 81.

With continued reference to fig. 6-8, the speaker module 80 further includes an inner core 82. The core 82 is a core element of the speaker module 80 for generating sound. Referring with emphasis to fig. 7, an inner core 82 is disposed within the first cavity. The core 82 and the first wall plate 811a, and the core 82 and the second wall plate 811b are stacked and spaced apart from each other. The inner core 82 and the first wall panel 811a form a front cavity C1 therebetween. The sound outlet passage 80d communicates with the front chamber C1. A partial rear cavity C2 is formed between the inner core 82 and the second wall panel 811b, and referring to fig. 6, the partial rear cavity C2 communicates with the second cavity C3 to form a rear cavity.

Specifically, referring to fig. 10, fig. 10 is a schematic cross-sectional structure diagram of the inner core 82 of the speaker module 80 shown in fig. 6-8. In this embodiment, the core 82 includes a diaphragm 821 and a driving device 822 provided on one side of the diaphragm 821. When the core 82 is applied to the speaker module 80 shown in fig. 6 to 8, a front cavity C1 is formed between the diaphragm 821 and the second wall plate 811 b. The driver 822 is located on the side of the diaphragm 821 remote from the front chamber C1. The driving device 822 is used for driving the diaphragm 821 to vibrate so as to drive the air in the front cavity C1 to vibrate to form sound waves, and the air flow circuit in the front cavity C1 is shown by the path of arrows in fig. 7.

The driving device 822 includes, but is not limited to, an electric (i.e., moving coil) driving device, an electrostatic (i.e., capacitive) driving device, an electromagnetic (i.e., reed) driving device, or a piezoelectric (i.e., crystal) driving device. In some embodiments, the drive 822 is a moving coil drive. Specifically, referring to fig. 10, the driving device 822 includes a voice coil 8221 fixedly connected to the diaphragm 821, a magnetic circuit 8222 disposed on one side of the diaphragm 821, and a frame for mounting the diaphragm 821 and the magnetic circuit 8222. When energized, voice coil 8221 generates an induced magnetic field, which is displaced by the magnetic force of magnetic circuit 8222 to drive diaphragm 821 to vibrate.

In the prior art, in order to increase the low frequency loudness of the speaker module 80 without increasing the physical volume of the rear cavity of the speaker module 80, the sound-absorbing particles 87 may be used to fill the entire rear cavity (including part of the rear cavity C2 and the second cavity C3) so as to maximize the equivalent volume of the rear cavity. The material of the sound-absorbing particles includes but is not limited to one or more of melamine, zeolite particles, glass fiber and activated carbon. In the speaker module 80 according to the above embodiment, referring to fig. 6, the thickness of the second housing portion 812 in the Z-axis direction is small. The second cavity C3 has a smaller height in the Z-axis direction. If the sound-absorbing particles 87 are filled in the whole rear cavity, when the sound-absorbing particles 87 enter the narrow second cavity C3 from the partial rear cavity C2, one end of the second cavity C3 close to the partial rear cavity C2 is easily blocked, so that the air in the second cavity C3 and the air in the partial rear cavity C2 are not communicated, and the part of the second cavity C3 far away from the partial rear cavity C2 cannot be utilized. This reduces the actual equivalent utilization rate of the sound-absorbing particles 87. Meanwhile, the sound-absorbing particles 87 block one end of the second cavity C3 near the partial rear cavity C2, resulting in poor filling uniformity of the sound-absorbing particles 87 throughout the rear cavity.

In order to avoid the above problem, in the embodiment of the present application, please refer to fig. 11 and 12, in which fig. 11 is a schematic structural diagram of a rear case K2 in the speaker module 80 shown in fig. 8, and fig. 12 is an enlarged view of an area I in a rear case K2 shown in fig. 11. An air-through long groove 83 is arranged in the rear cavity. The two ends of the air-permeable elongated slot 83 are respectively a first end 83a and a second end 83b, the first end 83a of the air-permeable elongated slot 83 is located in the partial rear cavity C2, the second end 83b of the air-permeable elongated slot 83 is located in the second cavity C3, and the width W of the air-permeable elongated slot 83 is smaller than the diameter of the sound-absorbing particles 87 (see fig. 6 and 7). The rear cavity is filled with the sound-absorbing particles 87. Therefore, the filled sound-absorbing particles 87 cannot enter the air-through long groove 83, the air-through long groove 83 forms an air flow channel for communicating the rear cavity C2 and the second cavity C3, and the sound-absorbing particles 87 can be effectively prevented from blocking the second cavity C3 to cause that the second cavity C3 cannot be effectively utilized. Therefore, the low-frequency loudness of the loudspeaker module 80 can be improved on the premise of not increasing the volume of the rear cavity.

In some embodiments, referring to fig. 13, fig. 13 is a schematic structural diagram of a rear case K2 of the speaker module 80 shown in fig. 8. In this embodiment, the second end 83b of the venting slot 83 is located in an end of the second chamber C3 distal from the partial rear chamber C2. Thus, the sound-absorbing particles 87 can be effectively prevented from blocking the respective regions of the second cavity C3, so that the whole second cavity C3 can be effectively utilized, and the low-frequency loudness of the speaker module 80 can be further improved.

In some embodiments, referring to fig. 14, fig. 14 is a schematic view of another structure of the rear case K2 in the speaker module 80 shown in fig. 8. In this embodiment, the first end 83a of the venting slot 83 is located in an end of the partial rear chamber C2 distal from the second chamber body C3. In this way, it is possible to avoid the sound-absorbing particles 87 from clogging the respective regions of the partial rear chamber C2, so that the entire partial rear chamber C2 can be effectively utilized, thereby further enhancing the low-frequency loudness of the speaker module 80.

It can be understood that when the second end 83b of the long ventilation groove 83 is located in the end of the second cavity C3 away from the partial rear cavity C2 and the first end 83a of the long ventilation groove 83 is located in the end of the partial rear cavity C2 away from the second cavity C3, the long ventilation groove 83 penetrates through the entire rear cavity along the X-axis direction, so that the sound-absorbing particles 87 can be prevented from blocking all areas of the rear cavity, the entire rear cavity can be effectively utilized, and the low-frequency loudness of the speaker module 80 can be further improved.

The number of the ventilation grooves 83 may be one or more, and is not particularly limited herein.

In some embodiments, the number of venting slots 83 is multiple. "plurality" means two or more. The plurality of air-permeable slots 83 are arranged side-by-side with first ends 83a of the plurality of air-permeable slots 83 each positioned within partial rear chamber C2 and second ends 83b of the plurality of air-permeable slots 83 each positioned within second chamber C3. In this way, a plurality of air flow passages can be formed to effectively prevent the sound-absorbing particles 87 from blocking the second cavity C3 to cause the second cavity C3 to be not effectively utilized.

In order to form the venting slots 83 described in the previous embodiments, in some embodiments, referring to fig. 12-14, a plurality of ribs 84 are provided on the inner wall of the rear chamber. Specifically, the ribs 84 may be provided on one inner wall of the rear cavity, or the ribs 84 may be provided on a plurality of inner walls of the rear cavity, which is not particularly limited herein. The present application is illustrative only of the provision of ribs 84 on one of the interior walls of the rear chamber and should not be considered as a specific limitation to the present application. In the present embodiment, "a plurality" means two or more. Specifically, the number of ribs 84 may be two, three, four, five, six, seven, eight, and so on. In the embodiment shown in fig. 12, the number of ribs 84 is eight. The plurality of ribs 84 may extend in a straight line or may extend in a curved line. Fig. 12 merely illustrates an example of a plurality of ribs 84 extending in a straight line, and should not be considered as a particular limitation to the present disclosure. A plurality of ribs 84 are arranged side by side with a vent slot 83 formed between adjacent ribs 84. This structure is simple, and does not affect the structural strength of the rear cavity wall plate where the ventilation groove 83 is located.

In still other embodiments, referring to fig. 15, fig. 15 is a schematic structural view of a rear cavity wall plate in which a venting groove 83 is located according to still other embodiments of the present application. In this embodiment, a rib 84 is provided on the inner wall of the rear cavity. The rib 84 comprises a plurality of first rib segments 841 arranged side by side. The plurality of first rib sections 841 may be distributed on one inner wall of the rear cavity, or may be distributed on a plurality of inner walls of the rear cavity, which is not limited herein. The present application is only illustrative of the case where the plurality of first rib segments 841 are distributed on an inner wall of the rear cavity, and this should not be construed as a particular limitation to the present application. The rib 84 further includes a second rib segment 842 connected between two adjacent first rib segments 841. Thus, the ribs 84 are approximately serpentine in configuration. The air-vent slot 83 is formed between two adjacent first rib segments 841. The structure is simple and easy to realize.

In the embodiment shown in fig. 12-15, the ribs 84 may be secured to the inner wall of the rear cavity by gluing, welding, or the like. In another embodiment, referring to fig. 16, fig. 16 is a cross-sectional view of the rear chamber wall panel with the venting grooves 83 in fig. 12-15. In this embodiment, the ribs 84 are integrally formed with the rear wall panel (e.g., the fourth wall panel 812b) where the ribs 84 are located, i.e., the ribs 84 and the rear wall panel are integrally formed. Thus, the speaker module 80 includes fewer components, which is advantageous for improving assembly efficiency.

In the embodiment shown in fig. 12-15, the height of ribs 84 projecting beyond the inner wall of the cavity is not particularly limited. In some embodiments, the height of the rib 84 protruding from the inner wall of the cavity may be the same as the dimension of the second cavity C in the height direction of the rib 84. In this embodiment, the highest portion of the rib 84 protruding beyond the inner wall of the rear cavity may contact or be connected to the opposite inner wall. The "opposite side inner wall" refers to the side of the rear cavity inner wall opposite to the side where the rib 84 is located.

In still other embodiments, please refer to fig. 17, fig. 17 is a schematic cross-sectional view of a rear cavity wall plate in which a venting groove 83 is located according to still other embodiments of the present application. In this embodiment, the ventilation slot 83 is a groove opened on the inner wall of the rear chamber. The structure is simple, and the inner space of the rear cavity can not be occupied.

In still other embodiments, please refer to fig. 18, fig. 18 is a schematic cross-sectional view of a rear cavity wall plate in which a venting groove 83 is located according to still other embodiments of the present application. In this embodiment, at least some of the walls of the rear chamber are corrugated, and the air-venting grooves 83 are formed between adjacent peaks of the corrugated plate that are arched toward the inside of the rear chamber. The structure can not occupy the inner space of the rear cavity, and can ensure the structural strength of the rear cavity wall plate.

In the present embodiment, in order to fill the sound absorbing particles 87 into the partial rear cavity C2, in some embodiments, referring back to fig. 8, the first housing portion 811 is provided with a filling opening 85. The shape of the fill port 85 includes, but is not limited to, circular, square, polygonal, and the like. The filling port 85 communicates with the partial rear chamber C2. The sound absorbing particles 87 can be filled into the partial rear cavity C2 through the filling opening 85. The filling opening 85 is provided with a cover body 86, and the cover body 86 is used for sealing the filling opening 85. Specifically, the cover 86 may be attached to the edge of the first housing portion at the filling opening 85 by gluing or the like.

In order to avoid that sound-absorbing particles 87 enter the inner core 82 and affect the movement of the diaphragm and the drive means. In some embodiments, with continued reference to fig. 6 and 8, the speaker module 80 further includes a mesh screen 85. The screen 85 includes, but is not limited to, gauze and metal mesh. The screen 85 is positioned within the partial posterior chamber C2 and the screen 85 covers the portion of the inner core 82 that is positioned outside of the partial posterior chamber C2. Sound absorbing particles 87 are filled in the side of the screen 85 away from the inner core 82. The screen 85 serves to prevent the sound-absorbing particles 87 from entering the core 82, thereby preventing the screen 85 from interfering with the movement of the diaphragm and the driving means in the core 82.

In the present embodiment, the first housing portion 811, the core 82, and the sound-absorbing particles 87 in the partial rear cavity C2 of the speaker module 80 form the first portion 80a of the speaker module 80 (see fig. 2). The second housing portion 812 of the speaker module and the sound absorbing particles 87 within the second cavity C3 form the second portion 80b of the speaker module 80. The third housing portion 813 of the speaker module forms a third portion 80c of the speaker module 80.

It should be noted that fig. 4-9 only schematically illustrate some components included in the speaker module 80, and the actual shape, the actual size, the actual position, and the actual configuration of these components are not limited by those in fig. 4-9.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A speaker module (80) comprising a housing (81), a core (82) and sound absorbing particles (87);

the housing (81) comprises a first housing part (811) and a second housing part (812) arranged side by side and fixed together; the thickness of the first housing portion (811) in the thickness direction of the speaker module (80) is larger than the thickness of the second housing portion (812) in the thickness direction of the speaker module (80);

the first housing portion (811) encloses a first cavity, and the first housing portion (811) has a first wall plate (811a) and a second wall plate (811b) which are arranged in the thickness direction of the speaker module (80) and are arranged opposite to each other; the second housing portion (812) enclosing a second cavity (C3);

the inner core (82) is arranged in the first cavity, the inner core (82) and the first wall plate (811a) are stacked, and a front cavity (C1) is formed between the inner core (82) and the first wall plate (811 a); the inner core (82) and the second wall plate (811b) are stacked, and a partial rear cavity (C2) is formed between the inner core (82) and the second wall plate (811 b); the partial rear cavity (C2) is communicated with the second cavity (C3) to form a rear cavity;

the rear cavity is internally provided with a ventilation elongated slot (83), two ends of the ventilation elongated slot (83) are respectively a first end (83a) and a second end (83b), the first end (83a) of the ventilation elongated slot (83) is positioned in the partial rear cavity (C2), the second end (83b) of the ventilation elongated slot (83) is positioned in the second cavity (C3), the width of the ventilation elongated slot (83) is smaller than the diameter of the sound-absorbing particles (87), and the sound-absorbing particles (87) are filled in the rear cavity.

2. A loudspeaker module (80) according to claim 1, wherein the second end (83b) of the venting slot (83) is located in an end of the second chamber (C3) remote from the partial rear chamber (C2).

3. A loudspeaker module (80) according to claim 1 or 2, wherein the first end (83a) of the air-venting elongated slot (83) is located in an end of the partial rear cavity (C2) remote from the second cavity (C3).

4. A loudspeaker module (80) according to any one of claims 1-3, wherein the inner wall of the rear chamber is provided with a plurality of ribs (84), the plurality of ribs (84) are arranged side by side, and the ventilation slot (83) is formed between two adjacent ribs (84).

5. A loudspeaker module (80) according to any one of claims 1 to 3, wherein the inner wall of the rear chamber is provided with a rib (84) comprising a plurality of first rib sections (841) arranged side by side and a second rib section (842) connected between two adjacent first rib sections (841), the vent slot (83) being formed between two adjacent first rib sections (841).

6. A loudspeaker module (80) according to claim 4 or 5, wherein the rib (84) is formed integrally with the rear wall panel in which the rib (84) is located.

7. A loudspeaker module (80) according to any of claims 1-3, wherein the air-venting elongated slot (83) is a groove opening onto the inner wall of the rear cavity.

8. A loudspeaker module (80) according to any of claims 1-3, wherein at least part of the walls of the rear cavity are corrugated, and the air-venting grooves (83) are formed between two adjacent peaks of the corrugated plates that are arched into the rear cavity.

9. The speaker module (80) of any of claims 1-8 wherein the number of air-venting slots (83) is plural, the plural air-venting slots (83) are arranged side-by-side, and first ends (83a) of the plural air-venting slots (83) are all located within the partial rear cavity (C2) and second ends (83b) of the plural air-venting slots (83) are all located within the second cavity (C3).

10. A loudspeaker module (80) according to any one of claims 1-9, further comprising a screen (85);

separate net (85) and be located in cavity (C2) behind part, just separate net (85) cover be located kernel (82) outside the part of cavity (C2) behind part, inhale sound granule (87) fill in separate keeping away from of net (85) one side of kernel (82).

11. A loudspeaker module (80) according to any one of claims 1-10, wherein the second housing part (812) has a third wall (812a) and a fourth wall (812b) arranged opposite each other in the thickness direction of the loudspeaker module (80);

an outer surface of the third wall plate (812a) and an outer surface of the first wall plate (811a) face a first side of the speaker module (80), an outer surface of the fourth wall plate (812b) and an outer surface of the second wall plate (811b) face a second side of the speaker module (80), the first side and the second side being opposite sides of the speaker module (80), respectively; the outer surface of the second wall panel (811b) is flush with the outer surface of the fourth wall panel (812 b).

12. A loudspeaker module (80) according to claim 11, wherein the first housing portion (811) further comprises a first side frame (811c), the first side frame (811c) being disposed between the first wall panel (811a) and the second wall panel (811b), and the first side frame (811c) being disposed around the edges of the first wall panel (811a) and the second wall panel (811 b);

the second housing portion (812) further comprising a second side frame (812c), the second side frame (812c) disposed between the third wall panel (812a) and the fourth wall panel (812b), and the second side frame (812c) disposed around edges of the third wall panel (812a) and the fourth wall panel (812 b);

the first wall panel (811a), the third wall panel (812a), the first side frame (811c), and the second side frame (812c) are integrally molded as a front case (K1); the second wall plate (811b) and the fourth wall plate (812b) are integrally formed as a rear case (K2).

13. A loudspeaker module (80) according to claim 11 or 12, wherein the housing (81) further comprises a third housing portion (813), the third housing portion (813) being of plate-like construction;

the third housing portion (813) is flush with the second wall plate (811b) and the fourth wall plate (812b), and the third housing portion (813) is integrally formed with the second wall plate (811b) and the fourth wall plate (812 b).

14. An electronic device (100) comprising a screen (10), a back case (20), a fingerprint recognition module (70), a circuit board, and a speaker module (80) of any of claims 1-12;

the screen (10) comprises a light-transmitting cover plate (11) and a display screen (12) which are arranged in a stacked mode, the back shell (20) comprises a frame (22) and a back cover (21), the light-transmitting cover plate (11) and the back cover (21) are respectively located on two sides of the frame (22), and an internal accommodating space of the electronic equipment (100) is enclosed by the light-transmitting cover plate (11), the frame (22) and the back cover (21);

the display screen (12), the fingerprint identification module (70), the circuit board and the loudspeaker module (80) are located in the inner accommodating space, the fingerprint identification module (70), the circuit board and a first shell part (811) of the loudspeaker module (80) are arranged in parallel in a plane parallel to the screen (10), a second shell part (812) of the loudspeaker module (80) is located on one side, away from the light-transmitting cover plate (11), of the fingerprint identification module (70), and an orthographic projection area of the second shell part (812) on the light-transmitting cover plate (11) is overlapped with an orthographic projection area of the fingerprint identification module (70) on the light-transmitting cover plate (11);

the inner core (82) of the loudspeaker module (80) is electrically connected with the circuit board, a sound outlet hole (22a) is formed in the frame (22), and a sound outlet channel (80d) of the loudspeaker module (80) is communicated with the sound outlet hole (22 a).

15. An electronic device (100) comprising a screen (10), a back shell (20), a fingerprint recognition module (70), a circuit board, and the speaker module (80) of claim 13;

the display screen (12), the fingerprint identification module (70), the circuit board and the loudspeaker module (80) are located in the inner accommodating space, the fingerprint identification module (70), the circuit board and a first shell part (811) of the loudspeaker module (80) are arranged in parallel in a plane parallel to the screen (10), a second shell part (812) of the loudspeaker module (80) is located on one side, away from the light-transmitting cover plate (11), of the fingerprint identification module (70), and an orthographic projection area of the second shell part (812) on the light-transmitting cover plate (11) is overlapped with an orthographic projection area of the fingerprint identification module (70) on the light-transmitting cover plate (11); the third shell part (813) of the loudspeaker module (80) is positioned on one side of the circuit board far away from the light-transmitting cover plate (11), and the orthographic projection area of the third shell part (813) on the light-transmitting cover plate (11) is overlapped with the orthographic projection area of the circuit board on the light-transmitting cover plate (11);