CN113110723B

CN113110723B - Heat dissipation mechanism and server

Info

Publication number: CN113110723B
Application number: CN202110379156.5A
Authority: CN
Inventors: 徐梦娜; 李宁; 徐江鑫; 黄建新; 倪健斌; 舒彬; 周丽平; 赵黎明; 胡显涛
Original assignee: Zhongke Controllable Information Industry Co Ltd
Current assignee: Zhongke Controllable Information Industry Co Ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2024-09-17
Anticipated expiration: 2041-04-08
Also published as: CN113110723A

Abstract

The application discloses a heat dissipation mechanism and a server, and relates to the technical field of heat sinks. The heat dissipation mechanism includes: the air guide cover comprises a first air channel; the heat conduction pipe assembly is wound on the outer side wall of the air guide cover and surrounds the first air duct; the base is connected with the heat conduction pipe assembly and is arranged at one end of the air guide cover; and the plurality of cooling fins are connected with the heat conduction pipe assembly and are arranged at one end of the air guide cover, which is far away from the base. The heat dissipation mechanism provided by the application has the functions of wind guiding and heat dissipation, and the heat dissipation efficiency is improved.

Description

Heat dissipation mechanism and server

Technical Field

The present application relates to the field of heat sinks, and in particular, to a heat dissipation mechanism and a server.

Background

Along with the development of technology toward miniaturization and integration, the heat flux density of electrical components such as chips in electronic devices is increasing, and a heat dissipation component is required to be disposed in the electronic devices to dissipate heat of the electrical components in the devices.

However, the heat dissipation component in the prior art has single function and large occupied space, which is not beneficial to the integrated development of equipment.

Disclosure of Invention

The application provides a heat dissipation mechanism and a server, which have the functions of heat dissipation and wind guiding and occupy smaller space.

The application provides:

A heat dissipation mechanism, comprising:

The air guide cover comprises a first air channel;

the heat conduction pipe assembly is wound on the outer side wall of the air guide cover and surrounds the first air duct;

the base is connected with the heat conduction pipe assembly and is arranged at one end of the air guide cover; and

And the cooling fins are connected with the heat conduction pipe assembly and are arranged at one end of the air guide cover, which is far away from the base.

In some possible embodiments, the heat transfer tube assembly comprises:

The heat conduction pipe is wound on the outer side wall of the air guide cover;

the liquid metal is arranged in the heat conducting pipe; and

And the electromagnetic pump group is used for driving the liquid metal to flow in the heat conduction pipe.

In some possible embodiments, the heat conducting pipe is a closed loop, and the electromagnetic pump set comprises a first electromagnetic pump for generating a first magnetic field;

The first electromagnetic pump is used for driving the liquid metal to circularly flow in the heat conduction pipe.

In some possible embodiments, the heat conducting tube comprises two ends, the electromagnetic pump group comprises a first electromagnetic pump generating a first magnetic field and a second electromagnetic pump generating a second magnetic field, the direction of the first magnetic field is opposite to the direction of the second magnetic field;

The first electromagnetic pump and the second electromagnetic pump are used for driving the liquid metal to flow back and forth between the two ends of the heat conduction pipe.

In some possible embodiments, the liquid metal comprises one or more of a gallium alloy, an indium alloy, a gallium indium alloy, and a gallium indium tin alloy.

In some possible embodiments, the plurality of cooling fins are arranged at intervals, and a second air channel is formed between two adjacent cooling fins, and the second air channel is parallel to the first air channel.

In some possible embodiments, a limit groove is formed in one side, close to the heat conducting pipe assembly, of the base, and one side, close to the base, of the heat conducting pipe assembly is in limit connection with the limit groove.

In some possible embodiments, the base is provided with a fool-proof part for fool-proof connection of the base and the heating source.

In some possible embodiments, the heat dissipation mechanism further includes a heat conducting sheet, and the heat conducting sheet is disposed on a side of the base away from the heat conducting pipe assembly.

In addition, the application also provides a server comprising the heat dissipation mechanism.

The beneficial effects of the application are as follows: the application provides a heat dissipation mechanism and a server. The heat dissipation mechanism comprises a wind scooper, a heat conduction pipe assembly, a base and a plurality of heat dissipation fins, wherein the wind scooper comprises a first air channel, and in use, the wind scooper can play a role in guiding the air flow in the server. The heat conducting pipe assembly is wound on the outer side wall of the air guide cover, namely the air guide pipe assembly is combined with the air guide cover, and compared with the prior art that the heat radiating assembly is arranged on the air guide cover in a separated mode, the heat conducting pipe assembly can save larger space. Meanwhile, the heat conduction pipe assembly surrounds the first air duct, and shielding of the first air duct can be avoided. The base and the plurality of cooling fins are respectively arranged at two ends of the wind scooper, and the base and the plurality of cooling fins are connected with the heat conduction pipe assembly so as to realize heat transfer and heat dissipation.

In use, the base can be used for absorbing heat of a heating source such as an electronic device, the heat is transferred to the radiating fins through the heat conduction pipe assembly, and then the radiating fins dissipate the heat into flowing air. Therefore, heat can be dissipated outwards at one end far away from the heating source, and the heat is prevented from returning to the heating source again, so that the heat dissipation quality and efficiency can be improved. In the heat transfer process of the heat conducting pipe assembly, part of heat can be transferred to flowing air in the first air duct through the air guide cover, so that the heat dissipation efficiency is improved.

Therefore, the wind scooper, the heat conductive pipe component, the base and the radiating fins are combined, so that the wind scooper has the effects of wind guiding and radiating, has higher radiating efficiency, can save the occupied space of the radiating mechanism, and is beneficial to the integrated development of the server.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows an exploded view of a heat dissipation mechanism;

FIG. 2 shows a schematic structural diagram of a heat dissipation mechanism;

FIG. 3 shows a schematic diagram of a heat sink;

FIG. 4 shows a schematic partial structure of a heat pipe assembly;

FIG. 5 illustrates a partial schematic view of another heat pipe assembly;

FIG. 6 shows a schematic structural view of a base;

FIG. 7 shows a schematic structural view of another base;

Fig. 8 shows a partial structure diagram of a server.

Description of main reference numerals:

100-a heat dissipation mechanism; 10-radiating fins; 11-clamping grooves; 12-a second air duct; 20-a heat pipe assembly; 21-a heat pipe; 211-a first end; 212-a second end; 22-electromagnetic pump group; 221-a first electromagnetic pump; 222-a second electromagnetic pump; 30-a wind scooper; 31-a first air duct; 40-base; 41-limit grooves; 42-fool-proofing part; 43-connection; 50-a heat conductive sheet;

200-heating source; 300-chassis; 400-cooling fan.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

The mainstream heat dissipation technology of the server mainly goes through third generation transformation, and the first generation of heat dissipater is mainly realized by relying on the heat conductivity of metals such as copper, aluminum and the like. The second generation radiator mainly uses a heat pipe to realize heat transfer by means of phase-change heat absorption and capillary reflux. The third-generation radiator is realized mainly by adopting a water convection heat exchange mode through a water cooling mode. However, with the continuous development of miniaturization, integration and high frequency of electronic devices such as chips, the heat generation power per unit area of the electronic devices such as chips is also increased, the temperature is increased, and the existing three-generation heat sinks cannot meet the heat dissipation requirement of the electronic devices such as chips.

The application provides a heat dissipation mechanism 100 which can have the functions of wind guiding and heat dissipation and has the characteristics of high heat dissipation efficiency, small volume and the like so as to meet the heat dissipation requirements of electronic devices such as chips and the like at present.

As shown in fig. 2, a cartesian coordinate system is established defining an x-axis direction as a length direction of the heat dissipating mechanism 100, a y-axis direction as a width direction of the heat dissipating mechanism 100, and a z-axis direction as a height direction of the heat dissipating mechanism 100. It is to be understood that the above definitions are merely for facilitating understanding of the relative positional relationship of the various parts of the heat dissipation mechanism 100, and should not be construed as limiting the present application.

Example 1

The heat dissipation mechanism 100 provided in the embodiment can be used in a server for dissipating heat of electronic devices such as chips in the server. Therefore, electronic devices in the server can work at proper temperature, and damage caused by overhigh temperature is avoided.

In other embodiments, the heat dissipation mechanism 100 may also be used in a television, a host computer, an intelligent home appliance, etc. for dissipating heat from electronic devices in the device, so that the corresponding device works normally.

As shown in fig. 1 and 2, the heat dissipation mechanism 100 may include a heat sink 10, a heat conduction pipe assembly 20, a wind scooper 30, and a base 40.

The wind scooper 30 may be a cover structure with two open ends, and the two open ends are disposed opposite to each other. Other sidewalls of the wind scooper 30 may be closed structures, and the wind scooper 30 may generally take on a closed loop shape. In an embodiment, the air guiding cover 30 may include a first air duct 31, and the first air duct 31 communicates with the surrounding environment through openings at two ends of the air guiding cover 30 to enable air circulation. At the same time, the air guide cover 30 can also guide the flow direction of the air. In some specific embodiments, the first air duct 31 may extend along the width direction of the heat dissipation mechanism 100.

In some specific embodiments, the wind scooper 30 may be made of copper, aluminum, copper alloy, aluminum alloy, or the like.

The heat pipe assembly 20 may be wound around the outer sidewall of the wind scooper 30. It is understood that, in the air guiding cover 30, a side close to the first air duct 31 may be an inner side wall of the air guiding cover 30. Accordingly, the side of the air guiding cover 30 far from the first air duct 31 may be an outer sidewall of the air guiding cover 30, i.e. a sidewall of the air guiding cover 30 that can be directly observed by a user. Meanwhile, the air guide cover 30 can also bear the heat pipe assembly 20 to support and fix the heat pipe assembly 20.

The heat sink 10 may be disposed at one end of the air guide housing 30 and connected to the heat pipe assembly 20 to transfer heat between the heat pipe assembly 20 and the heat sink 10. The heat sink 10 is disposed outside the air guide cover 30. When the heat dissipation mechanism 100 is vertically placed at a height, the heat dissipation fins 10 may be located at the top of the wind scooper 30.

In an embodiment, the heat sink 10 may be provided with a plurality of fins, and the heat sink 10 may be provided with one, two, three, five, six, nine, fifteen, or the like, for example. In use, the heat sink 10 may be in contact with ambient flowing air to facilitate heat exchange between the heat sink 10 and the flowing air to dissipate heat to the flowing air. In the embodiment, the heat sink 10 may have a rectangular plate structure, and may have a larger contact area with the flowing air, so that the heat sink 10 and the flowing air exchange heat, and the heat dissipation efficiency is improved. The area of the heat sink 10 may be set as needed, and is not particularly limited herein.

In other embodiments, the heat sink 10 may be configured in a plate-like structure having a square, circular, or the like shape, and may be specifically configured as desired.

Further, the base 40 may be disposed at an end of the air guiding cover 30 away from the heat sink 10, and the base 40 is connected to the heat conducting tube assembly 20, so as to facilitate heat transfer between the heat conducting tube assembly 20 and the base 40. The base 40 may be disposed outside the wind scooper 30. When the heat dissipation mechanism 100 is vertically placed at a height, the base 40 may be located at the bottom of the wind scooper 30.

In use, the base 40 may be used to receive the heat source 200 to absorb heat from the heat source 200. The base 40 may transfer the absorbed heat to the heat pipe assembly 20. Heat may be transferred to the heat sink 10 in steps through the heat pipe assembly 20. Then, the heat is transferred to the flowing air by exchanging heat between the heat sink 10 and the surrounding flowing air, so as to realize heat dissipation.

By way of example, the heat source 200 may be an electronic device in a server, such as a central processing unit (Central Processing Unit, CPU) chip, etc., and the base 40 may be disposed against a surface of the electronic device to facilitate heat transfer. During operation of the server, the electronic device continuously generates heat, and part of the heat can be absorbed by the base 40 and sequentially transferred to the heat pipe assembly 20 and the heat sink 10 by the base 40, and then the heat is dissipated into surrounding flowing air, and the flowing air carries the heat out of the server, so that heat dissipation of the server is realized. During this time, the air guide housing 30 may guide the flow direction of the flowing air.

In the prior art, a fan housing and a radiator are usually arranged separately, and the radiator is arranged below the fan housing and connected with a chip. In use, the heat sink radiates heat mainly in the vicinity of the chip, so that the ambient temperature around the chip will still have a higher temperature. Meanwhile, the fan housing and the radiator all need to occupy separate assembly space, so that the whole fan housing and the radiator need to occupy larger space.

In the present application, the heat-conducting tube assembly 20 is wound around the outer side wall of the air guide cover 30, so that the air guide cover 30, the heat-conducting tube assembly 20, the heat sink 10 and the base 40 are assembled in a combined manner, and the air guide cover 30 does not need to be separately arranged to occupy additional assembly space, so that the space occupied by the heat dissipation mechanism 100 can be greatly reduced, the space inside the server can be saved, and the development of lightening and thinning of the server can be facilitated. Meanwhile, the heat sink 10 is disposed at one end of the air guide cover 30 away from the base 40, even if the heat sink 10 is disposed away from the electronic device, so that heat of the heat dissipation mechanism 100 can be dissipated away from the electronic device, reducing the ambient temperature around the electronic device, and further facilitating heat dissipation and temperature reduction of the electronic device.

Therefore, the heat dissipation mechanism 100 provided by the application combines and assembles the wind scooper 30 and the heat conduction pipe assembly 20, has a smaller volume, and can obviously reduce the occupied space of the heat dissipation mechanism 100. Meanwhile, the heat dissipation mechanism 100 can have the functions of wind guiding and heat dissipation, and can also obviously improve the heat dissipation efficiency and ensure the normal operation of the electronic device and the server.

Example two

In the embodiment, a heat dissipation mechanism 100 is provided, and it is understood that the present embodiment may be further modified based on the first embodiment.

As shown in fig. 1, 2 and 8, in some embodiments, the heat sink 10 may be provided with a plurality of heat sinks 10 disposed at intervals from each other. A second air duct 12 may be formed between two adjacent heat sinks 10 to allow flowing air to pass through, so as to facilitate heat exchange between the heat sinks 10 and the flowing air. In some embodiments, the plurality of fins 10 may be evenly spaced, and the second air path 12 may be parallel to the first air path 31.

In the server, the heat dissipation mechanism 100 may be generally used together with the heat dissipation fan 400, and the heat dissipation fan 400 may be correspondingly disposed at one end of the first air duct 31 to be used as a power source for flowing air. Accordingly, the flowing air may flow along the extending direction of the first air duct 31. When the second air duct 12 is parallel to the first air duct 31, the flowing air can smoothly pass through the second air duct 12, so that wind resistance is avoided. When the second air duct 12 forms a certain angle with respect to the first air duct 31, the heat sink 10 will block the flowing air passing through, and reduce the flow rate of the air, thereby affecting the heat dissipation efficiency. Thus, in the present application, the second air duct 12 is parallel to the first air duct 31, and the width extending direction of the heat sink 10 is also parallel to the first air duct 31.

In some embodiments, the plurality of fins 10 may be parallel to each other, and the fins 10 may be perpendicular to the end surfaces of the corresponding ends of the air guide housing 30, i.e., the fins 10 may be disposed on the y-z plane.

In other embodiments, the heat sink 10 may be disposed obliquely with respect to the end face of the corresponding end of the air guiding cover 30, i.e. the included angle between the heat sink 10 and the end face of the air guiding cover 30 forms an acute angle. The heat sink 10 can be rotated and tilted about the y-axis as a rotation axis.

In other embodiments, the fins 10 may be disposed at non-uniform intervals, and the fins 10 may be inclined with respect to each other.

In some embodiments, the heat sink 10 may be a copper plate or an aluminum plate to facilitate heat exchange with the flowing air to increase heat dissipation efficiency.

As shown in fig. 1-4, in some embodiments, the heat pipe assembly 20 may include a heat pipe 21, an electromagnetic pump stack 22, and a liquid metal (not shown).

The heat conducting tube 21 may be wound around the outer side wall of the air guiding cover 30, and the heat conducting tube 21 may be wound around a plurality of turns, and accordingly, the heat conducting tube 21 may also have a spiral structure. The heat conducting tube 21 can be in contact with the outer side wall of the air guide cover 30, so that the heat conducting tube 21 can also perform corresponding heat exchange with the air guide cover 30, and then the air guide cover 30 performs heat exchange with flowing air passing through the first air duct 31, thereby realizing heat dissipation and accelerating the heat dissipation efficiency of the heat dissipation mechanism 100.

In some embodiments, the heat pipe 21 may be wound according to the structural configuration of the wind scooper 30. The shape of the air guiding cover 30 may be set according to needs, and exemplary air guiding cover 30 may be set to have a cover structure with a rectangular, square, irregular polygonal cross section, etc. The heat pipe 21 may be wound according to the sidewall shape of the wind scooper 30.

In some specific embodiments, the heat conductive pipe 21 may be one of a tubular structure of copper pipe, aluminum pipe, copper alloy pipe, aluminum alloy pipe, and the like.

Referring to fig. 2 and 3, the heat sink 10 may be connected to the heat pipe 21, and in particular, the heat sink 10 may be connected to a section of the heat pipe 21 near the top of the air guide housing 30. In some specific embodiments, a clamping groove 11 is disposed on a side of the heat sink 10 near the heat pipe 21 for clamping the heat pipe 21. Meanwhile, the shape of the clamping groove 11 can be matched with the outer wall of the heat conducting tube 21 so as to be attached to the outer wall of the heat conducting tube 21, so that the radiating fin 10 can have a larger contact area with the heat conducting tube 21, and heat transfer is facilitated.

It is understood that the same heat conducting tube 21 may be connected to each heat sink 10 at the same time, and the same heat sink 10 may be connected to each heat conducting tube 21 passing through at the same time. Correspondingly, a plurality of clamping grooves 11 can be formed in one side, close to the heat conducting tube 21, of the same radiating fin 10, and the number of the clamping grooves 11 can be equal to the number of winding turns of the heat conducting tube 21. Therefore, the contact opportunity between the heat conducting pipe 21 and the radiating fin 10 can be increased, the heat transfer between the heat conducting pipe 21 and the radiating fin 10 is improved, the heat in the heat conducting pipe assembly 20 is efficiently transferred to the radiating fin 10, and the rapid heat dissipation is realized.

In some embodiments, the heat sink 10 and the heat conducting tube 21 may be fixedly connected by soldering, so as to ensure heat transfer efficiency between the heat sink 10 and the heat conducting tube 21. Specifically, the soldering may be performed at a position where the clamping groove 11 is connected to the heat conduction pipe 21.

Further, the liquid metal can flow and set in the heat conducting pipe 21, and the heat conducting pipe 21 can be a sealing pipe, so that leakage of the liquid metal can be avoided, and pollution to the inside of the server can be avoided. In operation, liquid metal may carry heat flow in the heat pipe 21 for heat transfer. In particular, the liquid metal may absorb heat at the location of the base 40, which may then be transferred in the direction of the heat sink 10. At the location of the heat sink 10, the liquid metal may transfer heat to the heat sink 10 through the heat pipe 21, dissipating the heat from the heat sink 10 to the flowing air. During the flow of the liquid metal, some heat may be dissipated to the flowing air in the first air duct 31 through the heat conducting pipe 21 and the air guiding cover 30.

In some specific embodiments, the liquid metal may be selected from one or more of gallium alloys, indium alloys, gallium indium alloys, and gallium indium tin alloys. The liquid metal is liquid at normal temperature, can realize free flow, but can also keep the characteristics of metal, the heat conductivity coefficient of the liquid metal is far greater than that of the existing formaldehyde, water and other heat conducting agents, and the specific heat capacity of the liquid metal per unit volume is close to half of that of water because the density of the liquid metal is compared with that of the water and other heat conducting agents, so that the comprehensive heat conducting capacity of the liquid metal is far better than that of the existing heat conducting agents. Accordingly, the liquid metal has more efficient heat transport and limited heat dissipation capability, which may result in a higher heat dissipation efficiency for the heat dissipation mechanism 100. In addition, the liquid metal has the characteristics of no toxicity, stable physical and chemical properties, difficult volatilization, difficult leakage and the like, so that the liquid metal can run for a long time, efficiently and stably, and the working efficiency of the heat dissipation mechanism 100 is ensured.

In an embodiment, the electromagnetic pump unit 22 may be used as a power source for flowing the liquid metal, and the electromagnetic pump unit 22 may drive the liquid metal to flow in the heat conducting tube 21 so as to realize heat transfer.

Referring to fig. 4, in some embodiments, the heat pipe 21 may be a closed loop circuit, and the liquid metal may circulate within the heat pipe 21. The electromagnetic pump assembly 22 may include a first electromagnetic pump 221, and the first electromagnetic pump 221 may generate a first magnetic field. In an embodiment, the magnetic field direction of the first magnetic field may be made perpendicular to the axis of the heat conducting pipe 21, i.e. perpendicular to the flow direction of the liquid metal. In operation, the liquid metal may be charged with a suitable current, so that the liquid metal may be driven to move under the action of the lorentz force, i.e. the liquid metal may circulate in the heat conducting tube 21.

In the embodiment, the heat pipe 21 may be filled with liquid metal, and when the first electromagnetic pump 221 drives the liquid metal at the corresponding position to move, the liquid metal in the whole heat pipe 21 can be driven to move at the same time, that is, the liquid metal can circulate in the heat pipe 21, so as to continuously transfer heat.

In some embodiments, the heat pipe 21 may have a section penetrating inside the air guiding cover 30, i.e. located in the first air duct 31. The first electromagnetic pump 221 may be disposed on the section structure of the heat conductive pipe 21 such that the first electromagnetic pump 221 is located in the first air duct 31. On the one hand, the first electromagnetic pump 221 can be prevented from interfering with the assembly of other electronic devices in the server, on the other hand, the flowing air passing through the first air duct 31 can also radiate heat and cool the first electromagnetic pump 221, so that the first electromagnetic pump 221 can be ensured to work smoothly.

In other embodiments, the electromagnetic pump set 22 may further include two, three, four, six, etc. first electromagnetic pumps 221, and the directions of the magnetic fields generated by the plurality of first electromagnetic pumps 221 may be consistent, so as to drive the liquid metal to flow in the same direction, and jointly promote the circulating flow of the liquid metal in the heat conducting tube 21.

In other embodiments, as shown in fig. 5, the heat pipe 21 may include two ends, i.e., a first end 211 and a second end 212. The solenoid pump stack 22 may include a first solenoid pump 221 and a second solenoid pump 222. The first electromagnetic pump 221 may generate a first magnetic field, the second electromagnetic pump 222 may generate a second magnetic field, and the magnetic field direction of the first magnetic field may be opposite to the magnetic field direction of the second magnetic field. In some embodiments, a gap may be left in the heat pipe 21, i.e., the liquid metal does not fill the heat pipe 21. The first electromagnetic pump 221 and the second electromagnetic pump 222 may each be provided in plurality and each be provided at intervals along the length of the heat conductive pipe 21. In operation, the first electromagnetic pump 221 and the second electromagnetic pump 222 can be used to drive the liquid metal to flow in different directions. For example, the plurality of first electromagnetic pumps 221 may drive the flow of liquid metal from the first end 211 to the second end 212 of the heat pipe 21. The plurality of second electromagnetic pumps 222 may drive the liquid metal from the second end 212 of the heat pipe 21 to the first end 211. I.e. the first electromagnetic pump 221 and the second electromagnetic pump 222, can be used to drive the liquid metal to reciprocate in the heat conducting pipe 21. It will be appreciated that the first solenoid pump 221 and the second solenoid pump 222 operate in a staggered manner. Because the heat conducting tube 21 is in a spiral structure and is wound with a plurality of circles, when the liquid metal reciprocates, the liquid metal can flow through the positions of the base 40 and the positions of the radiating fins 10, and heat transfer between the base 40 and the radiating fins 10 can be realized.

In an embodiment, the solenoid pump assemblies 22 may have a controller (not shown) connected thereto, and the operation of each solenoid pump may be controlled by the controller.

Of course, in some embodiments, in use, the solenoid pump stack 22 may be directly electrically connected to the central processor of the server, with the central processor of the server directly controlling the operation of the solenoid pump stack 22.

In an embodiment, each electromagnetic pump may be a micro electromagnetic pump to reduce the occupied space.

Referring to fig. 1, 2 and 6, the base 40 may be a plate-like structure. The base 40 is provided with a plurality of limiting grooves 41 on one side close to the heat conducting pipe assembly 20, and the number of the limiting grooves 41 can be equal to the number of turns of the heat conducting pipe 21 passing through. The limiting grooves 41 are in one-to-one correspondence with the number of turns of the heat conduction pipe 21, and the limiting grooves 41 can limit and fix the heat conduction pipe 21. When the heat conducting tube 21 is assembled with the base 40, the heat conducting tube 21 can be pre-fixed by the limiting groove 41, so that random shaking between the base 40 and the heat conducting tube 21 is avoided, and the subsequent reinforcement connection operation is facilitated.

In an embodiment, the heat pipe 21 may be welded to the base 40, and in particular, the heat pipe 21 may be soldered to the base 40. The gap between the limiting groove 41 and the heat conduction pipe 21 can be filled with solder, so that the heat transfer efficiency between the base 40 and the heat conduction pipe 21 can be ensured.

In some embodiments, the end of the air guiding cover 30 away from the heat sink 10 is provided with two protrusions. Correspondingly, two groups of bases 40 can be arranged and correspond to the two convex parts of the wind scooper 30 one by one. The two bases 40 can support the wind scooper 30 together, and meanwhile, the two bases 40 are connected with the heat conductive pipes 21 at corresponding positions. The two bases 40 may be used to connect with the same heat source 200 or different heat sources 200 to dissipate heat and cool the corresponding heat sources 200.

In other embodiments, as shown in fig. 7, a U-shaped groove is disposed on a side of the base 40 near the wind scooper 30, so as to limit the protruding portion of the wind scooper 30. Meanwhile, the limiting groove 41 may be disposed on an inner wall of the U-shaped groove, and further limit the heat conductive pipe 21.

In the embodiment, the base 40 may be used to connect the heat source 200, so that the heat dissipation mechanism 100 may be fixed relative to the heat source 200, thereby ensuring stable heat transfer between the heat dissipation mechanism 100 and the heat source 200, and ensuring stable dissipation of heat from the heat source 200.

The base 40 may be provided with a connection portion 43 for connecting the heat generation source 200. The connection portion 43 may be one or a combination of connection posts, connection holes, snaps, and the like. Correspondingly, the heat source 200 may also be provided with a connection hole, a connection post, a buckle, and other structures that cooperate with the connection portion 43, so as to fixedly connect the base 40 and the heat source 200.

In some embodiments, a connection portion 43 may be provided at each of four corners of the base 40 to ensure stable connection of the base 40 and the heat source 200.

Further, the base 40 is further provided with a fool-proof portion 42 for fool-proof connection between the base 40 and the heat source 200. The fool-proof portion 42 may be disposed at a non-central position of the base 40. Specifically, the fool-proof portion 42 may be disposed at an edge position of the base 40 to realize the assembly position recognition. The fool-proof part 42 may be one of a positioning column, a positioning hole, a positioning groove, and the like.

In some particular embodiments, the base 40 may be made of copper.

In the embodiment, the heat dissipation mechanism 100 further includes a heat conducting fin 50, and the heat conducting fin 50 is disposed on a side of the base 40 away from the wind scooper 30. The heat conductive sheet 50 may serve to accelerate heat transfer between the heat generating source 200 and the susceptor 40. In some specific embodiments, the thermally conductive sheet 50 may be a thermally conductive silicone grease.

In use, heat generated by the heat generating source 200 may be transferred to the susceptor 40 through the heat conductive sheet 50, and then the susceptor 40 may transfer the heat to the liquid metal in the heat conductive pipe assembly 20. Under the driving action of the electromagnetic pump unit 22, the liquid metal can flow in the heat conducting tube 21 continuously so as to transfer heat from one end of the base 40 to the direction of the radiating fins 10. At the location of the heat sink 10, heat from the liquid metal may be transferred to the heat sink 10 via the heat pipe 21, and the heat may be dissipated into the flowing air by the heat sink 10. During the heat transfer period, the liquid metal can flow air by dissipating part of the heat into the first air duct 31 through the heat conducting pipe 21 and the air guiding cover 30. In the heat dissipation process, the heat dissipation mechanism 100 can transfer most of heat to one end far away from the heat source 200 for heat dissipation, so that the overhigh ambient temperature around the heat source 200 can be avoided, the heat dissipation of the heat source 200 is promoted, and the heat dissipation efficiency is improved.

In summary, the heat dissipation mechanism 100 provided by the present application has the functions of wind guiding and heat dissipation, and has the characteristics of small volume, small impedance and high heat dissipation efficiency.

Example III

As shown in fig. 8, a server is also provided in the embodiment, including the heat dissipation mechanism 100 provided in the embodiment.

The server may include an organic chassis 300, electronic devices (not shown) disposed in the chassis 300, and a cooling fan 400. The heat dissipation fan 400 may be disposed corresponding to one end of the heat dissipation mechanism 100, and corresponds to one ends of the first air duct 31 and the second air duct 12. It will be appreciated that only a portion of the structure of the server is shown in the figure.

In use, the heat dissipation fan 400 can be used to promote the flow of air in the chassis 300, and the heat dissipation mechanism 100 can transfer the heat generated by the electronic device to the flowing air, so that the flowing air dissipates the heat to the external environment. It is understood that vents (not shown) may be provided on the chassis 300 to facilitate air flow inside and outside the chassis 300.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims

1. A heat dissipation mechanism, comprising:

The air guide cover comprises a first air channel;

The heat conducting tube assembly comprises a base, a plurality of heat conducting tubes, a plurality of heat conducting plates, a plurality of air guide covers, a plurality of air guide channels and a plurality of air guide channels, wherein the heat conducting tubes are connected with the heat conducting tube assembly, the heat conducting tubes are arranged at one end of the air guide cover far away from the base, the heat conducting tubes are arranged at intervals, the heat conducting tubes are perpendicular to the end face of the air guide cover where the heat conducting tubes are located, a second air channel is formed between every two adjacent heat conducting tubes, and the second air channel is parallel to the first air channel;

the base is used for being connected with a heat source so as to transfer heat in the heat source to the heat conducting pipe assembly, the heat conducting pipe assembly transfers the heat to the plurality of cooling fins, and the heat is transferred to flowing air through the plurality of cooling fins.

2. The heat dissipation mechanism of claim 1, wherein the heat transfer tube assembly comprises:

the liquid metal is arranged in the heat conducting pipe; and

3. The heat dissipation mechanism of claim 2, wherein the heat pipe is a closed loop circuit and the electromagnetic pump assembly comprises a first electromagnetic pump that generates a first magnetic field;

4. The heat dissipation mechanism of claim 2, wherein the heat pipe comprises two ends, the electromagnetic pump assembly comprising a first electromagnetic pump that generates a first magnetic field and a second electromagnetic pump that generates a second magnetic field, the first magnetic field having a direction opposite to a direction of the second magnetic field;

5. The heat dissipation mechanism of any one of claims 2 to 4, wherein the liquid metal comprises one or more of a gallium alloy, an indium alloy, a gallium indium alloy, and a gallium indium tin alloy.

6. The heat dissipation mechanism of claim 1, wherein a side of the base adjacent to the heat pipe assembly is provided with a limiting groove, and a side of the heat pipe assembly adjacent to the base is in limiting connection with the limiting groove.

7. The heat dissipating mechanism of claim 1 or 6, wherein the base is provided with a fool-proof portion for fool-proof connection of the base to a heat generating source.

8. The heat dissipation mechanism of claim 1, further comprising a thermally conductive sheet disposed on a side of the base remote from the thermally conductive tube assembly.

9. A server comprising the heat dissipation mechanism of any one of claims 1 to 8.