CN113154903A - Radiator manufacturing process and radiator - Google Patents

Radiator manufacturing process and radiator Download PDF

Info

Publication number
CN113154903A
CN113154903A CN202110469561.6A CN202110469561A CN113154903A CN 113154903 A CN113154903 A CN 113154903A CN 202110469561 A CN202110469561 A CN 202110469561A CN 113154903 A CN113154903 A CN 113154903A
Authority
CN
China
Prior art keywords
heat dissipation
liquid inlet
liquid outlet
liquid
sealing cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110469561.6A
Other languages
Chinese (zh)
Inventor
邓小池
章云霖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Inovance Technology Co Ltd
Original Assignee
Suzhou Inovance Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Inovance Technology Co Ltd filed Critical Suzhou Inovance Technology Co Ltd
Priority to CN202110469561.6A priority Critical patent/CN113154903A/en
Publication of CN113154903A publication Critical patent/CN113154903A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00Making other particular articles
    • B21D53/02Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a radiator manufacturing process and a radiator, and the subject I comprises the following steps: obtaining a heat dissipation matrix through mold opening forming, wherein a heat dissipation channel penetrating through two ends of the heat dissipation matrix is arranged in the heat dissipation matrix; a liquid inlet accommodating cavity communicated with a liquid inlet end of the heat dissipation channel is machined on the end face of the heat dissipation substrate; and a liquid outlet accommodating cavity communicated with the liquid outlet end of the heat dissipation channel is machined on the end face of the heat dissipation base body. According to the technical scheme, the heat dissipation base body is obtained through die sinking forming, a drilling type or buried pipe type machining process is not needed, the liquid inlet containing cavity and the liquid outlet containing cavity are machined in the heat dissipation base body in a machining mode, and therefore material cost is reduced.

Description

Radiator manufacturing process and radiator
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a radiator manufacturing process and a radiator.
Background
The water-cooling plate is an element for exchanging heat through liquid cooling, and has the principle that a flow channel is formed in a metal plate in a processing mode, an electronic element is installed on the surface of the plate (a heat-conducting medium is coated in the middle of the plate), and cooling liquid enters from an inlet and exits from an outlet of the plate and takes away heat emitted by the element. The common processes for forming the water-cooling plate flow channel are as follows: friction welding, vacuum brazing, copper tube embedding, deep hole drilling and the like. The traditional water cooling plate is mostly formed into a water channel by a pipe burying or drilling process, the mode is high in cost and low in efficiency, and is not suitable for batch production. In order to solve the problem of high-power-density heat dissipation of devices, the conventional water-cooling plate is mainly processed into heat dissipation fins in a machining mode, the number of the fins can be effectively increased, and then sealing is performed by vacuum brazing.
Disclosure of Invention
The invention mainly aims to provide a radiator manufacturing process and a radiator, and aims to solve the technical problems of low production efficiency and high cost of the existing water-cooling plate.
In order to achieve the above object, the present invention provides a manufacturing process of a heat sink, which comprises the following steps:
obtaining a heat dissipation matrix through mold opening forming, wherein a heat dissipation channel penetrating through two ends of the heat dissipation matrix is arranged in the heat dissipation matrix;
a liquid inlet accommodating cavity communicated with a liquid inlet end of the heat dissipation channel is machined on the end face of the heat dissipation substrate;
and a liquid outlet accommodating cavity communicated with the liquid outlet end of the heat dissipation channel is machined on the end face of the heat dissipation base body.
Optionally, after the step of "machining a liquid inlet accommodating cavity communicated with a liquid inlet end of the heat dissipation channel on an end face of the heat dissipation substrate", the method further includes the following steps:
a liquid inlet sealing cover is fixedly installed at the opening of the liquid inlet accommodating cavity, and the liquid inlet sealing cover is sealed and covered on the liquid inlet accommodating cavity to form a liquid inlet chamber;
machining a liquid inlet on the cavity wall of the liquid inlet accommodating cavity or the liquid inlet sealing cover in a machining mode;
after the step of machining the liquid outlet containing cavity communicated with the liquid outlet end of the heat dissipation channel on the end face of the heat dissipation base body, the method further comprises the following steps of:
a liquid outlet sealing cover is fixedly arranged at the opening of the liquid outlet accommodating cavity and is sealed and covered on the liquid outlet accommodating cavity to form a liquid outlet chamber;
and a liquid outlet is processed on the cavity wall of the liquid outlet containing cavity or the liquid outlet sealing cover in a machining mode.
Optionally, the sealed closing cap of feed liquor passes through friction stir welding's welding mode fixed mounting in the open mouth department in feed liquor holding chamber, the sealed closing cap of play liquid passes through friction stir welding's welding mode fixed mounting in the open mouth department in business turn over liquid holding chamber.
Optionally, the method further comprises the following steps: the liquid inlet is provided with a liquid inlet nozzle, and the liquid outlet is provided with a liquid outlet nozzle.
Optionally, the liquid inlet pipe mouth is through threaded connection's mode fixed connection in liquid inlet department, the liquid outlet pipe mouth is through threaded connection's mode fixed connection in liquid outlet department.
Optionally, the method further comprises the following steps: and the heat dissipation base body is provided with an installation connecting part of a heating device.
Optionally, the mounting connection portion is a threaded hole or a through hole that is formed in the surface of the heat dissipation base body and located on two sides of the heat dissipation channel.
Optionally, the number of the threaded holes or through holes is at least one pair, and the heat dissipation channel is located between the pair of threaded holes or through holes.
Optionally, the feed liquor holds the chamber and goes out the liquid and holds the chamber and be located respectively on two terminal surfaces of heat dissipation base member, also be the one end of heat dissipation base member is the feed liquor end, the other end of heat dissipation base member is for going out the liquid end.
Optionally, the feed liquor holds the chamber and goes out the liquid and holds the chamber and be located the same terminal surface of heat dissipation base member, heat dissipation channel's quantity is a plurality of, partial heat dissipation channel among the plurality of heat dissipation channel is feed liquor heat dissipation channel, all the other heat dissipation channels except feed liquor heat dissipation channel among the plurality of heat dissipation channel are for going out liquid heat dissipation channel, the feed liquor hold the chamber with feed liquor heat dissipation channel is linked together, go out the liquid hold the chamber with it is linked together to go out liquid heat dissipation channel, still include the step:
machining an intermediate accommodating cavity on the end face, far away from the liquid inlet accommodating cavity or the liquid outlet accommodating cavity, of the heat dissipation base body;
and an intermediate sealing cover is fixedly arranged at the opening of the intermediate accommodating cavity and covers the intermediate accommodating cavity to form an intermediate liquid chamber.
Optionally, the liquid inlet sealing cover and the liquid outlet sealing cover are located on the same end face of the heat dissipation base body, so that the liquid inlet sealing cover and the liquid outlet sealing cover are of an integrated structure.
Optionally, the middle sealing cover is fixedly installed at the opening of the middle accommodating cavity by friction stir welding.
The invention also provides a radiator which is manufactured by adopting the manufacturing process.
According to the technical scheme, the heat dissipation base body is obtained through die sinking forming, the heat dissipation channel in the heat dissipation base body is formed through die sinking, a drilling type or buried pipe type machining process is not needed, in addition, the liquid inlet containing cavity and the liquid outlet containing cavity are machined on the heat dissipation base body in a machining mode, additional materials are not needed, and the material cost is favorably reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flowchart of example 1 of the present invention;
fig. 2 is a schematic structural view of a heat dissipation substrate according to embodiment 1 of the present invention;
FIG. 3 is a schematic view of the transparent structure of FIG. 1;
fig. 4 is a schematic structural view of a heat sink according to embodiment 1 of the present invention;
FIG. 5 is a schematic view showing a state of use of embodiment 1 of the present invention;
fig. 6 is a schematic structural view of a heat sink according to embodiment 2 of the present invention;
fig. 7 is a schematic structural view of a heat sink according to embodiment 3 of the present invention;
fig. 8 is a schematic structural view of a heat sink according to embodiment 4 of the present invention;
the reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
10 Heat dissipation base body 32 Liquid outlet
11 Heat dissipation channel 33 Liquid outlet sealing cover
12 Mounting connection part 41 Intermediate accommodating cavity
21 Liquid inlet holding cavity 42 Middle sealing cover
22 Liquid inlet 50 Heating device
23 Liquid inlet sealing cover 60 Inlet pipe mouth
31 Liquid outlet holding cavity 70 Liquid outlet pipe nozzle
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Example 1
Referring to fig. 1 to 5, an embodiment 1 of the present invention provides a heat sink manufacturing process, which includes the following steps:
obtaining a heat dissipation matrix 10 through mold opening forming, wherein heat dissipation channels 11 penetrating through two ends of the heat dissipation matrix 10 are arranged in the heat dissipation matrix 10;
a liquid inlet accommodating cavity 21 communicated with the liquid inlet end of the heat dissipation channel is machined on the end face of the heat dissipation substrate 10;
and a liquid outlet accommodating cavity 31 communicated with the liquid outlet end of the heat dissipation channel is machined on the end surface of the heat dissipation base body 10.
According to the technical scheme, the heat dissipation base body is obtained through die sinking forming, the heat dissipation channel in the heat dissipation base body is formed through die sinking, a drilling type or buried pipe type machining process is not needed, in addition, the liquid inlet containing cavity and the liquid outlet containing cavity are machined on the heat dissipation base body in a machining mode, additional materials are not needed, and the material cost is favorably reduced. When the heat dissipation base body is used, the heating devices 50 are fixedly attached to one side face of the heat dissipation base body 10 and located at the position of the heat dissipation channel 11, cooling liquid is input from the liquid inlet containing cavity, enters the heat dissipation channel 11 and is discharged from the liquid outlet containing cavity, specifically, the liquid inlet containing cavity and the liquid outlet containing cavity can be butted by adopting a connector, and the heating devices 50 fixedly attached to one side face of the heat dissipation base body 10 are dissipated by the cooling liquid when passing through the heat dissipation channel 11.
Optionally, in this embodiment, after the step of "machining the liquid inlet accommodating cavity communicating with the liquid inlet end of the heat dissipation channel on the end face of the heat dissipation substrate", the method further includes the following steps:
a liquid inlet sealing cover 23 is fixedly installed at the opening of the liquid inlet accommodating cavity 21, and the liquid inlet sealing cover 23 is sealed and covered on the liquid inlet accommodating cavity 21 to form a liquid inlet chamber;
and a liquid inlet 22 is machined on the wall 21 of the liquid inlet accommodating cavity or the liquid inlet sealing cover 23. The liquid inlet accommodating cavity is sealed by the liquid inlet sealing cover to form a liquid inlet chamber, the liquid inlet is opened, the liquid inlet is connected with an external connecting pipe, the liquid inlet chamber is equivalent to a sealed flow collecting effect, liquid can be prevented from being splashed out of the liquid inlet accommodating cavity, and the buffering effect is achieved. And the sealed closing cap of feed liquor holds the chamber cooperation with the feed liquor of opening at the heat dissipation base member and can form the feed liquor room, adopts the outside material independent molding's of heat dissipation base member structure for prior art's feed liquor room, is favorable to reducing material cost.
Further, optionally, in this embodiment, the liquid inlet sealing cover 23 is fixedly installed at the opening of the liquid inlet accommodating chamber 21 by welding of friction stir welding. The welding mode adopts friction stir welding, so that the welding process is greatly simplified, and the cost can be greatly reduced.
Optionally, in this embodiment, after the step of "machining the liquid outlet accommodating cavity communicating with the liquid outlet end of the heat dissipation channel on the end surface of the heat dissipation substrate", the method further includes the following steps:
a liquid outlet sealing cover 33 is fixedly arranged at the opening of the liquid outlet accommodating cavity 31, and the liquid outlet sealing cover 33 is sealed and covered on the liquid outlet accommodating cavity 31 to form a liquid outlet chamber;
and a liquid outlet 32 is machined on the wall 31 of the liquid outlet containing cavity or the liquid outlet sealing cover 33 in a machining mode. The liquid outlet accommodating cavity is sealed by the liquid outlet sealing cover to form a liquid outlet chamber, a liquid outlet is formed, the liquid outlet is used for being connected with an external connecting pipe, the liquid outlet chamber is equivalent to a sealed flow collecting effect, liquid can be prevented from being splashed out of the liquid outlet accommodating cavity, and the buffering effect is achieved. And the liquid outlet sealing cover is matched with the liquid outlet containing cavity formed in the heat dissipation substrate to form a liquid inlet chamber, and compared with the liquid inlet chamber in the prior art, the liquid inlet chamber is of a structure formed by independently forming materials outside the heat dissipation substrate, the liquid inlet chamber is beneficial to reducing the material cost.
Further, optionally, in this embodiment, the liquid outlet sealing cover 33 is fixedly installed at the opening of the liquid inlet and outlet containing cavity 31 by welding of friction stir welding. The welding mode adopts friction stir welding, so that the welding process is greatly simplified, and the cost can be greatly reduced.
Optionally, in this embodiment, the method further includes the following steps: a liquid inlet nozzle 60 is installed at the liquid inlet 22. Can be connected with an external pipeline quickly through the liquid inlet pipe nozzle. Specifically, the liquid inlet nozzle 60 is fixedly connected to the liquid inlet by means of screw connection. The disassembly and the assembly are convenient by a threaded connection mode. Of course, the inlet nozzle can also be fixedly connected with the inlet in a welding mode.
Optionally, in this embodiment, the method further includes the following steps: a liquid outlet nozzle 70 is installed at the liquid outlet 32. Can be quickly connected with an external pipeline through the liquid outlet pipe nozzle. Specifically, the liquid outlet nozzle 70 is fixedly connected to the liquid outlet by means of threaded connection. The disassembly and the assembly are convenient by a threaded connection mode. Of course, the liquid outlet nozzle can also be fixedly connected with the liquid outlet in a welding way.
Optionally, in this embodiment, the method further includes the following steps: the heat dissipating base 10 is provided with a mounting connection portion 12 of a heat generating device 50. Specifically, the mounting connection portion 12 is a threaded hole or a through hole formed in the side surface of the heat dissipation base, and the heating device can be quickly mounted and dismounted by means of threaded connection. Optionally, in this embodiment, the number of the threaded holes or through holes is at least one pair, and the heat dissipation channel 11 is located between the pair of threaded holes or through holes. When the heat dissipation base body is used, the heating device is arranged between the pair of threaded holes or the through holes, and the heating device is attached to the side face of the heat dissipation base body.
Optionally, in this embodiment, the feed liquor holds the chamber 21 and goes out the liquid and holds the chamber 31 and be located the same terminal surface of heat dissipation base member 10, the quantity of heat dissipation channel 11 is a plurality of, some heat dissipation channel among the plurality of heat dissipation channel 11 is feed liquor heat dissipation channel, all the other heat dissipation channels except feed liquor heat dissipation channel among the plurality of heat dissipation channel 11 are for going out liquid heat dissipation channel, the feed liquor hold the chamber 21 with feed liquor heat dissipation channel is linked together, go out the liquid hold the chamber 31 with it is linked together to go out liquid heat dissipation channel, still include the step:
machining an intermediate accommodating cavity 41 on the end face, far away from the liquid inlet accommodating cavity or the liquid outlet accommodating cavity, of the heat dissipation substrate 10;
an intermediate sealing cover 42 is fixedly installed at an opening of the intermediate accommodating cavity 41, and the intermediate sealing cover 42 covers the intermediate accommodating cavity 41 to form an intermediate liquid chamber. In the embodiment, the liquid inlet heat dissipation channel and the liquid outlet heat dissipation channel are communicated through the intermediate liquid chamber, so that the cooling liquid is discharged from the liquid outlet heat dissipation channel after passing through the liquid inlet heat dissipation channel, the distance of the cooling liquid in the heat dissipation channel can be increased, the utilization efficiency of the cooling liquid is improved, and the use cost is reduced.
In addition, the middle accommodating cavity of the middle liquid chamber is machined on the heat dissipation base body in a machining mode, extra materials are not needed, and the material cost is favorably reduced. Specifically, the intermediate sealing cover 42 is fixedly installed at the opening of the intermediate receiving chamber 41 by friction stir welding. The welding mode adopts friction stir welding, so that the welding process is greatly simplified, and the cost can be greatly reduced.
In the present embodiment, the liquid inlet sealing cover 23 and the liquid outlet sealing cover 33 are located on the same end surface of the heat dissipating substrate 10, so that the liquid inlet sealing cover 23 and the liquid outlet sealing cover 33 are integrated. Because the liquid inlet sealing cover and the liquid outlet sealing cover are positioned at the same end, the liquid inlet sealing cover and the liquid outlet sealing cover adopt an integrated structural form, the installation procedures can be reduced, and one sealing cover is produced to comprise the liquid inlet sealing cover and the liquid outlet sealing cover, so that the production cost can be reduced.
Specifically, in this embodiment, the liquid inlet 22 is provided on the cavity wall of the liquid inlet accommodating cavity 21, and the liquid outlet 32 is provided on the cavity wall of the liquid outlet accommodating cavity 31. And the liquid inlet 22 and the liquid outlet 32 are located on the same side of the heat-dissipating substrate 10.
The invention also provides a radiator, and the subject two is manufactured by the manufacturing process of the subject one. The specific process of the first subject refers to the above embodiments, and since the second subject adopts all technical solutions of all embodiments of the first subject, at least all beneficial effects brought by the technical solutions of the above embodiments are achieved, and are not described in detail herein.
Example 2
Referring to fig. 6, in another embodiment of the present invention, it is different from embodiment 1 in that: the liquid inlet 22 and the liquid outlet 32 are located on different sides of the heat dissipation substrate 10, and a liquid inlet nozzle 60 is installed at the liquid inlet 22. A liquid outlet nozzle 70 is installed at the liquid outlet 32. Can be connected with an external pipeline quickly through the liquid inlet pipe nozzle and the liquid outlet pipe nozzle. The liquid inlet and the liquid outlet are arranged on different side surfaces of the heat dissipation substrate, and external pipelines in different directions can be conveniently connected.
Example 3
Referring to fig. 7, in another embodiment of the present invention, it is different from embodiment 1 in that: the liquid inlet accommodating cavity 21 and the liquid outlet accommodating cavity 31 are respectively located on two end faces of the heat dissipation substrate 10, that is, one end of the heat dissipation substrate 10 is a liquid inlet end, and the other end of the heat dissipation substrate 10 is a liquid outlet end. Specifically, the number of the heat dissipation channels 11 is a plurality of, the liquid inlet ends and the liquid outlet ends of the heat dissipation channels 11 are respectively located at two ends of the heat dissipation substrate 10, that is, in this embodiment, the cooling liquid enters the heat dissipation channels from the liquid inlet ends after passing through the liquid inlet accommodating cavity and then enters the liquid outlet accommodating cavity from the liquid outlet ends and then is discharged, and compared with embodiment 1, the heat dissipation substrate does not need to be provided with an intermediate accommodating cavity, so that the processing process and the processing cost are saved. In this embodiment, a liquid inlet 22 is formed in a cavity wall of the liquid inlet accommodating cavity 21, a liquid outlet 32 is formed in a cavity wall of the liquid outlet accommodating cavity 31, and the liquid inlet 22 and the liquid outlet 32 are located on the same side surface of the heat dissipating substrate 10. A liquid inlet nozzle 60 is arranged at the liquid inlet 22. A liquid outlet nozzle 70 is provided at the liquid outlet 32. Can be connected with an external pipeline quickly through the liquid inlet pipe nozzle and the liquid outlet pipe nozzle.
Example 4
Referring to fig. 8, in another embodiment of the present invention, it is different from embodiment 3 in that: the liquid inlet sealing cover 23 is provided with a liquid inlet 22, and the liquid outlet sealing cover 33 is provided with a liquid outlet 32. A liquid inlet nozzle 60 is arranged at the liquid inlet 22. A liquid outlet nozzle 70 is provided at the liquid outlet 32. Can be connected with an external pipeline quickly through the liquid inlet pipe nozzle and the liquid outlet pipe nozzle. And the liquid inlet nozzle and the liquid outlet nozzle in the embodiment are different from those in the embodiment 1, the embodiment 2 and the embodiment 3 in orientation so as to adapt to different use environments.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A radiator manufacturing process is characterized by comprising the following steps:
obtaining a heat dissipation matrix through mold opening forming, wherein a heat dissipation channel penetrating through two ends of the heat dissipation matrix is arranged in the heat dissipation matrix;
a liquid inlet accommodating cavity communicated with a liquid inlet end of the heat dissipation channel is machined on the end face of the heat dissipation substrate;
and a liquid outlet accommodating cavity communicated with the liquid outlet end of the heat dissipation channel is machined on the end face of the heat dissipation base body.
2. The manufacturing process of claim 1,
after the step of machining the end face of the heat dissipation base body to form a liquid inlet accommodating cavity communicated with the liquid inlet end of the heat dissipation channel, the method further comprises the following steps of:
a liquid inlet sealing cover is fixedly installed at the opening of the liquid inlet accommodating cavity, and the liquid inlet sealing cover is sealed and covered on the liquid inlet accommodating cavity to form a liquid inlet chamber;
machining a liquid inlet on the cavity wall of the liquid inlet accommodating cavity or the liquid inlet sealing cover in a machining mode;
after the step of machining the liquid outlet containing cavity communicated with the liquid outlet end of the heat dissipation channel on the end face of the heat dissipation base body, the method further comprises the following steps of:
a liquid outlet sealing cover is fixedly arranged at the opening of the liquid outlet accommodating cavity and is sealed and covered on the liquid outlet accommodating cavity to form a liquid outlet chamber;
and a liquid outlet is processed on the cavity wall of the liquid outlet containing cavity or the liquid outlet sealing cover in a machining mode.
3. The manufacturing process according to claim 2, wherein the liquid inlet sealing cover is fixedly mounted at the opening of the liquid inlet containing cavity by friction stir welding, and the liquid outlet sealing cover is fixedly mounted at the opening of the liquid inlet and outlet containing cavity by friction stir welding.
4. The manufacturing process of claim 1, further comprising the steps of: and the heat dissipation base body is provided with an installation connecting part of a heating device.
5. The manufacturing process according to claim 4, wherein the mounting connection part is a screw hole or a through hole opened on the surface of the heat dissipating substrate and located at both sides of the heat dissipating channel.
6. The manufacturing process of claim 2, further comprising the steps of: a liquid inlet nozzle is arranged at the liquid inlet; and a liquid outlet nozzle is arranged at the liquid outlet.
7. The manufacturing process according to claim 1, wherein the liquid inlet holding cavity and the liquid outlet holding cavity are respectively positioned on two end surfaces of the heat dissipation substrate, one end of the heat dissipation substrate is a liquid inlet end, and the other end of the heat dissipation substrate is a liquid outlet end.
8. The manufacturing process according to claim 2, wherein the liquid inlet accommodating chamber and the liquid outlet accommodating chamber are located on the same end surface of the heat dissipation substrate, the number of the heat dissipation channels is several, part of the heat dissipation channels in the several heat dissipation channels are liquid inlet heat dissipation channels, the rest heat dissipation channels except the liquid inlet heat dissipation channels in the several heat dissipation channels are liquid outlet heat dissipation channels, the liquid inlet accommodating chamber is communicated with the liquid inlet heat dissipation channels, and the liquid outlet accommodating chamber is communicated with the liquid outlet heat dissipation channels, further comprising the steps of:
machining an intermediate accommodating cavity on the end face, far away from the liquid inlet accommodating cavity or the liquid outlet accommodating cavity, of the heat dissipation base body;
and an intermediate sealing cover is fixedly arranged at the opening of the intermediate accommodating cavity and covers the intermediate accommodating cavity to form an intermediate liquid chamber.
9. The manufacturing process of the radiator as claimed in claim 8, wherein the liquid inlet sealing cover and the liquid outlet sealing cover are positioned on the same end face of the radiating substrate, and the liquid inlet sealing cover and the liquid outlet sealing cover are of an integrated structure.
10. A heat sink, wherein the heat sink is manufactured by the manufacturing process of any one of claims 1 to 9.
CN202110469561.6A 2021-04-28 2021-04-28 Radiator manufacturing process and radiator Pending CN113154903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110469561.6A CN113154903A (en) 2021-04-28 2021-04-28 Radiator manufacturing process and radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110469561.6A CN113154903A (en) 2021-04-28 2021-04-28 Radiator manufacturing process and radiator

Publications (1)

Publication Number Publication Date
CN113154903A true CN113154903A (en) 2021-07-23

Family

ID=76872208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110469561.6A Pending CN113154903A (en) 2021-04-28 2021-04-28 Radiator manufacturing process and radiator

Country Status (1)

Country Link
CN (1) CN113154903A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205578107U (en) * 2016-05-13 2016-09-14 深圳市华盛源机电有限公司 Heat dissipation device
CN206488251U (en) * 2017-01-18 2017-09-12 福建省中科生物股份有限公司 A kind of easy-formation liquid-cooling heat radiation module and LED
CN108633233A (en) * 2018-06-29 2018-10-09 苏州汇川技术有限公司 Liquid cooling heat radiator and power electronic equipment
CN109411661A (en) * 2018-11-08 2019-03-01 河南速达电动汽车科技有限公司 Electric vehicle and its battery box body, battery case
US20190131674A1 (en) * 2016-04-11 2019-05-02 Byd Company Limited Tray, tray assembly, battery pack assembly and vehicle
CN208955142U (en) * 2018-06-21 2019-06-07 桑顿新能源科技有限公司 A kind of heating of battery pack and cooling integration device
CN209344178U (en) * 2019-01-02 2019-09-03 浙江吉利汽车研究院有限公司 Integrated thermal conditioning mould group and battery

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190131674A1 (en) * 2016-04-11 2019-05-02 Byd Company Limited Tray, tray assembly, battery pack assembly and vehicle
CN205578107U (en) * 2016-05-13 2016-09-14 深圳市华盛源机电有限公司 Heat dissipation device
CN206488251U (en) * 2017-01-18 2017-09-12 福建省中科生物股份有限公司 A kind of easy-formation liquid-cooling heat radiation module and LED
CN208955142U (en) * 2018-06-21 2019-06-07 桑顿新能源科技有限公司 A kind of heating of battery pack and cooling integration device
CN108633233A (en) * 2018-06-29 2018-10-09 苏州汇川技术有限公司 Liquid cooling heat radiator and power electronic equipment
CN109411661A (en) * 2018-11-08 2019-03-01 河南速达电动汽车科技有限公司 Electric vehicle and its battery box body, battery case
CN209344178U (en) * 2019-01-02 2019-09-03 浙江吉利汽车研究院有限公司 Integrated thermal conditioning mould group and battery

Similar Documents

Publication Publication Date Title
AU700624B2 (en) Liquid cooled heat sink for cooling electronic components
CN101610664B (en) Liquid cooler and manufacture method thereof
CN106252309B (en) Micro-channel liquid cooling radiator and cold conducting plug-in unit for high heat flux chip
US6639798B1 (en) Automotive electronics heat exchanger
JPH08264695A (en) Cooling device for electronic parts
CN211125625U (en) Liquid cooling heat dissipation assembly, liquid cooling heat dissipation device and power electronic equipment
CN215418156U (en) Microchannel copper-aluminum composite relieving liquid cooling radiator
WO1995017765A2 (en) Liquid cooled heat sink for cooling electronic components
JP2001284513A (en) Power semiconductor device
CN113154903A (en) Radiator manufacturing process and radiator
CN219372974U (en) Cooling mechanism for cooling fin
WO2017049867A1 (en) Heat dissipation device and heat dissipation plate thereof
US20230232577A1 (en) Water cooling radiator
US11131514B2 (en) Heat exchange device
CN208608188U (en) A kind of coldplate of high power semi-conductor component
CN220324451U (en) Liquid cooling radiator
CN215345577U (en) Liquid cooling radiator and heat abstractor
CN113225989B (en) Micro-channel heat dissipation structure and manufacturing process thereof
CN219644407U (en) Circuit board heat abstractor and computer server
CN204858267U (en) Fin passageway fusiformis radiator that declines
CN219919544U (en) Liquid cooling radiator and liquid cooling module
CN218996702U (en) Three-dimensional steam cavity component
CN219536653U (en) Liquid cooling assembly, power module and power conversion equipment
CN220874936U (en) Water-cooling radiator
CN211669608U (en) Heat dissipation machine case and 5G basic station

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20210723